JP2004043898A - Vapor deposition mask, and organic electroluminescence display device - Google Patents
Vapor deposition mask, and organic electroluminescence display device Download PDFInfo
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- 238000007740 vapor deposition Methods 0.000 title claims abstract description 27
- 238000005401 electroluminescence Methods 0.000 title claims abstract description 4
- 229920005989 resin Polymers 0.000 claims abstract description 41
- 239000011347 resin Substances 0.000 claims abstract description 41
- 239000000835 fiber Substances 0.000 claims abstract description 34
- 230000002093 peripheral effect Effects 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 25
- 230000008021 deposition Effects 0.000 claims description 20
- 238000001704 evaporation Methods 0.000 claims description 20
- 230000008020 evaporation Effects 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 15
- 239000011368 organic material Substances 0.000 claims description 14
- 230000003014 reinforcing effect Effects 0.000 claims description 9
- 238000005192 partition Methods 0.000 claims description 3
- 238000000151 deposition Methods 0.000 abstract description 20
- 239000010410 layer Substances 0.000 description 26
- 239000010408 film Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 16
- -1 polyethylene Polymers 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000005484 gravity Effects 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000005525 hole transport Effects 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- CFNMUZCFSDMZPQ-GHXNOFRVSA-N 7-[(z)-3-methyl-4-(4-methyl-5-oxo-2h-furan-2-yl)but-2-enoxy]chromen-2-one Chemical compound C=1C=C2C=CC(=O)OC2=CC=1OC/C=C(/C)CC1OC(=O)C(C)=C1 CFNMUZCFSDMZPQ-GHXNOFRVSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 239000004202 carbamide Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- DGBWPZSGHAXYGK-UHFFFAOYSA-N perinone Chemical class C12=NC3=CC=CC=C3N2C(=O)C2=CC=C3C4=C2C1=CC=C4C(=O)N1C2=CC=CC=C2N=C13 DGBWPZSGHAXYGK-UHFFFAOYSA-N 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- BBEAQIROQSPTKN-UHFFFAOYSA-N pyrene Chemical compound C1=CC=C2C=CC3=CC=CC4=CC=C1C2=C43 BBEAQIROQSPTKN-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- NZFNXWQNBYZDAQ-UHFFFAOYSA-N thioridazine hydrochloride Chemical class Cl.C12=CC(SC)=CC=C2SC2=CC=CC=C2N1CCC1CCCCN1C NZFNXWQNBYZDAQ-UHFFFAOYSA-N 0.000 description 2
- UWRZIZXBOLBCON-VOTSOKGWSA-N (e)-2-phenylethenamine Chemical class N\C=C\C1=CC=CC=C1 UWRZIZXBOLBCON-VOTSOKGWSA-N 0.000 description 1
- KLCLIOISYBHYDZ-UHFFFAOYSA-N 1,4,4-triphenylbuta-1,3-dienylbenzene Chemical class C=1C=CC=CC=1C(C=1C=CC=CC=1)=CC=C(C=1C=CC=CC=1)C1=CC=CC=C1 KLCLIOISYBHYDZ-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- XMRUSHWZTHNMHS-UHFFFAOYSA-N 3-(dimethylamino)pyrazine-2-carbonitrile Chemical class CN(C)C1=NC=CN=C1C#N XMRUSHWZTHNMHS-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910021595 Copper(I) iodide Inorganic materials 0.000 description 1
- VMQMZMRVKUZKQL-UHFFFAOYSA-N Cu+ Chemical compound [Cu+] VMQMZMRVKUZKQL-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical class N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 125000000746 allylic group Chemical group 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- XJHABGPPCLHLLV-UHFFFAOYSA-N benzo[de]isoquinoline-1,3-dione Chemical class C1=CC(C(=O)NC2=O)=C3C2=CC=CC3=C1 XJHABGPPCLHLLV-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical class C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- GVEPBJHOBDJJJI-UHFFFAOYSA-N fluoranthrene Natural products C1=CC(C2=CC=CC=C22)=C3C2=CC=CC3=C1 GVEPBJHOBDJJJI-UHFFFAOYSA-N 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- IBHBKWKFFTZAHE-UHFFFAOYSA-N n-[4-[4-(n-naphthalen-1-ylanilino)phenyl]phenyl]-n-phenylnaphthalen-1-amine Chemical compound C1=CC=CC=C1N(C=1C2=CC=CC=C2C=CC=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C3=CC=CC=C3C=CC=2)C=C1 IBHBKWKFFTZAHE-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- VOFUROIFQGPCGE-UHFFFAOYSA-N nile red Chemical compound C1=CC=C2C3=NC4=CC=C(N(CC)CC)C=C4OC3=CC(=O)C2=C1 VOFUROIFQGPCGE-UHFFFAOYSA-N 0.000 description 1
- 150000004866 oxadiazoles Chemical class 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
- FIZIRKROSLGMPL-UHFFFAOYSA-N phenoxazin-1-one Chemical compound C1=CC=C2N=C3C(=O)C=CC=C3OC2=C1 FIZIRKROSLGMPL-UHFFFAOYSA-N 0.000 description 1
- UOMHBFAJZRZNQD-UHFFFAOYSA-N phenoxazone Natural products C1=CC=C2OC3=CC(=O)C=CC3=NC2=C1 UOMHBFAJZRZNQD-UHFFFAOYSA-N 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- XKJCHHZQLQNZHY-UHFFFAOYSA-N phthalimide Chemical class C1=CC=C2C(=O)NC(=O)C2=C1 XKJCHHZQLQNZHY-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000553 poly(phenylenevinylene) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 150000005255 pyrrolopyridines Chemical class 0.000 description 1
- LISFMEBWQUVKPJ-UHFFFAOYSA-N quinolin-2-ol Chemical compound C1=CC=C2NC(=O)C=CC2=C1 LISFMEBWQUVKPJ-UHFFFAOYSA-N 0.000 description 1
- 150000003248 quinolines Chemical class 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- PYWVYCXTNDRMGF-UHFFFAOYSA-N rhodamine B Chemical class [Cl-].C=12C=CC(=[N+](CC)CC)C=C2OC2=CC(N(CC)CC)=CC=C2C=1C1=CC=CC=C1C(O)=O PYWVYCXTNDRMGF-UHFFFAOYSA-N 0.000 description 1
- YYMBJDOZVAITBP-UHFFFAOYSA-N rubrene Chemical group C1=CC=CC=C1C(C1=C(C=2C=CC=CC=2)C2=CC=CC=C2C(C=2C=CC=CC=2)=C11)=C(C=CC=C2)C2=C1C1=CC=CC=C1 YYMBJDOZVAITBP-UHFFFAOYSA-N 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- QKTRRACPJVYJNU-UHFFFAOYSA-N thiadiazolo[5,4-b]pyridine Chemical class C1=CN=C2SN=NC2=C1 QKTRRACPJVYJNU-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 1
- ODHXBMXNKOYIBV-UHFFFAOYSA-N triphenylamine Chemical compound C1=CC=CC=C1N(C=1C=CC=CC=1)C1=CC=CC=C1 ODHXBMXNKOYIBV-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
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Abstract
Description
【0001】
【発明の属する技術分野】
本発明は、蒸着法により有機エレクトロルミネセンス表示装置(以下、「有機EL表示装置」という。)の電極のパターン形成を行う蒸着用マスク、及びこれを用いて製造する有機EL表示装置に関する。
【0002】
【従来の技術】
蒸着法によりパターン形成をおこなう場合には、複数の開孔を有する金属薄板製の蒸着用マスクが一般的に用いられている。蒸着膜を成膜する際、蒸着源から飛散する粒子には方向性があるため、マスクの開孔部が小さくマスクの厚みが厚いと、飛散した粒子はマスクに遮蔽されるので蒸着され難い部分ができてしまい、蒸着膜にむらが生じてしまうことがある。
【0003】
また、金属製のマスクにおいては比重が大きいため、重力の影響でマスクが垂れ下がり、マスクの浮きにより膜厚むらができ、蒸着膜の幅も場所ごとに変わってしまう。最悪の場合には、蒸着膜がマスクの浮き上がった部分に完全に回り込んで連続的に形成されてしまい、精度の良いパターン形成を行うことができなかった。そのため、マスクの断面形状に工夫を施したものが一般的に使用されている。
【0004】
従来、蒸着用マスクの重力による歪みを減少するために、断面形状が丸い樹脂繊維マスクが用いられている。また、特開2000−182767号公報に開示されているように、断面が円状の繊維を用い、径の違う繊維を束ねて、断面形状の工夫により膜厚むらを防止する方法が提案されている。
【0005】
【発明が解決しようとする課題】
近年、表示装置の一つとして有機EL表示装置が提案され、実用化が進んでいる。この有機EL表示装置を構成する有機エレクトロルミネセンス素子(以下、「有機EL素子」という。)は、基板上に少なくとも陽極、有機物層、及び陰極を順次積層した構成を有しており、該積層体の陰極から電子を、陽極から正孔をそれぞれ注入し、印加した電場によって電子と正孔とが薄膜中を移動して、発光層としての有機物層内で再結合し、それにより生成した励起子の一部は熱失括し、一部は失括する際に発光する。すなわち、有機EL素子は、励起子が失括する際の光の放射現象を利用したものである。
【0006】
ところで、有機EL素子において、特に表示装置に用いる場合には、蒸着膜の膜厚の違いにより輝度差が生じ、ドット内での輝度差が生じることが分かった。これは、膜厚むらがあることにより、電子または正孔の注入効率が場所によって変化してしまうため、発光させた際の輝度ムラや非発光の原因となる。したがって、特に膜厚分布に影響を与える蒸着用マスクの改良が必要である。
【0007】
また、蒸着用マスクの浮き上がりに起因した蒸着膜の回り込みにより、電極線幅が場所ごとに変わるとドットの大きさがばらつき、ドットごとの輝度がばらついてしまう。このことは、表示ディスプレイとして用いられる有機EL素子には致命的なことである。
【0008】
本発明は、上記の課題に鑑みて創案されたものであり、その目的は、被蒸着面から浮き上がることがなく、蒸着膜の回り込みがなく、有機EL表示装置の電極を精度良く、且つ、安定して形成することができる蒸着用マスク、およびこれを用いて製造する有機EL表示装置を提供することにある。
【0009】
【課題を解決するための手段】
上記の目的を達成すべく、本発明の蒸着用マスクは、基板上に、少なくとも陽極、発光材料を含有する有機物層、及び陰極を積層してなり、一方向に沿って複数列の陽極を配するとともに、該陽極と直交する方向に沿って複数行の陰極を配する有機EL表示装置の陽極および陰極を形成するために用いる蒸着用マスクにおいて、
マスク周辺部を区画する枠体と、該枠体の相対向する辺間に一方向に沿って並列に掛け亘たされた複数条の樹脂繊維部とを備えており、
該樹脂繊維部の被蒸着面に接触する面が、平面部分を構成していることを特徴としている。
【0010】
上記蒸着用マスクにおいて、上記樹脂繊維部の断面形状は、上記被蒸着面に接触する平面部分の幅がこれに相対向する面部分の幅よりも大きく形成されていることが好ましい。
【0011】
また、上記樹脂繊維部の断面形状は、前記被蒸着面に接触する平面部分の幅が、前記被蒸着面と直交する厚み幅の最大値よりも大きく形成されていることが好ましい。
【0012】
さらに、上記樹脂繊維部の断面形状が、三角形、正方形、長方形、台形、多角形、あるいは半円形であることが好ましい。
【0013】
そして、上記枠体と前記樹脂繊維部とが同種の樹脂材料により形成されていることが好ましい。
【0014】
加えて、上記樹脂繊維部に張力をもたせるべく、前記枠体が補強枠により補強されていることが好ましい。
【0015】
一方、本発明の有機EL表示装置は、基板上に、少なくとも陽極、発光材料を含有する有機物層、及び陰極を積層してなり、一方向に沿って複数列の陽極が配されるとともに、該陽極と直交する方向に沿って複数行の陰極が配されてなる有機EL表示装置において、
上記のいずれかの蒸着用マスクを使用して、基板上に互いに直交するように陽極および陰極をパターン形成したことを特徴としている。
【0016】
【発明の実施の形態】
以下、本発明の実施の形態を図面に基づいて説明するが、本発明は本実施形態に限るものではない。
【0017】
本発明の蒸着用マスクは、基板上に、少なくとも陽極、発光材料を含有する有機物層、及び陰極を積層してなり、一方向に沿って複数列の陽極を配するとともに、該陽極と直交する方向に沿って複数行の陰極を配する有機EL表示装置の製造に用いられ、該有機EL表示装置の陽極および陰極を互いに直交するように形成するためのマスクである。
【0018】
本実施形態の蒸着用マスクは、マスクの周辺部を区画する枠体と、該枠体の相対向する辺間に一方向に沿って並列に掛け亘たされる複数条の樹脂繊維部とを備えている。すなわち、樹脂繊維部は枠体の相対向する辺間にストライプ状に平行に掛け亘たして張られており、この樹脂繊維部の被蒸着面としての基板に接触する面が平面部分を構成している。そして、樹脂繊維部の断面形状は、被蒸着面としての基板に接触する平面部分の幅が、これに相対向する面部分の幅よりも大きく形成されていることが好ましい。また、この樹脂繊維部の断面形状は、被蒸着面に接触する平面部分の幅が、被蒸着面と直交する厚み幅の最大値よりも大きく形成されていることが好ましい。かかる条件を満たす蒸着用マスクとしては、例えば、図4(a)に示すような樹脂繊維部の断面形状が台形のマスクが挙げられる。その他には、図4(b)に示すような半円形、正方形、長方形、三角形のマスクや、あるいは多角形などの形状を有するマスクを用いることができる。
【0019】
このような樹脂繊維部の被蒸着面に接触する面が平面部分を構成するマスクを用いることにより、マスクが被蒸着面に密着し易いので、蒸着膜の回り込みを防ぐことができ、特にエッジ部の膜厚むらを防ぐことが可能である。すなわち、蒸着用マスクの断面形状を工夫することにより、被蒸着面に達する前にマスクの出っ張りに阻害されて蒸着されなかった蒸着粒子を被蒸着面としての基板に蒸着させることが可能となる。
【0020】
さらに、樹脂製のマスクは、金属で構成されているマスクよりも重量を軽くすることが可能であり、重力による弛みがより少なく、マスクを張った状態に保つことができる。このことにより、蒸着用マスクの浮き上がりによる蒸着膜の回り込みを減少させることも可能となる。その結果、所定寸法に合致した正確なパターン形成が可能となる。
【0021】
本発明の蒸着用マスクの作成方法としては、光硬化樹脂を用いたフォトリソグラフィ技術や射出成形法などの様々な方法が挙げられる。以下、光硬化樹脂を用いたフォトリソグラフィ技術を例に挙げて説明するが、本発明は蒸着用マスクの形状が重要であって、作成方法や材料にはよらない。
【0022】
光硬化樹脂、ここでは例としてポジフォトレジストで作成する蒸着用マスクについて、図1を用いて説明する。
【0023】
まず、図1(a)に示すように、基板1上に光硬化樹脂2をスピンコートなどの成膜技術を用いて成膜し、この光硬化樹脂2上に照射光を透過するような基板にパターン化した遮光マスク3を載せて感光させる。
【0024】
すると、図1(b)に示すように、光照射したところは硬化して光硬化部4となり、光の当たっていないところは非硬化部5となる。
【0025】
その後、図1(c)に示すように、遮光マスク3を剥し、非硬化部5をエッチング液で溶かすと、基板1上には硬化樹脂としての光硬化部4が残る。
【0026】
そして、図1(d)に示すように、基板1と光硬化部4との接着部を剥すか、もしくは基板1をエッチング液で溶かすことにより、蒸着用マスク(光硬化部)4の作成を終了する。
【0027】
このとき樹脂繊維部(以下、「マスクライン」という。)のみを作成するのではなく、図2(a)、(b)に示すように、マスクライン6のピッチや形状を保持する枠7も同時に作成すると良い。なぜならば、マスクライン6を固定する枠7を別に作成するとしたならば、マスクライン6のピッチを一本ずつ合わせて正確に枠7の相対向する辺間に掛け亘さなければならないからである。枠7をマスクライン6の作成と同時作成しておけば、基板1から剥がした時点で、既に枠7とマスクライン6が一体化しており、所定のピッチに固定できているからである。このことは、他の作成方法にも言えることである。また、テーパー形成も光の集光具合を変えることにより容易に形成可能である。射出成型などにおいては、型の設計をしっかりと行うことにより、テーパーをつけた精度の良いマスクを作成可能である。枠7をマスクライン6と同時作成する観点から、これら枠体7とマスクライン(樹脂繊維部)6とを同種の樹脂材料により形成することが好ましい。
【0028】
このようにして作成した樹脂繊維マスクをある程度の強度で引っ張りながら、図3(a)、(b)に示すように、金属乃至何らかの剛性のある補強枠8に貼り付けることによってマスクライン6に張力を与えることができ、重力による撓みがなく、精度の良い蒸着用マスクが作成可能となる。
【0029】
次に、蒸着用マスクの構成材料となる樹脂繊維について説明する。
【0030】
蒸着用マスクの作成に用いる材料としては、ナイロン系、ポリエステル系、ポリエチレン系、ポリプロピレン系、ポリスチレン系、ウレタン系、エポキシ系、フェノール系、メラミン系、ユリア系、シリコン系、ポリイミド系、アクリル系、ビニル系、アリル系ABS樹脂、またはこれらのハロゲン化物など、様々な合成繊維や天然繊維が利用可能であり、単繊維または複繊維とすることができる。
【0031】
しかし、蒸着する際の温度上昇による熱膨張や分解、軟化などの制限がある。温度上昇を抑えることができれば、どのような高分子でも可能である。温度上昇を抑える方法として、例えば、マスクを冷やしながら蒸着を行うなどの方法があり、他には、蒸着源の輻射熱を遮断するため、輻射熱を通さない板にスリットを付けたものを蒸着源とマスクとの間に介在させ、そのスリットから蒸着粒子が出てくるようにした方法も考えられる。すなわち、基本的にはどのような高分子でも利用可能であることが分かる。
【0032】
また、マスクの作成時には、マスクの弛みを最小限に抑える必要があるので、図3(a)に示した補強板8に貼り付ける際、ある程度マスクに張力を与える方が有利である。ただし、しっかりした強度のマスクが作成されていれば、例えば膜厚が十分厚いマスクであれば、補強枠8を貼り付ける必要はない。
【0033】
マスクを冷やしたり、輻射熱を気にしたりすることを必要としない方がプロセスやコスト的に有利である。また、蒸着用マスクは一度だけの使い捨てよりは、むしろ洗浄してマスクについた膜を取り除いて、再使用できる方がコスト的には有利であるので、ここでは特に、引っ張り強度140kg/cm2や熱耐久性(熱変形も含む)70℃以上、耐薬品性などを考慮した、エポキシ系、シリコン系、アリル系、ポリエステル系、フェノール系、ポリカーボーネート系、ポリアセタール系、ナイロン(ポリアミド)系、フッ素系、ポリプロピレン系、ポリイミド系、ユリア系、メラミン系を選んでいる(プラスチックデータハンドブック 株式会社工業調査会 p6−p11のデータ参照)。
【0034】
これ以外の高分子によりマスクを作成することは可能であるし、蒸着することもできるが、その中でも性能が良いと思われるものを選択したものである。
【0035】
次に、本発明の蒸着用マスクを用いて、モノカラーでパッシブ駆動の有機ELパネルの製造について説明するが、これ以外にも本発明の蒸着用マスクを利用することは可能である。
【0036】
図5は、本実施形態における有機ELパネルの断面構造を示しており、透明基板からなる基板9上には、陽極10、発光材料を含有する有機物層11、及び陰極12が順次積層されている。すなわち、図6に示すように、ガラス基板9上に複数の陽極(第1電極)10をストライプ状にパターニングし、発光層となる有機物層11を全面蒸着し、最後に本発明の蒸着用マスクを用いて、陽極10に直交するように陰極12(第2電極)を順次蒸着し、陽極10、有機層11、及び陰極12の積層構造を構成している。このとき、陽極10及び陰極12の各々が互いに対向して直交する交差部を1画素として、各層がマトリクス状に形成、配列されている。また、解り易いように、有機EL表示装置を作成する際における陽極10及び有機物層11を積層した基板9と蒸着用マスク13と陰極蒸着源との位置関係を図7に示している。
【0037】
さらに、陽極10、発光材料を含有する有機物層11、及び陰極12について説明する。
【0038】
陽極としては、発光層となる有機物層11からの光を取り出すために透明であることが必要であり、仕事関数の大きい金属、合金、電気伝導性化合物、またはこれらの混合物を電極物質とするものが好ましく、具体的には金、ITO、CuI、酸化錫、酸化インジウム、亜鉛酸化物、クロム、アルミニウム、銀などが使用される。この陽極は蒸着法やスパッタリング法により成膜することができる。
【0039】
また、有機物層11は、例えば、正孔輸送層と有機発光層との2層構造からなるが、本構成に限定されるものではなく、発光層1層のみの構成や正孔注入層、電子輸送層、電子注入層等をさらに形成して多層構造としても良い。
【0040】
正孔輸送層を形成する材料としては特に限定されず、従来から正孔輸送材料として使用されている化合物、もしくは新規化合物などが使用可能である。例えば、α−NPD{N,N’−ジ(α−ナフチル)−N,N’−ジフェニル−1,1’−ビフェニル−4,4’−ジアミン}、MTDATA{4−4’−4”−トリス(N−(3−メチルフェニル)−N−フェニルアミノ)トリフェニルアミン}、TPD{N、N’−ジフェニル−N、N’−ビス(3−フェニル)−1,1’−ビフェニル−ビフェニル−4,4’−ジアミン}などが挙げられる。
【0041】
有機発光層には、アントラセンやピレン、トリス(8−キノリノラト)アルミニウム錯体及びその誘導体、キノリノール、キノリン誘導体、ビススチルアントラセン誘導体、クマリン誘導体、ペリノン誘導体、テトラフェニルブタジエン誘導体、オキサジアゾール誘導体、フタルイミド誘導体、アルダジン誘導体、ピラジリン誘導体、シクロペンタジエン誘導体、ピロロピリジン誘導体、スチリルアミン誘導体、アルダジン誘導体、ナフタルイミド誘導体、ジスチルベンゼン誘導体、チアジアゾロピリジン誘導体などがある。また、ポリマー系では、ポリフェニレンビニレン誘導体、ポリパラフェニレン誘導体、ポリチオフェン誘導体などを使用することができる。
【0042】
さらに、発光効率を向上させたり、発光寿命を延ばす目的で、有機発光層中に微量の不純物を意図的に混入させてもよい。具体的には、ルブレン、キナクリドン誘導体、フェノキサゾン660、ジシアノメチレンスチルピラン誘導体、ペリノン、ペリレン、クマリン誘導体、ジメチルアミノピラジンカルボニトリル誘導体、Nile Red、ローダミン誘導体などから選択される。
【0043】
上記有機物層11の形成は、主に真空蒸着法によって行われるが、電子ビーム蒸着、スパッタリング法、分子積層法、溶媒からのコーティングも可能である。
【0044】
陰極12としては、効率よく電子を発光層に伝達させるため、仕事関数の低い金属が好ましく、具体的にはアルミニウム、錫、インジウム、鉛、マグネシウム、銀、銅、モリブデン、ニッケル、タングステン、希土類単体、アルカリ金属、またはこれら金属の合金が使用される。また、陰極12は蒸着法やスパッタリング法により成膜される。このとき、膜厚がドット内で均一で、且つ、ドットの面積を一定に保つためには、本発明による蒸着用マスクが有効である。
【0045】
【発明の効果】
以上説明したように、本発明によれば、蒸着用マスクが被蒸着面から浮き上がることのない形状を有しており、蒸着膜の回り込みがないので電極間のショートがなく、ピッチ精度の良い電極パターンの形成が可能となる。したがって、有機EL表示装置の電極を精度良く、且つ、安定して形成することができるものである。
【図面の簡単な説明】
【図1】本発明の蒸着用マスクの作成方法を示しており、(a)から(d)は作成手順の説明図である。
【図2】本発明の蒸着用マスクの完成品を示す図である。(a)は完成品の平面図である。(b)は(a)のA−B断面図である。
【図3】本発明の蒸着マスクを補強するための補強枠を示す図である。(a)は補強枠の平面図である。(b)は補強枠に樹脂マスクを貼り付けた状態の断面図である。
【図4】本発明の蒸着用マスクの断面形状を示す説明図である。(a)は断面台形の場合の蒸着用マスクである。(b)はその他の断面の例を示す図である。
【図5】本発明の有機EL表示装置における層構成の一例を示す断面図である。
【図6】本発明の有機EL表示装置における陽極のパターン形状を示す模式図である。
【図7】本発明の有機EL表示装置を作成する際の基板と蒸着用マスクと陰極蒸着源との位置関係を示す模式図である。
【符号の説明】
1 基板
2 光硬化樹脂
3 遮光マスク
4 光硬化部
5 非硬化部
6 マスクライン
7 枠
8 補強枠
9 基板(透明基板)
10 陽極
11 有機物層
12 陰極
13 蒸着用マスク[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a deposition mask for forming a pattern of an electrode of an organic electroluminescence display device (hereinafter, referred to as an “organic EL display device”) by a vapor deposition method, and an organic EL display device manufactured using the same.
[0002]
[Prior art]
When a pattern is formed by an evaporation method, an evaporation mask made of a thin metal plate having a plurality of openings is generally used. When depositing a deposited film, the particles scattered from the deposition source have directionality, so if the opening of the mask is small and the thickness of the mask is thick, the scattered particles are blocked by the mask, so the part that is difficult to deposit , And unevenness may occur in the deposited film.
[0003]
In addition, since a metal mask has a large specific gravity, the mask hangs down under the influence of gravity, the thickness of the film is uneven due to the floating of the mask, and the width of the deposited film varies from place to place. In the worst case, the deposited film completely wraps around the raised portion of the mask and is continuously formed, so that accurate pattern formation cannot be performed. For this reason, a mask having a devised cross-sectional shape is generally used.
[0004]
Conventionally, a resin fiber mask having a round cross-sectional shape has been used in order to reduce distortion caused by gravity of an evaporation mask. Further, as disclosed in Japanese Patent Application Laid-Open No. 2000-182767, there has been proposed a method of using fibers having a circular cross section, bundling fibers having different diameters, and preventing unevenness in film thickness by devising a cross sectional shape. I have.
[0005]
[Problems to be solved by the invention]
2. Description of the Related Art In recent years, an organic EL display device has been proposed as one of display devices, and practical use thereof is progressing. An organic electroluminescent element (hereinafter, referred to as “organic EL element”) constituting this organic EL display device has a configuration in which at least an anode, an organic material layer, and a cathode are sequentially laminated on a substrate. Electrons are injected from the cathode of the body and holes are injected from the anode, and the applied electric field causes the electrons and holes to move through the thin film and recombine in the organic layer as the light emitting layer, thereby generating the excitation generated. Some of the children lose heat and some emit light when lost. That is, the organic EL element utilizes the phenomenon of light emission when excitons are lost.
[0006]
By the way, it has been found that in the organic EL element, particularly when used for a display device, a difference in luminance occurs due to a difference in the thickness of the vapor-deposited film, and a difference in luminance occurs in a dot. This is because unevenness of the film thickness causes the efficiency of injection of electrons or holes to vary depending on the location, which causes uneven brightness or non-emission when emitting light. Therefore, it is necessary to improve the deposition mask which particularly affects the film thickness distribution.
[0007]
In addition, if the electrode line width changes from place to place due to the wraparound of the deposition film due to the lifting of the deposition mask, the size of the dots varies, and the brightness of each dot varies. This is fatal to an organic EL element used as a display.
[0008]
The present invention has been made in view of the above problems, and has as its object the purpose of preventing the deposition of a deposited film from floating from the surface to be deposited, preventing the electrode of the organic EL display device from being accurately and stably provided. It is an object of the present invention to provide an evaporation mask that can be formed by using the method, and an organic EL display device manufactured using the mask.
[0009]
[Means for Solving the Problems]
In order to achieve the above object, the evaporation mask of the present invention has a structure in which at least an anode, an organic material layer containing a luminescent material, and a cathode are laminated on a substrate, and a plurality of rows of anodes are arranged in one direction. And an evaporation mask used to form an anode and a cathode of an organic EL display device in which a plurality of rows of cathodes are arranged along a direction orthogonal to the anode.
A frame that partitions the peripheral portion of the mask, and a plurality of resin fiber portions that are laid in parallel along one direction between opposing sides of the frame, and
The surface of the resin fiber portion that comes into contact with the surface to be deposited constitutes a plane portion.
[0010]
In the vapor deposition mask, it is preferable that a cross-sectional shape of the resin fiber portion is formed such that a width of a plane portion in contact with the surface to be vapor-deposited is larger than a width of a surface portion facing the surface.
[0011]
Further, it is preferable that the cross-sectional shape of the resin fiber portion is such that a width of a plane portion in contact with the surface to be vapor-deposited is larger than a maximum value of a thickness width orthogonal to the surface to be vapor-deposited.
[0012]
Further, the cross-sectional shape of the resin fiber portion is preferably a triangle, a square, a rectangle, a trapezoid, a polygon, or a semicircle.
[0013]
And it is preferable that the said frame and the said resin fiber part are formed with the same kind of resin material.
[0014]
In addition, it is preferable that the frame is reinforced by a reinforcing frame in order to give tension to the resin fiber portion.
[0015]
On the other hand, the organic EL display device of the present invention has at least an anode, an organic material layer containing a luminescent material, and a cathode laminated on a substrate, and a plurality of rows of anodes are arranged along one direction. In an organic EL display device in which a plurality of rows of cathodes are arranged along a direction orthogonal to the anode,
An anode and a cathode are pattern-formed on a substrate so as to be orthogonal to each other by using any one of the above masks for vapor deposition.
[0016]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited to the embodiments.
[0017]
The vapor deposition mask of the present invention is formed by stacking at least an anode, an organic material layer containing a luminescent material, and a cathode on a substrate, and disposing a plurality of rows of anodes along one direction, and orthogonal to the anodes. This mask is used for manufacturing an organic EL display device in which a plurality of rows of cathodes are arranged along a direction, and forms an anode and a cathode of the organic EL display device so as to be orthogonal to each other.
[0018]
The evaporation mask of the present embodiment includes a frame that partitions the peripheral portion of the mask, and a plurality of resin fiber portions that are laid in parallel in one direction between opposing sides of the frame. Have. In other words, the resin fiber portion is stretched across the opposite sides of the frame body in parallel in a stripe shape, and the surface of the resin fiber portion that contacts the substrate as the surface to be deposited constitutes a flat portion. are doing. And it is preferable that the cross-sectional shape of the resin fiber portion is formed such that the width of a plane portion in contact with the substrate as the surface to be vapor-deposited is larger than the width of the surface portion facing the same. Further, the cross-sectional shape of the resin fiber portion is preferably such that the width of a plane portion in contact with the surface to be vapor-deposited is larger than the maximum thickness width orthogonal to the surface to be vapor-deposited. As a mask for vapor deposition that satisfies such conditions, for example, a mask having a trapezoidal cross section of the resin fiber portion as shown in FIG. Alternatively, a semicircular, square, rectangular, or triangular mask as shown in FIG. 4B or a mask having a polygonal shape or the like can be used.
[0019]
By using a mask in which the surface in contact with the surface to be deposited of such a resin fiber portion constitutes a plane portion, the mask is easily adhered to the surface to be deposited, so that it is possible to prevent the deposition film from wrapping around, particularly at the edge portion. It is possible to prevent unevenness in film thickness. In other words, by devising the cross-sectional shape of the evaporation mask, it is possible to cause the evaporation particles that are not deposited due to the protrusion of the mask before reaching the evaporation surface to be evaporated on the substrate as the evaporation surface.
[0020]
Furthermore, a resin mask can be made lighter in weight than a mask made of metal, has less slack due to gravity, and can keep the mask stretched. This makes it possible to reduce the wraparound of the deposited film due to the lifting of the deposition mask. As a result, it is possible to form an accurate pattern conforming to a predetermined dimension.
[0021]
Various methods, such as a photolithography technique using a photocurable resin and an injection molding method, can be given as a method for producing the evaporation mask of the present invention. Hereinafter, a photolithography technique using a photocurable resin will be described as an example. However, in the present invention, the shape of an evaporation mask is important, and does not depend on a manufacturing method or a material.
[0022]
A deposition mask made of a photocurable resin, here a positive photoresist as an example, will be described with reference to FIG.
[0023]
First, as shown in FIG. 1A, a
[0024]
Then, as shown in FIG. 1 (b), the portion irradiated with light is cured to form a light-cured
[0025]
Thereafter, as shown in FIG. 1C, when the light-shielding
[0026]
Then, as shown in FIG. 1 (d), the adhesion portion between the
[0027]
At this time, not only the resin fiber portion (hereinafter, referred to as "mask line") is created, but also the
[0028]
As shown in FIGS. 3A and 3B, the resin fiber mask thus formed is attached to a metal or some rigid reinforcing
[0029]
Next, a description will be given of a resin fiber which is a constituent material of the evaporation mask.
[0030]
Materials used for making the mask for vapor deposition include nylon, polyester, polyethylene, polypropylene, polystyrene, urethane, epoxy, phenol, melamine, urea, silicon, polyimide, acrylic, Various synthetic fibers and natural fibers such as a vinyl-based, allylic-based ABS resin, or a halide thereof can be used, and a single fiber or a double fiber can be used.
[0031]
However, there are restrictions such as thermal expansion, decomposition, and softening due to a rise in temperature during vapor deposition. Any polymer can be used as long as the temperature rise can be suppressed. As a method of suppressing the temperature rise, for example, there is a method of performing evaporation while cooling the mask, and, in addition, in order to cut off the radiant heat of the evaporation source, a plate having a slit that does not transmit the radiant heat is referred to as an evaporation source. A method is also conceivable in which the particles are interposed between the mask and the vapor deposition particles coming out of the slit. That is, it is understood that basically any polymer can be used.
[0032]
Further, since it is necessary to minimize the slack of the mask when producing the mask, it is more advantageous to apply a certain amount of tension to the mask when attaching the mask to the reinforcing
[0033]
It is advantageous in terms of process and cost that it is not necessary to cool the mask or to worry about radiant heat. In addition, it is more advantageous in terms of cost to remove the film attached to the mask and wash it, rather than disposable once, rather than disposable once, so that the tensile strength is 140 kg / cm 2 or less. Thermal durability (including thermal deformation) of 70 ° C or higher, epoxy, silicon, allyl, polyester, phenol, polycarbonate, polyacetal, nylon (polyamide) based on chemical resistance, etc. Fluorine-based, polypropylene-based, polyimide-based, urea-based, and melamine-based are selected (see the data of the Plastics Research Handbook Co., Ltd., Industrial Research Institute, p6-p11).
[0034]
It is possible to form a mask with other polymers, and it is also possible to vapor-deposit, but among them, those which are considered to have good performance were selected.
[0035]
Next, a method of manufacturing a monocolor passively driven organic EL panel using the vapor deposition mask of the present invention will be described. However, the vapor deposition mask of the present invention can be used in addition to this.
[0036]
FIG. 5 shows a cross-sectional structure of the organic EL panel according to the present embodiment. An
[0037]
Further, the
[0038]
The anode needs to be transparent in order to extract light from the organic material layer 11 serving as a light emitting layer, and a metal, an alloy, an electrically conductive compound having a large work function, or a mixture thereof is used as an electrode material. Preferably, gold, ITO, CuI, tin oxide, indium oxide, zinc oxide, chromium, aluminum, silver and the like are used. This anode can be formed by a vapor deposition method or a sputtering method.
[0039]
The organic material layer 11 has, for example, a two-layer structure of a hole transport layer and an organic light emitting layer, but is not limited to this structure. A transport layer, an electron injection layer, and the like may be further formed to form a multilayer structure.
[0040]
The material for forming the hole transport layer is not particularly limited, and a compound conventionally used as a hole transport material, a novel compound, or the like can be used. For example, α-NPD {N, N′-di (α-naphthyl) -N, N′-diphenyl-1,1′-biphenyl-4,4′-diamine}, MTDATA {4-4′-4 ″- Tris (N- (3-methylphenyl) -N-phenylamino) triphenylamine}, TPD {N, N'-diphenyl-N, N'-bis (3-phenyl) -1,1'-biphenyl-biphenyl -4,4'-diamine} and the like.
[0041]
In the organic light emitting layer, anthracene, pyrene, tris (8-quinolinolato) aluminum complex and its derivative, quinolinol, quinoline derivative, bisstylanthracene derivative, coumarin derivative, perinone derivative, tetraphenylbutadiene derivative, oxadiazole derivative, phthalimide derivative , Aldazine derivatives, pyrazirine derivatives, cyclopentadiene derivatives, pyrrolopyridine derivatives, styrylamine derivatives, aldazine derivatives, naphthalimide derivatives, distilbenzene derivatives, thiadiazolopyridine derivatives and the like. In the case of a polymer system, a polyphenylenevinylene derivative, a polyparaphenylene derivative, a polythiophene derivative, or the like can be used.
[0042]
Furthermore, a small amount of impurities may be intentionally mixed into the organic light emitting layer for the purpose of improving the light emitting efficiency or extending the light emitting life. Specifically, it is selected from rubrene, quinacridone derivative, phenoxazone 660, dicyanomethylenestilpyran derivative, perinone, perylene, coumarin derivative, dimethylaminopyrazinecarbonitrile derivative, Nile Red, rhodamine derivative and the like.
[0043]
The formation of the organic material layer 11 is mainly performed by a vacuum evaporation method, but electron beam evaporation, a sputtering method, a molecular lamination method, and coating from a solvent are also possible.
[0044]
The cathode 12 is preferably a metal having a low work function in order to efficiently transfer electrons to the light-emitting layer. Specifically, aluminum, tin, indium, lead, magnesium, silver, copper, molybdenum, nickel, tungsten, a rare earth element alone , Alkali metals or alloys of these metals are used. The cathode 12 is formed by a vapor deposition method or a sputtering method. At this time, the deposition mask according to the present invention is effective for keeping the film thickness uniform within the dot and keeping the dot area constant.
[0045]
【The invention's effect】
As described above, according to the present invention, the vapor deposition mask has a shape that does not rise from the surface to be vapor-deposited, and there is no short circuit between the electrodes because there is no wraparound of the vapor deposition film. A pattern can be formed. Therefore, the electrodes of the organic EL display device can be formed accurately and stably.
[Brief description of the drawings]
FIG. 1 shows a method for producing a deposition mask of the present invention, and (a) to (d) are explanatory diagrams of the production procedure.
FIG. 2 is a view showing a completed product of a deposition mask of the present invention. (A) is a plan view of the finished product. (B) is AB sectional drawing of (a).
FIG. 3 is a diagram showing a reinforcing frame for reinforcing the vapor deposition mask of the present invention. (A) is a top view of a reinforcement frame. (B) is a sectional view of a state in which a resin mask is stuck to the reinforcing frame.
FIG. 4 is an explanatory view showing a cross-sectional shape of the evaporation mask of the present invention. (A) is a vapor deposition mask having a trapezoidal cross section. (B) is a figure which shows the example of another cross section.
FIG. 5 is a cross-sectional view illustrating an example of a layer configuration in the organic EL display device of the present invention.
FIG. 6 is a schematic view showing a pattern shape of an anode in the organic EL display device of the present invention.
FIG. 7 is a schematic diagram showing a positional relationship among a substrate, a deposition mask, and a cathode deposition source when an organic EL display device of the present invention is produced.
[Explanation of symbols]
REFERENCE SIGNS
Claims (7)
マスク周辺部を区画する枠体と、該枠体の相対向する辺間に一方向に沿って並列に掛け亘たされた複数条の樹脂繊維部とを備えており、
該樹脂繊維部の被蒸着面に接触する面が、平面部分を構成していることを特徴とする蒸着用マスク。On a substrate, at least an anode, an organic material layer containing a luminescent material, and a cathode are laminated, and a plurality of columns of anodes are arranged along one direction, and a plurality of rows of cathodes are arranged along a direction orthogonal to the anode. In an evaporation mask used to form an anode and a cathode of an organic electroluminescence display device,
A frame that partitions the peripheral portion of the mask, comprising a plurality of resin fiber portions that are laid in parallel along one direction between opposing sides of the frame,
A surface of the resin fiber portion, which is in contact with the surface to be vapor-deposited, constitutes a plane portion.
請求項1から6のいずれかの蒸着用マスクを使用して、基板上に互いに直交するように陽極および陰極をパターン形成したことを特徴とする有機エレクトロルミネセンス表示装置。On a substrate, at least an anode, an organic material layer containing a light-emitting material, and a cathode are laminated, and a plurality of columns of anodes are arranged along one direction, and a plurality of rows are arranged along a direction orthogonal to the anodes. In an organic electroluminescent display device provided with a cathode,
7. An organic electroluminescent display device, wherein an anode and a cathode are pattern-formed on a substrate so as to be orthogonal to each other by using the vapor deposition mask according to claim 1.
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