JP2003297967A - Multilayer structure for transmitting high frequency signal and high frequency semiconductor package employing it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve high frequency transmission characteristics. <P>SOLUTION: In the multilayer structure for transmitting a high frequency signal having through conductors for grounding the inner layer, through conductors for surface layer signal are arranged at the outer circumferential part of a region immediately over or under the uppermost layer and lowermost layer where inner layer grounding conductor is not formed in order to shorten the length of a signal wiring connection conductor. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high frequency semiconductor package for accommodating a semiconductor device and a laminated structure used in a high frequency band such as a microwave band and a millimeter wave band,
In particular, the present invention relates to a high-frequency signal transmission laminated structure having excellent high-frequency transmission characteristics and a high-frequency semiconductor package using the same.

[0002]

2. Description of the Related Art Conventionally, as the above high frequency transmission laminated structure,
There is a structure as shown in FIG.

In FIG. 17, reference numeral 1 denotes a dielectric layer, which is laminated to form a laminated plate. Reference numerals 11 and 21 denote signal wiring conductors, which are connected to the surface layer signal penetrating conductors 14 and 24 through the signal wiring connecting conductors 13 and 23, respectively. In the inner layer, 34 inner layer signal through conductors and 33 signal through conductor connecting conductors that connect them are formed, and are connected between the surface layer signal through conductors 14 and 24, and 32 inner layer ground conductors are connected. A circular inner-layer ground conductor non-forming region 36 is formed inside, and an inner-layer grounding through conductor 35 is formed near the outer periphery of the inner-layer ground conductor non-forming region 36.
Then, the surface-layer signal through conductors 14, 24, the inner-layer signal through-conductor 34, the surface ground conductor non-forming regions 16 and 26 and the inner layer ground conductor non-forming region 36 are overlapped while sharing the center, so-called coaxial line structure. None, it had a laminated structure for high frequency signal transmission.

[0004]

However, in the above-mentioned conventional laminated structure for high-frequency signal transmission, the signal wiring connection conductors 13 and 23 are long, and the distance from the high-frequency signal propagating therethrough to the ground is high. Since this is far, this portion acts as an inductance, and there is a problem that the high frequency transmission characteristics deteriorate.

The inventors of the present invention have, for example, a conventional laminated structure for high frequency signal transmission having the structure shown in FIG.
9 layers of dielectric layers 1 having a thickness of 0.2 mm and a thickness of 0.2 mm are laminated to form a laminated plate, the width of the signal wiring conductor 11 is 0.21 mm, and the width of the signal wiring connecting conductor 13 is 0.21 mm. For through conductor
14, 24 and the inner layer signal through conductor 34 are formed in a circular shape with a diameter of 0.1 mm, the signal through conductor connecting conductor is formed into a circular shape with a diameter of 0.16 mm, and the surface ground conductor non-formed regions 16 and 26 and the inner layer ground inner layer ground The conductor-free area 36 has a circular shape with a diameter of 1.24 mm, and the through conductor for grounding the inner layer has a circular shape with a diameter of 0.1 mm and a diameter of 1.40 m.
It was constructed by arranging the regular octagonal vertices on the circumference of m as the center. Then, the distance between the end portions of the surface layer signal wiring conductors 11 and 21 opposite to the signal wiring connection conductors 13 and 23 is set to 2.0 mm when viewed from above, and the high frequency characteristics between them are extracted by an electromagnetic field simulation. A characteristic curve of frequency characteristics as shown in the figure was obtained. In FIG. 19, the horizontal axis represents frequency (unit: GHz), and the vertical axis represents reflection coefficient (unit: d) as an evaluation index of the reflected amount of the input signal.
B) is shown, and the characteristic curve shows the frequency characteristic of the reflection coefficient.

The characteristic curve in FIG. 19 shows that the reflection increases as the frequency increases, and particularly at high frequencies, the influence of the inductance of the signal wiring connecting conductors 13 and 23 strongly appears and the reflection increases. , It was found that the transmission of high frequency signals was deteriorated.

It should be noted that the same structure as that of the example of FIG. 17 is used, except that the structure shown in FIG. 18 is the same as the above case as an example in which the inner layer grounding through conductor 35 is removed. When the high frequency characteristic was extracted by the electromagnetic field simulation with the design value, the characteristic curve as shown in FIG. 20 was obtained. FIG. 20 (a) shows the frequency characteristic of the reflection coefficient (unit: dB) showing the ratio of the reflected and returned signal in the incident high frequency signal, and FIG. 20 (b) shows the frequency characteristic of the incident high frequency signal transmitted. The frequency characteristics of the transmission coefficient (unit: dB) indicating the ratio of the transmitted signal are shown. From FIG. 20, by removing the inner-layer grounding through conductor 35, the reflection at high frequencies is slightly reduced, but the transmitted and transmitted signal is very small, and the signal is radiated through between the inner-layer grounded conductors 32. You can see that As described above, if the inner-layer grounding through conductor 35 is not properly arranged, the electromagnetic shielding space cannot be provided in the inner layer portion, so that a high-frequency signal is leaked, which causes an increase in radiation loss. This will deteriorate the characteristics.

Therefore, the present invention has been made in view of the above problems in the prior art, and an object thereof is to provide a laminated structure for high frequency signal transmission having good high frequency transmission characteristics and a high frequency semiconductor package using the same. Especially.

[0009]

A laminated structure for high-frequency signal transmission according to claim 1 of the present invention is formed on each of an uppermost layer and a lowermost layer of a laminated substrate formed by laminating four or more dielectric layers. The signal wiring conductors are in a relationship of extending in opposite directions from each other, and one end of each of these signal wiring conductors and a surface-layer signal through conductor that vertically penetrates through the uppermost layer and the lowermost dielectric layer are connected to each other. The inner layer ground conductor non-formation region and the inner layer ground conductor having a planar shape of biaxial symmetry are formed in each of the inner layers except the uppermost layer and the lowermost layer, which are connected through a connection conductor, and the inner layer grounded In the conductor non-forming area, a signal through conductor connecting conductor that connects to the inner layer signal through conductor that vertically penetrates each layer of the inner layer is formed, and the inner layer ground conductor non-forming area has an outer peripheral portion in which each layer of the inner layer is formed. Inner layer ground piers that pierce vertically A conductor, and a laminated structure for high-frequency signal transmission in which a surface-layer grounding through conductor that vertically penetrates between the surface-layer grounding conductor and the inner layer grounding conductor is formed, wherein the surface-layer signal through-conductor is the signal wiring connection conductor It is characterized in that it is arranged on the outer peripheral portion of the inner layer ground conductor non-forming region immediately above or below so as to have a short length.

Further, according to the high frequency semiconductor package of the thirteenth aspect, a frame body and a lid body are provided on the upper surface of the laminated substrate provided with the laminated structure for transmitting the high frequency signal, whereby the high frequency semiconductor element is accommodated. It is characterized by having done.

Here, in the laminated structure for high frequency signal transmission of the present invention, particularly, the thickness of the inner dielectric layer and the interval between the inner layer grounding through conductors are set to be smaller than half the guide wavelength of the highest frequency to be used. It is desirable to do. The reason for this is that, as shown in the conventional example, when the electromagnetic shielding space is not formed in the inner layer, electromagnetic waves leak in the inner layer and radiation loss is prevented. In other words, if the rectangle formed by the ground conductors above and below the inner layer and the through conductor for grounding is regarded as a rectangular waveguide, the lowest transmission mode (basic mode) of the rectangular waveguide is the TE10 mode, and the cutoff wavelength of this mode is Is equal to twice the effective length of the long side of the rectangle.
Therefore, in order to form the electromagnetic shielding space in the inner layer within the frequency band to be used, the thickness of the inner dielectric layer and the distance between the inner layer grounding through conductors should be smaller than half of the guide wavelength of the highest frequency to be used. Is necessary
More preferably, it is desirable to set the wavelength to a quarter wavelength or less. Therefore, it is also important to satisfy the above range within the range where manufacturing difficulties do not occur.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below with reference to the schematic drawings. The present invention is not limited to the following examples, and modifications and improvements can be made without departing from the spirit of the present invention.

FIG. 1 relates to claims 1 and 2 of the present invention,
It is a figure which shows the example of the laminated structure for 1st high frequency signal transmission,
(A) is a plan view and (b) is a sectional view taken along line AA of (a).
In FIG. 1, reference numeral 1 denotes a dielectric layer, which is laminated to form a laminated plate. Reference numerals 11 and 21 denote signal wiring conductors, which are connected to the surface layer signal penetrating conductors 14 and 24 through the signal wiring connecting conductors 13 and 23, respectively. In the present invention, the signal wiring connection conductor means a signal conductor that does not overlap the inner layer ground conductor 32 immediately below or above it. In the inner layer, 34 inner layer signal through conductors and 33 signal through conductor connecting conductors that connect them are formed, and are connected between the surface layer signal through conductors 14 and 24, and 32 inner layer ground conductors are connected. 36 elliptical inner layer ground conductor non-forming regions are formed inside, and 35 inner layer ground penetrating conductors are formed near the outer periphery of the inner layer ground conductor non-forming region 36. The inner layer ground conductor non-forming regions 36 are arranged one above the other, and connect the surface layer signal through conductors 14 and 24 smoothly by the inner layer signal through conductor 34 and the signal through conductor connecting conductor 33. It arranges so that it may be shifted in sequence.

Further, the surface-layer signal through conductors 14 and 24 are arranged on the outer peripheral portion of the inner-layer ground conductor non-forming region 36 immediately above or below, so that the length of the signal wiring connecting conductor 33 is shortened.

As a result, since the signal wiring connecting conductor is conventionally long and the distance from the signal wiring connecting conductor to the ground is long when viewed from the high frequency signal propagating there, this portion acts as an inductance and thereby high frequency transmission. Since the inductance of the signal wiring connecting conductor can be reduced as compared with the case where the characteristics are deteriorated, good high frequency transmission characteristics can be obtained. As a result, a high-frequency signal transmission laminated structure having excellent high-frequency transmission characteristics is obtained.
In particular, when arranging them so as to be smoothly connected between the surface layer signal through conductors 14 and 24 by the inner layer signal through conductor 34 and the signal through conductor connecting conductor 33, a region forming a high frequency signal transmission laminated structure ( (Size) can be made smaller than in the case where the inner layer ground conductor non-forming regions are sequentially arranged and arranged, and further, the impedance change can be made smaller than in the case where the shape of the inner layer ground conductor non-forming region is arranged and arranged sequentially. Therefore, there is an action and an effect that impedance matching becomes good.

Next, FIG. 2 is a view showing an example of a second laminated structure for high frequency signal transmission according to claim 4 of the present invention,
(A) is a plan view and (b) is a sectional view taken along line AA of (a).

In FIG. 2, the same parts as those in FIG. 1 are denoted by the same reference numerals, 1 is a dielectric layer, 11 and 21 are signal wiring conductors, 12 and 22 are surface ground conductors, and 13 and 23.
Is a signal wiring connection conductor, 14 and 24 are surface signal through conductors, 32 is an inner layer ground conductor, 33 is a signal through conductor connection conductor,
34 is a through conductor for inner layer signal, 35 is a through conductor for inner layer ground, 36
Is an area in which the inner-layer ground conductor is not formed. The inner-layer signal through conductor 34 has a smaller deviation as it approaches the center in the vertical direction (the middle layer of the laminated inner layers).

Thus, the propagation direction can be changed while maintaining the propagation mode stable with respect to the rectilinearity of the electromagnetic wave traveling from the surface layer to the inner layer (or from the inner layer to the surface layer), and therefore, between the surface layer and the inner layer. Since the impedance discontinuity in the propagation of the high frequency signal can be reduced, the high frequency transmission characteristic can be further improved. As a result, a high-frequency signal transmission laminated structure having excellent high-frequency transmission characteristics is obtained.

Next, FIG. 3 is a diagram showing an example of a third laminated structure for high-frequency signal transmission according to claim 4 of the present invention,
(A) is a plan view and (b) is a sectional view taken along line AA of (a).

That is, in FIG. 3, the same parts as those in FIG. 1 are denoted by the same reference numerals, 1 is a dielectric layer, and 11
And 21 are signal wiring conductors, 12 and 22 are surface ground conductors,
13 and 23 are signal wiring connection conductors, 14 and 24 are surface layer signal through conductors, 32 is an inner layer ground conductor, 33 is a signal through conductor connection conductor, 34 is an inner layer signal through conductor, and 35 is an inner layer grounding through conductor, Reference numeral 36 is a region where the inner layer ground conductor is not formed. Then, the inner layer ground conductor non-forming regions 36 are sequentially arranged so as to be smoothly connected to each other in the vertical direction.

As a result, the impedance change can be made smaller than that in the case where the shape of the inner layer ground conductor non-forming region is sequentially changed and arranged, so that the impedance matching is improved.

Next, FIG. 4 is a diagram showing an example of a fourth laminated structure for high-frequency signal transmission according to claim 5 of the present invention,
(A) is a plan view and (b) is a sectional view taken along line AA of (a).

In FIG. 4, the same parts as those in FIG. 1 are designated by the same reference numerals, 1 is a dielectric layer, 11 and 21 are signal wiring conductors, 12 and 22 are surface ground conductors, and 13 and 23.
Is a signal wiring connection conductor, 14 and 24 are surface signal through conductors, 32 is an inner layer ground conductor, 33 is a signal through conductor connection conductor,
34 is a through conductor for inner layer signal, 35 is a through conductor for inner layer ground, 36
Is an area in which the inner-layer ground conductor is not formed. The inner layer ground conductor non-forming region 36 has a smaller deviation as it approaches the center in the vertical direction.

As a result, the impedance discontinuity in the propagation of the high frequency signal between the surface layer and the inner layer can be reduced, so that the high frequency transmission characteristic can be further improved. As a result, a high-frequency signal transmission laminated structure having excellent high-frequency transmission characteristics is obtained.

Next, FIG. 5 is a diagram showing an example of a fifth laminated structure for high-frequency signal transmission according to claim 6 of the present invention,
(A) is a plan view and (b) is a sectional view taken along line AA of (a).

5, the same parts as those in FIG. 1 are designated by the same reference numerals, 1 is a dielectric layer, 11 and 21 are signal wiring conductors, 12 and 22 are surface ground conductors, and 13 and 23.
Is a signal wiring connection conductor, 14 and 24 are surface signal through conductors, 32 is an inner layer ground conductor, 33 is a signal through conductor connection conductor,
34 is a through conductor for inner layer signal, 35 is a through conductor for inner layer ground, 36
Is an area in which the inner-layer ground conductor is not formed. Then, the inner layer ground conductor non-forming regions 36 are arranged so that their shapes are changed so that they are smoothly connected to each other.

Thus, there is an effect that the area (dimensions) forming the high-frequency signal transmission laminated structure can be made smaller than that in the case where the inner layer ground conductor non-forming areas are sequentially displaced.

Next, FIG. 6 is a diagram showing an example of a sixth laminated structure for high-frequency signal transmission according to claim 7 of the present invention,
(A) is a plan view and (b) is a sectional view taken along line AA of (a).

In FIG. 6, the same parts as those in FIG. 1 are designated by the same reference numerals, 1 is a dielectric layer, 11 and 21 are signal wiring conductors, 12 and 22 are surface ground conductors, and 13 and 23.
Is a signal wiring connection conductor, 14 and 24 are surface signal through conductors, 32 is an inner layer ground conductor, 33 is a signal through conductor connection conductor,
34 is a through conductor for inner layer signal, 35 is a through conductor for inner layer ground, 36
Is an area in which the inner-layer ground conductor is not formed. The shape change of the inner layer ground conductor non-forming region 36 becomes smaller as it approaches the center in the vertical direction.

As a result, the impedance discontinuity in the propagation of the high-frequency signal between the surface layer and the inner layer can be reduced, so that more excellent high-frequency transmission characteristics can be obtained. As a result, a high-frequency signal transmission laminated structure having excellent high-frequency transmission characteristics is obtained.

Next, FIG. 7 is a diagram showing an example of a seventh high-frequency signal transmission laminated structure according to claim 8 of the present invention,
(A) is a plan view and (b) is a sectional view taken along line AA of (a).
7, the same parts as those in FIG. 1 are denoted by the same reference numerals, 1 is a dielectric layer, 11 and 21 are signal wiring conductors, 12 and 22 are surface ground conductors, and 13 and 23 are signal wirings. Connection conductors, 14 and 24 are surface signal through conductors, 32 is an inner layer ground conductor, 33 is a signal through conductor connection conductor, 34 is an inner layer signal through conductor, 35 is an inner layer grounding conductor, and 36 is an inner layer grounding conductor It is a formation area. Then, the surface signal through conductors 14, 2
4 and the inner layer signal through conductor 34 and the surface layer ground conductor non-forming regions 16 and 26 and the inner layer ground conductor non-forming region 36 are stacked so as to have a so-called coaxial line structure, and the surface layer ground conductor non-forming region 16 is formed. It is made smaller than the inner layer ground conductor non-forming region 36.

Thus, there is an effect that the region (dimension) forming the laminated structure for high frequency signal transmission can be made smaller than that in the case where the regions in which the inner layer ground conductors are not formed are sequentially displaced.

Next, FIG. 8 shows an eighth embodiment of the present invention.
It is a diagram showing an example of a laminated structure for high-frequency signal transmission,
(A) is a plan view and (b) is a sectional view taken along line AA of (a).

In FIG. 8, the same parts as those in FIG. 1 are denoted by the same reference numerals, 1 is a dielectric layer, 11 and 21 are signal wiring conductors, 12 and 22 are surface ground conductors, and 13 and 23.
Is a signal wiring connection conductor, 14 and 24 are surface signal through conductors, 32 is an inner layer ground conductor, 33 is a signal through conductor connection conductor,
34 is a through conductor for inner layer signal, 35 is a through conductor for inner layer ground, 36
Is an area in which the inner-layer ground conductor is not formed. The width of the signal wiring connection conductors 13 and 23 is wider than the width of the signal wiring conductors 11 and 21.

Since the widths of the signal wiring connection conductors 13 and 23 are wider than the widths of the signal wiring conductors 11 and 21, the inductance of the signal wiring connection conductors 13 and 23 can be further reduced. There is an action and an effect that the impedance matching becomes good.

By the way, in the high-frequency signal transmission laminated structure of the present invention, the length from the surface layer signal wiring conductor to the surface layer signal through conductor in the signal wiring connection conductor is directly above or directly below the uppermost layer or the lowermost layer. It is preferable that the thickness is less than or equal to the thickness of the region in which the inner layer ground conductor is not formed (the ninth laminated structure for high frequency signal transmission). This is based on the fact that the shorter the length of the signal wire connecting conductor, the smaller the inductance can be made. However, by making the length not more than the thickness of the uppermost or lowermost dielectric layer, the inductance becomes extremely small. By being maintained at.

Next, FIG. 9 is a view showing an example of a tenth laminated structure for high-frequency signal transmission according to claim 10 of the present invention,
(A) is a plan view and (b) is a sectional view taken along line AA of (a).

9, parts similar to those in FIG. 1 are designated by the same reference numerals, 1 is a dielectric layer, 11 and 21 are signal wiring conductors, 13 and 23 are signal wiring connection conductors, 14 and Reference numeral 24 is a surface layer signal through conductor, 32 is an inner layer grounding conductor, 33 is a signal through conductor connecting conductor, and 34 is an inner layer signal through conductor. Then, 12 surface ground conductors are formed on the upper surface or the lower surface of the laminated substrate 1 at a predetermined interval with respect to the signal wiring conductor 11 while surrounding the surface signal through conductor 14 and the signal wiring connection conductor 13. By connecting the surface grounding conductor 12 and the inner layer grounding conductor 32 by 15 surface layer grounding penetrating conductors that penetrate vertically, conventionally, the length of the signal wiring connecting conductor is long, and it can be seen from the high frequency signal propagating there. Compared to the case where the high-frequency transmission characteristics deteriorate due to the fact that this part acts as an inductance because the distance to the ground is long, the inductance of the signal wiring connection conductor can be made smaller, and the coplanarization as an input / output line is also possible. By configuring as a line, when the external wiring is a coplanar line,
Since the structure can reduce the discontinuity of the impedance in the connection with the external wiring, the high frequency transmission characteristic can be excellent. As a result, a high-frequency signal transmission laminated structure having excellent high-frequency transmission characteristics is obtained.

FIG. 21 shows the eleventh aspect according to the twelfth aspect of the present invention.
It is a diagram showing an example of a laminated structure for high-frequency signal transmission,
(A) is a plan view and (b) is a sectional view taken along line AA of (a).

The laminated structure for high frequency signal transmission shown in FIG.
In either of the upper and lower surfaces, the entire surface ground conductor 12 is connected to the signal wiring conductor 11 in the signal wiring connection conductor 13.
It is arranged on the signal wiring conductor 11 side with respect to the end opposite to. According to the configuration of FIG. 21, the surface ground conductor is formed only on both sides of the signal wiring conductor, so that the propagation mode is stably maintained with respect to the straightness of the electromagnetic wave traveling from the surface layer to the inner layer (or from the inner layer to the surface layer). Since it is possible to stably change the propagation direction as it is, the laminated structure for high frequency signal wave transmission can be obtained in which reflection is less likely to occur and impedance matching can be favorably performed.

The laminated structure for transmitting high frequency signals can be applied to a high frequency semiconductor package. That is,
A frame and a lid are formed on the upper surface of the laminated structure so as to accommodate the high-frequency semiconductor element, and an input for inputting / outputting signals to / from the outside is provided on the lower surface of the laminated structure on the opposite side of the signal wiring connecting conductor. By forming the output signal wiring connection conductor, a high frequency semiconductor package having excellent high frequency transmission characteristics is obtained.

FIG. 22 shows such a high-frequency semiconductor package, which is configured as a high-frequency semiconductor package by providing 41 frames and 42 lids to the first example of the high-frequency signal transmission laminated structure. There is.

In such a high-frequency signal transmission laminated structure of the present invention or a high-frequency semiconductor package using the same, the dielectric material is, for example, a ceramic material such as alumina, mullite, or aluminum nitride, a so-called glass-ceramic (glass + ceramic) material. The conductor patterns such as signal wiring conductors and grounding conductors are widely used for high frequency wiring conductors such as Cu, MoMn + Ni + Au, W + Ni + Au, Cr + C.
u, Cr + Cu + Ni + Au, Ta2N + NiCr + Au, Ti + Pd + Au, NiCr + Pd + Au
Is formed by a thick film printing method, various thin film forming methods, a plating method, or the like. Also, the thickness and width thereof are set together with the dielectric constant and thickness of the dielectric according to the frequency of the transmitted high frequency signal and the characteristic impedance used. When metal is used for the frame and lid, Fe-Ni alloy such as Fe-Ni-Co and Fe-Ni42 alloy, oxygen-free copper, aluminum, stainless steel, Cu-W alloy, Cu-Mo alloy, etc. For the joining between metal structures, the material consisting of is composed of high melting point metal brazing such as solder, AuSn brazing and AuGe brazing, seam welding (welding), etc. The substrate and the metal structure are AgCu solder and Au.
A high frequency semiconductor package having good transmission characteristics can be provided by housing a semiconductor element by joining with a high melting point metal solder such as Sn solder / AuGe solder.

[0044]

EXAMPLES Next, specific examples of the laminated structure for high frequency signal transmission of the present invention will be described. [Example 1] First, a dielectric layer having a relative permittivity of 9.2 and a thickness of 0.2 mm is formed in the same structure as in FIG. 1 showing a first high-frequency signal transmission laminated structure according to claims 1 and 2 of the present invention. 9 layers of 1 are laminated to form a laminated board, the width of the signal wiring conductor 11 is formed with 0.21 mm, the width of the signal wiring connection conductors 13 and 23 is 0.21 mm, and the signal wiring conductors 11 and 21 and the surface signal through conductor 14 are formed. , The distance to 24 is 0.13 mm
, The surface signal through conductors 14 and 24 and the inner layer signal through conductor 34 are formed into a circular shape with a diameter of 0.1 mm, and the signal through conductor connecting conductor is formed into a rectangular shape with a width of 0.16 mm. The conductor non-forming area 36 has a circular shape with a diameter of 1.24 mm, the inner layer grounding through conductor 35 has a circular shape with a diameter of 0.1 mm, and the center is 0.08 mm away from the outer circumference of the inner layer grounding conductor non-forming area 36. It is configured by arranging at eight places on the circumference, and the displacement between the 9 layers of the surface layer signal through conductors 14 and 24 and the inner layer signal through conductor 34 is shifted by 0.11 mm, and the surface layer signal wiring conductor 1 is formed.
Sample A of the laminated structure for high-frequency signal transmission of the present invention was obtained by setting the distance between the end portions of the signal wiring connecting conductors 13 and 23 of 1,21 to be 2.0 mm as viewed from above.

A second high-frequency signal transmission laminated structure according to claim 3 of the present invention has the same structure as that of FIG. 2 and has the same structure as the sample A, except that the surface-layer signal through conductor 14, 2
Displacement between 4 and 9 layers of the inner layer signal through conductor 34 from the surface side is 0.195 mm, 0.115 mm, 0.075 mm, 0.055 mm, 0.055 mm,
By setting the thickness to 0.075 mm, 0.115 mm, and 0.195 mm, Sample B of the laminated structure for high frequency signal transmission of the present invention was obtained.

The electrical characteristics between the end portions of the signal wiring conductor 21 on the lower surface and the end portions of the signal wiring conductor 11 on the upper surface of these samples A and B are extracted by electromagnetic field simulation, and the diagram is shown in FIG. The characteristic curve of the frequency characteristic as shown was obtained. In FIG. 10, the horizontal axis represents frequency (unit:
GHz), the vertical axis represents the reflection coefficient (unit: dB) as an evaluation index of the reflected amount of the input signal, and the characteristic curve represents the frequency characteristic of the reflection coefficient. Further, A and B added to the characteristic curves indicate that they are characteristic curves of the samples A and B, respectively.

From these results, it is understood that the samples A and B, which are the laminated structure for high frequency signal transmission of the present invention, have a small reflection even at a high frequency and have excellent electric characteristics. In particular, in Sample B, the displacement becomes smaller as the inner-layer signal through conductor becomes closer to the center of the inner-layer ground conductor non-formation region, and the impedance discontinuity becomes smaller, so that the matching is further improved. As a result of being able to carry out, it can be seen that it functions as a laminated structure for high frequency signal transmission which has good electrical characteristics with small reflection. [Example 2] First, in the same structure as FIG. 3 showing the third laminated structure for high-frequency signal transmission according to claim 4 of the present invention, as in the case of Sample A of [Example 1], except that the surface layer signal is The through conductors 14 and 24 for inner layer and the through conductors for inner layer signal 34 are stacked on top of each other, and the misalignment between the eight layers of the inner layer ground conductor non-forming region 36 is 0.11 mm
By shifting them one by one, Sample C of the laminated structure for high frequency signal transmission of the present invention was obtained.

A fourth high-frequency signal transmission laminated structure according to claim 5 of the present invention has the same structure as that of FIG.
Misalignment between 8 layers of 36 is 0.18mm, 0.14mm, 0.10m from the surface side
By setting m, 0.04mm, 0.10mm, 0.14mm, 0.18mm,
The sample D of the laminated structure for high frequency signal transmission of the present invention was obtained.

Then, with respect to these samples C and D, the electrical characteristics between the end portion of the signal wiring conductor 21 on the lower surface and the end portion of the signal wiring conductor 11 on the upper surface are extracted by an electromagnetic field simulation, and a diagram is shown in FIG. The characteristic curve of the frequency characteristic as shown by is obtained. 11, the horizontal axis represents frequency (unit: GHz), the vertical axis represents the reflection coefficient (unit: dB) as an evaluation index of the reflected amount of the input signal, and the characteristic curve represents the reflection coefficient. The frequency characteristic is shown.
Further, C and D added to the characteristic curves indicate that they are characteristic curves of the samples C and D, respectively.

From these results, it can be seen that Samples C and D, which are the laminated structure for high frequency signal transmission of the present invention, have a small reflection even at a high frequency and have a good electrical characteristic. In particular, in Sample D, the discontinuity of the impedance was further reduced because the deviation of the inner-layer ground conductor non-forming region becomes smaller as the center of the inner-layer ground conductor non-forming region approaches the inner-layer signal through conductor. Further, as a result of further excellent matching, it can be seen that it functions as a laminated structure for high-frequency signal transmission having good electrical characteristics with small reflection. [Example 3] First, in the same structure as in Fig. 5 showing a fifth laminated structure for high-frequency signal transmission according to claim 6 of the present invention, as in the case of Sample A in the above-mentioned [Example 1], except that the surface layer signal was used. The through conductors 14 and 24 for inner layer and the through conductors for inner layer signal 34 are stacked on top of each other, and the inner layer ground conductor non-forming region 36 is formed in a rectangular shape, the long side length of which is 1.16 mm and the short side length is the upper surface. 8 layers from the side, 0.76mm, 0.86mm, 0.96mm, 1.06mm, 1.06mm, 0.96mm,
By setting the thicknesses to 0.86 mm and 0.76 mm, Sample E of the laminated structure for high frequency signal transmission of the present invention was obtained.

A sixth high-frequency signal transmission laminated structure according to claim 7 of the present invention has the same structure as that of FIG.
The length of the short side of 36 rectangles is 0.76 mm in order from the top side to the 8 layers,
0.89mm, 1.00mm, 1.09mm, 1.09mm, 1.00mm, 0.89mm, 0.
By setting the thickness to 76 mm, a sample F having a laminated structure for high-frequency signal transmission of the present invention was obtained.

Then, with respect to these samples E and F, the electrical characteristics between the end portion of the signal wiring conductor 21 on the lower surface and the end portion of the signal wiring conductor 11 on the upper surface are extracted by an electromagnetic field simulation, and a diagram is shown in FIG. The characteristic curve of the frequency characteristic as shown by is obtained. In FIG. 12, the horizontal axis represents the frequency (unit: GHz), the vertical axis represents the reflection coefficient (unit: dB) as an evaluation index of the reflected amount of the input signal, and the characteristic curve represents the reflection coefficient. The frequency characteristic is shown.
Further, E and F added to the characteristic curves indicate that they are characteristic curves of the samples E and F, respectively.

From these results, it can be seen that Samples E and F, which are the laminated structure for high frequency signal transmission of the present invention, have a small reflection even at a high frequency and have good electrical characteristics. In particular, in Sample F, the shape change of the inner layer ground conductor non-forming region was smaller as the center of the inner layer ground conductor non-forming region was closer to the inner layer signal through conductor, so that the impedance discontinuity was smaller. Therefore, as a result of further excellent matching, it can be seen that it functions as a laminated structure for high-frequency signal transmission that has good electrical characteristics with small reflection. [Example 4] A structure similar to that of Fig. 7 showing a seventh laminated structure for high-frequency signal transmission showing the embodiment of claim 8 of the present invention, the same as the sample A of the above-mentioned [Example 1] except that the surface layer was The signal through conductors 14, 24 and the inner layer signal through conductors 34 and the circular inner layer ground conductor non-forming region 36 are configured to have the same center, and the diameters of the uppermost layer and the lowermost layer of the inner layer grounding conductor non-forming region 36 are set. Was 0.46 mm and the other 6 layers had a diameter of 1.24 mm to obtain Sample G of the laminated structure for high frequency signal transmission of the present invention.

Then, the electrical characteristics of this sample G between the end portion of the signal wiring conductor 21 on the lower surface and the end portion of the signal wiring conductor 11 on the upper surface are extracted by an electromagnetic field simulation, as shown in the diagram in FIG. A characteristic curve with various frequency characteristics was obtained. In FIG. 13, the horizontal axis represents frequency (unit: GH
z), the vertical axis shows the reflection coefficient (unit: dB) as an evaluation index of the reflected amount of the input signal, and the characteristic curve shows the frequency characteristic of the reflection coefficient. Further, G added to the characteristic curve indicates that it is the characteristic curve of the sample G.

From these results, it is understood that the sample G, which is the laminated structure for high frequency signal transmission of the present invention, has a small reflection even at high frequencies and has excellent electrical characteristics and has a laminated structure for high frequency signal transmission. [Example 5] The same structure as in Fig. 8 showing an eighth laminated structure for high-frequency signal transmission according to claim 9 of the present invention, but with the above-mentioned [Example 1].
Sample H of the laminated structure for high-frequency signal transmission of the present invention was obtained in the same manner as Sample B except that the widths of the signal wiring connecting conductors 13 and 23 were 0.30 mm.

Then, the electrical characteristics of this sample H between the end portion of the signal wiring conductor 21 on the lower surface and the end portion of the signal wiring conductor 11 on the upper surface are extracted by an electromagnetic field simulation, as shown in the diagram in FIG. A characteristic curve with various frequency characteristics was obtained. In FIG. 14, the horizontal axis represents frequency (unit: GH
z), the vertical axis shows the reflection coefficient (unit: dB) as an evaluation index of the reflected amount of the input signal, and the characteristic curve shows the frequency characteristic of the reflection coefficient. Further, B and H added to the characteristic curves indicate that they are the characteristic curves of Sample B and Sample H obtained in [Example 1].

From these results, it is understood that Samples B and H, which are the laminated structure for high frequency signal transmission of the present invention, have a small reflection even at a high frequency and have a good electrical characteristic. In particular, since the sample H has a smaller impedance discontinuity, it is possible to perform better matching, and as a result, the sample H functions as a laminated structure for high frequency signal transmission having good electrical characteristics with small reflection. I understand. [Example 6] First, in the same structure as in Fig. 1 showing the ninth laminated structure for high-frequency signal transmission according to claim 10 of the present invention, as in the case of Sample A of the above-mentioned [Example 1], except that the signal wiring is Connection conductor
The length of 13,23 is 0.20 mm, and the deviation between the 9 layers of the surface layer signal through conductors 14 and 24 and the inner layer signal through conductor 34 is shifted by 0.0925 mm to obtain a sample of the laminated structure for high frequency signal transmission of the present invention. Got I.

For comparison, the structure is the same as that of Sample I except that the lengths of the signal wiring connecting conductors 13 and 23 are 0.29 mm.
Then, a comparative sample J was obtained by shifting the displacement between the nine layers of the surface layer signal through conductors 14 and 24 and the inner layer signal through conductor 34 by 0.07 mm.

Then, with respect to these samples I and J, the electrical characteristics between the end portion of the signal wiring conductor 21 on the lower surface and the end portion of the signal wiring conductor 11 on the upper surface are extracted by an electromagnetic field simulation, and a diagram is shown in FIG. The characteristic curve of the frequency characteristic as shown by is obtained. In FIG. 15, the horizontal axis represents the frequency (unit: GHz), the vertical axis represents the reflection coefficient (unit: dB) as an evaluation index of the reflected amount of the input signal, and the characteristic curve represents the reflection coefficient. The frequency characteristic is shown.
A.I.J added to the characteristic curves indicate that they are the characteristic curves of Sample A and Sample I.J of [Example 1], respectively.

From these results, it can be seen that Sample A · I, which is the laminated structure for high frequency signal transmission of the present invention, has a small reflection even at high frequency and has a high frequency signal transmission laminated structure having good electrical characteristics. On the other hand, in the sample J obtained as a comparative example, since the length of the signal wiring connecting conductor becomes too long, the function as an inductance appears strongly and reflection of high frequency becomes large, resulting in deterioration of electrical characteristics. You know that it will happen. Therefore, the length of the signal wiring connection conductor from the surface signal wiring conductor to the surface signal through conductor is set to be equal to or less than the thickness of the uppermost or lowermost dielectric layer, thereby reliably reducing the inductance of the signal wiring connection conductor. Therefore, it is possible to more surely obtain good high frequency transmission characteristics. [Example 7] First, the tenth high-frequency signal transmission laminated structure according to claim 11 of the present invention has the same structure as that of FIG. On the top surface of 1, the surface layer signal through conductor 14 and the signal wiring connection conductor 13
The surface grounding conductor 12 is formed with a space of 0.10 mm with respect to the signal wiring conductor 11 so as to match the shape with the area where the inner layer grounding conductor is not formed, and further, this surface grounding conductor 12 and the inner layer grounding conductor 32. The sample K of the laminated structure for high-frequency signal transmission of the present invention was obtained by connecting the upper and lower parts with the through conductor 15 for grounding the surface layer having a diameter of 0.1 mm.

Then, with respect to this sample K, when the electrical characteristics between the end portion of the signal wiring conductor 21 on the lower surface and the end portion of the signal wiring conductor 11 on the upper surface are extracted by electromagnetic field simulation, as shown in the diagram in FIG. A characteristic curve with various frequency characteristics was obtained. In FIG. 16, the horizontal axis represents frequency (unit: GH
z), the vertical axis shows the reflection coefficient (unit: dB) as an evaluation index of the reflected amount of the input signal, and the characteristic curve shows the frequency characteristic of the reflection coefficient. Further, K added to the characteristic curve indicates that it is the characteristic curve of the sample K.

From these results, the sample K having the laminated structure for high frequency signal transmission of the present invention has small reflection even at high frequencies, has good electrical characteristics, and is configured as a coplanar line as an input / output line. In the case where the external wiring is a coplanar line, a laminated structure for high-frequency signal transmission having good high-frequency transmission characteristics is provided so that the impedance discontinuity in the connection with the external wiring can be reduced. I understand.

It should be noted that the above is merely an example of the embodiments of the present invention, and the present invention is not limited to these, and various modifications and improvements may be made without departing from the scope of the present invention. It doesn't matter.

For example, in the exemplification of the embodiment of the present invention, the shapes of the surface ground conductor non-forming region and the inner layer ground conductor non-forming region are shown as circular and rectangular, but other shapes such as elliptical and even polygonal shapes are also available. It is also possible to use a biaxially symmetrical shape.

When the surface ground conductor is provided on the upper surface or the lower surface of the laminated substrate, the surface ground conductor is formed as a high frequency transmission line by forming a predetermined width on both sides of the signal wiring conductor. Therefore, the high frequency characteristics are excellent even if they do not necessarily surround the signal wiring connection conductor, but a structure having more suitable high frequency transmission characteristics can be obtained by approaching the structure surrounding the signal wiring connection conductor.

[0066]

As described above, according to the laminated structure for high frequency signal transmission of claim 1, the signal formed on each of the uppermost layer and the lowermost layer of the laminated substrate formed by laminating four or more dielectric layers. The wiring conductors are in a relationship of extending in opposite directions from each other, and one end of each of these signal wiring conductors and a surface signal through conductor which vertically penetrates the uppermost layer and the lowermost dielectric layer are connected to each other by signal wiring. Connected via a conductor, and each of the inner layers except the uppermost layer and the lowermost layer has a planar shape of 2
An inner layer ground conductor non-forming region having an axisymmetric shape and an inner layer ground conductor non-forming region are formed, and in the inner layer ground conductor non-forming region, a signal penetrating connecting to an inner layer signal penetrating conductor vertically penetrating each layer of the inner layer is formed. A conductor connecting conductor is formed, and an inner-layer grounding through conductor that vertically penetrates each layer of the inner layer, and vertically penetrates between the surface layer grounding conductor and the inner layer grounding conductor, in an outer peripheral portion of the inner layer grounding conductor non-forming region. A laminated structure for high-frequency signal transmission in which a through conductor for surface layer grounding is formed, in which the inner layer ground conductor non-forming region directly above or directly below the surface layer signal through conductor so that the length of the signal wiring connecting conductor is shortened. Since the conductor is connected to the outer peripheral portion, the length of the signal wiring connecting conductor can be shortened, and the high frequency transmission characteristics can be improved by reducing the inductance in this portion. Result, it is possible to solve the problem that reflected in the high frequency is increased.

According to the laminated structure for high-frequency signal transmission of claim 2, the surface-layer signal through conductors are arranged so as to be sequentially shifted so that the inner-layer signal through conductors and the signal through-conductor connecting conductors are connected smoothly. Therefore, the impedance change can be made smaller than that in the case where the region (dimensions) forming the laminated structure for high-frequency signal transmission is arranged by changing the shape of the region in which the inner layer ground conductor is not formed, so that the impedance matching is improved. .

According to the laminated structure for high-frequency signal transmission of claim 3, in the laminated structure for high-frequency signal transmission of claim 2, the inner layer signal through conductor is displaced toward the center of the inner layer ground conductor non-formed region. Is smaller, the impedance discontinuity in the propagation of the high-frequency signal between the surface layer and the inner layer can be reduced, and more excellent high-frequency transmission characteristics can be obtained.

According to the laminated structure for high frequency signal transmission of claim 4, in the laminated structure for high frequency signal transmission of claim 1, the inner layer ground conductor non-forming regions of the uppermost inner layer and the lowermost layer are signal wiring connection conductors. The outer circumference of this inner layer ground conductor non-formed area is arranged in the vicinity of the surface signal through conductor so that the length of the inner layer ground conductor non-formed area becomes short, and the inner layer ground conductor non-formed area excluding the innermost layer and the lowermost layer is the uppermost layer of the inner layer. Since the inner layer ground conductor non-formation regions of the lowermost layer are arranged so as to be smoothly connected to each other, the change in impedance is smaller than that in the case where the inner layer conductor non-formation regions are sequentially changed and arranged. It is possible to improve impedance matching.

According to the laminated structure for high-frequency signal transmission of claim 5, in the laminated structure for high-frequency signal transmission according to claim 4, the inner layer ground conductor non-formed region has a center of the inner layer ground conductor non-formed region for inner layer signal. Since the deviation becomes smaller as it gets closer to the through conductor, it is possible to reduce the discontinuity of the impedance in the propagation of the high frequency signal between the surface layer and the inner layer, and it is possible to obtain more excellent high frequency transmission characteristics. .

Further, in the laminated structure for high frequency signal transmission according to claim 6, in the laminated structure for high frequency signal transmission according to claim 1, the inner layer ground conductor non-forming regions of the uppermost inner layer and the lowermost layer are the lengths of the signal wiring connecting conductors. The outer circumference of this inner layer ground conductor non-formed area is arranged in the vicinity of the surface layer signal conductor so that the length of the inner layer ground conductor non-formed area becomes short and the inner layer ground conductor non-formed area of the innermost layer and the innermost layer is smoothly connected. By arranging by changing the shape, the region (dimension) forming the laminated structure for high-frequency signal transmission can be made smaller than the case where the regions in which the inner layer ground conductors are not formed are sequentially shifted.

The laminated structure for high frequency signal transmission according to claim 7 is the laminated structure for high frequency signal transmission according to claim 6,
Since the shape change of the inner layer ground conductor non-formed area becomes smaller as the center of the inner layer ground conductor non-formed area approaches the inner layer signal through conductor, the impedance of the high-frequency signal propagation between the surface layer and the inner layer becomes smaller. The discontinuity can be reduced, and more excellent high frequency transmission characteristics can be obtained.

According to the laminated structure for high-frequency signal transmission of claim 8, in the laminated structure for high-frequency signal transmission according to claim 1, the innermost ground conductor non-formation regions of the uppermost inner layer and the lowermost layer are the uppermost inner layers. Since the area is smaller than the inner layer ground conductor non-forming area excluding the lowermost layer, the area (dimensions) forming the laminated structure for high-frequency signal transmission should be smaller than that in the case where the inner layer ground conductor non-forming area is sequentially shifted. You can

According to the laminated structure for high frequency signal transmission of claim 9 of the present invention, in the laminated structure for high frequency signal transmission of claims 1 to 8, the width of the signal wiring connecting conductor is larger than the width of the signal wiring conductor. Since the width is wide, the width of the signal wiring connecting conductor is widened, so that the inductance of this portion becomes smaller and the impedance matching becomes good.

According to the laminated structure for high-frequency signal transmission of claim 10, in the laminated structure for high-frequency signal transmission of claims 1 to 9, the length from the signal wiring conductor to the surface-layer signal through conductor is the above-mentioned. Since the thickness is less than or equal to the thickness of the inner layer surface layer ground conductor non-forming region immediately above or below the uppermost layer and the lowermost layer, the inductance can be suppressed to a very small extent.

Further, according to the laminated structure for high frequency signal radio waves of claim 11, a surface layer ground conductor non-forming region and a surface layer ground conductor having a predetermined distance from the signal wiring conductor are provided on either of the upper and lower surfaces of the laminated substrate. While forming the signal wiring connection conductor, the signal wiring conductor is arranged on the outer peripheral portion of the surface layer ground conductor non-forming region so that the length of the signal wiring connection conductor is shortened, and
Since the surface layer ground region surrounds the signal wiring conductor, conventionally, the length of the signal wiring connecting conductor is long, and this portion acts as an inductance because the distance from the high frequency signal propagating there to the ground is long. In comparison with the case where the deterioration of the high frequency transmission characteristics occurs, the inductance of the signal wiring connection conductor can be reduced, and by configuring the input / output line as a coplanar line, when the external wiring is a coplanar line, Since the structure can reduce the discontinuity of the impedance in the connection with the external wiring, the high frequency transmission characteristic can be excellent. As a result, a high-frequency signal transmission laminated structure having excellent high-frequency transmission characteristics is obtained.

According to the laminated structure for high-frequency signal transmission of the twelfth aspect, a surface layer ground conductor non-formation region and a surface layer ground conductor having a predetermined distance from the signal wiring conductor are formed on either the upper or lower surface of the laminated substrate. And forming the signal wiring connection conductor on the outer peripheral portion of the non-formation region of the surface layer ground conductor so that the length of the signal wiring connection conductor is shortened, and the entire surface layer ground conductor is connected to the signal line connection. Since the conductor is arranged closer to the signal wiring conductor side than the end opposite to the signal wiring conductor, the surface layer ground conductor is provided only on both sides of the signal wiring conductor. It is possible to change the propagation direction stably while keeping the propagation mode stable against the straightness of the electromagnetic wave going to the surface layer), so that reflection is less likely to occur and impedance matching is good. Playable a high frequency signal wave transmitting laminated structure.

Further, according to the high frequency semiconductor package of the thirteenth aspect, for example, a frame body and a lid body are housed on the upper surface of the laminated substrate having the laminated structure for high frequency signal transmission of the first to the twelfth aspects so as to accommodate the high frequency semiconductor element. A high-frequency semiconductor having good high-frequency transmission characteristics by forming an input / output signal wiring connection conductor for signal input / output with the outside on the side opposite to the signal wiring connection conductor of the signal wiring conductor on the lower surface of the laminated substrate. Can be provided as a package.

[Brief description of drawings]

1A and 1B are diagrams schematically showing an example of a first laminated structure for high-frequency signal transmission according to the present invention, in which FIG. 1A is a plan view and FIG.
FIG. 7A is a sectional view taken along the line AA in (a).

FIG. 2 is a diagram schematically showing an example of a second laminated structure for high-frequency signal transmission according to the present invention, in which (a) is a plan view and (b) is a plan view.
FIG. 7A is a sectional view taken along the line AA in (a).

FIG. 3 is a diagram schematically showing an example of a third laminated structure for high-frequency signal transmission according to the present invention, in which (a) is a plan view and (b) is a plan view.
FIG. 7A is a sectional view taken along the line AA in (a).

FIG. 4 is a diagram schematically showing an example of a fourth laminated structure for high-frequency signal transmission according to the present invention, in which (a) is a plan view and (b) is a plan view.
FIG. 7A is a sectional view taken along the line AA in (a).

5A and 5B are diagrams schematically showing an example of a fifth laminated structure for high-frequency signal transmission according to the present invention, in which FIG. 5A is a plan view and FIG.
FIG. 7A is a sectional view taken along the line AA in (a).

FIG. 6 is a diagram schematically showing an example of a sixth laminated structure for high-frequency signal transmission according to the present invention, in which (a) is a plan view and (b) is a plan view.
FIG. 7A is a sectional view taken along the line AA in (a).

FIG. 7 is a diagram schematically showing an example of a seventh laminated structure for high-frequency signal transmission according to the present invention, in which (a) is a plan view and (b) is a plan view.
FIG. 7A is a sectional view taken along the line AA in (a).

FIG. 8 is a diagram schematically showing an example of an eighth laminated structure for high-frequency signal transmission according to the present invention, in which (a) is a plan view and (b) is a plan view.
FIG. 7A is a sectional view taken along the line AA in (a).

9A and 9B are diagrams schematically showing an example of a tenth high-frequency signal transmission laminated structure of the present invention, in which FIG. 9A is a plan view and FIG. 9B is a sectional view taken along line AA of FIG. 9A.

FIG. 10 is a diagram showing high-frequency characteristics of the first and second high-frequency signal transmission laminated structures of the present invention.

FIG. 11 is a diagram showing high-frequency characteristics of the third and fourth high-frequency signal transmission laminated structures of the present invention.

FIG. 12 is a diagram showing high-frequency characteristics of the fifth and sixth laminated structures for transmitting high-frequency signals of the present invention.

FIG. 13 is a diagram showing high-frequency characteristics of the seventh laminated structure for high-frequency signal transmission of the present invention.

FIG. 14 is a diagram showing high-frequency characteristics of the eighth laminated structure for high-frequency signal transmission of the present invention.

FIG. 15 is a diagram showing high-frequency characteristics of a ninth laminated structure for high-frequency signal transmission of the present invention.

FIG. 16 is a diagram showing high-frequency characteristics of the tenth laminated structure for high-frequency signal transmission of the present invention.

17A and 17B are a plan view and a cross-sectional view showing an example of a conventional laminated structure for high-frequency signal transmission.

18A and 18B are a plan view and a cross-sectional view showing another example of the conventional laminated structure for high-frequency signal transmission.

FIG. 19 is a diagram showing high frequency characteristics of an example of a conventional laminated structure for high frequency signal transmission.

FIG. 20 is a diagram showing high frequency characteristics of another example of the conventional laminated structure for high frequency signal transmission.

FIG. 21 is a diagram schematically showing an example of a tenth high-frequency signal transmission laminated structure according to the present invention, in which (a) is a plan view,
(B) is a sectional view taken along the line AA of (a).

FIG. 22 is a cross-sectional view schematically showing an example of a high frequency semiconductor package using the laminated structure for high frequency signal transmission according to the present invention.

[Explanation of symbols]

1 ... Dielectric layer 11,21 ・ ・ ・ ・ ・ Signal wiring conductor 12,22 ・ ・ ・ ・ ・ Surface layer ground conductor 13,23 ・ ・ ・ ・ ・ Signal wiring connection conductor 14,24 ・ ・ ・ ・ ・ Surface signal through conductor 15,25 ・ ・ ・ ・ ・ Penetrating conductor for surface grounding 16,26 ・ ・ ・ ・ ・ Surface layer ground conductor non-formation area 32: Inner layer ground conductor 33. Signal through conductor connecting conductor 34 ・ ・ ・ ・ ・ Through conductor for inner layer signal 35 ・ ・ ・ ・ ・ Through conductor for inner layer grounding 36: Area where inner layer ground conductor is not formed 41 ・ ・ ・ ・ ・ Frame body 42 ... Lid

Claims (13)

[Claims] 1. A signal wiring conductor formed on each of an uppermost layer and a lowermost layer of a laminated substrate formed by laminating four or more dielectric layers has a relationship extending from one end in the opposite direction to each other. One end of a conductor and a surface layer signal through conductor that vertically penetrates the uppermost layer and the lowermost dielectric layer,
An inner layer ground conductor non-forming region having a plane biaxial symmetrical shape and an inner layer ground conductor are formed in each of the inner layers except the uppermost layer and the lowermost layer, which are connected to each other through a signal wiring connecting conductor; In the inner layer ground conductor non-forming region, a signal through conductor connecting conductor connecting to the inner layer signal through conductor vertically penetrating each layer of the inner layer is formed, and in the outer peripheral portion of the inner layer ground conductor non-forming region, the inner layer A laminated structure for high-frequency signal transmission, wherein an inner-layer grounding through conductor that vertically penetrates each layer, and a surface-layered grounding through conductor that vertically penetrates between the surface-layer grounding conductor and the inner-layer grounding conductor are formed. A laminated structure for high-frequency signal transmission, wherein a through conductor is arranged on an outer peripheral portion of the inner layer ground conductor non-forming region immediately above or below so that the length of the signal wiring connecting conductor is shortened. 2. The laminated structure for high-frequency signal transmission according to claim 1, wherein the through conductors for inner layer signals are sequentially arranged so as to be smoothly connected to each other between the through conductors for surface signals. 3. The laminated structure for high frequency signal transmission according to claim 2, wherein the inner-layer signal through conductor has a smaller deviation toward the center in the vertical direction. 4. The laminated structure for high frequency signal transmission according to claim 1, wherein the inner-layer ground conductor non-forming regions are arranged so as to be sequentially shifted so as to be smoothly connected to each other. 5. The laminated structure for high-frequency signal transmission according to claim 4, wherein the inner layer ground conductor non-forming region has a smaller deviation toward the center in the vertical direction. 6. The laminated structure for high frequency signal transmission according to claim 1, wherein the inner layer ground conductor non-forming regions are arranged so that their shapes are changed so that they are smoothly connected to each other. 7. The laminated structure for high-frequency signal transmission according to claim 6, wherein the inner-layer ground conductor non-forming region has a shape change which is small as it approaches the center in the vertical direction. 8. The high frequency signal according to claim 1, wherein the inner surface layer ground conductor non-forming region immediately above or below the uppermost layer and the lowermost layer is smaller than the other inner layer ground conductor non-forming regions. Laminated structure for transmission. 9. The laminated structure for high frequency signal transmission according to claim 1, wherein a width of the signal wiring connecting conductor is wider than a width of the signal wiring conductor. 10. The length from the signal wiring conductor to the surface-layer signal through conductor is less than or equal to the thickness of the inner layer surface-layer ground conductor non-forming region immediately above or below the uppermost layer and the lowermost layer. The laminated structure for high frequency signal transmission according to claim 1. 11. A surface layer ground conductor having a predetermined distance from the surface layer ground conductor non-formation region and the signal wiring conductor is formed on either the upper surface or the lower surface of the laminated substrate, and the length of the signal wiring connection conductor is short. So that the signal wiring conductor is arranged in the outer peripheral portion of the surface layer ground conductor non-forming region, and
11. The laminated structure for high frequency signal transmission according to claim 1, wherein the surface layer ground region surrounds the signal wiring conductor. 12. A surface layer ground conductor non-forming region and a surface layer ground conductor having a predetermined distance from the signal wiring conductor are formed on either of the upper and lower surfaces of the laminated substrate, and the length of the signal wiring connecting conductor is The signal wiring conductor is arranged in the outer peripheral portion of the surface layer ground conductor non-forming region so as to be shortened, and the entire surface layer ground conductor is located at an end of the signal wiring connection conductor opposite to the signal wiring conductor. The laminated structure for high frequency signal transmission according to claim 1, wherein the laminated structure is arranged on the side of the signal wiring conductor. 13. A structure for accommodating a high-frequency semiconductor element by providing a frame and a lid on the upper surface of the laminated substrate provided with the laminated structure for high-frequency signal transmission according to any one of claims 1 to 12. High frequency semiconductor package.