JP2003242471A - Antenna pattern forming method for ic chip mounted on web and package body with ic tug - Google Patents

Antenna pattern forming method for ic chip mounted on web and package body with ic tug

Info

Publication number
JP2003242471A
JP2003242471A JP2002036151A JP2002036151A JP2003242471A JP 2003242471 A JP2003242471 A JP 2003242471A JP 2002036151 A JP2002036151 A JP 2002036151A JP 2002036151 A JP2002036151 A JP 2002036151A JP 2003242471 A JP2003242471 A JP 2003242471A
Authority
JP
Japan
Prior art keywords
chip
antenna pattern
web material
tag
web
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002036151A
Other languages
Japanese (ja)
Other versions
JP3998992B2 (en
JP2003242471A5 (en
Inventor
Kazuyuki Takazawa
和幸 高澤
Shigeru Nakano
茂 中野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP2002036151A priority Critical patent/JP3998992B2/en
Publication of JP2003242471A publication Critical patent/JP2003242471A/en
Publication of JP2003242471A5 publication Critical patent/JP2003242471A5/ja
Application granted granted Critical
Publication of JP3998992B2 publication Critical patent/JP3998992B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/95053—Bonding environment
    • H01L2224/95085—Bonding environment being a liquid, e.g. for fluidic self-assembly
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01009—Fluorine [F]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01018—Argon [Ar]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01049—Indium [In]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Details Of Aerials (AREA)
  • Support Of Aerials (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an antenna pattern forming method to an IC chip mounted on a web, and a package body with an IC tug. <P>SOLUTION: This antenna pattern forming method to the IC chip mounted on a web includes (1) a process of forming a recessed hole corresponding to the outline and depth of the IC chip at spaces in the running web material, (2) a process of fitting IC chips having the shape corresponding to the above outline and depth in the recessed holes of the web material with each one left fitted, (3) a process of printing an antenna pattern to be connected to pads of the IC chips fitted to the recessed parts, and if necessary, (4) a process of covering a film on the whole surface of the recessed parts to which the IC chips are fitted of the web material on which the antenna pattern is printed. This packaged body with the IC tug is manufactured by the above method. <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【発明の属する技術分野】この発明は、連続的に供給す
るウェブ材料にＩＣチップを実装し、当該ＩＣチップに
アンテナパターンの印刷を行って非接触通信機能を有す
るＩＣタグ付き包装体を製造する方法等に関する。包装
体に非接触通信機能を有するＩＣタグを装着することが
行われるようになってきている。本発明はかかる非接触
ＩＣタグ用のＩＣチップを包装体の製造工程において、
直接、ウェブ材料に実装し、さらにアンテナパターンの
印刷を行う技術に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention manufactures a package with an IC tag having a contactless communication function by mounting an IC chip on a continuously supplied web material and printing an antenna pattern on the IC chip. Regarding methods etc. An IC tag having a non-contact communication function has been attached to a package. The present invention provides an IC chip for such a non-contact IC tag in a manufacturing process of a package,
The present invention relates to a technology of directly mounting on a web material and printing an antenna pattern.

【０００２】[0002]

【従来技術】非接触で情報を記録し、かつ読み取りでき
る「非接触ＩＣタグ」（一般に、「非接触データキャリ
ア」、「無線ＩＣタグ」、「非接触ＩＣ」、「非接触Ｉ
Ｃラベル」、「ＲＦＩＤタグ」等と表現される場合もあ
る。）が、物品や商品の情報管理、物流管理等に広く利
用されるようになってきている。食品等の包装体の分野
でも非接触ＩＣタグを装着して、流通や品質管理、使用
期限管理等に利用することが行われようとしている。2. Description of the Related Art A "contactless IC tag" capable of recording and reading information in a contactless manner (generally, "contactless data carrier", "wireless IC tag", "contactless IC", "contactless I").
It may be expressed as “C label”, “RFID tag”, or the like. ) Has come to be widely used for information management of goods and merchandise, logistics management, and the like. Even in the field of packages such as foods, non-contact IC tags are being attached to be used for distribution, quality control, expiration date management and the like.

【０００３】包装材料における非接触ＩＣタグの形態に
ついて検討すると、基材や包装材料面にアンテナパター
ンを導電性インキで印刷し、これに、インターポーザ形
態のＩＣタグラベルを装着することが行われている。図
７は、従来法による非接触ＩＣタグの実施形態を示す図
である。図７（Ａ）は、ＩＣタグラベル２０をパッケー
ジ基材のアンテナパターン１１，１２の双方に接続する
ように貼着した平面状態、図７（Ｂ）は、アンテナパタ
ーン１１，１２からＩＣタグラベル２０を部分的に剥離
した状態を示し、図７（Ｃ）は、図７（Ａ）のＡ−Ａ線
において拡大した断面を示す図である。この実施形態の
場合、非接触ＩＣタグ１０は、パッケージ基材１ｂにア
ンテナパターンを直接印刷し、当該アンテナパターン１
１，１２にＩＣタグラベル２０を装着した構成となる。When the form of the non-contact IC tag in the packaging material is examined, it has been practiced to print the antenna pattern on the surface of the base material or the packaging material with conductive ink and attach the IC tag label in the form of an interposer thereto. . FIG. 7 is a diagram showing an embodiment of a non-contact IC tag according to a conventional method. 7 (A) is a plan view in which the IC tag label 20 is attached so as to be connected to both the antenna patterns 11 and 12 of the package base material, and FIG. 7 (B) shows the IC tag label 20 from the antenna patterns 11 and 12. FIG. 7C is a diagram showing a partially peeled state and an enlarged cross section taken along line AA of FIG. 7A. In the case of this embodiment, the non-contact IC tag 10 directly prints the antenna pattern on the package base 1b, and the antenna pattern 1 is printed.
The IC tag label 20 is attached to each of 1 and 12.

【０００４】なお、ＩＣタグラベル２０とは、シリコン
基板に集積回路またはメモリあるいはその双方を設けた
ＩＣチップ２１をアンテナパターン１１，１２に装着可
能にタックラベル化した状態のものを意味し、当該ラベ
ル自体にもＩＣチップ２１に接続した小型のアンテナ部
２２，２３有するものである（図７（Ｃ）参照）。イン
ターポーザ形態のラベルとしては、モトローラ社の「Ｂ
ｉＳｔａｔｉｘ」（商標）が主に使用され、ラベラを用
いて簡単に実装できる利点がある反面、ＩＣチップ単体
で実装する場合に比べてコスト高になる問題がある。The IC tag label 20 means a state in which an IC chip 21 having a silicon substrate provided with an integrated circuit and / or a memory has been tack-labeled so that it can be attached to the antenna patterns 11 and 12. It also has small antenna parts 22 and 23 connected to the IC chip 21 itself (see FIG. 7C). The interposer type label is “B of Motorola”.
iStatix "(trademark) is mainly used, and although it has an advantage that it can be easily mounted by using a labeler, it has a problem that the cost is higher than that when mounted by a single IC chip.

【０００５】[0005]

【発明が解決しようとする課題】従来、このようにタッ
クラベル状のインターポーザが使用されるているのは、
ＩＣチップ単体をウェブ材料に加工速度に連動して効率
的に装着する技術が無かったことに起因すると考えられ
る。一方、ガラス等の枚用状の媒体にＩＣチップを実装
する技術は、電子部品基盤等に見られるように古くから
確立している。これらの技術では、ＩＣチップをロボッ
トアーム、真空吸引等により実装するものであるが、Ｉ
Ｃチップの微小化に伴い機械的操作が困難になってきて
いる。ところで、近年、特開平9-120943号公報、特表平
9-506742号公報、または米国特許 5,284,186号、 5,78
3,856号、 5,904,545号、 6,274,508号、 6,281,038号
に見られるように流体を使用して硬質や軟質基材に微小
な半導体等を実装する技術（ＦＳＡ＝Fluidic Self Ass
embly ) が提案されている。Conventionally, the tack label type interposer is used as described above.
This is probably because there was no technology for efficiently mounting the IC chip alone on the web material in association with the processing speed. On the other hand, a technique for mounting an IC chip on a single medium such as glass has been established for a long time as seen in electronic component boards and the like. In these techniques, an IC chip is mounted by a robot arm, vacuum suction, etc.
With the miniaturization of the C-chip, mechanical operation has become difficult. By the way, in recent years, Japanese Patent Laid-Open No. 9-120943
9-506742, or U.S. Patents 5,284,186, 5,78
A technology for mounting microscopic semiconductors on a hard or soft substrate using a fluid as seen in Nos. 3,856, 5,904,545, 6,274,508 and 6,281,038 (FSA = Fluidic Self Ass
embly) is proposed.

【０００６】本発明は、包装体へのＩＣタグラベルの実
装を従来のように、非接触ＩＣタグラベルの貼着による
のではなく、包装材料の製造工程において、特にＦＳＡ
技術を用いて軟質ウェブ材料に直接ＩＣチップを実装
し、さらにアンテナパターンを印刷して非接触ＩＣタグ
付き包装体製造の効率化と製造コスト低減を図ろうとす
るものである。According to the present invention, the mounting of the IC tag label on the package is not performed by pasting the non-contact IC tag label as in the conventional case, but particularly in the manufacturing process of the packaging material, especially in the FSA.
By using the technology, an IC chip is directly mounted on a flexible web material, and an antenna pattern is printed to improve efficiency in manufacturing a package with a non-contact IC tag and reduce manufacturing cost.

【０００７】[0007]

【課題を解決するための手段】上記課題を解決するため
の本発明の要旨の第１は、ウェブ材料に対してＩＣタグ
用ＩＣチップを実装し、アンテナパターンを形成する方
法であって、（１）走行するウェブ材料に間隔を置いて
ＩＣチップの外形、深さに相当する凹孔を形成する工程
と、（２）当該ウェブ材料を、前記ＩＣチップの外形、
深さに相応する形状を有するＩＣチップを分散した流体
中を通過させて当該凹孔内に嵌合した状態で各１個のＩ
Ｃチップを残す工程と、（３）前記凹孔内に嵌合したＩ
Ｃチップのパッドに接続するようにアンテナパターンを
印刷する工程と、からなることを特徴とするウェブに実
装されたＩＣチップへのアンテナパターン形成方法、に
ある。かかる形成方法であるため、効率良くＩＣチップ
を実装しアンテナパターンを位置合わせして印刷するこ
とができる。The first of the gist of the present invention for solving the above problems is a method of forming an antenna pattern by mounting an IC chip for an IC tag on a web material. 1) a step of forming recessed holes corresponding to the outer shape and depth of the IC chip at intervals in the running web material; and (2) using the web material, the outer shape of the IC chip,
An IC chip having a shape corresponding to the depth is passed through a dispersed fluid to be fitted in the concave hole, and each one I
Step of leaving C chip, and (3) I fitted in the concave hole
A method of forming an antenna pattern on an IC chip mounted on a web, which comprises a step of printing an antenna pattern so as to be connected to a pad of a C chip. With such a forming method, the IC chip can be mounted efficiently, and the antenna pattern can be aligned and printed.

【０００８】上記課題を解決するための本発明の要旨の
第２は、ウェブ材料に対してＩＣタグ用ＩＣチップを実
装し、アンテナパターンを形成する方法であって、
（１）走行するウェブ材料に間隔を置いてＩＣチップの
外形、深さに相当する凹孔を形成する工程と、（２）当
該ウェブ材料を、前記ＩＣチップの外形、深さに相応す
る形状を有するＩＣチップを分散した流体中を通過させ
て当該凹孔内に嵌合した状態で各１個のＩＣチップを残
す工程と、（３）前記凹孔内に嵌合したＩＣチップのパ
ッドに接続するようにアンテナパターンを印刷する工程
と、（４）ＩＣチップが嵌合し、アンテナパターンを印
刷したウェブ材料の凹孔部を含む全面にフィルムを被覆
する工程と、からなることを特徴とするウェブに実装さ
れたＩＣチップへのアンテナパターン形成方法、にあ
る。かかる形成方法であるため、効率良くＩＣチップを
実装しアンテナパターンを位置合わせして印刷し、かつ
チップの脱落を防止できる。A second aspect of the present invention for solving the above problems is a method of forming an antenna pattern by mounting an IC chip for an IC tag on a web material.
(1) A step of forming a concave hole corresponding to the outer shape and depth of the IC chip at intervals in the running web material, and (2) forming the web material into a shape corresponding to the outer shape and depth of the IC chip. A step of passing an IC chip having the above in a dispersed fluid to leave one IC chip in a state of being fitted in the concave hole; and (3) a pad of the IC chip fitted in the concave hole. A step of printing an antenna pattern so as to be connected, and (4) a step of covering the entire surface of the web material on which the IC chip is fitted and including the concave pattern of the web material on which the antenna pattern is printed with a film. A method of forming an antenna pattern on an IC chip mounted on a web. With such a forming method, the IC chip can be efficiently mounted, the antenna pattern can be aligned and printed, and the chip can be prevented from falling off.

【０００９】上記課題を解決するための本発明の要旨の
第３は、ウェブ材料に対してＩＣタグ用ＩＣチップを実
装し、アンテナパターンを製造する方法であって、
（１）走行するウェブ材料に間隔を置いてＩＣチップの
外形、深さに相当する凹孔を形成する工程と、（２）当
該ウェブ材料の凹孔内に、前記外形、深さに相応する形
状を有するＩＣチップを嵌合した状態で各１個残す工程
と、（３）前記凹孔内に嵌合したＩＣチップのパッドに
接続するようにアンテナパターンを印刷する工程と、か
らなることを特徴とするウェブに実装されたＩＣチップ
へのアンテナパターン形成方法、にある。かかる形成方
法であるため、凹孔内に嵌合したＩＣチップにアンテナ
パターンを位置合わせして印刷し、その後の脱落を防止
できる。A third aspect of the present invention for solving the above problems is a method of manufacturing an antenna pattern by mounting an IC chip for an IC tag on a web material.
(1) A step of forming a concave hole corresponding to the outer shape and depth of the IC chip at intervals in the running web material, and (2) corresponding to the outer shape and depth in the concave hole of the web material. A step of leaving one IC chip having a shape in a fitted state, and (3) a step of printing an antenna pattern so as to connect to the pad of the IC chip fitted in the recessed hole. A method of forming an antenna pattern on an IC chip mounted on a web, which is a feature of the present invention. With such a forming method, it is possible to align and print the antenna pattern on the IC chip fitted in the recessed hole, and prevent the subsequent dropping.

【００１０】上記課題を解決するための本発明の要旨の
第４は、ウェブ材料に対してＩＣタグ用ＩＣチップを実
装し、アンテナパターンを製造する方法であって、
（１）走行するウェブ材料に間隔を置いてＩＣチップの
外形、深さに相当する凹孔を形成する工程と、（２）当
該ウェブ材料の凹孔内に、前記外形、深さに相応する形
状を有するＩＣチップを嵌合した状態で各１個残す工程
と、（３）前記凹孔内に嵌合したＩＣチップのパッドに
接続するようにアンテナパターンを印刷する工程と、
（４）ＩＣチップが嵌合し、アンテナパターンを印刷し
たウェブ材料の凹孔部を含む全面にフィルムを被覆する
工程と、からなることを特徴とするウェブに実装された
ＩＣチップへのアンテナパターン形成方法、にある。か
かる形成方法であるため、凹孔内に嵌合したＩＣチップ
にアンテナパターンを位置合わせして印刷し、かつチッ
プの脱落を防止できる。A fourth aspect of the present invention for solving the above problems is a method for manufacturing an antenna pattern by mounting an IC chip for an IC tag on a web material.
(1) A step of forming a concave hole corresponding to the outer shape and depth of the IC chip at intervals in the running web material, and (2) corresponding to the outer shape and depth in the concave hole of the web material. A step of leaving one IC chip having a shape in a fitted state, and (3) a step of printing an antenna pattern so as to be connected to a pad of the IC chip fitted in the concave hole,
(4) An antenna pattern for an IC chip mounted on a web, which comprises a step of coating a film on the entire surface of the web material on which the IC chip is fitted and printed with the antenna pattern, including the concave holes. Forming method. With this formation method, the antenna pattern can be aligned and printed on the IC chip fitted in the recessed hole, and the chip can be prevented from falling off.

【００１１】上記課題を解決するための本発明の要旨の
第５は、非接触ＩＣタグ機能を有するＩＣタグ付き包装
体であって、ウェブ材料にＩＣチップの外形、深さに相
当する凹孔が形成され、当該凹孔内にＩＣチップが嵌合
した状態で、当該ＩＣチップのパッドに接続するよう
に、アンテナパターンが印刷され、さらに当該ＩＣチッ
プ、アンテナパターン上にシーラントフィルムが被覆さ
れていることを特徴とするＩＣタグ付き包装体、にあ
る。かかるＩＣタグ付き包装体であるため、低コストで
量産性あるＩＣタグ付き包装体となる。A fifth aspect of the present invention for solving the above-mentioned problems is a package with an IC tag having a non-contact IC tag function, in which a web material has concave holes corresponding to the outer shape and depth of the IC chip. Is formed, the antenna pattern is printed so as to be connected to the pad of the IC chip in a state where the IC chip is fitted in the concave hole, and the sealant film is further coated on the IC chip and the antenna pattern. The package with an IC tag is characterized in that Since such a package with an IC tag is provided, the package with an IC tag can be manufactured at low cost and can be mass-produced.

【００１２】上記において、アンテナパターンを、パッ
チアンテナ、平面コイル状アンテナ、ダイポール型アン
テナのいずれか、とすることができ、アンテナパターン
をラバースタンプ法で印刷することもできる。In the above, the antenna pattern may be any one of a patch antenna, a plane coil antenna and a dipole antenna, and the antenna pattern may be printed by a rubber stamp method.

【００１３】[0013]

【発明の実施の形態】非接触ＩＣタグ付き包装体は、食
品等の内容物充填後にＩＣタグを貼着する手間の省略
と、流通過程における剥落を防止する観点から、軟包装
材料やカートンの場合は、積層するフィルム間にＩＣタ
グをあらかじめ保持した構成が有利となる。したがっ
て、非接触ＩＣタグは、ウェブ材料にアンテナパターン
を印刷し、当該アンテナパターンにＩＣチップを装着
し、その後、接着剤を介してまたは介さずシーラントフ
ィルムを積層する形態が有利である。本発明は従来のよ
うに、アンテナパターンにＩＣタグラベルを実装するも
のではなく、ウェブ材料に凹孔を設けてＩＣチップを充
填し、当該充填したＩＣチップのパッド（またはバン
プ）に接続するようにアンテナパターンを印刷する。こ
れにより非接触ＩＣタグの機能を持たせるものである。BEST MODE FOR CARRYING OUT THE INVENTION A package with a non-contact IC tag is used for a flexible packaging material or a carton from the viewpoint of omitting the time and effort of sticking the IC tag after filling the contents such as foods and preventing the package from falling off during the distribution process. In this case, a configuration in which an IC tag is held in advance between the laminated films is advantageous. Therefore, it is advantageous that the non-contact IC tag has a form in which an antenna pattern is printed on a web material, an IC chip is attached to the antenna pattern, and then a sealant film is laminated with or without an adhesive. The present invention does not mount an IC tag label on an antenna pattern as in the prior art, but a concave hole is provided in a web material to fill an IC chip, and the pad (or bump) of the filled IC chip is connected. Print the antenna pattern. With this, the function of the non-contact IC tag is provided.

【００１４】以下、まず本発明のＩＣタグ付き包装体に
ついて図面を参照し説明する。図１は、本発明のＩＣタ
グ付き包装体の例を示す図である。図１（Ａ）は、ＩＣ
タグ付き包装体１の平面図であって、図１（Ｂ）は、図
１（Ａ）のＡ−Ａ線において、包装体上側基材のＩＣチ
ップ部を示す断面図である。厚み方向の倍率は横方向よ
りも拡大して図示している。図１のように、ＩＣタグ付
き包装体１は、凹孔４がウェブ材料１ｂに形成され当該
凹孔内にＩＣチップ２が嵌合している。アンテナパター
ン１１，１２は導電性インキによりＩＣチップのパッド
に接続するように印刷されている。図１において包装体
１は、製袋して内容物を充填した後の状態が示されてい
るが、本発明のＩＣタグ付き包装体は製袋や製函後の状
態のみを意味せず、積層フィルムや積層シートであって
製袋や製函前の巻き取り状等の形態のものをも包含する
ものとする。First, the package with an IC tag of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing an example of a package with an IC tag of the present invention. Figure 1 (A) shows the IC
FIG. 1B is a plan view of the wrapping body with tag 1, and FIG. 1B is a cross-sectional view showing the IC chip portion of the base material on the upper side of the wrapping body, taken along the line AA in FIG. The magnification in the thickness direction is shown in a larger scale than in the lateral direction. As shown in FIG. 1, in the package 1 with an IC tag, the concave hole 4 is formed in the web material 1b, and the IC chip 2 is fitted in the concave hole. The antenna patterns 11 and 12 are printed with conductive ink so as to be connected to the pads of the IC chip. In FIG. 1, the package 1 is shown in a state after bag making and filling the contents, but the package with an IC tag of the present invention does not mean only the state after bag making or box making, It also includes a laminated film or a laminated sheet which is in the form of a bag or a roll before box making.

【００１５】図１（Ｂ）のように、アンテナパターン１
１，１２はＩＣチップのパッド２ｐ，２ｑに接続するよ
うに印刷するので、ＩＣチップ２を凹孔４内に充填後に
印刷することになる。この際、ＩＣチップが凹孔内に固
定された状態にあるのが好ましく、比較的低温で溶融す
る熱溶融性樹脂層６を設けて固定する。熱溶融性樹脂層
６は、ウェブ材料１ｂの全面に塗工されているものであ
っても良いが、少なくとも凹孔４の底面部分に塗工され
ていることが必要になる。したがって、熱溶融性樹脂層
６はＩＣチップの底部２ｂに事前に塗工されたものであ
ってもよい。当該ＩＣチップ２とアンテナパターン１
１，１２とにより非接触ＩＣタグ１０を構成している。As shown in FIG. 1B, the antenna pattern 1
Since 1 and 12 are printed so as to be connected to the pads 2p and 2q of the IC chip, printing is performed after the IC chip 2 is filled in the concave hole 4. At this time, it is preferable that the IC chip is fixed in the concave hole, and the thermomelting resin layer 6 that melts at a relatively low temperature is provided and fixed. The heat-fusible resin layer 6 may be applied to the entire surface of the web material 1b, but it is necessary that it is applied to at least the bottom surface portion of the concave hole 4. Therefore, the heat-meltable resin layer 6 may be applied in advance to the bottom portion 2b of the IC chip. The IC chip 2 and the antenna pattern 1
The non-contact IC tag 10 is composed of 1 and 12.

【００１６】アンテナパターン１１，１２と共に、包装
体に必要な他の絵柄印刷５をすることができる。これは
アンテナパターンと同時の工程であっても良く、別工程
の異なる印刷方式であっても良い。ＩＣチップとアンテ
ナパターン面には、ＥＣ層または接着剤層等を介してシ
ーラントフィルム３が積層されている。With the antenna patterns 11 and 12, it is possible to perform other pattern printing 5 required for the package. This may be performed in the same step as the antenna pattern, or may be a different printing method in another step. A sealant film 3 is laminated on the IC chip and the antenna pattern surface via an EC layer or an adhesive layer.

【００１７】図１（Ｂ）の断面図のように、本発明のＩ
Ｃタグ付き包装体１では、凹孔４がＩＣチップ２と略同
一サイズ、形状で同じ厚みの深さに形成されていて（Ｉ
Ｃチップ２と凹孔４が相補形状にされている趣旨）、Ｉ
Ｃチップ２は当該凹孔４内に嵌合するようにして装着さ
れている。このＩＣチップは、後に詳述するように流体
中において凹孔４内にセルフアライン（自己整列）させ
ることで充填できるが、他の方式により嵌合させるもの
であってもよい。ＩＣチップ２は実際には、図１（Ｂ）
断面図よりも平面的のものであるが、表面２ｕと底部２
ｂとでは面積が異なるので、表裏が逆転して凹孔４内に
嵌合しない特徴がある。ＩＣチップ２のパッド２ｐ，２
ｑは通常状態では、表面側に現われるようになる。As shown in the sectional view of FIG. 1B, I of the present invention is used.
In the C-tagged package 1, the concave hole 4 is formed to have substantially the same size and shape as the IC chip 2 and a depth of the same thickness (I
C chip 2 and concave hole 4 have a complementary shape), I
The C chip 2 is mounted so as to fit in the recessed hole 4. This IC chip can be filled by self-aligning (self-aligning) in the concave hole 4 in a fluid as described later, but it may be fitted by another method. The IC chip 2 is actually shown in FIG.
Although it is more planar than the sectional view, the surface 2u and the bottom 2 are
Since the area is different from b, the front and back are reversed and there is a feature that they do not fit in the concave hole 4. Pads 2p and 2 of the IC chip 2
In the normal state, q comes to appear on the surface side.

【００１８】また、ＩＣチップの表面を矩形状にし、表
裏が正しければ左右の向きが入れ替わっても特性に影響
ないようにされている。表面が正方形状であるとパッド
間を結ぶ方向とそれに直交する方向の制御ができなくな
るからである。もっとも、ＩＣチップの左右の形状を異
なるものとし、凹孔の左右の形状も異なるようにし、Ｉ
Ｃチップの向きと凹孔が一致した場合にのみ嵌合するよ
うにすれば（一方位性とする意味）、表面が正方形状で
あっても表裏および上下左右の位置規制も可能となる。Further, the surface of the IC chip has a rectangular shape so that if the front and back are correct, the characteristics will not be affected even if the left and right directions are switched. This is because if the surface has a square shape, it becomes impossible to control the direction connecting the pads and the direction orthogonal thereto. However, the left and right shapes of the IC chip are made different, and the left and right shapes of the concave holes are made different.
If the C chip is fitted only when the direction of the C chip matches the concave hole (meaning one-sidedness), even if the surface has a square shape, the front and back positions and the vertical and horizontal positions can be regulated.

【００１９】ＩＣチップはシリコン基盤に半導体を形成
後、ダイシングして切断する場合は、矩形状の立方体に
形成され、形状のみで表裏を区別することはできない。
しかし、微小なＩＣチップを低コストで製造する場合
は、ダイシング溝面積を減少させ収率を高める必要から
分離は、基盤の背面側からのエッチングにより行う。そ
のため、パッド部分が有る表面側に対し背面側は必然的
に狭い面積になり、表面と背面間の面は傾斜面になるの
が通常である。チップの表面形状は通常矩形状であるの
で、ＩＣチップの全体形状は断面台形状であり、特に四
角錐の截頭ピラミッド形状となるのが一般的である。た
だし、目的と用途によって、直方体や立方体、円形や円
柱状、その他の形状とされる場合もある。When an IC chip is formed by forming a semiconductor on a silicon substrate and then cutting it by dicing, it is formed into a rectangular cube, and it is not possible to distinguish between the front and back by the shape alone.
However, in the case of manufacturing a minute IC chip at low cost, it is necessary to reduce the dicing groove area and increase the yield, so the separation is performed by etching from the back side of the substrate. Therefore, the back side inevitably has a smaller area than the front side where the pad portion is, and the surface between the front side and the back side is usually an inclined surface. Since the surface shape of the chip is usually rectangular, the entire shape of the IC chip is trapezoidal in cross section, and in particular, it is generally a truncated pyramid of quadrangular pyramids. However, depending on the purpose and application, it may be a rectangular parallelepiped, a cube, a circle, a column, or other shapes.

【００２０】ＩＣチップが四角錐の截頭ピラミッド形状
である場合、凹孔４とＩＣチップ２の外形形状は完全に
同一であるよりは、凹孔の斜面とＩＣチップの斜面の間
には、２〜２０°、好ましくは３〜５°程度範囲内の角
度αがあるのが好ましい。この角度によりＩＣチップの
円滑な嵌合が促進されるからである。また、微小な間隙
があってもアンテナパターンの印刷の際は導電性インキ
が充填されるので導通不良となるようなことはない。Ｉ
Ｃチップ２の上面側は、シーラントフィルム３等により
被覆されているので、凹孔からＩＣチップが脱落を防止
できる。シーラントフィルム３によりウェブ材料の強度
が補強されると共に、ヒートシール性や耐湿性の付与、
あるいは内容物への印刷インキの付着等も防止できる。When the IC chip has a truncated pyramid shape of a quadrangular pyramid, the outer shapes of the recessed hole 4 and the IC chip 2 are not completely the same, but between the slope of the recessed hole and the slope of the IC chip, It is preferable that there is an angle α within the range of 2 to 20 °, preferably about 3 to 5 °. This angle facilitates the smooth fitting of the IC chip. In addition, even if there is a minute gap, conductive ink is filled when the antenna pattern is printed, so that conduction failure does not occur. I
Since the upper surface side of the C chip 2 is covered with the sealant film 3 and the like, it is possible to prevent the IC chip from coming off from the concave hole. The sealant film 3 reinforces the strength of the web material and imparts heat sealability and moisture resistance,
Alternatively, the adhesion of printing ink to the contents can be prevented.

【００２１】アンテナパターンとＩＣチップのパッド
（またはバンプ）間は直接的に接続するのが原則である
が、多少位置ずれがあっても「オーミックコンタクト」
（オーム性接合）により非接触ＩＣタグとして動作可能
となる。ただし、アンテナパターンの接続端子１１ｃ，
１２ｃに対し、ＩＣチップのパッドが一方の接続端子側
に極端にずれる場合は、パッド間が短絡した状態になり
通信回路を形成できない。これはＩＣチップのパッド２
ｐ，２ｑに対するアンテナパターン１１，１２の印刷位
置精度の問題に帰結することになる。In principle, the antenna pattern and the pads (or bumps) of the IC chip are directly connected, but even if there is some misalignment, "ohmic contact"
(Ohmic bonding) enables operation as a non-contact IC tag. However, the connection terminal 11c of the antenna pattern,
In contrast to 12c, when the pads of the IC chip are extremely displaced toward one of the connection terminals, the pads are short-circuited and the communication circuit cannot be formed. This is the pad 2 of the IC chip
This results in the problem of the printing position accuracy of the antenna patterns 11 and 12 for p and 2q.

【００２２】図２は、アンテナパターンの接続端子とＩ
Ｃチップの相対位置を示す図である。図２（Ａ）は正常
の場合、図２（Ｂ）は、アンテナパターン１１，１２の
位置がずれた状態を示している。図２（Ｂ）では、ＩＣ
チップの双方のパッド２ｐ，２ｑが、アンテナパターン
１２側に接近するので短絡が生じることになる。結論的
には、ＩＣチップのパッド２ｐ，２ｑ間距離Ｌの１／２
以上に、アンテナパターンの接続端子１１ｃ，１２ｃの
中心位置との距離が、離れた場合は通信回路を形成し難
くなることになる。ちなみに表面が長方形状のＩＣチッ
プの一辺は、１０μｍ〜５ｍｍ程度であるから、図２の
ようなアンテナパターンの場合は、それぞれ５μｍ〜
２．５ｍｍ程度の位置精度で形成する必要がある。ＩＣ
チップが微小になるにしたがい高い開孔位置精度が求め
られることになる。なお、ＩＣチップの厚みは５μｍ〜
１０００μｍ程度である。FIG. 2 shows the connection terminals of the antenna pattern and the I
It is a figure which shows the relative position of C chip. 2A shows a normal state, and FIG. 2B shows a state where the positions of the antenna patterns 11 and 12 are deviated. In FIG. 2B, the IC
Since both pads 2p and 2q of the chip approach the antenna pattern 12 side, a short circuit will occur. In conclusion, 1/2 of the distance L between the pads 2p and 2q of the IC chip
As described above, if the distance from the center position of the connection terminals 11c and 12c of the antenna pattern is large, it becomes difficult to form a communication circuit. By the way, since one side of the IC chip having a rectangular surface is about 10 μm to 5 mm, the antenna pattern as shown in FIG.
It is necessary to form it with a positional accuracy of about 2.5 mm. IC
As the tip becomes finer, higher hole position accuracy is required. The thickness of the IC chip is 5 μm
It is about 1000 μm.

【００２３】ＩＣチップ２に対してアンテナパターン１
１，１２の位置がずれても、短絡し難くするためには、
ＩＣチップのパッド２ｐ，２ｑ間を結ぶ線に対して直交
する長い辺を有する接続端子１１ｃ，１２ｃを設けるの
が有利である。すなわち、図２（Ａ）において、矢印Ｙ
方向に接続端子１１ｃ，１２ｃの対向する辺が長けれ
ば、凹孔の位置ずれに対する許容を大きくすることがで
きる。一般的には、ウェブの走行方向の位置ずれに対し
て、ウェブの幅方向の位置ずれは小さく制御できるの
で、矢印Ｙの方向をウェブの走行方向としてアンテナパ
ターンを印刷するのが有利と考えられる。ただし、位置
制御の容易な方向は、装置によってまちまちであって一
律なものではない。したがって、通常の電気部品の場合
よりも拡大または延長した方向を有する接続端子部であ
れば、凹孔の位置ずれに対する許容を大きくできる。Antenna pattern 1 for IC chip 2
Even if the positions of 1 and 12 are misaligned,
It is advantageous to provide the connection terminals 11c, 12c having long sides orthogonal to the line connecting the pads 2p, 2q of the IC chip. That is, in FIG. 2A, the arrow Y
If the opposing sides of the connection terminals 11c and 12c are long in the direction, it is possible to increase the allowance for the positional deviation of the concave hole. Generally, since the positional deviation in the width direction of the web can be controlled to be smaller than the positional deviation in the running direction of the web, it is considered advantageous to print the antenna pattern with the direction of arrow Y as the running direction of the web. . However, the direction of easy position control varies depending on the device and is not uniform. Therefore, if the connection terminal portion has a direction that is expanded or extended as compared with the case of a normal electric component, it is possible to increase the tolerance for the positional deviation of the recessed hole.

【００２４】アンテナパターンは、図１、図２図示のよ
うに静電結合型パターンに限らず、図３のようにコイル
状（平面捲線状）の電磁誘導型パターンであってもよ
い。静電結合型の場合は、図１、図２のように２片に分
離したパッチアンテナ型に印刷し１２５ｋＨｚの通信に
使用する。電磁誘導型の場合は、図３（Ａ）の平面コイ
ル状パターン（１３．５６ＭＨｚ）や図３（Ｂ）のよう
なダイポール型（ＵＨＦ−ＳＨＦ帯）パターンとなる。
図３（Ａ）の場合、両接続端子１３ｃ，１３ｃ間は、Ｉ
Ｃチップが搭載できるように細線にするのが通常であ
る。The antenna pattern is not limited to the electrostatic coupling type pattern as shown in FIGS. 1 and 2, but may be a coiled (planar winding) electromagnetic induction type pattern as shown in FIG. In the case of the electrostatic coupling type, it is printed on a patch antenna type which is separated into two pieces as shown in FIGS. 1 and 2 and used for communication at 125 kHz. In the case of the electromagnetic induction type, the plane coil pattern (13.56 MHz) of FIG. 3A and the dipole type (UHF-SHF band) pattern as shown in FIG. 3B are used.
In the case of FIG. 3 (A), between both connection terminals 13c, 13c is I
Usually, the wire is thin so that a C chip can be mounted.

【００２５】パッチアンテナの場合、図１、図２のよう
にＩＣチップ２を装着したパッド部分に２片のアンテナ
パターン接続端子部１１ｃ，１２ｃを設ける。コイル状
パターンの場合もＩＣチップの接続端子が形成される
が、図３（Ａ）のようにパターン１３の両端部を接近し
た位置に形成すれば、当該部分を接続端子１３ｃとして
ＩＣチップ２に位置合わせして印刷することができる。
図３（Ｂ）のダイポール型パターン１４の場合も同様で
あって、ＩＣチップ２の部分に接続端子１４ｃを設ける
ことができる。図３（Ｃ）のように、コイルが１３ｔの
部分で折り返すような平面コイルであっても良い。この
場合、接続端子１３ｃはコイルの内側にすることもでき
る。図３（Ａ），（Ｃ）のいずれの場合も、従来のよう
に裏面に回路を設け、かしめ金具で接続したりジャンピ
ング回路を設ける必要がない。いずれの場合もＩＣチッ
プ２のパッドに対して拡張したまたは延長した接続端子
形状とすることにより、印刷位置ずれに対する許容を大
きくすることができる。In the case of the patch antenna, as shown in FIGS. 1 and 2, two pieces of antenna pattern connection terminal portions 11c and 12c are provided on the pad portion on which the IC chip 2 is mounted. In the case of the coiled pattern, the connection terminals of the IC chip are also formed. However, if both ends of the pattern 13 are formed close to each other as shown in FIG. It can be aligned and printed.
The same applies to the case of the dipole pattern 14 of FIG. 3B, and the connection terminal 14c can be provided in the IC chip 2 portion. As shown in FIG. 3 (C), a flat coil in which the coil is folded back at the 13t portion may be used. In this case, the connection terminal 13c can be inside the coil. In both cases of FIGS. 3A and 3C, it is not necessary to provide a circuit on the back surface and connect with caulking metal fittings or to provide a jumping circuit as in the conventional case. In either case, by forming the connection terminal shape expanded or extended with respect to the pad of the IC chip 2, it is possible to increase the tolerance for the print position deviation.

【００２６】次に、本発明のウェブ材料へのＩＣチップ
実装方法について説明する。図４は、ウェブ材料へのＩ
Ｃチップ実装を行う製造ライン図である。パッケー等に
使用するウェブ材料１ｂを給紙部から供給し凹孔４を形
成し、当該凹孔内にＩＣチップ２を実装し、アンテナパ
ターンを印刷し、さらに、ＩＣチップ２とアンテナパタ
ーンを含むウェブ材料面にシーラントフィルム３を被覆
する一連の製造ラインを示している。ただし、本発明は
全ての工程を連続したラインで行うことを要件とするも
のではないので、例えば、ＩＣチップ充填とアンテナパ
ターン印刷を別工程で行うもの、アンテナパターン印刷
とその後のＥＣ工程を別工程で行うもの、であっても良
い。Next, a method of mounting the IC chip on the web material of the present invention will be described. FIG. 4 shows the I to web material.
It is a manufacturing line figure which carries out C chip mounting. A web material 1b used for a package or the like is supplied from a paper feeding portion to form a concave hole 4, an IC chip 2 is mounted in the concave hole, an antenna pattern is printed, and the IC chip 2 and the antenna pattern are included. 1 shows a series of production lines for coating a sealant film 3 on the web material side. However, since the present invention does not require that all steps are performed in a continuous line, for example, IC chip filling and antenna pattern printing are performed in separate steps, and antenna pattern printing and the subsequent EC step are performed separately. What is performed in a process may be used.

【００２７】図４において、エンボス工程では、図示し
ないエンボス機等によりウェブ材料１ｂへ凹孔４を形成
する。凹孔の形成とは、ウェブ材料に「くぼみ」状部分
を設けることであり、凹孔の深さは実質的に実装される
ＩＣチップの厚みや高さに相当し、開口形状はＩＣチッ
プが平面的なものであれば当該平面形状、角錐状または
截頭ピラミッド形状等であれば当該外形形状に合わせた
形状にする。通常使用のＩＣチップは厚みは５μｍ〜１
０００μｍ程度であって、表面形状は、一辺が１０μｍ
〜５ｍｍ角程度の截頭ピラミッド形状のものが多いが、
目的により多角錐形状としたり平面な矩形状、等とする
こともできる。凹孔の形成は、加熱可能な適宜な型具を
用いる熱エンボス、あるいは熱条件下における真空／圧
空成形、レーザー照射等により形成する。In FIG. 4, in the embossing step, the concave holes 4 are formed in the web material 1b by an embossing machine (not shown) or the like. The formation of the recessed hole is to provide a “dent” -shaped portion in the web material, the depth of the recessed hole substantially corresponds to the thickness and height of the IC chip to be mounted, and the opening shape is defined by the IC chip. If the shape is planar, the shape is a plane shape, and the shape is a pyramid shape or a truncated pyramid shape. Normally used IC chips have a thickness of 5 μm to 1
It is about 000 μm and the surface shape is 10 μm on each side.
There are many truncated pyramid shapes of ~ 5mm square,
Depending on the purpose, the shape may be a polygonal pyramid shape, a flat rectangular shape, or the like. The concave holes are formed by hot embossing using an appropriate mold that can be heated, vacuum / pressure forming under thermal conditions, laser irradiation, or the like.

【００２８】ＩＣチップ実装工程では、凹孔４内にＩＣ
チップ２を嵌合させて充填する。この工程には、流体を
使用するＩＣチップ実装方法（ＦＳＡ実装）が好適に用
いられＩＣチップ充填槽１５内で行われる。ＩＣチップ
２は上記の形状に均一に切断または立体形状化したもの
を、流体内に分散したスラリー状にして使用する。ＩＣ
チップをウェブ走行方向に平行な一定ライン上にのみ配
列して実装する場合は、ＩＣチップを分散した流体を液
中においてディスペンサー等から当該ライン上に流出す
るようにするのがよい。同一特性、形状のＩＣチップを
各凹孔内に１個づつ嵌合させることが原則となるが、複
数の特性、形状のＩＣチップを各目的の位置に、それぞ
れ充填させることもできる。後者の場合は、異なる特性
のＩＣチップ毎に共通の形状を保持させて、流体中にも
異なる特性、形状のＩＣチップを分散し、それぞれの形
状に合致する凹孔を基材に設け、ＩＣチップ形状と凹孔
形状が一致する場合に、当該凹孔内にＩＣチップが嵌合
するようにする。In the IC chip mounting process, the IC is placed in the concave hole 4.
The chip 2 is fitted and filled. An IC chip mounting method (FSA mounting) using a fluid is suitably used for this step, and is performed in the IC chip filling tank 15. The IC chip 2 is used by uniformly cutting or three-dimensionally forming the above-mentioned shape into a slurry dispersed in a fluid. IC
When the chips are arranged and mounted only on a certain line parallel to the web running direction, it is preferable that the fluid in which the IC chips are dispersed flows out from the dispenser or the like onto the line in the liquid. As a general rule, IC chips having the same characteristics and shapes are fitted into the respective recessed holes one by one, but it is also possible to fill a plurality of IC chips having the same characteristics and shapes at respective target positions. In the latter case, IC chips having different characteristics are held in a common shape, IC chips having different characteristics and shapes are dispersed in a fluid, and recessed holes matching the respective shapes are provided in the base material. When the chip shape and the concave hole shape match, the IC chip is fitted in the concave hole.

【００２９】用いられる流体は、水や有機溶剤が使用さ
れる。有機溶剤としては、エチルアルコールやメチルア
ルコール、アセトン、シリコンオイル等であってＩＣや
プラスチックフィルムに作用せず、かつ包装体に使用す
る場合は食品の変質や人体に悪影響を及ぼさないものに
限られることになる。包装体の場合、現実的には水やエ
チルアルコールが好ましく用いられることになる。分散
するＩＣチップの数は、基材に充填する密度により調整
する必要があるが、分散量を多くし過剰なＩＣチップ
は、ウェブ材料を振動させて落下させるようにすれば、
充填の効率を高めることができる。分散するＩＣチップ
の数は、目的とＩＣチップの大きさ等にも関係するが、
通常１０００〜１００００００個／リットル程度とす
る。包装材料に非接触ＩＣタグとして実装する場合は、
ウェブ材料の１ｍ2 に対して、通常１個以上〜１００個
以下の数量になる。The fluid used is water or an organic solvent. The organic solvent is ethyl alcohol, methyl alcohol, acetone, silicone oil, etc., which does not act on the IC or the plastic film, and when used as a package, is not limited to those that do not alter the quality of food or adversely affect the human body. It will be. In the case of a package, water or ethyl alcohol is actually preferably used. The number of IC chips to be dispersed needs to be adjusted depending on the density with which the base material is filled, but if the amount of dispersion is increased and excess IC chips are made to vibrate and drop the web material,
The efficiency of filling can be improved. The number of dispersed IC chips depends on the purpose and the size of the IC chips,
Usually, it is about 1000 to 1,000,000 pieces / liter. When mounting as a non-contact IC tag on the packaging material,
The number is usually 1 or more and 100 or less per 1 m 2 of the web material.

【００３０】ＩＣチップを分散した流体が、ＩＣチップ
が常時流体中に拡散し流動する状態でウェブ基材に当接
するためには、ポンプにより液流をつくり層流状態にし
て基材面に流すことが好ましい。前記のように、ピペッ
トやディスペンサー状の先端部から凹孔のラインに沿っ
て流すようにすることもできる。凹孔内に嵌合しないＩ
Ｃチップは、ウェブ表面に沿って液体を吸引するヘッド
を設けて充填槽内で除去することができる。In order for the fluid in which the IC chips are dispersed to come into contact with the web base material in a state in which the IC chips are always diffused and flowing in the fluid, a liquid flow is created by a pump to make it a laminar flow state and then flow to the base material surface. It is preferable. As described above, it is also possible to flow from the tip of a pipette or dispenser along the line of the concave hole. Do not fit in the recessed hole I
The C-tip can be removed in the filling tank by providing a head for sucking the liquid along the surface of the web.

【００３１】ウェブ材料が充填槽から引き出された直後
に凹孔以外の部分にもＩＣチップが付着し液体も残って
いる場合はこれらを除去する必要がある。このためには
ウェブ材料を傾斜して振動を与えるか、ドクターブレー
ド、ブラシ、スクレーパ等の機械的手段により不要なＩ
Ｃチップの落下、除去を促進させるが凹孔内に充填した
ＩＣチップまで取り去らないようにする。温風や空気流
により残余の液体の乾燥を促進することも好ましい。Immediately after the web material is drawn out from the filling tank, if the IC chip is attached to the portion other than the concave hole and the liquid remains, it is necessary to remove them. For this purpose, the web material is tilted to give vibrations, or unnecessary by mechanical means such as a doctor blade, a brush or a scraper.
Promote the dropping and removal of the C chip, but do not remove the IC chip filled in the recess. It is also preferable to accelerate the drying of the residual liquid with warm air or a stream of air.

【００３２】本発明では、上記のようにＦＳＡ技術を用
いて凹孔にＩＣチップを充填するのが効率良い充填方法
であるが、請求項３または請求項４記載の発明では、当
該方法に限定しない充填方法を採用できる。充填効率の
問題もあるが、ＩＣチップをロボットアーム、真空吸引
等によりピックアップし、所定の目標位置に実装する技
術は既に確立しており、それらの技術を採用することが
できる。In the present invention, the efficient filling method is to fill the IC holes in the recesses using the FSA technique as described above, but the invention according to claim 3 or 4 is limited to this method. It is possible to adopt a filling method that does not. Although there is a problem of filling efficiency, techniques for picking up an IC chip by a robot arm, vacuum suction, etc. and mounting it at a predetermined target position have already been established, and these techniques can be adopted.

【００３３】ＩＣチップを凹孔内に一時的に固定するた
めには、凹孔内の少なくとも底部部分またはＩＣチップ
の底面に塗工した熱溶融性樹脂層６（図１）を加熱して
溶融してから冷却し（室温に戻し）、ＩＣチップをウェ
ブ材料に固定する必要がある。その後のＥＣ工程やラミ
ネート工程での脱落を防止するためである。これには、
前記のように集積回路を形成したシリコン基盤の底面に
熱溶融性樹脂を塗工するものでも良く、ウェブ材料の少
なくとも凹孔内に部分的に塗工層を設けるものであって
も良い。凹孔４の形成と同時に樹脂層を設ける方法も可
能である。In order to temporarily fix the IC chip in the recess, the heat-meltable resin layer 6 (FIG. 1) applied to at least the bottom portion of the recess or the bottom surface of the IC chip is heated and melted. Then, it is necessary to cool (return to room temperature) and fix the IC chip to the web material. This is to prevent falling off in the subsequent EC process or laminating process. This includes
A heat-melting resin may be coated on the bottom surface of the silicon substrate on which the integrated circuit is formed as described above, or a coating layer may be partially provided in at least the concave holes of the web material. A method of providing the resin layer at the same time as forming the concave hole 4 is also possible.

【００３４】アンテナ印刷工程では、ＩＣチップ２の充
填後、ＩＣチップのパッドに接続するようにアンテナパ
ターン１１，１２の印刷を行う。印刷方式は要求される
アンテナ精度により異なるが、グラビア印刷やオフセッ
ト印刷、スクリーン印刷等が採用できる。精度の高い印
刷の場合はシルクスクリーン印刷や後述するラバースタ
ンプ法の印刷方式が好ましい。ウェブ材料１ｂが印刷機
１７の版胴１７１と圧胴１７２の間を通過してＩＣチッ
プ面にアンテナパターンが印刷される。導電性インキは
インキ付けローラ１７３から供給される。アンテナ印刷
はこのようにウェブを連続的に走行させる状態で行って
も良いし、一時的にウェブの走行を停止させて印刷し、
次いでウェブを送る間欠動作で印刷するものであっても
良い。アンテナパターン印刷と同時にまたは別工程で絵
柄印刷５（図１）をしても良いのは前記のとおりであ
る。In the antenna printing step, after the IC chip 2 is filled, the antenna patterns 11 and 12 are printed so as to be connected to the pads of the IC chip. The printing method depends on the required antenna accuracy, but gravure printing, offset printing, screen printing or the like can be adopted. In the case of highly accurate printing, silk screen printing or a rubber stamp printing method described later is preferable. The web material 1b passes between the plate cylinder 171 and the impression cylinder 172 of the printing machine 17, and the antenna pattern is printed on the IC chip surface. The conductive ink is supplied from the inking roller 173. The antenna printing may be performed in a state in which the web is continuously run in this way, or the web may be temporarily stopped to print.
Then, the web may be intermittently printed for printing. As described above, the pattern printing 5 (FIG. 1) may be performed simultaneously with the antenna pattern printing or in another step.

【００３５】本発明では、アンテナパターンの印刷をラ
バースタンプ法で行うのが、精度の高い印刷を可能とす
る。ラバースタンプ法はナノ構造を作る新技術として開
発された技術であって、ソフトリソグラフィーともいわ
れる。本発明で印刷するアンテナパターンは、最も細い
線でも数μｍの単位であり、パッドとの位置合わせでも
２〜３μｍの許容が認められるので、ナノメートル単位
の精度が必要とされるものではないが、高精度を達成す
るため当該印刷方法に準じた方法を採用する。In the present invention, the printing of the antenna pattern is performed by the rubber stamp method, which enables highly accurate printing. The rubber stamp method is a technology developed as a new technology for making nanostructures and is also called soft lithography. The antenna pattern printed in the present invention has a unit of several μm even for the thinnest line, and a tolerance of 2 to 3 μm is recognized in the alignment with the pad, so that accuracy of the nanometer unit is not required. In order to achieve high accuracy, adopt a method similar to the printing method.

【００３６】以下に当該ラバースタンプ技術による印刷
方法について説明する。図５は、ラバースタンプ法の工
程を示す図である。ラバースタンプ法の場合は、まず鋳
型またはスタンプを用意する。通常、ナノメータの精度
を達成する場合は、フォトリソグラフィーか電子ビーム
リソグラフィーを使って、型材料であるシリコン基板表
面にフォトレジストパターンを作成するが、アンテナパ
ターンの場合の型材料は、４２合金（ニッケル４２％：
鉄合金）や銅合金、あるいは金属アルミであってよい。
これに対し、フォトマスクを使用するフォトエッチング
法を採用して型を作る。エッチング後には金属材料の凹
凸型７が形成される（図５（Ａ））。次に液状のＰＤＭ
Ｓ（ポリジメチルシロキサン）材料８を型７表面の凹凸
上に注ぎ込み、低温加熱して硬化させゴム状に固める
（図５（Ｂ））。ＰＤＭＳを型から分離すれば、元のパ
ターンに合ったＰＤＭＳスタンプ９が完成する（図５
（Ｃ））。A printing method using the rubber stamp technique will be described below. FIG. 5 is a diagram showing a process of the rubber stamp method. In the case of the rubber stamp method, first a mold or stamp is prepared. Usually, in order to achieve nanometer accuracy, a photoresist pattern is formed on the surface of a silicon substrate, which is a mold material, by using photolithography or electron beam lithography. However, in the case of an antenna pattern, the mold material is 42 alloy (nickel alloy). 42%:
It may be an iron alloy), a copper alloy, or metallic aluminum.
On the other hand, a mold is made by using a photo etching method using a photo mask. After the etching, the concave-convex mold 7 made of a metal material is formed (FIG. 5A). Next, liquid PDM
The S (polydimethylsiloxane) material 8 is poured onto the irregularities on the surface of the mold 7 and heated at a low temperature to cure and harden into rubber (FIG. 5 (B)). When the PDMS is separated from the mold, the PDMS stamp 9 matching the original pattern is completed (Fig. 5).
(C)).

【００３７】このＰＤＭＳスタンプ９をゴム凸版として
導電性インキを用いてウェブ材料に対する印刷を行う。
ＰＤＭＳスタンプ９は平板状でもシリンダに巻き付けた
輪転印刷機でも使用できる。導電性インキには、導電性
カーボンや黒鉛、銀粉やアルミ粉、あるいはこれらの混
合体をビヒクルに分散したインキを使用する。あるいは
また、インキコストは割高となるが、酸化錫、酸化イン
ジウム、ドープ酸化インジウム（ＩＴＯ）、酸化チタン
粉末、７，７，８，８−テトラシアノキノジメタン錯体
（ＴＣＮＱ錯体）を溶解したもの等を使用した透明導電
性インキであってもよい。アンテナパターンの表面抵抗
は、ＪＩＳＫ６９１１による測定値で、１０6 Ω/ □以
下が適用でき、好ましくは１０4 Ω／□以下で、交信の
信頼性を高められる。The PDMS stamp 9 is used as a rubber relief plate to print on a web material using a conductive ink.
The PDMS stamp 9 can be used in a flat plate form or a rotary printing machine wound around a cylinder. As the conductive ink, ink in which conductive carbon, graphite, silver powder, aluminum powder, or a mixture thereof is dispersed in a vehicle is used. Alternatively, although the ink cost is relatively high, tin oxide, indium oxide, doped indium oxide (ITO), titanium oxide powder, and a solution of 7,7,8,8-tetracyanoquinodimethane complex (TCNQ complex) are dissolved. It may be a transparent conductive ink using the above. The surface resistance of the antenna pattern is a value measured by JISK6911 of 10 6 Ω / □ or less, and preferably 10 4 Ω / □ or less, and the reliability of communication can be improved.

【００３８】ＥＣ工程では、ウェブ材料にシーラントフ
ィルムを積層して被覆する。凹孔内に充填されたＩＣチ
ップはウェブ基材と物理的に完全に接合した状態にはな
いので、フィルムが揺れたり振動したり、下向きになれ
ば凹孔内から脱落することが生じ得る。そこで、ＩＣチ
ップを充填後、凹孔およびウェブ材料の他の部分を含む
全面をシーラントフィルムを被覆する。図４では、イク
ストルージョンコーター（ＥＣ）機の場合を例示してい
る。ウェブ材料１ｂに溶融したポリエチレン（シーラン
トフィルム）３等を被覆する場合は、ＥＣ機１８のゴム
ロールであるニップロール１８１側からウェブ材料１ｂ
を供給し、Ｔダイ１８３から溶融ポリエチレンを押し出
し、ウェブ材料と溶融ポリエチレンの一体化フィルムを
金属ロールであるチルロール１８２に押圧して積層す
る。この際、チルロール側からフィルム３ｂを供給して
３層積層体としてもよい。本実装方法では、実装したＩ
Ｃチップ２が凹孔内に嵌合しているので、ＩＣチップ２
がチルロール１８２側に面するように実装されていて
も、チルロールを損傷することはない。前工程にＡＣ剤
の塗工工程を設ける場合も同様である。In the EC process, the web material is laminated and coated with a sealant film. Since the IC chip filled in the recessed hole is not in a state of being physically completely bonded to the web base material, the film may shake or vibrate, or may fall out of the recessed hole if the film faces downward. Therefore, after filling the IC chip, the entire surface including the recess and other portions of the web material is covered with the sealant film. FIG. 4 illustrates the case of an extrusion coater (EC) machine. When the melted polyethylene (sealant film) 3 or the like is coated on the web material 1b, the web material 1b is fed from the nip roll 181 side, which is a rubber roll of the EC machine 18.
The molten polyethylene is extruded from the T die 183, and the integrated film of the web material and the molten polyethylene is pressed against the chill roll 182 which is a metal roll to be laminated. At this time, the film 3b may be supplied from the chill roll side to form a three-layer laminate. In this implementation method, I
Since the C chip 2 is fitted in the recess, the IC chip 2
Is mounted so as to face the chill roll 182 side, the chill roll is not damaged. The same applies when the coating process of the AC agent is provided in the previous process.

【００３９】シーラントフィルムのラミネート方法とし
ては、ＥＣ以外にドライラミネート方式あるいは接着剤
を使用するラミネート等、適宜の形態を採用することが
できる。このようにしてシーラントフィルムが被覆され
た状態では、ＩＣチップ２は安定した状態になり、その
後の製袋や内容物を充填する加工を行っても凹孔４内か
ら脱落するようなことはない。As a method for laminating the sealant film, an appropriate form such as a dry laminating method or laminating using an adhesive can be adopted in addition to EC. In such a state where the sealant film is covered, the IC chip 2 is in a stable state, and does not fall out from the recessed hole 4 even if a bag-making process or a process of filling the contents is performed thereafter. .

【００４０】図６は、ＩＣチップ充填槽を示す詳細図で
ある。ＩＣチップ充填槽１５は、ガラスまたは透明アク
リル板等で形成する漏斗状の容器からなる。容器の材質
は、スラリーで影響を受けることのない他の金属やプラ
スチックを使用できる。この充填槽に液体を満たし、凹
孔４を形成したウェブ材料１ｂを液体中に走行させる。
図６においては、搬送ロールＲ３とＲ４間の傾斜面にお
いて、ディスペンサー１５１からＩＣチップの分散した
スラリーをウェブ表面に流すようにしている。ウェブ材
料面を流れるスラリーの流速は、１ｍｍ／ｓｅｃから約
１０００ｍｍ／ｓｅｃ程度であるが、ウェブ材料の搬送
速度やＩＣチップの嵌合速度、ウェブからの除去速度を
勘案して適宜に調整するのが好ましい。ＩＣチップ充填
槽１５内の液体とスラリーの液体はもちろん同質の液体
であるので、ディスペンサー１５１から流れた液体は速
やかに充填槽内に拡散するが、液体よりはやや比重の大
きいＩＣチップは沈降してウェブ表面に落ちる。沈降し
たＩＣチップの幾つかは凹孔に嵌合するが、嵌合しない
残余の大多数のＩＣチップはウェブ表面から除去され
る。FIG. 6 is a detailed view showing the IC chip filling tank. The IC chip filling tank 15 is a funnel-shaped container made of glass or a transparent acrylic plate. As the material of the container, other metal or plastic which is not affected by the slurry can be used. The filling tank is filled with the liquid, and the web material 1b having the concave holes 4 formed therein is made to travel in the liquid.
In FIG. 6, the slurry in which the IC chips are dispersed is made to flow from the dispenser 151 to the web surface on the inclined surface between the transport rolls R3 and R4. The flow rate of the slurry flowing on the surface of the web material is about 1 mm / sec to about 1000 mm / sec, but it should be appropriately adjusted in consideration of the transport speed of the web material, the IC chip fitting speed, and the removal speed from the web. Is preferred. Since the liquid in the IC chip filling tank 15 and the slurry liquid are of the same quality, the liquid flowing from the dispenser 151 quickly diffuses into the filling tank, but the IC chips having a slightly larger specific gravity than the liquid settle down. Falls on the surface of the web. Some of the settled IC chips will fit into the recesses, while the majority of the remaining unfit IC chips will be removed from the web surface.

【００４１】ＩＣチップ充填槽１５中では凹孔にＩＣチ
ップ２を嵌合させて充填すると共に、余分なＩＣチップ
を迅速に落下させる必要があるので、ウェブに連続的な
振動を与えたり、ＩＣチップを分散しない弱い液流を与
えてＩＣチップの嵌合と落下を促進させる。ウェブ材料
は、図６のようにウェブ材料の進行方向に上昇して傾斜
するものでなく、進行方向に向かって下降したり、右ま
たは左に傾斜して走行するものであっても良い。In the IC chip filling tank 15, it is necessary to fit the IC chip 2 into the concave hole to fill the IC chip 2 and to quickly drop the excess IC chip. A weak liquid flow that does not disperse the chips is applied to facilitate the fitting and dropping of the IC chips. The web material does not have to rise and tilt in the traveling direction of the web material as shown in FIG. 6, but may have a material that descends in the traveling direction or travels while leaning to the right or left.

【００４２】ディスペンサー１５１は、ポンプ１５２か
らのガス噴出流により加速した流体をウェブ表面に流出
させることができる。ディスペンサー１５１の先端部分
は、凹孔の並ぶラインに近い部分に位置させる。１つの
ディスペンサーで凹孔が完全に充填されない場合は複数
のディスペンサーを凹孔のラインに沿って配列すること
ができる。凹孔に嵌合しないＩＣチップは振動により加
速されてウェブの傾斜面を滑り落ちるが、前記のように
吸引や強制落下させる機構を設けても良い。落下したＩ
Ｃチップは、漏斗状の受容槽１５３面に蓄積するので、
導通管（カラム）を通じて液流を循環させてディスペン
サー１５１に戻す。これには、空気や水素（Ｈ2 ）や酸
素（Ｏ2 ）、窒素ガス（Ｎ2 ）や炭酸ガス、あるいはア
ルゴンやヘリウム等の不活性ガスをポンプを用いて気泡
と共にに流す搬送方法を採用できる。The dispenser 151 can discharge the fluid accelerated by the gas jet flow from the pump 152 to the web surface. The tip portion of the dispenser 151 is located near the line where the concave holes are lined up. If a single dispenser does not completely fill the wells, multiple dispensers can be arranged along the line of the wells. The IC chip that does not fit into the recessed hole is accelerated by vibration and slides down the inclined surface of the web, but a mechanism for sucking or forcibly dropping may be provided as described above. I fell
Since C chips accumulate on the surface of the funnel-shaped receiving tank 153,
The liquid flow is circulated through the conduit (column) and returned to the dispenser 151. For this, a transfer method is used in which air, hydrogen (H 2 ), oxygen (O 2 ), nitrogen gas (N 2 ), carbon dioxide gas, or an inert gas such as argon or helium is used together with bubbles using a pump. it can.

【００４３】次に、本発明に使用する他の材料について
説明する。包装体のウェブ材料には、被覆したカートン
紙や板紙、樹脂含浸紙、ＰＥＴやＰＢＴ等のポリエステ
ル、ポリオレフィン、アクリル、ナイロン６、ナイロン
６６等のポリアミド、また、無機蒸着フィルムやＥＶＯ
Ｈ等のバリアフィルムが用いられる。流体塗工を行う関
係から被覆されていないカートン紙や板紙、通常の紙類
は適切とは考えられない。シーラントフィルムにはＰＥ
やＰＰ等のポリオレフィンもしくはそれらの２種以上の
フィルムやシートの積層体を使用できる。基材やシーラ
ントフィルムの厚みは１５〜５００μｍが使用できる
が、強度、加工作業性、コスト等の点から２０〜２００
μｍがより好ましい。Next, other materials used in the present invention will be described. The web material for the package includes coated carton paper, paperboard, resin-impregnated paper, polyester such as PET and PBT, polyamide such as polyolefin, acrylic, nylon 6, nylon 66, inorganic vapor deposition film and EVO.
A barrier film such as H is used. Uncoated carton paper, paperboard, and ordinary paper are not considered appropriate due to the fact that they are fluid coated. PE for sealant film
Polyolefin such as PP and PP, or a laminate of two or more kinds of films and sheets thereof can be used. The thickness of the base material and the sealant film may be 15 to 500 μm, but from the viewpoint of strength, processing workability, cost, etc., it is 20 to 200 μm.
μm is more preferable.

【００４４】熱溶融性樹脂層６としては、ポリエチレン
もしくはエチレンと（メタ）アクリル酸との共重合体な
どのオレフィン系、エチレン−酢酸ビニル系共重合体、
ポリアミド系、ポリエステル系、熱可塑性エラストマー
系、反応ホットメルト系などのホットメルト系樹脂、ワ
ックス等がある。As the heat-meltable resin layer 6, an olefin-based copolymer such as polyethylene or a copolymer of ethylene and (meth) acrylic acid, an ethylene-vinyl acetate-based copolymer,
There are polyamide-based, polyester-based, thermoplastic elastomer-based, hot-melt resin such as reactive hot-melt resin, and wax.

【００４５】[0045]

【実施例】（実施例）図１、図４、図５等を参照して、
ＩＣタグ付き包装体の実施例を説明する。厚み４０μ
ｍ、幅３００ｍｍのポリエチレンテレフタレート（ＰＥ
Ｔ）フィルム（東洋紡績株式会社製「Ｅ−５１０２」）
をウェブ材料１ｂとし、これに、アクリル系ホットメル
ト剤（熱溶融性樹脂６）を幅１ｃｍ、厚み２μｍのライ
ン状になるように印刷してウェブ材料を作成した。次
に、ホットメルト剤塗工ライン上に、開孔４の表面が１
５２０×２０４０μｍ、底面が１２００×１７００μｍ
の矩形状、深さが２００μｍの逆截頭ピラミッド型にな
るように、当該形状を有する雄型と雌型の熱成形具を用
いて、１０ｃｍ間隔置きに各１個の凹孔を連続して形成
した。(Example) (Example) Referring to FIG. 1, FIG. 4, FIG.
An example of a package with an IC tag will be described. Thickness 40μ
m, width 300 mm polyethylene terephthalate (PE
T) film ("E-5102" manufactured by Toyobo Co., Ltd.)
Was used as a web material 1b, and an acrylic hot melt agent (heat-melting resin 6) was printed on the web material 1b so as to form a line having a width of 1 cm and a thickness of 2 μm to prepare a web material. Next, the surface of the opening 4 is 1 on the hot melt coating line.
520 × 2040 μm, bottom surface 1200 × 1700 μm
To form an inverted truncated pyramid shape having a rectangular shape and a depth of 200 μm, one concave hole is continuously formed at intervals of 10 cm by using male and female thermoforming tools having the shape. Formed.

【００４６】ＩＣチップ塗布用スラリーとして、ＩＣチ
ップ約８０００個を１リットルの水に分散させたものを
準備した。当該ＩＣチップは、表面が１５００×２００
０μｍ、底面が１２００×１７００μｍの矩形状で、厚
みが２００μｍの截頭ピラミッド型形状、非接触ＩＣタ
グ用途のものである。このＩＣチップを分散したスラリ
ーを、図６図示の充填層内において、前記ウェブ材料面
にディスペンサー１５１から噴射した。ＩＣチップ充填
後のウェブ材料を加熱して熱溶融性樹脂層６によりＩＣ
チップ２を基材に固定した。As a slurry for coating IC chips, about 8000 IC chips dispersed in 1 liter of water were prepared. The surface of the IC chip is 1500 × 200
It is a rectangular pyramid shape with 0 μm and a bottom surface of 1200 × 1700 μm and a thickness of 200 μm, which is used for a non-contact IC tag. The slurry in which the IC chips were dispersed was sprayed from the dispenser 151 onto the web material surface in the filling layer shown in FIG. The web material after filling the IC chips is heated to form the IC by the heat-meltable resin layer 6.
The chip 2 was fixed to the base material.

【００４７】別に、アンテナパターン印刷用のＰＤＭＳ
スタンプを以下のようにして準備した。まず、厚み２．
０ｍｍの銅合金にレジストを塗工し、図３（Ａ）図示の
平面コイル状アンテナパターンを作製したフォトマスク
を重ねて露光した。レジスト作製後、エッチングして深
さ０．５ｍｍのスタンプ型７を作製した。このスタンプ
型材に、ポリジメチルシロキサン（ダウコーニング社
「ＳＹＬＰＯＴ」）の液体を塗工して固め、その後剥離
して凹凸パターンのＰＤＭＳスタンプ９を完成した。Separately, PDMS for antenna pattern printing
Stamps were prepared as follows. First, the thickness 2.
A resist was applied to a 0 mm copper alloy, and a photomask having the planar coil antenna pattern shown in FIG. After producing the resist, etching was performed to produce a stamp die 7 having a depth of 0.5 mm. A liquid of polydimethylsiloxane (“SYLPOT” manufactured by Dow Corning Co., Ltd.) was applied to the stamp mold material to harden it and then peeled off to complete a PDMS stamp 9 having an uneven pattern.

【００４８】このＰＤＭＳスタンプ９をゴム凸版とし
て、導電性インキ（藤倉化成株式会社製「銀ペース
ト」）を使用してアンテナパターンを印刷した。当該イ
ンキは、有機銀化合物と銀フレークの混合物ペーストか
らなる材料である。当該インキは焼成によりさらに低抵
抗の導電体になるが、未焼成でもＩＣタグとして十分な
導電性が得られる。アンテナパターンをパッチアンテナ
形状（図２）とし、接続端子１１ｃ，１２ｃの大きさを
１．０ｍｍ×１．０ｍｍ、端子間距離を０．８ｍｍとし
たところパッドに対して見当位置合わせを容易に行うこ
とができた。Using this PDMS stamp 9 as a rubber relief printing plate, an antenna pattern was printed using a conductive ink ("Silver paste" manufactured by Fujikura Kasei Co., Ltd.). The ink is a material composed of a mixture paste of an organic silver compound and silver flakes. The ink becomes a conductor having a lower resistance when fired, but sufficient conductivity can be obtained as an IC tag even if it is not fired. When the antenna pattern is a patch antenna shape (FIG. 2), the size of the connection terminals 11c and 12c is 1.0 mm × 1.0 mm, and the distance between the terminals is 0.8 mm, the register position can be easily aligned with the pad. I was able to.

【００４９】その後、シングルＥＣ機を用いて、ＩＣチ
ップ側にＡＣ（アンカーコート）剤（武田薬品工業株式
会社製「Ａ３２１０／Ａ３０７５」、固形分５％）を塗
布し、乾燥後、樹脂温度３２０°Ｃの押出しＰＥ（三井
化学株式会社製「ミラソン１６Ｐ」）；押出し厚み２０
μｍにて、厚み４０μｍのＰＥフィルム（大日本樹脂株
式会社製「ＳＫＬフィルム」）と押出しラミネーション
を行い、シーラントフィルムを作製した。After that, an AC (anchor coat) agent ("A3210 / A3075" manufactured by Takeda Pharmaceutical Co., Ltd., solid content 5%) is applied to the IC chip side using a single EC machine, and after drying, a resin temperature 320 Extrusion PE at ° C (“Mirason 16P” manufactured by Mitsui Chemicals, Inc.); Extrusion thickness 20
At 40 μm, a PE film having a thickness of 40 μm (“SKL film” manufactured by Dainippon Resin Co., Ltd.) was extruded and laminated to produce a sealant film.

【００５０】上記の工程により作製した、ＩＣタグ付き
包装体の構成は、 （表）ＰＥＴ４０μｍ／アンテナパターン印刷／ＩＣチ
ップ／ＡＣ／ＰＥ２０μｍ／ＰＥフィルム４０μｍ
（裏） となった。The structure of the package with an IC tag produced by the above steps is as follows: (Table) PET 40 μm / antenna pattern printing / IC chip / AC / PE 20 μm / PE film 40 μm
(Back).

【００５１】実施例のＩＣタグ付き包装体を使用して、
スナック菓子用包装材料を作製した。確認事項として非
接触ＩＣタグ１０に対して所定のデータの記録を行った
後、読取装置として、モトローラ社製ＢｉＳｔａｔｉｘ
リーダー「ＷＡＶＥ」を用いて、情報の読取り試験を行
ったところ、全ての包装体の非接触ＩＣタグを正しく読
み取りすることができた。Using the IC tag package of the embodiment,
A packaging material for snacks was made. As a confirmation item, after recording predetermined data on the non-contact IC tag 10, as a reading device, BiStatix manufactured by Motorola Co., Ltd.
When the information reading test was conducted using the reader "WAVE", the non-contact IC tags of all the packages could be correctly read.

【００５２】本発明のＩＣタグ付き包装体は、データの
書き換えができるので、出荷検査結果のデータ、成分表
示や賞味期限、製造者名、出荷日等の各種の記録がで
き、商品の流通管理、品質管理に好適である。本発明の
包装体は軟包装材料に限らず、紙−フィルム等を積層す
るカートン等にも適用が可能であり函体状の包装体を除
外するものではない。Since the data can be rewritten in the package with an IC tag of the present invention, various records such as shipping inspection result data, ingredient display, expiration date, manufacturer name, shipping date, etc. can be recorded, and product distribution management is possible. Suitable for quality control. The package of the present invention is not limited to a soft packaging material, but can be applied to a carton or the like in which paper-film and the like are laminated, and does not exclude a box-shaped package.

【００５３】[0053]

【発明の効果】上述のように、本発明のウェブに実装さ
れたＩＣチップへのアンテナパターン形成方法によれ
ば、ＩＣチップを実装したウェブ材料に対して、高い精
度でアンテナパターンを印刷することができる。また、
インラインで高速にＩＣタグ付き包装体を製造できる利
点がある。本発明のＩＣタグ付き包装体は、従来のよう
に、非接触ＩＣタグラベルを使用しないので、製造原価
を低くすることができる。As described above, according to the antenna pattern forming method for the IC chip mounted on the web of the present invention, the antenna pattern can be printed on the web material mounted with the IC chip with high accuracy. You can Also,
There is an advantage that a package with an IC tag can be manufactured inline at high speed. Since the package with an IC tag of the present invention does not use a non-contact IC tag label as in the conventional case, the manufacturing cost can be reduced.

【図面の簡単な説明】[Brief description of drawings]

【図１】 本発明のＩＣタグ付き包装体の例を示す図で
ある。FIG. 1 is a diagram showing an example of a package with an IC tag of the present invention.

【図２】 アンテナパターンの接続端子とＩＣチップの
相対位置を示す図である。FIG. 2 is a diagram showing relative positions of a connection terminal of an antenna pattern and an IC chip.

【図３】 電磁誘導型アンテナパターンを示す。FIG. 3 shows an electromagnetic induction antenna pattern.

【図４】 ウェブ材料へのＩＣチップ実装を行う製造ラ
イン図である。FIG. 4 is a manufacturing line diagram for mounting an IC chip on a web material.

【図５】 ラバースタンプ法の工程を示す図である。FIG. 5 is a diagram showing a process of a rubber stamp method.

【図６】 ＩＣチップ充填槽を示す図である。FIG. 6 is a view showing an IC chip filling tank.

【図７】 従来法による非接触ＩＣタグの実施形態を示
す図である。FIG. 7 is a diagram showing an embodiment of a non-contact IC tag according to a conventional method.

【符号の説明】[Explanation of symbols]

１ ＩＣタグ付き包装体 １ｂ パッケージ基材、ウェブ材料 ２ ＩＣチップ ２ｂ ＩＣチップの底部 ２ｕ ＩＣチップの表面 ３ シーラントフィルム ４ 凹孔 ５ 絵柄印刷 ６ 熱溶融性樹脂層 ７ 型 ８ ＰＤＭＳ材料 ９ ＰＤＭＳスタンプ １０ 非接触ＩＣタグ １１，１２ アンテナパターン １３ コイル状パターン １４ ダイポール型パターン １５ ＩＣチップ充填槽 １７ 印刷機 １８ ＥＣ機 ２０ ＩＣタグラベル ２１ ＩＣチップ 1 Package with IC tag 1b Package base material, web material 2 IC chip 2b Bottom of IC chip 2u IC chip surface 3 sealant film 4 recessed holes 5 Design printing 6 Thermofusible resin layer Type 7 8 PDMS material 9 PDMS stamps 10 Non-contact IC tag 11,12 antenna pattern 13 coil pattern 14 dipole pattern 15 IC chip filling tank 17 Printing machine 18 EC machine 20 IC tag label 21 IC chip

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０１Ｑ 1/40 Ｂ６５Ｂ 15/04 Ｂ 9/16 Ｇ０６Ｋ 19/00 Ｋ // Ｂ６５Ｂ 15/04 Ｈ Ｆターム(参考） 2C005 MA15 MA16 MA17 MA19 MB06 NA06 NA18 NB03 NB07 RA14 5B035 BA03 BA04 BA05 BB09 BC00 CA01 CA08 CA23 5J046 AA01 AA04 AA06 AA07 AA09 AA10 AA13 AB07 PA07 QA02 5J047 AA01 AA04 AA06 AA07 AA09 AA10 AA13 AB07 EF04 EF05─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 7 Identification code FI theme code (reference) H01Q 1/40 B65B 15/04 B 9/16 G06K 19/00 K // B65B 15/04 HF term ( reference) 2C005 MA15 MA16 MA17 MA19 MB06 NA06 NA18 NB03 NB07 RA14 5B035 BA03 BA04 BA05 BB09 BC00 CA01 CA08 CA23 5J046 AA01 AA04 AA06 AA07 AA09 AA10 AA13 AB07 PA07 QA02 5J047 AA01 AA04 AA06 AA07 AA09 AA10 AA13 AB07 EF04 EF05

Claims (8)

【特許請求の範囲】[Claims] 【請求項１】 ウェブ材料に対してＩＣタグ用ＩＣチッ
プを実装し、アンテナパターンを形成する方法であっ
て、（１）走行するウェブ材料に間隔を置いてＩＣチッ
プの外形、深さに相当する凹孔を形成する工程と、
（２）当該ウェブ材料を、前記ＩＣチップの外形、深さ
に相応する形状を有するＩＣチップを分散した流体中を
通過させて当該凹孔内に嵌合した状態で各１個のＩＣチ
ップを残す工程と、（３）前記凹孔内に嵌合したＩＣチ
ップのパッドに接続するようにアンテナパターンを印刷
する工程と、からなることを特徴とするウェブに実装さ
れたＩＣチップへのアンテナパターン形成方法。1. A method for forming an antenna pattern by mounting an IC chip for an IC tag on a web material, comprising: (1) corresponding to the outer shape and the depth of the IC chip with a gap in the running web material. Forming a concave hole to
(2) The web material is passed through a fluid in which IC chips having a shape corresponding to the outer shape and the depth of the IC chips are passed through, and one IC chip is attached to each recessed hole. An antenna pattern for an IC chip mounted on a web, which comprises a step of leaving the pattern, and (3) a step of printing an antenna pattern so as to be connected to a pad of the IC chip fitted in the concave hole. Forming method. 【請求項２】 ウェブ材料に対してＩＣタグ用ＩＣチッ
プを実装し、アンテナパターンを形成する方法であっ
て、（１）走行するウェブ材料に間隔を置いてＩＣチッ
プの外形、深さに相当する凹孔を形成する工程と、
（２）当該ウェブ材料を、前記ＩＣチップの外形、深さ
に相応する形状を有するＩＣチップを分散した流体中を
通過させて当該凹孔内に嵌合した状態で各１個のＩＣチ
ップを残す工程と、（３）前記凹孔内に嵌合したＩＣチ
ップのパッドに接続するようにアンテナパターンを印刷
する工程と、（４）ＩＣチップが嵌合し、アンテナパタ
ーンを印刷したウェブ材料の凹孔部を含む全面にフィル
ムを被覆する工程と、からなることを特徴とするウェブ
に実装されたＩＣチップへのアンテナパターン形成方
法。2. A method for mounting an IC chip for an IC tag on a web material to form an antenna pattern, comprising: (1) an outer shape and a depth of the IC chip spaced apart from a running web material. Forming a concave hole to
(2) The web material is passed through a fluid in which IC chips having a shape corresponding to the outer shape and the depth of the IC chips are passed through, and one IC chip is attached to each recessed hole. A step of leaving, (3) a step of printing an antenna pattern so as to connect to the pad of the IC chip fitted in the recess, and (4) a step of printing the web material on which the IC chip is fitted and the antenna pattern is printed. A method of forming an antenna pattern on an IC chip mounted on a web, which comprises a step of coating a film on the entire surface including a recessed portion. 【請求項３】 ウェブ材料に対してＩＣタグ用ＩＣチッ
プを実装し、アンテナパターンを製造する方法であっ
て、（１）走行するウェブ材料に間隔を置いてＩＣチッ
プの外形、深さに相当する凹孔を形成する工程と、
（２）当該ウェブ材料の凹孔内に、前記外形、深さに相
応する形状を有するＩＣチップを嵌合した状態で各１個
残す工程と、（３）前記凹孔内に嵌合したＩＣチップの
パッドに接続するようにアンテナパターンを印刷する工
程と、からなることを特徴とするウェブに実装されたＩ
Ｃチップへのアンテナパターン形成方法。3. A method of manufacturing an antenna pattern by mounting an IC chip for an IC tag on a web material, comprising: (1) corresponding to the outer shape and depth of the IC chip with a gap in the running web material. Forming a concave hole to
(2) A step of leaving one IC chip having a shape corresponding to the outer shape and the depth in the concave hole of the web material, and (3) an IC fitted in the concave hole A step of printing an antenna pattern so as to be connected to a pad of a chip;
A method for forming an antenna pattern on a C chip. 【請求項４】 ウェブ材料に対してＩＣタグ用ＩＣチッ
プを実装し、アンテナパターンを製造する方法であっ
て、（１）走行するウェブ材料に間隔を置いてＩＣチッ
プの外形、深さに相当する凹孔を形成する工程と、
（２）当該ウェブ材料の凹孔内に、前記外形、深さに相
応する形状を有するＩＣチップを嵌合した状態で各１個
残す工程と、（３）前記凹孔内に嵌合したＩＣチップの
パッドに接続するようにアンテナパターンを印刷する工
程と、（４）ＩＣチップが嵌合し、アンテナパターンを
印刷したウェブ材料の凹孔部を含む全面にフィルムを被
覆する工程と、からなることを特徴とするウェブに実装
されたＩＣチップへのアンテナパターン形成方法。4. A method for manufacturing an antenna pattern by mounting an IC chip for an IC tag on a web material, comprising: (1) an outer shape and a depth of the IC chip spaced apart from a running web material. Forming a concave hole to
(2) A step of leaving one IC chip having a shape corresponding to the outer shape and the depth in the concave hole of the web material, and (3) an IC fitted in the concave hole It comprises a step of printing an antenna pattern so as to be connected to a pad of the chip, and (4) a step of covering the entire surface of the web material on which the antenna pattern is printed, including the concave holes, with the IC chip fitted with the film. A method for forming an antenna pattern on an IC chip mounted on a web, comprising: 【請求項５】 アンテナパターンが、パッチアンテナ、
平面コイル状アンテナ、ダイポール型アンテナのいずれ
かのパターンであることを特徴とする請求項１ないし請
求項４記載のウェブに実装されたＩＣチップへのアンテ
ナパターン形成方法。5. The antenna pattern is a patch antenna,
5. The method for forming an antenna pattern on an IC chip mounted on a web according to claim 1, wherein the pattern is one of a planar coil antenna and a dipole antenna. 【請求項６】 アンテナパターンをラバースタンプ法で
印刷することを特徴とする請求項１ないし請求項４記載
のウェブに実装されたＩＣチップへのアンテナパターン
形成方法。6. The method for forming an antenna pattern on an IC chip mounted on a web according to claim 1, wherein the antenna pattern is printed by a rubber stamp method. 【請求項７】 非接触ＩＣタグ機能を有するＩＣタグ付
き包装体であって、ウェブ材料にＩＣチップの外形、深
さに相当する凹孔が形成され、当該凹孔内にＩＣチップ
が嵌合した状態で、当該ＩＣチップのパッドに接続する
ように、アンテナパターンが印刷され、さらに当該ＩＣ
チップ、アンテナパターン上にシーラントフィルムが被
覆されていることを特徴とするＩＣタグ付き包装体。7. A package with an IC tag having a non-contact IC tag function, wherein a recessed hole corresponding to the outer shape and depth of the IC chip is formed in a web material, and the IC chip is fitted in the recessed hole. In this state, the antenna pattern is printed so as to be connected to the pad of the IC chip, and the IC
A package with an IC tag, characterized in that a chip and an antenna pattern are covered with a sealant film. 【請求項８】 アンテナパターンが、パッチアンテナ、
平面コイル状アンテナ、ダイポール型アンテナのいずれ
かのパターンであることを特徴とする請求項７記載のＩ
Ｃタグ付き包装体。8. The antenna pattern is a patch antenna,
8. The I according to claim 7, wherein the pattern is one of a planar coil antenna and a dipole antenna.
Package with C tag.
JP2002036151A 2002-02-14 2002-02-14 Method for forming antenna pattern on IC chip mounted on web and package with IC tag Expired - Fee Related JP3998992B2 (en)

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