JP2002252117A - Laminated coil component and its manufacturing method - Google Patents

Laminated coil component and its manufacturing method

Info

Publication number
JP2002252117A
JP2002252117A JP2001353428A JP2001353428A JP2002252117A JP 2002252117 A JP2002252117 A JP 2002252117A JP 2001353428 A JP2001353428 A JP 2001353428A JP 2001353428 A JP2001353428 A JP 2001353428A JP 2002252117 A JP2002252117 A JP 2002252117A
Authority
JP
Japan
Prior art keywords
coil
laminated
electrode
via hole
ceramic green
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001353428A
Other languages
Japanese (ja)
Other versions
JP3788325B2 (en
Inventor
Takahiro Yamamoto
高弘 山本
Motoi Nishii
基 西井
Hajime Arakawa
元 荒川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP2001353428A priority Critical patent/JP3788325B2/en
Priority to TW090130744A priority patent/TW527613B/en
Priority to CNB011445211A priority patent/CN1175438C/en
Priority to KR10-2001-0080682A priority patent/KR100417302B1/en
Publication of JP2002252117A publication Critical patent/JP2002252117A/en
Application granted granted Critical
Publication of JP3788325B2 publication Critical patent/JP3788325B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/0006Printed inductances
    • H01F17/0013Printed inductances with stacked layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/2804Printed windings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041Printed circuit coils
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/0006Printed inductances
    • H01F17/0013Printed inductances with stacked layers
    • H01F2017/002Details of via holes for interconnecting the layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/2804Printed windings
    • H01F2027/2809Printed windings on stacked layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Filters And Equalizers (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a laminated coil component that can be reduced in size and in manufacturing cost and has a low conductor resistance, and to provide a method of manufacturing the component. SOLUTION: A coil 2, the center axis of which crosses the direction of a lamination A of an element (laminate) 1 at right angles, is formed by respectively connecting one- and the other-side end sections of a prescribed via hole of a plurality of via holes 4 provided in the element 1, in the direction of lamination A to one- and the other-side end sections of another prescribed via hole of the via holes 4 in the direction of lamination A through belt-like connecting electrodes 5 having plural-layer structures and provided in the element 1, in parallel with the laminating surface of the element 1 (in the direction perpendicular to the direction of lamination A). At the same time, the coil 2 is connected to an external electrode 3 for inputting and outputting through a lead-out electrode 6, which has a plural-layer structure and are provided in parallel with the lamination surface.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本願発明は積層型コイル部品
及びその製造方法に関し、詳しくは、積層構造のコイル
が積層体中に配設されてなる積層型インダクタや積層型
LC複合部品などのような積層型コイル部品及びその製
造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated coil component and a method for manufacturing the same, and more particularly, to a laminated inductor such as a laminated inductor or a laminated LC composite component in which a coil having a laminated structure is disposed in a laminated body. The present invention relates to a laminated coil component and a method for manufacturing the same.

【0002】[0002]

【従来の技術及び発明が解決しようとする課題】代表的
な積層型コイル部品の1つに、積層型インダクタがあ
り、このような積層型インダクタのうちには、例えば、
図9に示すような構造を有するものがある。すなわち、
この積層型インダクタは、積層体である素子51の積層
方向Aと一致するようにして設定されたコイル中心軸を
周回する積層型のコイル52が素子51の内部に配設さ
れ、かつ、このコイル52の両端部が引き出された素子
51の両端面に入出力用外部電極53が配設された構造
を有している。
2. Description of the Related Art One of the typical multilayer coil components is a multilayer inductor. Among such multilayer inductors, for example,
Some have a structure as shown in FIG. That is,
In this laminated inductor, a laminated coil 52 orbiting around a coil central axis set so as to coincide with a laminating direction A of a laminated element 51 is disposed inside the element 51, and The device 51 has a structure in which input / output external electrodes 53 are provided on both end surfaces of the element 51 from which both end portions are drawn out.

【0003】そして、上記従来の積層型インダクタは、
通常、図10に示すように、層間接続のためのバイアホ
ール54を形成したセラミックグリーンシート56に、
スクリーン印刷などの方法により、バイアホール54に
応じた形状に導電ペーストを印刷してコイルパターン
(内部電極)55を形成した後、このコイルパターン5
5が印刷されたセラミックグリーンシート56、及び所
定の位置にバイアホール57が形成され、かつ、表裏前
面に外部との接続のための電極膜58が形成されたセラ
ミックグリーンシート59を積層圧着し、焼成した後、
入出力用外部電極53(図9)を形成する工程を経て製
造されている。
[0003] The conventional multilayer inductor described above is
Normally, as shown in FIG. 10, a ceramic green sheet 56 in which a via hole 54 for interlayer connection is formed,
After a conductive paste is printed in a shape corresponding to the via hole 54 by a method such as screen printing to form a coil pattern (internal electrode) 55, the coil pattern 5 is formed.
5 and a ceramic green sheet 59 having via holes 57 formed at predetermined positions and electrode films 58 for connection to the outside formed on the front and back surfaces, and laminated and pressed together. After firing,
It is manufactured through a process of forming the input / output external electrodes 53 (FIG. 9).

【0004】しかし、上述のように、導電ペーストをス
クリーン印刷し、焼成することにより形成される電極
(焼成後のコイルパターン(内部電極)55)の厚み
は、最大でも20μm程度と厚みが小さく、このような
コイルパターン55からなるコイル52(図9)を備え
た上記従来の積層型コイル部品においては、導体抵抗が
大きく、大電流に十分に対応することが困難であるのが
実情である。
However, as described above, the thickness of the electrode (the coil pattern (internal electrode) 55 after firing) formed by screen-printing and firing a conductive paste is as small as about 20 μm at the maximum. In the above-described conventional laminated coil component having the coil 52 (FIG. 9) including the coil pattern 55, the conductor resistance is large, and it is difficult to sufficiently cope with a large current.

【0005】ところで、導体抵抗を低減する方法とし
て、例えば、同一のコイルパターン55を複数層ずつ積
層して電極厚みを大きくする方法が考えられるが、積層
枚数が増大すると、製品の大型化を招くばかりでなく、
製造工程が複雑になりコストの上昇を招くという問題点
がある。なお、上記問題点は積層型インダクタに限ら
ず、積層LC複合部品などの種々の積層型コイル部品に
も当てはまるものである。
As a method of reducing the conductor resistance, for example, a method of increasing the electrode thickness by laminating the same coil pattern 55 in a plurality of layers is conceivable. However, an increase in the number of laminated layers causes an increase in the size of the product. Not only
There is a problem that the manufacturing process is complicated and the cost is increased. The above problem is not limited to the multilayer inductor, but also applies to various multilayer coil components such as a multilayer LC composite component.

【0006】本願発明は上記問題点を解決するものであ
り、小型化が可能で、導体抵抗が低く、しかも、製造コ
ストの低減を図ることが可能な積層型コイル部品及びそ
の製造方法を提供することを目的とする。
The present invention solves the above-mentioned problems, and provides a laminated coil component which can be reduced in size, has low conductor resistance, and can reduce the production cost, and a method for producing the same. The purpose is to:

【0007】[0007]

【課題を解決するための手段】上記目的を達成するため
に、本願発明の請求項1にかかる積層型コイル部品は、
積層体内部に、積層方向と直交するコイル中心軸を周回
するコイルが配設され、かつ、積層体の両端面に、コイ
ルの両端部と導通する入出力用外部電極が配設された構
造を有する積層型コイル部品であって、積層体内部の、
積層方向から見た複数の位置に、軸心が積層方向に沿う
ように配設されたバイアホールと、積層体内部に、積層
面と平行に配設され、所定のバイアホールの積層方向の
一方側端部どうし及び所定のバイアホールの積層方向の
他方側端部どうしを接続することにより、バイアホール
と協働して、コイル中心軸が積層方向と直交するコイル
を構成する複数層構造の帯状接続電極と、積層体内部
に、積層面と平行に配設され、バイアホールと帯状接続
電極から構成される前記コイルと前記入出力用外部電極
とを接続する複数層構造の引出電極とを具備することを
特徴としている。
To achieve the above object, a laminated coil component according to claim 1 of the present invention comprises:
Inside the laminated body, a structure is provided in which a coil orbiting around a coil central axis orthogonal to the laminating direction is provided, and on both end surfaces of the laminated body, input / output external electrodes that are electrically connected to both ends of the coil are provided. A laminated coil component having:
Via holes arranged at a plurality of positions viewed from the laminating direction such that the axis thereof is along the laminating direction, and one of the predetermined via holes disposed in parallel with the laminating surface inside the laminated body and in a laminating direction. By connecting the side end portions and the other end portions of the predetermined via holes in the stacking direction with each other, in cooperation with the via holes, a strip having a multilayer structure in which the coil central axis forms a coil orthogonal to the stacking direction. A connection electrode, and a multi-layered extraction electrode that is provided inside the laminate and is arranged in parallel with the lamination surface and connects the coil formed of a via hole and a strip-shaped connection electrode to the input / output external electrode. It is characterized by doing.

【0008】本願発明(請求項1)の積層型コイル部品
は、複数のバイアホールのうちの所定のバイアホールの
積層方向の一方側端部どうし及び所定のバイアホールの
積層方向の他方側端部どうしを、積層面と平行に(積層
方向に直交する方向に)配設された複数層構造の帯状接
続電極により接続して、コイル中心軸が積層方向と直交
するコイルを形成するとともに、積層面と平行に配設さ
れた複数層構造の引出電極により該コイルを入出力用外
部電極と接続するようにしているので、製品の大型化を
招くことなく、導体抵抗を低減することが可能になる。
すなわち、帯状接続電極及び引出電極を複数層構造とし
て、バイアホールの電極断面積と同等程度の断面積が確
保されるまで帯状接続電極及び引出電極の厚みを大きく
する(積層数を増やす)ことにより、小型化を阻害する
ことなく、導体抵抗を低減して、大電流への対応性を向
上させることができるようになる。
In the laminated coil component according to the present invention (claim 1), one end of one of the plurality of via holes in the laminating direction of the predetermined via hole and the other end of the predetermined via hole in the laminating direction are provided. The coils are connected to each other by a strip-shaped connection electrode having a multi-layer structure arranged in parallel with (in the direction perpendicular to the laminating direction) parallel to the laminating surface to form a coil having a coil center axis perpendicular to the laminating direction. The coil is connected to the input / output external electrode by a multi-layered lead electrode arranged in parallel with the above, so that the conductor resistance can be reduced without increasing the size of the product. .
That is, the thickness of the strip-shaped connection electrode and the extraction electrode is increased (the number of layers is increased) until the cross-section area equivalent to the electrode cross-section area of the via hole is secured in a multi-layer structure of the strip-shaped connection electrode and the extraction electrode. In addition, the conductor resistance can be reduced without impairing the miniaturization, and the responsiveness to a large current can be improved.

【0009】また、請求項2の積層型コイル部品は、前
記引出電極が、積層体の積層方向の略中央部に、かつ、
積層面と平行に配設されていることを特徴とする。
In the laminated coil component according to a second aspect of the present invention, the extraction electrode is provided at a substantially central portion of the laminated body in the laminating direction,
It is characterized by being arranged in parallel with the lamination surface.

【0010】引出電極が積層体の最外層付近に配設され
ている場合には、実装基板上の電極と引出電極との間に
浮遊容量が発生する場合があり、高周波特性が劣化しや
すくなることがあるため、実装時の方向性に配慮する必
要があるが、請求項2にかかる積層型コイル部品におい
ては、引出電極を、積層体の積層方向の略中央部に、か
つ、積層面と平行に配設するようにしているため、実装
基板上の電極と引出電極との間に浮遊容量が発生するこ
とを抑制することが可能になり、実装時の方向性をなく
して、実装工程における作業性を向上させることが可能
になる。
When the extraction electrode is disposed near the outermost layer of the laminate, a floating capacitance may be generated between the electrode on the mounting board and the extraction electrode, and the high-frequency characteristics are easily deteriorated. Therefore, it is necessary to consider the directionality at the time of mounting. However, in the multilayer coil component according to claim 2, the extraction electrode is provided substantially at the center of the multilayer body in the stacking direction, and at the same time as the stacking surface. Since they are arranged in parallel, it is possible to suppress the generation of stray capacitance between the electrodes on the mounting board and the extraction electrodes, and eliminate the directionality during mounting, and Workability can be improved.

【0011】また、請求項3の積層型コイル部品は、積
層体の表面に、バイアホールと帯状接続電極から構成さ
れる前記コイルと対向する容量取得用外部電極が配設さ
れていることを特徴としている。
According to a third aspect of the present invention, in the laminated coil component, a capacitance acquiring external electrode facing the coil is formed on the surface of the laminated body, the external electrode being constituted by a via hole and a strip-shaped connection electrode. And

【0012】積層体の表面に、バイアホールと帯状接続
電極から構成されるコイルと対向する容量取得用外部電
極を配設するようにした場合、積層体の表面に容量取得
用外部電極を配設するだけで、バイアホールと容量取得
用外部電極との間で必要な容量を確保することが可能に
なり、容易に積層型LC複合部品を構成することが可能
になる。
In the case where a capacitance acquisition external electrode facing a coil formed of a via hole and a strip-shaped connection electrode is provided on the surface of the laminate, the capacitance acquisition external electrode is provided on the surface of the laminate. Only by doing so, it is possible to secure a necessary capacitance between the via hole and the external electrode for obtaining capacitance, and it is possible to easily configure a laminated LC composite component.

【0013】また、請求項4の積層型コイル部品は、積
層体内部の、前記帯状接続電極よりも積層方向外側の一
方側及び他方側の少なくとも一方の領域に、前記帯状接
続電極と対向する容量取得用内部電極が配設されている
とともに、積層体の表面にグランド接続用外部電極が配
設されており、かつ、容量取得用内部電極がグランド接
続用外部電極に接続されていることを特徴としている。
According to a fourth aspect of the present invention, in the laminated coil component, the capacitance opposing the band-shaped connection electrode is provided in at least one region on one side and the other side outside the band-shaped connection electrode in the lamination direction inside the laminate. An internal electrode for acquisition is provided, an external electrode for ground connection is provided on the surface of the laminate, and the internal electrode for capacitance acquisition is connected to the external electrode for ground connection. And

【0014】帯状接続電極よりも積層方向外側の一方側
及び他方側の少なくとも一方の領域に、帯状接続電極と
対向する容量取得用内部電極を配設するとともに、積層
体の表面にグランド接続用外部電極を配設し、容量取得
用内部電極をグランド接続用外部電極に接続することに
より、請求項3にかかる積層型コイル部品の場合よりも
大きい容量を確保することが可能になり、特性設計の自
由度を向上させることが可能になる。
In at least one region on one side and the other side outside the band-shaped connection electrode in the stacking direction, a capacitance acquisition internal electrode facing the band-shaped connection electrode is arranged, and a ground connection external electrode is provided on the surface of the laminate. By arranging the electrodes and connecting the capacitance acquisition internal electrode to the ground connection external electrode, it is possible to secure a larger capacitance than in the case of the multilayer coil component according to claim 3, and to improve the characteristic design. The degree of freedom can be improved.

【0015】また、請求項5の積層型コイル部品は、積
層体の、前記容量取得用内部電極が配設される領域が誘
電体セラミックを主成分とする材料から形成されている
ことを特徴としている。
According to a fifth aspect of the present invention, in the multilayer coil component, a region of the multilayer body where the capacitance acquiring internal electrode is disposed is formed of a material mainly composed of a dielectric ceramic. I have.

【0016】積層体の、容量取得用内部電極が配設され
る領域を誘電体セラミックを主成分とする材料から構成
することにより、さらに大きい容量を確保することが可
能になり、本願発明をより実効あらしめることができ
る。
By forming the region of the laminated body where the internal electrodes for obtaining capacitance are arranged from a material containing dielectric ceramic as a main component, it is possible to secure a still larger capacitance. It can be effective.

【0017】また、本願発明(請求項6)の積層型コイ
ル部品の製造方法は、請求項1〜5のいずれかに記載の
積層型コイル部品を製造するための方法であって、回折
格子で分光されたレーザビームを照射してセラミックグ
リーンシートに貫通孔を形成した後、この貫通孔に導電
ペーストを充填してバイアホールを形成する工程を具備
していることを特徴としている。
Further, a method of manufacturing a laminated coil component according to the present invention (claim 6) is a method for producing a laminated coil component according to any one of claims 1 to 5, wherein the method comprises the steps of: After forming a through hole in the ceramic green sheet by irradiating the split laser beam, a step of filling the through hole with a conductive paste to form a via hole is provided.

【0018】回折格子で分光されたレーザビームを照射
してセラミックグリーンシートに貫通孔を形成した後、
この貫通孔に導電ペーストを充填してバイアホールを形
成することにより、セラミックグリーンシートに対して
高精度の貫通孔を、極めて効率よく形成することが可能
になり、本願発明の積層型コイル部品を効率よく製造す
ることが可能になる。また、レーザビームを照射する方
法によれば、微細で、精度の高いバイアホールを形成す
ることが可能になるため、同じ製品寸法で巻き数の多い
コイルを形成することが可能になる。
After irradiating the laser beam split by the diffraction grating to form a through hole in the ceramic green sheet,
By filling this through hole with a conductive paste to form a via hole, a highly accurate through hole can be formed very efficiently in the ceramic green sheet. It becomes possible to manufacture efficiently. Further, according to the method of irradiating a laser beam, it is possible to form a fine and high-precision via hole, and thus it is possible to form a coil having the same product dimensions and a large number of turns.

【0019】また、請求項7の積層型コイル部品の製造
方法は、前記バイアホールが形成されたセラミックグリ
ーンシートを積層して積層体を形成するにあたって、1
枚又は2枚以上のセラミックグリーンシートを積層する
たびに仮圧着しながら積層を行い、所定枚数積層した
後、本圧着することにより積層体を形成することを特徴
としている。
In the method of manufacturing a laminated coil component according to a seventh aspect of the present invention, when forming the laminated body by laminating the ceramic green sheets in which the via holes are formed.
Each time one or two or more ceramic green sheets are laminated, they are laminated while being pre-pressed, and after laminating a predetermined number of sheets, a full-press is formed to form a laminate.

【0020】1枚又は2枚以上のセラミックグリーンシ
ートを積層するたびに仮圧着しながら積層を行い、所定
枚数積層した後、本圧着することにより、コイルパター
ンの位置ずれを生じたりすることなく、確実に所望の積
層体を形成することが可能になり、本願発明の積層型コ
イル部品をさらに効率よく製造することができるように
なる。
Each time one or two or more ceramic green sheets are laminated, they are laminated while temporarily pressing them, and after laminating a predetermined number of sheets, the final pressure bonding is performed without causing displacement of the coil pattern. A desired laminated body can be reliably formed, and the laminated coil component of the present invention can be manufactured more efficiently.

【0021】[0021]

【発明の実施の形態】以下、本願発明の実施の形態を図
面に基づいて説明する。なお、以下の実施形態では、磁
性体セラミック中にコイルが配設された構造を有する積
層型インダクタ及び積層型LC複合部品を例にとって説
明する。
Embodiments of the present invention will be described below with reference to the drawings. In the following embodiments, a multilayer inductor and a multilayer LC composite component having a structure in which a coil is disposed in a magnetic ceramic will be described as examples.

【0022】[実施形態1]図1は本願発明の一実施形
態(実施形態1)にかかる積層型インダクタを示す外観
斜視図、図2は積層型インダクタを構成する積層体を示
す分解斜視図である。
[First Embodiment] FIG. 1 is an external perspective view showing a multilayer inductor according to an embodiment (first embodiment) of the present invention, and FIG. 2 is an exploded perspective view showing a multilayer body constituting the multilayer inductor. is there.

【0023】この実施形態1にかかる積層型インダクタ
は、図1に示すように、素子(積層体)1の内部に、素
子1の積層方向Aと直交するように設定されたコイル中
心軸を周回する積層型のコイル2が配設され、かつ、素
子1の両端面に、コイル2の両端部と導通する入出力用
外部電極3が配設された構造を有している。
As shown in FIG. 1, the laminated inductor according to the first embodiment circulates around a coil central axis set so as to be orthogonal to the laminating direction A of the element 1 inside the element (laminated body) 1. The coil 2 has a structure in which the input / output external electrodes 3 electrically connected to both ends of the coil 2 are provided on both end faces of the element 1.

【0024】そして、素子1の内部には、所定の平面位
置(積層方向から見た位置)に、軸心が積層方向Aに沿
うように配設された複数のバイアホール4が配設されて
いる。また、同じく、素子1の内部には、所定のバイア
ホール4の積層方向の一方側端部(上端部)どうし及び
所定のバイアホール4の積層方向の他方側端部(下端
部)どうしを接続することにより、バイアホール4と一
体となってコイル中心軸が積層方向Aと直交するコイル
2を構成する複数層構造の帯状接続電極5が、積層面と
平行(積層方向Aに直交する方向)に配設されている。
In the element 1, a plurality of via holes 4 are disposed at predetermined plane positions (positions viewed in the laminating direction) such that their axes are aligned with the laminating direction A. I have. Similarly, inside the element 1, one end (upper end) of the predetermined via hole 4 in the laminating direction and the other end (lower end) of the predetermined via hole 4 in the laminating direction are connected. By doing so, the strip-shaped connection electrodes 5 having a multilayer structure, which are integrated with the via holes 4 and constitute the coil 2 having the coil center axis orthogonal to the stacking direction A, are parallel to the stacking surface (the direction orthogonal to the stacking direction A). It is arranged in.

【0025】さらに、素子1の内部には、バイアホール
4と帯状接続電極5から構成されるコイル2と入出力用
外部電極3とを接続する複数層構造の引出電極6が、積
層面と平行(積層方向Aに直交する方向)に配設されて
いる。なお、この実施形態1の積層型インダクタにおい
て、引出電極6は、帯状接続電極5と同一平面に形成さ
れている。
Further, inside the element 1, there is provided a lead electrode 6 having a multi-layer structure for connecting the coil 2 composed of the via hole 4 and the strip-shaped connection electrode 5 to the input / output external electrode 3, parallel to the lamination surface. (A direction orthogonal to the stacking direction A). In the multilayer inductor of the first embodiment, the extraction electrode 6 is formed on the same plane as the strip-shaped connection electrode 5.

【0026】次に、この実施形態1の積層型インダクタ
の製造方法について説明する。まず、図2に示すよう
に、(1)所定位置ごとにバイアホール7(最終的にバイ
アホール4(図1)となる)が形成されたセラミックグ
リーンシート8と、(2)所定位置ごとにバイアホール9
(最終的にバイアホール4(図1)との接続部分とな
る)が形成され、かつ、これらのバイアホール9を含
む、所定形状の帯状接続電極5(図1)及び引出電極6
となる導体パターン10,11が形成されたセラミック
グリーンシート12と、(3)所定位置ごとにバイアホー
ル13(最終的にバイアホール4(図1)との接続部分
となる)が形成され、かつ、これらのバイアホール13
を含む、所定形状の帯状接続電極5(図1)となる導体
パターン14が形成されたセラミックグリーンシート1
5と、(4)バイアホール及び導体パターンが形成されて
いない外層用のセラミックグリーンシート16の4種類
のセラミックグリーンシートを用意する。
Next, a method of manufacturing the multilayer inductor of the first embodiment will be described. First, as shown in FIG. 2, (1) a ceramic green sheet 8 in which a via hole 7 (which eventually becomes a via hole 4 (FIG. 1)) is formed at each predetermined position; Via Hole 9
A band-shaped connection electrode 5 (FIG. 1) and a lead-out electrode 6 having predetermined shapes are formed (which eventually become connection portions with the via holes 4 (FIG. 1)) and include these via holes 9.
And (3) via holes 13 (which are finally connected to via holes 4 (FIG. 1)) at predetermined positions, and (3) ceramic green sheets 12 on which conductive patterns 10 and 11 are formed, and , These via holes 13
Green sheet 1 on which a conductor pattern 14 to be a strip-shaped connection electrode 5 having a predetermined shape (FIG. 1) is formed.
5 and (4) Four types of ceramic green sheets 16 for the outer layer where via holes and conductor patterns are not formed are prepared.

【0027】なお、セラミックグリーンシート8,1
2,15,16としては、例えば、Ni−Cu−Znフ
ェライトやNi−Znフェライトなどの磁性体セラミッ
ク材料、あるいは、ガラスセラミックからなる非磁性の
絶縁体セラミック材料などをドクターブレード法や引き
上げ法などの方法で成形したものなどが用いられる。
The ceramic green sheets 8, 1
Examples of 2, 15, 16 include a magnetic ceramic material such as Ni-Cu-Zn ferrite or Ni-Zn ferrite, or a non-magnetic insulating ceramic material made of glass ceramic, etc. And the like molded by the above method.

【0028】また、導体パターン10,11,14は、
例えば、Agを主成分とする導電ペーストをスクリーン
印刷することによって形成されている。なお、引出電極
6となる導体パターン11は、図2に示すように、セラ
ミックグリーンシート12の端縁近傍にまで引き出され
ているとともに、端縁近傍では、セラミックグリーンシ
ート12の一つの辺に沿うように、帯状のパターンに形
成され、外部電極3と確実に導通するように構成されて
いる。
The conductor patterns 10, 11, 14 are
For example, it is formed by screen-printing a conductive paste containing Ag as a main component. As shown in FIG. 2, the conductor pattern 11 serving as the extraction electrode 6 is extended to near the edge of the ceramic green sheet 12, and along one edge of the ceramic green sheet 12 near the edge. Thus, it is formed in a belt-like pattern and is configured to reliably conduct with the external electrode 3.

【0029】また、バイアホール7,9,13は、レー
ザ光源から放射され、回折格子を通過して分光されたレ
ーザビームを照射することにより、セラミックグリーン
シート8,12,15の所定位置に貫通孔を形成した
後、この貫通孔に導電ペーストを充填することにより形
成されている。
The via holes 7, 9, 13 penetrate into predetermined positions of the ceramic green sheets 8, 12, 15 by irradiating a laser beam emitted from a laser light source and passing through a diffraction grating and dispersed. After the holes are formed, the through holes are filled with a conductive paste.

【0030】なお、バイアホール7,9,13となる貫
通孔は、例えば、セラミックグリーンシートのマザーシ
ートを移動可能に支持するX−Yテーブルと、CO2
YAGなどのレーザ光源と、レーザ光源から放射された
レーザビームを通過させて貫通孔と対応した形状、例え
ば円形の断面形状を有する複数のレーザビームに分光す
る回折格子と、回折格子を通過して分光されたレーザビ
ームを所定の反射角で反射させるガルバノスキャンミラ
ーと、反射されたレーザビームを集光する集光レンズな
どを備えた加工装置を用い、マザーシート上に素子1の
それぞれと対応する区画を予め設定して、このマザーシ
ートを移動させながら一つずつの区画に対して所要個数
の貫通孔を同時的に形成する方法などを適用することに
より、効率よく製造することが可能である。
The through holes serving as the via holes 7, 9, and 13 are, for example, an XY table that movably supports a ceramic green sheet mother sheet, a laser light source such as CO 2 or YAG, and a laser light source. A diffraction grating that passes the laser beam emitted from the diffraction grating into a plurality of laser beams having a shape corresponding to the through-hole, for example, a circular cross-sectional shape, and a predetermined reflection of the laser beam that has passed through the diffraction grating. Using a processing device including a galvano scan mirror that reflects light at an angle and a condenser lens that collects the reflected laser beam, sections corresponding to each of the elements 1 are preset on the mother sheet, and Efficient production is achieved by applying a method of simultaneously forming the required number of through holes in each section while moving the sheet. It is possible to.

【0031】このようなレーザビームの照射を利用した
場合には、直径が50μmから200μm程度までの貫通
孔を、±10μm程度の位置精度で、セラミックグリー
ンシート8,12,15に対して効率よく形成すること
ができる。したがって、同じ製品寸法で、巻き数の多い
コイルを形成することが可能になる。なお、貫通孔の形
成方法は、上述のようなレーザビームの照射による方法
に限られるものではなく、金型による打ち抜き加工やド
リルによる穿孔などの方法を適用することも可能であ
る。
When such laser beam irradiation is used, through holes having a diameter of about 50 μm to about 200 μm can be efficiently formed in the ceramic green sheets 8, 12, 15 with a positional accuracy of about ± 10 μm. Can be formed. Therefore, it is possible to form a coil having a large number of turns with the same product dimensions. Note that the method of forming the through holes is not limited to the method using the laser beam irradiation as described above, and a method such as punching using a die or drilling using a drill can also be applied.

【0032】それから、所定位置に形成されたバイアホ
ール7どうしが互いに重なりあうように所定枚数のセラ
ミックグリーンシート8を積層するとともに、帯状接続
電極5及び引出電極6となる導体パターン10,11が
形成されたセラミックグリーンシート12の所定枚数を
バイアホール9がバイアホール7に重なるようにしてセ
ラミックグリーンシート8の上面側に積層し、さらに、
帯状接続電極5となる導体パターン14が形成されたセ
ラミックグリーンシート15の所定枚数をバイアホール
13がバイアホール7に重なるようにセラミックグリー
ンシート8の下面側に積層する。なお、この際における
セラミックグリーンシート12,15の積層枚数は、帯
状接続電極5及び引出電極6の断面積がバイアホール7
の断面積と同等程度となるように設定されている。
Then, a predetermined number of ceramic green sheets 8 are laminated so that the via holes 7 formed at predetermined positions overlap each other, and at the same time, conductor patterns 10 and 11 serving as strip-shaped connection electrodes 5 and extraction electrodes 6 are formed. A predetermined number of the obtained ceramic green sheets 12 are laminated on the upper surface side of the ceramic green sheet 8 such that the via holes 9 overlap the via holes 7, and further,
A predetermined number of the ceramic green sheets 15 on which the conductor patterns 14 to be the strip-shaped connection electrodes 5 are formed are laminated on the lower surface side of the ceramic green sheet 8 such that the via holes 13 overlap the via holes 7. In this case, the number of laminated ceramic green sheets 12 and 15 is such that the cross-sectional area of the strip-shaped connection electrode 5 and the extraction electrode 6 is
Is set to be approximately the same as the cross-sectional area of.

【0033】そしてさらに、バイアホール及び導体パタ
ーンが形成されていないセラミックグリーンシート16
の所定枚数ずつを、セラミックグリーンシート12の上
面側とセラミックグリーンシート15の下面側とに積層
した後、セラミックグリーンシート8,12,15,1
6の全体を積層方向Aに沿って圧着することにより、積
層体17(未焼成の素子1)が作製される。
Further, the ceramic green sheet 16 in which the via hole and the conductor pattern are not formed is provided.
Are laminated on the upper surface side of the ceramic green sheet 12 and the lower surface side of the ceramic green sheet 15, and then the ceramic green sheets 8, 12, 15, 1
6 is pressed along the laminating direction A to produce a laminate 17 (unfired element 1).

【0034】なお、これらセラミックグリーンシート
8,12,15,16の全体としての積層枚数が多い場
合には、バイアホール7どうしの積層部が圧着時に座屈
を起こすことがあるので、ある程度以上の枚数を積層す
る場合には、セラミックグリーンシート8,12,1
5,16の1枚又は2枚以上を積層するたびに、比較的
低い圧力で仮圧着しながら積層を行い、所定枚数積層し
た後、本圧着することにより積層体を形成することが好
ましい。
If the number of the ceramic green sheets 8, 12, 15, 16 as a whole is large, the laminated portions of the via holes 7 may buckle during the pressing, so that the ceramic green sheets 8, 12, 15, 16 may be buckled. When laminating a number of sheets, the ceramic green sheets 8, 12, 1
Each time one or two or more of the layers 5 and 16 are laminated, it is preferable to perform lamination while temporarily compressing at a relatively low pressure, and after laminating a predetermined number of layers, it is preferable to form a laminate by performing final compression.

【0035】また、セラミックグリーンシート8,1
2,15,16の積層順序には、特別の制約はなく、各
セラミックグリーンシートを種々の任意の順序で積層す
るように構成することが可能である。
Further, the ceramic green sheets 8, 1
There is no particular restriction on the stacking order of 2, 15, and 16, and the ceramic green sheets can be stacked in various arbitrary orders.

【0036】上記のようにして作製された積層体17
(未焼成の素子1)においては、セラミックグリーンシ
ート12,15に形成された、帯状接続電極5となる導
体パターン10,14の各々が、バイアホール9,13
を介してセラミックグリーンシート8のバイアホール7
と電気的に接続される結果、コイル中心軸が積層方向A
と直交する積層型のコイル2が積層体17の内部に形成
される。
The laminate 17 manufactured as described above
In the (green element 1), the conductor patterns 10 and 14, which are formed on the ceramic green sheets 12 and 15 and serve as the strip-shaped connection electrodes 5, respectively have via holes 9 and 13.
Via holes 7 in ceramic green sheet 8
Electrically connected to the coil, the coil center axis is
Is formed inside the laminate 17.

【0037】ところで、実際の製造工程では、バイアホ
ール7が形成された大面積のマザーセラミックグリーン
シートと、多数の帯状接続電極5及び引出電極6となる
導体パターン10,11が形成された大面積のマザーセ
ラミックグリーンシートと、多数の帯状接続電極5とな
る導体パターン14が形成された大面積のマザーセラミ
ックグリーンシートと、バイアホールや導体パターンの
形成されていない大面積のマザーセラミックグリーンシ
ートとを互いに積層したうえで圧着することによって積
層ブロック(マザーブロック)を作製した後、この積層
ブロックを所定の切断線に沿って切断、分割することに
より、同時に個々の積層体17を作製する方法が適用さ
れることになる。
In the actual manufacturing process, a large-area mother ceramic green sheet having via holes 7 formed therein and a large area having a large number of strip-shaped connection electrodes 5 and conductive patterns 10 and 11 serving as extraction electrodes 6 formed therein. Mother ceramic green sheet, a large-area mother ceramic green sheet having a large number of conductive patterns 14 serving as strip-shaped connection electrodes 5 formed thereon, and a large-area mother ceramic green sheet having no via hole or conductive pattern formed therein. A method of producing a laminated block (mother block) by laminating and crimping each other and then cutting and dividing this laminated block along a predetermined cutting line to simultaneously produce individual laminated bodies 17 is applied. Will be done.

【0038】なお、この実施形態1の積層型インダクタ
においては、積層体17の積層方向Aとコイル中心軸と
が直交するように構成されているので、大きな切断代を
必要とし、加工時間が長くなるダイシングソー(砥石状
の回転刃)を用いずに切断することも可能であることか
ら、切断代をほとんど必要としない剃刀状の押し切り刃
を用いて切断することが可能になり、製造工程を簡略化
することが可能になる。
In the laminated inductor according to the first embodiment, since the laminating direction A of the laminated body 17 is orthogonal to the coil center axis, a large cutting margin is required, and the processing time is long. Since it is possible to cut without using a dicing saw (grinding wheel-shaped rotary blade), it is possible to cut using a razor-shaped push-cutting blade that hardly requires a cutting allowance. It can be simplified.

【0039】それから、上述のようにして作製した未焼
成の積層体17を脱脂焼成処理して素子1を作製した
後、素子1の両端面に、導電ペーストを塗布して焼き付
けることにより、コイル2の両端部と導通する入出力用
外部電極3を形成する。これにより、図1に示すような
積層型インダクタが得られる。なお、この積層型インダ
クタは、入出力用外部電極3が素子1の水平方向(横方
向)両端側にある姿勢をとった場合にコイル2が横巻状
態となる、いわゆるコイル横巻タイプの積層型コイル部
品である。
Then, the unsintered laminate 17 produced as described above is degreased and fired to produce the element 1, and a conductive paste is applied to both end faces of the element 1 and baked, thereby obtaining the coil 2. Are formed with the input / output external electrodes 3 which are electrically connected to both ends. Thus, a multilayer inductor as shown in FIG. 1 is obtained. This multilayer inductor is a so-called coil-horizontal-type laminated type in which the coil 2 is in a horizontal-winding state when the input / output external electrodes 3 are positioned at both ends of the element 1 in the horizontal direction (lateral direction). Mold coil parts.

【0040】この実施形態1の積層型インダクタにおい
ては、素子1の積層方向Aとコイル中心軸とが互いに直
交しているので、積層方向Aとコイル中心軸とが平行で
ある従来の構成では1kgf程度であった抗折強度を3〜
4kgf程度まで高めることが可能になる。特に、ガラス
を主成分とする非磁性体セラミックを用いた高周波用イ
ンダクタの場合には、抗折強度を5倍以上にまで高める
ことができる。
In the multilayer inductor of the first embodiment, since the lamination direction A of the element 1 and the coil center axis are orthogonal to each other, the conventional configuration in which the lamination direction A is parallel to the coil center axis is 1 kgf. The bending strength was about 3 ~
It can be increased to about 4kgf. In particular, in the case of a high-frequency inductor using a nonmagnetic ceramic mainly composed of glass, the transverse rupture strength can be increased to 5 times or more.

【0041】また、この積層型インダクタにおいては、
帯状接続電極5及び引出電極6が複数層構造を有してお
り、積層数を増やすことにより、バイアホール4の断面
積と同等程度の断面積が確保されるまで電極厚みを大き
くすることができるため、従来の積層型インダクタにお
いては、100MHzでのインダクタンスが10nH程
度であったのに対し、この実施形態1の積層型インダク
タにおいては、100MHzでのインダクタンスが約1
00nH程度になることが確認されている。なお、複数
層構造の帯状接続電極5及び引出電極6を形成する態様
としては、上述のように単層構造の導体パターンを形成
したセラミックグリーンシートを複数枚積層するととも
に、各単層構造の導体パターンをバイアホールにより接
続する態様の他に、一枚のセラミックグリーンシートに
複数層構造の導体パターンを形成し、これを複数枚積層
して、各複数層構造の導体パターンをバイアホールによ
り接続する態様、あるいは一枚のセラミックグリーンシ
ートに複数層構造の導体パターンを形成する態様などが
例示されるが、これらはいずれも本願発明の範囲に含ま
れるものである。
In this laminated inductor,
The strip-shaped connection electrode 5 and the extraction electrode 6 have a multi-layer structure, and by increasing the number of layers, the electrode thickness can be increased until a cross-sectional area equivalent to the cross-sectional area of the via hole 4 is secured. Therefore, the inductance at 100 MHz is about 10 nH in the conventional multilayer inductor, whereas the inductance at 100 MHz is about 1 nH in the multilayer inductor of the first embodiment.
It has been confirmed to be about 00 nH. In addition, as a mode of forming the strip-shaped connection electrode 5 and the extraction electrode 6 having a multi-layer structure, a plurality of ceramic green sheets each having a conductor pattern having a single-layer structure as described above are stacked, In addition to the mode in which the patterns are connected by via holes, a conductor pattern having a multi-layer structure is formed on one ceramic green sheet, a plurality of these are laminated, and the conductor patterns having the multi-layer structure are connected by via holes. Examples include an embodiment and an embodiment in which a conductor pattern having a multi-layer structure is formed on one ceramic green sheet. These are all included in the scope of the present invention.

【0042】また、この実施形態1では、素子1の内部
に単一のコイル2を配設しているが、2個以上のコイル
を並列的に配設することも可能である。なお、2個のコ
イルが並列的に配設された積層型インダクタであれば、
トランスとして使用することも可能である。例えば、2
個のコイルが並列的に配設された積層型コイル部品を形
成する場合、図3に示すように、上記実施形態1の場合
に準じて、一枚のシートに導体パターン、バイアホール
などが2組ずつ形成されたセラミックグリーンシートを
用意し、これを積層することにより、上記実施形態1の
積層型インダクタを製造する場合と同様の方法で製造す
ることができる。なお、図3においては、図1及び図2
と同一又は相当する部分に同一符号を付している。
In the first embodiment, the single coil 2 is provided inside the element 1. However, it is also possible to provide two or more coils in parallel. In the case of a multilayer inductor in which two coils are arranged in parallel,
It can also be used as a transformer. For example, 2
As shown in FIG. 3, when forming a laminated coil component in which a plurality of coils are arranged in parallel, a conductor sheet, a via hole, etc. By preparing the ceramic green sheets formed in pairs and laminating them, it is possible to manufacture them by the same method as in the case of manufacturing the multilayer inductor of the first embodiment. In FIG. 3, FIGS. 1 and 2
The same or corresponding parts are denoted by the same reference characters.

【0043】[実施形態2]図4は本願発明の他の実施
形態(実施形態2)にかかる積層型インダクタを示す外
観斜視図、図5は積層型インダクタを構成する積層体を
示す分解斜視図である。この実施形態2の積層型インダ
クタにおいては、複数層構造の引出電極6が素子(積層
体)1の積層方向Aの略中央部に、積層面と平行(積層
方向Aに直交する方向)に配設されている。なお、この
実施形態2の積層型インダクタの全体構成を含むその他
の構成は、上記実施形態1の積層型インダクタの場合と
同様であることから、重複を避けるため説明を省略す
る。なお、図4及び図5においては、図1及び図2と同
一又は相当する部分に同一符号を付している。
[Embodiment 2] FIG. 4 is an external perspective view showing a multilayer inductor according to another embodiment (Embodiment 2) of the present invention, and FIG. 5 is an exploded perspective view showing a multilayer body constituting the multilayer inductor. It is. In the multilayer inductor according to the second embodiment, the extraction electrode 6 having a multi-layer structure is disposed substantially at the center of the element (laminate) 1 in the lamination direction A and parallel to the lamination plane (in a direction perpendicular to the lamination direction A). Has been established. The other configuration including the entire configuration of the multilayer inductor of the second embodiment is the same as that of the multilayer inductor of the first embodiment, and therefore the description is omitted to avoid duplication. 4 and 5, the same or corresponding parts as those in FIGS. 1 and 2 are denoted by the same reference numerals.

【0044】この実施形態2の積層型インダクタは、図
5に示すように、(1)所定位置ごとにバイアホール7
(最終的にバイアホール4(図4)となる)と、前記実
施形態1の場合と同様の、所定形状の引出電極6となる
導体パターン11が形成されたセラミックグリーンシー
ト18と、(2)所定位置ごとにバイアホール7(最終的
にバイアホール4(図4)となる)が形成されたセラミ
ックグリーンシート8(8a,8b)と、(3)所定位置
ごとにバイアホール9(最終的にバイアホール4(図
4)との接続部分となる)が形成され、かつ、これらの
バイアホール9を含む、所定形状の帯状接続電極5(図
4)となる導体パターン10が形成されたセラミックグ
リーンシート19と、(4)所定位置ごとにバイアホール
13(最終的にバイアホール4(図4)との接続部分と
なる)が形成され、かつ、これらのバイアホール13を
含む、所定形状の帯状接続電極5(図4)となる導体パ
ターン14が形成されたセラミックグリーンシート20
と、(5)バイアホール及び導体パターンが形成されてい
ない外層用のセラミックグリーンシート16の5種類の
セラミックグリーンシートを用意し、上記実施形態1の
場合に準じて、これら5種類のセラミックグリーンシー
トを、積層、圧着した後、焼成、外部電極の形成などの
工程を経て作製される。
As shown in FIG. 5, the multilayer inductor according to the second embodiment has (1) a via hole 7 for each predetermined position.
(Finally via holes 4 (FIG. 4)), and a ceramic green sheet 18 on which a conductor pattern 11 to be the extraction electrode 6 having a predetermined shape is formed, as in the case of the first embodiment (2). A ceramic green sheet 8 (8a, 8b) in which a via hole 7 (finally a via hole 4 (FIG. 4)) is formed at each predetermined position; and (3) a via hole 9 (finally, at each predetermined position) A ceramic green on which a conductive pattern 10 serving as a strip-shaped connection electrode 5 (FIG. 4) having a predetermined shape including these via holes 9 is formed. A sheet 19 and (4) via holes 13 (to be finally connected to via holes 4 (FIG. 4)) are formed at predetermined positions, and a predetermined band-like shape including these via holes 13 is formed. Connection Ceramic green sheets 20 on which the conductor pattern 14 serving as electrode 5 (Fig. 4) is formed
And (5) preparing five types of ceramic green sheets 16 for the outer layer on which no via hole and conductive pattern are formed, and according to the first embodiment, these five types of ceramic green sheets are prepared. Are laminated and pressure-bonded, and then fired and formed with external electrodes.

【0045】この実施形態2の積層型インダクタにおい
ては、引出電極6が素子1(積層体17)の積層方向A
の略中央部に配設されているので、実装基板上の電極と
引出電極6との間に浮遊容量が発生することを抑制する
ことが可能になり、実装時の方向性をなくして、実装工
程における作業性を向上させることが可能になる。な
お、この実施形態2の積層型インダクタにおいては、そ
の他の点においても、上記実施形態1の積層型インダク
タと同様の効果を得ることができる。
In the multilayer inductor according to the second embodiment, the extraction electrode 6 is arranged in the stacking direction A of the element 1 (stacked body 17).
Is arranged at substantially the center of the mounting board, it is possible to suppress the generation of stray capacitance between the electrode on the mounting board and the extraction electrode 6, and to eliminate the directionality during mounting, Workability in the process can be improved. In the multilayer inductor of the second embodiment, the same effects as those of the multilayer inductor of the first embodiment can be obtained in other respects.

【0046】[実施形態3]図6は本願発明のさらに他
の実施形態(実施形態3)にかかる積層型LC複合部品
を示す外観斜視図である。この実施形態3の積層型LC
複合部品においては、積層体である素子1の両側面中央
部から、上下両面側に回り込むように、コイル2(主と
してバイアホール4)と対向する一対の容量取得用外部
電極40が配設されている。
[Embodiment 3] FIG. 6 is an external perspective view showing a laminated LC composite component according to still another embodiment (Embodiment 3) of the present invention. Laminated LC of Embodiment 3
In the composite component, a pair of capacitance acquisition external electrodes 40 facing the coil 2 (mainly the via hole 4) are provided so as to extend from the center of both sides of the element 1 as a laminate to the upper and lower sides. I have.

【0047】すなわち、この実施形態3の積層型LC複
合部品は、実施形態1で説明した積層型インダクタを構
成する素子1に、容量取得用外部電極40を配設したも
のであり、容量取得用外部電極40が、主として、コイ
ル2を構成するバイアホール4と対向するように配設さ
れている。
That is, the laminated LC composite component according to the third embodiment is obtained by disposing the capacitance acquiring external electrode 40 on the element 1 constituting the laminated inductor described in the first embodiment. The external electrode 40 is mainly disposed so as to face the via hole 4 forming the coil 2.

【0048】なお、容量取得用外部電極40は、入出力
用外部電極3と同様、素子1の所定の領域に導電ペース
トを塗布して焼き付ける方法などにより形成することが
可能である。この実施形態3の積層型インダクタの全体
構成を含むその他の構成は、上記実施形態1の積層型イ
ンダクタの場合と同様であることから、重複を避けるた
め説明を省略する。なお、図6においては、図1及び図
2と同一又は相当する部分に同一符号を付している。
The external electrode 40 for obtaining capacitance can be formed by applying a conductive paste to a predetermined region of the element 1 and baking it, as in the case of the external electrode 3 for input and output. Other configurations including the entire configuration of the multilayer inductor of the third embodiment are the same as those of the multilayer inductor of the first embodiment, and therefore, description thereof will be omitted to avoid duplication. In FIG. 6, the same or corresponding parts as those in FIGS. 1 and 2 are denoted by the same reference numerals.

【0049】上述のように、実施形態1の積層型インダ
クタを構成する素子1の表面の所定の位置に、コイル
(実施形態では、主としてコイル2を構成するバイアホ
ール4)と対向する容量取得用外部電極40を配設する
だけで、バイアホール4と容量取得用外部電極40との
間で必要な容量を確保することが可能になり、積層型L
C複合部品を容易に形成することが可能になる。
As described above, at a predetermined position on the surface of the element 1 constituting the multilayer inductor according to the first embodiment, the capacitance (in the embodiment, mainly the via hole 4 constituting the coil 2) facing the coil is used for obtaining the capacitance. Only by arranging the external electrode 40, it is possible to secure a necessary capacitance between the via hole 4 and the external electrode 40 for obtaining capacitance.
C composite parts can be easily formed.

【0050】なお、この実施形態3では、実施形態1の
積層型インダクタを構成する素子1に容量取得用外部電
極40を配設するように構成しているが、容量取得用外
部電極40の具体的な形状や配設位置などには、特別の
制約はなく、例えば、実施形態2で説明した積層型イン
ダクタを構成する素子1に容量取得用外部電極40を配
設するように構成することも可能である。
In the third embodiment, the capacitance acquiring external electrode 40 is provided on the element 1 constituting the multilayer inductor of the first embodiment. There are no particular restrictions on the general shape, arrangement position, and the like. For example, it may be configured such that the capacitance acquisition external electrode 40 is arranged on the element 1 constituting the multilayer inductor described in the second embodiment. It is possible.

【0051】[実施形態4]図7は本願発明のさらに他
の実施形態(実施形態4)にかかる積層型LC複合部品
を示す外観斜視図、図8はこの積層型LC複合部品を構
成する積層体を示す分解斜視図である。この実施形態4
の積層型LC複合部品においては、積層体である素子1
の内部の、帯状接続電極5(図7)よりも積層方向Aの
外側の領域(上側領域及び下側領域)1aに、帯状接続
電極5と対向する一対の容量取得用内部電極42が配設
されている。そして、容量取得用内部電極42は、素子
1の表面の両側面に形成された容量取得用外部電極を兼
ねる一対のグランド接続用外部電極40aに接続されて
いる。なお、この実施形態4の積層型LC複合部品にお
いては、素子1の、容量取得用内部電極42が配設され
る上側領域及び下側領域1aは誘電体セラミックを主成
分とする材料から形成されている。
[Embodiment 4] FIG. 7 is an external perspective view showing a laminated LC composite component according to still another embodiment (Embodiment 4) of the present invention, and FIG. 8 is a laminate constituting the laminated LC composite component. It is an exploded perspective view showing a body. Embodiment 4
In the laminated type LC composite part, the element 1
In a region (upper region and lower region) 1a outside the band-shaped connection electrode 5 (FIG. 7) in the stacking direction A, a pair of capacitance acquisition internal electrodes 42 facing the band-shaped connection electrode 5 is disposed. Have been. The capacitance acquisition internal electrodes 42 are connected to a pair of ground connection external electrodes 40a that also serve as capacitance acquisition external electrodes formed on both sides of the surface of the element 1. In the multilayer LC composite component of the fourth embodiment, the upper region and the lower region 1a of the element 1 where the capacitance acquisition internal electrodes 42 are provided are formed of a material mainly composed of a dielectric ceramic. ing.

【0052】この実施形態4の積層型LC複合部品は、
帯状接続電極5と対向する一対の容量取得用内部電極4
2と、容量取得用内部電極42が接続される、容量取得
用外部電極を兼ねるグランド接続用外部電極40aを備
えており、さらに、容量取得用内部電極42が配設され
る上側領域及び下側領域1aが誘電体セラミックを主成
分とする材料から形成されているので、上記実施形態3
の積層型LC複合部品の場合に比べて、さらに大きい容
量を確保することが可能になり、本願発明をさらに実効
あらしめることができる。
The laminated LC composite component of the fourth embodiment is
A pair of capacitance acquiring internal electrodes 4 facing the strip-shaped connection electrodes 5
2 and a ground connection external electrode 40a also serving as a capacitance acquisition external electrode to which the capacitance acquisition internal electrode 42 is connected, and further, an upper region and a lower side where the capacitance acquisition internal electrode 42 is disposed. Since the region 1a is formed from a material containing a dielectric ceramic as a main component, the third embodiment is used.
It is possible to secure a larger capacity as compared with the case of the laminated type LC composite part, and the present invention can be made more effective.

【0053】なお、この実施形態4の積層型LC複合部
品の全体構成を含むその他の構成は、上記実施形態1の
積層型インダクタ、及び上記実施形態3の積層型LC複
合部品と同様であることから、重複を避けるため説明を
省略する。なお、図7及び8においては、図1、図2及
び図6と同一又は相当する部分に同一符号を付してい
る。また、図7においては、容量取得用内部電極42や
グランド接続用外部電極40aを示す必要があることか
ら、素子1の内部の構造の図示を省略しているが、素子
1の内部の構造は図6とまったく同様である。
Other configurations including the entire configuration of the laminated LC composite component of the fourth embodiment are the same as those of the laminated inductor of the first embodiment and the laminated LC composite component of the third embodiment. Therefore, description is omitted to avoid duplication. 7 and 8, the same or corresponding parts as those in FIGS. 1, 2 and 6 are denoted by the same reference numerals. In FIG. 7, the internal structure of the element 1 is omitted because the capacitance acquisition internal electrode 42 and the ground connection external electrode 40a need to be shown. This is exactly the same as FIG.

【0054】また、この実施形態4の積層型LC複合部
品は、例えば、図8示すように、(1)所定位置ごとにバ
イアホール7(最終的にバイアホール4(図6参照)と
なる)が形成されたセラミックグリーンシート8と、
(2)所定位置ごとにバイアホール9(最終的にバイアホ
ール4(図6参照)との接続部分となる)が形成され、
かつ、これらのバイアホール9を含む、所定形状の帯状
接続電極5(図6参照)となる導体パターン10,及び
前記実施形態1の場合と同様の、所定形状の引出電極6
となる導体パターン11が形成されたセラミックグリー
ンシート12と、(3)所定位置ごとにバイアホール13
(最終的にバイアホール4(図6参照)との接続部分と
なる)が形成され、かつ、これらのバイアホール13を
含む、所定形状の帯状接続電極5(図6参照)となる導
体パターン14が形成されたセラミックグリーンシート
15と、(4)バイアホール及び導体パターンが形成され
ていない外層用のセラミックグリーンシート16と、
(5)平面視十字形状で、一方の端部と該端部に対向する
他方の端部がシート端面にまで達するような、容量取得
用内部電極42となる導体パターン43が形成されたセ
ラミックグリーンシート44の5種類のセラミックグリ
ーンシートを用意し、上記実施形態1の場合に準じて、
これら5種類のセラミックグリーンシートを、積層、圧
着した後、焼成、外部電極の形成などの工程を経て作製
される。
Further, as shown in FIG. 8, for example, as shown in FIG. 8, the laminated type LC composite component of the fourth embodiment has (1) a via hole 7 at each predetermined position (finally a via hole 4 (see FIG. 6)). A ceramic green sheet 8 formed with
(2) Via holes 9 (finally connecting portions with via holes 4 (see FIG. 6) are formed at predetermined positions,
In addition, a conductor pattern 10 including the via holes 9 and serving as a band-shaped connection electrode 5 having a predetermined shape (see FIG. 6), and an extraction electrode 6 having a predetermined shape similar to that of the first embodiment.
And (3) a via hole 13 at each predetermined position.
(Finally, a connection portion with via hole 4 (see FIG. 6)) is formed, and conductor pattern 14 serving as band-shaped connection electrode 5 (see FIG. 6) having a predetermined shape including via holes 13 is formed. And (4) a ceramic green sheet 16 for an outer layer where no via hole and conductive pattern are formed,
(5) A ceramic green having a cross shape in a plan view, in which a conductor pattern 43 serving as an internal electrode 42 for capacitance acquisition is formed such that one end and the other end opposite to the end reach the sheet end surface. Five kinds of ceramic green sheets of the sheet 44 are prepared, and according to the case of the first embodiment,
After these five types of ceramic green sheets are laminated and pressure-bonded, they are manufactured through steps such as firing and formation of external electrodes.

【0055】なお、本願発明は、上記実施形態1〜4に
限定されるものではなく、発明の要旨の範囲内におい
て、種々の応用、変形を加えることが可能である。
It should be noted that the present invention is not limited to the first to fourth embodiments, and various applications and modifications can be made within the scope of the invention.

【0056】[0056]

【発明の効果】上述のように、本願発明(請求項1)の
積層型コイル部品は、複数のバイアホールのうちの所定
のバイアホールの積層方向の一方側端部どうし及び所定
のバイアホールの積層方向の他方側端部どうしを、積層
面と平行に(積層方向に直交する方向に)配設された複
数層構造の帯状接続電極により接続して、コイル中心軸
が積層方向と直交するコイルを形成するとともに、積層
面と平行に配設された複数層構造の引出電極により該コ
イルを入出力用外部電極と接続するようにしているの
で、製品の大型化を招くことなく、導体抵抗を低減する
ことができる。すなわち、帯状接続電極及び引出電極を
複数層構造として、バイアホールの電極断面積と同等程
度の断面積が確保されるまで帯状接続電極及び引出電極
の厚みを大きくする(積層数を増やす)ことにより、小
型化を阻害することなく、導体抵抗を低減して、大電流
への対応性を向上させることが可能になる。
As described above, the laminated coil component of the present invention (Claim 1) is characterized in that one end of one of the plurality of via holes in the laminating direction of the predetermined via hole and one of the predetermined via holes are formed. The other end portions in the stacking direction are connected to each other by a strip-shaped connection electrode having a multi-layer structure disposed in parallel (in a direction orthogonal to the stacking direction) with the stacking surface, and a coil whose central axis is orthogonal to the stacking direction. And the coil is connected to the input / output external electrode by a multi-layered lead electrode arranged in parallel with the lamination surface, so that the conductor resistance can be reduced without increasing the size of the product. Can be reduced. That is, the thickness of the strip-shaped connection electrode and the extraction electrode is increased (the number of layers is increased) until the cross-section area equivalent to the electrode cross-section area of the via hole is secured in a multi-layer structure of the strip-shaped connection electrode and the extraction electrode. In addition, it is possible to reduce the conductor resistance without impairing the miniaturization and improve the responsiveness to a large current.

【0057】また、引出電極が積層体の最外層付近に配
設されている場合には、実装基板上の電極と引出電極と
の間に浮遊容量が発生する場合があり、高周波特性が劣
化しやすくなることがあるため、実装時の方向性に配慮
する必要があるが、請求項2の積層型コイル部品のよう
に、引出電極を、積層体の積層方向の略中央部に、か
つ、積層面と平行に配設するようにした場合、実装基板
上の電極と引出電極との間に浮遊容量が発生することを
抑制することが可能になり、実装時の方向性をなくし
て、実装工程における作業性を向上させることができ
る。
When the extraction electrode is disposed near the outermost layer of the laminate, a floating capacitance may be generated between the electrode on the mounting board and the extraction electrode, deteriorating high-frequency characteristics. It is necessary to consider the directionality at the time of mounting because it may be easier. However, as in the laminated coil component of claim 2, the extraction electrode is disposed substantially at the center of the laminated body in the laminating direction and is laminated. If it is arranged parallel to the surface, it is possible to suppress the generation of stray capacitance between the electrode on the mounting board and the extraction electrode, and it is possible to eliminate the directionality during mounting and to reduce the mounting process. Operability can be improved.

【0058】また、請求項3の積層型コイル部品のよう
に、積層体の表面に、バイアホールと帯状接続電極から
構成されるコイルと対向する容量取得用外部電極を配設
するようにした場合、積層体の表面に容量取得用外部電
極を配設するだけで、バイアホールと容量取得用外部電
極との間で必要な容量を確保することが可能になり、容
易に積層型LC複合部品を構成することができる。
Further, in the case of the laminated coil component according to the third aspect, a capacitance acquiring external electrode facing the coil constituted by the via hole and the strip-shaped connection electrode is provided on the surface of the laminated body. By simply arranging the external electrode for capacitance acquisition on the surface of the laminate, it is possible to secure the required capacitance between the via hole and the external electrode for capacitance acquisition, and the laminated LC composite component can be easily manufactured. Can be configured.

【0059】また、請求項4の積層型コイル部品のよう
に、帯状接続電極よりも積層方向外側の一方側及び他方
側の少なくとも一方の領域に、帯状接続電極と対向する
容量取得用内部電極を配設するとともに、積層体の表面
にグランド接続用外部電極を配設し、容量取得用内部電
極をグランド接続用外部電極に接続するようにした場
合、請求項3にかかる積層型コイル部品の場合よりも大
きい容量を確保することが可能になり、特性設計の自由
度を向上させることができる。
Further, as in the laminated coil component of the fourth aspect, the capacitance acquisition internal electrode facing the band-shaped connection electrode is provided in at least one region on one side and the other side outside the band-shaped connection electrode in the lamination direction. 4. In the case of the laminated coil component according to claim 3, wherein the external electrode for ground connection is disposed on the surface of the laminate, and the internal electrode for capacitance acquisition is connected to the external electrode for ground connection. A larger capacity can be secured, and the degree of freedom in characteristic design can be improved.

【0060】また、請求項5の積層型コイル部品のよう
に、積層体の、容量取得用内部電極が配設される領域を
誘電体セラミックを主成分とする材料から構成するよう
にした場合、さらに大きい容量を確保することが可能に
なり、本願発明をより実効あらしめることができる。
Further, in the case where the region of the laminated body where the capacitance acquiring internal electrode is provided is made of a material mainly composed of a dielectric ceramic, as in the laminated coil component of the present invention, A larger capacity can be secured, and the present invention can be made more effective.

【0061】また、本願発明(請求項6)の積層型コイ
ル部品の製造方法は、回折格子で分光されたレーザビー
ムを照射してセラミックグリーンシートに貫通孔を形成
した後、この貫通孔に導電ペーストを充填してバイアホ
ールを形成するようにしているので、セラミックグリー
ンシートに対して高精度の貫通孔を、極めて効率よく形
成することが可能になり、本願発明の積層型コイル部品
を効率よく製造することができる。また、レーザビーム
を照射する方法によれば、微細で、精度の高いバイアホ
ールを形成することが可能になるため、同じ製品寸法で
巻き数の多いコイルを形成することが可能になる。
In the method of manufacturing a laminated coil component according to the present invention (claim 6), a laser beam separated by a diffraction grating is irradiated to form a through hole in a ceramic green sheet, and then a conductive hole is formed in the through hole. Since the via hole is formed by filling the paste, it is possible to form a highly accurate through-hole in the ceramic green sheet extremely efficiently, and the laminated coil component of the present invention can be efficiently formed. Can be manufactured. Further, according to the method of irradiating a laser beam, it is possible to form a fine and high-precision via hole, and thus it is possible to form a coil having the same product dimensions and a large number of turns.

【0062】また、請求項7の積層型コイル部品の製造
方法のように、1枚又は2枚以上のセラミックグリーン
シートを積層するたびに仮圧着しながら積層を行い、所
定枚数積層した後、本圧着することにより、コイルパタ
ーンの位置ずれを生じたりすることなく、確実に所望の
積層体を形成することが可能になり、本願発明の積層型
コイル部品をさらに効率よく製造することができる。
Further, as in the method for manufacturing a laminated coil component according to the seventh aspect, each time one or two or more ceramic green sheets are laminated, the green sheets are laminated while being temporarily press-bonded. By crimping, it is possible to reliably form a desired laminated body without causing displacement of the coil pattern, and the laminated coil component of the present invention can be manufactured more efficiently.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本願発明の一実施形態(実施形態1)にかかる
積層型インダクタを示す外観斜視図である。
FIG. 1 is an external perspective view showing a multilayer inductor according to an embodiment (Embodiment 1) of the present invention.

【図2】実施形態1にかかる積層型インダクタを構成す
る積層体を示す分解斜視図である。
FIG. 2 is an exploded perspective view showing a multilayer body constituting the multilayer inductor according to the first embodiment.

【図3】実施形態1の積層型インダクタの変形例にかか
る積層体を示す分解斜視図である。
FIG. 3 is an exploded perspective view showing a multilayer body according to a modification of the multilayer inductor of the first embodiment.

【図4】本願発明の他の実施形態(実施形態2)にかか
る積層型インダクタを示す外観斜視図である。
FIG. 4 is an external perspective view showing a multilayer inductor according to another embodiment (Embodiment 2) of the present invention.

【図5】実施形態2にかかる積層型インダクタを構成す
る積層体を示す分解斜視図である。
FIG. 5 is an exploded perspective view showing a multilayer body constituting the multilayer inductor according to the second embodiment.

【図6】本願発明のさらに他の実施形態(実施形態3)
にかかる積層型LC複合部品を示す外観斜視図である。
FIG. 6 shows still another embodiment of the present invention (Embodiment 3).
1 is an external perspective view showing a laminated LC composite component according to the first embodiment.

【図7】本願発明のさらに他の実施形態(実施形態4)
にかかる積層型LC複合部品を示す外観斜視図である。
FIG. 7 shows still another embodiment of the present invention (Embodiment 4).
1 is an external perspective view showing a laminated LC composite component according to the first embodiment.

【図8】実施形態4にかかる積層型LC複合部品を構成
する積層体を示す分解斜視図である。
FIG. 8 is an exploded perspective view showing a laminate constituting the laminated LC composite component according to the fourth embodiment.

【図9】従来の積層型インダクタを示す外観斜視図であ
る。
FIG. 9 is an external perspective view showing a conventional multilayer inductor.

【図10】従来の積層型インダクタを構成する積層体を
示す分解斜視図である。
FIG. 10 is an exploded perspective view showing a multilayer body constituting a conventional multilayer inductor.

【符号の説明】[Explanation of symbols]

1 素子(積層体) 1a 素子の上側領域及び下側領域 2 コイル 3 入出力用外部電極 4,7,9,13 バイアホール 5 帯状接続電極 6 引出電極 8(8a,8b),12,15,16,18,19,2
0,44セラミックグリーンシート 10,11,14,43 導体パターン 17 未焼成の積層体 40 容量取得用外部電極 40a グランド接続用外部電極 42 容量取得用内部電極 A 積層方向
DESCRIPTION OF SYMBOLS 1 Element (laminated body) 1a Upper area and lower area of element 2 Coil 3 I / O external electrode 4, 7, 9, 13 Via hole 5 Strip connection electrode 6 Extraction electrode 8 (8a, 8b), 12, 15, 16, 18, 19, 2
0,44 Ceramic green sheet 10, 11, 14, 43 Conductor pattern 17 Unfired laminate 40 External electrode for capacity acquisition 40a External electrode for ground connection 42 Internal electrode for capacity acquisition A Stacking direction

───────────────────────────────────────────────────── フロントページの続き (72)発明者 荒川 元 京都府長岡京市天神二丁目26番10号 株式 会社村田製作所内 Fターム(参考) 5E062 DD04 5E070 AA01 AA05 BA12 CB04 CB13 CB17  ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Gen Arakawa 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto F-term in Murata Manufacturing Co., Ltd. (Reference) 5E062 DD04 5E070 AA01 AA05 BA12 CB04 CB13 CB17

Claims (7)

【特許請求の範囲】[Claims] 【請求項1】積層体内部に、積層方向と直交するコイル
中心軸を周回するコイルが配設され、かつ、積層体の両
端面に、コイルの両端部と導通する入出力用外部電極が
配設された構造を有する積層型コイル部品であって、 積層体内部の、積層方向から見た複数の位置に、軸心が
積層方向に沿うように配設されたバイアホールと、 積層体内部に、積層面と平行に配設され、所定のバイア
ホールの積層方向の一方側端部どうし及び所定のバイア
ホールの積層方向の他方側端部どうしを接続することに
より、バイアホールと協働して、コイル中心軸が積層方
向と直交するコイルを構成する複数層構造の帯状接続電
極と、 積層体内部に、積層面と平行に配設され、バイアホール
と帯状接続電極から構成される前記コイルと前記入出力
用外部電極とを接続する複数層構造の引出電極とを具備
することを特徴とする積層型コイル部品。
A coil surrounding a coil central axis orthogonal to a laminating direction is provided inside a laminated body, and input / output external electrodes electrically connected to both ends of the coil are disposed on both end surfaces of the laminated body. A laminated coil component having a structure provided, wherein a via hole is provided at a plurality of positions inside the laminated body as viewed from the laminating direction such that the axis is along the laminating direction, and Is disposed in parallel with the stacking surface, by connecting one end of the predetermined via hole in the stacking direction and the other end of the predetermined via hole in the stacking direction, in cooperation with the via hole. A multi-layered band-shaped connection electrode constituting a coil having a coil center axis orthogonal to the laminating direction; and the coil disposed inside the laminate in parallel with the lamination surface and comprising a via hole and a band-shaped connection electrode. The input / output external electrode Laminated coil component characterized by comprising a lead electrode of the multilayer structure to continue.
【請求項2】前記引出電極が、積層体の積層方向の略中
央部に、かつ、積層面と平行に配設されていることを特
徴とする請求項1記載の積層型コイル部品。
2. The laminated coil component according to claim 1, wherein the extraction electrode is disposed substantially at the center of the laminated body in the laminating direction and parallel to the laminating surface.
【請求項3】積層体の表面に、バイアホールと帯状接続
電極から構成される前記コイルと対向する容量取得用外
部電極が配設されていることを特徴とする請求項1又は
2記載の積層型コイル部品。
3. The laminate according to claim 1, wherein an external electrode for obtaining a capacitance is provided on a surface of the laminate, the external electrode being provided with a via hole and a strip-shaped connection electrode and facing the coil. Type coil parts.
【請求項4】積層体内部の、前記帯状接続電極よりも積
層方向外側の一方側及び他方側の少なくとも一方の領域
に、前記帯状接続電極と対向する容量取得用内部電極が
配設されているとともに、積層体の表面にグランド接続
用外部電極が配設されており、かつ、容量取得用内部電
極がグランド接続用外部電極に接続されていることを特
徴とする請求項3記載の積層型コイル部品。
4. A capacity acquisition internal electrode facing the band-shaped connection electrode is provided in at least one region on the one side and the other side outside the band-shaped connection electrode in the stacking direction inside the laminate. 4. The laminated coil according to claim 3, wherein an external electrode for ground connection is provided on the surface of the multilayer body, and the internal electrode for capacitance acquisition is connected to the external electrode for ground connection. parts.
【請求項5】積層体の、前記容量取得用内部電極が配設
される領域が誘電体セラミックを主成分とする材料から
形成されていることを特徴とする請求項3又は4記載の
積層型コイル部品。
5. The laminate type according to claim 3, wherein a region of the laminate in which the capacitance acquiring internal electrodes are disposed is formed of a material mainly composed of a dielectric ceramic. Coil parts.
【請求項6】請求項1〜5のいずれかに記載の積層型コ
イル部品を製造するための方法であって、 回折格子で分光されたレーザビームを照射してセラミッ
クグリーンシートに貫通孔を形成した後、この貫通孔に
導電ペーストを充填してバイアホールを形成する工程を
具備していることを特徴とする積層型コイル部品の製造
方法。
6. A method for manufacturing a laminated coil component according to claim 1, wherein a through-hole is formed in the ceramic green sheet by irradiating a laser beam separated by a diffraction grating. And forming a via hole by filling the through hole with a conductive paste.
【請求項7】前記バイアホールが形成されたセラミック
グリーンシートを積層して積層体を形成するにあたっ
て、1枚又は2枚以上のセラミックグリーンシートを積
層するたびに仮圧着しながら積層を行い、所定枚数積層
した後、本圧着することにより積層体を形成することを
特徴とする請求項6記載の積層型コイル部品の製造方
法。
7. When laminating the ceramic green sheets having the via holes formed therein to form a laminate, the ceramic green sheets are laminated while temporarily compressing each time one or more ceramic green sheets are laminated. 7. The method for manufacturing a laminated coil component according to claim 6, wherein the laminated body is formed by laminating a number of pieces and then performing full pressure bonding.
JP2001353428A 2000-12-19 2001-11-19 Multilayer coil component and manufacturing method thereof Expired - Lifetime JP3788325B2 (en)

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TW090130744A TW527613B (en) 2000-12-19 2001-12-12 Laminated coil component and its manufacturing method
CNB011445211A CN1175438C (en) 2000-12-19 2001-12-18 Laminated coil parts and production thereof
KR10-2001-0080682A KR100417302B1 (en) 2000-12-19 2001-12-18 Laminated coil component and method of manufacturing same

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JP2000-385054 2000-12-19
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* Cited by examiner, † Cited by third party
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KR100653429B1 (en) * 2005-01-28 2006-12-05 한명희 Multilayered chip-type power inductor and manufacturing method thereof
JP2009111284A (en) * 2007-10-31 2009-05-21 Soshin Electric Co Ltd Electronic component and passive component
CN102057452A (en) * 2008-06-12 2011-05-11 株式会社村田制作所 Electronic component
JP2012064683A (en) * 2010-09-15 2012-03-29 Murata Mfg Co Ltd Lamination coil
CN103035396A (en) * 2011-09-30 2013-04-10 钰铠科技股份有限公司 Lamination type inductance manufacturing process
CN102881403B (en) * 2012-10-18 2015-03-11 深圳顺络电子股份有限公司 Laminated inductor
CN103035390A (en) * 2012-12-24 2013-04-10 深圳顺络电子股份有限公司 Inductance magnetic bead
CN104538175B (en) * 2014-12-19 2017-09-22 深圳顺络电子股份有限公司 A kind of preparation method of laminated sheet type electronic component
KR101883036B1 (en) 2015-12-29 2018-08-24 삼성전기주식회사 Multilayered electronic component and multilayered chip antenna comprising the same

Cited By (139)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7034646B2 (en) 2003-07-04 2006-04-25 Murata Manufacturing Co., Ltd. Multilayer ceramic electronic component, multilayer coil component and process for producing multilayer ceramic electronic component
JP2005026560A (en) * 2003-07-04 2005-01-27 Murata Mfg Co Ltd Laminated ceramic electronic component, laminated coil component, and method for manufacturing laminated ceramic electronic component
WO2005004177A1 (en) * 2003-07-04 2005-01-13 Murata Manufacturing Co. Ltd. Multilayer ceramic electronic component, multilayer coil component and process for producing multilayer ceramic electronic component
CN100382207C (en) * 2003-09-01 2008-04-16 株式会社村田制作所 Laminated coil component and method of producing the same
EP1564761A4 (en) * 2003-09-01 2010-03-31 Murata Manufacturing Co Laminated coil component and method of producing the same
WO2005024863A1 (en) * 2003-09-01 2005-03-17 Murata Manufacturing Co., Ltd. Laminated coil component and method of producing the same
EP1564761A1 (en) * 2003-09-01 2005-08-17 Murata Manufacturing Co., Ltd. Laminated coil component and method of producing the same
US7167070B2 (en) 2003-09-01 2007-01-23 Murata Manufacturing Co., Ltd. Laminated coil component and method of producing the same
JP4492540B2 (en) * 2003-10-10 2010-06-30 株式会社村田製作所 Multilayer coil component and manufacturing method thereof
JPWO2005036566A1 (en) * 2003-10-10 2006-12-28 株式会社村田製作所 Multilayer coil component and manufacturing method thereof
US7176772B2 (en) 2003-10-10 2007-02-13 Murata Manufacturing Co. Ltd. Multilayer coil component and its manufacturing method
WO2005060093A1 (en) * 2003-12-18 2005-06-30 Murata Manufacturing Co., Ltd. Multilayer ceramic electronic component
JP2005228857A (en) * 2004-02-12 2005-08-25 Matsushita Electric Ind Co Ltd High frequency oscillation device
JP2005295102A (en) * 2004-03-31 2005-10-20 Otowa Denki Kogyo Kk Filter
US8676117B2 (en) 2006-01-19 2014-03-18 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8725071B2 (en) 2006-01-19 2014-05-13 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8326223B2 (en) 2006-01-19 2012-12-04 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8078106B2 (en) 2006-01-19 2011-12-13 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
JP2012023752A (en) * 2006-04-14 2012-02-02 Murata Mfg Co Ltd Laminated band pass filter
JPWO2007119356A1 (en) * 2006-04-14 2009-08-27 株式会社村田製作所 Multilayer bandpass filter
WO2007119356A1 (en) * 2006-04-14 2007-10-25 Murata Manufacturing Co., Ltd. Layered band pass filter
JP5142985B2 (en) * 2006-04-14 2013-02-13 株式会社村田製作所 Multilayer bandpass filter
CN102647167A (en) * 2006-04-14 2012-08-22 株式会社村田制作所 Layered band pass filter
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US7671706B2 (en) 2006-04-14 2010-03-02 Murata Manufacturing Co., Ltd High frequency multilayer bandpass filter
KR100956303B1 (en) 2006-04-14 2010-05-10 가부시키가이샤 무라타 세이사쿠쇼 Layered band pass filter
JP2011244503A (en) * 2006-04-14 2011-12-01 Murata Mfg Co Ltd Laminated band pass filter
US9165239B2 (en) 2006-04-26 2015-10-20 Murata Manufacturing Co., Ltd. Electromagnetic-coupling-module-attached article
US8228765B2 (en) 2006-06-30 2012-07-24 Murata Manufacturing Co., Ltd. Optical disc
US8299929B2 (en) 2006-09-26 2012-10-30 Murata Manufacturing Co., Ltd. Inductively coupled module and item with inductively coupled module
US8081121B2 (en) 2006-10-27 2011-12-20 Murata Manufacturing Co., Ltd. Article having electromagnetic coupling module attached thereto
WO2008050689A1 (en) * 2006-10-27 2008-05-02 Murata Manufacturing Co., Ltd. Article with electromagnetically coupled module
US8031124B2 (en) 2007-01-26 2011-10-04 Murata Manufacturing Co., Ltd. Container with electromagnetic coupling module
US8299968B2 (en) 2007-02-06 2012-10-30 Murata Manufacturing Co., Ltd. Packaging material with electromagnetic coupling module
US8390459B2 (en) 2007-04-06 2013-03-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8360324B2 (en) 2007-04-09 2013-01-29 Murata Manufacturing Co., Ltd. Wireless IC device
US8424762B2 (en) 2007-04-14 2013-04-23 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8531346B2 (en) 2007-04-26 2013-09-10 Murata Manufacturing Co., Ltd. Wireless IC device
US8474725B2 (en) 2007-04-27 2013-07-02 Murata Manufacturing Co., Ltd. Wireless IC device
US8632014B2 (en) 2007-04-27 2014-01-21 Murata Manufacturing Co., Ltd. Wireless IC device
US7931206B2 (en) 2007-05-10 2011-04-26 Murata Manufacturing Co., Ltd. Wireless IC device
US8757500B2 (en) 2007-05-11 2014-06-24 Murata Manufacturing Co., Ltd. Wireless IC device
US8264357B2 (en) 2007-06-27 2012-09-11 Murata Manufacturing Co., Ltd. Wireless IC device
US8662403B2 (en) 2007-07-04 2014-03-04 Murata Manufacturing Co., Ltd. Wireless IC device and component for wireless IC device
US8552870B2 (en) 2007-07-09 2013-10-08 Murata Manufacturing Co., Ltd. Wireless IC device
US8191791B2 (en) 2007-07-17 2012-06-05 Murata Manufacturing Co., Ltd. Wireless IC device and electronic apparatus
US8413907B2 (en) 2007-07-17 2013-04-09 Murata Manufacturing Co., Ltd. Wireless IC device and electronic apparatus
US7997501B2 (en) 2007-07-17 2011-08-16 Murata Manufacturing Co., Ltd. Wireless IC device and electronic apparatus
US8400307B2 (en) 2007-07-18 2013-03-19 Murata Manufacturing Co., Ltd. Radio frequency IC device and electronic apparatus
US9460376B2 (en) 2007-07-18 2016-10-04 Murata Manufacturing Co., Ltd. Radio IC device
US7857230B2 (en) 2007-07-18 2010-12-28 Murata Manufacturing Co., Ltd. Wireless IC device and manufacturing method thereof
US9830552B2 (en) 2007-07-18 2017-11-28 Murata Manufacturing Co., Ltd. Radio IC device
US8610636B2 (en) 2007-12-20 2013-12-17 Murata Manufacturing Co., Ltd. Radio frequency IC device
US8915448B2 (en) 2007-12-26 2014-12-23 Murata Manufacturing Co., Ltd. Antenna device and radio frequency IC device
US8360330B2 (en) 2007-12-26 2013-01-29 Murata Manufacturing Co., Ltd. Antenna device and radio frequency IC device
US8070070B2 (en) 2007-12-26 2011-12-06 Murata Manufacturing Co., Ltd. Antenna device and radio frequency IC device
US8797148B2 (en) 2008-03-03 2014-08-05 Murata Manufacturing Co., Ltd. Radio frequency IC device and radio communication system
US8179329B2 (en) 2008-03-03 2012-05-15 Murata Manufacturing Co., Ltd. Composite antenna
US8668151B2 (en) 2008-03-26 2014-03-11 Murata Manufacturing Co., Ltd. Wireless IC device
US8360325B2 (en) 2008-04-14 2013-01-29 Murata Manufacturing Co., Ltd. Wireless IC device, electronic apparatus, and method for adjusting resonant frequency of wireless IC device
US8973841B2 (en) 2008-05-21 2015-03-10 Murata Manufacturing Co., Ltd. Wireless IC device
US9022295B2 (en) 2008-05-21 2015-05-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8960557B2 (en) 2008-05-21 2015-02-24 Murata Manufacturing Co., Ltd. Wireless IC device
US8590797B2 (en) 2008-05-21 2013-11-26 Murata Manufacturing Co., Ltd. Wireless IC device
US7967216B2 (en) 2008-05-22 2011-06-28 Murata Manufacturing Co., Ltd. Wireless IC device
US8047445B2 (en) 2008-05-22 2011-11-01 Murata Manufacturing Co., Ltd. Wireless IC device and method of manufacturing the same
US9281873B2 (en) 2008-05-26 2016-03-08 Murata Manufacturing Co., Ltd. Wireless IC device system and method of determining authenticity of wireless IC device
US8596545B2 (en) 2008-05-28 2013-12-03 Murata Manufacturing Co., Ltd. Component of wireless IC device and wireless IC device
US8011589B2 (en) 2008-06-25 2011-09-06 Murata Manufacturing Co., Ltd. Wireless IC device and manufacturing method thereof
US7871008B2 (en) 2008-06-25 2011-01-18 Murata Manufacturing Co., Ltd. Wireless IC device and manufacturing method thereof
US9077067B2 (en) 2008-07-04 2015-07-07 Murata Manufacturing Co., Ltd. Radio IC device
US8870077B2 (en) 2008-08-19 2014-10-28 Murata Manufacturing Co., Ltd. Wireless IC device and method for manufacturing same
US9231305B2 (en) 2008-10-24 2016-01-05 Murata Manufacturing Co., Ltd. Wireless IC device
US8177138B2 (en) 2008-10-29 2012-05-15 Murata Manufacturing Co., Ltd. Radio IC device
US8692718B2 (en) 2008-11-17 2014-04-08 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US8917211B2 (en) 2008-11-17 2014-12-23 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
US8544759B2 (en) 2009-01-09 2013-10-01 Murata Manufacturing., Ltd. Wireless IC device, wireless IC module and method of manufacturing wireless IC module
US8342416B2 (en) 2009-01-09 2013-01-01 Murata Manufacturing Co., Ltd. Wireless IC device, wireless IC module and method of manufacturing wireless IC module
US8583043B2 (en) 2009-01-16 2013-11-12 Murata Manufacturing Co., Ltd. High-frequency device and wireless IC device
US9104950B2 (en) 2009-01-30 2015-08-11 Murata Manufacturing Co., Ltd. Antenna and wireless IC device
JP2010205750A (en) * 2009-02-27 2010-09-16 Murata Mfg Co Ltd Electronic component
US8690070B2 (en) 2009-04-14 2014-04-08 Murata Manufacturing Co., Ltd. Wireless IC device component and wireless IC device
US8876010B2 (en) 2009-04-14 2014-11-04 Murata Manufacturing Co., Ltd Wireless IC device component and wireless IC device
US8418928B2 (en) 2009-04-14 2013-04-16 Murata Manufacturing Co., Ltd. Wireless IC device component and wireless IC device
US9203157B2 (en) 2009-04-21 2015-12-01 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US9564678B2 (en) 2009-04-21 2017-02-07 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US8976075B2 (en) 2009-04-21 2015-03-10 Murata Manufacturing Co., Ltd. Antenna device and method of setting resonant frequency of antenna device
US8381997B2 (en) 2009-06-03 2013-02-26 Murata Manufacturing Co., Ltd. Radio frequency IC device and method of manufacturing the same
US8810456B2 (en) 2009-06-19 2014-08-19 Murata Manufacturing Co., Ltd. Wireless IC device and coupling method for power feeding circuit and radiation plate
US8847831B2 (en) 2009-07-03 2014-09-30 Murata Manufacturing Co., Ltd. Antenna and antenna module
JP2011049326A (en) * 2009-08-26 2011-03-10 Tdk Corp Inductor and lc composite component
US8680971B2 (en) 2009-09-28 2014-03-25 Murata Manufacturing Co., Ltd. Wireless IC device and method of detecting environmental state using the device
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US9461363B2 (en) 2009-11-04 2016-10-04 Murata Manufacturing Co., Ltd. Communication terminal and information processing system
US9178279B2 (en) 2009-11-04 2015-11-03 Murata Manufacturing Co., Ltd. Wireless IC tag, reader-writer, and information processing system
US8400365B2 (en) 2009-11-20 2013-03-19 Murata Manufacturing Co., Ltd. Antenna device and mobile communication terminal
US8704716B2 (en) 2009-11-20 2014-04-22 Murata Manufacturing Co., Ltd. Antenna device and mobile communication terminal
US8718727B2 (en) 2009-12-24 2014-05-06 Murata Manufacturing Co., Ltd. Antenna having structure for multi-angled reception and mobile terminal including the antenna
US10013650B2 (en) 2010-03-03 2018-07-03 Murata Manufacturing Co., Ltd. Wireless communication module and wireless communication device
US8602310B2 (en) 2010-03-03 2013-12-10 Murata Manufacturing Co., Ltd. Radio communication device and radio communication terminal
US8336786B2 (en) 2010-03-12 2012-12-25 Murata Manufacturing Co., Ltd. Wireless communication device and metal article
US8528829B2 (en) 2010-03-12 2013-09-10 Murata Manufacturing Co., Ltd. Wireless communication device and metal article
US9727765B2 (en) 2010-03-24 2017-08-08 Murata Manufacturing Co., Ltd. RFID system including a reader/writer and RFID tag
US9024837B2 (en) 2010-03-31 2015-05-05 Murata Manufacturing Co., Ltd. Antenna and wireless communication device
US8905316B2 (en) 2010-05-14 2014-12-09 Murata Manufacturing Co., Ltd. Wireless IC device
US9123996B2 (en) 2010-05-14 2015-09-01 Murata Manufacturing Co., Ltd. Wireless IC device
US8424769B2 (en) 2010-07-08 2013-04-23 Murata Manufacturing Co., Ltd. Antenna and RFID device
US9558384B2 (en) 2010-07-28 2017-01-31 Murata Manufacturing Co., Ltd. Antenna apparatus and communication terminal instrument
US8981906B2 (en) 2010-08-10 2015-03-17 Murata Manufacturing Co., Ltd. Printed wiring board and wireless communication system
US8546927B2 (en) 2010-09-03 2013-10-01 Murata Manufacturing Co., Ltd. RFIC chip mounting structure
US8944335B2 (en) 2010-09-30 2015-02-03 Murata Manufacturing Co., Ltd. Wireless IC device
US9166291B2 (en) 2010-10-12 2015-10-20 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US9236651B2 (en) 2010-10-21 2016-01-12 Murata Manufacturing Co., Ltd. Communication terminal device
US8884721B2 (en) 2010-11-09 2014-11-11 Murata Manufacturing Co., Ltd. Laminated LC filter
JP2012105026A (en) * 2010-11-09 2012-05-31 Murata Mfg Co Ltd Laminated lc filter
US9761923B2 (en) 2011-01-05 2017-09-12 Murata Manufacturing Co., Ltd. Wireless communication device
US8991713B2 (en) 2011-01-14 2015-03-31 Murata Manufacturing Co., Ltd. RFID chip package and RFID tag
US8960561B2 (en) 2011-02-28 2015-02-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8613395B2 (en) 2011-02-28 2013-12-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8757502B2 (en) 2011-02-28 2014-06-24 Murata Manufacturing Co., Ltd. Wireless communication device
US8797225B2 (en) 2011-03-08 2014-08-05 Murata Manufacturing Co., Ltd. Antenna device and communication terminal apparatus
US8937576B2 (en) 2011-04-05 2015-01-20 Murata Manufacturing Co., Ltd. Wireless communication device
US8740093B2 (en) 2011-04-13 2014-06-03 Murata Manufacturing Co., Ltd. Radio IC device and radio communication terminal
US9378452B2 (en) 2011-05-16 2016-06-28 Murata Manufacturing Co., Ltd. Radio IC device
US8878739B2 (en) 2011-07-14 2014-11-04 Murata Manufacturing Co., Ltd. Wireless communication device
US8770489B2 (en) 2011-07-15 2014-07-08 Murata Manufacturing Co., Ltd. Radio communication device
US8814056B2 (en) 2011-07-19 2014-08-26 Murata Manufacturing Co., Ltd. Antenna device, RFID tag, and communication terminal apparatus
US9543642B2 (en) 2011-09-09 2017-01-10 Murata Manufacturing Co., Ltd. Antenna device and wireless device
US8905296B2 (en) 2011-12-01 2014-12-09 Murata Manufacturing Co., Ltd. Wireless integrated circuit device and method of manufacturing the same
US8720789B2 (en) 2012-01-30 2014-05-13 Murata Manufacturing Co., Ltd. Wireless IC device
US9692128B2 (en) 2012-02-24 2017-06-27 Murata Manufacturing Co., Ltd. Antenna device and wireless communication device
US10235544B2 (en) 2012-04-13 2019-03-19 Murata Manufacturing Co., Ltd. Inspection method and inspection device for RFID tag
WO2013171923A1 (en) * 2012-05-15 2013-11-21 株式会社 村田製作所 Inductor element
US9424981B2 (en) 2012-05-15 2016-08-23 Murata Manufacturing Co., Ltd. Inductor element

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