JP2002214240A - Analyzing device using measuring chip and measuring chip control device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform inventory control on measuring chips in an analyzing device using the disposable measuring chips. SOLUTION: The analyzing device for making samples adhere to the disposable measuring chips 10 and analyzing the characteristics of the samples through the use of the measuring chips 10 is provided with a storage means for storing the number of the measuring chips 10 delivered to the analyzing device, a tallying means 84 for counting the number of the measured chips 10 used for analysis, a computing means 80 for obtaining the residual amount of the measuring chips 10 by subtracting the number of the used measuring chips counted by the tallying means 84 from the number of the delivered measuring chips stored in the storage means, and an alarming means 82 for issuing an alarm when the residual amount of the measuring chips 10 obtained by the computing means 80 becomes equal to a predetermined number or less.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an analyzer for analyzing characteristics of a sample attached to a measuring chip using a disposable measuring chip, and more particularly, to a function of managing inventory of the measuring chip. The present invention relates to an analyzer provided with:

[0002] The present invention also relates to an apparatus for managing the inventory of measurement chips used in the above-described analyzer.

[0003]

2. Description of the Related Art In a metal, free electrons vibrate collectively to generate a compression wave called a plasma wave. And, the quantization of this compression wave generated on the metal surface is
It is called surface plasmon.

Conventionally, various surface plasmon sensors for quantitatively analyzing a substance in a sample by utilizing the phenomenon that surface plasmons are excited by light waves have been proposed.
Among them, a particularly well-known one uses a system called a Kretschmann configuration (see, for example, JP-A-6-167443).

A surface plasmon sensor using the above system basically has a dielectric block formed, for example, in the shape of a prism, a metal film formed on one surface of the dielectric block and brought into contact with a sample, and a light beam. The light source to be generated and the light beam are set at various angles with respect to the dielectric block so that total reflection conditions can be obtained at the interface between the dielectric block and the metal film, and that total reflection attenuation due to surface plasmon resonance can occur. And an optical system for measuring the intensity of the light beam totally reflected at the interface and detecting the state of surface plasmon resonance, that is, the state of attenuated total reflection.

In order to obtain various angles of incidence as described above, a relatively narrow light beam may be deflected to be incident on the interface, or a component which is incident on the light beam at various angles may be included. As described above, a relatively thick light beam may be incident on the interface in a convergent light state or a divergent light state. In the former case, the light beam whose reflection angle changes with the deflection of the light beam is detected by a small photodetector that moves synchronously with the deflection of the light beam, or by an area sensor extending along the direction of the change in the reflection angle. Can be detected. On the other hand, the latter case can be detected by an area sensor extending in a direction in which all light beams reflected at various reflection angles can be received.

In the surface plasmon sensor having the above structure, when a light beam is made incident on a metal film at a specific incident angle θ _SP equal to or larger than the total reflection angle, an evanescent wave having an electric field distribution is formed in a sample in contact with the metal film. Is generated, and surface plasmons are excited at the interface between the metal film and the sample by the evanescent wave. When the wave number vector of the evanescent light is equal to the wave number of the surface plasmon and the wave number matching is established, both are in a resonance state, and the energy of light is transferred to the surface plasmon. The intensity of the reflected light drops sharply. This decrease in light intensity is generally detected as a dark line by the light detection means.

The above resonance occurs only when the incident beam is p-polarized. Therefore, it is necessary to set in advance so that the light beam is incident as p-polarized light.

If the wave number of the surface plasmon is known from the incident angle θ _{SP at} which the attenuated total reflection (ATR) occurs, the dielectric constant of the sample can be obtained. That is, the wave number of the surface plasmon is K
_{When SP} and the angular frequency of the surface plasmon are ω, c is the speed of light in vacuum, ε _m and ε _s are the metal and the dielectric constant of the sample, respectively, there is the following relationship.

[0010]

(Equation 1) If the dielectric constant ε _s of the sample is known, the concentration of the specific substance in the sample can be determined based on a predetermined calibration curve or the like. Therefore, by knowing the incident angle θ _{SP at} which the reflected light intensity decreases, the dielectric constant of the sample can be determined. Properties related to the index, or refractive index, can be determined.

As similar sensors utilizing attenuated total reflection (ATR), for example, "Spectroscopy", Vol. 47, No. 1 (1998), pp. 21-23 and 26-27.
A leak mode sensor described on the page is also known. This leak mode sensor is basically formed of, for example, a dielectric block formed in a prism shape, a clad layer formed on one surface of the dielectric block, and formed on the clad layer and brought into contact with a sample. An optical waveguide layer, a light source for generating a light beam, and the light beam with respect to the dielectric block, a condition of total reflection is obtained at an interface between the dielectric block and the cladding layer, and the light is guided by the optical waveguide layer. An optical system that enters at various angles so that total reflection attenuation can occur due to wave mode excitation, and the intensity of the light beam totally reflected at the interface is measured to determine the excited state of the waveguide mode, that is, the total reflection attenuation state. And a light detecting means for detecting.

In the leakage mode sensor having the above configuration,
When the light beam is incident on the cladding layer through the dielectric block at an incident angle equal to or greater than the total reflection angle, only light having a specific wave number at a specific incident angle is transmitted through the cladding layer. The light propagates in a guided mode. When the waveguide mode is excited in this way, most of the incident light is taken into the optical waveguide layer, so that total reflection attenuation occurs in which the intensity of light totally reflected at the interface sharply decreases.
Since the wave number of the guided light depends on the refractive index of the sample on the optical waveguide layer, the refractive index of the sample and the characteristics of the sample related thereto are analyzed by knowing the specific incident angle at which the total reflection attenuation occurs. be able to.

Incidentally, in the above-mentioned analyzers such as the surface plasmon sensor and the leak mode sensor, Japanese Patent Application No.
As shown in JP-A-00-212125, a dielectric block and a thin film layer formed thereon (for example, a metal film in a surface plasmon sensor, and a cladding layer and an optical waveguide layer in a leakage mode sensor) are integrated. It is considered that the measurement chip is used as a measurement chip and is disposable.

In this case, for example, the dielectric block is formed into one block including all of the light beam incident surface, the light beam exit surface, and one surface on which the thin film layer is formed, and this block is used as a measurement chip. be able to. Alternatively, a fixed portion fixed to the analyzer main body side including the light beam incident surface and the light beam emitting surface, and a portion replaceable to the fixed portion including one surface on which the thin film layer is formed, including the light beam incident surface and the light emitting surface. And the replaceable portion may be used as a measurement chip.

[0015]

An analyzer using a disposable measurement chip as described above is applied to so-called screening for examining whether or not a substance to be analyzed can bind to a specific protein in the field of drug discovery, for example. It may be done. In such a case, since a huge number of substances are generally subjected to screening, it is not uncommon for the number of measurement chips used in one analyzer to be several hundred thousand per month.

When a large number of measurement chips are consumed every day, if inventory management of the measurement chips is neglected at the site where the analyzer is used, or if an order is mistaken when ordering chips to the supplier of the measurement chips, In addition, there is a serious problem that the analysis chip cannot be analyzed for a whole day due to a shortage of measurement chips.

The present invention has been made in view of the above circumstances, and has as its object to provide an analyzer having a function of managing inventory of measurement chips so as not to cause a shortage of measurement chips at a site where the analyzer is used. And

Another object of the present invention is to provide a measuring chip management device capable of managing inventory of measuring chips used in the above-described analyzer.

[0019]

An analyzer using a measuring chip according to the present invention attaches a sample to a disposable measuring chip as described above, and analyzes the characteristics of the sample using the measuring chip. A storage means for storing the number of measurement chips delivered to the analyzer; a counting means for counting the number of measurement chips used for analysis; and a delivery measurement stored in the storage means. An arithmetic unit for obtaining the remaining number of measuring chips by subtracting the number of used measuring chips counted by the counting unit from the number of chips, and the remaining number of measuring chips obtained by the arithmetic unit is equal to or less than a predetermined number. And a warning means for issuing a warning at times.

In the analyzer using the measuring chip of the present invention having the above-mentioned structure, the measuring chip has a predetermined number N (2 ≦ 2).
N) a chip supply unit that is set together; and a chip set number input unit that inputs the predetermined number N. The warning unit determines that the remaining number of measurement chips is smaller than the predetermined number N. It is desirable to be configured to issue a warning when a warning occurs.

It is preferable that the analyzer using the measuring chip of the present invention has a display means for displaying the remaining amount of the measuring chip obtained by the calculating means.

Further, the analyzer using the measuring chip of the present invention may be provided with a number-of-delivery-chips input means for receiving the operation of inputting the number of the delivered measuring chips and storing the number in the storage means. desirable.

Alternatively, information indicating the number of delivered measurement chips is received from the outside instead of, or in addition to, the delivery chip number input means as described above, and the number of measurement chips indicated by the information is stored in the memory. An information receiving means for storing the information in the means may be provided.

In the analyzer using the measurement chip of the present invention, for example, when the warning is issued, an order information output for outputting information for ordering the measurement chip to a supplier who supplies the measurement chip. Preferably, means are provided. More preferably, the order information output means outputs a display for confirming the order before outputting the information for ordering the measurement chip, and outputs the information after the order confirmation is input.

The analyzer using the measurement chip according to the present invention is preferably configured as an analyzer utilizing the above-described total reflection attenuation. That is, in this case, the analyzer using the measurement chip of the present invention specifically includes a dielectric block, a thin film layer formed on one surface of the dielectric block,
And an analyzer using a measurement chip comprising a sample holding mechanism for holding a sample on the surface of the thin film layer,
A support that supports the plurality of measurement chips, a light source that generates a light beam, and the light beam with respect to the dielectric block, a total reflection condition is obtained at an interface between the dielectric block and the thin film layer, and An optical system that makes incident at various angles of incidence such that attenuated total reflection occurs, an intensity of a light beam that is totally reflected at the interface, and a light detection unit that detects a state of attenuated total reflection; The support is moved and the measuring chips are sequentially arranged at predetermined positions with respect to the optical system and the light detecting means so that the total reflection condition and various incident angles are sequentially obtained for each dielectric block of the measuring chip. And a support driving means.

The analyzer using the measurement chip of the present invention is more specifically configured as a surface plasmon sensor among the analyzers utilizing the attenuated total reflection.
That is, in this case, the analyzer using the measurement chip of the present invention includes a dielectric block, a metal film that is a thin film layer formed on one surface of the dielectric block, and a sample holding device that holds a sample on the surface of the metal film. An analyzer using a measurement chip having a mechanism, comprising: a support for supporting a plurality of the measurement chips, a light source for generating a light beam, and the light block for the dielectric block. An optical system that enters at various angles of incidence so that total reflection conditions are obtained at the interface between the metal film and the metal film, and attenuation of total reflection is caused by surface plasmon resonance, and the intensity of the light beam totally reflected at the interface is measured Then, light detection means for detecting the state of the total reflection attenuation, and so that the total reflection conditions and various incident angles are sequentially obtained for each dielectric block of the plurality of measurement chips, Serial configured as having a support member driving means for placing in position for sequential optical system and light-detecting means each measurement chip by moving the support.

The analyzer using the measuring chip of the present invention is more specifically configured as a leak mode sensor among the analyzers utilizing the attenuated total reflection. In other words, in that case, the analyzer using the measurement chip of the present invention,
A dielectric block, a thin film layer including a cladding layer formed on one surface of the dielectric block and an optical waveguide layer formed thereon, and a sample holding mechanism for holding a sample on the surface of the optical waveguide layer. An analyzer using a measurement chip, comprising: a support for supporting a plurality of the measurement chips, a light source for generating a light beam, and the light block for the dielectric block, the dielectric block and the cladding layer. An optical system for entering at various angles of incidence such that total reflection conditions are obtained at the interface with the optical waveguide layer and total reflection attenuation occurs due to excitation of the waveguide mode in the optical waveguide layer; and a light beam totally reflected at the interface. Light detecting means for measuring the intensity of the total reflection attenuation to detect the total reflection condition and various incident angles with respect to each dielectric block of the plurality of measurement chips. Configured as having a support member driving means for placing in position for sequential optical system and light-detecting means each measurement chip by moving the support.

On the other hand, in the analyzer using the measuring chip of the present invention, the dielectric block is formed as one block including all of the light beam incident surface, the light emitting surface and the one surface on which the thin film layer is formed. When a replaceable measuring chip is configured for the support, the measuring chip is configured to be used.

In this case, the analyzer of the present invention comprises a cassette containing a plurality of the measurement chips, and chip supply means for taking out the measurement chips one by one from the cassette and supplying the chips in a state supported by the support. It is desirable to have.

In the analyzer using the measuring chip of the present invention, the thin film layer is formed by fixing a dielectric block including the light beam incident surface and the light beam exit surface to the support. If the fixed portion is divided into an exchangeable portion with respect to the fixed portion including one surface, and the exchangeable portion constitutes a measurement chip, the measurement chip may be used as an object to be used.

In that case, the analyzer of the present invention takes out a cassette containing a plurality of measurement chips, and takes out the measurement chips one by one from the cassette, and puts them in a state where they are combined with the fixed portion of the dielectric block fixed to the support. It is desirable to have a chip supply means for supplying.

In the analyzer using the measuring chip of the present invention, the support is a turntable which supports the plurality of measuring chips on a circumference around a rotation axis. It is desirable that the drive means intermittently rotate the turntable.

In the analyzer using the measurement chip of the present invention, a means for automatically supplying a predetermined sample is provided to each sample holding mechanism of the plurality of measurement chips supported by the support. desirable.

Further, the optical system in the analyzer using the measuring chip of the present invention is such that the light beam is incident on the dielectric block in a convergent light or a divergent light state. It is desirable to detect the position of a dark line existing in the totally reflected light beam due to attenuation of total reflection. In such a configuration,
The optical system may be one that causes the light beam to enter the interface in a defocused state.

On the other hand, one measuring chip management apparatus according to the present invention receives information indicating the number of delivered measuring chips from the outside as described above, and stores the number of measuring chips indicated by this information in the storage means. The information receiving means of the present invention, the number of measuring chips delivered for the analyzing device to the information receiving means of the analyzing device. And means for transmitting the indicated information.

Another measuring chip management apparatus according to the present invention includes, in addition to the information receiving means described above, an ordering information output means for outputting information for ordering the measuring chip to a supplier to which the measuring chip is delivered. The analyzer is provided for the analyzer of the present invention, and sends information indicating the number of measurement chips delivered for the analyzer to the information receiving means of the analyzer. Means, and means for receiving information for ordering the measurement chip output by the order information output means.

[0037]

As described above, the analyzer using the measurement chip of the present invention comprises a storage means for storing the number of measurement chips delivered to the analyzer, and a measurement chip used for analysis. Counting means for counting the number of measuring chips, and calculating means for subtracting the number of used measuring chips counted by the counting means from the number of delivered measuring chips stored in the storage means to obtain the remaining amount of measuring chips, Warning means for issuing a warning when the remaining amount of the measurement chip obtained by the calculation means is equal to or less than a predetermined number is provided, so that the apparatus user can refer to this warning and run out of stock of the measurement chip, Alternatively, it becomes possible to order a measurement chip before the number of measurement chips becomes extremely small, so that it is possible to prevent a situation in which the number of measurement chips is insufficient and sample analysis becomes impossible.

Further, in the analyzer using the measuring chip of the present invention, in particular, a chip supply section in which a predetermined number N (2 ≦ N) of measuring chips are set together, and a chip set number input for inputting the predetermined number N In the case where the warning means is configured to issue a warning when the remaining amount of the measurement chip falls below the predetermined number N, the warning means is normally provided to the chip supply unit next time. Since a warning is issued when the number of measurement chips that can be set is not available, inventory management can be performed more strictly so that the number of measurement chips is not insufficient.

Further, in the analyzer using the measuring chip of the present invention, if a display means for displaying the remaining amount of the measuring chip obtained by the calculating means is provided, the remaining amount of the measuring chip is such that a warning is particularly generated. Even if it does not decrease to
The user of the apparatus can order the measurement chip with a margin while watching the display, thereby realizing more secure inventory management.

If the analyzer using the measurement chip of the present invention is provided with a chip number input means for receiving the operation of inputting the number of measurement chips delivered and storing the number in the storage means, The number of chips required for calculating the remaining amount of measurement chips can be given to the calculating means by using the number-of-chips-to-be-delivered input means.

On the other hand, instead of providing the delivery chip number input means as described above, information indicating the number of delivered measurement chips is received from the outside, and the number of measurement chips indicated by this information is stored in the storage means. If the information receiving means to be stored is provided, the number of chips to be delivered can be directly supplied from the supplier of the measuring chip to the calculating means of the analyzer via a communication line, and the number of chips to be delivered by the user of the analyzer can be input. Can be eliminated. If the burden on the user of the analyzer can be reduced in this way, the supplier of the measurement chip will be able to establish a commercially advantageous position with respect to competitors.

In the analyzer using the measurement chip of the present invention, when the warning is issued, an order information output means for outputting information for ordering the measurement chip to a supplier who supplies the measurement chip is provided. If it is provided, automatic ordering via a communication line becomes possible, and the burden on the ordering work of the user of the analyzer can be reduced.

In this case, the order information output means outputs a display for confirming the order before outputting the information for ordering the measurement chip, and outputs the information after the order confirmation is input. For example, it is possible to prevent an order error due to a malfunction of the apparatus, and it is also possible for the user of the analyzer to place an order based on a special schedule different from the usual one.

On the other hand, as described above, the analyzer using the measuring chip according to the present invention has a total reflection condition and various incident angles for the support for supporting a plurality of measuring chips and for each dielectric block of the measuring chip. As you can get,
An analysis using a total reflection attenuation such as a surface plasmon sensor or a leak mode sensor, comprising a support driving means for moving the support and sequentially disposing each measuring chip at a predetermined position with respect to the optical system and the light detecting means. When configured as an apparatus, samples held by each sample holding mechanism of a plurality of measurement chips can be used for measurement one after another as the support moves. Therefore, according to this analyzer, it is possible to analyze a large number of samples in a short time.

On the other hand, the above-mentioned dielectric block is formed as one block including all of the light beam incident surface, the light emitting surface and the one surface on which the thin film layer is formed, and the measurement block is exchangeable with respect to the support. When configuring a chip,
If the analysis device of the present invention is configured with this measurement chip as an object to be used, by removing the measurement chip holding the sample whose measurement has been completed from the support and supporting a new measurement chip on the support, New samples can be successively used for measurement, and measurement of a large number of samples can be performed in a shorter time.

When such a measuring chip is applied, a cassette accommodating a plurality of the measuring chips, and a chip supplying means for taking out the measuring chips one by one from the cassette and supplying them in a state supported by a supporter Is provided, the work of supplying the measurement chip is streamlined also in this case, and the time required for measuring a large number of samples can be further reduced.

Further, the dielectric block is exchanged with respect to the fixed portion including the incident surface and the emission surface of the light beam and fixed to the support, and to the fixed portion including the surface on which the thin film layer is formed. Even if the exchangeable part constitutes a measurement chip, if the analysis device of the present invention is configured to use this measurement chip, the measurement chip By removing a new measurement chip from the fixed part of the dielectric block and combining it with the fixed part, new samples can be provided one after another, making it possible to perform measurement on a large number of samples in a shorter time. Become.

When such a measuring chip is applied, a cassette accommodating a plurality of the measuring chips, and a chip for taking out the measuring chips one by one from the cassette and supplying them in a state of being combined with the fixed portion of the dielectric block If the supply means is provided, the operation of supplying the measurement chip is streamlined, and the time required for measuring a large number of samples can be further reduced.

In the analyzer using the measurement chip of the present invention, when a means for automatically supplying a sample is provided to each sample holding mechanism of the plurality of measurement chips supported by the support, the time required for sample supply is It is also possible to perform measurement on a large number of samples in a shorter time.

Since the above-described support is mechanically moved by the support driving means, it is inevitable that a positioning error occurs. When this positioning error occurs, the relative stop position of the measuring chip supported on the optical system changes. If the position of the measurement chip with respect to the optical system fluctuates in this manner, an error occurs in detecting the state of attenuated total reflection. More specifically, an error occurs in the position measurement of the dark line due to the attenuated total reflection described above.

However, if the optical system is configured to cause the light beam to be incident on the interface in a defocused state, the detection of the attenuated total reflection state by the excitation of the surface plasmon resonance or the waveguide mode described above. The error of (for example, the position measurement of the dark line) is averaged, and the measurement accuracy is improved.

On the other hand, one measuring chip managing apparatus according to the present invention is an analyzing apparatus which receives information indicating the number of delivered measuring chips from the outside and stores the number of measuring chips indicated by the information in the storage means. Since the information receiving means is provided with means for transmitting information indicating the number of measurement chips delivered for the analyzer, the measurement chip management device is provided to the source of the measurement chip. If this is done, the information indicating the number of the measurement chips can be directly supplied to the analyzer via, for example, a communication line, and the input operation of the number of chips to be delivered by the user of the analyzer can be eliminated. If the burden on the user of the analyzer can be reduced in this way, the supplier of the measurement chip will be able to establish a commercially advantageous position with respect to competitors.

Further, another measuring chip management device according to the present invention includes, in addition to the above-mentioned information receiving means, an ordering information output means for outputting information for ordering the measuring chip to a supplier who supplies the measuring chip. It is configured for the analysis device of the present invention to be provided, and is provided with means for transmitting information indicating the number of measurement chips delivered for the analysis device in the same manner as described above. Also, in the case of using the measurement chip management device, the input operation of the number of chips to be delivered by the user of the analyzer can be eliminated.

In addition, this measuring chip management device
Since there is provided a means for receiving information for ordering the measurement chip output from the order information output means of the analyzer, if the measurement chip management device is arranged at the supply source of the measurement chip,
Automatic ordering, in which measurement chip ordering information is directly sent to a measurement chip supply source via a communication line, for example, becomes possible, so that the burden of ordering work of a user of the analyzer can be reduced.

In this case, the order information output means is configured to output a display for confirming the order before outputting the information for ordering the measurement chip, and to output the information after the order confirmation is input. For example, it is possible to prevent an order error due to a malfunction of the apparatus, and it is also possible for the user of the analyzer to place an order based on a special schedule different from the usual one.

[0056]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 shows a surface plasmon resonance measurement chip (hereinafter, referred to as a chip) according to a first embodiment of the present invention.
FIG. 1 shows a main part of a surface plasmon sensor using a measurement chip (hereinafter simply referred to as a measurement chip) 10. FIG. 2 shows a side view of the optical system of the apparatus, and FIG. 3 shows a perspective view of the measuring chip 10.

As shown in FIG. 1, this surface plasmon sensor has a turntable 20 supporting a plurality of measurement chips 10.
A laser light source 31 such as a semiconductor laser for generating a measurement light beam (laser beam) 30; a condenser lens 32 forming an incident optical system; a photodetector 40;
A support driving means 50 for intermittently rotating the support 20, and controlling the driving of the support driving means 50;
It has a controller 60 that receives the output signal S of 40 and performs processing described below, and an automatic sample supply mechanism 70.

As shown in FIGS. 2 and 3, the measuring chip 10 is, for example, a transparent dielectric block formed in a rectangular parallelepiped shape.
11, a metal film 12 made of, for example, gold, silver, copper, aluminum or the like formed on the upper surface of the dielectric block 11, and a cylindrical shape defining a space closed on the side on the metal film 12. And a sample holding frame 13 made of a member. The dielectric block 11 has a surface on which the metal film 12 is formed (a surface constituting an interface 11a described later) and a surface 11b on which the light beam 30 is incident.
And the surface 11c from which the light beam 30 is emitted is formed as one block including all of the surface 11c. For example, a liquid sample 15 is stored in the sample holding frame 13 as described later.

The measuring chip 10 is formed by integrally molding a dielectric block 11 and a sample holding frame 13 from, for example, a transparent resin or the like, and is replaceable with a turntable 20. To be replaceable, for example, turntable
The measurement chip 10 may be fitted and held in the through hole formed in the hole 20. In this example, the sensing medium 14 is fixed on the metal film 12, which will be described later in detail.

Preferred examples of the transparent resin include P
Examples thereof include MMA, polycarbonate, amorphous polyolefin, and cycloolefin. In addition, glass is also suitable as a material for integrally forming the dielectric block 11 and the sample holding frame 13. In general, it is desirable to use a material having a refractive index in the range of about 1.45 to 2.5 as a material for forming the dielectric block 11. The reason is,
This is because a practical SPR resonance angle can be obtained in this refractive index range.

A plurality of turntables 20 (12 in this example)
) Are configured to be supported at equal angular intervals on a circumference around the rotation axis 20a. The support driving means 50 is composed of a stepping motor or the like, and rotates the turntable 20 intermittently by an angle equal to the arrangement angle of the measurement chip 10.

The condenser lens 32 has a light beam as shown in FIG.
The light 30 is condensed and passed through the dielectric block 11 in a convergent light state, and is incident on the interface 11a between the dielectric block 11 and the metal film 12 so that various incident angles can be obtained. The range of the incident angle is a range including an angle range in which the condition for total reflection of the light beam 30 at the interface 11a is obtained and surface plasmon resonance can occur.

The light beam 30 is incident on the interface 11a as p-polarized light. In order to do so, the laser light source 31 may be disposed in advance so that the polarization direction thereof becomes a predetermined direction. Alternatively, the direction of polarization of the light beam 30 may be controlled by a wave plate or a polarizing plate.

The photodetector 40 is composed of a line sensor in which a large number of light receiving elements are arranged in one line, and the light receiving elements are arranged such that the arrangement direction of the light receiving elements is the direction of arrow X in FIG. .

On the other hand, the controller 60 is
Receives an address signal A indicating the rotation stop position, and outputs a drive signal D for operating the support driving means 50 based on a predetermined sequence. The controller 60 includes a signal processing unit 61 that receives the output signal S of the photodetector 40, and a display unit 62 that receives an output from the signal processing unit 61.

The automatic sample supply mechanism 70 includes, for example, a pipette 71 for sucking and holding a liquid sample by a predetermined amount, and a pipette 71.
Means for moving the sample from the sample container 73 set at a predetermined position to the pipette 71 by suction and holding the sample in the sample holding frame 13 of the measurement chip 10 at the predetermined stop position. The sample is supplied dropwise.

Hereinafter, a sample analysis by the surface plasmon sensor having the above configuration will be described. At the time of sample analysis, the turntable 20 is intermittently rotated by the support driving means 50 as described above. Then, the sample 15 is supplied by the sample automatic supply mechanism 70 to the sample holding frame 13 of the measurement chip 10 which is stopped at a predetermined position when the turntable 20 stops.

Thereafter, when the turntable 20 is rotated several times and then stopped, the measurement chip 10 holding the sample 15 in the sample holding frame 13 is moved to a position where the light beam 30 is incident on the dielectric block 11. Position (measurement tip 10 on the right in FIG. 2)
At the position (). In this state, the laser light source 31 is driven by a command from the controller 60, and the light beam 30 emitted from the laser light source 31 is incident on the interface 11a between the dielectric block 11 and the metal film 12 in a state of being converged as described above. I do. The light beam 30 totally reflected at the interface 11a is a light detector
Detected by 40.

Since the light beam 30 is incident on the dielectric block 11 in a convergent light state as described above, it contains components incident on the interface 11a at various incident angles θ. The incident angle θ is an angle equal to or larger than the total reflection angle. Therefore, the light beam 30 is totally reflected at the interface 11a, and the reflected light beam 30 contains components reflected at various reflection angles. Here, the optical system such as the condenser lens 32
The light beam 30 may be configured to be incident on the interface 11a in a defocused state. By doing so, errors in detecting the state of surface plasmon resonance (for example, measuring the position of the dark line) are averaged, and measurement accuracy is improved.

When the light beam 30 is totally reflected as described above, an evanescent wave seeps from the interface 11a to the metal film 12 side. When the light beam 30 enters the interface 11a at a specific incident angle θ _SP , the evanescent wave resonates with the surface plasmon excited on the surface of the metal film 12, so that the reflected light intensity I drops sharply. FIG. 4 schematically shows the relationship between the incident angle θ and the reflected light intensity I when this total reflection attenuation phenomenon occurs.

Therefore, the light amount detection signal output from the photodetector 40 is
Check the amount of light detected for each light receiving element from signal S to detect dark lines.
The incident angle (total reflection attenuation)
Angle) θ _SPAnd input the reflected light intensity I obtained in advance.
Based on the relationship curve with the angle of incidence θ, the specific substance in sample 15
Quantitative analysis can be performed. Controller 60 signal processing
The part 61 determines the specific substance in the sample 15 based on the above principle.
The quantity is analyzed, and the analysis result is displayed on the display unit 62.

When the measurement is performed only once for one sample 15, the measurement is completed by the above operation. Therefore, the measurement chip 10 having completed the measurement is manually operated from the turntable 20, or an automatic discharging means is provided. It may be used and discharged. On the other hand, when performing measurements on one sample 15 multiple times,
After the measurement is completed, keep the measurement chip 10 as it is on the turntable 20
If you support it after one turn of the turntable 20,
The sample 15 held on the measurement chip 10 can be measured again.

As described above, this surface plasmon sensor is configured such that a plurality of measurement chips 10 are supported on a turntable 20, and the turntable 20 is moved to sequentially arrange the measurement chips 10 at measurement positions. Therefore, the samples 15 held in the sample holding frames 13 of the plurality of measurement chips 10 can be used for measurement one after another as the turntable 20 moves. Thus, according to this surface plasmon sensor, it is possible to perform measurement on a large number of samples 15 in a short time.

In the surface plasmon sensor of this embodiment, the time required for supplying the sample is reduced by providing the automatic sample supply mechanism 70, so that the measurement of many samples 15 can be performed in a shorter time. become.

In this embodiment, the dielectric block 11 and the metal film
The measurement chip 10 is configured by integrating the sample holding frame 12 and the sample holding frame 13, and the measurement chip 10 is replaceable with respect to the turntable 20. Therefore, the measurement chip 10 holding the sample 15 whose measurement has been completed is turned. By removing the new measurement chip 10 from the table 20 and supporting it on the turntable 20, new samples 15 can be successively used for measurement, and the measurement of many samples 15 can be performed in a shorter time. become.

The measuring chip 10 does not need to optically couple the dielectric block 11 to another dielectric block via the refractive index matching liquid. Therefore, the measurement chip 10 is easy to handle, and may be free from adverse effects of the refractive index matching liquid on the environment.

The sensing medium 14 fixed on the surface of the metal film 12 binds to a specific substance in the sample 15. Examples of such a combination of the specific substance and the sensing medium 14 include an antigen and an antibody. In that case, the antigen-antibody reaction can be detected based on the total reflection attenuation angle θ _SP .

Further, in this embodiment, the rotating turntable 20 is used as a support for supporting the measuring unit, but the shape and the moving method of the support are not limited to this. For example, the support that supports the plurality of measurement units may be configured to reciprocate linearly, and the plurality of measurement units may be sequentially set in the measurement unit with the movement.

In this case, when it is necessary to perform a plurality of measurements on one sample, a plurality of measurement units each including an optical system for irradiating the measurement unit with a light beam and light detection means may be provided. For example, the measuring units are sequentially set in the measuring section with the movement of the support, and the measurement can be performed in each measuring section. Alternatively, only one such measurement unit is provided, the support is moved in one direction, the measurement unit is set on the measurement unit, and after the measurement is performed, the support is moved in the opposite direction to remove the measurement unit. Set it on the measuring section again,
The measurement may be performed.

The method of moving the support in the normal and reverse directions can be applied to the case where the turntable 20 is used. When the turntable 20 is used, it is also possible to provide a plurality of measuring units so as to measure one measurement unit a plurality of times while the turntable 20 makes one rotation.

Next, the overall control of the surface plasmon sensor of this embodiment will be described in detail with reference to FIGS. FIG. 5 and FIG. 6 show the overall side surface shape and overall planar shape of the surface plasmon sensor, respectively. FIG. 5 also shows a schematic configuration of a chip management system including a measurement chip management device according to an embodiment of the present invention.

As shown in FIGS. 5 and 6, in this surface plasmon sensor,
Twelve measuring chips 10 are supported at angular intervals of °, and the turntable 20 is intermittently rotated in the direction of arrow Y by 30 °. When the turntable 20 is stopped, the four measurement unit support portions of the turntable 20 are moved to the measurement unit supply position, the sample supply position, the measurement position, and the measurement unit discharge position indicated by P1, P2, P3, and P4 in FIG. It stops at the position sequentially.

The measurement chip 10 taken out by the chip supply means 76 is supplied to the measurement unit supporting portion which is stationary at the measurement unit supply position P1 from the cassette 75 accommodating a plurality of measurement chips 10. Note that chip supply means 76
Is constituted by a known air suction cup and a mechanism for moving the air suction cup. For example, one measuring chip 10 is taken out of an outlet provided at the bottom of the cassette 75 one by one.
Can be sucked and taken out, and can be moved to be supplied to the measurement unit support section.

The sample is supplied to the measuring chip 10 supported by the measuring unit supporting portion which is stationary at the sample supplying position P2 by using the automatic sample supplying mechanism 70.

Further, with respect to the measurement chip 10 supported by the measurement unit supporting portion that is stationary at the measurement position P3, the sample held by the measurement chip 10 is analyzed. This sample analysis is as described above.

The measuring chip 10 supported by the measuring unit supporting portion which is stationary at the measuring unit discharge position P4.
Is discharged from the turntable 20 by the chip discharging means 78. When the turntable 20 rotates three times, the measurement unit support vacated in this manner stops at the measurement unit supply position P1, and thereafter, the same processing as described above is repeated.

As described above, in this embodiment,
Measuring chips from cassette 75 containing multiple measuring chips 10
By providing the chip supply means 76 for taking out one by one and supplying it in a state of being supported by the turntable 20, the supply operation of the measurement chips is streamlined, and a large number of samples 15 are provided.
The time required for the measurement can be sufficiently reduced.

Next, a system for managing the inventory of the measuring chips 10 will be described with reference to FIG. The controller 60 described above is controlled by the overall control device 80. The general control device 80 includes input means 81 such as a keyboard.
And display means such as a CRT or a liquid crystal display panel
82 is connected. The overall control device 80, the input means 81, and the display means 82 are configured by, for example, a general computer system. The overall control device 80 is connected to the receiving means 83, and is connected to the chip supplying means 76 to supply the measuring chip 10 supplied by the chip supplying means 76.
The counting means 84 for counting the number of pieces is connected.

The receiving means 83 is connected to a customer management computer 90 installed at the supplier of the measuring chip 10 via a dedicated commercial communication line or a communication line 93 such as the Internet. The customer management computer 90 has input means 91 such as a keyboard.
And display means such as a CRT or a liquid crystal display panel
92 is connected.

Hereinafter, the flow of the process of inventory management of the measuring chip 10 will be described. When the measurement chip 10 is ordered by the user of the surface plasmon sensor, the measurement chip 10 supplier sends the specified number of the measurement chips 10 to the user in a tray containing a predetermined number of the measurement chips 10. ,
Deliver. This delivery is made using a transportation means such as a normal truck service.

When the specified number of measurement chips 10 is sent to the user, the supply source of the measurement chips 10 inputs the number of the sent measurement chips 10 to the customer management computer 90 using the input means 91. At this time, the input can be confirmed using the display means 92. Computer for customer management
Reference numeral 90 denotes a unit for transmitting information indicating the number of delivery measurement chips, and this information is transmitted to the user's receiving unit 83 via the communication line 93.

The receiving means 83 inputs the received information Q indicating the number of delivery measurement chips to the overall control device 80. Then, the overall control device 80 stores the input information Q in an internal memory (not shown).

When the sample analysis is performed using the measuring chip 10 as described above, the counting means 84 counts the number of measuring chips 10 supplied by the chip supplying means 76 and controls the information R indicating the number as a whole. Input to the device 80. The overall control device 80 subtracts the number of used chips indicated by the information R from the number of delivered measurement chips indicated by the information Q stored in the internal memory, thereby determining the number of the measurement chips 10 remaining in stock at the user. Ask. As described above, the overall control device 80
It functions as a calculation means for calculating the remaining amount of data. Here, the remaining amount of the measurement chip 10 is denoted by T.

The cassette 75 as a chip supply unit is schematically shown in the drawing, but actually has a predetermined number N of thousands to 10,000 or more measurement chips 10.
The input unit 81 functions as a chip set number input unit for inputting the chip set number N. The chip set number N is input to the overall control device 80 by the device user operating the input unit 81. . The overall controller 80 subtracts the number of chip sets N from the remaining chip amount T, and when the difference, that is, (T−N) becomes a negative value, causes the display means 82 to generate an alarm. This alarm is issued by, for example, halving the display size of the content previously displayed on the display means 82 and displaying a large character such as "Please order a measuring chip" in the remaining half. Done.

When the alarm is issued, the apparatus user places an order to supply a predetermined number of the measurement chips 10 to the supplier of the measurement chips 10 by telephone, for example. The supplier of the measuring chip 10 that has received the order sends the measuring chip 10 to the user as described above, and counts the number of the measuring chips 10 sent at that time by using the input means 91 to the customer. It is input to the management computer 90.

The fact that the value of (T−N) has become a negative value means that the measurement chip 10
Is set, the cassette 75 cannot be filled with the predetermined number N of the measurement chips 10. Therefore, at this point, the above warning is issued and the measuring chip
If 10 is ordered and replenished, measurement chip 10
The problem that the sample analysis cannot be performed due to lack of data can be prevented beforehand.

The above-mentioned warning may be performed in the form of a display on the display means 82, or may be performed by, for example, outputting a warning sound from a separately provided buzzer or blinking a warning lamp.

When such a warning is issued,
At the same time, for example, information for ordering the measurement chip 10 may be output from the overall control device 80, and the information may be transmitted to the customer management computer 90 via the communication line 93. By automatically ordering the measurement chip 10 in this manner, the burden on the ordering work of the user of the analyzer can be reduced.

In this case, the overall control device 80 as the order information output means causes the display means 82 to output a display for confirming the order before outputting the information for ordering the measuring chip 10, and uses the input means 81 to place the order. Preferably, the information is output after the confirmation input is made. By doing so, it is possible to prevent an order error due to a malfunction of the device, and it is also possible for the user of the analyzer to place an order based on a special schedule different from usual.

In this embodiment, the number of the measuring chips 10 delivered by the supplier is notified from the supplier to the overall control device 80 via the communication line 93. For example, the analyzer user may input the number of delivery to the overall controller 80 from the input unit 81 by using the input unit 81 also as the delivery chip number input unit.

In such a case, the function of notifying the total control device 80 of the number of measurement chips 10 delivered by the supplier from the supplier via the communication line 93 may be omitted, but the function is left. In this case, a mode in which information indicating the number of delivery measurement chips given to the overall control device 80 is input from the supply source and a mode in which the information is input from the analysis device user may be selectively switched and set.

When the number of measuring chips 10 delivered by the supplier is notified from the supplier to the overall control device 80 via the communication line 93, the input operation of the number of chips to be delivered by the user of the analyzer is not required. Can be. If the burden on the user of the analyzer can be reduced in this way, the supplier of the measurement chip 10 will be able to establish a commercial advantage over competitors.

In addition to issuing a warning when the value of (T−N) becomes a negative value, a predetermined lower limit number that is not related to the number of chip sets in the cassette 75 is set in advance. ,
If the remaining amount of the measurement chip 10 falls below this, an alarm may be issued.

The measurement chip obtained by the overall control device 80
If the remaining amount of the measurement chip 10 is displayed on the display means 82, for example, even if the remaining amount of the measurement chip 10 does not decrease to such a degree that a warning is particularly issued, the user of the apparatus has ample time while watching this display. It becomes possible to place an order for the measurement chip 10, and more secure inventory management is realized.

Next, a surface plasmon sensor according to another embodiment of the present invention will be described with reference to FIG. FIG. 7 shows a side surface shape of a main part of the surface plasmon sensor. In FIG. 7, elements that are the same as the elements in FIG. 2 are given the same reference numerals, and descriptions thereof will be omitted unless otherwise necessary (the same applies hereinafter).

This surface plasmon sensor is different from that shown in FIG. 2 in the configuration of the measurement chip. That is, the measurement chip 1 used here
0 ′ is composed of the sample holding frame 13 ′ and the metal film 12 integrated with each other. The sample holding frame 13 ′ is formed in a bottomed cylindrical block (also a dielectric block) using a transparent dielectric, and the metal film 12 is fixed on the bottom surface thereof, and the two constitute a measurement chip. ing.

The measuring chip 10 ′ can be appropriately removed from the dielectric block 11 ′ fixed to the turntable 20 and replaced. When the measurement chip is combined with the dielectric block 11 ', it is preferable to interpose a refractive index matching oil between the sample holding frame 13' and the dielectric block 11 '. In this case, the sample holding frame 1
The light beam 30 is applied to the interface 13a between the 3 'and the metal film 12.

When the measuring chip 10 'having the above configuration is used, the measuring chip holding the sample 15 whose measurement has been completed is removed from the dielectric block 11', and a new measuring chip is combined with the dielectric block 11 '. By doing
New samples 15 can be successively used for measurement, and measurement of many samples 15 can be performed in a short time.

The configuration relating to the inventory management of the measuring chip 10 'is the same as that in the first embodiment, whereby the same effect as in the first embodiment can be obtained.

Next, a surface plasmon sensor according to still another embodiment of the present invention will be described with reference to FIG. The surface plasmon sensor shown in FIG. 8 differs from that shown in FIG. 2 in the manner in which the light beam 30 is applied to the interface 11a between the dielectric block 11 and the metal film 12. That is, in the present apparatus, the light beam 30 condensed by the condensing lens 32 is applied to the interface 11a in a defocused state.

Since the turntable 20 is mechanically moved by the support driving means 50, it is inevitable that a positioning error occurs. When this positioning error occurs, the relative stop position of the measuring chip 10 supported thereon with respect to the light beam 30 emitted from the condenser lens 32 fluctuates. When the position of the measurement chip 10 with respect to the light beam 30 fluctuates in this manner, an error occurs in detecting the state of surface plasmon resonance. More specifically, an error occurs in the position measurement of the dark line due to the total reflection attenuation described above.

However, if the light beam 30 is incident on the interface 11a in a defocused state as described above, the error in the state detection of the surface plasmon resonance (here, the position measurement of the dark line) is averaged. And the measurement accuracy is improved.

In this case, too, the configuration relating to the inventory management of the measuring chip 10 is the same as that in the first embodiment, whereby the same effect as in the first embodiment can be obtained.

Next, an embodiment in which the analyzer using the measuring chip of the present invention is formed as a leak mode sensor will be described with reference to FIG. This leak mode sensor has a configuration similar to the surface plasmon sensor shown in FIG. 2, and is also configured to use the measurement chip 110 including the dielectric block 11 in this example. A cladding layer 45 is formed on one surface (upper surface in the figure) of the dielectric block 11, and an optical waveguide layer 46 is further formed thereon, thereby forming a measurement chip 110.

The dielectric block 11 is made of, for example, synthetic resin or B
It is formed using an optical glass such as K7. On the other hand, the cladding layer 45 is formed in a thin film shape using a dielectric material having a lower refractive index than the dielectric block 11 or a metal such as gold. The optical waveguide layer 46 is a dielectric having a higher refractive index than the cladding layer 45,
For example, this is also formed into a thin film using PMMA. The thickness of the cladding layer 45 is, for example, 36.5 nm when formed from a gold thin film, and the thickness of the optical waveguide layer 46 is, for example, PMMA.
Is formed to about 700 nm.

In the leakage mode sensor having the above configuration,
Light beam 30 emitted from laser light source 31 is a dielectric block
When the light beam 30 is incident on the cladding layer 45 at an incident angle equal to or larger than the total reflection angle through the interface 11, the light beam 30 is totally reflected at the interface 11 e between the dielectric block 11 and the cladding layer 45.
The light of a specific wave number that has passed through the optical waveguide layer 46 and entered the optical waveguide layer 46 at a specific incident angle propagates through the optical waveguide layer 46 in a guided mode. When the waveguide mode is excited in this way, most of the incident light is taken into the optical waveguide layer 46, and thus the total reflection attenuation occurs in which the intensity of the light totally reflected at the interface 11e sharply decreases.

Since the wave number of the guided light in the optical waveguide layer 46 depends on the refractive index of the sample 15 on the optical waveguide layer 46, the specific incident angle at which attenuated total reflection occurs is known.
It is possible to analyze the refractive index of 15 and the characteristics of the sample 15 related thereto.

In this case, too, the configuration relating to the inventory management of the measuring chip 110 is the same as that in the first embodiment, whereby the same effect as in the first embodiment can be obtained.

The present invention can be applied not only to an analyzer using a measuring chip composed of a dielectric block as described above, but also to a disposable such as a measuring chip called a microwell having many small holes for storing a sample. The present invention can be applied to all analyzers using the measurement chip to be performed, and has the same effect.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a main part of a surface plasmon sensor according to a first embodiment of the present invention.

FIG. 2 is a partially broken side view showing an optical system of the surface plasmon sensor of FIG. 1;

FIG. 3 is a perspective view showing a measurement chip used in the surface plasmon sensor of FIG. 1;

FIG. 4 is a graph showing a schematic relationship between an incident angle of a light beam in a surface plasmon sensor and a light intensity detected by a photodetector.

FIG. 5 is a schematic side view showing a main part of the surface plasmon sensor of FIG. 1 and a configuration of a measurement chip management system.

FIG. 6 is a plan view showing a main part of the surface plasmon sensor of FIG. 1;

FIG. 7 is a partially cutaway side view showing a main part of a surface plasmon sensor according to another embodiment of the present invention.

FIG. 8 is a partially cutaway side view showing a main part of a surface plasmon sensor according to still another embodiment of the present invention.

FIG. 9 is a partially cutaway side view showing a main part of a leakage mode sensor according to still another embodiment of the present invention.

[Explanation of symbols]

 10, 10'110 Measurement chip 11, 11 'Dielectric block 11a Interface between dielectric block and metal film 11e Interface between dielectric block and cladding layer 12 Metal film 13, 13' Sample holding frame 13a Dielectric block and metal Interface with film 14 Sensing medium 15 Sample 20 Turntable 30 Light beam 31 Laser light source 32 Condensing lens 40 Photodetector 45 Cladding layer 46 Optical waveguide layer 50 Support driving means 60 Controller 61 Signal processing unit 62 Display unit 70 Sample automatic Supply mechanism 75 Cassette 76 Chip supply means 77 Surface plasmon resonance measurement means 78 Chip discharge means 80 Overall control device 81 Input means 82 Display means 83 Receiving means 84 Counting means 90 Customer management computer 91 Input means for measuring chip supply side 92 Display means on the measuring chip supply side 93 Communication line

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Claims (12)

[Claims] 1. An analyzer for attaching a sample to a disposable measuring chip and analyzing the characteristics of the sample using the measuring chip, wherein the number of measuring chips delivered to the analyzer is stored. Storage means for storing, counting means for counting the number of measurement chips used for analysis, and subtraction of the number of used measurement chips counted by the counting means from the number of delivery measurement chips stored in the storage means. Calculating means for calculating the remaining amount of the measuring chip; and warning means for issuing a warning when the remaining amount of the measuring chip obtained by the calculating means becomes a predetermined number or less. The analyzer used. 2. The apparatus according to claim 1, further comprising: a chip supply unit configured to collectively set a predetermined number N (2 ≦ N) of the measurement chips; and a chip set number input unit configured to input the predetermined number N; The analyzer according to claim 1, wherein a warning is issued when the remaining amount of the measurement chip falls below the predetermined number N. 3. The display device according to claim 1, further comprising a display unit for displaying a remaining amount of the measurement chip obtained by said calculation unit.
Or an analyzer using the measurement chip according to 2. 4. A delivery chip number input means for receiving the operation of inputting the number of delivered measurement chips and storing the number in the storage means.
An analyzer using the measurement chip according to any one of claims 1 to 3. 5. An information receiving means for receiving information indicating the number of delivered test chips from outside and storing the number of test chips indicated by the information in the storage means. Item 5. An analyzer using the measurement chip according to any one of Items 1 to 4. 6. An apparatus according to claim 1, further comprising order information output means for outputting information for ordering the measurement chip to a supplier to which the measurement chip is delivered. An analyzer that uses a measurement chip. 7. The system according to claim 1, wherein the order information output means outputs a display for confirming the order before outputting the information for ordering the measurement chip, and outputs the information after the order confirmation is input. An analyzer using the measurement chip according to claim 6. 8. An analyzer using a measurement chip including a dielectric block, a thin film layer formed on one surface of the dielectric block, and a sample holding mechanism for holding a sample on the surface of the thin film layer. A support for supporting a plurality of the measuring chips, a light source for generating a light beam, and a condition for total reflection at the interface between the dielectric block and the thin film layer with respect to the dielectric block. An optical system that causes the light beam to be incident at various angles of incidence, a light detection unit that measures the intensity of the light beam totally reflected at the interface to detect a state of attenuated total reflection, and each dielectric block of the plurality of measurement chips. So that the total reflection condition and various angles of incidence can be obtained sequentially with respect to
The measuring chip according to any one of claims 1 to 7, further comprising: support driving means for moving the support to sequentially dispose each measuring chip at a predetermined position with respect to the optical system and the light detecting means. The analyzer used. 9. An analysis using a dielectric block, a metal film as a thin film layer formed on one surface of the dielectric block, and a measurement chip including a sample holding mechanism for holding a sample on the surface of the metal film. An apparatus, comprising: a support for supporting a plurality of the measurement chips; a light source for generating a light beam; and a light source for generating the light beam. An optical system that makes incident light at various angles of incidence so as to obtain a light beam; a light detection unit that measures the intensity of the light beam totally reflected at the interface to detect a state of attenuated total reflection due to surface plasmon resonance; In order to obtain the total reflection condition and various angles of incidence sequentially for each dielectric block of the measurement chip,
The measuring chip according to any one of claims 1 to 7, further comprising: support driving means for moving the support to sequentially dispose each measuring chip at a predetermined position with respect to the optical system and the light detecting means. The analyzer used. 10. A dielectric block, a thin film layer comprising a cladding layer formed on one surface of the dielectric block and an optical waveguide layer formed thereon, and a sample held on the surface of the optical waveguide layer. An analyzer using a measurement chip provided with a sample holding mechanism, comprising: a support for supporting a plurality of the measurement chips; a light source for generating a light beam; An optical system for incidence at various angles of incidence so as to obtain the condition of total reflection at the interface between the body block and the cladding layer, and measuring the intensity of the light beam totally reflected at the interface to guide the light at the optical waveguide layer. Light detection means for detecting a state of attenuated total reflection by wave mode excitation, and so that the total reflection condition and various incident angles are sequentially obtained for each dielectric block of the plurality of measurement chips,
The measuring chip according to any one of claims 1 to 7, further comprising: support driving means for moving the support to sequentially dispose each measuring chip at a predetermined position with respect to the optical system and the light detecting means. The analyzer used. 11. An information indicating the number of measurement chips delivered for the analyzer to the information receiving means of the analyzer using the measurement chip according to any one of claims 5 to 10. A measuring chip management device comprising means. 12. The information indicating the number of measurement chips delivered for the analyzer to the information receiving means of the analyzer using the measurement chip according to any one of claims 6 to 10. And a means for receiving information for ordering the measurement chip output from the order information output means.