JP2002056908A - Electrical connector and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electrical connector, and its manufacturing method, which can be used for an analog circuit, high-frequency circuit, or the like by restraining dispersion through lowering of resistance and can also aim at expanding the range of use. SOLUTION: A plurality of metal connecting plates 8 are buried in a row to the top and bottom width direction of an elastic matrix layer 7 interposed between an electronic circuit board 1 and an electric joint 3 made of liquid crystal module, to be formed and bent in a wave form. At one end of each metal connecting plate 8, a spherical connecting contact 9 contacting an electrode 2 of the electronic circuit board 1 is laser formed, and on the other hand, a spherical connecting contact 9 contacting an electrode 4 of the electric joint 3 is laser formed at the other end, and at each side of the elastic matrix layer 7, an insulating support layer 10 is laminated and bonded through an adhesive 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an electronic circuit board and a liquid crystal module, an electronic circuit board and an electronic circuit board, and various ICs.
The present invention relates to an electrical connector used for conducting a package and an opposing electrode such as an electronic circuit board, and more particularly to a press-contact type electrical connector and a method of manufacturing the same.

[0002]

2. Description of the Related Art An electrical connector is used for electrical connection between an electronic circuit board and a liquid crystal module, between an electronic circuit board and an electronic circuit board, and between various IC packages and an electronic circuit board. Although not shown, this type of electrical connector is formed by alternately and parallelly laying multiple layers of an insulating rubber sheet made of silicone rubber and a conductive rubber sheet made of silicone rubber. An electric connector having such a configuration is sandwiched between an electronic circuit board and an electric joint made of a liquid crystal module or the like, and is strongly pressed and compressed (press-contacted), whereby it is elastically deformed to be electrically connected to the electronic circuit board and the electric joint. Is conducted.

[0003]

The conventional electrical connector uses silicone rubber as described above. However, since the resistance value of the conductive rubber sheet is as high as 1 kΩ or more and the variation of the resistance value is large, the electrical connector is low. There is a problem that it is difficult to use it for conducting various circuits that require a current with a resistance value or a semiconductor package that requires a small current with a low resistance value. In addition, carbon black is often used as a conductivity imparting agent for the conductive rubber sheet.However, when carbon black is used, the volume resistivity of the conductive portion becomes higher than 0.2 Ωcm, and the compression load is high. Therefore, it cannot be used for analog circuits or high-frequency circuits.

[0004] Further, in order to obtain a region having a volume resistivity of 0.4 Ωcm or less, a high filling of carbon black is required, so that the rubber hardness of the conductive rubber sheet becomes high,
Since the stress at the time of compression connection of 15% becomes larger than 15 kgf / cm ² , it is not suitable for compression use. In addition, in this case, when a current of 1 mA or more flows, a state occurs in which the temperature becomes 50 ° C. or more, and thus there is a problem that the electric connector is not suitable. Further, even when the conductivity-imparting agent is a metal-based material, the rubber hardness of the conductive rubber sheet is likely to be high, and the stress at the time of 15% compression connection is larger than 15 kgf / cm ² . It is not uncommon that compression is not suitable for use. Further, there is a problem that the thickness of conduction as an electrical connector is 0.5 mm or less, and the range of use is greatly limited.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has a low resistance value to suppress variations thereof, and can be used in analog circuits, high frequency circuits, and the like, and furthermore, can be used in a wider range of use. And a method of manufacturing the same.

[0006]

According to the first aspect of the present invention, there is provided an electric connector for conducting an opposing electrode, the electric connector being provided between an opposing electrode of an electronic circuit board and an electric joint. In the thickness direction of the insulating elastic matrix layer, a plurality of narrow and substantially corrugated metal connection plates having substantially spherical shapes at both ends are provided while maintaining insulation from each other. In addition, it is preferable that an insulating support layer is provided on at least both side surfaces along the thickness direction of the elastic matrix layer.

According to a third aspect of the present invention, there is provided a method of manufacturing a device for electrically connecting an electronic circuit board and an electric joint, the method comprising: An elastic matrix layer is formed with a plurality of thin metal connection plates sandwiched therebetween, and both ends of each metal connection plate exposed from the elastic matrix layer are laser-processed to form substantially spherical connection contacts. An insulating support layer is adhered to at least both side surfaces of the layer.

Here, the electronic circuit board in the claims includes various circuit boards such as an inspection circuit board, a printed wiring board for mobile phones, and a high-density flexible board. Liquid crystal module, surface mount type (Q
FP, BGA, LGA, etc.) and various electronic components such as various circuit boards, microphones and speakers for mobile phones and electronic devices.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of the present invention will be described below with reference to the accompanying drawings. As shown in FIGS. A plurality of metal connecting plates 8 are buried in a row in the vertical thickness direction of the elastic matrix layer 7 interposed between the joints 3, and one end of each metal connecting plate 8 is provided with an electrode 2 of the electronic circuit board 1. The metal connection plate 8 is laser-formed on the other end of each metal connection plate 8, and the spherical connection contact 9 that is in contact with the electrode 4 of the electric joint 3 is formed by laser. Support layers 10 of the same shape are laminated and adhered to both sides of the layer 7 with an adhesive 11 interposed therebetween.

As shown in FIG. 1, the electronic circuit board 1 is made of, for example, a printed wiring board, and a plurality of electrodes 2 are arranged on the surface in parallel and flat in the figure. Electric joint 3
As shown in the figure, the liquid crystal module is made of, for example, a liquid crystal module, and is closely opposed to the surface of the lower electronic circuit board 1 via the liquid crystal light guide plate 5. The electrical joint 3 includes a plurality of electrodes 4 composed of ITO electrodes. Further, a guide holder 6 communicating with the electrodes 2 and 4 is formed in the liquid crystal light guide plate 5 to be vertically long, and an electric connector is housed in the guide holder 6.

As shown in FIGS. 1 to 3, the elastic matrix layer 7 is formed in a vertically long elastic plate shape using an electrically insulating material, particularly a material which forms a crosslinked structure after curing. . Examples of the material of the elastic matrix layer 7 include silicone rubber, polybutadiene rubber, natural rubber, polyisoprene rubber, urethane rubber, chloroprene rubber, polyester rubber, styrene / butadiene copolymer rubber, epichlorohydrin rubber, and foamed materials thereof. And the like. Among these, silicone rubber having excellent electrical insulation, heat resistance, and compression set of the cured product is preferable. In particular, the hardness after curing is 50 ° H or less, preferably 30 °, in order to minimize the load during compression connection. ５０50 ° H. or less, and any thickness that can hold the conductive portion may be used.
mm silicone rubber sheet is optimal.

As shown in FIG. 2, the plurality of metal connecting plates 8 are, for example, 0.1 m in the case of connecting fine pitch electrodes.
It is arranged at m pitch, and in case of connection of semiconductor package,
They are arranged at a pitch of 0.3 to 0.5 mm. The height of the plurality of metal connection plates 8 is formed as short and short as possible so as not to be affected by high frequency. Specifically, 1.0 to
It is formed at a height of 1.5 mm.

As shown in FIGS. 1 to 3, the metal connecting plate 8 is formed by etching using a conductive thin metal plate which can be etched. Examples of the material of the metal connection plate 8 include a copper plate and an aluminum plate, a nickel plate, and the like, such as a copper plate and a phosphor bronze plate, which are excellent in workability, conductivity, versatility, and cost. Considering the cost and the like, a copper plate is optimal. Such a metal connection plate 8 is plated with gold after etching, thereby preventing metal corrosion and reducing the contact resistance value at the time of connection.

The thickness of the metal connecting plate 8 is 0.05 to 0.5 in consideration of workability, cost, and low compression during connection.
mm, particularly 0.1 to 0.3 mm. Metal connection plate 8
Is formed in a substantially elastic wave shape (sinusoidal wave shape), but when the pitch is 0.1 to 0.5 mm, the width is formed to be half of the pitch and the required width of the electrical connector is formed. Is done. The width of the metal connection plate 8 is set to 0.1 in consideration of conduction between the electronic circuit board 1 and the electric joint 3 and formation of the connection contact 9.
0.5 mm, preferably 0.1 mm to 0.3 mm.

As shown in FIGS. 1 to 3, the support layer 10 is formed in a vertically long elastic plate shape using an electrically insulating material, particularly a material which forms a crosslinked structure after curing. This improves the protection and handleability of the connector, and contributes to the insulation between the electronic circuit board 1 and the electronic components. As a material of the support layer 10, for example, silicone rubber,
Polybutadiene rubber, natural rubber, polyisoprene rubber,
Examples thereof include urethane rubber, chloroprene rubber, polyester rubber, styrene / butadiene copolymer rubber, epichlorohydrin rubber, and foamed materials thereof. Among these, silicone rubber having excellent electrical insulation, heat resistance, and compression set of the cured product is preferable. In particular, in order to minimize the load during compression connection, the hardness after curing is 15 ° to 50 ° H, preferably At 40 ° -50 ° H,
A sheet of silicone rubber of 0.5-1.5 mm is optimal.

As the adhesive 11, a known type is appropriately used, but a room temperature curing type, particularly an addition reaction type silicone is suitable.

Next, a method of manufacturing the electric connector will be described. First, a conductive metal thin plate is etched and a corrugated metal connecting plate 8 is arranged between a plurality of connecting pieces 12 at predetermined intervals (see FIG. 1). 4 (a)). After the plurality of metal connection plates 8 are formed in a bridged state in this manner, the plurality of metal connection plates 8 that are curved in a wavy manner are sandwiched between a pair of insulating elastics 13 via an adhesive 11A to form the elastic matrix layer 7 ( As shown in FIG. 4 (b), each metal connecting plate 8 exposed from both end surfaces of the elastic matrix layer 7 is formed.
Is irradiated with a laser beam (see arrow), and the spherical connection contact 9 is slightly exposed to form a molten state (FIG. 4 (c)).
Then, the plurality of connecting pieces 12 are removed. Then, on both sides of the elastic matrix layer 7,
If the insulating support layers 10 are bonded to each other via the adhesive 11, an electrical connector can be manufactured (FIG. 4).
(d)).

After the electric connector is obtained, the electric connector is connected to the electronic circuit board 1 and the electric joint 3 by the liquid crystal light guide plate 5.
To be pinched. Then, when the electric joint 3 is pressurized and compressed on the electronic circuit board 1, the plurality of metal connection plates 8 of the electric connector are elastically deformed to conduct the electronic circuit board 1 and the electric joint 3 (see FIG. 1). .

According to the above configuration, since the metal connection plate 8 is curved in a wave shape and the spherical connection contacts 9 are formed at both ends by melting, the volume resistance value of the metal connection plate 8 is 0.1Ωc.
m or less, and the variation of the resistance value is also very small, so that it can be reliably used for conducting various circuits that require a low resistance current and a semiconductor package that requires a small current with a low resistance value. In addition, 100 mA is applied to the metal connection plate 8.
, The temperature does not rise above 50 ° C. Further, even if the elastic matrix layer 7 is compression-connected by 15%, the stress can be suppressed to 5 to 10 kgf / cm ^2, and a suitable electrical connector can be reliably obtained.

Further, since the metal connecting plate 8 is curved in a wavy shape, the metal connecting plate 8 does not buckle due to the elastic action, and stable conduction can be greatly expected even under a low load. Furthermore, spherical connection contacts 9 are provided at each end of the metal connection plate 8.
Is formed, reliable conduction can be achieved even with the flat electrodes 2 and 4 that do not protrude. Furthermore, since the metal connection plate 8 is formed by etching, the width, pitch, and wave shape of the metal connection plate 8 can be easily changed freely.

FIGS. 5 and 6 show a second embodiment of the present invention. In this case, a flat electronic circuit board 1 is used.
A plurality of metal connection plates 8 are arranged in a line in the vertical thickness direction of the elastic matrix layer 7 interposed between the metal connection plate 3 and the electrical joint 3 made of a semiconductor package (PGA). In addition, a spherical connection contact 9 that contacts the electrode 2 of the electronic circuit board 1 is formed by laser, and the other end of each metal connection plate 8 has a spherical connection contact 9 that contacts the electrode 4 of the electric joint 3. Is formed by laser, and a plurality of elastic matrix layers 7 are arranged in the front-rear direction or the left-right direction to form an electrical connector. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted.

In this embodiment, the same operation and effect as those of the above embodiment can be expected, and the support layer 10 can be omitted. Further, it is possible to facilitate the connection of the surface-mounted semiconductor package.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the electrical connector according to the present invention and a method for manufacturing the same will be described. Example 1 First, a conductive metal sheet was pitch 0.5 mm and width 0.2.
The metal connection plates 8 were etched under conditions of 1.0 mm and 1.0 mm in length, and 660 metal connection plates 8 were arranged at predetermined intervals between the plurality of connection pieces 12 and connected. 0.02m thick as a thin metal plate
A 200 mm square thin copper plate was used. After the plurality of metal connection plates 8 are connected in this manner, the plurality of metal connection plates 8 having a wavy shape are adhesively vulcanized between a pair of insulating elastic members 13 to form an elastic matrix layer 7. The ends of the metal connection plates 8 exposed from both end surfaces of the metal connection plate 7 were irradiated with carbon dioxide laser light to melt and form spherical connection contacts 9 having a diameter of 0.2 mm, and the plurality of connection pieces 12 were removed. As each of the elastics 13, a silicone rubber sheet coated with a silicone adhesive and having a thickness of 0.1 mm and a rubber hardness of 40 ° H was used.

Then, an insulating support layer 10 is adhesively vulcanized on both sides of the elastic matrix layer 7 to obtain a length of 20 mm, a height of 1.4 mm and a thickness of 2.4 m.
An electrical connector having a size of m was manufactured. Each support layer 1
As 0, a silicone rubber sheet having a thickness of 1.0 mm and a rubber hardness of 50 ° H to which a silicone adhesive as the adhesive 11 was applied was used.

After the electrical connector is obtained in this manner, the electrical connector is sandwiched between the electronic circuit board 1 and the electrical connector 3 including the liquid crystal module via the liquid crystal light guide plate 5, and the electrical connector 3 is pressed onto the electronic circuit board 1. It compressed and made the electronic circuit board 1 and the electrical joint 3 electrically connected. The plurality of electrodes 2 of the electronic circuit board 1 are arranged at a pitch of 0.5 mm. Similarly, the plurality of electrodes 4 of the electric joint 3 are arranged at a pitch of 0.5 mm. When the elastic matrix layer 7 was compression-connected by 15%, the compression load could be suppressed to 8 kgf / cm ² , and the electronic circuit board 1 was confirmed to have stable warpage without warpage.

Example 2 First, a thin metal plate was etched under the conditions of a pitch of 0.5 mm, a width of 0.2 mm, and a length of 1.0 mm to form a plurality of connecting pieces 12.
In between, 660 metal connecting plates 8 were arranged at predetermined intervals and connected. As a metal thin plate, a copper plate 0.2 mm thick and 200 mm square was used. After the plurality of metal connection plates 8 are connected, the plurality of corrugated metal connection plates 8 are adhesively vulcanized between a pair of elastics 13 to form an elastic matrix layer 7. Both end surfaces of the elastic matrix layer 7 are formed. A carbon dioxide laser beam is applied to the end of each metal connection plate 8 exposed from the above to melt and form a spherical connection contact 9 having a diameter of 0.2 mm, and a plurality of connection pieces 12 are removed, and a length of 20 mm and a height of 20 mm. 1.4m
An elastic matrix layer 7 having a thickness of m and a thickness of 2.4 mm was produced.

Each elastic 13 has a thickness of 0.15 mm coated with a silicone adhesive and a rubber hardness of 40 ° H.
Was used. After that, a plurality of elastic matrix layers 7 were arranged in the front-rear direction or the left-right direction to produce an electrical connector having a height of 1.4 mm, a size of □ 20 mm, and 1600 contacts.

After obtaining the electrical connector, the inspection circuit board 1A
The electric connector is positioned and sandwiched between the electric circuit 3 and the electric package 3 made of a semiconductor package (PGA), and the electric circuit 3 is pressurized and compressed to the test circuit board 1A to make the test circuit board and the electric circuit 3 conductive. The number of electrodes of the electric junction 3 is 1225. Conduction was obtained from the 0% compression connection of the elastic matrix layer 7, and complete conduction was confirmed when the compression load was set to 6 kgf / cm ² .

[0029]

As described above, according to the first or third aspect of the present invention, the resistance can be reduced to suppress the variation, and can be used for an analog circuit, a high-frequency circuit, and the like. There is an effect that the range can be expanded.

[Brief description of the drawings]

FIG. 1 is a partial sectional view showing an embodiment of an electric connector according to the present invention.

FIG. 2 is a perspective explanatory view showing an embodiment of an electrical connector and a method of manufacturing the same according to the present invention.

FIG. 3 is an explanatory sectional view showing an embodiment of the electric connector according to the present invention.

FIG. 4 is a sectional explanatory view showing an embodiment of a method for manufacturing an electrical connector according to the present invention, and FIG. 4 (a) shows a state in which a metal thin plate is etched to mount a plurality of metal connecting plates between connecting pieces. FIG. 2B is a cross-sectional view showing a state in which an elastic matrix layer is formed by sandwiching and adhering a corrugated metal connecting plate between a pair of elastics, and FIG. 1C is a sectional view showing each metal connection projecting from the elastic matrix layer. FIG. 4 is a cross-sectional view showing a state in which a connection contact is formed by irradiating an end of the plate with a laser beam, and FIG. 4D is a cross-sectional view showing a state in which a support layer is bonded to both side surfaces of an elastic matrix layer.

FIG. 5 is an explanatory cross-sectional view showing a second embodiment of the electrical connector according to the present invention.

FIG. 6 is a perspective explanatory view showing a second embodiment of the electric connector according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic circuit board 1A Inspection circuit board 2 Electrode (counter electrode) 3 Electrical joint 4 Electrode (counter electrode) 7 Elastic matrix layer 8 Metal connection board 9 Connection contact 10 Support layer 11 Adhesive 11A Adhesive 12 Connecting piece 13 Elastic

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E023 AA04 AA05 AA16 AA18 BB16 BB22 CC02 CC22 CC26 DD26 EE18 FF07 HH06 HH11 HH18 5E051 CA04

Claims (3)

[Claims] 1. An electrical connector for conducting a counter electrode, wherein both ends are substantially spherical in the thickness direction of an insulating elastic matrix layer interposed between an electronic circuit board and an electrical joint. An electrical connector comprising a plurality of narrow, substantially corrugated metal connection plates provided with insulation therebetween. 2. The electrical connector according to claim 1, further comprising an insulating support layer on at least both sides of the elastic matrix layer along the thickness direction. 3. A method of manufacturing an electrical connector for electrically connecting an electronic circuit board and an electrical joint, comprising: an elastic matrix having a plurality of thin metal connecting plates curved in a substantially wave shape sandwiched between a plurality of insulating elastics. A layer is formed, and both ends of each metal connection plate exposed from the elastic matrix layer are respectively laser-processed to form substantially spherical connection contacts. An insulating support layer is formed on at least both side surfaces of the elastic matrix layer. And a method of manufacturing an electrical connector.