JP2000049432A - Connection member - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a connection member for excellently suppressing short- circuiting due to work errors. SOLUTION: This connection member 1 for connecting a substrate 21 provided with a part where terminals 201 are parallelly arranged with a fixed pitch by an anisotropic conductive adhesive material 3 is composed of an insulation base material 102 and a conductor 101. In this case, on the part to be connected to the terminal 201 of the substrate 21, the conductor 101 of a width less than 1/3 of the width of the terminal 201 of the substrate 21 is provided. It is desirable that the pitch between the terminals at the part of a fixed pitch is in the range of 0.02-2 mm.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connecting member, particularly to a connecting member for connecting to a substrate.

[0002]

2. Description of the Related Art Heretofore, connection between boards has been performed by connectors and cables or jumper wires. However, with the development of electronic devices, small and thin, low-priced devices have been required, such as the need to reduce the amount of connector mounting and the cost of connectors, and jumper wires have also been required. The fact is that the connection points are cut off.

Further, it is necessary to connect to a substrate having a fine electrode pattern such as a liquid crystal display device, and use a substrate having a terminal pattern corresponding to such a fine electrode pattern and an anisotropic conductive adhesive. A connection method has been developed.

In such a connection, the substrate to be connected and the liquid crystal substrate have different coefficients of thermal expansion, or the substrate and the liquid crystal substrate must be mounted in an overlapping manner. In many cases, a flexible base material having a connection terminal pattern formed thereon is used for the connection, and in some cases, it is necessary to combine three types of base materials having different coefficients of thermal expansion.

In such a case, it has been proposed that, when bonding the substrate and the connecting member, positioning is performed while heating, and connection is performed while extending the connecting member.

[0006]

However, if the terminals of the substrate to be connected are arranged in a line at a constant interval, when bonding the substrate and the connecting member, the positioning is performed while heating, and the connecting member is connected. Connecting while stretching,
Although effective for bonding substrates having different coefficients of thermal expansion to each other, there is a problem that the number of terminals is large, and a slight operation error of bonding causes a short between adjacent terminals.

[0007] It is an object of the present invention to provide a connecting member which is excellent in suppressing a short circuit due to a work error.

[0008]

As shown in FIG. 1A, a connecting member according to the present invention comprises a substrate 21 having terminals 201 arranged in parallel at a constant pitch and an anisotropic conductive adhesive. As shown in FIG. 1B, a connecting member 1 for connecting with an agent 3, which is composed of an insulating base material 102 and a conductor 101, is connected to a terminal 201 of the substrate 21 as shown in FIG.
1 is the surface not in contact with the insulating base material 102 and the substrate 2
1 is characterized by having a conductor 101 having a width of 1/3 or less of the terminal width.

It is preferable that the pitch between the terminals of the portion having a constant pitch is in the range of 0.02 to 2 mm.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In the present invention, a glass substrate on which a liquid crystal cell is formed, another printed wiring board, or a semiconductor package such as a flip chip or a flat package can be used as the substrate.

If the pitch between the terminals in the portion where the pitch is constant is less than 0.02 mm, it is not economical to use a method of etching a normal wiring board, and if it exceeds 2 mm, heating is performed. Connection can be efficiently performed without extending the connection member.
It is preferably in the range of 2 mm, more preferably
It is in the range of 0.04 to 0.2 mm.

In the connection member of the present invention, the terminal is preferably a conductor, and the conductor and an insulating base material for supporting the conductor are preferable. Specifically, the conductor includes a metal foil, particularly a copper foil or a copper foil. What is used for a normal printed wiring board such as aluminum foil is suitable for forming a conductor, and the insulating base material is preferably a flexible insulating material,
For example, there are a glass cloth epoxy resin impregnated base material having a thickness of 0.2 mm or less, a polyester film, a polyimide film, and the like. Among them, a glass cloth epoxy resin impregnated base material and a polyester film are preferable because of excellent portability and workability. In addition, in order to adjust the alignment of the terminals by heating and adjusting the difference in the base material having a different coefficient of thermal expansion, it is more preferable that the insulating base material of the connection member has a uniform coefficient of thermal expansion, In addition, a metal plate coated with an insulating material can be used.

[0013]

EXAMPLE MCL-E-679 (a product manufactured by Hitachi Chemical Co., Ltd., a copper-clad laminate having a thickness of 0.2 mm, in which a copper foil having a thickness of 18 μm was bonded to one surface of a glass cloth epoxy resin base material) HN-920 (trade name, manufactured by Hitachi Chemical Co., Ltd.), which is a dry film for an etching resist, was laminated on the substrate, and the light was turned into a shape of a terminal 201 having a width of 0.03 mm arranged in parallel at a pitch of 0.06 mm. Printed wiring on which a terminal 201 is formed by superposing a photomask that transmits light, irradiating and developing ultraviolet rays, forming an etching resist, and etching away unnecessary portions of the copper foil not covered with the etching resist. A plate was made as the substrate 21. A copper foil having a thickness of 18 μm was attached to one surface of a glass cloth epoxy resin base material serving as the insulating base material 102.
MCL-E-67 which is a copper-clad laminate having a thickness of 0.2 mm
HN-920 (trade name, manufactured by Hitachi Chemical Co., Ltd.), which is a dry film for an etching resist, was laminated on 9 (trade name, manufactured by Hitachi Chemical Co., Ltd.),
Conductors 10 having a width of 0.01 mm arranged in parallel at a pitch of 6 mm
A photomask that transmits light in the shape of 1 is superimposed, irradiated with ultraviolet light, developed, and an etching resist is formed. Unnecessary portions of the copper foil not covered with the etching resist are removed by etching. The connection member 1 on which 101 was formed was produced. At this time, the etching amount was experimentally determined in advance, and the spray pressure of the etching solution and the etching time were controlled such that the conductor width at the portion in contact with the insulating base material 102 was 0.03 mm. AC-7244 (trade name, manufactured by Hitachi Chemical Co., Ltd.), which is a film-shaped anisotropic conductive adhesive 3 having a width of 1.2 mm, was laminated on the conductor 101 of the connecting member 1 to prepare the first. Align printed circuit board, 2MP at 170 ° C
a, bonding was performed by heating and pressing under the conditions of 10 seconds. In this way, 100 sheets were connected, but no connection failure was found.

[0014]

As described above, according to the present invention, it is possible to provide a connecting member which is excellent in suppressing a short circuit due to a work error.

[Brief description of the drawings]

FIG. 1A is a top view showing an embodiment of the present invention, and FIG. 1B is a sectional view thereof.

[Explanation of symbols]

1. Connection member 101. Conductor 102. Insulating base material 21. Substrate 201. Terminal 3. Anisotropic conductive adhesive

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor: Toshiaki Iso, 1500 Oji Ogawa, Shimodate City, Ibaraki Prefecture Inside Hitachi Chemical Electronics Co., Ltd. 72) Inventor Kunio Misaki 1500 Ogawa, Shimodate-shi, Ibaraki F-term in Hitachi Chemical Electronics Co., Ltd. (Reference) 5E344 AA02 AA22 BB05 CC19 CC23 5G435 AA16 AA17 EE34 EE41 EE42 KK09

Claims (2)

[Claims] 1. A connection member for connecting with a substrate having portions in which terminals are arranged in parallel at a fixed pitch and an anisotropic conductive adhesive, the connection member comprising an insulating base material and a conductor, A conductor having a width of not more than 1/3 of the terminal width of the substrate on a surface where the width of the conductor is not in contact with the insulating base material at a location where the connection is made. 2. The connecting member according to claim 1, wherein a pitch between terminals of the portion having a constant pitch is in a range of 0.02 to 2 mm.