JP2001320187A - Liquid type cooler for electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To overcome a defect that since in a cooler both the driving motor of a pump for circulating its cooling liquid and the driving motor of its air- cooling fan are required, the space for the cooler becomes large, and therefore, the size of the cooler is made larger than a standardized cooler to make impossible its attachment to a standardized electronic appliance. SOLUTION: A liquid type cooler for electronic parts is provided with an MPU1 of a highly heat generating component, a heat transferring body 2 attached to the MPU1, and a liquid-air heat exchanger 3 coupled to the heat transferring body 2 and having in its inside circulating passages for a cooling liquid. In the liquid type cooler, the driving of its pump for circulating the cooling liquid and the driving of its fan attached to the liquid-air heat exchanger 3 are performed forcedly by using a single motor 4 as a power source. Therefore, a space saving is made possible in the liquid type cooler.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid cooling device used for cooling electronic components which are components generating high heat.

[0002]

2. Description of the Related Art A conventional MPU cooling device is an air-cooling type cooling device shown in FIG. 9, in which a heat transfer body 117 having a plurality of fins is provided on the surface of an MPU 116, and an air cooling fan is provided so as to face the fins. 118 were provided. But,
In recent years, as the processing speed of the MPU has increased, the heat generated by the MPU has also increased, and it has been impossible to sufficiently cool the air-cooled cooling device using a fan.

Therefore, as disclosed in Japanese Patent Application Laid-Open No. Hei 10-213370, a cooling passage is provided in a heat transfer plate connected to an MPU, and cooling is performed by flowing a cooling liquid through the passage. Further, in the cooling device disclosed in Japanese Patent Application Laid-Open No. H10-213370, a plurality of fins are provided in a radiator for cooling a coolant, and an air-cooling fan is provided so as to face the fins so that heat of the radiator can be easily radiated. I have.

[0004]

However, such a cooling device also has some problems. The cooling device requires two motors, a pump driving motor for refluxing the cooling liquid and an air cooling fan motor for driving the air cooling fan, and the space for the cooling device is increased. Therefore, the size of the cooling device becomes larger than that of a cooling device having a standardized size, and the cooling device cannot be mounted on a standardized electronic device.

The present invention has been made in view of the above problems, and has as its object to provide a space-saving and highly safe cooling device.

[0006]

SUMMARY OF THE INVENTION The present invention provides an electronic component which is a component generating high heat, a heat transfer member attached to the electronic component, and a circulation of a cooling liquid connected to the heat transfer member. A liquid-air heat exchanger having a cooling passage, and a liquid drive of an electronic component powered by a single motor using a pump drive for circulating a cooling liquid and a fan drive attached to the liquid-air heat exchanger A cooling device that uses a single motor as a power source for driving a pump for circulating a cooling liquid and driving a fan attached to a liquid-air heat exchanger, thereby saving space.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention relates to an electronic component which is a component generating high heat, a heat transfer member attached to the electronic component, and a passage for circulating a cooling liquid connected to the heat transfer member. A liquid-air heat exchanger having a pump unit for circulating a cooling liquid and a fan unit mounted on the liquid-air heat exchanger using a single motor as a power source. It is a liquid cooling device for electronic components, and a single motor serves as a power source for driving a pump for circulating a cooling liquid and driving a fan attached to a liquid-air heat exchanger, thereby saving space.

Further, according to the present invention, the cooling performance is excellent because the cooling liquid circulation passage of the liquid-air heat exchanger passes through the inside of the heat transfer body.

Further, according to the present invention, a part of the liquid-air heat exchanger is used as a heat transfer body, so that the liquid-air heat exchanger and the heat transfer body are integrated, Since the transfer body is a single package, the assembly of the liquid-air heat exchanger and the heat transfer body is not displaced, and leakage of the coolant can be prevented.

Further, in the cooling device for electronic parts of the present invention, the liquid-air heat exchanger and the heat transfer element are connected by a cooling liquid passage pipe, so that the distance between the liquid-air heat exchanger and the heat transfer element is increased. Can be placed in

Further, in the cooling device for electronic parts of the present invention, since the material of the cooling liquid passage pipe is resin, it is easy to bend and the liquid-air heat exchanger and the heat transfer body can be freely arranged. .

Further, in the cooling device for electronic parts according to the present invention, the liquid cooling apparatus for electronic parts in which the pump section is embedded in the liquid-air heat exchanger is characterized in that the cooling liquid passes through the liquid-air heat exchanger. A simple configuration can be achieved by passing through the pump section.

Further, according to the present invention, the motor is an outer rotor type motor. By providing a fan on the outer rotor of this motor, downsizing can be achieved.

Further, according to the present invention, the rotational speed of each of the fan and the pump is changed to a different rotational speed by a transmission between the motor output shaft and the pump rotational shaft or between the motor output shaft and the fan rotational shaft. Can be driven at the most efficient rotation speed in each of the fan and the pump,
The cooling efficiency can be maximized.

Further, according to the present invention, the liquid-air heat exchanger is provided with a radiating fin, and the fan is disposed so as to face the radiating fin, so that the heat radiation is excellent.

Further, in the liquid cooling device of the present invention, the motor unit and the pump unit may be integrated, or the distance between the pump unit and the motor unit may be shorter than the length of the radiation fins in the liquid-air heat exchanger. By arranging the part between the radiating fins of the liquid-air heat exchanger and the fan part, the rotating shaft connecting the liquid-air heat exchanger can be shortened.

[0017]

(Embodiment 1) FIG. 1 shows the basic concept of the present invention. The liquid cooling device of the present invention includes a heat transfer body 2 and a liquid-air heat exchanger 3 attached to an electronic component MPU 1 which is a high heat generating component, and circulates a cooling liquid by a single motor 4. The pump 5 and the fan 6 for air-cooling the liquid-air heat exchanger are driven.

A feature of the present invention is that the pump 5 and the fan 6 are driven by a single motor 4.

The liquid cooling apparatus for electronic parts according to the first embodiment shown in FIG. 2 includes an MPU 11 disposed on a substrate 20 and a part of a liquid-air heat exchanger attached to the MPU 11 which is a heat transfer member. By doing so, the liquid-air heat exchanger and the heat transfer body are integrated with the liquid-air heat exchanger and the heat transfer body, and the liquid-air heat exchanger and the heat transfer body are integrated. An air-cooling fan 16 for forcibly cooling the unit 18 and a pump 15 driven by a drive motor in the fan are provided for cooling the unit 18 of the liquid-air heat exchanger and the heat transfer body. The cooling liquid is circulated in the liquid circulation passage 17 by the pump 15.

Between the MPU 11 and the integrated body 18 of the liquid-air heat exchanger and the heat transfer body, silicon grease having high thermal conductivity is applied between the joints in order to prevent heat transfer by air bubbles. , MPU 11, the liquid-air heat exchanger, and the heat transfer body 18 are fixed.

As shown in FIG. 2, the cross section taken along the line AB in the integrated body 18 of the liquid-air heat exchanger and the heat transfer body is meandering in order to increase the heat transfer efficiency. Is provided.

As shown in FIG. 4, the motor 14 used in this embodiment is an outer rotor type motor, and includes a magnet 21, a stator 22, and a coil 23. A fan 16 is provided on an outer rotor 24 of the motor. In this embodiment, the motor is arranged in the fan. However, the motor may be arranged in the pump, and the fan may be driven by the output shaft.

In the conventional electronic component cooling device, the heat transfer body and the liquid-air heat exchanger are separate bodies, and the heat transfer body and the liquid-air heat exchanger are connected by a circulation passage such as a tube. Therefore, there is a problem that if the accuracy of the assembly is poor, or if a large impact is applied, the coolant may leak from the circulation passage and the joint thereof. However, in the present embodiment, since the coolant pump drive and the air-cooling fan drive are driven by a single motor as the power source, space can be saved. Furthermore, since the liquid-air heat exchanger and the heat transfer element are in a single package, the assembly of the liquid-air heat exchanger and the heat transfer element is not displaced, and leakage of the coolant can be prevented. it can.

In this embodiment, the pump 15 is installed independently on the integrated body 18 of the liquid-air heat exchanger and the heat transfer body, but the pump 15 is integrated with the liquid-air heat exchanger and the heat transfer body. Thing 1
If it is buried and installed in the inside 8, further miniaturization becomes possible.

Further, a plurality of fans and pumps may be driven by a single motor.

Further, a plurality of the liquid cooling devices may be provided in the computer.

By circulating the cooling liquid through the meandering circulation passage 17 in the integrated body 18 of the liquid-air heat exchanger and the heat transfer body, the integrated body 1 of the liquid-air heat exchanger and the heat transfer body is formed.
Since the heat can be transmitted to the details of FIG. 8, the MPU 11 can be efficiently cooled.

(Embodiment 2) A liquid cooling apparatus for electronic parts according to Embodiment 2 shown in FIG.
U21 and a liquid-air heat exchanger integrated with a liquid-air heat exchanger and a heat transfer body by using a part of the liquid-air heat exchanger attached to the MPU 21 as a heat transfer body And a heat transfer body, an air cooling fan 26 for forcibly cooling the integrated body 28 of the liquid-air heat exchanger and the heat transfer body, and a transmission 35 by a drive motor 24 in the fan. The cooling liquid is circulated by the pump 25 through the cooling liquid circulation passage 27 in the integrated body 28 of the liquid-air heat exchanger and the heat transfer body.

The transmission 35 between the motor output shaft 29 and the pump rotation shaft allows the respective rotation speeds of the fan 26 and the pump 25 to be different from each other. It can be driven at an efficient rotation speed, maximizing cooling efficiency. In this embodiment, the transmission 35 is provided between the motor output shaft and the pump rotation shaft. However, the same effect can be obtained by providing a transmission between the motor output shaft and the fan rotation shaft.

(Embodiment 3) A liquid cooling apparatus for electronic parts according to Embodiment 3 shown in FIG.
U41 and the heat transfer body 4 attached to the MPU 41
2, a liquid-air heat exchanger 43, an air-cooling fan 46 for forcibly cooling the liquid-air heat exchanger, and a pump 45 driven by a drive motor 44 in the fan. The circulation passage 4 of the liquid-air heat exchanger 43
7, a connecting pipe 48, and a circulation passage 50 of the heat transfer body 42.
And the cooling liquid is circulated by the pump 45.

In the third embodiment, the heat transfer member 42 and the liquid-to-air heat exchanger 43 are separated from each other, and cooling is performed at a position where the liquid-to-air heat exchanger 43 and the heat transfer member 42 are separated from each other. Actions can be taken. When the space between the liquid-air heat exchanger 43 and the heat transfer body 42 is wide, the cooling efficiency is excellent. The connecting pipe 48 connecting the heat transfer body 42 and the liquid-air heat exchanger 43 is made of a deformable material such as resin such as vinyl chloride, so that the connection pipe 48 is easily bent, and the heat transfer body 42 and the liquid-air heat The positional relationship of the heat exchanger 43 can be freely set, and the degree of freedom in designing is widened.

Although the pump 45 is provided so as to be embedded in a part of the liquid-air heat exchanger 43, the fan 44 and the pump 45 are driven to rotate by the same motor 44. 45 are connected by a rotating shaft 50.

The cooling liquid radiates heat when passing through the liquid-air heat exchanger 51. The circulation path in the liquid-air heat exchanger 43 has a series of two circulation paths as shown in FIG. In place. The pump 45 is connected to the entrances 52 and 53 of the circulation passage 47. By the operation of the pump 45, the cooling liquid circulates through the liquid-air heat exchanger 43, the connection pipe 48, and the heat transfer body 42, and absorbs the heat absorbed by the heat transfer body 42 through the connection pipe 48. The heat is radiated by the liquid-air heat exchanger 43.

The space between the MPU 41 and the heat transfer body 43 is
Silicon grease having high thermal conductivity is applied between the joints in order to prevent the transmission of heat due to bubbles.
3 is fixed to the MPU 41.

(Embodiment 4) A liquid cooling apparatus for electronic parts according to Embodiment 4 shown in FIG.
U61 and the heat transfer body 6 attached to the MPU 61
2, a liquid-air heat exchanger 63, an air-cooling fan 66 for forcibly air-cooling the liquid-air heat exchanger, and a pump 65 integrated with a drive motor 64 in the fan.
The cooling liquid is circulated by the pump 65 in the cooling liquid circulation passage 67.

The fan drive motor 64 and the pump 65 are structurally integrated, and the pump 65 is driven using the power of the fan drive motor 64.

By integrating the fan drive motor 64 and the pump 65, the parts for manufacturing the fan drive motor 64 and the pump 65 are shared, so that the number of parts at the time of manufacture can be reduced. .

Further, with this configuration, the distance between the center of the fan rotation shaft and the center of the pump rotation shaft can be shortened.
When transmitting the power of the motor 64 to the fan 66 and the pump 65 using the output shaft, the motor 4 can transmit the power accurately without causing shaft runout.

[0039]

The liquid cooling apparatus for electronic parts according to the first and second aspects of the present invention uses a single motor as a power source for driving the cooling liquid pump and driving the air-cooling fan, so that space can be saved. Become. Further, by using a part of the liquid-air heat exchanger as a heat transfer body, it is possible to perform cooling with high space efficiency, high cooling efficiency, and high safety.

Further, according to the third aspect of the present invention, the heat transfer body and the liquid-air heat exchanger are integrated to prevent leakage of the cooling liquid.

In the invention according to the fourth aspect, the heat transfer body and the liquid-air heat exchanger are provided separately, and the cooling effect is excellent.

According to the fifth aspect of the present invention, the passage pipe is bent, so that the cooling device can be freely designed.

The invention according to claim 6 is easy to assemble with a simple configuration.

Further, according to the ninth aspect of the present invention, the number of revolutions of the fan unit and the pump unit can be adjusted to the optimum, so that efficient cooling is possible.

According to the tenth aspect of the present invention, the liquid-to-air heat exchanger is provided with a radiating fin, and the fan is disposed so as to face the radiating fin.

The invention according to claims 11 and 12 provides:
Since the rotating shaft connecting the motor unit and the pipe unit can be set short, stable rotational driving is possible.

[Brief description of the drawings]

FIG. 1 is a conceptual diagram of the present invention.

FIG. 2 is a diagram showing a first embodiment of the present invention.

FIG. 3 is a cross-sectional view of an integrated body of the liquid-air heat exchanger and the heat transfer body of FIG. 2;

FIG. 4 is a detailed view of a fan and a motor in FIG. 2;

FIG. 5 is a diagram showing a second embodiment of the present invention.

FIG. 6 is a diagram showing a third embodiment of the present invention.

FIG. 7 is a sectional view of an integral part of the liquid-air heat exchanger of FIG. 6;

FIG. 8 is a diagram showing a fourth embodiment of the present invention.

FIG. 9 is a diagram showing a conventional cooling device for electronic components.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 MPU 2 Heat transfer body 3 Liquid-air heat exchanger 4 Motor 5 Pump 6 Fan 7 Circulation path 8 Integrated thing of liquid-air heat exchanger and heat transfer body 9 Motor output shaft 10 Substrate 11 Magnet 12 Stator 13 Coil 14 Outer Rotor 15 Transmission 16 MPU 17 Heat transfer body 18 Air cooling fan

Continued on the front page (72) Inventor Taro Kishibe 1006 Kazuma Kadoma, Kazuma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. Person Miyuki Furuya 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture (72) Inside of Matsushita Electric Industrial Co., Ltd. 1006 Oaza Kadoma Matsushita Electric Industrial Co., Ltd. F term (reference) 5E322 AA01 AA07 BB01 BB03 DA01 EA11

Claims (11)

[Claims] An electronic component which is a component generating high heat, a heat transfer member attached to the electronic component, and a liquid connected to the heat transfer member and having a cooling liquid circulation passage therein.
The pump drive of the pump section that circulates the cooling liquid and the fan drive of the fan section attached to the liquid-air heat exchanger are equipped with an air heat exchanger. Cooling system. 2. The liquid cooling device for electronic parts according to claim 1, wherein a circulation path of a cooling liquid of the liquid-air heat exchanger passes through the inside of the heat transfer body. 3. The liquid cooling device for an electronic component according to claim 1, wherein a part of the liquid-air heat exchanger serves as a heat transfer body. 4. The liquid cooling device according to claim 1, wherein the liquid-air heat exchanger and the heat transfer body are connected by a connecting pipe. 5. The connecting pipe is made of a resin.
A liquid cooling device for an electronic component as described in the above. 6. A liquid cooling device for electronic parts having a pump section embedded in a liquid-air heat exchanger, wherein the cooling liquid passes through the pump section while passing through the liquid-air heat exchanger. Liquid cooling device. 7. The liquid cooling device for electronic parts according to claim 1, wherein the motor is an outer rotor type motor, and a fan is provided on the outer rotor of the motor. 8. The liquid cooling device for electronic parts according to claim 1, wherein a transmission is provided between the motor output shaft and the pump rotation shaft or between the motor output shaft and the fan rotation shaft. 9. The liquid cooling device for electronic parts according to claim 1, wherein the liquid-air heat exchanger includes a radiation fin, and a fan is arranged to face the radiation fin. 10. The liquid cooling device for electronic parts according to claim 1, wherein the motor section and the pump section are integrated. 11. The liquid cooling device for electronic parts according to claim 9, wherein the pump section is disposed between the radiating fins of the liquid-air heat exchanger and the fan section.