JP2001298235A - Electronic component mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem of the conventional mounting means by chick components are mounted on the solder on a substrate before melting, hence the mounting height of the mounted components adhered to the substrate is not fixed because of the thickness variation of the adhering solder, the mounted components are tilted, the mounting height variation of the components or tilt between the mounted components exceeded an allowable range of the optical axis adjustment, and the light receiving surface height of the mounted components and the optical path are not aligned to result in the growth of an optical loss. SOLUTION: The surface of a mounted component 13 is aligned with an extension plane of the surface of a reference component 3 at a high accuracy. Thus, the mounting positional relation between the components can be accurately held to enable the high accuracy mounting for mounting optical modules, etc., irrespective of the thickness variation of solder 14, the mounting position failure of the reference component 3 and the distortion of the substrate 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to an electronic component, in particular,
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting device for mounting a plurality of electronic components constituting an optical module on one substrate, and to a mounting device capable of minimizing optical loss.

[0002]

2. Description of the Related Art A configuration of a conventional mounting apparatus for mounting a plurality of electronic components constituting an optical module on one substrate will be described with reference to FIGS.

As shown in FIG. 11A, an optical module obtained by a conventional mounting apparatus includes a substrate 102, a mounting component 113 for mounting, and a bonding material 104 on the substrate 102 in advance.
Mounted component 103 mounted by the above, and solder 1 necessary for bonding mounted component 113 to substrate 102
14.

On the other hand, as shown in FIG. 10, a conventional mounting device for obtaining the optical module includes a solder cutout portion 121 for cutting a joining solder 114 supplied in a tape shape to a required length, and a cutout solder 121. And a mounting head 130 that holds a mechanism for adsorbing components and performs a mounting operation, and a contact sensor 1 that detects contact between the components 113 and the substrate 102 during the mounting operation.
31, a mounting head moving mechanism 132 for operating the mounting head 130 in the XYZ directions, and a mounting stage 140 on which the substrate 102 is installed and which holds a heater for heating the bonding solder 114.

Next, the structure of the mounting head will be described with reference to FIG.

The mounting head section includes a mounting head 130 having a mechanism for sucking components, and an arm 401 for supporting the mounting head 130. The arm is a contact sensor 1
31 is held.

Usually, the mounting head 130 and the contact sensor 13
1A, there is no gap as shown in FIG. 12A, but during the mounting operation, as shown in FIG.
Reference numeral 30 denotes a bonding solder 11 on the substrate 102 for mounting the component 113.
4, the mounting head 130 is lifted, and a gap is generated between the mounting head 130 and the contact sensor 131. The contact sensor 131 senses this gap and detects that the mounted component 113 has contacted the bonding solder 114.

Thereafter, the mounting head 130 and the contact sensor 13
A state in which a gap is generated between the mounting head 130 and the mounting head 130 sensing contact with an object is referred to as an ON state. The mounting head 1
A state in which 30 is lowered and there is no gap with the contact sensor 131 is called an OFF state.

Next, the component mounting operation will be described with reference to FIG.
This will be described with reference to FIGS.

First, as shown in FIG. 13, a substrate 102 on which a reference mounting component 103 previously bonded by a bonding material 104 is mounted is transferred onto a mounting stage (not shown) at the start of the mounting operation, and is mounted. The component 113 is the mounting head 13
It is absorbed and held at 0.

Here, during the description of the mounting operation in FIG.
The supply operation of the bonding solder 114 for bonding the mounting component 113 and the substrate 102 will be described with reference to FIG.

First, the bonding solder 1 supplied in a tape form
14 is cut out by a necessary length by the solder cut-out section 121 and is adsorbed by the solder supply section 120 (FIG. 14).
(A)), the solder supply unit 12 that has absorbed the bonding solder 114
0 is the bonding solder 114 to the component mounting position on the substrate 102
Is supplied (FIG. 14B).

Next, returning to the description of the mounting operation in FIG. 13, the mounting head 130 having sucked the mounting component 113 moves above the mounting position where the bonding solder 114 is located, and starts the mounting operation.

The mounting head 130 is gradually lowered from above the mounting position, and the contact sensor 131 senses contact, and stops lowering at a position where it is turned ON.

Next, heating is performed by a heater held by a mounting stage (not shown) until the bonding solder 114 is melted. When the bonding solder 114 is melted, the mounting head 130 that is holding the mounted component 113 is lowered by its own weight, and the contact sensor 131 is changed from the ON state to the OFF state. After the melting is confirmed, the heating by the heater is stopped, and the solder 114 for bonding is used.
Wait for curing.

After confirming that the solder has hardened, the mounting component 113 is released from suction and the mounting head 130 is lifted to complete the mounting operation.

Further, in another example, in order to correct that the head is lowered by its own weight due to melting of the solder, an operation of raising the mounting head by a predetermined height after the melting of the solder is performed, and positioning is performed. I was going.

In Japanese Patent Application Laid-Open No. 7-22800,
The device has means for detecting at least one of the inclination and the unevenness of the substrate surface with a sensor or the like, and measures the inclination or the unevenness of the substrate surface to be mounted before the mounting operation. Based on the result of the measurement, the component mounting height when mounting the mounted component is corrected, and the mounting operation is performed.

[0019]

However, as shown in FIG. 11, the conventional mounting means mounts the component to be mounted on the solder before melting when mounting the component on the substrate. Mounted component 10 bonded to substrate 102
In contrast to FIG. 3, the mounting height of the mounting component 113 is not constant due to the variation in the thickness of the bonding solder 114 (FIG. 11).
(A)) Further, the substrate 202 is formed by the bonding material 204.
The mounted component 213 bonded to the substrate 202 by the bonding solder 214 may be mounted on the mounted component 203 bonded to the substrate 202 at an angle (FIG. 11B).

Further, even when the mounting height is raised to the taught mounting height, the mounting height may not be constant due to variations in the thickness and warpage of the substrate.

For this reason, when mounting an optical module component or the like that needs to maintain the positional relationship between components with high accuracy,
In the mounting means as described above, the variation in mounting height and the inclination between the mounted components exceed the allowable range of the optical axis adjustment, the light receiving surface height of the mounted component does not match the optical path, or the component is mounted with a tilt. However, there is a problem that optical loss occurs due to this.

In view of the above problems, an object of the present invention is to provide an electronic component mounting apparatus for mounting a plurality of electronic components constituting an optical module on a single board, and to position the plurality of electronic components on a single board. It is an object of the present invention to provide an electronic component mounting apparatus capable of minimizing optical loss by controlling the relationship with high precision.

[0023]

According to the first aspect of the present invention, there is provided a first electronic component mounting apparatus, comprising: a substrate on which a reference component serving as a reference for other components is mounted; a stage on which the substrate is mounted; A tilt measuring mechanism for obtaining a tilt of the surface with respect to the substrate surface, and based on the tilt, the other component is placed on the substrate, and the surface of the other component is extended on an extended surface of the surface of the reference component. Characterized in that the reference component and the other component are components constituting an optical module, and the reference component is provided inside the component substantially parallel to the surface of the substrate. The tilt measuring mechanism has at least two different optical axes that penetrate each other, and the tilt measuring mechanism is located in an adhesive surface between the reference component and the substrate, and is obliquely opposed to each other across the at least two optical axes. The group at the point A first height measuring unit and a second height measuring unit for calculating a height of the surface of the component from the substrate surface; and controlling the first height measuring unit and the second height measuring unit. And a mounting control unit, wherein the mounting control unit is configured to control the position of the reference component surface determined by the first height measuring unit and the second height measuring unit.
Based on the height from the substrate surface at a point, the inclination of the reference component surface with respect to the substrate surface and the mounting height of the other component surface from the substrate surface are calculated to constitute the mounting head movable mechanism. The mounting head, after moving to a position where the other component is to be mounted on the substrate, more preferably, after moving to the mounting position of the other component on the substrate, the mounting control unit Based on the calculated inclination of the reference component surface with respect to the substrate surface and the mounting height of the other component surface from the substrate surface, position the surface of the other component on an extension of the surface of the reference component. That is.

Further, the height of the surface of the other component is set to a mounting height from the substrate surface in a plane orthogonal to the optical axis and approximately bisecting the other component. The mounting head adopts a configuration having a mechanism rotatable in each of two planes orthogonal to the substrate and orthogonal to each other.

Next, a second electronic component mounting apparatus according to the present invention includes a substrate on which a reference component serving as a reference for other components is mounted, a stage on which the substrate is mounted, and a surface on the reference component. A tilt measuring mechanism for determining a tilt with respect to the substrate surface, and a mounting head for placing the other component on the substrate based on the tilt and aligning the surface of the other component on an extension of the surface of the reference component Wherein the reference component and the other component are components constituting an optical module, and the inclination measuring mechanism is provided with two different points on the optical axis of the surface of the reference component. A first height measuring means and a second height measuring means for obtaining a height from the substrate surface, and a mounting control unit for controlling the first height measuring means and the second height measuring means And the mounting control unit is Based on the heights of two different points on the optical axis of the reference component surface from the substrate surface determined by the first height measurement means and the second height measurement means, Calculate the mounting height of the mounting head movable mechanism from the inclination of the substrate surface and the mounting height of the other component surface from the substrate surface, above the mounting position of the other component on the substrate. After the movement, more preferably, after moving to the mounting position of the other component on the board, the inclination of the reference component surface calculated by the mounting control unit with respect to the board surface and the other component surface The surface of the other component is positioned on an extension of the surface of the reference component based on the mounting height from the substrate surface.

In the first and second electronic component mounting apparatuses of the present invention, the mounting head picks up the other component and then mounts the other component at a mounting position on the substrate. Having a contact sensor for sensing a contact state of the other component with a component constituting a surface of the substrate, wherein the mounting head that has absorbed the other component includes the other component of the substrate. The mounting head and the contact sensor come into contact with each other when the component moves above the component mounting position and descends toward the surface of the substrate from there, and the other component is not in contact with the component. In a contact state, when the other component comes into contact with the structure, the mounting head and the contact sensor are in a non-contact state in which they are separated from each other, and the mounting control unit changes from the contact state to the non-contact state. When Sensing, stopping the movement of the mounting head, and the mounting head, after stopping the movement of the mounting head, the inclination of the reference component surface calculated by the mounting control unit with respect to the substrate surface and the other Based on the mounting height of the component surface from the substrate surface, while the component on the substrate is being melted, position the surface of the other component on an extension of the surface of the reference component, The other component is fixed on the substrate by solidifying the melted structure. Further, the structure is a conductive material that melts at a high temperature.

Lastly, in the first and second electronic component mounting apparatuses of the present invention, the mounting control section includes a plane position of the substrate with respect to the stage, a reference component, and a plane of the other component with respect to the substrate. A planar position correcting mechanism for correcting a position is controlled, and the planar position correcting mechanism includes a planar position correcting image processing device and a planar position correcting camera controlled by the planar position correcting image processing device. Things.

[0028]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The feature of the present invention is to measure the height of the upper surface of a component already mounted in order to make the positional relationship between the component to be mounted and the component already mounted highly accurate. Then, the mounting operation is performed such that the surface of the component to be mounted is positioned on an extension surface of the surface of the mounted component based on the measured reference surface. When the mounting reference plane is inclined, the mounting operation is performed by tilting the mounted component in consideration of the inclination angle.

By using this means, the component mounting operation can be performed irrespective of the displacement of the mounting height due to the solder thickness for joining the mounted component and the substrate, the distortion of the mounted substrate, the inclination of the mounted component, and the like. It becomes possible.

Next, an embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIG. The upper part of FIG. 2 shows a plan view of the substrate on which the components are mounted, as viewed from above, and the lower part shows a cross-sectional view of the substrate taken along the optical axis in the plan view.

In the present embodiment, as shown in FIG. 1, a component supply unit 10 for supplying a component to be mounted and a mounting head 3 for holding a mechanism for sucking the component during a component transfer / mounting operation.
0, a contact sensor 31 for detecting contact between the mounting head 30 and the component or contact between the component and the board 2 during the component suction operation or the mounting operation, and the mounting head 30 in the XYZ direction and the XZ plane for the mounting operation. There is a mounting head movable mechanism 32 for operating in the direction of the rotation axis θ2 on the rotation axis θ1 and the YZ plane.

As shown in FIG. 2, the substrate 2 on which components are mounted has a reference mounting component 3 which is used as a reference when mounting components and is mounted on the substrate 2 in advance by the bonding material 4 on the substrate 2. .

As shown in FIG. 1, as means for supplying solder 14 for joining the components to be mounted and the board 2, a solder cutting section 21 for cutting a required length during the mounting operation is provided. The cut-out solder 14 is applied to the substrate 2
And a mounting stage 40 on which the substrate 2 is set when the mounting operation is performed, is provided with a heater for heating the bonding solder 14.

A recognition device for performing the mounting operation includes an XY correction camera 50 and an XY correction image processing device 51 for correcting the positions of the mounted components and the substrate 2 in the X and Y directions.
Height measuring means 60 for measuring the upper surface height of the reference mounting component 3 mounted on the component mounting position side, and measuring the upper surface height at a position away from the component mounting position of the reference component 3 And a mounting operation control unit 70 for controlling the entire mounting operation.

The operation for supplying the bonding solder 14 is the same as in the conventional example.

However, regarding the structure of the mounting head, as shown in FIG. 3, in order to correct the inclination in the θ1 and θ2 directions, the mounting head is required to be rotatable in the θ1 and θ2 directions. The mounting head movable mechanism 32 has a head movable mechanism θ1 axis 321 and a mounting head movable mechanism θ2 axis 322.

Next, the operation of this embodiment will be described with reference to FIGS.
This will be described with reference to FIG. First, a description will be given of a supply operation procedure of members required for mounting.

First, as shown in FIG. 4, the mounting component 13 is supplied to the component supply unit 10, and the substrate 2 is mounted on the mounting stage 4.
0. The supplying operation of the joining solder 14 is the same as that of the conventional example as shown in FIG. 11. The joining solder 14 is cut out by a necessary length by the solder cutting section 21, and the joining solder 14 is Top mounted components 13
To the mounting position. The reference mounting component 3 is mounted on the substrate 2 for supplying the bonding solder 14 in advance.

Next, a procedure for taking out the mounted component 13 will be described with reference to FIGS.

First, the mounting operation control unit 70 shown in FIG.
Controls the mounting head movable mechanism 32, and controls the mounting head 3
0 is moved above the component supply unit 10 to perform an operation of attracting the mounted component 13 to the mounting head 30.

That is, the mounting head 30 is lowered, the mounting head 30 comes into contact with the mounting component 13, and the contact sensor 31
It stops at the height which becomes N state.

After the stop, the mounting component 13 is sucked by the suction nozzle held by the mounting head 30, and then the mounting head 30 is raised (FIG. 4A).

Next, the procedure for correcting the mounting position of the board and the mounted component 13 will be described with reference to FIG.

As shown in FIG. 2, the substrate 2 supplied to the mounting stage 40 is imaged by the XY position correcting camera 50,
The XY position correction image processing device 51 calculates a correction movement amount in the XY directions. An alignment mark A and an alignment mark B for XY alignment are written on the substrate 2 in advance, and the XY directions are corrected by using the alignment marks. It should be noted that the reference mounting component 3 mounted in advance on the substrate 2 performs position correction in the X and Y directions similarly to the mounting component 13, and is mounted at a target position with high accuracy.

Next, the procedure for measuring the height of the reference component 3 will be described with reference to FIGS.

As shown in FIG. 2, two optical axes 1 and 2 of a reference mounting component 3 mounted on a substrate 2 in advance.
Two points sandwiching the optical axis 2 obliquely in the contact surface between the reference mounting component 3 and the substrate 2 are selected, and the height of the upper surface of the reference mounting component 3 from the surface of the substrate 2 at each point is measured. Means 60
And the height measuring means 61. The positions at which the upper surface height is measured by the height measuring means 60 are height measurement point 1 and height measurement point 2 from the side closer to the mounting position, and the measurement heights at these positions are h1 and h2.

In this embodiment, the description has been made on the assumption that the number of optical axes passing through the reference mounting component 3 is two. However, the present embodiment is applicable to a case where three or more optical axes pass through the reference mounting component 3. Is possible. In this case, it is only necessary to select two points that obliquely sandwich a plurality of optical axes in the contact surface between the reference mounting component 3 and the substrate 2.

The distance between the height measurement point 1 and the height measurement point 2 in the X-axis direction is L1, the distance in the Y-axis direction is L2, and the distance X from the height measurement point 1 to the mounting position on which the mounting component 13 is mounted. Assuming that the axial distance is L3, the inclination θ1 of the upper surface of the reference component 3 on the XZ plane and the inclination θ2 of the upper surface of the reference component 3 on the YZ plane
And the height h at which the mounting component 13 is to be mounted is determined by the following equation. θ1 = ATAN ((h1−h2) / L1) θ2 = ATAN ((h1−h2) / L2) h = h1 + L3 * TANθ1

Next, a procedure for mounting the mounting component 13 will be described with reference to FIGS.

After the mounting component 13 is attracted to the mounting head 30, the mounting head 30 is moved above the mounting position of the substrate 2 in the X and Y directions (FIG. 4B). This mounting position is a position reflecting the correction movement amount calculated by the XY correction image processing device 51.

Next, at this position, the mounting head 30 is gradually lowered, and the mounting component 13 sucked and the substrate 2 come into contact with each other, and the mounting head 30 is at a height at which the contact sensor 31 fixed to the arm 301 is turned on. Stop descending (Fig. 5
(A)).

Next, after the mounting head 30 stops descending, the heating of the bonding solder 14 is started by the heating heater held by the mounting stage 40. As the heating time, the time for melting the solder is determined in advance, and that time is used. Since the solder is melted by being heated, the position of the mounting head 30 holding the mounted component 13 is lowered by its own weight, and the contact sensor 31 comes into contact with the mounting head 30 again to be in the OFF state. From this state, first, the height measuring means 6
Mounting inclination θ obtained from the results measured by 0 and 61
The mounting head 30 is tilted by the mounting head moving mechanism 32 by 1, θ2.

In this case, the mounting head 30 is mounted on the XY
Immediately after being moved upward in the direction mounting position (FIG. 4B),
The mounting head movable mechanism 32 by the mounting inclinations θ1 and θ2 obtained from the results measured by the height measuring means 60 and 61.
The operation of inclining the mounting head 30 by the mounting head 3 is also possible as an application example of the embodiment of the present invention.
In consideration of the mechanical displacement of the mounting head 30 after the lowering operation of 0, the adjustment of the inclination at the position closest to the final mounting position is more accurate than the mounting component 13 as in the present embodiment. Enable mounting.

Further, the mounting head 30 is raised so that the height of the surface of the mounting component 13 from the surface of the substrate 2 becomes the mounting height h obtained from the result measured by the height measuring means 60 and 61 in advance. Or lower it (Fig. 5
(C)).

After the elapse of the heating time, the contact sensor is turned off.
After confirming the state, the mounting head 30 is moved to the position of the reference height h obtained by the reference plane measurement, and the height is determined.

At this position, the heating heater held by the mounting stage 40 is turned off, and the curing of the joining solder is waited.
As the hardening waiting time, a time for hardening the solder is determined in advance, and that time is used (FIG. 5C).

After the curing time has elapsed, the suction of the mounting component 13 by the mounting head 30 is released, the mounting head 30 is raised, and the mounting operation is completed.

As described above, by positioning the surface of the mounted component 13 on an extension of the surface of the reference mounted component 3, the mounting component 13 and the reference mounted component 3 as shown in FIGS.
It is possible to realize highly accurate matching of the optical axis 1 and the optical axis 2 in each case.

As described above, if the electronic component mounting apparatus according to the first embodiment of the present invention is used, the variation in solder thickness (FIG. 6)
(A)) and maintaining the positional relationship between the mounted components with high accuracy without being affected by the inclination of the surface due to the defective mounting position of the reference mounted component and the distortion of the mounted substrate (FIG. 6B). Becomes possible. Thus, when mounting the optical module or the like, the mounting positional relationship between the components can be accurately maintained, and the mounting can be performed with high accuracy.

In the first embodiment of the present invention, the two-dimensional correction in which the surface of the mounted component is positioned on an extension of the surface of the reference mounted component has been described. It is also possible to perform one-dimensional correction on the surface.

This method will be described as a second embodiment of the present invention with reference to FIGS. At the top of FIG. 8,
A plan view of a board on which components are mounted is viewed from above, and a lower section is a cross-sectional view of the board taken along the optical axis in the plan view. Also in the present embodiment, the mounting operation is
The first except that the calculation of the mounting height of the mounted components is one-dimensional
The embodiment is completely the same as that of the first embodiment, and follows the same mounting mechanism as in FIG.

First, as shown in FIG. 8, the board 2 on which the components are mounted is used as a reference for mounting the components.
There is a reference mounting component 3 previously mounted on the substrate 2 with the bonding material 4.

As shown in FIG. 9, since the mounting head performs tilt correction only in the θ1 direction, only the mounting head movable mechanism θ-axis 421 for enabling the mounting head to rotate in the θ1 direction. The third embodiment is different from the first embodiment in that the second embodiment is provided in the mounting head movable mechanism 32 and is rotatable in the θ1 and θ2 directions.

After the mounting component 13 is attracted to the mounting head 30, the mounting component 13 is moved to a position above the mounting position of the substrate 2, and the mounting head 30 is lowered from there to contact the solder 14 for bonding. The operation of melting the solder for use 14 and positioning the surface of the mounted component 13 on an extension of the surface of the reference mounted component 3 is the same as that of the first embodiment, and a detailed description thereof will be omitted.

Here, only the method of calculating the height h of the surface of the mounted component 13 in the second embodiment will be described.

As shown in FIG. 8, the height of the upper surface on the optical axis of the reference mounting component 3 previously mounted on the substrate 2 is measured by the height measuring means 60 and the height measuring means 61. The position where the upper surface height is measured by the height measuring means 60 is the height measurement point 1, and the upper surface height on the side closer to the position where the mounting component 13 of the reference mounting component 3 is mounted is measured. The position where the upper surface height is measured by the height measuring means 61 is the height measurement point 2, and the upper surface height on the opposite side to the position where the mounting component 13 is mounted is measured.

FIG. 10 shows the inclination θ of the upper surface of the reference mounting component 3.
1 shows a procedure for calculating the mounting height h of the mounting component 13. FIG. 10A shows a case where the upper surface of the reference mounting component 3 is substantially parallel to the surface of the substrate 2, and FIG.
FIG. 10C shows a case where the upper surface of the reference mounting component 3 is inclined with respect to the surface of the substrate 2, and FIG. This shows a method of calculating the inclination θ1 of the upper surface of the component 3 and the mounting height h of the mounted component 13.

In the case of FIG. 10A, the mounting component 13 is mounted so that the surface of the mounting component 13 is parallel to the substrate surface and at a height h from the substrate surface.

In the case of FIG. 10B, the following method is adopted. That is, as shown in FIG.
And height measurement point 2 are two points on the upper surface position along the optical axis. The height measured at the position of height measurement point 1 is h1, and the height measured at the position of height measurement point 2 is h1. h2. The distance between height measurement point 1 and height measurement point 2 is L1, and height measurement point 1
Is the distance from L2 to the mounting position where the mounting component 13 is mounted.
And

The measured heights h1 and h2 of the two points, the distance L1 between the measurement points, and the distance L between the height measurement point 1 and the mounting position.
According to 2, the inclination θ1 of the upper surface of the reference mounting component 3 and the mounting height h of the mounting component 13 are calculated and determined as θ1 = ATAN ((h2−h1) / L1) h = h1−L2 * TANθ1.

As described above, when the electronic component mounting apparatus of the second embodiment is used, the apparatus can be simplified and the manufacturing process can be shortened as compared with the first embodiment to the extent that the characteristics of the electronic component are permissible. In addition, it is possible to reduce the manufacturing cost.

[0072]

As described above, when a plurality of electronic components are mounted on one substrate by using the electronic component mounting apparatus of the present invention, the surface of the other component is highly precisely positioned on the extension surface of the reference component surface. In the mounting of optical modules, etc., the mounting position relationship between components can be accurately maintained without being affected by variations in solder thickness, defective mounting positions of the reference component, and distortion of the mounting substrate. It can be mounted with high accuracy.

[Brief description of the drawings]

FIG. 1 is a block diagram illustrating a configuration of an electronic component mounting apparatus according to a first embodiment of the present invention.

FIG. 2 is a diagram illustrating a method of measuring a height of a surface of an electronic component from a substrate, which is a main part of the operation, in the electronic component mounting apparatus according to the first embodiment of the present invention.

FIG. 3 is a diagram illustrating a mounting head movable mechanism θ1 axis and a mounting head movable mechanism θ2 axis in the electronic component mounting apparatus according to the first embodiment of the present invention.

FIG. 4 is a diagram illustrating a method of mounting an electronic component on a substrate in the electronic component mounting apparatus according to the first embodiment of the present invention in the order of steps.

FIG. 5 is a view showing a step following the step shown in FIG. 4;

FIG. 6 is a view for explaining how the electronic component mounting apparatus according to the first embodiment of the present invention matches a surface of an electronic component to be mounted with an extension of a reference mounted component surface.

FIG. 7 is a diagram illustrating a state in which the surface of an electronic component to be mounted coincides with an extension of the surface of the reference mounted component by the electronic component mounting apparatus according to the first embodiment of the present invention, focusing on the inclination of the surface of the reference mounted component; FIG.

FIG. 8 is a diagram illustrating a method of measuring a height of a surface of an electronic component from a substrate, which is a main part of the operation, in the electronic component mounting apparatus according to a second embodiment of the present invention.

FIG. 9 is a view for explaining a mounting head movable mechanism θ1 axis in the electronic component mounting apparatus according to the second embodiment of the present invention.

FIG. 10 is a diagram for explaining a mounting height correction of an electronic component to be mounted in an electronic component mounting apparatus according to a second embodiment of the present invention.

FIG. 11 is a block diagram illustrating a configuration of a conventional electronic component mounting apparatus.

FIG. 12 is a diagram illustrating a defect of an electronic component mounted on a substrate by a conventional electronic component mounting apparatus.

FIG. 13 is a diagram illustrating an operation of a mounting head when mounting an electronic component on a substrate.

FIG. 14 is a diagram illustrating a mounting operation of a mounting head when mounting an electronic component on a substrate on which a reference mounting component is mounted in advance.

FIG. 15 is a diagram illustrating a solder supply process of the solder supply mechanism.

[Explanation of symbols]

 2, 102, 202 Substrate 3 Reference mounting component 4, 104, 204 Bonding material 10, 110 Component supply unit 13, 113, 213 Mounting component 14, 114, 214 Soldering solder 20, 120 Solder supply unit 21, 121 Solder cutting unit 30, 130 Mounting head 31, 131 Contact sensor 32, 132 Mounting head movable mechanism section 40, 140 Mounting stage 50 XY position correction camera 51 XY correction image processing device 60, 61 Height measuring means 70, 170 Mounting operation control section 103, 203 Mounted parts 301, 401 Arms 321, 421 Mounting head movable mechanism θ1 axis 322 Mounting head movable mechanism θ2 axis

Claims (18)

[Claims] 1. A substrate on which a reference component serving as a reference for another component is mounted, a stage on which the substrate is mounted, an inclination measuring mechanism for determining an inclination of a surface of the reference component with respect to the substrate surface, and And a mounting head moving mechanism for mounting the other component on the substrate and aligning the surface of the other component with an extension of the surface of the reference component. Onboard equipment. 2. The reference component and the other component are components constituting an optical module, wherein the reference component has at least two different optical axes penetrating therein substantially in parallel with a surface of the substrate. Wherein the tilt measuring mechanism is located on the bonding surface between the reference component and the substrate, and the substrate on the surface of the reference component at two points obliquely opposed to each other across the at least two optical axes. Consisting of a first height measuring means and a second height measuring means for obtaining a height from the surface, and a mounting control unit for controlling the first height measuring means and the second height measuring means. The electronic component mounting apparatus according to claim 1, wherein 3. The mounting control section calculates a height from the substrate surface at the two opposite points of the reference component surface obtained by the first height measuring means and the second height measuring means. 3. The electronic component mounting apparatus according to claim 2, wherein the inclination of the reference component surface with respect to the substrate surface and the mounting height of the other component surface from the substrate surface are calculated based on the reference component surface. 4. The reference component surface calculated by the mounting controller after the mounting head constituting the mounting head moving mechanism moves above a mounting position of the other component on the substrate. 4. The electronic component mounting apparatus according to claim 3, wherein the surface of the other component is positioned on an extension of the surface of the reference component based on the inclination of the component relative to the substrate surface and the mounting height from the substrate surface. 5. The mounting head, after moving to a position where the other component is to be mounted on the substrate, the inclination of the reference component surface calculated by the mounting control unit with respect to the substrate surface and the inclination of the other component. 5. The electronic component mounting apparatus according to claim 3, wherein the surface of the other component is positioned on an extension of the surface of the reference component based on the mounting height from the substrate surface. 6. The height of the surface of the other component is set to a mounting height from the surface of the substrate in a plane orthogonal to the optical axis and approximately bisecting the other component. Item 5. The electronic component mounting device according to item 4 or 5. 7. The mounting head is orthogonal to the substrate,
7. The electronic component mounting apparatus according to claim 4, further comprising a mechanism rotatable in each of two planes orthogonal to each other. 8. A substrate on which a reference component serving as a reference for another component is mounted, a stage on which the substrate is mounted, an inclination measuring mechanism for determining an inclination of a surface of the reference component with respect to the substrate surface, and An electronic component, comprising: a mounting head movable mechanism for mounting the other component on the substrate and aligning the surface of the other component on an extension of the surface of the reference component. Mounting equipment. 9. The reference component and the other component are components constituting an optical module, and the inclination measuring mechanism is configured to detect two different points on the optical axis of the reference component surface from the substrate surface. First height measuring means and second height measuring means for determining the height, and the first height measuring means and the second height measuring means
9. The electronic component mounting apparatus according to claim 8, further comprising a mounting control unit that controls a height measuring unit. 10. The mounting control section is configured to determine two different heights from the substrate surface on the optical axis of the reference component surface obtained by the first height measuring means and the second height measuring means. The electronic component mounting apparatus according to claim 9, wherein an inclination of the reference component surface with respect to the substrate surface and a mounting height of the other component surface from the substrate surface are calculated based on the height. 11. The reference component surface calculated by the mounting control unit after the mounting head constituting the mounting head moving mechanism moves above a mounting position of the other component on the substrate. The electronic component according to claim 10, wherein the surface of the other component is positioned on an extension of the surface of the reference component based on the inclination of the component with respect to the substrate surface and the mounting height of the surface of the other component from the substrate surface. Mounting equipment. 12. The mounting head, after moving to a position where the other component is to be mounted on the substrate, the inclination of the reference component surface with respect to the substrate surface calculated by the mounting control unit and the other component surface 12. The electronic component mounting apparatus according to claim 10, wherein the surface of the another component is positioned on an extension of the surface of the reference component based on the mounting height from the substrate surface. 13. The mounting head, after adsorbing the other component, has an operation of mounting the other component on the substrate, and the mounting head includes a component for forming a surface of the substrate. 13. The electronic component mounting apparatus according to claim 4, further comprising a contact sensor that detects a contact state of the other component. 14. The mounting head, having sucked the other component, moves above the other component mounting position of the substrate, descends from there toward the surface of the substrate, and moves the other component. Is not in contact with the structure, the mounting head and the contact sensor are in a contact state in contact with each other, and when the other component contacts the structure,
14. The non-contact state in which the mounting head and the contact sensor are separated from each other, and the mounting control unit detects a change from the contact state to the non-contact state, and stops the movement of the mounting head. Electronic component mounting equipment. 15. The mounting head, after stopping the movement of the mounting head, the inclination of the reference component surface with respect to the substrate surface calculated by the mounting control unit and the inclination of the other component surface from the substrate surface. Positioning the surface of the other component on an extension of the surface of the reference component while the component on the substrate is molten based on the mounting height, and solidifying the molten component. 15. The electronic component mounting apparatus according to claim 14, wherein the other component is fixed on the substrate by using. 16. The electronic component mounting apparatus according to claim 13, wherein the component is a conductive material that melts at a high temperature. 17. A planar position correcting mechanism for correcting a planar position of the substrate with respect to the stage and a planar position of the reference component and the other component with respect to the substrate. 3, 4, 5, 6, 7,
8, 9, 10, 11, 12, 13, 14, 15, or 16
A mounting device for the electronic component described above. 18. The electronic component mounting apparatus according to claim 17, wherein said plane position correcting mechanism comprises a plane position correcting image processing apparatus and a plane position correcting camera controlled by said plane position correcting image processing apparatus. .