JP2001298045A - Method and apparatus for sticking conductive film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and an apparatus for sticking a conductive film in good state while eliminating waste of the conductive film. SOLUTION: The method for sticking an anisotropic conductive film to a plurality of film sticking regions 11-16 on a mounting board 39 comprises a step of causing a plurality of anisotropic conductive sheets 23, 33 to run in a specified direction in parallel with each other, a step of cutting the anisotropic conductive sheet of each anisotropic conductive film into the length of the film sticking region, and a step of sticking the anisotropic conductive film thus cut to the first and third film sticking regions 11, 13.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive film sticking method and a conductive film sticking apparatus used in a surface mounting step of mounting a semiconductor element on a mounting substrate.

[0002]

2. Description of the Related Art BGA (ball grid array) and CS
In a mounting process such as P (chip size package), an anisotropic conductive film (ACF) is used to electrically connect an electric element such as a semiconductor element and a pattern of a mounting substrate. This anisotropic conductive film has N
It is made by dispersing conductive particles such as i, Au, Cu and the like, and connects an electric element and a mounting board via the conductive particles.

When this anisotropic conductive film is attached to a mounting substrate, an apparatus having a configuration as shown in FIG. 2 is used. FIG.
1 is a side view showing a schematic configuration of a conductive film sticking apparatus.

In this apparatus, the anisotropic conductive sheet 33 is configured to run between a feed roll 31 and a take-up roll 32. This anisotropic conductive sheet 33
Is composed of a separator 33a and an anisotropic conductive film (ACF) 33b which is a conductive film.

[0005] Below the feed roll 31 and the take-up roll 32, pressing rolls 34 are arranged, respectively. Further, a cutter 35 that cuts the anisotropic conductive film 33b is disposed at a stage subsequent to the pressing roll on the feed roll side in the sheet traveling direction.

The cutter 35 cuts the anisotropic conductive sheet 33 from below by ascending. At this time, the cutter 35 does not cut the separator 33a. Further, a cutter presser 36 is disposed above the anisotropic conductive sheet at a position corresponding to the cutter 35 so as to press the separator 33a when the anisotropic conductive sheet is cut by the cutter 35.

The anisotropic conductive sheet 3 running horizontally
Above 3, a pressing jig 37 is installed so as to be able to move up and down. Further, on both sides of the pressing jig 37, a holding jig 38 for holding the anisotropic conductive sheet 33 when the pressing jig 37 is pressed is installed so as to be able to move up and down.

FIG. 3 is a schematic plan view for explaining a method of attaching a conductive film to a mounting substrate using the conductive film attaching apparatus shown in FIG. First, the mounting board 39 is placed on the base 40 shown in FIG. As shown in FIG. 3, on the surface of the mounting substrate 39, first to sixth film attachment regions (regions for mounting IC chips) 11 to 16 to which the anisotropic conductive film 33b is attached are formed. . Next, the anisotropic conductive sheet 33 is sent out from the feed roller 31,
Winding is performed by the winding roller 32. This anisotropic conductive sheet 3
No. 3 is changed in direction by the pressing roller 34, and travels in the horizontal direction.

Thereafter, the cutter holder 36 descends to hold the upper side of the anisotropic conductive sheet 33,
Rises to cut only the anisotropic conductive film 33b.
Thereby, the 1st and 2nd film sticking area | regions 11 and 1
An anisotropic conductive film of a size to be attached at a time to 2 is cut. Then, after cutting, the cutter presser 36 moves up, and the cutter 35 moves down.

Next, with the pressing jig 38 descending from above the anisotropic conductive sheet 33 and holding the anisotropic conductive sheet 33, the pressing jig 37 descends to mount the anisotropic conductive sheet 33. First and second film attachment areas 1 on substrate 39
Press 1 and 12. At this time, the pressing jig 37 is heated to a predetermined temperature. Thus, the cut anisotropic conductive film 33b is attached to the first and second film attachment regions of the mounting board 39.

The separator 33 a from which the anisotropic conductive film 33 b has been removed is turned in the direction of the take-up roll 32 via the press roll 34, and is taken up by the take-up roll 32.

Next, after attaching an anisotropic conductive film to the third and fourth film attaching regions 13 and 14 in the same manner as described above, the fifth and sixth film attaching regions 15 and 1 are attached.
6 is attached with an anisotropic conductive film.

[0013]

As described above, in the conventional conductive film sticking method, in order to increase the productivity of the sticking device, the length of the sticking of the anisotropic conductive film is increased, and the sticking is performed on the sticking device side. A plurality of film affixing areas in an area where the film can be affixed are attached by a single attaching operation.

However, when a plurality of film pasting regions are pasted in a single pasting operation, as shown in FIG. 3, the anisotropic conductive film is wasted in the region 18 on the mounting board 39 which does not need to be pasted. It will be pasted.
This increases manufacturing costs.

Further, since the anisotropic conductive film is stuck to a plurality of film stuck regions at once, the area of each anisotropic conductive film stuck becomes large. Thereby, air is easily trapped between the attached anisotropic conductive film and the mounting substrate. Therefore, when pasted by the conventional conductive film pasting method described above,
This is worse than when anisotropic conductive films are individually attached to one film attachment area.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to provide a method and an apparatus for attaching a conductive film in which the state of attaching the conductive film is improved and the waste of the conductive film is eliminated. Is to provide.

[0017]

A method of attaching a conductive film according to the present invention is a method of attaching a conductive film to a plurality of conductive film attachment regions on a mounting substrate, wherein the plurality of conductive films are attached in a predetermined direction parallel to each other. And a step of cutting each conductive film to the length of the conductive film sticking region, and a step of collectively sticking the cut conductive films to a plurality of conductive film sticking regions. It is characterized by doing.

According to the conductive film sticking method, a plurality of conductive films are run in parallel to each other in a predetermined direction, and each conductive film is cut to the length of the conductive film sticking region, and each cut conductive film is cut. Are collectively attached to a plurality of conductive film attachment regions. By setting the size of each conductive film to be attached to be approximately the same as the size of the conductive film attachment region, the attached state of the conductive film can be improved, and waste of the conductive film can be eliminated. .

The method for attaching a conductive film according to the present invention is a method for attaching a conductive film to first and second conductive film attachment regions on a mounting substrate, wherein the first conductive film is moved in a predetermined direction. At the same time, the step of running the second conductive film in parallel to the running direction of the first conductive film, and the step of cutting the first conductive film to the length of the first conductive film attachment region, Cutting the conductive film to the length of the second conductive film attachment region and attaching the cut first conductive film to the first conductive film attachment region, and simultaneously cutting the cut second conductive film. Adhering to the second conductive film adhering region.

The conductive film sticking apparatus according to the present invention is an apparatus for sticking a conductive film to a plurality of conductive film sticking regions on a mounting substrate, and a traveling means for running the plurality of conductive films in parallel to each other in a predetermined direction. And cutting means for cutting each conductive film to the length of the conductive film sticking region, and sticking means for sticking each cut conductive film to a plurality of conductive film sticking regions at once. Features.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic plan view for explaining a conductive film attaching method according to an embodiment of the present invention.

As shown in FIG. 1, the conductive film sticking apparatus used in the present embodiment comprises two supply means for supplying an anisotropic conductive sheet 33 as shown in FIG. The two anisotropic conductive sheets 23 and 33 are arranged side by side by a single pressing operation by one pressing jig 37.

The supply means arranged in parallel in two units is a traveling means for moving a plurality of anisotropic conductive sheets in a predetermined direction in parallel with each other. A first supply unit configured to run the conductive sheet 33; a feed roll 21 and a take-up roll 2;
And a second supply means configured to run the anisotropic conductive sheet 23 between the second supply means and the second supply means. The pitch of the anisotropic conductive sheets arranged in parallel is adjusted to the product pitch to be attached. Anisotropic conductive sheets 23, 33
Is composed of a separator 33a and an anisotropic conductive film 33b (ACF) which is a conductive film. Further, it is preferable to use a set of feed mechanisms for feeding the anisotropic conductive sheets 23 and 33, and to feed a plurality of anisotropic conductive sheets collectively by the set of feed mechanisms.

Below the feed roll 31 and the take-up roll 32, presser rolls 34 are arranged, respectively. Further, a cutter 35 that cuts the anisotropic conductive film 33b is disposed at a stage subsequent to the pressing roll on the feed roll side in the sheet traveling direction. Similarly, the pressing roll 2 is also provided below the feed roll 21 and the take-up roll 22.
4 are arranged. Further, a cutter (not shown) for cutting the anisotropic conductive film is disposed at a stage subsequent to the pressing roll on the feed roll side in the sheet traveling direction.

The cutter is adapted to cut the anisotropic conductive sheets 23 and 33 from below by ascending. At this time, the cutter 35 is
Does not cut. Further, a cutter retainer 36 is disposed above the anisotropic conductive sheets 23 and 33 at a position corresponding to the cutter 35 so as to press the separator 33a when the anisotropic conductive sheet is cut by the cutter 35.

The anisotropic conductive sheet 2 running horizontally
A pressing jig 37 is installed above and below the members 3 and 33 so as to be able to move up and down. The pressing jig 3 is provided on both sides of the pressing jig 37.
A pressing jig 38 that presses the anisotropic conductive sheets 23 and 33 at the time of pressing 7 is installed so as to be able to move up and down.

Next, a method for attaching a conductive film using the above-described apparatus for attaching a conductive film will be described with reference to FIG. First, the mounting board 39 is placed on the base. As shown in FIG. 1, an anisotropic conductive film 33b
The first to sixth film attachment areas (areas where IC chips are mounted) 11 to 16 are formed.

Thereafter, the anisotropic conductive sheets 23 and 33 are sent out from the feed rollers 21 and 31, and
Wind up at 2,32. These anisotropic conductive sheets 23, 33
Is changed in direction by the pressing rollers 24 and 34, and travels in the horizontal direction.

Thereafter, the cutter retainer 36 is lowered to press the upper side of the anisotropic conductive sheets 23 and 33, and the cutter 35 is raised to cut only the anisotropic conductive film 33b. Thereby, the first anisotropic conductive sheet 33 has
The anisotropic conductive film having a size to be attached to the film attachment region 11 is cut, and the anisotropic conductive film having a size to be attached to the third film attachment region 13 in the anisotropic conductive sheet 23 is cut. Then, after cutting, the cutter presser 36 moves up, and the cutter 35 moves down.

Next, the holding jig 38 descends from above the anisotropic conductive sheets 23 and 33, and
With the 33 held down, the pressing jig 37 descends and presses the anisotropic conductive sheets 23, 33 at a time against the first and third film attachment areas 11, 13 on the mounting board 39. At this time, the pressing jig 37 is heated to a predetermined temperature.
Thus, the cut anisotropic conductive film is attached to the first and third film attachment areas of the mounting board 39.

The separator from which the anisotropic conductive film has been removed is taken up by the take-up roll 2 via the holding rolls 24 and 34.
2, 32, and the winding rolls 22,
Winded at 32.

Next, an anisotropic conductive film is attached to the second and fourth film attachment regions 12 and 14 in the same manner as described above, and thereafter, anisotropic conductive films are attached to all the film attachment regions on the mounting board 39. Attach a conductive film. Thereafter, the IC chip is mounted on the mounting board 39 via the anisotropic conductive film.

According to the above embodiment, the roll-shaped anisotropic conductive films are supplied in parallel, and the sticking directions of the plurality of film sticking regions are set in the width direction (at right angles to the direction of travel of the anisotropic conductive sheet). Direction). Thereby, a plurality of pieces of the anisotropic conductive film can be simultaneously attached to required positions at a required position, so that the material of the anisotropic conductive film is not wasted. That is, the anisotropic conductive film can be stuck to a plurality of film sticking regions by a single sticking operation, and the anisotropic conductive film can be stuck to a region that does not require sticking as in the conventional conductive film sticking method. Unnecessary sticking can be prevented. Therefore, manufacturing costs can be reduced.

Further, in the present embodiment, the anisotropic conductive film is stuck to a plurality of film sticking regions at once, but the size of the anisotropic conductive film to be stuck is the size of one film sticking region. Is the same as For this reason, the adhesion state can be improved as compared with the conventional conductive film attaching method, and the anisotropic conductive film can be attached without deteriorating the quality.

Further, the conductive film sticking apparatus according to the present embodiment can use the mechanism of the conventional conductive film sticking apparatus as it is, so that it can be carried out with only a part change without a significant additional modification. Is easy.

The present invention is not limited to the above-described embodiment, but can be implemented with various modifications. For example,
In the above-described embodiment, two supply means for supplying the anisotropic conductive sheet onto the mounting substrate are arranged in parallel, and the two film attaching regions 11 and 13 are attached by one attaching operation. It is also possible to arrange three or more supply means for supplying the anisotropic conductive sheet in parallel, and to attach three or more film attaching regions by one attaching operation.

[0037]

As described above, according to the present invention, a plurality of conductive films are run in parallel to each other in a predetermined direction, and each conductive film is cut to the length of the conductive film-attached region. Each conductive film is attached to a plurality of conductive film attachment regions at once. Therefore, it is possible to provide a conductive film sticking method and a conductive film sticking apparatus in which the state of sticking the conductive film is improved and waste of the conductive film is eliminated.

[Brief description of the drawings]

FIG. 1 is a schematic plan view illustrating a method for attaching a conductive film according to an embodiment of the present invention.

FIG. 2 is a side view showing a schematic configuration of a conductive film sticking apparatus.

FIG. 3 is a schematic plan view for explaining a method of attaching a conductive film to a mounting substrate using the conductive film attaching apparatus shown in FIG. 2;

[Explanation of symbols]

 11 to 16 First to sixth film affixing areas 21, 31 Feed roll 22, 32 Take-up roll 23, 33 Anisotropic conductive sheet 24, 34 Holding roll 33a Separator 33b Anisotropic conductive film (ACF) 34 Holding roll 35 Cutter 36 Cutter presser 37 Pressing jig 38 Presser jig 39 Mounting board 40 Base

Claims (3)

[Claims] 1. A method of attaching a conductive film to a plurality of conductive film attachment regions on a mounting substrate, the method comprising: running a plurality of conductive films in a predetermined direction parallel to each other; A method for attaching a conductive film, comprising: a step of cutting to a length of an attachment region; and a step of attaching each of the cut conductive films to a plurality of conductive film attachment regions at once. 2. A method of attaching a conductive film to first and second conductive film attachment regions on a mounting substrate, wherein the first conductive film is caused to run in a predetermined direction, and the second conductive film is Running the first conductive film in parallel with the running direction of the first conductive film; cutting the first conductive film to the length of the first conductive film attachment region; Cutting the cut first conductive film into the first conductive film sticking region, and cutting the cut second conductive film into the second conductive film sticking region. A method for attaching a conductive film, comprising the steps of: 3. An apparatus for attaching a conductive film to a plurality of conductive film attachment regions on a mounting substrate, comprising: running means for running the plurality of conductive films in a predetermined direction in parallel with each other; A conductive film sticking apparatus, comprising: cutting means for cutting a film to a length of a film sticking region; and sticking means for sticking each cut conductive film to a plurality of conductive film sticking regions at once.