JP3498246B2 - Film sticking method - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film sticking method for sticking an adhesive film on a main surface of a substrate to an outline which is equal to or slightly smaller than the outline of the main surface. In particular, the present invention relates to a method for attaching a film to a principal surface of a substrate such as a semiconductor wafer using a resist film having an area larger than the contour with a contour equal to or slightly smaller than the contour of the substrate. 2. Description of the Related Art When an exposure resist film is bonded to a rectangular printed circuit board or a circular semiconductor wafer (hereinafter abbreviated as a wafer), a resist film having a larger area than the substrate is conventionally used. It is bonded to the main surface, and then cut along the outer periphery (contour) of the substrate with a blade or a laser. In the above-mentioned conventional method, for example, when cutting along the outer periphery of the wafer, a blade is applied to the outer peripheral end of the wafer, so that the life of the blade is shortened and the blade is frequently shortened. Need to be replaced. Further, in the case of cutting with a laser, the resist film at the cut portion is deteriorated or melted by the heat of the laser, which causes a problem in a subsequent base film peeling step. Further, the main surface of the processed wafer in the previous process may be heated and deteriorated by the heat of the laser. [0004] In both blade cutting and laser cutting, since the resist film is cut slightly outside the outer periphery of the wafer, another means is used in the next step.
In many cases, the resist film is removed from the outer periphery of the wafer and has a width of several mm to remove a resist film that hinders post-processing. Accordingly, an object of the present invention is to apply an adhesive film to the main surface of a substrate with a contour equal to or slightly smaller than the contour of the main surface of the substrate without frequently changing the cutting means. To provide a method for attaching a film. Another object of the present invention is to attach an adhesive film to a main surface of a substrate with a contour equal to or slightly smaller than the contour of the main surface of the substrate without deteriorating the film or the substrate. To provide a method for attaching a film. Still another object of the present invention is to apply an adhesive film on the main surface of a substrate with a contour equal to or slightly smaller than the contour of the main surface of the substrate without requiring any post-processing. An object of the present invention is to provide a method for attaching a film that can be attached. [0008] A feature of the present invention that achieves the above object is that an adhesive film is provided on one principal surface of a substrate with a contour equal to or greater than the contour of one principal surface of the substrate. Is also a method of attaching a film with a slightly smaller outline, wherein the adhesive film provided on the entire surface of the base film having a size larger than or equal to the outline of one main surface of the substrate, A cut is made to reach one surface of the base film with a contour that is equal to or slightly smaller than the contour of one main surface, the adhesive film located outside the cut is removed, and the adhesive film located inside the cut is removed. In a film sticking method for sticking the adhesive film on a base film at a desired position on one main surface of the substrate, the substrate is appropriately spaced.
A circular substrate transported by the
Is fed out of the film roll together with the base film
Resist film from which the cover film has been removed.
The adhesive film at a desired position on one main surface of the substrate.
Paste the lamination roll or lamination
Heat-pressing with a plate or the adhesive film
To be performed under reduced pressure by surrounding the
You. [0009] According to the film sticking method of the present invention, the cutting means is not frequently changed, the film or the substrate is not deteriorated, and furthermore, the cleaning process of the substrate is not required. An adhesive film can be attached to the surface with an outline equal to or slightly smaller than the outline of the main surface of the substrate. An embodiment of the present invention is described below with reference to FIG.
FIG. FIG. 1 is a top view of a film sticking apparatus 100 embodying the method of the present invention, and FIG. 2 is a schematic side view of the film sticking apparatus 100 shown in FIG. In both figures, F is a dry film, which has a three-layer structure of a base film 102, a resist film 103, and a cover film 104 in this order. 101 is a film roll for feeding out the dry film F. The cover film 104 of the dry film F includes a peeling roller 105
Is peeled off after passing through, and then collected on the take-up roll 106. By peeling off the cover film 104, the resist film 103 is exposed. In FIG. 1, the base film 102 of the dry film F is on the upper side in the figure. C1 is a cut forming unit. This unit C1 is composed of the resist film 1 of the dry film F.
An arm 108 is provided on the 03 side, is rotated in a circular shape by a motor 107, has a disk cutter 109 provided at the tip of the arm 108, and a receiving table 110 located on the base film 102 side. The disk cutter 109 forms a circular cut in the resist film 103 such that the arm 108 rotates to reach the base film 102. Reference numeral 111 denotes a linear cutter provided as needed, which cuts the resist film 103 in the width direction. The necessity of installation will be described later. C2 is a surplus resist film peeling unit. The unit C2 includes a feeding roll 116 for the adhesive tape 115 and a peeling roller 11 for the excess resist film.
7 and a recovery roll 118 for surplus resist film. C3 is a perforation forming unit. The unit C3 has a configuration similar to that of the cut forming unit C1, but is slightly different.
The description includes the differences. The unit C3 is located on the side of the resist film 103 of the dry film F, and has an arm 121 which is rotated by a motor 120 in a circular shape and a roulette or jockey used for sewing provided at the tip of the arm 121 so as to rotate. Perforated cutter 12 like spur to be attached to heel
2 and a receiving base 123 located on the base film 102 side. The perforation cutter 122 forms a circular perforation on the base film 102 from the resist film 103 side as the arm 121 rotates. The diameter of this perforation is slightly larger than the cut formed in the resist film 103, but is slightly smaller than the diameter of a wafer described later. FIG. 3 shows an example of a perforated cutter and a cut cutter suitable for use in the embodiment of the present invention. FIG. 2A is a perspective view of a push-cut type perforation cutter, FIG. 2B is a perspective view of a rotary type perforated cutter, and FIG. C4 is a film sticking unit. 1
Reference numeral 25 denotes a suction mounting table for the wafer Wf, which moves up and down on a guide rail 126 in FIG. In the film sticking unit C4, when sticking the film, the wafer Wf is placed on the suction mounting table 125 by a robot hand (not shown) and fixed at a desired position by vacuum suction or the like.
Then, the suction mounting table 125 is moved to the lower side of 3. On the base film 102, there is provided a heating and pressing roller 127 which moves in the left-right direction in FIG. 1, and the heating and pressing roller 127 is rotated and moved by a driving means (not shown) so that the resist is formed on the upper main surface of the wafer Wf. The film 103 is attached. The suction mounting table 125 may have a built-in heater. C5 is a base film cutting unit. Reference numeral 130 denotes a holding roll for the base film 102 installed on the upstream side of the dry film F, and moves up and down to sandwich the base film 102 from above and below. Reference numeral 131 denotes a pedestal for the wafer Wf, which moves vertically on the guide rail 132 in FIG. When the pedestal 131 moves and is positioned below the wafer Wf, the film presser 133 on the base film 102 is lowered to sandwich the wafer Wf and the base film 102 with the pedestal 131. Reference numeral 134 denotes a cutting roll for the base film 102. As shown in FIG. 2, the base film 102 is lifted upward from below as shown by a dotted line. Reference numeral 135 denotes an adjustment roll that moves rightward in FIG. 2 in conjunction with the cutting roll 134 moving upward and adjusts the tension of the base film 102. 140 is a take-up roll for the base film 102. In both figures, each unit C1 to C1
Although the interval of C5 is appropriately represented, the interval between each unit is different from before and after the surplus resist film peeling unit C2, that is, between the units C1 and C3, from the viewpoint of improving work efficiency.
Assuming that the intervals between the units C3 and C4 and the intervals between the units C4 and C5 are equal, the units C1 to C5 perform desired operations in parallel with the movement of the dry film. Next, the film sticking apparatus 100 embodying the method of the present invention attaches the resist film 10 to the wafer Wf.
The operation of attaching 3 in a desired shape will be described. The width d0 of the dry film F fed from the film roll 101 is slightly larger than or equal to the diameter of the wafer Wf. The fed out dry film F moves intermittently from right to left in both figures, and the cover film 104 of the dry film F is peeled off by the peeling roller 105 to expose the resist film 103. At the break forming unit C1, one arm 108 is attached to the resist film 103.
A circular cut having a diameter d1 indicated by a dotted line in FIG. During the formation of the cut, the dry film F stops intermittent movement. This cut may be slightly cut in the base film 102, but is not cut over the entire thickness.
It is sufficient to cut the entire thickness of the resist film 103. Since the cutter 109 does not hit the wafer Wf, it does not cause blade spillage, and there is no need to worry about replacing the cutter.
Further, there is no need to worry that the resist film 103 or the wafer Wf is deteriorated. In the next intermittent movement, the area where the break in the dry film F is formed reaches the perforation forming unit C3. During this movement, in the surplus resist film peeling unit C2, the resist film 103 outside the cut is removed with the adhesive tape 115. When the adhesive tape 115 is adhered to the preceding portion of the resist film 103 outside the cut, the peeling roller 1 is removed so as not to remove the resist film 103 inside the cut.
17, the resist film 103 outside the cut is peeled off along with the left line of the dry film F, and the collecting roll 118 is wound up. In the perforation forming unit C3, a perforation having a diameter d2 indicated by a dotted line in FIG. 1 is formed on the exposed base film 102 concentrically with a cut having a diameter d1. The diameter d2 is slightly larger than the diameter d1. By the time the perforation is completed, the wafer Wf is installed at a desired position on the suction mounting table 125, and is positioned below the circular resist film 103 in the dry film F by the guide rail 126 where the resist film 103 intermittently moves. . A circular resist film 103 formed by intermittent movement
Is waiting at the film sticking unit C4
When it is positioned above f, the thermocompression roller 127 moves to the left to thermocompression-bond the circular resist film 103 to the upper surface of the wafer Wf. When the thermocompression bonding roller 127 is returned to the right, thermocompression bonding may be performed again to increase reliability. In FIG. 1, the wafer Wf is shown by a dashed line in FIG. 1 for the cuts and perforations formed in the dry film F. The pedestal 131 in the base film cutting unit C5 waits for the wafer Wf to move in the subsequent intermittent movement. The dry film F intermittently moves to the base film cutting unit C5 while holding the wafer Wf with the adhesive property of the resist film 103. Here, the holding roll 130 sandwiches the upstream side of the dry film F from above and below, the film holder 133 having a diameter d4 descends, and
1 sandwiches the wafer Wf with the base film 102 inside the perforation. Thereafter, the cutting roll 134 moves up as shown in FIG. 2, and the adjusting roll 135 moves to the right, and the base film 102 is lifted up as shown by the dotted line.
2 is cut. In other words, the base film 102 remains on the wafer Wf in a form in which the film presser 133 is punched by a press at the perforation. After cutting the base film 102 along the perforations, the cutting roll 134 descends and the adjusting roll 13
Reference numeral 5 moves to the left to apply an appropriate tension to the dry film F. Then, the film presser 133 is raised, and the resist film 103 is formed in a circular shape as shown by a dashed line in FIG.
Then, the wafer Wf having the base film 102 concentrically affixed thereon is taken out from under the dry film F by the receiving stand 131, and is sent to the next step such as an exposure step. Therefore, cleaning of the resist film 103 and the base film 102 for the wafer Wf is unnecessary. Also, the suction mounting table 125 returns to the position shown by the solid line, and prepares for film attachment to the next wafer. The base film 102 which has become unnecessary by cutting the inside of the perforation is collected on a take-up roll 140. The above-described linear cutter 111 cuts the resist film 103 in the width direction while the intermittent movement is stopped, thereby removing the surplus portion outside the cut for each wafer Wf in the surplus resist film peeling unit C2. it can. In the case where the width d0 of the dry film F is almost the diameter d2 of the perforation, the length from the cut to the end of the film is small, and if the outer surplus portion is cut off at this portion, the removal proceeds well. Since there is no resist film 103, the resist film 103 is cut in the width direction so that an excessive tensile force is not applied, and removal is ensured. Regardless of the embodiment described above, the present invention may be implemented in the following embodiments. In FIG. 1, the disc cutter 109 for forming a cut and the cutter 122 for forming a perforation are rotated once by the arms 108 and 121, respectively, but each arm has a length equal to or larger than the diameter of the cut or the perforation. Each cutter was installed on both sides of the circumference, and when the arm was rotated half a turn, a cut or perforation was formed over one circumference, or a blade was provided at the end of a cylinder having a diameter d1, d2. A cutter may be used. In the above-described embodiment, since the wafer Wf is used as an object to be attached to the film, the resist film 103 is used.
Is set smaller than the wafer Wf. However, if the cut is not a wafer, the cut may be formed in the same contour as the substrate as the object to which the film is to be attached.
In this case, a dry film having a width of the base film larger than the contour of the main surface to which the film of the substrate is attached and a resist film provided on the entire surface may be used. Further, the diameter d2 of the perforations is easier to be formed if the diameter d1 is larger than the diameter d1 of the cuts, but they may have the same size. Instead of the heat-pressing roller 127, pressure may be applied in the vertical direction using a hot plate to perform thermocompression. In the cut forming unit C1 and the perforation forming unit C2, the cutting chips may be caused to flow down by the air flow generating means in order to prevent the cutting chips generated at the time of forming the cuts and perforations from adhering to the substrate. The film pasting unit C4 may be surrounded by a decompression housing and may be subjected to decompression bonding. Although the suction mounting table 125 and the receiving table 131 are used for the transfer processing of the wafer Wf, these can be substituted by appropriate means. The transfer of the wafer Wf from the film sticking unit C4 to the base film cutting unit C5 may use a robot hand having a suction function. That is, a robot hand which can scrape between the holding rolls 130 and reciprocate between the film sticking unit C4 and the base film cutting unit C5 and has an electrostatic suction or suction suction means at the hand portion is prepared, and the film sticking unit C4 is used. Finished wafer Wf to base film 1
Then, the base film 102 may be sucked through the base film 102 and moved to the base film cutting unit C5 in conjunction with the intermittent movement of the base film 102. As described above, according to the method of the present invention, the adhesive film is applied to the main surface of the substrate without frequently changing the cutting means, and the contour of the main surface of the substrate is obtained. It can be pasted with an outline that is equal to or slightly smaller than that. Also,
ADVANTAGE OF THE INVENTION According to this invention, an adhesive film can be stuck on the main surface of a board | substrate, without changing the quality of a film or a board | substrate.
Further, according to the present invention, an adhesive film can be attached to the main surface of the substrate without requiring a post-processing step.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a top view of a film sticking apparatus embodying the method of the present invention. FIG. 2 is a schematic side view of the film sticking apparatus shown in FIG. FIG. 3 is a perspective view showing an example of a perforated cutter and a cut cutter. [Description of Signs] Wf Wafer F Dry film 102 Base film 103 Resist film 104 Cover film 109 Disc cutter 117 Peeling roller 122 Perforated cutter 127 Heat-press roller 133 Film presser

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Hideaki Yamamoto 794 Higashi-Toyoi, Kudamatsu City, Yamaguchi Prefecture Hitachi Techno Engineering Co., Ltd. Kasado Office (72) Inventor Satoshi Saito 5-2-2 Koyodai, Ryugasaki City, Ibaraki Prefecture Hitachi Techno Engineering (56) References JP-A-10-102010 (JP, A) JP-A-2000-211085 (JP, A) (58) Fields studied (Int. Cl. ⁷ , DB name) C09J 201 / 00-201/02 C09J 5/00-5/10

Claims (1)

(57) [Claims] An adhesive film is provided on one principal surface of a substrate.
With a contour equal to or slightly smaller than the contour of one main surface
A method of attaching a film, Has dimensions larger than or equal to the contour of one main surface of the substrate
The adhesive film provided on one entire surface of the base film.
To the contour of the main surface of the substrate or slightly less
A cut that reaches one side of the base film with a small outline
Provided, the adhesive film located outside the cut
Remove and on the base film located inside the cut
Affixing the adhesive film to a desired position on one main surface of the substrate.
In the method of attaching the film, The substrate is a circular substrate conveyed at appropriate intervals.
The adhesive film together with the base film.
The register with the cover film pulled out from the roll
Film of the substrate, and the main surface of the substrate is moved to a desired position.
Lamination roll for sticking the adhesive film
Or by heating and pressing with a lamination plate or
The adhesive film is surrounded by a decompression housing to
A film sticking method characterized in that the method is performed below.