JP2001129457A - Coating method and coating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a coating method and a coating device capable of suppressing the problems of uneven thickness, the stripping of a base layer, or the like, due to the flow of a solution. SOLUTION: A solution 40 or 42 stored in a vessel part 60 is atomized from the liquid surface by the ultrasonic vibration in a solution atomizing device 46 and stuck to the inside surface 12 of a front surface plate 16 supported above the vessel part 60 by a rotary table 52. The deficiency such as the evenness due to the flowing mark of the solution 40 or 42 or the stripping of a phosphor layer 26 in the case of applying it on the inside surface 12 by utilizing the flow of the solution 40, 42, is eliminated because the fog of the solution 40, 42 generated by the ultrasonic vibration is stuck to the inside surface of the front surface plate 16 in performing the coating.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a method and an apparatus for coating a solution.

[0002]

2. Description of the Related Art In the process of forming a film on a substrate or the like, it has been practiced to apply a solution with a uniform thickness to the surface on which the film is formed. For example, a field emission device (Field Emission
In the manufacturing process of the phosphor screen substrate positioned on the light emitting side of the display (FED), a metal back made of thin-film aluminum or the like is formed on the phosphor layer on the inner surface thereof. It is difficult to directly form a metal back smoothly due to the presence of large irregularities. Therefore, for example, a wetting process for wetting the surface of the phosphor layer with water glass, a filming process for further applying a resin solution such as a lacquer solution containing an acrylic resin or the like to the surface, etc., are performed prior to the deposition of the thin film aluminum. Is being done.

[0003]

By the way, the above-mentioned wetting process and filming process are conventionally performed by using, for example, a spin coater or the like, for example, a water glass or resin solution dripped at the center of the film forming surface. Was spread by centrifugal force to apply it on the entire surface of the film. However, in such a method, since the solution flows on the film forming surface, traces of the flow remain, resulting in coating unevenness such as uneven thickness, and the above-described method such as application of the solution to the phosphor layer surface. When another film (underlying layer) that is easily peeled off is provided first on the film forming surface, there is a problem that the other film (underlying layer) is peeled off by the flowing solution.
Such a problem is not limited to the application of the solution to the phosphor screen substrate, but can similarly occur when an attempt is made to apply the solution to the film forming surface by using its fluidity.

[0004] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a coating method and a coating apparatus capable of suppressing problems such as uneven thickness and peeling of an underlayer due to the flow of a solution. To provide.

[0005]

A first aspect of the present invention to achieve the above object is to provide a method of coating a film-forming surface with a solution, comprising the steps of: The solution stored in the container is atomized from the liquid surface by ultrasonic vibration, and the mist is guided to the film forming surface to adhere.

[0006]

According to the first aspect of the present invention, since the coating is performed by the mist of the solution generated by the ultrasonic vibration adhered to the film-forming surface, the flow of the solution is used to coat the film-forming surface. The above-mentioned problems in the case of coating are eliminated. That is, the traces of the solution form unevenness,
When another film is formed first on the film forming surface, the other film does not peel off. In addition, even if dust is included in the solution, the larger one than the mist does not go to the film-forming surface, so that there is an advantage that the dust is also prevented from adhering to the film-forming surface.

[0007]

In another preferred embodiment of the first invention, preferably, the coating method comprises: (b) rotating the film-forming surface about an axis substantially perpendicular thereto, and rotating about a revolving axis substantially parallel to the rotation axis thereof. The fog is caused to adhere while revolving around. With this configuration, the unevenness of fog adhesion is suppressed by the rotation and revolution of the film forming surface, so that the uniformity of the solution coating thickness is improved.

[0008] Preferably, the film formation surface is arranged horizontally toward the liquid surface. If you do this,
Since the film forming surface to which the mist is attached is horizontal, the solution attached on the film forming surface flows, which further suppresses variations in the attached thickness and the formation of traces of the solution. Is done.

[0009]

A second aspect of the present invention to achieve the above-mentioned object is to provide a coating apparatus for coating a film-forming surface with a solution. a) a solution container having an open upper surface for storing the solution, (b) a support device for supporting the film-forming surface above the solution container, and (c) an ultrasonic wave for the solution in the solution container. And a solution atomizing device for atomizing from the liquid level by vibrating.

[0010]

According to the second aspect of the present invention, the solution stored in the solution container is ultrasonically vibrated by the solution atomizing device so that the solution is atomized from the liquid level, and the solution is atomized above the solution container by the support device. Is adhered to the film forming surface supported by. Therefore, since the coating is performed by the mist of the solution generated by the ultrasonic vibration being attached to the film-forming surface, the above-described problem in coating the film-forming surface using the flow of the solution is eliminated. At the same time, dust contained in the solution is suppressed from adhering to the film forming surface.

[0011]

In another preferred embodiment of the second invention, the coating apparatus preferably comprises: (d) a first air blower for blowing air toward a part of the liquid surface of the solution stored in the solution container. And (e) a second blower for blowing air toward the film-forming surface through a path passing above the remainder of the liquid level. According to this configuration, the mist generated by the first blower toward the part of the liquid surface and exclusively generated from the remaining part excluding the part is directed toward the film forming surface by the second blower. It is suitably directed to the film forming surface on the sent wind. For this reason, more fog is attached to the film forming surface with higher uniformity as compared with the case where the fog is directed toward the film forming surface only by ultrasonic vibration alone.

Preferably, the coating apparatus further comprises (f) a movable lid which is moved between a closed position for covering the opening of the solution container and an open position for opening the opening. With this configuration, the mist generated from the liquid surface of the solution by operating the solution atomizing device is not attached to the film forming surface when the movable lid is in the closed position, and the movable lid is Only when in the open position is it adhered to the film forming surface. Therefore, by moving the movable lid to the closed position from the start of the operation of the solution atomizing device to the time when the mist is generated stably, the amount of the mist of the solution adhering to the film forming surface per unit time is stabilized. Therefore, by controlling the time during which the fog flies toward the film forming surface, the amount of adhesion can be accurately controlled.

Preferably, the coating apparatus includes (g) a temperature controller for maintaining the solution stored in the solution container at a predetermined temperature. In this way, since the temperature change of the solution is suppressed, heating by ultrasonic vibration and thus deterioration of the solution and a change in the amount of fog can be suppressed. The above temperature control device is, for example,
A solution container is disposed in a liquid tank, and a cooling liquid maintained at a predetermined temperature is circulated through a passage through the liquid tank so as not to enter the inside of the solution container through an opening.

[0014]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 shows an FED 1 in which the coating method of the present invention is applied to a manufacturing process of a phosphor screen substrate (front panel) 16.
It is a perspective view which shows the structure of No. 0 with a part cut away. In the figure, an FED 10 has a substantially flat surface 12, 1
A front plate 16 and a back plate 18 having substantially the same size and shape are arranged parallel to each other at a predetermined interval so that they face each other, and a spacer 22 is arranged between them. . These front plate 16, back plate 18,
The spacer 22 and the spacer 22 are hermetically sealed with each other, thereby forming an airtight container which is an envelope of the FED 10 having an airtight space 20 therein. The inside of the airtight container is set to a vacuum of, for example, about 6.7 × 10 ⁻⁵ (Pa) [5 × 10 ⁻⁷ (Torr)].

The front plate 16 and the back plate 18 have dimensions of, for example, about 800.times.500.times.3 (mm), and have a substantially uniform thickness and a light-transmitting softening point of about 600 (.degree. C.). Made of soda lime glass or the like. Further, the spacer 22 is, for example, a front plate 16 and a back plate 1.
8 has a rectangular frame shape or a lattice shape having the same outer dimensions as FIG. The spacer 22 is made of, for example, a borosilicate glass having a softening point of about 600 (° C.) on the surface of a rectangular frame or grid-like material having a uniform thickness of about 0.3 (mm) made of, for example, 426 alloy. The insulating glass layer is not provided with a thickness of about 10 (μm) by electrodeposition or the like. Therefore, the distance between the front plate 16 and the rear plate 18, that is, the height of the airtight space 20 is, for example, about 0.3 (mm).

On one surface 12 of the front plate 16, a plurality of stripe-shaped transparent anodes 24 made of, for example, ITO (Indium Tin Oxide) are provided side by side in one direction. . Those multiple anodes 2
A phosphor layer 26 corresponding to any one of the three emission colors of R (red), G (green), and B (blue) is formed on each surface of R 4 in a direction orthogonal to one direction, for example. , G, and B are arranged in this order and intermittently provided so as to be independent for each light emission unit in a direction along one direction. Note that the phosphor layer 26 may be provided in a continuous stripe shape on the anode 24. The anode 24 is formed to a thickness of, for example, about 1 (μm) by, for example, a thin film method such as sputtering, and has a relatively high conductivity with a sheet resistance of about 10 (Ω / □) or less. ing. The phosphor layer 26 is made of a material that emits visible light by an electron beam such as ZnO: Zn, ZnS: Ag + In ₂ O ₃ , for example.
For example, by being provided with a thickness of about 10 to 20 (μm) by a thick film screen printing method or the like, the area resistivity is 500 (Ω)
/ cm ² ).

As shown in an enlarged cross section of the front plate 16 in FIG. 2, a black matrix made of, for example, glass containing a black pigment is provided on the remaining surface 12 where the phosphor layer 26 is not provided. (Black mask) 28 is 15
The surface of the phosphor layer 26 and the surface of the black matrix 28 are formed on the entire surface 12 of the phosphor layer 26 and the black matrix 28 in a thickness of about 20 μm. 100 imitated
It is covered by a metal back 30 having a thickness of about 200 (nm). The black matrix 28 is provided by, for example, a thick-film screen printing method or the like, and forms a lattice shape passing between the phosphor layers 26 provided in a matrix as described above. Note that the phosphor layer 26
Is formed in a stripe shape, a black mask in a stripe shape passing therethrough is provided instead of the black matrix 28. The metal back 30 is provided by, for example, vapor deposition of an aluminum thin film 30 and has a relatively smooth surface, but is formed in a thin film having a thickness such that electrons can easily pass therethrough. I have. In this embodiment, one surface 12 of the front plate 16 on which the metal back 30 and the like are provided corresponds to a film forming surface.

Returning to FIG. 1, one surface 1 of the back plate 18 is described.
4, a plurality of cathode electrodes 32 and gate electrodes 3
4 are provided at right angles to each other and insulated by an insulating film (not shown) made of silicon dioxide (SiO ₂ ) or the like. On the other hand, a plurality of emitters (cold cathodes) 38 are provided on the cathode electrode 32 at portions corresponding to the electron passage holes 36.

The above-mentioned cathode electrode 32 is made of, for example, gold (A
The gate electrode 34 is made of a highly conductive metal such as u), and the gate electrode 34 is made of chromium (Cr) or the like. Also,
The emitter 38 is, for example, a conical cold cathode called a spindt type made of molybdenum (Mo) or the like.
Each of the plurality is formed at a uniform height of about 1 (μm). These are all provided by a thin film method such as sputtering, similarly to the anode 24. The emitter 38 may be of a surface conduction type, MIM type, MIS type, or the like. Each of the electron passage holes 36 has a substantially circular shape having a diameter of about 1 to 2 (μm). For example, the gate electrode 34 is formed by ion etching or the like.
Is partially removed. The insulating film (not shown) is provided so as to cover substantially the entire surface of the cathode electrode 32 except for the portion where the emitter 38 is formed, and the gate electrode 34 is formed on the insulating film. Further, the gate electrode 34 has an emitter 38
The distance between the gate electrode 34 and the surface of the phosphor layer 26 provided on the front plate 16 is, for example, about 0.2 to 1 (mm). In addition,
In the figure, a cathode electrode 32 and a gate electrode 34
Is drawn such that four electron passing holes 36 and emitters 38 are provided at each intersection, but usually, a larger number of, for example, about 2000 electron passing holes 36 and emitters 38 are provided at the intersections. It is provided for each.

For this reason, when a predetermined signal voltage and a predetermined scanning voltage are applied to the cathode electrode 32 and the gate electrode 34, respectively, the field emission (Field Emission) generated based on a large voltage gradient therebetween causes the emitter 38 to emit.
The electrons are emitted from. The electrons fly toward the anode 24 through the electron passage holes 36 when a predetermined positive voltage is applied to the anode 24 provided on the front plate 16. Thereby, electrons collide with the phosphor layer 26 provided on the anode 24, and the phosphor layer 26 emits light. At this time, the phosphor layer 26 is covered with a metal back 30. The metal back 30 is a thin film formed by vapor deposition and has a thickness that allows electrons to easily pass therethrough. Therefore, the electrons emitted from the emitter 38 and attracted to the anode 24 pass through the metal back 30 and enter the phosphor layer 26 to collide with the phosphor. On the other hand, the light generated in the phosphor layer 26 is directed not only to the front plate 16 side but also to the rear plate 18 side.
The light traveling toward the side is reflected by the metal back 30 toward the front plate 16. Therefore, most of the generated light is emitted from the front plate 16.
Therefore, the light is emitted after passing through, so that the substantial luminous efficiency is improved. For this reason, light emission of the phosphor layer 26 cannot be observed from the back plate 18 side, and the FED 10
This is a so-called transmission type display device for observing light transmitted through the phosphor layer 26 from the sixth side.

When the light emission state of the FED 10 thus configured was fully lit and the state of light emission was observed, the metal back 30
No unevenness or inclusion of foreign matter was observed, and no uneven brightness due to unevenness or foreign matter was observed. In this embodiment, one pixel is formed at each intersection of the cathode electrode 32 and the gate electrode 34. Further, the FED 10 is provided with electric wiring for connecting the anode 24, the cathode 32, the gate 34, and the like, and an exhaust hole for exhausting from the inside after forming an airtight container as described in a later-described manufacturing process. However, these are omitted in the figure.

The above-described FED 10 is manufactured, for example, according to the process shown in FIG. In the figure, a process SR1
Through SR3 are processing steps for the back plate 18, and are performed in step SF1.
Steps SF4 to SF4 are processing steps of the front plate 16. Back plate 18
First, the cathode forming step SR1
The cathode electrode 32 is formed by forming a conductive film made of gold or the like on the one surface 14 of the back plate 18 by, for example, a sputtering method and patterning the conductive film. In the subsequent gate forming step SR2, after forming an insulating film on the cathode electrode 32, a conductive film made of chromium or the like is similarly formed on the insulating film by a sputtering method or the like, and is patterned and subjected to chemical etching and ion etching. The conductive film is partially removed by etching or the like to form the gate electrode 34 having the electron passage holes 36. The patterning of the gate electrode may be performed after forming an emitter 38 described later. Then, in the emitter forming step SR3,
After the insulating film on the cathode electrode 32 is partially removed at the position where the electron passage holes 36 are formed, a molybdenum film is formed by a sputtering method or the like. As a result, a molybdenum film is formed on the cathode electrode 32 in the portion where the insulating film has been removed. However, the shape of the molybdenum film naturally forms a conical shape. It is done. Unnecessary molybdenum film formed on gate electrode 34 is removed thereafter.

On the other hand, in the process of processing the front plate 16,
First, in the anode forming process SF1, the one surface 12 is made of ITO.
Is formed by a thin film method such as sputtering, and then a black matrix forming step SF2 is performed.
The above-mentioned black matrix is formed by printing an insulating glass paste containing a black pigment on the one surface 12 by using, for example, a thick film screen printing method and performing a baking treatment at a temperature of, for example, about 450 (° C.). 28 are formed.
In the subsequent phosphor layer forming step SF3, the three colors corresponding to the three colors RGB are included in the lattice of the black matrix 28.
The above-described phosphor layer 26 is provided by applying a kind of phosphor paste to a predetermined position determined for each color by a thick film screen printing method or the like and performing a baking treatment at a temperature of, for example, about 450 (° C.). The phosphor paste is, for example, a mixture of a phosphor, ethyl cellulose, and terpineol in a ratio of 3: 3: 1, and contains no glass component or the like. The bonding strength is extremely low. 4 (a) to 4 (f) are views showing the main part of the cross section at each stage of the treatment process of the front plate 16 by omitting the anode 24 and the like. FIG. This shows a state before firing. Thereafter, in a metal back forming step SF4, a metal back 30 is formed so as to cover the surfaces of the phosphor layer 26 and the black matrix 28.

The above metal back forming step SF4 includes:
For example, it is performed as follows according to the process chart shown in FIG. In the figure, first, in a wetting step SF41, for example, a potassium silicate solution 40 is applied to the entire surface on one surface 12 with a uniform thickness of about 1 to 200 (μm). The potassium silicate solution 40 is, for example, a solution obtained by dissolving potassium silicate in deionized water, and contains, for example, SiO ₂ and K ₂ O at a concentration of about 0.7 (%) and 0.3 (%), respectively, as oxides. FIG. 4B shows this state. Next, in the filming step SF42, the one side 12
While the upper part is wet with the potassium silicate solution 40, a filming solution 42 is applied to the entire surface. The filming solution 42 is, for example, a solution obtained by dissolving an acrylic resin precursor in a solvent such as toluene, and has a viscosity of, for example, about 1 × 10 ⁻⁴ (Pa · s). FIG. 4C shows this state. By drying this at a temperature of, for example, about 60 (° C.), the solvent component in the filming solution 42 is volatilized to form a resin film 44 made of an acrylic resin or the like having a thickness of about 2 to 3 (μm). At the same time as potassium silicate solution 4
0 (water) is removed, and the resin film 4 is substantially formed directly on the phosphor layer 26 and the black matrix 28.
4 are provided. FIG. 4D shows this state.

In the following aluminum deposition step SF43,
An aluminum thin film 30 having a thickness of about 100 to 200 (nm) is deposited on one surface 12 of the front plate 16 provided with the resin film 44 as described above. FIG. 4E shows this state. Thereafter, in a baking step SF44, a heat treatment is performed at a predetermined processing temperature determined in accordance with the decomposition temperature of the resin contained in the filming solution 42, for example, at a temperature of about 430 (° C.). The film 44 is disassembled and the metal back 30 is placed directly on the phosphor layer 26 and the black matrix 28. Fig. 4 (f)
Indicates this state. The metal back 30
Is not porous and does not hinder the decomposition and removal of the resin film 44.

Returning to FIG. 3, in the joining step S5,
The rear plate 18 and the front plate 16 processed as described above are stacked so that the surfaces 12 and 14 face each other via a separately prepared spacer 22, and are subjected to a heat treatment, so that, for example, the upper and lower end surfaces of the spacer 22. Airtightly with a sealing agent such as a seal glass (not shown) made of lead glass which has been applied beforehand. The heat treatment temperature is determined according to the type of the sealing agent and the like.
(° C). Thereafter, in the exhaust step S6, the FED 10 shown in FIG. 1 is obtained by exhausting air from an exhaust hole (not shown).

Meanwhile, of the metal back forming step SF4, the wetting step SF shown in FIG.
The filming step 41 and the filming step SF42 are performed using, for example, a coating apparatus 46 shown in FIG. In the figure, a coating device 46 is provided with a water bath 48.
It has a solution atomizing device 50 disposed therein and a turntable 52 functioning as a supporting device that supports the plurality of front plates 16 above the inner surface 12 so that the inner surface 12 is in the horizontal direction. The turntable 52 is provided at a position where the rotation shaft 54 is deviated from the center of the solution atomizing device 50 by about 回 転 of the radius of rotation, for example, outside the water bath 48. For this reason, the front plate 16 supported by the rotating shaft 52 passes through the solution atomizing device 50 (that is, on the opening 68) along with the rotation of the turntable 52 in the direction of the arrow R, and its rotation axis perpendicular to the inner surface 12. (Revolution axis) is rotated around 54. The plurality of front plates 16 are parallel to the rotation of the rotation shaft 54 (that is, perpendicular to the inner surface 12).
Each of them is held by a holding device 58 that is rotated around the rotation shaft 56. Therefore, the front plate 16 is passed over the solution atomizing device 50 while rotating in the direction of the arrow r around the rotation axis 56 on the turntable 52. The turntable 52 is
Although it is arranged at a position covering the opening 68 of the solution atomizing device 50, it is shown at a position shifted laterally in the figure.

Further, the above-mentioned solution atomizing apparatus 50 includes a potassium silicate solution 40 in the wetting step SF41.
In the filming step SF42, the filming solution 42 is atomized by ultrasonic vibration, respectively, and is directed upward, that is, toward the front plate 16 supported by the turntable 52. FIG. 7 is a diagram schematically illustrating an example of a configuration of the solution atomizing device 50 by illustrating a cross section of a main part thereof. In the figure, a container portion 60 has an open top surface, and a potassium silicate solution 40
Alternatively, a filming solution 42 (hereinafter, referred to as a solution) is stored, and a plurality of vibrators 62 are submerged in the solution. An oscillating circuit 64 is provided outside the container section 60. When the vibrator 62 is ultrasonically oscillated by the oscillating circuit 64, the solution is atomized from the liquid surface 66 to form the mist. The solution is taken out from the opening 68 to the outside. The vibrator 62 has, for example, a diameter of 25 to 50 (m
m), a substantially disk-shaped piezoelectric element, electrostrictive element, magnetostrictive element, or the like. In this embodiment, the container section 60 corresponds to a solution container.

A first intake port 70 for taking in outside air is provided adjacent to the opening 68 above the container section 60. A blower fan 72 and a filter 74 are provided in the first intake port 70, and the first intake port 7 is activated by operating the blower fan 72.
After the air taken in from 0 is filtered and cleaned by the filter 74, it is supplied toward a part of the liquid surface 66 on the right side in the figure as shown by the arrow A. A second intake port 76 for taking in outside air is provided on a side of the container section 60, and a ventilation fan 78 and a filter 80 are provided in the second intake port 76 similarly to the first intake port 70. . When the blower fan 78 is operated, the second
After the air taken in from the air inlet 76 is filtered and purified by the filter 80, the course is changed obliquely upward by a slope 81 provided on the blower fan 78,
As shown by an arrow B, the ink is supplied toward the upper part of the container part 60, that is, toward the opening 68. That is, the blowing fan 78
Blows toward the inner surface 12 along a path that passes above the remaining portion of the liquid surface 66 on the left side in the drawing. Therefore, the mist of the solution generated from the liquid surface 66 by the ultrasonic vibration does not stay near the liquid surface 68, and the air (arrow A) taken in from the first air inlet 70 as shown by the arrow C. ), Is forcibly sent toward the opening 68, and further rides on the flow of air (arrow B) taken in from the second intake port 76, that is, sequentially from the opening 68 by the transport flow indicated by arrows A and B. Will be sent out. That is, the portion near the opening 68 of the solution atomizing device 50 forms a duct portion that guides the generated mist toward the entire surface 12. In this embodiment, the blower fan 72 is connected to the first blower by the blower fan 78.
Correspond to the second blowers, respectively.

The front plate 1 held by the holding device 58
6 is rotated around the rotation axis 54 so as to pass over the opening 68, and the holding device 58 has a stepped portion protruding inward at a position where the front plate 16 can be mounted as shown in FIG. Since a through hole 84 having a portion 82 is provided, and the stepped portion 82 supports the peripheral edge of the front plate 16,
One surface 12 of the front plate 16 is exposed to the opening 68 side. That is, the one surface 12 is arranged on the container part 60 toward the liquid surface 66. As a result, as described above, the mist of the solution sent out from the opening 68 along the path indicated by the arrow C is rotated (revolved), so that one surface of the front plate 16 temporarily positioned on the opening 68 12 are attached substantially uniformly. In the drawing, reference numeral 86 denotes a float switch for stopping the operation of the oscillation circuit 64 when the liquid level 68 falls below a predetermined level.

Returning to FIG. 6, in the vicinity of the solution atomizing device 50, a lid 88 is provided with a rotating shaft 90 extending, for example, in the vertical direction.
It is provided so as to be rotatable around. The lid 88 is rotated as shown by an arrow D in the figure, and thereby is positioned at one of an open position for opening the opening 68 and a closed position for closing the opening 68 as shown in the figure. Things.

On the side wall surface of the water bath 48,
A supply port 94 for introducing a coolant 92 such as cooling water into the inside and a discharge port 96 for discharging the coolant 92 are provided. The supply port 94 and the discharge port 96 are connected to the temperature control device 100, and the refrigerant 92 is circulated between the temperature control device 100 and the water bath 48 via the supply port 94 and the discharge port 96. The solution atomizer 50 located in the water bath 48 is cooled by the refrigerant 92. For this reason, even if the solution in the container unit 60 is ultrasonically vibrated,
For example, 20
Since the temperature is maintained at a constant temperature of about (° C.), it is possible to appropriately suppress the deterioration of the heating and the change in the amount of generated fog due to the heating.
In the drawing, reference numeral 98 denotes the solution atomizing device 50 and the turntable 5
2 is a film thickness correction plate disposed at an appropriate position between
The uniformity of the amount of the solution adhering to the inner surface 12 of the front plate is enhanced by being provided in the direction in which the mist of the solution easily flies.

The above-mentioned wetting step SF41 using the coating apparatus 46 configured as described above is performed, for example, as follows. First, a sufficient amount of the potassium silicate solution 40 is charged into the container 60. Next, by operating the oscillation circuit 64 and the blowing fans 72 and 78 with the opening 68 closed with the lid 88, the solution 40 is atomized from the liquid surface 66 by ultrasonic vibration and sent out from the opening 68. The input power of the oscillation circuit 64 is about 200 to 800 (W), and the vibration frequency of the vibrator 62 is 0.05 to 20 (W).
It is about 0 (MHz).

Further, the front plate 16 is held by the holding device 58 and the turntable 52 is rotated around the rotation axis 54 in parallel with or before or after the above processing. At this time, the rotation speed of the rotating shaft 54, that is, the revolution speed of the front plate 16 is 2 to 30 (rpm).
The rotation speed of the rotation shaft 56, that is, the rotation speed of the front plate 16 is about 0.5 to 20 (rpm). Then, after a predetermined preliminary operation time of about 2 to 3 (minutes) has elapsed and the mist of the solution has been stably sent out from the opening 68, the lid 88 is rotated to open the opening 68. I do. The opening time is, for example, about 20 to 120 (seconds). As a result, the inner surface 12 of the front plate is exposed to the mist of the potassium silicate solution 40 only while the opening 68 is open, and the mist adheres to the inner surface 12 of the front plate. At this time, since the front plate 16 is revolved around the rotation axis 52 and rotated around the rotation axis 56, even if the amount of fog sent out from the opening 68 in the direction along the inner surface 12 is uneven, Inner surface 12
Is applied with a substantially uniform thickness distribution. For example, if the temperature inside the device before operation is 21
(° C) and humidity of about 43 (% RH), the particle size of the generated fog is in a fine range of about 0.1 to 50 (μm), and the adhesion film thickness before drying is, for example, 1 to 200 (μm). μm), and the particle size distribution under certain conditions is 5
Approximately 30 (μm), and the film thickness distribution was as extremely small as about 2 (μm) ± 5 (%), so that a uniform adhesion thickness could be obtained. Although the dispersion of the particle size of the mist is relatively large, the mist is uniformly directed to the entire surface 12 and adheres and spreads thereon, so that a uniform adhesion thickness can be obtained.

The filming step SF42 is performed in a manner similar to the general wetting step SF41. However, the filming solution 42 is charged into the container 60 instead of the potassium silicate solution 40, and the input power of the oscillation circuit 64 and the vibration frequency of the vibrator 62 are, for example, 10
It is about 0 to 500 (W) and about 100 to 1000 (MHz). Also,
The number of revolutions and the number of revolutions of the front plate 16 are, for example, 20 to 100 (rpm) and 1 to 20 (rpm), respectively. This allows the mist of the filming solution 42 to adhere to the front plate inner surface 12 with a substantially uniform thickness distribution in the same manner as in the case of the potassium silicate solution 40. The mist of the filming solution 42 also has a particle diameter in the range of about 1 to 100 (μm) under the same conditions as the potassium silicate solution 40, and after drying the deposited film thickness.
Each can be controlled in the range of about 0.1 to 30 (μm),
Under certain conditions, the particle size distribution was about 10 to 40 (μm), and the film thickness distribution was very narrow, about 2.5 (μm) ± 5 (%) after drying, and a uniform adhesion thickness could be obtained.

In the wetting step SF41 and the filming step SF42, the solutions 40, 4
Since the solution 2 is atomized and adhered to the inner surface 12 of the front plate, the solutions 40 and 42 do not flow on the inner surface 12. As a result, the flow marks remain on the inner surface 12 to cause unevenness in the thickness of the aluminum thin film deposited on the metal back 30, that is, the metal back 30, and the phosphor layer 26 is peeled off by the flow of the solutions 40 and 42. Etc. are suppressed. Therefore, in the FED 10 using such a front plate 16, unevenness of the metal back 30 and uneven brightness due to partial peeling of the phosphor layer 26 do not occur. In addition, even if the solution 40, 42 contains dust (foreign matter), only the solution 40, 42 in the form of mist adheres to the inner surface 12 of the front plate, so that the solution 40, 42 becomes mist by ultrasonic vibration. Unused refuse does not adhere to the inner surface 12. Therefore, the metal back 30 has no unevenness due to the adhesion of foreign matter, and no uneven brightness of the FED 10 due to the unevenness.

In short, in this embodiment, the container 6
The solution 40, 42 stored in the nozzle plate 0 is atomized from the liquid level by being ultrasonically vibrated by the solution atomizing device 46, and the front plate 16 supported above the container unit 60 by the turntable 52. Is attached to the inner surface 12.
Therefore, the mist of the solutions 40 and 42 generated by the ultrasonic vibration adheres to the inner surface 12 of the front plate, so that the solutions 40 and 42
Since the coating 42 is performed, there is no problem in coating the inner surface 12 by using the flow of the solutions 40 and 42, that is, unevenness due to the flow traces of the solutions 40 and 42 and peeling of the phosphor layer 26 are eliminated. . And solution 4
There is also an advantage that the dust in 0 and 42 does not become mist and cannot be attached to the inner surface 12.

In this embodiment, the solutions 40, 4
When coating 2 on the inner surface 12 of the front plate, the uniformity of the coating thickness of the solutions 40 and 42 is enhanced because the rotation and revolving of the inner surface 12 suppress uneven fog adhesion.

Further, in this embodiment, since the one surface 12 is disposed horizontally to face the liquid surface 66, the solution adhered on the one surface 12 on which the mist is adhered flows, and the thickness of the adhered film may vary. In addition, the formation of a trace of the flow of the solution is further suppressed.

In this embodiment, the solution atomizing device 50 has a blowing fan 7 for blowing air toward a part of the liquid surface 66 of the solutions 40 and 42 stored in the container portion 60.
2 and the inner surface of the front plate 1
2 is provided with a blower fan 78 for blowing air toward the nozzle 2, so that the air is blown toward a part of the liquid surface 66 by the blower fan 72 and is generated exclusively from the remaining part except for a part thereof. The mist rides on the wind blown toward the inner surface 12 by the blower fan 78 and the inner surface 12
Is suitably directed. Therefore, more fog is attached to the inner surface 12 with higher uniformity as compared with the case where the fog is directed toward the inner surface 12 by simply ultrasonic vibration.

In the present embodiment, the coating device 46 is placed between a closed position for covering the opening 68 of the container portion 60 (that is, the opening of the solution atomizing device 50) and an open position for opening the opening 68. A lid 88 that is moved is provided, and the lid 88 is located at the closed position from the start of the operation of the solution atomizing device 50 until the mist is stably generated, and the opening 68 is opened for a fixed time after the stabilization. . Therefore, the solutions 40, 4 adhering to the inner surface 12 per unit time
Since the inner surface 12 is exposed in a state where the amount of mist 2 is stable, a uniform amount of adhesion can be obtained by controlling the time during which the mist flies toward the inner surface 12 as described above.

In the present embodiment, the coating apparatus 46 includes the solutions 40, 4 stored in the container section 60.
2 is maintained at a constant temperature of, for example, about 20 (° C.), so that a change in the temperature of the solutions 40 and 42 is suppressed. It is possible to suppress the alteration and the change in the amount of fog.

In the above-described embodiment, the case where the coating method of the present invention is applied to the manufacturing process of the front plate 16 of the FED 10 has been described, but this coating method is applied to a flat panel panel such as the FED 10 or a liquid crystal panel. The present invention is similarly applied to a manufacturing process of a matrix wiring substrate of a display and a cathode ray tube (CRT) having a curved inner surface.

In the manufacturing process of the matrix wiring substrate, for example, the above-mentioned coating method can be applied to the formation of the X-direction wiring and the Y-direction wiring forming the matrix wiring. This is performed, for example, as follows. First, for example, a thick film conductor paste is applied to the entire surface of a soda glass substrate having a size of about 800 × 500 × 3 (mm) by using a thick film screen printing method. Here, the thick film conductor paste contains, for example, Ag as a conductive component and borosilicate glass as a component for increasing the adhesive strength to a substrate. Dry the applied thick film conductor paste
After baking to fix the thick film conductor on the substrate, the photosensitive resin solution is atomized and applied using the coating apparatus 46 described above. This photosensitive resin solution is, for example, a solution in which a photosensitive agent is dissolved in a resin solution such as an acrylic solution or a PVA (polyvinyl alcohol) solution, and is, for example, 1 × 10 ⁻⁴ to 1 × 10 ⁻² (Pa
・ Adjusted to a viscosity of the order of s). Next, after applying the photosensitive resin solution, the solution is dried at a temperature of about 80 (° C.) for about 60 (minutes) to remove the liquid. Then, after exposing and developing the photosensitive resin solution in a positive pattern of the X-direction wiring, unnecessary portions of the thick-film conductor are removed by an etching process, and the photosensitive resin is peeled off with a peeling liquid to thereby remove the thick resin. Wiring is formed. The Y-direction wiring provided crossing over the X-direction wiring is formed in the same manner as the X-direction wiring after a thick-film insulating paste is thick-film-screen-printed at the intersection, dried and fired to form an insulating film. Formed by procedure.

In this example, the solution coating method is used for applying a photosensitive resin to be a protective film (resist) during the etching process. Further, there is no film having a low adhesive strength that can be peeled off when the photosensitive resin solution flows on the coated surface of the photosensitive resin.

When the matrix wiring substrate constitutes the back plate 18 of the FED 10, the X-direction wiring (cathode electrode 32) and the Y-direction wiring (gate electrode 34)
At the point of intersection with the electron-emitting device (for example, the aforementioned emitter 38)
After being formed, it is bonded to the front plate 16 and evacuated from the inside to be sealed with a sealing agent. In the case of constituting a switching substrate of an LCD, a liquid crystal material is injected between them after being bonded to a transparent substrate on which a color filter is formed.

In the manufacturing process of the CRT, the above-mentioned coating method can be applied to the preparation of the phosphor screen. This is performed, for example, as follows. First, a black matrix is formed on the inner surface of a glass tube constituting a CRT using black carbon by a photolithography method. Next, phosphor layers of three colors of RGB are formed in an appropriate arrangement in the lattice of the matrix. For forming the phosphor layer, for example, a well-known sedimentation method or a photolithography method is used. Subsequently, the potassium silicate solution 40 is atomized and applied to the entire inner surface of the glass tube by using the coating apparatus 46. Similarly, a filming solution 42 is applied on the solution 40 using a coating device 46, and after the leveling process, for example,
By drying at (° C.), a filming film similar to the resin film 44 is generated. Then, for example, an aluminum thin film is formed on the filming film by 0.1 to
A phosphor screen tube is obtained by forming a film having a thickness of about 0.2 (μm) and baking it at a temperature of, for example, about 430 (° C.) to remove the filming film. A well-known electron gun is assembled to the fluorescent screen tube, and exhausted and sealed to form a CRT.

Although one embodiment of the present invention has been described in detail, the present invention can be implemented in other embodiments.

For example, in the embodiment, the present invention is applied to the case where the metal back of the FED 10 which is an image display
The case where the film is used for coating a resist film of D or a fluorescent screen of a CRT has been described. However, if a solution is coated on a film forming surface such as a substrate surface in a manufacturing process, for example, resinate (metal) Organic compound) ITO film, SnO film, Si using paste
The same applies to the formation of other films such as an O ₂ film. In addition, IT
The O film and the SnO film constitute a transparent electrode in a display device or the like, and the SiO ₂ film is provided for the purpose of avoiding direct contact with an alkali component when forming a film.

In the embodiment, when forming the metal back 30 or forming the pattern of the electrodes, the resin film 44 which temporarily forms the base layer and is burned off in a later step, or the resist which is peeled off is removed. Although the case where the present invention is applied to the step of forming the same on one surface 12 or the like has been described,
The present invention is similarly applied to a case where the coating film is left as it is on the film forming surface.

In the embodiment, the temperature controller 1
00, the temperature of the solutions 40 and 42 was kept at a constant temperature. However, when the temperature rise due to the ultrasonic vibration is sufficiently small, or when there is no inconvenience even when the temperature rises, the temperature control device 100 Not required.

Further, in the embodiment, the exposure time of the one surface 12 is adjusted by covering the opening 68 with a cover 88 which can be opened and closed. However, for example, the turntable 52 is configured to be movable and placed on it. The exposure time may be adjusted by moving the provided front plate 16 over the opening 68.

In the embodiment, the blower fan 7
Although it was configured so that the mist was sent out from the opening 68 by the air blow from 2, 78, if it was possible to guide the mist to the inner surface 12 with a substantially uniform distribution and apply it to the inner surface 12 with a uniform thickness, The mist may be attached to the inner surface 12 only by ultrasonic vibration without providing the blower fans 72 and 78, or
Only one of the blower fans 72 and 78 may be provided.

Further, in the embodiment, the front plate 16 is applied with the mist while being rotated around the rotation axis 56 and the revolution axis 54 perpendicular to the inner surface 12 thereof. Alternatively, the fog may be applied only in the revolution state.

Further, in the embodiment, the front plate 16 is arranged horizontally so that the inner surface 12 faces the liquid surface 66, but it may be arranged such that the inner surface 12 is inclined with respect to the horizontal plane. Good. Further, since the direction in which the fog is guided by the duct portion 85 is substantially determined, the duct portion 85 may be formed by bending the duct portion 85 in an arbitrary direction, and the front plate inner surface 12 may be disposed in the opening 68 of the duct portion 85. The mist of the solution can be uniformly attached to the inner surface 12. That is, the inner surface 12 does not necessarily have to be disposed toward the liquid surface 66.

The conditions of the ultrasonic vibration for atomizing the solutions 40 and 42 are not limited to the range shown in the embodiment.
Physical properties such as viscosity and surface tension of solutions 40 and 42, etc.
It is appropriately changed according to the environmental factors such as the film thickness, temperature, humidity, and the like to be attached to the substrate.

Although not specifically exemplified, the present invention can be variously modified without departing from the gist thereof.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a configuration of an FED according to an embodiment of the present invention, with a part thereof being cut away.

FIG. 2 is an enlarged view showing a cross section of a front plate of the FED of FIG. 1;

FIG. 3 is a process diagram illustrating a manufacturing process of the FED in FIG. 1;

FIG. 4 is a diagram illustrating a cross-sectional structure of a front plate in each step of FIG. 3;

FIG. 5 is a process diagram illustrating in detail an aluminum thin film forming process of FIG. 3;

FIG. 6 is a front view illustrating the overall configuration of a coating apparatus used in the wetting step and the filming step in FIG.

FIG. 7 is a cross-sectional view illustrating a configuration of a solution atomizing device provided in the coating device of FIG.

[Explanation of symbols]

 12: One surface (film forming surface) 40: Potassium silicate solution (solution) 42: Filming solution (solution) 50: Solution atomizing device 58: Holding device (supporting device) 60: Container part (solution container) 66: Liquid surface

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Kota Hirakawa 3-36 Noritakeshinmachi, Nishi-ku, Nagoya-shi, Aichi F-term in Noritake Electronics Co., Ltd. 4D074 AA01 BB04 DD03 DD22 DD34 4D075 AC96 AC99 BB26Z BB85Z CA48 DA06 DB13 DC22 EA06 EA45 EB02 4F035 CA02 CB04 CB05 CB13 4F042 AA07 AB00 DB01 DF03 DF04 DF28 EB02 ED00

Claims (4)

[Claims] 1. A method of coating a solution on a film forming surface, comprising: atomizing the solution stored in a solution container from the liquid surface by ultrasonic vibration; and guiding the mist to the film forming surface. A coating method characterized by attaching. 2. The coating method according to claim 1, wherein the film is formed so as to rotate around the axis substantially perpendicular to the film-forming surface and revolve around a revolving axis substantially parallel to the rotation axis to adhere the mist. 3. An apparatus for coating a film-forming surface with a solution, comprising: a solution container having an open upper surface for storing the solution; and a support for supporting the film-forming surface above the solution container. A coating apparatus comprising: an apparatus; and a solution atomizing apparatus that atomizes a solution in the solution container from the liquid level by ultrasonically oscillating the solution. 4. A first air blower for blowing air toward a part of the liquid surface of the solution stored in the solution container, and a first air blowing device which is directed toward the film forming surface through a path passing above a remaining part of the liquid surface. 4. The coating apparatus according to claim 3, further comprising a second blower for blowing air.