JP2001007015A - Stage device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To keep the temperature on a stage constant by controlling a heat recovery amount based on the drive pattern which is specified in advance for stage driving, related to a control means. SOLUTION: A control means calculates the drive pattern of a wafer table, based on the layout information of a job which is to be used in advance (S1). Based on the driven pattern, a control pattern for a set temperature for a cooling liquid is acquired from the accumulated value of predicted heating amount for each specified interval (S2). The driving of the wafer table is started, and at the same time, the set temperature of the cooling liquid is started to be controlled (S5). Then the driving amount of the wafer table is integrated (S4), which is compared with the drive pattern (S6), and based on the comparison result, the temperature of cooling liquid is reset (S7), and the integrated value is reset (S8) for controlling the heat recovery amount.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for exposing each exposure area by sequentially aligning each exposure area on a substrate at a predetermined exposure position, and in particular, manufacturing a semiconductor device such as an IC or LSI. In a step-and-repeat type exposure apparatus that projects and exposes a circuit pattern on a reticle surface onto a wafer surface via a projection optical system, a position or a position error related to several shot regions on a semiconductor wafer is measured. From these, a shot arrangement of each shot area on the wafer is determined, and the shot arrangement can be used for alignment to sequentially align each shot area on the wafer at a position related to the reticle using the determined shot arrangement. Is a stage device that can be used in equipment that requires high-precision position control, such as precision processing machines and precision measuring machines. About.

[0002]

2. Description of the Related Art Such a stage device generally has a structure for recovering the heat generated by a drive motor by circulating a refrigerant maintained at a constant temperature to a motor portion as a heat source. It is very difficult in terms of structure to completely block the heat generation of the device. That is, the motor is configured to recover substantially constant heat regardless of the amount of heat generated by the motor. Therefore, when the amount of heat generated by the motor is large, the amount of heat generated by the motor is larger than the amount of heat recovered by the refrigerant, and the temperature on the stage table increases due to electric heat from the motor.

On the other hand, in order to stabilize the environment of the stage, air whose temperature is controlled from a certain direction flows through a space around the stage. Therefore, when the temperature on the stage table increases, a temperature difference occurs between the windward side and the leeward side. Due to this temperature difference, a difference in thermal expansion on the table occurs, causing distortion. When the distortion on the table occurs, the posture of the reference mirror mounted on the table changes, and the coordinate shape of the stage configured based on the mirror changes. As a result, a wafer positioning error occurs.

As a countermeasure, the heat generation amount of the motor is monitored, the heat generation amount is calculated from the driving history of the motor, and the refrigerant temperature of the heat recovery heat exchanger is changed in accordance with the heat generation amount. The temperature is kept as constant as possible. Also, as described in JP-A-1-195389, in a stage device such as a precision moving table using a linear motor, the temperature of the linear motor is detected by using a temperature detecting means, and the base and the linear motor are detected. The cooling means is controlled so as to eliminate the temperature difference.

[0005]

However, according to the prior art in which the refrigerant temperature is changed based on the monitoring result of the heat generation amount of the motor and the calculation result based on the driving history, the actual cooling effect is changed after changing the temperature setting of the refrigerant. Since there is a time difference before the appearance of the temperature change, there is a problem that it is difficult to keep the temperature change on the table to a certain extent, but it is difficult to keep it constant.

Further, according to the prior art described in the above publication, feedback control is used in which the temperature detecting means detects a temperature rise of the linear motor due to the driving of the stage and then controls the cooling means based on the detected temperature rise. Because
A certain response time is required from when the temperature of the linear motor rises to when it decreases. Therefore, there is a problem that the table is deformed by thermal stress due to a temperature change during that time, and a member serving as a reference of the accuracy of the table is deformed, so that further high-precision control cannot be performed. Further, it is difficult to attach a temperature detecting means such as a thermistor to a linear motor, a table, or the like, which causes an increase in cost.
There is also a problem that it is difficult to perform a wiring process for attaching them to a moving body.

An object of the present invention is to provide a stage apparatus capable of maintaining a constant temperature on a stage irrespective of a change in driving load and without using a temperature detecting means in a stage device. It is to make.

[0008]

In order to achieve this object, a first stage apparatus of the present invention comprises a drive motor for driving a stage, heat recovery means for recovering heat generated by the drive motor, Control means for controlling the amount of heat recovery by the recovery means, wherein the control means controls the drive of the stage based on a drive pattern defined in advance with respect to the drive of the stage. Is performed.

In this configuration, the drive pattern is defined with respect to the drive of the stage in order to control the drive of the stage, and is obtained before the drive of the stage is performed based on the drive pattern. The state of heat generation of the motor can be obtained in advance. Based on this, accurate control of the heat recovery amount is performed in consideration of the heat transfer time, and the stage temperature is kept constant.

A second stage apparatus according to the present invention includes a drive motor for driving the stage, heat recovery means for recovering heat generated by the drive motor, and control for controlling the amount of heat recovery by the heat recovery means. Means for controlling the amount of heat recovery by changing the amount of heat recovery based on a driving state detected at predetermined time intervals of the stage. It is characterized by.

In this configuration, the heat recovery amount is immediately changed at each predetermined time based on the detected driving state. Therefore, by appropriately setting the predetermined time, the control of the heat recovery amount is performed accurately without delay, and the temperature of the stage is kept constant.

A third stage apparatus according to the present invention includes a drive motor for driving a stage, heat recovery means for recovering heat generated by the drive motor, and control means for controlling the amount of heat recovery by the heat recovery means. Wherein the control means calculates, for each drive of the stage, a heat value of the drive motor based on drive information which is information on the drive, and further calculates the heat value at predetermined time intervals. The heat recovery amount is controlled by integrating and changing the heat recovery amount based on the integrated value.

In this configuration, the heat generation amount for each drive of the stage is integrated at every predetermined time, and the heat recovery amount is immediately changed based on this. Therefore, by appropriately setting the predetermined time, the control of the heat recovery amount is performed accurately without delay, and the temperature of the stage is kept constant.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In a preferred embodiment of the first stage device of the present invention, the drive pattern defines a drive position of the stage, acceleration during acceleration / deceleration, or maximum speed. The stage apparatus is used for step movement in an exposure apparatus that performs exposure on each exposure region on the substrate while sequentially moving the substrate in accordance with a given exposure layout. The drive pattern is obtained based on a layout. Further, the control means obtains a heat generation pattern of the drive motor based on the drive pattern,
Based on this, the operation pattern of the heat recovery means is obtained, and the driving of the stage is controlled based on this. Further, the control means may control a heat amount of the drive motor based on the amount of current per predetermined time to be supplied to the drive motor based on the drive pattern, the acceleration time per predetermined time of the stage, or the drive amount per predetermined time of the stage. Is what you want.

In this configuration, the driving pattern of the stage is read in advance from the layout information of the job and the number of wafers, and the calorific value of the driving motor is predicted from the information. To change the heat recovery. As a result, the temperature change on the stage becomes very small. As a result, a change in coordinates on the stage is reduced, and high-precision alignment is always performed.

In a preferred embodiment of the second stage apparatus according to the present invention, the control means changes the heat recovery amount based on the moving distance of the stage at every predetermined time. That is, for each of the predetermined times, it is determined whether or not the moving distance of the stage for each of the predetermined times is equal to or greater than a predetermined maximum value and whether or not the movement distance is equal to or less than a predetermined minimum value. In some cases, the heat recovery amount is reduced by a predetermined value, and when the heat recovery amount is equal to or less than a predetermined minimum value, the heat recovery amount is increased by a predetermined value. Alternatively, the control means calculates the amount of heat generated by the drive motor based on the current supplied to the drive motor every predetermined time, and changes the amount of heat recovery based on the amount of heat generated.

In a preferred embodiment of the third stage apparatus according to the present invention, the drive information includes an amount of current flowing through the drive motor per predetermined time, an acceleration time per predetermined time, or a drive per predetermined time. Quantity. And the amount of heat recovery has an upper limit and a lower limit,
The control means controls the heat recovery amount so that the heat recovery amount does not exceed the upper limit or the lower limit.

In any of the first to third stage devices, the control means controls the heat so that the temperature change of the stage and the drive motor is minimized, that is, the amount of heat generated by the drive motor is equal to the amount of heat recovery. Control the amount of collection. As the heat recovery means, a means for recovering heat with a refrigerant can be used. In this case, the control means controls the amount of heat recovery by controlling the temperature of the refrigerant. Further, as the drive motor, a linear motor having a stator having a coil or a magnet and a movable element having a coil or a magnet that moves linearly along the stator can be used. Further, the control means controls the amount of heat recovery in consideration of the difference between the heat transfer path at the time of heat recovery by the heat recovery means and the heat transfer path of heat generated by the drive motor.

[0019]

FIG. 1 is a perspective view showing a wafer stage of a semiconductor exposure apparatus according to a first embodiment of the present invention. This stage device is composed of a fine movement stage 2 and a Y slider 4a constituting an X stage as shown in FIG.
Heat recovery means (not shown) for recovering the heat generated by the X linear motor 3 and the X linear motor 6 for driving the X linear motor 3 and 4b in the X axis direction and the Y axis direction, respectively. Control means for controlling the amount of heat recovered by the recovery means is provided.

The wafer 1 to which a photosensitive agent is applied and exposed is
It is mounted on a stage table via a wafer holder. The wafer table can be driven by a fine movement mechanism (not shown) of the fine movement stage 2 in the optical axis direction (Z-axis direction) of the projection lens and in a rotation direction about the optical axis. On the wafer table, two orthogonal bar mirrors for a laser interferometer (not shown) are mounted, and the wafer table is moved by an interferometer for X-axis and Y-axis measurement and rotation measurement parallel to the X-axis. Positioning in the rotational direction is performed. The laser interferometer has a problem that when a change in the refractive index in the air occurs due to a temperature change, the measured value changes. For this reason, the stage space around the stage device needs to be constantly maintained at a constant temperature, and temperature-adjusted air is constantly flowing through the optical path of the interferometer. Therefore, when there is no heat source in the wafer holder, if the temperature is almost the same as the temperature of the air flowing through the stage space,
The wafer table can be kept free from temperature unevenness.

The heat recovery means is provided in the casing of the X linear motor 3 or in the casings of the Y linear motors 6a and 6b in a liquid adjusted to a temperature set by a heat exchanger (hereinafter referred to as a motor cooling liquid). Has a structure to circulate.
Most of the heat generated from the coil of the X linear motor 3 is released by the motor coolant circulated through the housing.
Since the X linear motor 3 generates little heat when the stage device is stopped, the temperature of the motor coolant flowing in the housing of the X linear motor 3 is substantially the same as the temperature of the air flowing in the stage space. By setting this temperature, the temperature of the wafer holder can be kept almost the same as the temperature of the air in the stage space. However, when the acceleration and deceleration of the X stage is repeated, a large amount of current flows in the coil of the X linear motor 3, and the heat generated from the coil cannot be completely released by the motor coolant. Is emitted from the coil surface. In the structure of this embodiment, the heat generated from the coil surface of the X linear motor 3 in particular heats the wafer holder via the X stage. On the other hand, if the temperature of the motor coolant is set lower than the temperature of the stage space, the wafer holder that has become accustomed to the temperature of the stage space loses heat through the X stage, and thus generates heat from the motor. When there is no wafer holder, the temperature of the wafer holder becomes lower than the temperature of the stage space. However, when heat is generated from the X linear motor 3, the wafer holder is heated as described above.
Therefore, if the amount of heat supplied by the heat generated by the X linear motor 3 and the amount of heat taken away by the motor coolant can be canceled successfully, the temperature of the wafer holder can always be kept constant.

One method of calculating the amount of heat generated by the X linear motor 3 is to calculate the amount of current of the X linear motor 3 per unit time by directly measuring the current input to the coil. There is a way to ask. Another method is to monitor the driving amount when the difference in driving force due to the position of the wafer table is small and the driving pattern such as acceleration during acceleration / deceleration and the maximum speed is predetermined. It is also possible to estimate the amount of heat generated from the motor 3.

For example, consider the case where the wafer table is triangularly driven as shown in FIG. When the acceleration during acceleration / deceleration is α and β, the driving distance is X, the acceleration / deceleration time during acceleration / deceleration is ta and tb, respectively, and the maximum speed is V, X
The current flowing through the linear motor 3 is proportional to the acceleration, and the thermal energy, that is, the integrated value of the square of the current corresponds to the integrated value of the square of the acceleration. become.

P = ∫ (acceleration) ² dt = α ² ta + β ² tb Further, the following equation holds. X = (α ² ta + β ² tb) / 2 V = αta = βtb Therefore, the following equation is established. P = α ² ta + β ² tb = (α ² + αβ) ta = (2β (α ² + αβ)) ^1/2 × X ^1/2

Therefore, the parameter P is the driving distance X
It is proportional to the square root of. Further, the coefficient changes depending on the acceleration / deceleration. Therefore, it is possible to monitor the square root of the driving distance and calculate the parameter P from the acceleration / deceleration at that time.

On the other hand, it is well known that the amount of heat taken from an object is proportional to the temperature difference between the objects. Therefore, the cancellation of the supplied heat amount can be achieved by changing the set temperature of the motor coolant at any time according to the heat generation amount.

In a semiconductor exposure apparatus, for a wafer coated with a photosensitive material, the wafer pattern is first monitored by an alignment microscope to align the wafer, and then each shot is sequentially sent under a projection lens to form a reticle image. After exposing and exposing the final shot, the wafer is replaced. These operations are controlled by the control device. Therefore, at that time, the square root of the drive distance for each drive of the wafer table is monitored, and the heat value of the motor is calculated. Then, the heat generation of the motor can be canceled by determining the integrated value of the heat generation amount at regular time intervals and determining the set temperature value of the motor coolant from the integrated value according to a preset table. However, in this method, since the set temperature of the coolant is changed after the heat generation of the motor is found, the cooling control is inevitably delayed, and the temperature tends to be kept constant only within a certain range. .

In this embodiment, since the drive pattern of the wafer table is determined at the time when the job layout is determined, the calorific value is not calculated after the drive is completed, as shown in FIG. Prior to driving the wafer table, the calorific value is calculated in advance based on the driving pattern of the stage. FIG. 3 is a flowchart showing the processing in the control means of the stage device of FIG. As shown in the figure, when a job is started, the control unit first calculates a driving pattern of a wafer table based on layout information of a job to be used in advance (step S1). Next, based on the driving pattern, a control pattern of the set temperature of the coolant to be set is obtained from the integrated value of the heat generation amount expected at regular intervals (step S2).
Then, almost simultaneously with actually starting the driving of the wafer table (step S3), the control of the set temperature of the coolant is started (step S5). Thereby, the temperature control can be further stabilized. Therefore, high-precision alignment by accurate temperature control can be expected.

Even if the acceleration / deceleration of the wafer table differs depending on the purpose, if the value is determined in advance, the set temperature of the coolant can be calculated in consideration of the value. If the value has not been determined,
If the predicted acceleration or drive distance is slightly different from the actual one, the wafer table control information may be constantly monitored separately from the prediction, and the predicted coolant set temperature may be sequentially corrected based on the monitoring. For example, the driving amount of the wafer table is integrated (step S4), the driving amount is compared with the driving pattern (step S6), the temperature of the coolant is reset based on the comparison result (step S7), and the integrated value is calculated. May be reset (step S7).

[Second Embodiment] FIG. 4 is a schematic block diagram showing a configuration of a precision moving table according to a second embodiment of the present invention. In the figure, 101 is a stage which is a moving body, 102 is a linear motor mover coupled to the stage 101, 103 is a linear motor stator, and 104 is a drive control for driving the linear motor to move the stage 101 precisely. Unit, 105 is a drive command unit for setting how to drive the stage 101, 106 is a refrigerant for cooling the linear motor, 107 is a temperature control unit for controlling the temperature of the refrigerant 106, and 108 is a target temperature of the refrigerant 106. This is a target temperature setting unit to be set.

FIG. 5 shows the appearance of the precision moving table. As shown in the figure, the precision moving table includes a base 508, and two parallel guides 507 disposed on the upper surface of the base 508 so as to face each other along both ends thereof.
Y stage 502 mounted so as to straddle between both guides 507 and X stage 5 mounted on Y stage 502
01. The Y stage 502 is horizontally supported by a guide 507 via an air bearing, and similarly vertically supported on a base 508 via an air bearing, and can slide linearly along the guide 507. It is. The X stage 501 is horizontally supported by a Y stage 502 via an air bearing, and vertically supported by a base 50 via an air bearing.
8 is supported. The X stage 501 slides on the Y stage 502 in a direction perpendicular to the direction in which the Y stage 502 moves. Reference numeral 503 denotes a mounting plate for a hydrostatic bearing (air bearing) for the X stage 501, and reference numeral 504 denotes a mounting plate for a hydrostatic bearing for the Y stage 502. A table for holding an object to be precisely moved is provided on the X stage 501.

A linear motor 505 as a driving means of the X stage 501 is mounted in the Y stage 502.
Two linear motors 506 as driving means for the Y stage 502 are mounted outside the two guides 507, respectively. The linear motors 505 and 506 are respectively a stator 533 and a mover 53 sliding on the stator 533.
2. A coolant passage for cooling is formed in the stator 533, and a flexible tube 522 for coolant inflow is connected to the coolant passage.

FIG. 6 shows the structure of the linear motors 505 and 506. As shown in the figure, these linear motors have permanent magnets 37 arranged to face each other, and these are attached to the upper and lower yokes 12, which are paths for magnetic flux. The upper and lower yokes 12 are connected to each other via a spacer 13 to form a box-shaped movable element 532. The coil 11 of the linear motor is fixed between the two coil support members 10. The two coil supporting members 10 are connected to a connecting member 15.
To form a stator 533. Since the coil 11 of the stator is disposed in the magnetic field formed by the box-shaped mover, a thrust can be generated by energizing the coil 11. The coil support member 10 is provided with a coolant passage 16 through which a coolant for cooling flows. Although the cooling means shown in FIG. 6 has a refrigerant passage provided in the support member for supporting the coil, the cooling means is not limited to this. May be collected.

The stator 533 corresponds to the linear motor stator 103 in FIG. 4, and the mover 532 corresponds to the linear motor mover 102 in FIG.

Next, the operation of the apparatus will be described with reference to FIG. When the drive command unit 105 creates a drive profile of the stage 101 and gives a drive command to the drive control unit 104 and the target temperature setting unit 108, the drive control unit 104
Drives the stage 101 precisely by applying a current to the linear motor in accordance with a given drive command. At this time, Joule heat is generated by the current flowing through the coil of the linear motor. However, when the precision moving table is like a wafer stage of a stepper, the temperature is stable because almost no current flows through the coil of the linear motor when the device is not operating, but the device operates. When the operation is started, a current flows through the coil of the linear motor to generate heat, so that the state in which the temperature of the linear motor rapidly rises is repeated. Therefore, if the temperature setting of the refrigerant is constant, the temperature of the table greatly changes. Therefore, in the present embodiment, the target temperature setting unit 108 changes the target temperature to the temperature control unit 107 according to the flowchart shown in FIG.

That is, the target temperature setting unit 108 clears the accumulated movement value L of the stage 101 to zero (step 400), and then moves the stage 101 based on the drive command value given by the drive command unit 105 to the drive control unit 104. The distance is calculated, and the moving distance of the stage 101 is added to L for a certain period S (step 401). After the elapse of the predetermined period S, the movement integrated value L is compared with the reference value M (step 40).
2) If L> M, set temperature T to temperature control section 107
Is reduced by T1 (step 403). Further, the moving integrated value L is compared with the reference value N (step 404). If L <N, the set temperature T is increased by T2 (step 40).
5). Next, the set temperature T is changed from the minimum value TA to the maximum value TB.
Are limited by TA and TB so as not to exceed the range (step 406). This prevents the set temperature T from being too high or too low. In this way, the target temperature setting unit 108 repeats the operation of changing the set temperature T in accordance with the moving integrated value L every fixed period S.

FIG. 8 is a diagram for explaining a change in the set temperature T of the refrigerant due to such processing and a change in the temperature of the table due to the change. FIG. 7A is a graph showing a temporal change of the moving distance integrated value L of the stage 101. FIG. 3B is a graph showing a temporal change of the set temperature T of the refrigerant. FIG. 3C is a graph showing the time change of the temperature of the table. The time axes in these three graphs match.

As shown in FIG. 5A, when the integrated value L for each fixed time S exceeds the reference value M, the set temperature T is lowered by T1 as shown in FIG. The set temperature T continues to be decreased by T1 while the integrated value L exceeds M, but does not decrease below the integrated value L when the integrated value L reaches the minimum value TA. If the integrated value L does not exceed M, then the set temperature T is changed to T2.
Go up one by one. When it reaches the maximum value TB, it does not increase any more. Thus, the set temperature is changed as shown in FIG. At this time, the change in the temperature of the refrigerant and the change in the temperature of the table are as shown by curves 81 and 82 in FIG. That is, the table temperature change 8
2 is 1/10 or less of the temperature change in the table when the set temperature T of the refrigerant is not changed.

In the present embodiment, the set temperature T is controlled based on the integrated value L of the moving distance of the stage. Instead, the current value flowing through the coil of the linear motor is integrated, and Accordingly, the set temperature T of the refrigerant may be similarly changed. By using the coil current value in this way, the temperature change of the linear motor can be predicted so as to reduce the error more directly. can do.

[Third Embodiment] In the first embodiment, the calorific value is calculated in advance based on the driving pattern of the stage. However, in this embodiment, instead of this, the heat generation amount shown in FIG. In the device configuration, the amount of heat generated by the X linear motor 3 is calculated from drive information such as a drive command to the X linear motor 3 simultaneously for each drive of the X stage. Then, an integrated value of the calorific value is obtained at regular intervals, and based on the integrated value,
The temperature setting value of the motor coolant is determined with reference to a preset table.

FIG. 9 shows how the amount of heat generated by the X linear motor 3 and the temperature of the motor coolant change in the wafer exposure operation when the temperature of the motor coolant is controlled in this manner. When the X linear motor 3 is stopped, the set temperature of the motor coolant is T0. During driving, the amount of heat generated differs depending on the driving duty at that time. Even in the same exposure operation, the step size and the exposure time are different between the condition A and the condition B, and the amount of heat generated from the X linear motor 3 is different, so that the temperature setting value of the motor coolant is also different.

In this embodiment, the temperature setting value of the motor coolant is immediately changed in accordance with the amount of heat generated. However, when there is a difference between the heat transfer path and the cooling transfer path. Is to gradually change the temperature setting value of the motor coolant by giving a gradient to the change, or conversely, set the temperature setting value larger for a certain time and reach the final target value after a certain time. Thereby, the temperature stability of the controlled object can be improved.

In this embodiment, the wafer stage of the semiconductor exposure apparatus has been described as an example. However, the present invention is applicable to a reticle stage of an exposure apparatus, a cooling apparatus capable of setting a temperature and a heat source such as a motor in a robot or the like. Can also be applied to a mechanism having

[Embodiment of Exposure Apparatus] Next, an embodiment of a scanning exposure apparatus in which the stage device shown in the above-described embodiment is mounted as a wafer stage will be described with reference to FIG.

The lens barrel base 96 is supported from the floor or base 91 via a damper 98. The lens barrel base 96 is
The projection optical system 9 located between the reticle stage 95 and the wafer stage 93 while supporting the reticle surface plate 94.
7 is supported.

The wafer stage is supported on a stage base supported by a floor or a base, and positions and positions a wafer. The reticle stage is supported on a reticle stage base supported by a lens barrel base, and is movable with a reticle on which a circuit pattern is formed. Exposure light for exposing the reticle mounted on the reticle stage 95 to the wafer on the wafer stage 93 is generated from an illumination optical system 99.

The wafer stage 93 is scanned in synchronization with the reticle stage 95. Reticle stage 9
During the scanning of the wafer 5 and the wafer stage 93, the positions of the two are continuously detected by the interferometer, and are fed back to the driving units of the reticle stage 95 and the wafer stage 93, respectively. As a result, both the scanning start positions can be accurately synchronized, and the scanning speed of the constant-speed scanning region can be controlled with high accuracy. The reticle pattern is exposed on the wafer while the two are scanning the projection optical system, and the circuit pattern is transferred.

In the present embodiment, since the stage device of the above-described embodiment is used as a wafer stage, the heat generated by the linear motor can be quickly recovered, so that high-speed and high-precision exposure can be performed. Become.

[Embodiment of Device Manufacturing Method] Next, an embodiment of a semiconductor device manufacturing method using the above-described exposure apparatus will be described. FIG. 11 shows a semiconductor device (IC or L
Semiconductor chips such as SI, liquid crystal panels and CCDs
Etc.). In step 1 (circuit design), the circuit of the semiconductor device is designed. Step 2 is a process for making a mask on the basis of the designed pattern. In step 3 (wafer manufacture), a wafer is manufactured using a material such as silicon. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer. Step 5 (assembly) is called a post-process, and is a process of forming a semiconductor chip using the wafer produced in step 4, and includes processes such as an assembly process (dicing and bonding) and a packaging process (chip encapsulation). . In step 6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in step 5 are performed. Through these steps, a semiconductor device is completed and shipped (step 7).

FIG. 12 shows a detailed flow of the wafer process. Step 11 (oxidation) oxidizes the wafer's surface. Step 12 (CVD) forms an insulating film on the wafer surface. Step 13 (electrode formation) forms electrodes on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. Step 1
In 5 (resist processing), a photosensitive agent is applied to the wafer. Step 16 (exposure) uses the above-described exposure apparatus to print and expose the circuit pattern of the mask onto the wafer. Step 17 (development) develops the exposed wafer. In step 18 (etching), portions other than the developed resist image are removed. In step 19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer. By using the manufacturing method of this embodiment, it is possible to manufacture a highly integrated semiconductor device, which has been conventionally difficult to manufacture.

[0051]

As described above, according to the present invention, in order to control the driving of the stage, the amount of heat recovery is controlled based on the driving pattern defined in advance with respect to the driving of the stage. Regardless of the fluctuation,
The stage temperature can be kept constant. In addition, even if the heat generated by the drive motor cannot be completely shut off by a coolant or the like, which is used in an exposure apparatus, the temperature change of the table on the stage is minimized as much as possible, and the shape of the mirror and reference marks on the table is reduced. , And as a result, highly accurate alignment can always be realized.

Further, since the heat recovery amount is changed based on the driving state detected at every predetermined time of the stage, the temperature of the stage can be kept constant regardless of the fluctuation of the driving load. That is, the temperature of the refrigerant can be changed so that the temperature change of the stage and the drive motor is minimized in accordance with the driving state of the stage, and the table on the stage is deformed by thermal stress or serves as a reference for the accuracy of the table. Deformation of the member can be prevented. Therefore, highly accurate table drive control is possible.

Further, for each drive of the stage, the calorific value of the drive motor is calculated on the basis of the drive information, and the calorific value is integrated for each predetermined time. Because we changed the collection amount,
The stage temperature can be kept constant irrespective of fluctuations in the driving load. In addition, even when the heat generated by the drive motor cannot be completely shut off by the cooling liquid used in the exposure apparatus, the change in the temperature of the table on the stage can be reduced. Therefore, the attitude and shape of the mirror on the table can be stabilized. As a result, the stability of the coordinates of the stage can be improved, and the superposition performance can be improved.

In any case, since it is not necessary to provide a temperature detecting means such as a thermistor inside the stage, the cost can be reduced, the stage can be reduced in weight, the stage can be downsized, and the wiring can be omitted. .

[Brief description of the drawings]

FIG. 1 is a perspective view schematically showing a main part of a wafer stage of a semiconductor exposure apparatus according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a speed and a current value during acceleration / deceleration of the stage device of FIG. 1;

FIG. 3 is a flowchart illustrating a process in a control unit of the stage device in FIG. 1;

FIG. 4 is a schematic block diagram illustrating a configuration of a precision moving table according to a second embodiment of the present invention.

FIG. 5 is a perspective view showing the appearance of the precision moving table of FIG. 4;

FIG. 6 is a perspective view showing a configuration of a linear motor in the precision moving table of FIG. 5;

FIG. 7 is a flowchart showing an operation of a target temperature setting section of the refrigerant in the precision moving table of FIG. 4;

8 is a graph showing a change in the set temperature of the refrigerant due to the processing of FIG. 7 and a change in the temperature of the table due to the change.

FIG. 9 is a graph showing a change in a heat value of an X linear motor and a temperature set value of a motor coolant in an exposure operation of a wafer according to a third embodiment of the present invention.

FIG. 10 is a diagram showing a configuration of a scanning exposure apparatus in which the stage device of the present invention is mounted as a wafer stage.

FIG. 11 is a diagram showing a flow of manufacturing a micro device.

FIG. 12 is a diagram showing a detailed flow of a wafer process in FIG. 11;

[Explanation of symbols]

1: wafer, 2: fine movement stage, 3: X linear motor,
4a, 4b: Y slider, 5: Y guide, 6a, 6b:
Y linear motor, 7a, 7b: stage base, 10: coil support member, 11: coil, 12: yoke, 13: spacer, 15: connecting member, 16: refrigerant passage, 37: permanent magnet, 101: stage, 102 : Linear motor mover, 103: linear motor stator, 104: stage drive controller, 105: drive commander, 106: refrigerant, 10
7: refrigerant temperature control unit, 108: target temperature setting unit for refrigerant,
501: X stage, 502: Y stage, 503, 5
04: mounting plate, 505: linear motor, 506: linear motor, 507: guide, 508: base, 522:
Flexible tube 532: mover, 533: stator.

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Hiroyuki Sekiguchi 3-30-2 Shimomaruko, Ota-ku, Tokyo F-term in Canon Inc. (reference) 2F078 CA02 CA08 CB13 CC11 3C048 BB12 DD06 DD26 EE02 5F046 AA22 CC01 CC04 CC16 CC18 CC20 DA07 DA26 DD06

Claims (19)

[Claims] 1. A drive motor for driving a stage, heat recovery means for recovering heat generated by the drive motor, and control means for controlling the amount of heat recovery by the heat recovery means, wherein the control means comprises: A stage apparatus, wherein the heat recovery amount is controlled based on a drive pattern defined in advance for driving the stage in order to control the drive of the stage. 2. The stage device according to claim 1, wherein the drive pattern defines a drive position of the stage, an acceleration or a speed during acceleration / deceleration. 3. An exposure apparatus for exposing each exposure area on the substrate while sequentially moving the substrate in steps, wherein the control means obtains the drive pattern based on a given exposure layout. The stage device according to claim 1, wherein: 4. The control means obtains a heat generation pattern of the drive motor based on the drive pattern, obtains an operation pattern of the heat recovery means based on the heat generation pattern, and controls drive of the stage based on the obtained heat pattern. The stage device according to any one of claims 1 to 3, wherein the stage device is operated. 5. The control unit according to claim 1, wherein the control unit is configured to control an amount of current per predetermined time to be supplied to the drive motor based on the driving pattern, an acceleration time per predetermined time of the stage, or a driving amount per predetermined time of the stage. 5. The stage apparatus according to claim 4, wherein a heat generation pattern of the drive motor is obtained based on the following. 6. A drive motor for driving a stage, heat recovery means for recovering heat generated by the drive motor, and control means for controlling an amount of heat recovery by the heat recovery means, wherein the control means comprises: A stage apparatus for controlling the heat recovery amount by changing the heat recovery amount based on a driving state detected at predetermined time intervals of the stage. 7. The stage apparatus according to claim 6, wherein the control unit changes the heat recovery amount based on a moving distance of the stage at every predetermined time. 8. The control means determines whether the moving distance of the stage for each predetermined time is equal to or more than a predetermined maximum value and whether or not the moving distance of the stage for each predetermined time is equal to or less than a predetermined minimum value at each of the predetermined times. The method according to claim 7, wherein the heat recovery amount is reduced by a predetermined value when the heat recovery amount is equal to or more than a predetermined maximum value, and the heat recovery amount is increased by a predetermined value when the heat recovery amount is equal to or less than a predetermined minimum value. Stage equipment. 9. The stage apparatus according to claim 6, wherein said control means changes said heat recovery amount based on a current supplied to said drive motor at every predetermined time. 10. The control means calculates a calorific value of the drive motor based on a current supplied to the drive motor at every predetermined time, and changes the heat recovery amount based on the calorific value. The stage device according to claim 6, wherein: 11. A drive motor for driving a stage, heat recovery means for recovering heat generated by the drive motor, and control means for controlling an amount of heat recovery by the heat recovery means, wherein the control means comprises: For each drive of the stage, the calorific value of the drive motor is calculated based on drive information that is information on the drive, and the calorific value is integrated every predetermined time, and the heat recovery is performed based on the integrated value. A stage apparatus wherein the amount of heat recovery is controlled by changing the amount. 12. The drive information according to claim 12, wherein the drive information is a current amount flowing through the drive motor per predetermined time, an acceleration time per predetermined time of the stage, or a drive amount per predetermined time of the stage. Item 12. The stage device according to item 11. 13. The heat recovery amount has an upper limit and a lower limit, and the control means controls the heat recovery amount so that the heat recovery amount does not exceed the upper limit or the lower limit. Item 13. The stage device according to any one of Items 1 to 12. 14. The apparatus according to claim 1, wherein the control unit controls the heat recovery amount such that a change in temperature of the stage and the drive motor is minimized. Stage equipment. 15. The heat recovery means for recovering heat with a refrigerant, and the control means controls the heat recovery amount by controlling the temperature of the refrigerant. 15. The stage device according to any one of items 14 to 14. 16. The drive motor according to claim 1, wherein the drive motor is a linear motor having a stator having a coil or a magnet and a mover having a coil or a magnet moving linearly along the stator. Any one of 1 to 15
A stage device according to the item. 17. The heat recovery device according to claim 1, wherein the control unit controls the heat recovery amount in consideration of a difference between a heat transfer path at the time of heat recovery by the heat recovery unit and a heat transfer path of heat generated by the drive motor. The stage device according to claim 1, wherein: 18. An exposure apparatus using the stage device according to claim 1. Description: 19. A device manufacturing method, comprising a step of preparing the exposure apparatus according to claim 18, and a step of exposing a predetermined region on a substrate using the exposure apparatus.