JP2000357871A - Method and apparatus for repairing electronic circuit component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of repairing an electronic circuit component whereby the component to be repaired is heated to uniformly melt solder in a short time by suppressing heating nonuniformity of the component and the component can be surely removed in a short time. SOLUTION: The repairing method comprises irradiating an electronic circuit component 4 connected with solder 3 on a board 2 with infrared rays from infrared irradiating means 5 to melt the solder 3, and sucking the electronic circuit component 6 at the top with a negative pressure from a sucking means 7 having a negative pressure source 6 and a suction passage 70 communicating with the pressure source 6, thereby removing the electronic circuit component 4 from the board 2. At least, a part of the suction means 7 involved in the infrared irradiation range of the irradiating means 5 on the electronic circuit component 4 is made of an infrared ray permeable material, thereby irradiating approximately the entire top face of the electronic circuit component 4 with infrared rays.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit component such as an IC or an LSI chip soldered on a substrate, and more particularly to an electronic circuit component suitable for repairing an electronic circuit component soldered on a substrate. The present invention relates to an apparatus and a method for repairing circuit components.

[0002]

2. Description of the Related Art In recent years, high-density modules mounted on general-purpose computers have been developed to meet the demand for higher performance.
There is a demand for larger SIs and higher densities for multiple mounting. In such a high-density module, high-density mounting of electronic circuit components on a substrate is mainly performed by surface mounting such as a flat package and a ball grid array (BGA). In such a high-density mounted module, when a defect or a mounting defect occurs in an electronic circuit component such as an LSI chip, a so-called repair work for removing the electronic circuit component from the module substrate and mounting the component again is necessary. Become.

As a conventional technique relating to such repair of an electronic circuit component such as an LSI chip, for example, a technique disclosed in Japanese Patent Application Laid-Open No. H11-0226929 is known as a BGA mounting. In this technique, hot air is blown between a BGA element and a substrate to melt the solder, the BGA element is suctioned at a negative pressure, pulled up, and separated from the substrate.

On the other hand, in the above-mentioned high-density module mounted on a general-purpose computer, since the mounting density of the LSI chip is high, the surface of the LSI chip is locally heated by a heating device using infrared rays or the like as a heat source. Then, the LSI chip is melted, and the LSI chip is suctioned at a negative pressure by a suction head.
After the chip is separated from the module substrate, a method of connecting again is adopted. Specifically, a metal suction head is provided between the heat source and the LSI chip so as to be movable up and down, and a suction path communicating with a negative pressure source is provided inside the suction head. A window for transmitting infrared rays from the heat source is provided substantially coaxially with the contacting suction port, and the surface of the LSI chip is irradiated with infrared rays and heated through the window. When the solder is sufficiently melted, a negative pressure is applied to the LSI chip. Aspirated and separated from module substrate.

[0005]

In the repair operation of the LSI chip in the high-density module as described above, since the LSI chip must be separated from the module substrate by directly performing negative pressure suction, the suction port of the suction head is required. Must be made smaller than the area of the package surface of the LSI chip. Therefore, the irradiation area of infrared rays is limited to the area of the suction port, and only the vicinity of the center of the package of the LSI chip is heated, and uneven heating occurs between the center and the periphery of the package, and the solder becomes uniform. In such a case, it is necessary to increase the heating time until the solder is melted evenly without disturbing the suction, or until the solder is uniformly melted. In addition, since the suction head itself is made of metal, when the LSI chip is directly suctioned by the suction head, the suction head may directly contact the LSI chip and damage the LSI chip.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an electronic circuit component capable of suppressing uneven heating of an electronic circuit component to be repaired, uniformly melting the solder, and reliably removing the electronic circuit component in a short time. To provide a repair method.

Another object of the present invention is to provide a method for repairing an electronic circuit component, which can reliably remove the electronic circuit component while preventing damage to the electronic circuit component.

Further, the present invention makes it possible to suppress uneven heating of an electronic circuit component to be repaired, uniformly melt the solder, and reliably remove the electronic circuit component in a short time.
An object of the present invention is to provide a repair device for electronic circuit components.

[0009]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides an electronic circuit component connected to a substrate with solder by irradiating infrared rays by infrared irradiating means to melt the solder, thereby providing a negative pressure source and A method for repairing an electronic circuit component, wherein the electronic circuit component is removed from the substrate by suctioning the electronic circuit component from above with a suction unit having a suction path communicating with the negative pressure source, A first step is to form at least a part included in an infrared irradiation area on the electronic circuit component by the infrared irradiation means with an infrared transmitting material, and to irradiate substantially the entire upper surface of the electronic circuit component with the infrared ray. Features.

According to the present invention, in the method for repairing an electronic circuit component having the first feature, when the electronic circuit component is suctioned at a negative pressure, a space between the suction port of the suction path and the electronic circuit component is provided. A second feature is that a buffer jig that transmits infrared light is interposed therebetween, and the buffer jig is suctioned together with the electronic circuit component by the suction unit under a negative pressure.

Further, the present invention provides an infrared irradiation means for irradiating an infrared ray to an electronic circuit component connected to a substrate by soldering, a negative pressure source, and a suction passage communicating with the negative pressure source, and the electronic circuit component is mounted on the substrate. In a repair device for an electronic circuit component having a suction unit for more negative pressure suction, at least a part of the suction unit included in an infrared irradiation area on the electronic circuit component by the infrared irradiation unit is formed of an infrared transmitting material. It is characterized by being formed.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the accompanying drawings. Note that the present invention is not limited to the present embodiment.

FIG. 1 shows an embodiment of a repair apparatus for electronic circuit components according to the present invention. In the figure, reference numeral 1 indicates a repair device.

As shown in FIG. 1, a repair apparatus 1 includes an LI connected to a module substrate (substrate) 2 by solder 3.
Infrared oscillator (infrared irradiation means) 5 for irradiating infrared rays to S chip (electronic circuit component) 4 and suction pump (negative pressure source)
6 and a suction means 7 having a suction path 70 leading to the suction pump 6.

The repair device 1 has a chamber 8 that can be closed, and the repair work of the LSI chip 4 can be performed in the chamber 8.

The infrared oscillator 5 is disposed above the chamber 8, and can irradiate the chamber 8 with a substantially vertical infrared ray through an infrared transmission window 80 provided on the upper surface of the chamber 8. I have. In the present embodiment, the infrared oscillator 5 is an LSI chip 4 to be heated.
A device that can heat the surface of the LSI chip 4 to 200 ° C. or higher with an irradiation spot having a diameter of about 30 mm from a position about 100 mm away from the top of the chip. The size of the window 80 is
It is set larger than the outer shape of the package 40 of the LSI chip 4 to be repaired.

The suction means 7 is provided with a suction arm 71 which is moved up and down by a motor-driven elevator 81 disposed at the back of the chamber 8. A suction head 10 is attached. In addition, a window 72 made of quartz is provided on the upper surface side of the distal end portion of the suction arm 71, and infrared rays emitted from the infrared oscillator 5 can be irradiated downward through the window 72. The dimensions of this window 72 are
It is set larger than the outer shape of the package 40 of the chip 4. Further, inside the suction arm 71, a pipe 73 forming a suction path 70 leading to the suction pump 6 is provided (see FIG. 4A). With the suction means 7 configured as described above, the LSI chip 4
Can be suctioned at a negative pressure.

An XY table 82 for positioning the module substrate 2 is provided in the chamber 8. The XY table 82 drives a feed screw by a motor (not shown) to move the tables 83 and 84 to guide rails 85 and 84.
It is a well-known moving table that moves in two directions in a horizontal plane along 86. The table 83 of the XY table 82
On the upper side, a pre-heater 87 for heating the module substrate 2 from below is provided, so that the pre-heater 87 can pre-heat the module substrate 2 from below if necessary.

Above the chamber 8, a CCD camera 88 and a non-contact thermometer 89 are provided. By monitoring the image of the CCD camera 88 on a display device (not shown), the operator can repair the image. It is possible to check the LSI chip 4 and the position thereof, and the heating temperature by the pre-heater 87.

Further, the repair apparatus 1 includes a chamber 8 for preventing the solder 3 from being oxidized during the repair operation.
A nitrogen cylinder 90 and a pipe 91 for introducing nitrogen gas into the chamber 8 from the nitrogen cylinder 90 are provided so that the inside can be maintained in a nitrogen atmosphere.

As shown in FIG. 2, the suction head 10 is
It is a cylindrical member provided with a conduit 10a that communicates with the conduit 72 and forms the suction passage 70, and has an outer shape larger than the outer shape of the package 40 of the LSI chip 4 at its upper end. A flange portion 10b is provided.
The flange portion 10b is provided with a plurality of screw holes 10c, and the suction head 10 is connected to the suction arm 71.
The screw can be fastened to. At the lower end of the suction head 10, a suction port 10d having a diameter smaller than the outer shape of the package 40 of the LSI chip 4 is provided.
The suction port 10d allows the LSI chip 4 to be reliably sucked. It is preferable that quartz is used as a material for forming the suction head 10, but other materials may be used as long as they are infrared-transmissive materials having desired heat resistance.

As described above, the part included in the infrared irradiation area from the infrared oscillator 5 to the LSI chip 4, that is, in this embodiment, the suction head 10 itself and the suction arm 71
By forming the window and the suction head 10 provided on the upper end side of the front end portion of quartz, which is an infrared transmitting material, regardless of the size of the suction port 10d of the suction head 10, the upper surface of the package of the LSI chip 4 can be formed. Almost all areas can be irradiated with infrared rays.

FIG. 3 shows an embodiment of the buffer jig 11 used in the method of the present invention. As shown in the figure, the buffer jig 11 is a cylindrical quartz jig provided with a conduit 11a therein, and has a rectangular flange portion 11b formed at its upper end in a plan view. I have. Buffer jig 1
A heat-resistant silicone rubber packing 11d is provided outside the first cylindrical wall 11c, and the lower end of the packing 11d is lower than the lower end of the cylindrical wall 11c. Is used. The opening size at the upper end of the cylindrical wall portion 11c is
The suction port 10d is set smaller than the diameter of the suction port 10d.
Can be surely sucked. This buffer jig 1
1 may be made of any material other than quartz as long as it is an infrared-permeable material having a desired heat resistance.

Next, a description will be given of a procedure of a method of repairing an electronic circuit component using the electronic circuit component repair apparatus 1 and the buffer jig 11 configured as described above.

First, as shown in FIG. 4A, the module substrate 2 on which the defective LSI chip 4 to be subjected to the repair work is mounted and fixed on the pre-heater 87. Then, the buffer jig 11 is placed on the corresponding LSI chip 4, and the inside of the chamber 8 is sealed.

Next, a CCD camera 88 (FIG.
Check the video), move the XY table 82,
The XY table 82 is positioned so that the LSI chip 4 is located at a predetermined position below the suction head 10.

Next, a nitrogen gas cylinder 9 is placed in the chamber 8.
A nitrogen gas is introduced from 0 through a pipe 91 to make the inside of the chamber 8 a nitrogen atmosphere.

Next, in order to reduce the generation of thermal stress in the module substrate 2 due to local heating, the module substrate 2 is preliminarily heated by a preheater 87 to a predetermined temperature from below.

Next, the suction arm 71 is operated to lower the suction head 10 so as not to contact the buffer jig 11. Then, by irradiating infrared rays from the infrared oscillator 5, LS
The surface of the I chip 4 is heated. At this time, since the suction head 10 itself and the buffer jig 11 interposed between the suction head 10 and the LSI chip 4 are made of infrared-transmitting quartz, the irradiated infrared rays are not obstructed by these. Irradiation is performed over a wide area over substantially the entire upper surface of the package 40 of the LSI chip 4. The clearance between the suction head 10 that can be removed by suction and the LSI chip 4 is, for example, a suction force of 200 liters / minute, and the clearance required to remove about 50 g of the LSI chip is 0.5.
mm or less.

Next, after the solder 3 is sufficiently melted, the suction pump 6 is operated to perform negative pressure suction of the LSI chip 4. Then, as shown in FIG. 4B, the lift 81 is operated to move the suction arm 71 upward. Thus, the removal of the LSI chip 4 from the module substrate 2 is completed. Then, the solder 3 remaining on the module substrate 2 is removed by a known method.

Next, reconnection of a new LSI chip will be described.

After the removal of the defective LSI chip 4 is completed, a new LSI chip is replaced with the removed LSI chip 4.
Place on the mounting location. This new LSI chip is mounted by releasing the nitrogen atmosphere in the chamber 8 and then separately
Mounted on a mounted machine. Then, the inside of the chamber 8 is again set to a nitrogen atmosphere, and infrared irradiation is performed by the infrared oscillator 5 from above a new LSI chip mounted at a predetermined position.
The connection is completed by melting the solder. Even when the solder is melted, the suction head 10 transmits the infrared rays without blocking the infrared rays, so that almost the entire surface of the package surface of the LSI chip can be irradiated with the infrared rays. It can be performed uniformly.

As described above, according to the electronic circuit component repair apparatus 1 and the repair method using the same according to the present embodiment, the suction head 10 and the buffer jig 11 are both made of quartz which is an infrared transmitting material. LSI that performs repair
Nearly the entire upper surface of the chip 4 can be irradiated with infrared light. Therefore, uneven heating of the LSI chip 4 due to infrared irradiation can be suppressed, and the solder can be uniformly melted in a short time, so that the removal of the LSI chip 4 by negative pressure suction can be performed reliably in a short time. Since the buffer jig 11 is interposed when the LSI chip 4 is suctioned by the suction head 10, the suction head 1 is directly attached to the LSI chip 4 as in the related art.
The zero suction port 10d does not contact. Therefore, the damage can be surely prevented.

In the above embodiment, the buffer jig 11 as shown in FIG. 3 was used. However, instead of the buffer jig 11, for example, another buffer jig as shown in FIG. 12
Can also be used. The buffering jig 12 is a quartz buffering jig having an opening 12b substantially at the center of a horizontal plane portion 12a having a rectangular shape in a plan view and having a peripheral wall portion 12c hanging down from a lower peripheral edge thereof. The area of the horizontal surface portion 12a is set wider than the outer shape of the package 40 of the LSI chip 4,
On the lower end surface of the peripheral wall portion 12, a step portion 12d corresponding to the package 40 is formed. Thereby, the peripheral wall portion 12c
Are securely brought into contact with the peripheral edge of the upper surface of the package 40 of the LSI 4 so that the negative pressure suction can be surely performed.
It is designed to cope with a case where the surface shape of 0 is not flat. The diameter of the opening 12b is set smaller than the diameter of the suction port 10d of the suction head 10, and when the suction head 10 sucks the LSI chip 4 under a negative pressure, the buffer jig and the LSI chip 4 are used. 12 can also be sucked. Even in the case of using the buffer jig 12, similarly to the case of the buffer jig 11, the LSI chip can be reliably sucked at the negative pressure without interrupting the irradiation of the heating infrared ray.

In the above-described embodiment, the suction head and the buffer jig are provided as separate members. For example, the suction head may be made of silicone rubber around the suction port 13d like the suction head 13 shown in FIG. May be provided with the packing 13e. This suction head 13 is provided with a suction port 13d.
It has the same configuration as the suction head 10 of the above-described embodiment, except that a packing 13e is provided therearound. In this case, the packing 13e is disposed so that the lower end thereof is located lower than the lower end surface of the suction port 13d. By using such a suction head, irradiation of infrared rays may not be hindered, and damage to the LSI chip during suction may be prevented.

[0036]

According to the present invention, the following effects can be obtained.

According to the method for repairing an electronic circuit component having the first feature, unevenness in heating of the electronic circuit component to be repaired can be suppressed, and the solder can be substantially uniformly melted in a short time. Accordingly, it is possible to reliably remove the electronic circuit component in a short time.

According to the method for repairing an electronic circuit component having the second feature, in addition to the above-described effects, when the electronic circuit component is suctioned by the suction means, the electronic circuit component directly contacts the suction port. Since it does not, the damage can be prevented.

Further, according to the electronic circuit component repair apparatus having the above characteristics, unevenness in heating of the electronic circuit component to be repaired can be suppressed, and the solder can be substantially uniformly melted in a short time. Accordingly, it is possible to reliably remove the electronic circuit component in a short time.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing one embodiment of a repair device according to the present invention.

FIGS. 2A and 2B are diagrams showing a suction head in the repair device, wherein FIG. 2A is a side view and FIG. 2B is a bottom view.

FIGS. 3A and 3B are views showing one embodiment of a buffer jig used for a method of repairing an electronic circuit component according to the present invention, wherein FIG. 3A is a partial sectional side view and FIG. 3B is a bottom view.

FIG. 4 is a view showing steps of a method of repairing an electronic circuit component using the repair device, and FIG. 4 (a) is a schematic diagram showing a state in which a buffer jig is placed on the electronic circuit component and infrared rays are irradiated. FIG. 1B is a schematic view showing a state in which the electronic circuit component is sucked under a negative pressure together with a buffer jig.

5A and 5B are diagrams showing another embodiment of the buffer jig used in the repair method, wherein FIG. 5A is a partial side sectional view and FIG. 5B is a bottom view.

6A and 6B are diagrams showing another embodiment of the suction head, and FIG. 6A is a partial side sectional view, and FIG. 6B is a bottom view.

[Explanation of symbols]

1: repair device, 2: module substrate (substrate), 3: solder, 4: LSI chip (electronic circuit component), 5: infrared oscillator (infrared irradiation means), 6: suction pump (negative pressure source), 7: suction Means, 70: suction path, 71: suction port, 1
1,12: buffer jig.

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Eiichi Kiryu 1st Horiyamashita, Hadano-shi, Kanagawa Prefecture, in the Enterprise Server Division of Hitachi Ltd. (72) Takeshi Kuroda 1st Horiyamashita, Hadano-shi, Kanagawa, Hitachi F term in information technology (reference) 5E319 CC45 CD57 GG15

Claims (3)

[Claims] An electronic circuit component connected to a circuit board by solder is irradiated with infrared rays by an infrared ray irradiating means to melt the solder, and is suctioned by a suction means provided with a negative pressure source and a suction path leading to the negative pressure source. A method of repairing an electronic circuit component, wherein the electronic circuit component is removed from the substrate by suctioning the electronic circuit component from above the negative pressure, wherein at least the infrared irradiation means irradiates the electronic circuit component with the infrared light in the suction means. A method for repairing an electronic circuit component, wherein a portion included in the region is formed of an infrared transmitting material, and substantially the entire upper surface of the electronic circuit component is irradiated with infrared rays. 2. The method for repairing an electronic circuit component according to claim 1, wherein when the electronic circuit component is suctioned under a negative pressure, an infrared-transmissive buffer is provided between the suction port of the suction path and the electronic circuit component. A method of repairing an electronic circuit component, wherein a jig is interposed, and the buffer jig is suctioned together with the electronic circuit component by the suction means under a negative pressure. 3. An infrared irradiating means for irradiating infrared rays to an electronic circuit component connected to the substrate by soldering, a negative pressure source, and a suction passage communicating with the negative pressure source, the electronic circuit component being suctioned from above by a negative pressure. And an electronic circuit component repair device comprising: a suction unit that performs at least a part of the suction unit included in an infrared irradiation region from the infrared irradiation unit to the electronic circuit component, by using an infrared transmitting material. A repair device for electronic circuit components.