JP2000261193A - Method of fixing fpc board to carrier board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of fixing a flexible printed circuit(FPC) board to a carrier board whereby the FPC board can be exactly aligned and easily removed from the carrier board in a few processes, without an exclusive carrier board of every type, and adhesive tapes are reusable. SOLUTION: The method comprises steps of pasting to a carrier board 2 a plurality of rows of higher-adhesive surfaces of double-sided tapes 3 each having coatings of adhesives different in adhesion on both surfaces of a base, mounting the carrier board 2 with the adhered tapes 3 on a positioning guide plate 5, mounting a board positioning jig 6 on the guide board 5, and inserting the FPC board 1 into a positioning hole 7 of the positioning jig 6 to rigidly fix it to the lower-adhesive surface of each tape 3. The adhesive of the lower- adhesive surface of the tape 3 is of a silicone material and that of the higher- adhesive surface is of an acrylic material.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for fixing a flexible printed circuit board (hereinafter, referred to as an FPC board) to a transfer board for fixing the FPC board to the transfer board.

[0002]

2. Description of the Related Art Conventionally, as a method of fixing an FPC board to a transport board, a positioning line is drawn on the transport board in advance, an FPC board is placed in accordance with the line, and an adhesive tape is stuck on the surface of the transport board. There are known a first method of positioning and fixing the FPC board, and a second method of making a positioning hole in the FPC board, fitting the FPC board into a positioning pin provided on the transport plate, and positioning and fixing the FPC board. In the first conventional method, the FPC board is positioned and temporarily placed on the carrier plate,
It took a long time to perform the alignment to attach the adhesive tape to the surface of the transport plate. In addition, since the FPC board is thin, the FPC board is easily deformed and floats due to bending, so that accurate positioning cannot be performed. In addition, when the adhesive tape is peeled off after the application, the peeled adhesive tape is curled, cannot be reused, and is disposable. Further, there is a problem that a large amount of time is required to remove the FPC board from the transport plate due to the high adhesive strength of the adhesive tape. In the second conventional method, it is necessary to make a one-to-one correspondence between the positioning holes formed on the FPC board and the positioning pins provided on the carrier plate. For this purpose, a dedicated carrier plate is prepared for each type of the FPC board. It is necessary to keep. In addition, when the FPC board has a flexure or the like, floating occurs, and accurate positioning cannot be performed. In addition, when solder cream printing is performed on the FPC board, the positioning pins on the carrier plate are in the way,
There was a problem that contact printing could not be performed.

[0003]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and has a small number of steps.
Positioning of the PC board can be performed with high precision, no special transport board is required for each type, the FPC board can be easily removed from the transport board, and the FPC board can be fixed to the transport board where the adhesive tape can be reused. It is intended to provide a method.

[0004]

According to the present invention, there is provided a method for fixing an FPC board to a carrier plate according to the present invention, comprising the steps of: fixing an FPC board to the carrier plate; Attaching a plurality of rows of the highly adhesive side of the double-sided tape to which the double-sided tape is attached to the carrier plate, attaching the carrier plate to which the double-sided tape is attached to a positioning guide plate, and attaching a substrate positioning jig to the positioning guide plate. And a step of inserting an FPC board into the positioning hole of the board positioning jig and fixing the FPC board to the low-adhesive side of the double-sided tape, and the adhesive on the low-adhesive side of the double-sided tape is made of silicone. The adhesive on the high adhesive side is made of acrylic.

[0005]

By applying a plurality of rows of double-sided tapes coated with an adhesive having different tackiness to the carrier plate, the highly adhesive side is securely fixed to the carrier plate with a high adhesive force. The FPC board can be positioned with good positioning accuracy using a board positioning jig, and is fixed to the low-adhesion side with good peeling and re-adhesion properties, so that the FPC board can be easily peeled without being deformed or damaged. It is possible to reuse double-sided tape. As a result, there is no need to prepare a dedicated transport board for each type of FPC board, no need to provide a positioning hole in the FPC board, the FPC board can be fixed to the transport board, and the double-sided tape can be used repeatedly. As a result, it is possible to save consumables and reduce man-hours, so that manufacturing costs can be significantly reduced.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method for fixing an FPC board to a carrier plate according to the present invention will be described with reference to the drawings. FIG. 1 is an explanatory view showing the steps of a method of fixing an FPC board to a carrier plate according to the present invention, and FIG. 2 is a configuration diagram of a double-sided tape in an embodiment of the present invention. In FIG. 1, 1 is an FPC board, 2 is a transport plate, 3 is a double-sided tape that is coated on both sides with an adhesive material having different adhesiveness and is fixed to the transport plate 2, and 5 is a positioning guide plate on which the transport plate 2 is mounted. Reference numeral 6 denotes a substrate positioning jig mounted on the positioning guide plate 5 together with the transport plate 2, and reference numeral 7 denotes a substrate positioning hole in which a predetermined number of insertion holes are arrayed and formed to position the FPC substrate 1 and fix it to the transport plate. In FIG. 2, 3 is a double-sided tape, 8 is a base material constituting the double-sided tape 3, 3 a is a high-adhesive side on which the surface of the base material 8 is coated with a high-pressure adhesive, and 3 b is a base material of the base material 8. The low-adhesive side 4 whose surface is coated with a releasable and re-adhesive adhesive is a release paper laminated and attached to the surfaces of the high-adhesive side 3a and the low-adhesive side 3b.

[0007] In the first step, a high-adhesion side 3a of the double-sided tape 3 constructed as shown in FIG. The release paper is peeled off, and a plurality of rows are stuck on the surface of the transport plate 2 in advance, and the double-sided tapes are fixed respectively. In the second step, the transport plate 2 to which the double-sided tape 3 is fixed is mounted in a groove provided in the positioning guide plate 5. In the third step, a substrate positioning jig 6 provided with a substrate positioning hole 7 is mounted on the positioning guide plate 5 so as to overlap the carrier plate 2 mounted on the positioning guide plate 5. In the fourth step, the release paper on the low-adhesive side of the double-sided tape 3 is peeled off, and the FPC board 1 is inserted into the board positioning holes 7 arranged and formed on the board positioning jig 6 so that the transfer board 2
To the double-sided tape 3. In the present embodiment, as the adhesive having different adhesiveness applied to both surfaces of the base material 12 constituting the double-sided tape 3, a silicone-based adhesive having releasability and re-adhesiveness on the low adhesive side is used. On the high adhesive side, an acrylic adhesive having high adhesive strength is used.

[0008] In this manner, the high-adhesive side of the double-sided tape coated with an adhesive having different tackiness is stuck to the carrier plate in a plurality of rows, so that the double-sided tape is securely adhered to the carrier plate with high adhesive strength. Is done. Since the FPC boards are respectively positioned in the board positioning holes 7 and fixed to the low-adhesive side of the double-sided tape fixed to the carrier plate, the FPC board can be secured to the carrier plate with high positional accuracy. When peeling the FPC board fixed to the easy-to-peel and re-adhesive adhesive from the carrier plate, the FPC board can be easily peeled without deforming or damaging the FPC board, and the double-sided tape can be used repeatedly. Therefore, it is not necessary to prepare a dedicated transport plate for each type of FPC board, and a single type of transport plate can be used for both types, and man-hours for positioning and consumables such as double-sided tape can be reduced, thereby reducing manufacturing costs. Can be greatly reduced. The pressure-sensitive adhesive applied to the double-sided tape is not limited to the pressure-sensitive adhesive of the present embodiment, and the same effects can be obtained as long as they have the same performance, and various combinations are possible.

[0009]

According to the method of fixing an FPC board to a carrier plate according to the present invention, a double-sided tape coated with an adhesive having different tackiness is attached to the carrier plate in a plurality of rows, so that the high tackiness side is high. It is firmly fixed to the transport plate by the adhesive force. FP
The C-substrate can be positioned with good positioning accuracy in the height and height directions of the substrate using a substrate positioning jig, so that operations such as printing in the next process can be performed easily with high precision, and low peeling and re-adhesiveness can be achieved. Since the FPC board is fixed to the adhesive side, the FPC board can be easily peeled off without being deformed or damaged, and the double-sided tape can be reused. This makes it possible to use one type of FPC board without having to prepare a dedicated transport plate for each type. Also, FP
There is no need to provide positioning holes in the C board, and the FPC board can be fixed to the carrier plate and the double-sided tape can be used repeatedly. This saves consumables and reduces man-hours. Can be reduced.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing steps of a method for fixing an FPC board to a carrier plate according to the present invention.

FIG. 2 is a configuration diagram of a double-sided tape according to the embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... FPC board 2 ... Carrier plate 3 ... Double-sided tape 3a ... High adhesive side 3b ... Low adhesive side 4 ... Release paper 5 ... Positioning guide plate 6 ...・ Substrate positioning jig 7 ・ ・ ・ Substrate positioning hole 8 ・ ・ ・ Substrate

Claims (2)

[Claims] The present invention relates to a method of fixing an FPC board (1) to a carrier plate (2), wherein an adhesive having different tackiness is applied to both sides of a substrate (12) and a release paper (4) is applied. Attaching a plurality of rows of the highly adhesive side of the attached double-sided tape (3) to the transport plate, attaching the transport plate to which the double-sided tape is attached to a positioning guide plate (5), and positioning the guide plate Mounting a substrate positioning jig (6) on the substrate and inserting a FPC board (1) into a positioning hole (7) of the substrate positioning jig and fixing the FPC substrate (1) to a low-adhesive side of the double-sided tape. F to the transfer plate, characterized in that
PC board fixing method. 2. The FP to a carrier plate according to claim 1, wherein the pressure-sensitive adhesive on the low-adhesive side of the double-sided tape is made of silicone, and the adhesive on the high-adhesive side is made of acrylic.
C substrate fixing method.