JP2000105807A5 - - Google Patents

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Publication number
JP2000105807A5
JP2000105807A5 JP1998275413A JP27541398A JP2000105807A5 JP 2000105807 A5 JP2000105807 A5 JP 2000105807A5 JP 1998275413 A JP1998275413 A JP 1998275413A JP 27541398 A JP27541398 A JP 27541398A JP 2000105807 A5 JP2000105807 A5 JP 2000105807A5
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JP
Japan
Prior art keywords
conductive paste
data carrier
paste layer
contact data
label
Prior art date
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Pending
Application number
JP1998275413A
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Japanese (ja)
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JP2000105807A (en
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Publication date
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Priority to JP27541398A priority Critical patent/JP2000105807A/en
Priority claimed from JP27541398A external-priority patent/JP2000105807A/en
Publication of JP2000105807A publication Critical patent/JP2000105807A/en
Publication of JP2000105807A5 publication Critical patent/JP2000105807A5/ja
Pending legal-status Critical Current

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Description

【特許請求の範囲】
【請求項１】 情報を記憶する記憶素子を含む回路部品と、
基材上に形成された導電性ペースト層からなり、外部機器との間で非接触で信号を送受信するためのアンテナとを備えた内部部品と、
前記基材とにより前記内部部品を挟持する粘着剤層を備えた非接触データキャリア本体と
を具備し、
前記導電性ペースト層は、非接触データキャリア本体と該非接触データキャリア本体が貼付された被着体との間に働く粘着力に抵抗する最小の外力によって、前記導電性ペースト層の少なくとも一部が破壊され得る破壊強度を有することを特徴とするラベル状の非接触データキャリア。
【請求項２】 前記基材と前記導電性ペースト層間の一部に、前記導電性ペースト層の破壊を容易にするための易破壊処理が施されたことを特徴とする請求項１記載のラベル状の非接触データキャリア。
【請求項３】 情報を記憶する記憶素子を含む回路部品と、
基材上に形成された導電性ペースト層からなり、外部機器との間で非接触で信号を送受信するためのアンテナとを備えた内部部品と、
前記基材とにより前記内部部品を挟持する粘着剤層を備えた非接触データキャリア本体と、
前記基材と前記導電性ペースト層間の一部に、前記導電性ペースト層の破壊を容易にするための易破壊処理が施された易破壊処理部と
を具備することを特徴とするラベル状の非接触データキャリア。
【請求項４】 前記導電性ペースト層は、厚さが１〜１００μｍであることを特徴とする請求項１乃至３のいずれか１項記載のラベル状の非接触データキャリア。
【請求項５】 前記粘着剤層の外面に貼付された剥離ライナをさらに具備することを特徴とする請求項１乃至４のいずれか１項記載のラベル状の非接触データキャリア。 [Claims]
1. A circuit component including a storage element for storing information,
An internal component composed of a conductive paste layer formed on a base material and having an antenna for transmitting and receiving signals to and from an external device in a non-contact manner.
With a non-contact data carrier body provided with an adhesive layer that sandwiches the internal parts with the base material
Equipped with
The conductive paste layer has at least a part of the conductive paste layer due to the minimum external force that resists the adhesive force acting between the non-contact data carrier body and the adherend to which the non-contact data carrier body is attached. Has a breaking strength that can be brokenA label-like non-contact data carrier characterized by that.
2. A part between the base material and the conductive paste layer was subjected to an easy-to-break treatment for facilitating the destruction of the conductive paste layer.The label-like non-contact data carrier according to claim 1.
3. Circuit components including storage elements that store information,
An internal component composed of a conductive paste layer formed on a base material and having an antenna for transmitting and receiving signals to and from an external device in a non-contact manner.
A non-contact data carrier body provided with an adhesive layer that sandwiches the internal parts with the base material, and
An easily destructive treatment unit in which a part between the base material and the conductive paste layer is subjected to an easy destruction treatment for facilitating the destruction of the conductive paste layer.
A label-like non-contact data carrier comprising.
4. The label-like product according to any one of claims 1 to 3, wherein the conductive paste layer has a thickness of 1 to 100 μm.Non-contact data carrier.
5. The label-shaped non-contact data carrier according to any one of claims 1 to 4, further comprising a peeling liner attached to the outer surface of the pressure-sensitive adhesive layer.

すわなち、本発明のラベル状の非接触データキャリアは、情報を記憶する記憶素子を含む回路部品と、基材上に形成された導電性ペースト層からなり、外部機器との間で非接触で信号を送受信するためのアンテナとを備えた内部部品と、前記基材とにより前記内部部品を挟持する粘着剤層を備えた非接触データキャリア本体とを具備し、前記導電性ペースト層は、非接触データキャリア本体と該非接触データキャリア本体が貼付された被着体との間に働く粘着力に抵抗する最小の外力によって、前記導電性ペースト層の少なくとも一部が破壊され得る破壊強度を有することを特徴としている。このような構成とすることにより、ラベル状の非接触データキャリアを剥がした場合に、導電性ペースト層が確実に破壊され、通信が全く行えなくなる。 That is, the label-shaped non-contact data carrier of the present invention comprises a circuit component including a storage element for storing information and a conductive paste layer formed on a base material, and is non-contact with an external device. The conductive paste layer comprises an internal component provided with an antenna for transmitting and receiving signals, and a non-contact data carrier main body provided with an adhesive layer sandwiching the internal component with the base material. It has a breaking strength that allows at least a part of the conductive paste layer to be broken by the minimum external force that resists the adhesive force acting between the non-contact data carrier body and the adherend to which the non-contact data carrier body is attached. It is characterized by that. With such a configuration, when the label-shaped non-contact data carrier is peeled off, the conductive paste layer is surely destroyed and communication cannot be performed at all.

また、本発明のラベル状の非接触データキャリアは、前記基材と前記導電性ペースト層間の一部に、前記導電性ペースト層の破壊を容易にするための易破壊処理が施されたことを特徴としている。Further, in the label-shaped non-contact data carrier of the present invention, a part between the base material and the conductive paste layer is subjected to an easy destruction treatment for facilitating the destruction of the conductive paste layer. It is a feature.

また、本発明のラベル状の非接触データキャリアは、情報を記憶する記憶素子を含む回路部品と、基材上に形成された導電性ペースト層からなり、外部機器との間で非接触で信号を送受信するためのアンテナとを備えた内部部品と、前記基材とにより前記内部部品を挟持する粘着剤層を備えた非接触データキャリア本体と、前記基材と前記導電性ペースト層間の一部に、前記導電性ペースト層の破壊を容易にするための易破壊処理が施された易破壊処理部とを具備することを特徴としている。Further, the label-shaped non-contact data carrier of the present invention comprises a circuit component including a storage element for storing information and a conductive paste layer formed on a base material, and signals non-contact with an external device. A non-contact data carrier body having an internal component provided with an antenna for transmitting and receiving signals, a non-contact data carrier body provided with an adhesive layer sandwiching the internal component between the base materials, and a part between the base material and the conductive paste layer. In addition, the conductive paste layer is provided with an easy-to-break treatment unit that has been subjected to an easy-to-break treatment to facilitate the breakage of the conductive paste layer.

また、本発明のラベル状の非接触データキャリアは、前記導電性ペースト層は、厚さが１〜１００μｍであることを特徴としている。アンテナとしてこのような厚さの導電性ペースト層を用いることにより、一旦貼付されたラベル状の非接触データキャリアを剥がそうとしたときには、導電性ペースト層つまりアンテナが損傷を受け、再度貼付したとしても通信不良を引き起こして使用できなくなるようにしたものである。 Further, the label-shaped non-contact data carrier of the present invention is characterized in that the conductive paste layer has a thickness of 1 to 100 μm . By using a conductive paste layer of such a thickness as an antenna, when the label-shaped non-contact data carrier once attached is attempted to be peeled off, the conductive paste layer, that is, the antenna is damaged and the antenna is reattached. Also causes communication failure and makes it unusable.

また、本発明のラベル状の非接触データキャリアは、前記粘着剤層の外面に貼付された剥離ライナをさらに具備することを特徴としている。 Further, the label-shaped non-contact data carrier of the present invention is further provided with a peeling liner attached to the outer surface of the pressure-sensitive adhesive layer.

JP27541398A 1998-09-29 1998-09-29 Label type noncontact data carrier Pending JP2000105807A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27541398A JP2000105807A (en) 1998-09-29 1998-09-29 Label type noncontact data carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27541398A JP2000105807A (en) 1998-09-29 1998-09-29 Label type noncontact data carrier

Publications (2)

Publication Number Publication Date
JP2000105807A JP2000105807A (en) 2000-04-11
JP2000105807A5 true JP2000105807A5 (en) 2005-11-17

Family

ID=17555165

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27541398A Pending JP2000105807A (en) 1998-09-29 1998-09-29 Label type noncontact data carrier

Country Status (1)

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JP (1) JP2000105807A (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4013653B2 (en) * 2002-05-27 2007-11-28 凸版印刷株式会社 Fraud prevention contactless tag
CN100367308C (en) * 2002-11-21 2008-02-06 琳得科株式会社 IC tag
DE60332551D1 (en) 2002-11-21 2010-06-24 Lintec Corp IC-TAG
US7102522B2 (en) 2002-12-24 2006-09-05 3M Innovative Properties Company Tamper-indicating radio frequency identification antenna and sticker, a radio frequency identification antenna, and methods of using the same
US6816125B2 (en) 2003-03-01 2004-11-09 3M Innovative Properties Company Forming electromagnetic communication circuit components using densified metal powder
JP4549765B2 (en) * 2004-07-22 2010-09-22 大日本印刷株式会社 Non-contact data carrier with break detection function
JP2006209616A (en) * 2005-01-31 2006-08-10 Toppan Forms Co Ltd Contactless ic label
US8232555B2 (en) 2005-01-31 2012-07-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, and method for manufacturing thereof
JP4817853B2 (en) * 2005-01-31 2011-11-16 株式会社半導体エネルギー研究所 Method for producing semiconductor device
JP2006209617A (en) * 2005-01-31 2006-08-10 Toppan Forms Co Ltd Contactless ic label
JP2007004046A (en) * 2005-06-27 2007-01-11 Toppan Forms Co Ltd Non-contact type ic label
JP2007122466A (en) * 2005-10-28 2007-05-17 Fujitsu Ltd Rfid tag
JP2009075711A (en) * 2007-09-19 2009-04-09 Toppan Printing Co Ltd Ic label for forgery prevention
JP2009075712A (en) * 2007-09-19 2009-04-09 Toppan Printing Co Ltd Ic label for forgery prevention
JP2013250855A (en) * 2012-06-01 2013-12-12 Toppan Printing Co Ltd Non-contact ic medium, and packaging material with non-contact ic medium
WO2014195558A1 (en) * 2013-06-03 2014-12-11 Walki Group A sealing tag with conductive features for preventing the counterfeiting of a product and a method for manufacturing such

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