JP2000031320A - Printed wiring unit and electronic equipment incorporating the same - Google Patents
Printed wiring unit and electronic equipment incorporating the sameInfo
- Publication number
- JP2000031320A JP2000031320A JP19295798A JP19295798A JP2000031320A JP 2000031320 A JP2000031320 A JP 2000031320A JP 19295798 A JP19295798 A JP 19295798A JP 19295798 A JP19295798 A JP 19295798A JP 2000031320 A JP2000031320 A JP 2000031320A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- package
- wiring board
- electronic component
- spacer member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、例えばパーソナ
ルコンピュータ（ＰＣ）等の電子機器に搭載するのに好
適する印刷配線ユニットに関する。[0001] 1. Field of the Invention [0002] The present invention relates to a printed wiring unit suitable for mounting on electronic equipment such as a personal computer (PC).
【０００２】[0002]
【従来の技術】一般に、この種の印刷配線ユニットは、
図６に示すように例えばＢＧＡ（ボールグリッドアレ
イ）やＣＳＰ（チップサイズパッケージ）等のエリアア
レイの電子部品１が印刷配線板２に実装されてメモリー
モジュール等が構成される。そして、このような印刷配
線ユニットは、図示しない電子機器の機器筐体に収容さ
れる。2. Description of the Related Art Generally, this type of printed wiring unit is
As shown in FIG. 6, for example, an electronic component 1 of an area array such as a BGA (ball grid array) or a CSP (chip size package) is mounted on a printed wiring board 2 to constitute a memory module or the like. Then, such a printed wiring unit is accommodated in a device housing of an electronic device (not shown).
【０００３】このような電子部品１は、例えば図７に示
すように半田ボールと称する複数の接続端子１ａが、シ
リコン等で形成されるダイと称するパッケージ１ｂの一
方面の略中央部にアレイ状に配列されて突設され、この
複数の接続端子１ａが印刷配線板２に設けられた接続パ
ッド２ａに半田接続されて実装される。In such an electronic component 1, for example, as shown in FIG. 7, a plurality of connection terminals 1a called solder balls are arranged in an array at a substantially central portion of one surface of a package 1b called die formed of silicon or the like. The plurality of connection terminals 1a are soldered to the connection pads 2a provided on the printed wiring board 2 and mounted.
【０００４】ところが、上記印刷配線ユニットでは、そ
の電子部品１を印刷配線板２に実装した状態で、例えば
上記電子機器の機器本体に組付けたりする際に、電子部
品１のパッケージ１ａの周囲に衝撃力等の外力が加わる
と、電子部品１のパッケージ１ｂの周囲部にひびが入り
破損する虞れを有するために（図６参照）、その取扱い
が非常に面倒であるという問題を有する。However, in the printed wiring unit, when the electronic component 1 is mounted on the printed wiring board 2 and is assembled to, for example, the main body of the electronic device, the electronic component 1 is placed around the package 1a of the electronic component 1. When an external force such as an impact force is applied, the periphery of the package 1b of the electronic component 1 may be cracked and damaged (see FIG. 6), so that there is a problem that the handling is very troublesome.
【０００５】係る事情は、特にＰＣの拡張メモリー等の
印刷配線ユニットの場合には、その機器本体への組付け
を電子機器の製品完成後の、いわゆる後付け作業ととな
るために、その機器本体への組付け作業を含む取扱い作
業が非常に煩雑なものとなっている。[0005] In such a situation, especially in the case of a printed wiring unit such as an extended memory of a PC, the assembling to the equipment main body is a so-called post-installation work after completion of the product of the electronic equipment. The handling work including the work of assembling the parts has become very complicated.
【０００６】[0006]
【発明が解決しようとする課題】以上述べたように、従
来の印刷配線ユニットでは、電子部品のパッケージが破
損し易く、その取扱いが非常に面倒であるという問題を
有する。この発明は、上記の事情に鑑みてなされたもの
で、構成簡易にして、パッケージ破損防止を図り得るよ
うにして、その取扱い性の向上を図った印刷配線ユニッ
トを提供することを目的とする。また、この発明は、そ
のユニット組付け作業性の向上を図り得るようにした印
刷配線ユニットを内蔵した電子機器を提供することを目
的とする。As described above, the conventional printed wiring unit has a problem that the package of the electronic component is easily damaged and the handling thereof is very troublesome. SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to provide a printed wiring unit which has a simplified configuration and can prevent package breakage, thereby improving the handleability thereof. Another object of the present invention is to provide an electronic device having a built-in printed wiring unit capable of improving the unit assembling workability.
【０００７】[0007]
【課題を解決するための手段】この発明は、パッケージ
の一方面の中間部に複数の接続端子が配置された電子部
品と、この電子部品が実装されるものであって、該電子
部品の複数の接続端子が電気的に接続される複数の接続
パッドが設けられる印刷配線板と、前記電子部品のパッ
ケージの一方面と前記印刷配線板との間に介在されるス
ペーサ部材とを備えて印刷配線ユニットを構成した。According to the present invention, there is provided an electronic component having a plurality of connection terminals arranged at an intermediate portion on one surface of a package, and the electronic component mounted thereon. A printed wiring board provided with a plurality of connection pads to which the connection terminals are electrically connected, and a spacer member interposed between one surface of the package of the electronic component and the printed wiring board. Unit configured.
【０００８】上記構成によれば、パッケージは、その周
囲部に外力が加わると、印刷配線板との間に介在される
スペーサ部材が印刷配線板方向への撓みを抑制して、そ
の外力による破損が防止される。従って、その電子機器
への組付け作業を含む取扱い時の安全保護が図れて、そ
の取扱い性の向上が図れる。According to the above structure, when an external force is applied to the periphery of the package, the spacer member interposed between the package and the printed wiring board suppresses bending in the direction of the printed wiring board, and the package is damaged by the external force. Is prevented. Therefore, safety during handling including the assembling work to the electronic device can be secured, and the handling can be improved.
【０００９】また、この発明は、パッケージの一方面の
中間部に複数の接続端子が配置された電子部品を、前記
複数の接続端子を印刷配線板の複数の接続パッドに電気
的に接続して前記印刷配線板に実装し、前記電子部品の
パッケージの一方面と前記印刷配線板との間にスペーサ
部材を介在した印刷配線ユニットと、この印刷配線ユニ
ットが収容される機器本体とを備えて電子機器を構成し
た。According to the present invention, an electronic component having a plurality of connection terminals disposed at an intermediate portion on one surface of a package is electrically connected to the plurality of connection pads of a printed wiring board. An electronic device comprising a printed wiring unit mounted on the printed wiring board and having a spacer member interposed between one surface of a package of the electronic component and the printed wiring board, and a device main body in which the printed wiring unit is housed. The equipment was configured.
【００１０】上記構成によれば、印刷配線ユニットは、
その電子部品のパッケージの周囲部に外力が加わると、
印刷配線板との間に介在されるスペーサ部材が印刷配線
板方向への撓みを抑制して、その外力によるパッケージ
の破損を防止する。従って、その電子機器への組付け作
業を含む取扱い時におけるパッケージの安全保護が図
れ、その組付け作業性の向上が図れる。According to the above configuration, the printed wiring unit is
When an external force is applied around the package of the electronic component,
The spacer member interposed between the printed wiring board and the printed wiring board suppresses bending in the direction of the printed wiring board, thereby preventing damage to the package due to external force. Accordingly, the package can be protected safely during handling including the assembling work to the electronic device, and the assembling workability can be improved.
【００１１】また、前記スペーサ部材は、前記電子部品
のパッケージあるいは前記印刷配線板の一方に接着固定
されて前記パッケージと前記印刷配線板との間に介在さ
れる。これにより、電子部品を印刷配線板に実装するだ
けの作業で、スペーサ部材の簡便な組付けが可能とな
り、簡便なユニット組付け作業が確保される。Further, the spacer member is adhered and fixed to one of the package of the electronic component or the printed wiring board, and is interposed between the package and the printed wiring board. Thus, the spacer member can be easily assembled simply by mounting the electronic component on the printed wiring board, and a simple unit assembling operation is ensured.
【００１２】さらに、前記スペーサ部材は、前記電子部
品を前記印刷配線板に実装した状態で、前記パッケージ
の一方面と前記印刷配線板との間に挿着される。これに
より、電子部品の実装作業に悪影響を及ぼすことなく、
簡便な組付け作業が確保される。Further, the spacer member is inserted between one surface of the package and the printed wiring board in a state where the electronic component is mounted on the printed wiring board. As a result, without adversely affecting the mounting work of electronic components,
Simple assembling work is secured.
【００１３】[0013]
【発明の実施の形態】以下、この発明の実施の形態につ
いて、図面を参照して詳細に説明する。図１はこの発明
の一実施の形態に係る印刷配線ユニットを内蔵した電子
機器を示すもので、機器本体１０には、この発明の特徴
とする印刷配線板２０にＢＧＡ（ボールグリッドアレ
イ）やＣＳＰ（チップサイズパッケージ）等のエリアア
レイの電子部品２１を実装した印刷配線ユニット３０が
内蔵される。Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 shows an electronic device incorporating a printed wiring unit according to an embodiment of the present invention. A device body 10 includes a printed wiring board 20 which is a feature of the present invention, a BGA (ball grid array) or a CSP. A printed wiring unit 30 on which an electronic component 21 of an area array such as a (chip size package) is mounted.
【００１４】上記印刷配線ユニット３０は、図２に示す
ように図示しない回路パターンの形成された印刷配線板
２０上に電子部品２１が実装されて所望の電子回路を形
成する。In the printed wiring unit 30, as shown in FIG. 2, an electronic component 21 is mounted on a printed wiring board 20 on which a circuit pattern (not shown) is formed to form a desired electronic circuit.
【００１５】すなわち、印刷配線板２０には、その一方
面に、例えばエリアアレイ状に配列された複数の接続パ
ッド２０１が形成される。この複数の接続パッド２０１
は、上述したように印刷配線板２０に形成される図示し
ない回路パターンの一部を形成し、上記電子部品２１の
半田ボールと称する接続端子２１１が半田接続される。That is, a plurality of connection pads 201 arranged in, for example, an area array are formed on one surface of the printed wiring board 20. The plurality of connection pads 201
Forms a part of a circuit pattern (not shown) formed on the printed wiring board 20 as described above, and a connection terminal 211 called a solder ball of the electronic component 21 is connected by soldering.
【００１６】また、上記電子部品２１は、例えば図３に
示すようにパッケージ２１２が、シリコン等で例えば略
矩形状に形成され、このパッケージ２１２の一方面に
は、その中間部に上記複数の接続端子２１１が上記印刷
配線板２０の複数の接続パッド２０１に対応してアレイ
状に配列されて形成される。そして、このパッケージ２
１２には、例えばその接続端子２１１を挟んだ長手方向
の両端部にスペーサ部材２２が接着されて配設される。In the electronic component 21, as shown in FIG. 3, for example, a package 212 is formed in, for example, a substantially rectangular shape from silicon or the like. The terminals 211 are formed in an array corresponding to the plurality of connection pads 201 of the printed wiring board 20. And this package 2
For example, the spacer member 22 is attached to the both ends in the longitudinal direction with the connection terminal 211 interposed therebetween.
【００１７】スペーサ部材２２は、例えば絶縁性を有す
る樹脂フィルムで形成され、電子部品２１の接続端子２
１１が上記印刷配線板２０の複数の接続パッド２０１に
半田接続されて実装された状態で、パッケージ２１２の
複数の接続端子２１１の周囲部と印刷配線板２０との間
に介在される。そして、スペーサ部材２２は、パッケー
ジ２０２の周囲部に外力が加わると、その弾性力でパッ
ケージ２０２の印刷配線板方向への撓みを抑制する。The spacer member 22 is formed of, for example, a resin film having an insulating property.
11 is mounted between the periphery of the plurality of connection terminals 211 of the package 212 and the printed wiring board 20 in a state where the wiring board 11 is mounted on the plurality of connection pads 201 of the printed wiring board 20 by soldering. When an external force is applied to the periphery of the package 202, the spacer member 22 suppresses the bending of the package 202 in the direction of the printed wiring board by the elastic force.
【００１８】さらに、上記機器本体１０には、キーボー
ド１１が配設され、このキーボード１１は、上記機器本
体１０内の回路モジュール３０に電気的に接続される。
そして、機器本体１０には、液晶ディスプレイ（ＬＣ
Ｄ）１２が、矢印方向に回動自在に組付けられる。 上
記構成において、印刷配線板２０には、その接続パッド
２０１に電子部品２１の接続端子２１１が載置されて半
田接続される。ここで、電子部品２１は、そのパッケー
ジ２１２の複数の接続端子２１１の周囲部が、印刷配線
板２０に対してスペーサ部材２２を介して対向配置され
て実装される。Further, a keyboard 11 is provided on the device main body 10, and the keyboard 11 is electrically connected to a circuit module 30 in the device main body 10.
The device body 10 includes a liquid crystal display (LC).
D) 12 is assembled so as to be rotatable in the direction of the arrow. In the above configuration, the connection terminals 211 of the electronic component 21 are placed on the connection pads 201 of the printed wiring board 20 and soldered. Here, the electronic component 21 is mounted with the periphery of the plurality of connection terminals 211 of the package 212 facing the printed wiring board 20 via the spacer member 22.
【００１９】そして、電子部品２１は、そのパッケージ
２１２の両端部に印刷配線板方向の外力が加わった場
合、印刷配線板２０との間に介在されるスペーサ部材２
２がパッケージ２１２の印刷配線板方向への撓みを抑制
して、そのパッケージ２１２の破損を防止する。これに
より、電子機器の機器本体１０への組付け作業時等に加
わる外力に対するパッケージ２１２の確実な安全保護が
図れて、その取扱い性の向上が図れる。When an external force in the direction of the printed wiring board is applied to both ends of the package 212, the electronic component 21 has a spacer member 2 interposed between the electronic component 21 and the printed wiring board 20.
2 suppresses the bending of the package 212 in the direction of the printed wiring board, thereby preventing the package 212 from being damaged. As a result, the package 212 can be reliably protected against external force applied when the electronic device is attached to the device main body 10, and the handling thereof can be improved.
【００２０】なお、上記スペーサ部材２２としては、図
３に示すように電子部品２１のパッケージ２１２の複数
の接続端子２１１を挟んだ長手方向の両端に配設するよ
うに構成するばかりでなく、例えばパッケージ２１２の
長手方向と略直交する方向の二方向に、複数の接続端子
２１１を挟んで配設するように構成してもよい。As shown in FIG. 3, the spacer members 22 are not only arranged at both ends in the longitudinal direction of the package 212 of the electronic component 21 with the plurality of connection terminals 211 interposed therebetween. A configuration may be adopted in which the plurality of connection terminals 211 are interposed in two directions substantially perpendicular to the longitudinal direction of the package 212.
【００２１】このパッケージ２１２の長手方向と略直交
する方向の二方向に、スペース部材２２を配置する構成
の場合には、パッケージ２１２の略直交する二方向の両
端の外力に対する撓み防止が実現され、さらにパッケー
ジ２１２の確実な安全保護が可能となる。In the case where the space members 22 are arranged in two directions substantially perpendicular to the longitudinal direction of the package 212, bending of both ends of the package 212 in two directions substantially perpendicular to each other can be prevented from being bent. Further, the security of the package 212 can be surely secured.
【００２２】このように、上記印刷配線ユニット３０
は、パッケージ２１２の中間部に複数の接続端子２１１
が配置される電子部品２１を、その接続端子２１１を印
刷配線板２０の接続パッド２０１に半田接続した状態
で、印刷配線板２０とパッケージ２１１との間にスペー
サ部材２２を介在されるように構成した。As described above, the printed wiring unit 30
Are connected to a plurality of connection terminals 211 at an intermediate portion of the package 212.
Is arranged such that the spacer member 22 is interposed between the printed wiring board 20 and the package 211 in a state in which the connection terminals 211 are soldered to the connection pads 201 of the printed wiring board 20. did.
【００２３】これによれば、例えば電子部品２１のパッ
ケージ２１１の周囲部に外力が加わると、印刷配線板２
０との間に介在されるスペーサ部材２２により印刷配線
板方向への撓みが抑制されて、その外力による破損が防
止される。この結果、例えば電子機器の機器本体１０へ
の組付け作業を含むユニット取扱い時における確実な安
全保護が図れて、その取扱い性の向上が図れる。According to this, for example, when an external force is applied to the periphery of the package 211 of the electronic component 21, the printed wiring board 2
The flexure in the direction of the printed wiring board is suppressed by the spacer member 22 interposed therebetween, and damage due to the external force is prevented. As a result, for example, reliable safety protection can be achieved at the time of handling the unit including the work of assembling the electronic device to the device main body 10, and the handleability can be improved.
【００２４】また、上記電子機器は、パッケージ２１２
の一方面の中間部に複数の接続端子２１１が配置された
電子部品２１を、その複数の接続端子２１１を印刷配線
板２０の複数の接続パッド２０１に電気的に接続して該
印刷配線板２０に実装し、この電子部品２１のパッケー
ジ２１２の一方面と印刷配線板２０との間にスペーサ部
材２２を介在した印刷配線ユニット３０を機器本体２０
に収容配置するように構成した。Further, the electronic device includes a package 212.
An electronic component 21 having a plurality of connection terminals 211 arranged at an intermediate portion on one surface of the printed wiring board 20 is electrically connected to the plurality of connection pads 201 of the printed wiring board 20. And a printed wiring unit 30 having a spacer member 22 interposed between the printed wiring board 20 and one surface of the package 212 of the electronic component 21.
It was configured to be accommodated and arranged.
【００２５】これによれば、印刷配線ユニット３０の電
子部品２１のパッケージ２１２の周囲部に外力が加わる
と、印刷配線板２０との間に介在されるスペーサ部材２
２が印刷配線板方向への撓みを抑制して、その外力によ
るパッケージ２１２の破損を防止する。According to this, when an external force is applied to the periphery of the package 212 of the electronic component 21 of the printed wiring unit 30, the spacer member 2 interposed between the printed wiring board 20 and the spacer member 2.
2 suppresses bending in the direction of the printed wiring board and prevents the package 212 from being damaged by the external force.
【００２６】この結果、印刷配線ユニット３０を電子機
器に機器本体１０に組付け収容する際のパッケージ２１
２の安全保護が効果的に実現されて、その組付け作業性
の向上が図れる。As a result, the package 21 for assembling and housing the printed wiring unit 30 in the device main body 10 in the electronic device.
2 is effectively realized, and the assembling workability can be improved.
【００２７】なお、この発明は、上記実施の形態に限る
ことなく、その他、図４及び図５に示すように構成する
ことが可能である。但し、ここでは、図４及び図５にお
いて、前記図２の実施の形態と同一部分について同一符
号を付して、その詳細な説明については省略する。It should be noted that the present invention is not limited to the above-described embodiment, and can be configured as shown in FIGS. 4 and 5. Here, in FIGS. 4 and 5, the same parts as those in the embodiment of FIG. 2 are denoted by the same reference numerals, and the detailed description thereof will be omitted.
【００２８】先ず、図４に示す実施の形態は、スペーサ
部材２２を電子部品２１のパッケージ２１２に接着して
取付けて、電子部品２１の接続端子２１１を印刷配線板
２０の接続パッド２０１に半田接続して実装する。これ
により、電子部品２１のパッケージ２１２と印刷配線板
２０との間には、スペーサ部材２２が介在され、このス
ペーサ部材２２が前記実施の形態と略同様にパッケージ
２１２の破損防止を実現する。First, in the embodiment shown in FIG. 4, the spacer member 22 is attached to the package 212 of the electronic component 21 by bonding, and the connection terminals 211 of the electronic component 21 are connected to the connection pads 201 of the printed wiring board 20 by soldering. And implement it. As a result, the spacer member 22 is interposed between the package 212 of the electronic component 21 and the printed wiring board 20, and the spacer member 22 substantially prevents the package 212 from being damaged as in the above-described embodiment.
【００２９】即ち、スペーサ部材２２は、パッケージ２
１２の長手方向の複数の接続端子２１１を挟むように印
刷配線板２０に直接的に接着して、電子部品２１の実装
状態で、パッケージ２１２と印刷配線板２０との間に介
在するように構成したものであり、前記図２の実施の形
態と、略同様にパッケージ２１２の確実な安全保護が実
現される。That is, the spacer member 22 is
12 are directly adhered to the printed wiring board 20 so as to sandwich the plurality of connection terminals 211 in the longitudinal direction, and are interposed between the package 212 and the printed wiring board 20 with the electronic component 21 mounted. As in the embodiment of FIG. 2, reliable security of the package 212 is realized.
【００３０】また、図５に示す実施の形態は、印刷配線
板２０の接続パッド２０１上にパッケージ２１２の接続
端子２１１を半田接続して、電子部品２１を印刷配線板
２０上に実装した状態で、予め用意しておいた別体のス
ペーサ部材２２ａを、印刷配線板２０と電子部品２１の
パッケージ２１２との間に挿入する如く挿着するように
構成したものである。In the embodiment shown in FIG. 5, the connection terminals 211 of the package 212 are connected by soldering to the connection pads 201 of the printed wiring board 20, and the electronic component 21 is mounted on the printed wiring board 20. A separate spacer member 22a prepared in advance is inserted and inserted between the printed wiring board 20 and the package 212 of the electronic component 21.
【００３１】そして、図５の実施の形態では、スペーサ
部材２２ａに接着部（図の都合上、図示せず）を設け
て、この接着部（図示せず）を印刷配線板２０あるいは
電子部品２１のパッケージ２１２に接着するように構成
してもよい。また、スペーサ部材２２ａを印刷配線板２
０と電子部品２１のパッケージ２１２との間に挿入する
ようにして装着し、この印刷配線板２０とパッケージ２
１２で挟持し得るように構成してもよい。In the embodiment of FIG. 5, an adhesive portion (not shown for convenience of illustration) is provided on the spacer member 22a, and the adhesive portion (not shown) is attached to the printed wiring board 20 or the electronic component 21. May be configured to adhere to the package 212. Also, the spacer member 22a is connected to the printed wiring board 2
0 and the package 212 of the electronic component 21, and the printed circuit board 20 and the package 2
It may be configured so that it can be clamped at 12.
【００３２】さらに、上記別体のスペーサ部材２２ａ
を、印刷配線板２０と電子部品２０のパッケージ２１２
との間に挿入する如く挿着する実施の形態においても、
この別体のスペース部材２２ａを電子部品２１の印刷配
線板２０への実装状態において、パッケージ２１２の複
数の接続端子２１１の、略直交する二方向を挟装するよ
うに挿着配置するように構成することも可能である。Further, the separate spacer member 22a
To the printed wiring board 20 and the package 212 of the electronic component 20.
Also in the embodiment to be inserted so as to be inserted between
In a state where the separate space member 22a is mounted on the printed wiring board 20 of the electronic component 21, the plurality of connection terminals 211 of the package 212 are inserted and arranged so as to sandwich the two substantially orthogonal directions. It is also possible.
【００３３】このようにスペーサ部材２２ａをパッケー
ジ２１２の複数の接続端子２１１を、略直交する二方向
挟装するように配置する構成においては、上述したパッ
ケージ２１２の複数の接続端子２１１の一方向のみを挟
装するようにスペーサ部材２２ａを設ける構成よりも、
さらにパッケージ２１２の破損防止の向上を図ることが
可能となる。In the configuration in which the spacer member 22a is disposed so as to sandwich the plurality of connection terminals 211 of the package 212 in two directions substantially orthogonal to each other, only one direction of the plurality of connection terminals 211 of the package 212 described above is provided. Than the configuration in which the spacer member 22a is provided so as to sandwich
Further, it is possible to improve prevention of breakage of the package 212.
【００３４】さらに、この発明は、上記実施の形態に限
ることなく、その他、スペース部材２２，２２ａを印刷
配線板２０及び電子部品２１のパッケージ２１２の双方
に交互に接着配置して、印刷配線板２０とパッケージ２
１２との間に介在させるように構成してもよい。Further, the present invention is not limited to the above-described embodiment, and the space members 22 and 22a may be alternately adhered and arranged on both the printed wiring board 20 and the package 212 of the electronic component 21 to form a printed wiring board. 20 and package 2
12 may be interposed.
【００３５】また、さらに上記実施の形態では、略矩形
状のパッケージ２１２の電子部品２１に適用した場合で
説明したが、これに限ることなく、例えば略中央部に複
数の接続端子をアレイ状に配置した正方形状のパッケー
ジ２１２を有する電子部品２１においても適用可能であ
る。Further, in the above embodiment, the case where the present invention is applied to the electronic component 21 of the substantially rectangular package 212 has been described. However, the present invention is not limited to this. The present invention is also applicable to the electronic component 21 having the arranged square package 212.
【００３６】このパッケージ形状の場合には、一般に複
数の接続端子２１１がパッケージ２１２の中央部に配列
配置されることで、スペーサ部材２２，２２ａは、上述
したようにパッケージ２１２の直交する二方向において
複数の接続端子２１１を挟んで設けることとなる。In the case of this package shape, generally, a plurality of connection terminals 211 are arranged and arranged at the center of the package 212, so that the spacer members 22 and 22a are arranged in two directions orthogonal to the package 212 as described above. It is provided with a plurality of connection terminals 211 interposed therebetween.
【００３７】そして、上記図４及び図５の実施の形態に
おける各印刷配線ユニット３０は、前記図１に示す機器
本体１０に収容されてパーソナルコンピュータ等の電子
機器が構成される。Each of the printed wiring units 30 in the embodiment shown in FIGS. 4 and 5 is housed in the device main body 10 shown in FIG. 1 to constitute an electronic device such as a personal computer.
【００３８】これによれば、略同様に電子部品２１のパ
ッケージ２１２の確実な安全保護が実現されることによ
り、機器本体１０への組付け作業時における安全が図れ
て、その取扱い性の向上が実現される。According to this, the security of the package 212 of the electronic component 21 is reliably secured substantially in the same manner, so that the safety at the time of the assembling work to the device main body 10 is achieved, and the handling of the device is improved. Is achieved.
【００３９】さらに、上記実施の形態では、電子部品２
１として、ＢＧＡ（ボールグリドアレイ）やＣＳＰ（チ
ップサイズパッケージ）等のエリアアレイ部品を用いて
構成した場合を代表して説明したが、これに限ることな
く、その他、各種の半導体パッケージにおいても適用可
能であり、略同様の効果が期待される。よって、この発
明は、上記実施の各形態に限ることなく、その他、この
発明の要旨を逸脱しない範囲で種々の変形を実施し得る
ことは勿論のことである。Further, in the above embodiment, the electronic component 2
As 1, the description has been made on the case where the configuration is made using area array components such as BGA (ball grid array) and CSP (chip size package). However, the present invention is not limited to this, and may be applied to various other semiconductor packages. It is possible and almost the same effect is expected. Therefore, it is needless to say that the present invention is not limited to the above embodiments, and that various modifications can be made without departing from the spirit of the present invention.
【００４０】[0040]
【発明の効果】以上詳述したように、この発明によれ
ば、構成簡易にして、パッケージ破損防止を図り得るよ
うにして、その取扱い性の向上を図った印刷配線ユニッ
トを提供することができる。また、この発明は、そのユ
ニット組付け作業性の向上を図り得るようにした印刷配
線ユニットを内蔵した電子機器を提供することができ
る。As described above in detail, according to the present invention, it is possible to provide a printed wiring unit which has a simple structure and can prevent the package from being damaged, thereby improving the handling property. . Further, the present invention can provide an electronic device having a built-in printed wiring unit capable of improving the unit assembling workability.
【図１】この発明の一実施の形態に係る印刷配線ユニッ
トを内蔵した電子機器の要部を示した図。FIG. 1 is an exemplary view showing a main part of an electronic device including a printed wiring unit according to an embodiment of the present invention;
【図２】この発明の一実施の形態に係る印刷配線ユニッ
トの要部を取出して示した断面図である。FIG. 2 is a sectional view showing a main part of the printed wiring unit according to the embodiment of the present invention;
【図３】この発明の一実施の形態に係る電子部品の要部
を説明するために示した平面図である。FIG. 3 is a plan view for explaining a main part of the electronic component according to one embodiment of the present invention;
【図４】この発明の他の実施の形態に係る印刷配線ユニ
ットの要部を示した断面図である。FIG. 4 is a sectional view showing a main part of a printed wiring unit according to another embodiment of the present invention.
【図５】この発明の他の実施の形態に係る印刷配線ユニ
ットの要部を示した断面図である。FIG. 5 is a sectional view showing a main part of a printed wiring unit according to another embodiment of the present invention.
【図６】この従来の印刷配線ユニットの問題点を説明す
るために要部を取出して示した断面図である。FIG. 6 is a cross-sectional view showing a main part of the conventional printed wiring unit in order to explain a problem with the printed wiring unit.
【図７】図６の電子部品の詳細を説明するために示した
平面図である。FIG. 7 is a plan view shown for explaining details of the electronic component of FIG. 6;
１０ … 機器本体。 １１ … キーボード。 １２ … ＬＣＤ。 ２０ … 印刷配線板。 ２０１ … 接続パッド。 ２１ … 電子部品。 ２１１ … 接続端子。 ２１２ … パッケージ。 ２２ … スペーサ部材。 ２２ａ … スペーサ部材。 ３０ … 印刷配線ユニット。 10… The device itself. 11 ... keyboard. 12 LCD. 20 ... printed wiring board. 201 ... connection pad. 21 Electronic parts. 211 ... connection terminal. 212 ... Package. 22 ... spacer member. 22a ... spacer member. 30 ... printed wiring unit.
Claims (8)
続端子が配置された電子部品と、 この電子部品が実装されるものであって、該電子部品の
複数の接続端子が電気的に接続される複数の接続パッド
が設けられる印刷配線板と、 前記電子部品のパッケージの一方面と前記印刷配線板と
の間に介在されるスペーサ部材とを具備した印刷配線ユ
ニット。1. An electronic component having a plurality of connection terminals disposed at an intermediate portion on one surface of a package, and the electronic component is mounted, wherein the plurality of connection terminals of the electronic component are electrically connected. A printed wiring board provided with a plurality of connection pads to be provided, and a spacer member interposed between one surface of the package of the electronic component and the printed wiring board.
るいは前記電子部品のパッケージのいずれか一方に接着
固定されることを特徴とする請求項１記載の印刷配線ユ
ニット。2. The printed wiring unit according to claim 1, wherein the spacer member is adhered and fixed to one of the printed wiring board and a package of the electronic component.
記印刷配線板に実装した状態で、前記パッケージの一方
面と前記印刷配線板との間に挿着されることを特徴とす
る請求項１記載の印刷配線ユニット。3. The printed wiring board according to claim 1, wherein the spacer member is inserted between one surface of the package and the printed wiring board in a state where the electronic component is mounted on the printed wiring board. Printed wiring unit as described.
ッケージあるいは前記印刷配線板のいずれか一方に接着
される接着部を備えることを特徴とする請求項３記載の
印刷配線ユニット。4. The printed wiring unit according to claim 3, wherein the spacer member includes an adhesive portion bonded to one of the package of the electronic component and the printed wiring board.
続端子が配置された電子部品を、前記複数の接続端子を
印刷配線板の複数の接続パッドに電気的に接続して前記
印刷配線板に実装し、前記電子部品のパッケージの一方
面と前記印刷配線板との間にスペーサ部材を介在した印
刷配線ユニットと、 この印刷配線ユニットが収容される機器本体とを具備し
た電子機器。5. An electronic component having a plurality of connection terminals disposed at an intermediate portion on one surface of a package, wherein the plurality of connection terminals are electrically connected to a plurality of connection pads of the printed wiring board. An electronic device, comprising: a printed wiring unit mounted on a printed circuit board and having a spacer member interposed between one surface of a package of the electronic component and the printed wiring board; and a device main body in which the printed wiring unit is housed.
るいは前記電子部品のパッケージのいずれか一方に接着
固定されることを特徴とする請求項５記載の電子機器。6. The electronic device according to claim 5, wherein the spacer member is bonded and fixed to one of the printed wiring board and a package of the electronic component.
記印刷配線板に実装した状態で、前記パッケージの一方
面と前記印刷配線板との間に挿着されることを特徴とす
る請求項５記載の電子機器。7. The printed circuit board according to claim 5, wherein the spacer member is inserted between one surface of the package and the printed wiring board in a state where the electronic component is mounted on the printed wiring board. Electronic device as described.
ッケージあるいは前記印刷配線板のいずれか一方に接着
される接着部を備えることを特徴とする請求項７記載の
電子機器。8. The electronic device according to claim 7, wherein the spacer member includes an adhesive portion that is adhered to one of a package of the electronic component and the printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19295798A JP2000031320A (en) | 1998-07-08 | 1998-07-08 | Printed wiring unit and electronic equipment incorporating the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19295798A JP2000031320A (en) | 1998-07-08 | 1998-07-08 | Printed wiring unit and electronic equipment incorporating the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000031320A true JP2000031320A (en) | 2000-01-28 |
Family
ID=16299853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19295798A Pending JP2000031320A (en) | 1998-07-08 | 1998-07-08 | Printed wiring unit and electronic equipment incorporating the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000031320A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100426500B1 (en) * | 2001-07-03 | 2004-04-13 | 앰코 테크놀로지 코리아 주식회사 | Semiconductor package |
| KR100631991B1 (en) | 2005-07-14 | 2006-10-09 | 삼성전기주식회사 | Electronic modules with structure for stacking ic chips |
| KR100694455B1 (en) * | 2000-12-26 | 2007-03-12 | 앰코 테크놀로지 코리아 주식회사 | Semiconductor package |
| US7573718B2 (en) | 2004-01-29 | 2009-08-11 | Fujitsu Limited | Spacer, printed circuit board, and electronic equipment |
| JP2012033696A (en) * | 2010-07-30 | 2012-02-16 | Fujitsu Ltd | Circuit substrate unit, method for manufacturing the same, and electronic device |
-
1998
- 1998-07-08 JP JP19295798A patent/JP2000031320A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100694455B1 (en) * | 2000-12-26 | 2007-03-12 | 앰코 테크놀로지 코리아 주식회사 | Semiconductor package |
| KR100426500B1 (en) * | 2001-07-03 | 2004-04-13 | 앰코 테크놀로지 코리아 주식회사 | Semiconductor package |
| US7573718B2 (en) | 2004-01-29 | 2009-08-11 | Fujitsu Limited | Spacer, printed circuit board, and electronic equipment |
| KR100631991B1 (en) | 2005-07-14 | 2006-10-09 | 삼성전기주식회사 | Electronic modules with structure for stacking ic chips |
| JP2012033696A (en) * | 2010-07-30 | 2012-02-16 | Fujitsu Ltd | Circuit substrate unit, method for manufacturing the same, and electronic device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR0141067B1 (en) | Electronic package with a thermally conductive support member having a thin circuitized substrate | |
| JP3855594B2 (en) | Semiconductor device | |
| US6476500B2 (en) | Semiconductor device | |
| US6469377B1 (en) | Semiconductor device | |
| JP5445340B2 (en) | Substrate reinforcement structure, substrate assembly, and electronic device | |
| JP2003133518A (en) | Semiconductor module | |
| JP2003115568A (en) | Mounting structure of ic chip and display | |
| JP2007165420A (en) | Semiconductor device | |
| JP2000223645A (en) | Semiconductor device | |
| JP2000031320A (en) | Printed wiring unit and electronic equipment incorporating the same | |
| JP2001119107A (en) | Printed wiring board | |
| JP3888037B2 (en) | Semiconductor device | |
| US5877545A (en) | Encapsulated printed circuit assembly and method and manufacturing the same | |
| JPH1111056A (en) | Ic card | |
| JP2004274007A (en) | Tape wiring board provided with corrugated beam leads and semiconductor chip package using the same | |
| JP2817712B2 (en) | Semiconductor device and mounting method thereof | |
| JP2001326428A (en) | Printed circuit board | |
| JPH10308413A (en) | Electronic component and electronic component mount module | |
| JP4076988B2 (en) | Electronics | |
| JP2000077798A (en) | Printed wiring board, semiconductor device and liquid crystal display device provided therewith | |
| JP3491576B2 (en) | Semiconductor device and mounting structure of semiconductor device | |
| JPH0755014Y2 (en) | Mounting structure | |
| JP3882471B2 (en) | Semiconductor device | |
| JP2786047B2 (en) | Resin-sealed semiconductor device | |
| JP3226240B2 (en) | Film carrier LSI |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20050328 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060516 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060712 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20071030 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20080311 |