JP2000077798A - Printed wiring board, semiconductor device and liquid crystal display device provided therewith - Google Patents
Printed wiring board, semiconductor device and liquid crystal display device provided therewithInfo
- Publication number
- JP2000077798A JP2000077798A JP24638298A JP24638298A JP2000077798A JP 2000077798 A JP2000077798 A JP 2000077798A JP 24638298 A JP24638298 A JP 24638298A JP 24638298 A JP24638298 A JP 24638298A JP 2000077798 A JP2000077798 A JP 2000077798A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- protective film
- semiconductor device
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Wire Bonding (AREA)
- Liquid Crystal (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、フレキシブルプリ
ント配線板、その片面に半導体ベアチップを搭載した半
導体装置およびそれを使用した液晶表示装置に係り、特
に、フレキシブルプリント配線基板の反りが生じないよ
うにしたプリント配線板、半導体装置および液晶表示装
置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible printed wiring board, a semiconductor device having a semiconductor bare chip mounted on one side thereof, and a liquid crystal display device using the same. In particular, the present invention relates to a flexible printed wiring board which is not warped. The present invention relates to a printed wiring board, a semiconductor device, and a liquid crystal display device.
【０００２】[0002]
【従来の技術】前述したフレキシブルプリント配線基板
の表面に配線パターンを形成し、この配線パターンを電
気的接続部を除いて保護膜により被覆したプリント配線
板に半導体ベアチップなどを搭載した半導体装置は、そ
のフレキシブルプリント配線基板が可撓性であるため、
フレキシブルプリント配線基板の折り曲げなどによる薄
型化や小型化が可能であるし、また、部品の配線本数の
削減も図れるので、液晶表示装置の駆動装置などに適用
されている。2. Description of the Related Art A semiconductor device in which a wiring pattern is formed on the surface of a flexible printed wiring board described above, and a semiconductor bare chip or the like is mounted on a printed wiring board in which this wiring pattern is covered with a protective film except for an electrical connection portion, Because the flexible printed wiring board is flexible,
Since it is possible to reduce the thickness and size of a flexible printed wiring board by bending or the like and to reduce the number of component wirings, it is applied to a driving device of a liquid crystal display device and the like.
【０００３】まず、この種の半導体装置の従来のものを
図２により説明する。First, a conventional semiconductor device of this type will be described with reference to FIG.
【０００４】図２に示す半導体装置１は、ポリイミド、
ポリエステルといった絶縁性材料により構成されたフレ
キシブルプリント配線基板としてのベースフィルム２を
有しており、このベースフィルム２の表面３Ａには、銅
箔のような材料からなる配線パターン４がめっきあるい
はエッチングなどにより形成されている。A semiconductor device 1 shown in FIG.
It has a base film 2 as a flexible printed wiring board made of an insulating material such as polyester, and a wiring pattern 4 made of a material such as copper foil is formed on a surface 3A of the base film 2 by plating or etching. Is formed.
【０００５】そして、前記配線パターン４には、半導体
ベアチップ５などがワイヤボンディング法、ソルダバン
プや金バンプを用いたバンプ接続法、ソルダリング法な
どにより搭載されている。また、前記配線パターン４上
には、電気的接続部を除きエポキシ系樹脂やアクリレー
ト樹脂のようなレジスト材料からなる保護膜６が積層さ
れ、配線パターン４を保護するようになっている。A semiconductor bare chip 5 and the like are mounted on the wiring pattern 4 by a wire bonding method, a bump connection method using solder bumps or gold bumps, a soldering method, or the like. A protective film 6 made of a resist material such as an epoxy resin or an acrylate resin is laminated on the wiring pattern 4 except for an electrical connection portion, so as to protect the wiring pattern 4.
【０００６】そして、前記ベースフィルム２、配線パタ
ーン４および保護膜６とによりプリント配線板７が構成
されている。The printed wiring board 7 is composed of the base film 2, the wiring pattern 4 and the protective film 6.
【０００７】[0007]
【発明が解決しようとする課題】ところで、前述したプ
リント配線板７は片面のみに配線パターン４が形成され
るものであるため、ベースフィルムの肉厚が０．１ｍｍ
以下で配線パターン４の肉厚が１８μｍ以下と薄く形成
される場合には、ベースフィルム２、配線パターン４お
よび保護膜６の相互の熱膨張係数が異なっているため、
プリント配線板７に全体的な反りが発生するという問題
点があった。Since the printed wiring board 7 has the wiring pattern 4 formed only on one side, the base film has a thickness of 0.1 mm.
When the thickness of the wiring pattern 4 is formed as thin as 18 μm or less below, the mutual thermal expansion coefficients of the base film 2, the wiring pattern 4 and the protective film 6 are different.
There is a problem that the printed wiring board 7 is entirely warped.
【０００８】このプリント配線板７の反りの問題は、初
期のみに生じるわけではなく、半導体装置１を形成する
ためにチップ部品５を配線パターン４に搭載する際の熱
や、半導体装置１として高温環境内での使用により反り
が生じてしまうことがあった。そして、プリント配線板
７に反りが生じると、部品の脱落やはんだ不良さらには
導体の断線の生じるおそれがあり、信頼性に欠けるし、
また、プリント配線板７の反りのために半導体装置１と
例えば液晶表示パネルのような他の部品とを電気的に接
続する際に位置合わせが困難となり、生産性が低下して
いた。The problem of the warpage of the printed wiring board 7 does not occur only in the initial stage, but may be caused by the heat generated when the chip component 5 is mounted on the wiring pattern 4 to form the semiconductor device 1 or the high temperature Warpage sometimes occurred due to use in an environment. If the printed wiring board 7 is warped, parts may fall off, solder failure may occur, and the conductor may be disconnected.
In addition, since the printed wiring board 7 is warped, it is difficult to align the semiconductor device 1 with another component such as a liquid crystal display panel, for example, so that productivity is reduced.
【０００９】本発明は、このような点に鑑み、熱を加え
られても反りが生じず、半導体装置として信頼性の高い
ものを形成することができる薄肉のプリント配線板を提
供することを目的とする。SUMMARY OF THE INVENTION In view of the foregoing, it is an object of the present invention to provide a thin printed wiring board which does not warp even when heated and can form a highly reliable semiconductor device. And
【００１０】[0010]
【課題を解決するための手段】前述した目的を達成する
ため請求項１に係る本発明のプリント配線板の特徴は、
フレキシブルプリント配線基板の他方の面にも保護膜を
形成した点にある。そして、このような構成を採用した
ことにより、他方の面側の保護膜が反りに抗するように
作用するので、反りの生じない信頼性ある半導体装置を
形成することができる。In order to achieve the above-mentioned object, the features of the printed wiring board of the present invention according to claim 1 are as follows.
The point is that a protective film is also formed on the other surface of the flexible printed wiring board. By adopting such a configuration, the protective film on the other surface acts to resist warpage, so that a reliable semiconductor device free from warpage can be formed.
【００１１】請求項２に係る本発明のプリント配線板の
特徴は、配線パターン側の保護膜と他方の面側の保護膜
とを熱膨張係数の等しい材料により形成し、他方の面側
の保護膜の膜厚を、配線パターンの側の保護膜の膜厚の
０．５〜１．５倍の範囲内とした点にある。そして、こ
のような構成を採用したことにより、フレキシブルプリ
ント配線基板の両面における熱膨張の均衡をとることが
でき、さらに良好に反りを防止することができる。The printed wiring board according to the present invention is characterized in that the protective film on the wiring pattern side and the protective film on the other surface side are formed of a material having the same thermal expansion coefficient, and the other surface side is protected. The point is that the thickness of the film is in the range of 0.5 to 1.5 times the thickness of the protective film on the wiring pattern side. By adopting such a configuration, the thermal expansion can be balanced on both sides of the flexible printed wiring board, and the warpage can be prevented more favorably.
【００１２】請求項３に係る本発明の半導体装置の特徴
は、請求項１または２のプリント配線板にフリップチッ
プ方式にて半導体ベアチップを搭載してなる点にある。
そして、このような構成を採用したことにより、それ自
体の生産性が向上するばかりでなく、例えば液晶表示パ
ネルのような他の部品と電気的に接続する際の生産性が
向上するとともに確実で信頼性の高い電気的接続が達成
される。The semiconductor device according to the third aspect of the present invention is characterized in that a semiconductor bare chip is mounted on the printed wiring board according to the first or second aspect by a flip chip method.
By adopting such a configuration, not only the productivity of itself is improved, but also the productivity when electrically connecting with other components such as a liquid crystal display panel is improved and the reliability is improved. A reliable electrical connection is achieved.
【００１３】請求項４に係る本発明の液晶表示装置の特
徴は、請求項３の半導体装置を液晶表示パネルの入力端
子部に電気的に接続させる点にある。そして、このよう
な構成を採用したことにより、半導体装置との電気的接
続が確実で信頼性の高いものとなるばかりでなく、生産
性も大きく向上する。A feature of the liquid crystal display device of the present invention according to claim 4 is that the semiconductor device of claim 3 is electrically connected to an input terminal of a liquid crystal display panel. By employing such a configuration, not only is the electrical connection with the semiconductor device reliable and reliable, but also the productivity is greatly improved.
【００１４】[0014]
【発明の実施の形態】図１は本発明のプリント配線板を
適用した半導体装置の実施形態を示すものであるが、図
２において前述した従来のものと同一ないしは相当する
ものにおいては図面中に同一の符号を付して説明する。FIG. 1 shows an embodiment of a semiconductor device to which a printed wiring board according to the present invention is applied. In FIG. 2, components which are the same as or correspond to those of the conventional device shown in FIG. The description is given with the same reference numerals.
【００１５】図１に示す半導体装置１Ａは、前述した従
来のものと同様、ポリイミド、ポリエステルといった絶
縁性材料により構成されたフレキシブルプリント配線基
板としてのベースフィルム２を有しており、このベース
フィルム２の肉厚は、０．１ｍｍ以下とされている。そ
して、このベースフィルム２の表面３Ａには、銅箔のよ
うな材料からなる配線パターン４がめっきあるいはエッ
チングなどにより１８μｍ以下の肉厚に形成されてい
る。The semiconductor device 1A shown in FIG. 1 has a base film 2 as a flexible printed circuit board made of an insulating material such as polyimide or polyester, similarly to the above-described conventional device. Has a thickness of 0.1 mm or less. On the surface 3A of the base film 2, a wiring pattern 4 made of a material such as a copper foil is formed to a thickness of 18 μm or less by plating or etching.
【００１６】そして、前記配線パターン４には、半導体
ベアチップ５がワイヤボンディング法、ソルダバンプや
金バンプを用いたバンプ接続法、ソルダリング法などに
より搭載されている。また、前記配線パターン４上に
は、電気的接続部を除きエポキシ系樹脂やアクリレート
樹脂のようなレジスト材料からなる保護膜６が積層さ
れ、配線パターン４を保護するようになっている。A semiconductor bare chip 5 is mounted on the wiring pattern 4 by a wire bonding method, a bump connection method using solder bumps or gold bumps, a soldering method, or the like. A protective film 6 made of a resist material such as an epoxy resin or an acrylate resin is laminated on the wiring pattern 4 except for an electrical connection portion, so as to protect the wiring pattern 4.
【００１７】ここまでの構成は、前述した従来の半導体
装置１と同様である。The configuration up to this point is the same as that of the conventional semiconductor device 1 described above.
【００１８】そして、本実施形態においては、特に、半
導体ベアチップ５を搭載した側の背部となるベースフィ
ルム２の裏面３Ｂに、前記配線パターン４の保護膜６と
等しい熱膨張係数の保護膜８が形成されている。この保
護膜８の材料は、エポキシ系樹脂やアクリレート樹脂の
ようなレジスト材料からなる前記保護膜６の材料と異な
るものであってもよいが、同一の材料を同一膜厚に形成
すれば、製造工程の簡略化がはかれる。そして、この保
護膜８の膜厚は、前記保護膜６の膜厚の０．５〜１．５
倍の範囲内であることが本実施形態のプリント配線板７
Ａの反りを防止するうえで特に好ましい。In this embodiment, the protective film 8 having the same thermal expansion coefficient as the protective film 6 of the wiring pattern 4 is formed on the back surface 3B of the base film 2 which is the back of the side on which the semiconductor bare chip 5 is mounted. Is formed. The material of the protective film 8 may be different from the material of the protective film 6 made of a resist material such as an epoxy resin or an acrylate resin. The process can be simplified. The thickness of the protective film 8 is 0.5 to 1.5 times the thickness of the protective film 6.
The printed wiring board 7 according to the present embodiment is within the range of twice.
It is particularly preferable to prevent the warpage of A.
【００１９】つぎに、前述した構成からなる本実施形態
の作用ならびに効果について説明する。Next, the operation and effect of this embodiment having the above-described configuration will be described.
【００２０】本実施形態のプリント配線板７Ａは、ベー
スフィルム２の裏面３Ｂに保護膜８が形成されているの
で、ベースフィルム２、配線パターン４および保護膜６
の相互の熱膨張係数が異なっていることにより生じる熱
応力による反りがベースフィルム２の裏面３Ｂの保護膜
８により相殺されるので、プリント配線板７Ａには、そ
の完成時あるいは半導体装置７Ａの製造時のいずれのと
きにも反りが生じない。したがって、部品の脱落やはん
だ不良の生じるおそれがないし、また、プリント配線板
７Ａに反りの生じない信頼性ある半導体装置を形成する
ことができる。さらに、プリント配線板７Ａに反りがな
いため、半導体装置１Ａを組み立てる際にプリント配線
板７Ａと半導体ベアチップ５との位置合わせが容易とな
るため、従来多数必要とされた押え治具の数の削減が可
能となるし、また、半導体装置１Ａを例えば液晶表示パ
ネルの入力端子部に電気的に接続させて液晶表示装置を
製造するに際して、位置合わせが容易となり、確実で信
頼性の高い電気的接続が達成される。In the printed wiring board 7A of this embodiment, since the protective film 8 is formed on the back surface 3B of the base film 2, the base film 2, the wiring pattern 4, and the protective film 6 are formed.
The warpage caused by the thermal stress caused by the difference in the thermal expansion coefficients between the two is offset by the protective film 8 on the back surface 3B of the base film 2, so that the printed wiring board 7A is completed when it is completed or when the semiconductor device 7A is manufactured. No warping occurs at any time. Therefore, there is no possibility that components will fall off or solder failure will occur, and a reliable semiconductor device in which the printed wiring board 7A does not warp can be formed. Furthermore, since the printed wiring board 7A has no warp, the printed wiring board 7A and the semiconductor bare chip 5 can be easily aligned when assembling the semiconductor device 1A, so that the number of holding jigs conventionally required in large numbers is reduced. In addition, when manufacturing the liquid crystal display device by electrically connecting the semiconductor device 1A to, for example, the input terminal portion of the liquid crystal display panel, the alignment becomes easy, and the reliable and reliable electrical connection is achieved. Is achieved.
【００２１】なお、本発明は、前述した実施の形態に限
定されるものではなく、必要に応じて種々の変更が可能
である。It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made as necessary.
【００２２】[0022]
【発明の効果】以上説明したように本発明のプリント配
線板によれば、熱を加えられても反りが生じず、半導体
装置として信頼性の高いものを形成することができる。As described above, according to the printed wiring board of the present invention, warping does not occur even when heat is applied, and a highly reliable semiconductor device can be formed.
【００２３】すなわち、フレキシブルプリント配線基板
の他方の面側に保護膜を形成したことにより、他方の面
側の保護膜が反りに抗するように作用するので、部品の
脱落やはんだ不良の生じるおそれがないし、また、反り
の生じない信頼性ある半導体装置を形成することができ
る。しかも、半導体装置を組み立てる際にプリント配線
板と半導体ベアチップとの位置合わせが容易となるた
め、従来多数必要とされた押え治具の数の削減が可能と
なるばかりでなく、半導体装置と例えば液晶表示パネル
のような他の部品とを電気的に接続する際に、生産性が
向上するとともに確実で信頼性の高い電気的接続が達成
される。That is, since the protective film is formed on the other surface of the flexible printed wiring board, the protective film on the other surface acts to resist warpage, which may cause parts to fall off or defective soldering. And a reliable semiconductor device free from warpage can be formed. Moreover, since the alignment between the printed wiring board and the semiconductor bare chip becomes easy when assembling the semiconductor device, not only the number of holding jigs conventionally required in large numbers can be reduced, but also the semiconductor device and the liquid crystal display, for example, can be used. When electrically connecting another component such as a display panel, the productivity is improved, and a reliable and highly reliable electrical connection is achieved.
【００２４】また、配線パターン側の保護膜と他方の面
側の保護膜を熱膨張係数の等しい材料により形成し、他
方の面側の保護膜の膜厚を、配線パターン側の保護膜の
膜厚の０．５〜１．５倍の範囲内とすれば、フレキシブ
ルプリント配線基板の両面における熱膨張の均衡をとる
ことができ、さらに良好に反りを防止することができ
る。Further, the protective film on the wiring pattern side and the protective film on the other surface side are formed of a material having the same thermal expansion coefficient, and the thickness of the protective film on the other surface side is changed to the thickness of the protective film on the wiring pattern side. When the thickness is in the range of 0.5 to 1.5 times, the thermal expansion can be balanced on both sides of the flexible printed wiring board, and the warpage can be more favorably prevented.
【図１】 本発明に係るプリント配線板を適用した半導
体装置の実施の形態を示す縦断面図FIG. 1 is a longitudinal sectional view showing an embodiment of a semiconductor device to which a printed wiring board according to the present invention is applied.
【図２】 従来のプリント配線板を適用した半導体装置
を示す縦断面図FIG. 2 is a longitudinal sectional view showing a semiconductor device to which a conventional printed wiring board is applied.
１，１Ａ 半導体装置 ２ ベースフィルム ３Ａ ベースフィルム２の片面 ３Ｂ ベースフィルム２の他方の面 ４ 配線パターン ５ 半導体ベアチップ ６，８ 保護膜 DESCRIPTION OF SYMBOLS 1, 1A Semiconductor device 2 Base film 3A One surface of base film 2 3B The other surface of base film 2 4 Wiring pattern 5 Semiconductor bare chip 6,8 Protective film
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 2H092 GA50 GA59 HA18 MA34 NA17 NA29 PA01 4M105 AA03 FF01 5E314 AA24 AA32 AA33 BB02 BB06 BB12 CC15 FF06 GG21 5E338 AA01 AA12 AA16 BB63 BB72 BB75 CC01 CD11 EE28 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H092 GA50 GA59 HA18 MA34 NA17 NA29 PA01 4M105 AA03 FF01 5E314 AA24 AA32 AA33 BB02 BB06 BB12 CC15 FF06 GG21 5E338 AA01 AA12 AA16 BB63 BB72 BB75 CC01 CD11 EE28
Claims (4)
厚のフレキシブルプリント配線基板の片面に１８μｍ以
下の肉厚の導体層を設け、これをパターンニングして配
線パターンを形成し、この配線パターンを電気的接続部
を除いて保護膜により被覆したプリント配線板におい
て、前記フレキシブルプリント配線基板の他方の面にも
保護膜を形成したことを特徴とするプリント配線板。A flexible printed wiring board made of an insulating material and having a thickness of 0.1 mm or less is provided with a conductor layer having a thickness of 18 μm or less on one surface, and is patterned to form a wiring pattern. A printed wiring board in which a pattern is covered with a protective film except for an electrical connection portion, wherein a protective film is also formed on the other surface of the flexible printed wiring board.
の面側の保護膜とを熱膨張係数の等しい材料により形成
し、前記他方の面側の保護膜の膜厚を、前記配線パター
ン側の保護膜の膜厚の０．５〜１．５倍の範囲内とした
ことを特徴とする請求項１に記載のプリント配線板。2. The method according to claim 1, wherein the protection film on the wiring pattern side and the protection film on the other surface side are formed of a material having the same thermal expansion coefficient, and the thickness of the protection film on the other surface side is adjusted to the wiring pattern side. 2. The printed wiring board according to claim 1, wherein the thickness of the protective film is in the range of 0.5 to 1.5 times.
リップチップ方式にて半導体ベアチップを搭載してなる
ことを特徴とする半導体装置。3. A semiconductor device comprising: a semiconductor bare chip mounted on the printed wiring board according to claim 1 by a flip chip method.
の入力端子部に電気的に接続させてなることを特徴とす
る液晶表示装置。4. A liquid crystal display device wherein the semiconductor device according to claim 3 is electrically connected to an input terminal of a liquid crystal display panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24638298A JP2000077798A (en) | 1998-08-31 | 1998-08-31 | Printed wiring board, semiconductor device and liquid crystal display device provided therewith |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24638298A JP2000077798A (en) | 1998-08-31 | 1998-08-31 | Printed wiring board, semiconductor device and liquid crystal display device provided therewith |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000077798A true JP2000077798A (en) | 2000-03-14 |
Family
ID=17147717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24638298A Pending JP2000077798A (en) | 1998-08-31 | 1998-08-31 | Printed wiring board, semiconductor device and liquid crystal display device provided therewith |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000077798A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1301437C (en) * | 2003-06-20 | 2007-02-21 | 友达光电股份有限公司 | LCD module and printed circuit board thereof |
| JP2007207781A (en) * | 2006-01-30 | 2007-08-16 | Fujitsu Ltd | Printed wiring board having multilayer structure, and method of manufacturing printed wiring board |
| JP2009283500A (en) * | 2008-05-19 | 2009-12-03 | Sumitomo Electric Printed Circuit Inc | Flexible printed wiring board |
| JP2010157553A (en) * | 2008-12-26 | 2010-07-15 | Sharp Corp | Interconnect sheet, solar cell with the interconnect cell, solar cell module, and method of manufacturing the solar cell with the interconnect sheet, and method of manufacturing the solar cell moidule |
| JP2017174841A (en) * | 2016-03-18 | 2017-09-28 | 株式会社ジャパンディスプレイ | Flexible wiring board and display device |
| WO2022065405A1 (en) * | 2020-09-27 | 2022-03-31 | 立山科学株式会社 | Electric circuit substrate and method for manufacturing electric circuit substrate |
-
1998
- 1998-08-31 JP JP24638298A patent/JP2000077798A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1301437C (en) * | 2003-06-20 | 2007-02-21 | 友达光电股份有限公司 | LCD module and printed circuit board thereof |
| JP2007207781A (en) * | 2006-01-30 | 2007-08-16 | Fujitsu Ltd | Printed wiring board having multilayer structure, and method of manufacturing printed wiring board |
| JP2009283500A (en) * | 2008-05-19 | 2009-12-03 | Sumitomo Electric Printed Circuit Inc | Flexible printed wiring board |
| JP2010157553A (en) * | 2008-12-26 | 2010-07-15 | Sharp Corp | Interconnect sheet, solar cell with the interconnect cell, solar cell module, and method of manufacturing the solar cell with the interconnect sheet, and method of manufacturing the solar cell moidule |
| JP2017174841A (en) * | 2016-03-18 | 2017-09-28 | 株式会社ジャパンディスプレイ | Flexible wiring board and display device |
| WO2022065405A1 (en) * | 2020-09-27 | 2022-03-31 | 立山科学株式会社 | Electric circuit substrate and method for manufacturing electric circuit substrate |
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