IN2013MU03700A - - Google Patents

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Publication number
IN2013MU03700A
IN2013MU03700A IN3700MU2013A IN2013MU03700A IN 2013MU03700 A IN2013MU03700 A IN 2013MU03700A IN 3700MU2013 A IN3700MU2013 A IN 3700MU2013A IN 2013MU03700 A IN2013MU03700 A IN 2013MU03700A
Authority
IN
India
Prior art keywords
insights
heat dissipating
thermal
dissipating device
cooling units
Prior art date
Application number
Inventor
Anirudh Deodhar
Harshad Girish Bhagwat
Amarendra Kumar Singh
Anand Sivasubramaniam
Original Assignee
Tata Consultancy Services Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tata Consultancy Services Ltd filed Critical Tata Consultancy Services Ltd
Priority to PCT/IN2014/000120 priority Critical patent/WO2015075727A2/en
Priority to IN3700MU2013 priority patent/IN2013MU03700A/en
Priority to US15/039,729 priority patent/US10540457B2/en
Priority to EP14864803.3A priority patent/EP3074914A4/en
Publication of IN2013MU03700A publication Critical patent/IN2013MU03700A/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • G06F30/28—Design optimisation, verification or simulation using fluid dynamics, e.g. using Navier-Stokes equations or computational fluid dynamics [CFD]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/30—Monitoring
    • G06F11/3003—Monitoring arrangements specially adapted to the computing system or computing system component being monitored
    • G06F11/3006—Monitoring arrangements specially adapted to the computing system or computing system component being monitored where the computing system is distributed, e.g. networked systems, clusters, multiprocessor systems
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/30—Monitoring
    • G06F11/3058—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations
    • G06F11/3062—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations where the monitored property is the power consumption
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/10—Complex mathematical operations
    • G06F17/18—Complex mathematical operations for evaluating statistical data, e.g. average values, frequency distributions, probability functions, regression analysis
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836—Thermal management, e.g. server temperature control
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2111/00—Details relating to CAD techniques
    • G06F2111/10—Numerical modelling
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2113/00—Details relating to the application field
    • G06F2113/02—Data centres
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/08—Thermal analysis or thermal optimisation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computing Systems (AREA)
  • Computer Hardware Design (AREA)
  • Mathematical Physics (AREA)
  • Quality & Reliability (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • Data Mining & Analysis (AREA)
  • Pure & Applied Mathematics (AREA)
  • Mathematical Analysis (AREA)
  • Mathematical Optimization (AREA)
  • Computational Mathematics (AREA)
  • Algebra (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Software Systems (AREA)
  • Operations Research (AREA)
  • Probability & Statistics with Applications (AREA)
  • Evolutionary Biology (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Databases & Information Systems (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Fluid Mechanics (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Architecture (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Disclosed is a method for real-time prediction of thermal-insights for a heat dissipating device in a data center cooled by one or more cooling units. The method uses a concept of influence mass fractions in conjunction with proper orthogonal decomposition (POD) based reduced order model. It may be understood that, the influence mass fractions may be computed by performing a fixed number of CFD simulations based on mass flow rates of the one or more cooling units. The method further facilitates to identify a set of reference scenarios for a given range of operational parameters of the one or more cooling units impacting the heat dissipating device. The set of reference scenarios may then be provided to the POD in order to predict the thermal-insights of the data center such as a temperature, mass flow rate, and insights into thermal influence of air sources on the heat dissipating device.
IN3700MU2013 2013-11-25 2014-02-25 IN2013MU03700A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
PCT/IN2014/000120 WO2015075727A2 (en) 2013-11-25 2014-02-25 A system and method for predicting thermal-insights of a data center
IN3700MU2013 IN2013MU03700A (en) 2013-11-25 2014-02-25
US15/039,729 US10540457B2 (en) 2013-11-25 2014-02-25 System and method for predicting thermal-insights of a data center
EP14864803.3A EP3074914A4 (en) 2013-11-25 2014-02-25 A system and method for predicting thermal-insights of a data center

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IN3700MU2013 IN2013MU03700A (en) 2013-11-25 2014-02-25

Publications (1)

Publication Number Publication Date
IN2013MU03700A true IN2013MU03700A (en) 2015-07-31

Family

ID=53180340

Family Applications (1)

Application Number Title Priority Date Filing Date
IN3700MU2013 IN2013MU03700A (en) 2013-11-25 2014-02-25

Country Status (4)

Country Link
US (1) US10540457B2 (en)
EP (1) EP3074914A4 (en)
IN (1) IN2013MU03700A (en)
WO (1) WO2015075727A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015201015A (en) * 2014-04-07 2015-11-12 富士通株式会社 Thermal fluid analysis program, information processing device, and thermal fluid analysis method
US10621849B2 (en) * 2015-09-25 2020-04-14 Intel Corporation Alert system for internet of things (IoT) devices
JP6562893B2 (en) * 2016-11-17 2019-08-21 株式会社東芝 Parameter estimation device, air conditioning system evaluation device, parameter estimation method and program
CN106951355A (en) * 2017-03-24 2017-07-14 联想(北京)有限公司 Detect the method and server of air regime in cabinet
CN113170592B (en) * 2018-11-19 2023-11-10 阿里云计算有限公司 Thermal control optimization based on monitoring/control mechanism
CN109582520B (en) * 2018-12-07 2022-02-18 郑州云海信息技术有限公司 Method and system for automatically testing AEP (external-access-point) memory heat dissipation based on Linux environment

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7644051B1 (en) * 2006-07-28 2010-01-05 Hewlett-Packard Development Company, L.P. Management of data centers using a model
DK2123140T3 (en) * 2007-01-24 2016-12-05 Schneider Electric It Corp System and method for evaluation of cooling conditions of an equipment rack
US8306794B2 (en) * 2008-06-26 2012-11-06 International Business Machines Corporation Techniques for thermal modeling of data centers to improve energy efficiency
US8972217B2 (en) 2010-06-08 2015-03-03 Schneider Electric It Corporation System and method for predicting temperature values in a data center
US8949091B2 (en) * 2011-03-09 2015-02-03 Tata Consultancy Services Limited Method and system for thermal management by quantitative determination of cooling characteristics of data center
US8992074B2 (en) * 2012-02-17 2015-03-31 Cypress Envirosystems, Inc. System and method for conducting heating, ventilation, and air conditioning analytics
WO2013128468A2 (en) * 2012-03-01 2013-09-06 Tata Consultancy Services Limited Method and system for efficient real time thermal management of a data center

Also Published As

Publication number Publication date
US10540457B2 (en) 2020-01-21
WO2015075727A3 (en) 2015-11-12
US20160378891A1 (en) 2016-12-29
EP3074914A4 (en) 2017-06-07
WO2015075727A2 (en) 2015-05-28
EP3074914A2 (en) 2016-10-05

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