HK1108973A1 - Substrate with multi-layer interconnection structure and method of manufacturing the same - Google Patents

Substrate with multi-layer interconnection structure and method of manufacturing the same

Info

Publication number
HK1108973A1
HK1108973A1 HK07114167.1A HK07114167A HK1108973A1 HK 1108973 A1 HK1108973 A1 HK 1108973A1 HK 07114167 A HK07114167 A HK 07114167A HK 1108973 A1 HK1108973 A1 HK 1108973A1
Authority
HK
Hong Kong
Prior art keywords
substrate
manufacturing
same
interconnection structure
layer interconnection
Prior art date
Application number
HK07114167.1A
Original Assignee
Princo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Princo Corp filed Critical Princo Corp
Publication of HK1108973A1 publication Critical patent/HK1108973A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
HK07114167.1A 2006-01-06 2007-12-27 Substrate with multi-layer interconnection structure and method of manufacturing the same HK1108973A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200610005788 CN1996582B (en) 2006-01-06 2006-01-06 Carrier board including the multi-layer internal connection line and its making, recycling and application method

Publications (1)

Publication Number Publication Date
HK1108973A1 true HK1108973A1 (en) 2008-05-23

Family

ID=38251597

Family Applications (1)

Application Number Title Priority Date Filing Date
HK07114167.1A HK1108973A1 (en) 2006-01-06 2007-12-27 Substrate with multi-layer interconnection structure and method of manufacturing the same

Country Status (2)

Country Link
CN (1) CN1996582B (en)
HK (1) HK1108973A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI337059B (en) 2007-06-22 2011-02-01 Princo Corp Multi-layer substrate and manufacture method thereof
KR20100049065A (en) * 2007-07-12 2010-05-11 프린코 코포레이션 Multilayer substrate and fabricating method thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2823596B1 (en) * 2001-04-13 2004-08-20 Commissariat Energie Atomique SUBSTRATE OR DISMOUNTABLE STRUCTURE AND METHOD OF MAKING SAME

Also Published As

Publication number Publication date
CN1996582B (en) 2012-02-15
CN1996582A (en) 2007-07-11

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20200106