CN1996582A - Carrier board including the multi-layer internal connection line and its making, recycling and application method - Google Patents
Carrier board including the multi-layer internal connection line and its making, recycling and application method Download PDFInfo
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- CN1996582A CN1996582A CN 200610005788 CN200610005788A CN1996582A CN 1996582 A CN1996582 A CN 1996582A CN 200610005788 CN200610005788 CN 200610005788 CN 200610005788 A CN200610005788 A CN 200610005788A CN 1996582 A CN1996582 A CN 1996582A
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- support plate
- connection line
- internal connection
- layer internal
- layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
This invention provides one load board composed of multi-layer wire structure, which comprises one load board and one layer of connection structure, wherein, the multi-layer connection structure and the load board are connected only in part area with simple isolation and low cost. This invention also provides one process method; recycle method and its sealing method and connection process method of the multi-layer connection structure.
Description
[technical field]
The invention relates to a kind of manufacture method that comprises support plate and manufacturing, recovery method, the method for packing that uses it and the multiple layer inner connection line apparatus of multi-layer internal connection line, especially about a kind of support plate that comprises multi-layer internal connection line, adhere in subregion essence between its multi-layer internal connection line and the support plate, and the manufacture method of manufacturing, recovery method, the method for packing that uses it and multiple layer inner connection line apparatus.
[background technology]
Progress along with present semiconductor fabrication process, the live width of wafer, distance between centers of tracks and size are all more and more little, the desired transmission speed of wafer is more and more fast, power output is more and more high, therefore it is more and more high that wafer is electrically connected to the outside also corresponding requirement of structure packing technique, lead will be more and more many and wire pitch also need more and more intensive, therefore the technology of chip assembly is changeed gradually from the pin insert type and is entered surface adhesion type, beating the connection kenel of gold thread from lead frame changes the mode that enters the use projection gradually, and circuit board is from the PCB hardboard, flexible printed wiring board FPC changes gradually and enters the IC substrate.
Heavily about 4 grams of the PCB hardboard of general six layers of BT material, the about 1mm of thickness, thereby can't deflection, and flexible printed wiring board only can be made 2 layers of intraconnections under the situation of the about 50 μ m of thickness, relative, under the situation of the about 50 μ m of thickness, the IC substrate can be produced 6 layers of intraconnections substrate, about 0.21 gram of total weight, therefore the flexibility of IC substrate is best, and the most frivolous.On this external intraconnections density, the through hole minimum of PCB hardboard and flexible printed wiring board is required to be 50 μ m, through hole weld pad minimum is required to be 100 μ m, live width and distance between centers of tracks minimum are required to be 25 μ m, and relative, the through hole minimum of IC substrate is required to be 20 μ m, and through hole weld pad minimum is required to be 25 μ m, live width and distance between centers of tracks minimum are required to be 20 μ m, so the IC substrate can significantly increase intraconnections density.
Downsizing along with the circuit board size, requirement for circuit board precision also improves, the fabrication schedule of circuit board also is faced with new challenges, especially it is very important how improving line density in fabrication schedule, and the key of raising line density is the dimensional stability of circuit board in the fabrication schedule.Known a kind of solution is to carry out the making of IC substrate on a hard support plate, increasing the dimensional stability of IC substrate in processing procedure by the preferable dimensional stability of support plate, is a big problem of this type of technology but will how the IC substrate be separated with support plate after the IC substrate manufacture is finished.
In No. the 4812191st, United States Patent (USP), disclose a kind of to sacrifice the method that the support plate manufacturing technology is made multi-layer internal connection line, wherein be on support plate, to make multi-layer internal connection line, the thermal coefficient of expansion of support plate is less than multi-layer internal connection line, then harden, in the program that heats up, lowers the temperature, make and be adsorbed on the enough tension force of generation between support plate and the multi-layer internal connection line mode that reaches acid liquor etching on the multi-layer internal connection line with supportive device again multi-layer internal connection line and support plate are separated.
In No. the 5258236th, United States Patent (USP), disclose a kind of method of separating support plate and multi-layer internal connection line with laser lift-off, as shown in Figure 1, wherein the order with polymeric layer 2, metal level 3 and multi-layer internal connection line 4 be formed in order on the transparent support plate 1 after, see through transparent support plate 1 with the laser ultraviolet light again and be radiated at decomposing copolymer layer 2 on the polymeric layer 2, and make transparent support plate 1 to separate with other part-structures.
Yet, the separation method of above-mentioned known techniques is comparatively loaded down with trivial details, complicated, therefore, how a method and structure are provided, the high IC substrate of manufactured size precision simultaneously, can make IC substrate and separating of support plate again is simply, cheaply, is still that circuit board manufacturing process at present makes great efforts to pursue.
[summary of the invention]
The object of the present invention is to provide a kind of support plate and manufacture method thereof that comprises multi-layer internal connection line, wherein multi-layer internal connection line be separating of support plate simply, fast and cheaply; The present invention more provides and uses this to comprise the method for packing of the support plate of multi-layer internal connection line, and reclaims the method that this comprises the support plate of multi-layer internal connection line.
Comprise the support plate of multi-layer internal connection line in a profit provided by the invention, comprise: a support plate; And a multi-layer internal connection line, this multi-layer internal connection line position is wherein only adhered in subregion essence between this multi-layer internal connection line and this support plate on this support plate.Wherein this subregion can be at support plate outer peripheral areas, be spot distribution or distribute as net shape or the like.
In a kind of manufacture method that comprises the support plate of multi-layer internal connection line of the present invention, comprise: a support plate is provided; And form a multi-layer internal connection line on this support plate, wherein only adhere between this multi-layer internal connection line and this support plate in subregion essence.Wherein this subregion can be at support plate outer peripheral areas, be spot distribution or distribute as net shape or the like.
The present invention provides a kind of electron element packaging method in addition, uses the above-mentioned support plate that comprises multi-layer internal connection line, and this method for packing comprises: be electrically connected at least one electronic component and comprise the support plate of multi-layer internal connection line to this; Sealing is on this electronic component; And cut this multi-layer internal connection line, make the multiple layer inner connection line apparatus that is packaged with electronic component and this support plate natural separation that cuts down.Wherein this electronic component is a plurality of, sealing is in being only not have sealing on the specific region of support plate of this multi-layer internal connection line of these a plurality of electronic components on these a plurality of electronic components, making does not have sealing on the remaining area, uses and keeps the flexibility that this is packaged with the multiple layer inner connection line apparatus of electronic component.
The present invention provides a kind of electron element packaging method in addition, uses as the above-mentioned support plate that comprises multi-layer internal connection line, and this method for packing comprises: cut this multi-layer internal connection line, feasible multiple layer inner connection line apparatus and this support plate natural separation that cuts down; Be electrically connected at least one electronic component to this multiple layer inner connection line apparatus; And sealing is on this electronic component.Wherein this electronic component is a plurality of, sealing is on these a plurality of electronic components being only sealing on this multiple layer inner connection line apparatus specific region of these a plurality of electronic components of nothing, making does not have sealing on the remaining area, uses and keeps the flexibility that this is packaged with the multiple layer inner connection line apparatus of electronic component.
The present invention provides a kind of recovery method that reclaims as the above-mentioned support plate that comprises multi-layer internal connection line in addition, and comprising provides the support plate that comprises multi-layer internal connection line, and this multi-layer internal connection line is removed from this support plate.Wherein this multi-layer internal connection line is to have part to be cut to remove, this removes step and can use sulfuric acid and mixed solution of hydrogen peroxide to carry out this multi-layer internal connection line is removed from this support plate, to grind this multi-layer internal connection line is removed from this support plate, or this multi-layer internal connection line is removed from this support plate in the mode of tearing off.
The present invention provides a kind of manufacture method of multiple layer inner connection line apparatus in addition, comprises: a support plate is provided; Form a multi-layer internal connection line on this support plate, wherein only adhere between this multi-layer internal connection line and this support plate in subregion essence; And cut this multi-layer internal connection line, make multiple layer inner connection line apparatus and this support plate natural separation that cuts down.Wherein this subregion can be at support plate outer peripheral areas, be spot distribution or distribute as net shape or the like.
By technological means of the present invention, must multi-layer internal connection line be separated with support plate in complicated modes such as solvent, laser compared to known techniques, the present invention can make the multiple layer inner connection line apparatus in mode simply, fast and cheaply.
[description of drawings]
Fig. 1 shows a kind of known method of separating support plate and multi-layer internal connection line with laser lift-off;
Fig. 2 A, 2B show as top view and the drawing in side sectional elevation that comprises the support plate of multi-layer internal connection line of the present invention;
Fig. 3 A-3D demonstration is electrically connected electronic component with the support plate that comprises multi-layer internal connection line of the present invention, and finishes a method of encapsulation;
Fig. 4 A-4D demonstration is electrically connected electronic component with the support plate that comprises multi-layer internal connection line of the present invention, and finishes the other method of encapsulation;
Fig. 5 shows after encapsulating as method for packing of the present invention, the remaining support plate that comprises multi-layer internal connection line;
Fig. 6 shows as constituency of the present invention adhering zone is latticed;
Fig. 7 shows as constituency of the present invention adhering zone is a point-like.
[embodiment]
Now with reference to graphic preferred embodiment of the present invention is described, each element all indicate reference symbol so that explanation with understand.Notice that the described embodiment of the invention only is to serve as illustrative, and non-limiting, exist unless particularly pointed out this kind restriction in an embodiment.
Fig. 2 A, 2B show as top view and the drawing in side sectional elevation that comprises the support plate of multi-layer internal connection line of the present invention.The illustrated multi-layer internal connection line of present embodiment is to be a two-sided substrate, the promptly positive and back side all is electrically connected to the outside, in this double-sided substrate, substrate front side is to be electrically connected to substrate back, but multi-layer internal connection line also can be other inner connection modes, as interior connection or other various situations of coplanar multiple spot, in addition, the number of plies of multi-layer internal connection line can should be used for suitable variation according to various also without limits.
In addition, must note in Fig. 2 A, 2B, only schematically illustrate a multi-layer internal connection line 19 is used as a substrate, but have the knack of this technology personage as can be known, a multi-layer internal connection line 19 can be made into hundreds of thousands of substrates in the successive process cutting, only represents for convenience to simplify with explanation at this.
In the present embodiment, support plate 11 is to use 6 o'clock Silicon Wafers, dielectric layer and metal level on support plate 11, overlap in regular turn to form multi-layer internal connection line 19, wherein dielectric layer the 12,14,16, the 18th, selects the pi PI (polyimide) of low-k (less than 4) for use, thickness is 8 μ m, last metal level 17 and lower metal layer 13 are selected the projection underlying metal (UBM of Cr/Cu/Ni/Au structure for use, under bump metallurgy), with the usefulness as the electrical connection of follow-up WU ball, middle metal level 15 is selected Cr/Cu/Cr multiple layer metal line for use.
On multi-layer internal connection line 19, can utilize engraving method or method for drilling holes to connect dielectric layer 18,14 or 16, make metal interconnecting to be electrically connected each other, or be electrically connected to the outside.
Must notice that in the present invention support plate can be all solid materials, comprises metal, glass, pottery, Silicon Wafer, sapphire substrate, GaAs, pi or the like.Dielectric layer material can be any organic material, comprise pi PI (polyimide), benzocyclobutene BCB (benzo-cyclobutene), polymetylmethacrylate (poly (methyl-methacrylate)), liquid crystal polymer LCP (liquid crystal polymer) or the like, for base plate for packaging is used, low-k, low dielectric consume helps at a high speed, the application of high-effect encapsulation, suitably engineering properties is (as thermal coefficient of expansion CTE, young's modulus) material is selected the engineering properties with coupling electronic component and multiple layer inner connection line apparatus, more can help the reliability of encapsulating products.The mode of dielectric layer coating can be rotary coating, plsitive mold coating, roller coating.Metal interconnecting can be made of engraving method, metal-stripping method (MetalLift-off) or the like mode.
In the present invention, it can be the primary characteristic of utilizing the support plate surface that the constituency is adhered to, or utilizes the mode that promotes surface energy, as handling or the like with the electricity slurry, or utilize to strengthen interface molecule crosslinked with the material of entwining, reinforcing agent that as silicon-coating methane is or the like mode is reached.Table one shows the example of the various constituencies adhering mode that various different carrier plate material and dielectric layer material can be selected for use, but is not limited thereto.
Table one:
| Carrier plate material | Dielectric layer | Attachment method | Attachment region not |
| Silicon silica glass aluminium silicon nitride | Pi | The reinforcing agent that silicomethane is | Office does not manage |
| Silicon | Pi | 1. be coated with special pi 2. sclerosis 3. comprehensive electricity slurries and handle 4. coating dielectric layers | Do not handle, when the electricity slurry is handled, do not need to block yet with shade |
| Silicon silica glass aluminium silicon nitride pottery | Pi | The chromium film of physical vapor deposition (PVD) | Do not handle, need during the chromium plated film to block with shade |
Then, illustrate and utilize the above-mentioned support plate that comprises multi-layer internal connection line to be electrically connected electronic component, and finish the method for encapsulation.
Fig. 3 A to Fig. 3 D demonstration is electrically connected electronic component with the support plate that comprises multi-layer internal connection line of the present invention, and finishes a method of encapsulation.Whether Fig. 3 A demonstration as of the present invention comprises the support plate 11 of multi-layer internal connection line 19, can test earlier, good to confirm its intraconnections situation; Then, shown in Fig. 3 B, one electronic component 21 is electrically connected in the mode of projection 22 chip bondings comprises on the multi-layer internal connection line 19, must notice that the quantity of electronic component is not limited to one, also be not limited to integrated circuit (IC), other elements such as passive device, printed circuit board (PCB) can be the element that multi-layer internal connection line 19 of the present invention is electrically connected, in addition, the juncture that is electrically connected also can be selected other modes, as routing, anisotropic conductive film ACF (anisotropic conductive film), surface adhering technology SMT (surface mounttechnology), BGA Package BGA (ball grid array), planar lattice array LGA (landgrid array), stitch grid array PGA (pin grid array) or the like; Then, shown in Fig. 3 C, encapsulate with sealing 23 on electronic component 21, sealing can be used as molding for epoxy resin (epoxy molding), box dam and filling epoxy resin (Dam ﹠amp; Fill Epoxy), box dam and filling gel (Dam ﹠amp; Fill Silicone) or the like, sealing region need can not kept sealing on appropriate area on whole multi-layer internal connection line 19 in addition, to keep the flexibility of multi-layer internal connection line 19 at ad-hoc location, to cooperate various application scenarios; At last, shown in Fig. 3 D, on the suitable position of multi-layer internal connection line 19, cut, the multiple layer inner connection line apparatus 24 that makes gained be packaged with electronic component 21 directly separates with support plate 11, double-sided substrate situation at present embodiment, will be again at substrate back with laser drill, make bottom UBM can be electrically connected to the outside, and finish the encapsulation of electronic component.
Fig. 4 A to Fig. 4 D demonstration is electrically connected electronic component with the support plate that comprises multi-layer internal connection line of the present invention, and finishes the other method of encapsulation.Fig. 4 A shows as the support plate 11 that comprises multi-layer internal connection line 19 of the present invention; Then, Fig. 4 B is presented on the suitable position of multi-layer internal connection line 19 and cuts, make the multiple layer inner connection line apparatus 25 of gained directly separate with support plate 11, double-sided substrate situation at present embodiment, will be again at substrate back with laser drill, make bottom UBM can be electrically connected to the outside, in addition, can test earlier, whether good to confirm the intraconnections situation; Then, shown in Fig. 4 C, one electronic component 26 is electrically connected in the mode of projection 27 chip bondings comprises on the multiple layer inner connection line apparatus 25, as previously mentioned, number of electronic components is not limited to one, also be not limited to integrated circuit (IC), other elements such as passive device, printed circuit board (PCB) can be the element that multiple layer inner connection line apparatus 25 of the present invention is electrically connected, in addition, the juncture that is electrically connected also can be selected other modes, as routing, anisotropic conductive film ACF, surface adhering technology SMT, BGA Package BGA, planar lattice array LGA, stitch grid array PGA or the like; Then, shown in Fig. 4 D, encapsulate with sealing 28 on electronic component 26, as aforementioned, sealing 28 can be used as molding for epoxy resin (epoxymolding), box dam and filling epoxy resin (Dam ﹠amp; Fill Epoxy), box dam and filling gel (Dam ﹠amp; Fill Silicone) or the like, sealing region need be on whole multiple layer inner connection line apparatus 25 in addition, can on appropriate area, not keep sealing, to keep the flexibility of multiple layer inner connection line apparatus 25 on ad-hoc location, cooperating various application scenarios, and finish the encapsulation of electronic component.
Above-mentioned example only illustrates the situation of electronic package on multiple layer inner connection line apparatus of the present invention, but the occupation mode of multiple layer inner connection line apparatus of the present invention is not limited thereto situation, the intermediary layer that multiple layer inner connection line apparatus of the present invention can also be connected with printed circuit board (PCB) as electronic component, the intermediary layer that printed circuit board (PCB) is connected with printed circuit board (PCB), the intermediary layer that is electrically connected each other between a plurality of electronic components, or the situation that is electrically connected of multiple layer inner connection line apparatus and other multiple layer inner connection line apparatus.
Another aspect of the present invention more comprises the recovery method for the support plate that comprises multi-layer internal connection line, Fig. 5 shows after above-mentioned two kinds of method for packing encapsulation, the remaining support plate that comprises multi-layer internal connection line, can be with the above-mentioned remaining support plate of multi-layer internal connection line that comprises with the various methods that remove the separate multiple layer internal connection-wire structure, this multi-layer internal connection line is separated with support plate, for example immerse in the mixed solution of sulfuric acid and hydrogen peroxide, remove multi-layer internal connection line in the mode of grinding, or directly tear off out the mode of multi-layer internal connection line, reuse and support plate can be reclaimed again.
The adhering zone of constituency attachment method is not limited to the outer peripheral areas of the foregoing description, it can be different shape, as latticed, point-like, in follow-up various processing procedures, produce various defectives such as delamination, bubble as long as be unlikely to, Fig. 6 shows as constituency of the present invention adhering zone is latticed situation, and Fig. 7 shows as constituency of the present invention adhering zone is the situation of point-like.
The present invention with way of illustration narration explanation, should be appreciated that above-mentioned explanation only is descriptive and non-limiting.Haveing the knack of this skill personage can be that various change of the present invention is revised according to the above description.Therefore, the present invention will comprise all modifications that fall into this case protection range and change situation.
[explanation of symbol]
1 support plate
2 polymeric layers
3 metal levels
4 multi-layer internal connection lines
11 support plates
12 dielectric layers
13 lower metal layers
14 dielectric layers
15 metal levels
16 dielectric layers
Metal level on 17
18 dielectric layers
19 multi-layer internal connection lines
20 zones
21 electronic components
22 projections
23 sealings
24 multiple layer inner connection line apparatus
25 multiple layer inner connection line apparatus
26 electronic components
27 projections
28 sealings.
Claims (13)
1. support plate that comprises multi-layer internal connection line is characterized in that: comprise:
One support plate; And
One multi-layer internal connection line, the position is wherein only adhered in subregion essence between this multi-layer internal connection line and this support plate on this support plate.
2. the support plate that comprises multi-layer internal connection line as claimed in claim 1 is characterized in that: wherein the subregion adhered to of this essence be at support plate outer peripheral areas, in support plate, be spot distribution or in support plate, distribute as net shape.
3. manufacture method that comprises the support plate of multi-layer internal connection line is characterized in that: comprise following steps:
One support plate is provided; And
Form a multi-layer internal connection line on this support plate, wherein only adhere between this multi-layer internal connection line and this support plate in subregion essence.
4. the manufacture method that comprises the support plate of multi-layer internal connection line as claimed in claim 3 is characterized in that: this essence attachment portion zone be at support plate outer peripheral areas, in support plate, be spot distribution or in support plate, distribute as net shape.
5. electron element packaging method is characterized in that: comprise following steps:
A support plate that comprises multi-layer internal connection line as claimed in claim 1 is provided;
Be electrically connected at least one electronic component and comprise the support plate of multi-layer internal connection line to this;
Sealing is on this electronic component; And
Cut this multi-layer internal connection line, the feasible multiple layer inner connection line apparatus that is packaged with electronic component and this support plate natural separation that cuts down.
6. electron element packaging method as claimed in claim 5, it is characterized in that: this electronic component is a plurality of, sealing is in being only not have sealing on the specific region of support plate of this multi-layer internal connection line of these a plurality of electronic components on these a plurality of electronic components, making does not have sealing on the remaining area, uses and keeps the flexibility that this is packaged with the multiple layer inner connection line apparatus of electronic component.
7. electron element packaging method is characterized in that: comprise following steps:
A support plate that comprises multi-layer internal connection line as claimed in claim 1 is provided;
Cut this multi-layer internal connection line, feasible multiple layer inner connection line apparatus and this support plate natural separation that cuts down;
Be electrically connected at least one electronic component to this multiple layer inner connection line apparatus; And
Sealing is on this electronic component.
8. electron element packaging method as claimed in claim 7, it is characterized in that: wherein this electronic component is a plurality of, sealing is on these a plurality of electronic components being only sealing on this multiple layer inner connection line apparatus specific region of these a plurality of electronic components of nothing, making does not have sealing on the remaining area, uses and keeps the flexibility that this is packaged with the multiple layer inner connection line apparatus of electronic component.
9. support plate recovery method is characterized in that: comprise following steps:
One support plate that comprises multi-layer internal connection line as claimed in claim 1 is provided, and
This multi-layer internal connection line is removed from this support plate.
10. support plate recovery method as claimed in claim 9 is characterized in that: this removes step and is to use sulfuric acid and mixed solution of hydrogen peroxide, carries out this multi-layer internal connection line is removed from this support plate with lapping mode or in the mode of tearing off.
11. support plate recovery method as claimed in claim 10 is characterized in that: this multi-layer internal connection line is to have part to be cut to remove.
12. the manufacture method of a multiple layer inner connection line apparatus is characterized in that: comprise following steps:
One support plate is provided;
On this support plate, form a multi-layer internal connection line, wherein only adhere between this multi-layer internal connection line and this support plate in subregion essence; And
Cut this multi-layer internal connection line, feasible multiple layer inner connection line apparatus and this support plate natural separation that cuts down.
13. the manufacture method of multiple layer inner connection line apparatus as claimed in claim 12 is characterized in that: wherein the subregion adhered to of this essence be at support plate outer peripheral areas, in support plate, be spot distribution or in support plate, distribute as net shape.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610005788 CN1996582B (en) | 2006-01-06 | 2006-01-06 | Carrier board including the multi-layer internal connection line and its making, recycling and application method |
| HK07114167.1A HK1108973A1 (en) | 2006-01-06 | 2007-12-27 | Substrate with multi-layer interconnection structure and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610005788 CN1996582B (en) | 2006-01-06 | 2006-01-06 | Carrier board including the multi-layer internal connection line and its making, recycling and application method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1996582A true CN1996582A (en) | 2007-07-11 |
| CN1996582B CN1996582B (en) | 2012-02-15 |
Family
ID=38251597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610005788 Expired - Fee Related CN1996582B (en) | 2006-01-06 | 2006-01-06 | Carrier board including the multi-layer internal connection line and its making, recycling and application method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN1996582B (en) |
| HK (1) | HK1108973A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009006762A1 (en) * | 2007-07-12 | 2009-01-15 | Princo Corp. | Multilayer substrate and fabricating method thereof |
| US8266797B2 (en) | 2007-06-22 | 2012-09-18 | Princo Middle East Fze | Method of manufacturing a multi-layer substrate |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2823596B1 (en) * | 2001-04-13 | 2004-08-20 | Commissariat Energie Atomique | SUBSTRATE OR DISMOUNTABLE STRUCTURE AND METHOD OF MAKING SAME |
-
2006
- 2006-01-06 CN CN 200610005788 patent/CN1996582B/en not_active Expired - Fee Related
-
2007
- 2007-12-27 HK HK07114167.1A patent/HK1108973A1/en not_active IP Right Cessation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8266797B2 (en) | 2007-06-22 | 2012-09-18 | Princo Middle East Fze | Method of manufacturing a multi-layer substrate |
| US8278562B2 (en) | 2007-06-22 | 2012-10-02 | Princo Middle East Fze | Multi-layer substrate and manufacturing method thereof |
| WO2009006762A1 (en) * | 2007-07-12 | 2009-01-15 | Princo Corp. | Multilayer substrate and fabricating method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1996582B (en) | 2012-02-15 |
| HK1108973A1 (en) | 2008-05-23 |
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