GB9802137D0 - Cleasing apparatus and method - Google Patents

Cleasing apparatus and method

Info

Publication number
GB9802137D0
GB9802137D0 GBGB9802137.1A GB9802137A GB9802137D0 GB 9802137 D0 GB9802137 D0 GB 9802137D0 GB 9802137 A GB9802137 A GB 9802137A GB 9802137 D0 GB9802137 D0 GB 9802137D0
Authority
GB
United Kingdom
Prior art keywords
cleasing
cleasing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB9802137.1A
Other versions
GB2321782A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of GB9802137D0 publication Critical patent/GB9802137D0/en
Publication of GB2321782A publication Critical patent/GB2321782A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Prevention Of Fouling (AREA)
GB9802137A 1997-01-31 1998-01-30 Cleansing objects such as semiconductor wafers Withdrawn GB2321782A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1837797A JPH10216660A (en) 1997-01-31 1997-01-31 Washing device

Publications (2)

Publication Number Publication Date
GB9802137D0 true GB9802137D0 (en) 1998-04-01
GB2321782A GB2321782A (en) 1998-08-05

Family

ID=11970034

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9802137A Withdrawn GB2321782A (en) 1997-01-31 1998-01-30 Cleansing objects such as semiconductor wafers

Country Status (3)

Country Link
JP (1) JPH10216660A (en)
DE (1) DE19803201A1 (en)
GB (1) GB2321782A (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4326553A (en) * 1980-08-28 1982-04-27 Rca Corporation Megasonic jet cleaner apparatus
JP2653511B2 (en) * 1989-03-30 1997-09-17 株式会社東芝 Semiconductor device cleaning method and cleaning apparatus
US5186192A (en) * 1990-12-14 1993-02-16 Shin-Etsu Handotai Co., Ltd. Apparatus for cleaning silicon wafer
US5368054A (en) * 1993-12-17 1994-11-29 International Business Machines Corporation Ultrasonic jet semiconductor wafer cleaning apparatus
JP2900788B2 (en) * 1994-03-22 1999-06-02 信越半導体株式会社 Single wafer processing equipment

Also Published As

Publication number Publication date
JPH10216660A (en) 1998-08-18
DE19803201A1 (en) 1998-08-06
GB2321782A (en) 1998-08-05

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)