GB9722305D0 - Method and apparatus - Google Patents

Method and apparatus

Info

Publication number
GB9722305D0
GB9722305D0 GBGB9722305.1A GB9722305A GB9722305D0 GB 9722305 D0 GB9722305 D0 GB 9722305D0 GB 9722305 A GB9722305 A GB 9722305A GB 9722305 D0 GB9722305 D0 GB 9722305D0
Authority
GB
United Kingdom
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB9722305.1A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alphr Technology Ltd
Original Assignee
Alphr Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alphr Technology Ltd filed Critical Alphr Technology Ltd
Priority to GBGB9722305.1A priority Critical patent/GB9722305D0/en
Publication of GB9722305D0 publication Critical patent/GB9722305D0/en
Priority to AU95479/98A priority patent/AU9547998A/en
Priority to PCT/GB1998/003095 priority patent/WO1999021676A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
GBGB9722305.1A 1997-10-23 1997-10-23 Method and apparatus Ceased GB9722305D0 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GBGB9722305.1A GB9722305D0 (en) 1997-10-23 1997-10-23 Method and apparatus
AU95479/98A AU9547998A (en) 1997-10-23 1998-10-16 Soldering method and apparatus
PCT/GB1998/003095 WO1999021676A1 (en) 1997-10-23 1998-10-16 Soldering method and apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB9722305.1A GB9722305D0 (en) 1997-10-23 1997-10-23 Method and apparatus

Publications (1)

Publication Number Publication Date
GB9722305D0 true GB9722305D0 (en) 1997-12-17

Family

ID=10820916

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB9722305.1A Ceased GB9722305D0 (en) 1997-10-23 1997-10-23 Method and apparatus

Country Status (3)

Country Link
AU (1) AU9547998A (en)
GB (1) GB9722305D0 (en)
WO (1) WO1999021676A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10308817A1 (en) * 2003-02-27 2004-09-09 Endress + Hauser Gmbh + Co. Kg Printed circuit board and method for fixing wired components on the printed circuit board
EP1878527A1 (en) * 2006-07-10 2008-01-16 Linde Aktiengesellschaft Process and apparatus for reflow soldering with two different gases
DE102013217952B3 (en) * 2013-09-09 2014-11-06 Ersa Gmbh Device for supplying a hot gas stream
JP7426771B2 (en) * 2018-04-11 2024-02-02 太陽誘電株式会社 Manufacturing method of multilayer ceramic capacitor
US10868401B1 (en) * 2020-03-04 2020-12-15 Onanon, Inc. Robotic wire termination system

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1008311A (en) * 1973-08-22 1977-04-12 William S. Fortune Directed heated air flow apparatus
EP0309665B1 (en) * 1987-08-31 1993-06-09 Siemens Aktiengesellschaft Soldering head for soldering and unsoldering components using hot gas, particularly for surface-mounted components (smd)
KR910005959B1 (en) * 1988-01-19 1991-08-09 니혼 덴네쯔 게이기 가부시끼가이샤 Reflow soldering device
US4971554A (en) * 1988-08-30 1990-11-20 Semiconductor Equipment Corporation Multi-nozzle surface mount rework system
US5560531A (en) * 1994-12-14 1996-10-01 O.K. Industries, Inc. Reflow minioven for electrical component
DE19527398A1 (en) * 1995-07-27 1997-01-30 Philips Patentverwaltung Process for soldering components on a carrier film

Also Published As

Publication number Publication date
WO1999021676A1 (en) 1999-05-06
AU9547998A (en) 1999-05-17

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)