GB2318075B - Method and apparatus for washing silicon ingot with water to remove particulate matter - Google Patents
Method and apparatus for washing silicon ingot with water to remove particulate matterInfo
- Publication number
- GB2318075B GB2318075B GB9800212A GB9800212A GB2318075B GB 2318075 B GB2318075 B GB 2318075B GB 9800212 A GB9800212 A GB 9800212A GB 9800212 A GB9800212 A GB 9800212A GB 2318075 B GB2318075 B GB 2318075B
- Authority
- GB
- United Kingdom
- Prior art keywords
- water
- particulate matter
- silicon ingot
- remove particulate
- washing silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7201745A JPH0936080A (en) | 1995-07-13 | 1995-07-13 | Method for washing machined silicon ingot |
PCT/US1996/011627 WO1997002905A1 (en) | 1995-07-13 | 1996-07-12 | Method and apparatus for washing silicon ingot with water to remove particulate matter |
Publications (3)
Publication Number | Publication Date |
---|---|
GB9800212D0 GB9800212D0 (en) | 1998-03-04 |
GB2318075A GB2318075A (en) | 1998-04-15 |
GB2318075B true GB2318075B (en) | 1999-03-03 |
Family
ID=16446246
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9800212A Expired - Fee Related GB2318075B (en) | 1995-07-13 | 1996-07-12 | Method and apparatus for washing silicon ingot with water to remove particulate matter |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPH0936080A (en) |
KR (1) | KR19990028611A (en) |
DE (1) | DE19681497T1 (en) |
GB (1) | GB2318075B (en) |
WO (1) | WO1997002905A1 (en) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06314070A (en) * | 1992-09-24 | 1994-11-08 | Shiina:Kk | Bollard and guide using it |
DE19742680B4 (en) * | 1997-09-26 | 2006-03-02 | Siltronic Ag | Cleaning process for disc-shaped material |
WO1999064855A1 (en) * | 1998-06-08 | 1999-12-16 | Memc Electronic Materials, Inc. | Process for monitoring the concentration of metallic impurities in a wafer cleaning solution |
DE60022619T2 (en) * | 2000-04-01 | 2006-03-16 | Robert Bosch Gmbh | Method and device for charging a piezoelectric element |
US6481447B1 (en) * | 2000-09-27 | 2002-11-19 | Lam Research Corporation | Fluid delivery ring and methods for making and implementing the same |
KR20030035152A (en) | 2001-10-30 | 2003-05-09 | 주식회사 하이닉스반도체 | Method for fabricating semiconductor wafer |
CN100587937C (en) * | 2005-11-07 | 2010-02-03 | 袁建中 | Silicon slice processing method for solar battery |
DE102008004548A1 (en) * | 2008-01-15 | 2009-07-16 | Rec Scan Wafer As | Wafer batch cleaning |
US8241432B2 (en) * | 2008-03-07 | 2012-08-14 | Mei, Llc | Solar wafer cleaning systems, apparatus and methods |
DE102009035343A1 (en) | 2009-07-23 | 2011-01-27 | Gebr. Schmid Gmbh & Co. | Method and device for cleaning substrates on a support |
DE102009035341A1 (en) | 2009-07-23 | 2011-01-27 | Gebr. Schmid Gmbh & Co. | Device for cleaning substrates on a support |
KR101064268B1 (en) * | 2011-04-05 | 2011-09-14 | 한국생산기술연구원 | Wafer support apparatus installed on wire saw |
CN102275234B (en) * | 2011-06-29 | 2014-03-12 | 沈利军 | Automatic degumming method and device for multi-wire cutting of monocrystal/ polycrystalline silicon wafer |
CN102514113A (en) * | 2012-01-06 | 2012-06-27 | 无锡市奥曼特科技有限公司 | Full-automatic silicon rod viscose board degumming equipment |
KR101428585B1 (en) * | 2013-04-24 | 2014-08-12 | 한국에너지기술연구원 | Method and Apparatus for cutting semiconductor wafers using wire saw |
CN105642619A (en) * | 2015-03-04 | 2016-06-08 | 张磊 | Square billet washing, blow-drying and loosening machine |
CN108515628B (en) * | 2018-07-12 | 2020-07-10 | 深圳市旺多光学有限公司 | Be used for glass-cutting and abluent device |
KR102221914B1 (en) * | 2018-12-03 | 2021-03-03 | 일륭기공(주) | Spline groove foreign material removal device to shaft joint |
CN112871813A (en) * | 2019-11-29 | 2021-06-01 | 隆基绿能科技股份有限公司 | Cleaning method and cleaning device for slicing machine |
CN112440394A (en) * | 2020-11-18 | 2021-03-05 | 连城凯克斯科技有限公司 | Automatic spraying device for material lifting process of wire cutting machine |
CN112846920A (en) * | 2021-02-08 | 2021-05-28 | 南京铁道职业技术学院 | Mechanical equipment processing work piece belt cleaning device |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4484417A (en) * | 1982-11-22 | 1984-11-27 | W. J. Savage Company | Sawing apparatus |
US4619081A (en) * | 1985-02-28 | 1986-10-28 | General Signal Corporation | Combined nozzle with air foil |
EP0269997A2 (en) * | 1986-11-28 | 1988-06-08 | Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH | Process and device for the correction of the cutting direction for sawing crystal rods or blocks |
US4941489A (en) * | 1987-05-06 | 1990-07-17 | Dan Science Co., Ltd. | Carrier cleaning and drying apparatus |
US4949700A (en) * | 1987-12-17 | 1990-08-21 | Tokyou Seimitsu Co., Ltd. | Ingot support device in slicing apparatus |
US4997490A (en) * | 1990-08-02 | 1991-03-05 | Bold Plastics, Inc. | Method of cleaning and rinsing wafers |
US5186192A (en) * | 1990-12-14 | 1993-02-16 | Shin-Etsu Handotai Co., Ltd. | Apparatus for cleaning silicon wafer |
US5421905A (en) * | 1991-04-02 | 1995-06-06 | Tokyo Electron Limited | Method for washing wafers |
US5427644A (en) * | 1993-01-11 | 1995-06-27 | Tokyo Seimitsu Co., Ltd. | Method of manufacturing semiconductor wafer and system therefor |
US5447890A (en) * | 1993-03-24 | 1995-09-05 | Shin-Etsu Handotai Co., Ltd. | Method for production of wafer |
US5484326A (en) * | 1992-11-30 | 1996-01-16 | Shin-Etsu Handotai Company, Ltd. | Semiconductor ingot machining method |
EP0762483A1 (en) * | 1995-09-06 | 1997-03-12 | Nippei Toyama Corporation | Wafer processing system |
-
1995
- 1995-07-13 JP JP7201745A patent/JPH0936080A/en active Pending
-
1996
- 1996-07-12 DE DE19681497T patent/DE19681497T1/en not_active Withdrawn
- 1996-07-12 WO PCT/US1996/011627 patent/WO1997002905A1/en active IP Right Grant
- 1996-07-12 KR KR1019970709933A patent/KR19990028611A/en active IP Right Grant
- 1996-07-12 GB GB9800212A patent/GB2318075B/en not_active Expired - Fee Related
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4484417A (en) * | 1982-11-22 | 1984-11-27 | W. J. Savage Company | Sawing apparatus |
US4619081A (en) * | 1985-02-28 | 1986-10-28 | General Signal Corporation | Combined nozzle with air foil |
EP0269997A2 (en) * | 1986-11-28 | 1988-06-08 | Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH | Process and device for the correction of the cutting direction for sawing crystal rods or blocks |
US4941489A (en) * | 1987-05-06 | 1990-07-17 | Dan Science Co., Ltd. | Carrier cleaning and drying apparatus |
US4949700A (en) * | 1987-12-17 | 1990-08-21 | Tokyou Seimitsu Co., Ltd. | Ingot support device in slicing apparatus |
US4997490A (en) * | 1990-08-02 | 1991-03-05 | Bold Plastics, Inc. | Method of cleaning and rinsing wafers |
US5186192A (en) * | 1990-12-14 | 1993-02-16 | Shin-Etsu Handotai Co., Ltd. | Apparatus for cleaning silicon wafer |
US5421905A (en) * | 1991-04-02 | 1995-06-06 | Tokyo Electron Limited | Method for washing wafers |
US5484326A (en) * | 1992-11-30 | 1996-01-16 | Shin-Etsu Handotai Company, Ltd. | Semiconductor ingot machining method |
US5427644A (en) * | 1993-01-11 | 1995-06-27 | Tokyo Seimitsu Co., Ltd. | Method of manufacturing semiconductor wafer and system therefor |
US5447890A (en) * | 1993-03-24 | 1995-09-05 | Shin-Etsu Handotai Co., Ltd. | Method for production of wafer |
EP0762483A1 (en) * | 1995-09-06 | 1997-03-12 | Nippei Toyama Corporation | Wafer processing system |
Also Published As
Publication number | Publication date |
---|---|
GB9800212D0 (en) | 1998-03-04 |
JPH0936080A (en) | 1997-02-07 |
DE19681497T1 (en) | 1998-12-17 |
GB2318075A (en) | 1998-04-15 |
WO1997002905A1 (en) | 1997-01-30 |
KR19990028611A (en) | 1999-04-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB2318075B (en) | Method and apparatus for washing silicon ingot with water to remove particulate matter | |
EP0880470A4 (en) | Apparatus and method for water purification | |
SG63753A1 (en) | Apparatus for and method of cleaning objects to be processed | |
HUT66489A (en) | Process and apparatus for the purification of water | |
EP0944552A4 (en) | Method for removing toxic substances in water | |
EP0741111A3 (en) | Apparatus and method for purifying polluted water | |
IL116813A0 (en) | Process and apparatus for water purification | |
SG63754A1 (en) | Apparatus for and method of cleaning objects to be processed | |
IL121884A0 (en) | Filter means and method for the purification of water | |
IL118958A0 (en) | Apparatus and method for reducing water use | |
ZA988965B (en) | Apparatus and method for the purification of water | |
HK1008988A1 (en) | Method of purifying water and apparatus therefor | |
AU3920893A (en) | Method and apparatus for purifying waste water | |
GB2290985B (en) | An apparatus and method for purifying water | |
GB9609840D0 (en) | Apparatus for use in relation to mud buckets | |
IL124875A (en) | Process for the desalination of water and apparatus for carrying out the process | |
EE03343B1 (en) | Method and apparatus for purifying the liquid to be purified | |
IL108956A0 (en) | Method and apparatus for purifying waste water | |
FI101375B1 (en) | Process and device for removing fluoride from water | |
GB9022862D0 (en) | Method and apparatus for water purification | |
IL112341A0 (en) | Method and apparatus for water filtration | |
IL101392A (en) | Water purification apparatus and method | |
IL107107A0 (en) | Method and apparatus for water purification | |
GB9211482D0 (en) | Method and apparatus for saving waste water | |
IL135380A0 (en) | Apparatus and method for the purification of water |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20020712 |