GB2318075A - Method and apparatus for washing silicon ingot with water to remove particulate matter - Google Patents

Method and apparatus for washing silicon ingot with water to remove particulate matter

Info

Publication number
GB2318075A
GB2318075A GB9800212A GB9800212A GB2318075A GB 2318075 A GB2318075 A GB 2318075A GB 9800212 A GB9800212 A GB 9800212A GB 9800212 A GB9800212 A GB 9800212A GB 2318075 A GB2318075 A GB 2318075A
Authority
GB
United Kingdom
Prior art keywords
ingot
silicon ingot
detergent
water
particulate matter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB9800212A
Other versions
GB9800212D0 (en
GB2318075B (en
Inventor
Yoshihiro Suzuki
Koichi Kato
Keiichi Takami
Ryoichi Kawamura
Takehiro Watanabe
Masahiro Kosako
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SunEdison Inc
Original Assignee
SunEdison Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SunEdison Inc filed Critical SunEdison Inc
Publication of GB9800212D0 publication Critical patent/GB9800212D0/en
Publication of GB2318075A publication Critical patent/GB2318075A/en
Application granted granted Critical
Publication of GB2318075B publication Critical patent/GB2318075B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

A method and apparatus for washing a sliced silicon ingot (2) reduces the consumption of detergent used to clean the ingot (2) after it is sliced to define individual semiconductor wafers (1). The ingot (2) is taken as a unit mounted to a holder (3) after slicing to a pre-washing machine. The machine sprays jets (12) of warm to hot water onto the ingot (2). The water spray removes much of the dust. Thus when the ingot (2) is subsequently washed with detergent, less dust must be removed thereby increasing the effective performance life of a given quantity of detergent.
GB9800212A 1995-07-13 1996-07-12 Method and apparatus for washing silicon ingot with water to remove particulate matter Expired - Fee Related GB2318075B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7201745A JPH0936080A (en) 1995-07-13 1995-07-13 Method for washing machined silicon ingot
PCT/US1996/011627 WO1997002905A1 (en) 1995-07-13 1996-07-12 Method and apparatus for washing silicon ingot with water to remove particulate matter

Publications (3)

Publication Number Publication Date
GB9800212D0 GB9800212D0 (en) 1998-03-04
GB2318075A true GB2318075A (en) 1998-04-15
GB2318075B GB2318075B (en) 1999-03-03

Family

ID=16446246

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9800212A Expired - Fee Related GB2318075B (en) 1995-07-13 1996-07-12 Method and apparatus for washing silicon ingot with water to remove particulate matter

Country Status (5)

Country Link
JP (1) JPH0936080A (en)
KR (1) KR19990028611A (en)
DE (1) DE19681497T1 (en)
GB (1) GB2318075B (en)
WO (1) WO1997002905A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999064855A1 (en) * 1998-06-08 1999-12-16 Memc Electronic Materials, Inc. Process for monitoring the concentration of metallic impurities in a wafer cleaning solution
US8387636B2 (en) 2009-07-23 2013-03-05 Gebr. Schmid Gmbh Device for cleaning substrates on a carrier
US8524008B2 (en) 2009-07-20 2013-09-03 Gebr. Schmid Gmbh Method and device for cleaning substrates on a carrier

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06314070A (en) * 1992-09-24 1994-11-08 Shiina:Kk Bollard and guide using it
DE19742680B4 (en) * 1997-09-26 2006-03-02 Siltronic Ag Cleaning process for disc-shaped material
DE60022619T2 (en) * 2000-04-01 2006-03-16 Robert Bosch Gmbh Method and device for charging a piezoelectric element
US6481447B1 (en) * 2000-09-27 2002-11-19 Lam Research Corporation Fluid delivery ring and methods for making and implementing the same
KR20030035152A (en) 2001-10-30 2003-05-09 주식회사 하이닉스반도체 Method for fabricating semiconductor wafer
CN100587937C (en) * 2005-11-07 2010-02-03 袁建中 Silicon slice processing method for solar battery
DE102008004548A1 (en) * 2008-01-15 2009-07-16 Rec Scan Wafer As Wafer batch cleaning
US8241432B2 (en) * 2008-03-07 2012-08-14 Mei, Llc Solar wafer cleaning systems, apparatus and methods
KR101064268B1 (en) * 2011-04-05 2011-09-14 한국생산기술연구원 Wafer support apparatus installed on wire saw
CN102275234B (en) * 2011-06-29 2014-03-12 沈利军 Automatic degumming method and device for multi-wire cutting of monocrystal/ polycrystalline silicon wafer
CN102514113A (en) * 2012-01-06 2012-06-27 无锡市奥曼特科技有限公司 Full-automatic silicon rod viscose board degumming equipment
KR101428585B1 (en) * 2013-04-24 2014-08-12 한국에너지기술연구원 Method and Apparatus for cutting semiconductor wafers using wire saw
CN105642619A (en) * 2015-03-04 2016-06-08 张磊 Square billet washing, blow-drying and loosening machine
CN108515628B (en) * 2018-07-12 2020-07-10 深圳市旺多光学有限公司 Be used for glass-cutting and abluent device
KR102221914B1 (en) * 2018-12-03 2021-03-03 일륭기공(주) Spline groove foreign material removal device to shaft joint
CN112871813A (en) * 2019-11-29 2021-06-01 隆基绿能科技股份有限公司 Cleaning method and cleaning device for slicing machine
CN112440394A (en) * 2020-11-18 2021-03-05 连城凯克斯科技有限公司 Automatic spraying device for material lifting process of wire cutting machine
CN112846920A (en) * 2021-02-08 2021-05-28 南京铁道职业技术学院 Mechanical equipment processing work piece belt cleaning device

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4484417A (en) * 1982-11-22 1984-11-27 W. J. Savage Company Sawing apparatus
US4619081A (en) * 1985-02-28 1986-10-28 General Signal Corporation Combined nozzle with air foil
EP0269997A2 (en) * 1986-11-28 1988-06-08 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH Process and device for the correction of the cutting direction for sawing crystal rods or blocks
US4941489A (en) * 1987-05-06 1990-07-17 Dan Science Co., Ltd. Carrier cleaning and drying apparatus
US4949700A (en) * 1987-12-17 1990-08-21 Tokyou Seimitsu Co., Ltd. Ingot support device in slicing apparatus
US4997490A (en) * 1990-08-02 1991-03-05 Bold Plastics, Inc. Method of cleaning and rinsing wafers
US5186192A (en) * 1990-12-14 1993-02-16 Shin-Etsu Handotai Co., Ltd. Apparatus for cleaning silicon wafer
US5421905A (en) * 1991-04-02 1995-06-06 Tokyo Electron Limited Method for washing wafers
US5427644A (en) * 1993-01-11 1995-06-27 Tokyo Seimitsu Co., Ltd. Method of manufacturing semiconductor wafer and system therefor
US5447890A (en) * 1993-03-24 1995-09-05 Shin-Etsu Handotai Co., Ltd. Method for production of wafer
US5484326A (en) * 1992-11-30 1996-01-16 Shin-Etsu Handotai Company, Ltd. Semiconductor ingot machining method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5950643A (en) * 1995-09-06 1999-09-14 Miyazaki; Takeshiro Wafer processing system

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4484417A (en) * 1982-11-22 1984-11-27 W. J. Savage Company Sawing apparatus
US4619081A (en) * 1985-02-28 1986-10-28 General Signal Corporation Combined nozzle with air foil
EP0269997A2 (en) * 1986-11-28 1988-06-08 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH Process and device for the correction of the cutting direction for sawing crystal rods or blocks
US4941489A (en) * 1987-05-06 1990-07-17 Dan Science Co., Ltd. Carrier cleaning and drying apparatus
US4949700A (en) * 1987-12-17 1990-08-21 Tokyou Seimitsu Co., Ltd. Ingot support device in slicing apparatus
US4997490A (en) * 1990-08-02 1991-03-05 Bold Plastics, Inc. Method of cleaning and rinsing wafers
US5186192A (en) * 1990-12-14 1993-02-16 Shin-Etsu Handotai Co., Ltd. Apparatus for cleaning silicon wafer
US5421905A (en) * 1991-04-02 1995-06-06 Tokyo Electron Limited Method for washing wafers
US5484326A (en) * 1992-11-30 1996-01-16 Shin-Etsu Handotai Company, Ltd. Semiconductor ingot machining method
US5427644A (en) * 1993-01-11 1995-06-27 Tokyo Seimitsu Co., Ltd. Method of manufacturing semiconductor wafer and system therefor
US5447890A (en) * 1993-03-24 1995-09-05 Shin-Etsu Handotai Co., Ltd. Method for production of wafer

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999064855A1 (en) * 1998-06-08 1999-12-16 Memc Electronic Materials, Inc. Process for monitoring the concentration of metallic impurities in a wafer cleaning solution
US8524008B2 (en) 2009-07-20 2013-09-03 Gebr. Schmid Gmbh Method and device for cleaning substrates on a carrier
US8387636B2 (en) 2009-07-23 2013-03-05 Gebr. Schmid Gmbh Device for cleaning substrates on a carrier

Also Published As

Publication number Publication date
GB9800212D0 (en) 1998-03-04
JPH0936080A (en) 1997-02-07
DE19681497T1 (en) 1998-12-17
GB2318075B (en) 1999-03-03
WO1997002905A1 (en) 1997-01-30
KR19990028611A (en) 1999-04-15

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20020712