|
US4365222A
(en)
*
|
1981-04-06 |
1982-12-21 |
Bell Telephone Laboratories, Incorporated |
Stripline support assembly
|
|
FR2640083B1
(en)
*
|
1988-12-06 |
1991-05-03 |
Thomson Csf |
SUPPORT FOR MICROWAVE TRANSMISSION LINE, ESPECIALLY OF THE PLATE TYPE
|
|
US20020125967A1
(en)
*
|
2000-11-03 |
2002-09-12 |
Garrett Richard H. |
Air dielectric backplane interconnection system
|
|
TWI238513B
(en)
|
2003-03-04 |
2005-08-21 |
Rohm & Haas Elect Mat |
Coaxial waveguide microstructures and methods of formation thereof
|
|
JP2008188755A
(en)
|
2006-12-30 |
2008-08-21 |
Rohm & Haas Electronic Materials Llc |
Three-dimensional microstructures and their formation method
|
|
US7898356B2
(en)
|
2007-03-20 |
2011-03-01 |
Nuvotronics, Llc |
Coaxial transmission line microstructures and methods of formation thereof
|
|
KR101593686B1
(en)
|
2007-03-20 |
2016-02-12 |
누보트로닉스, 엘.엘.씨 |
Integrated electronic components and methods of formation thereof
|
|
US8659371B2
(en)
*
|
2009-03-03 |
2014-02-25 |
Bae Systems Information And Electronic Systems Integration Inc. |
Three-dimensional matrix structure for defining a coaxial transmission line channel
|
|
US20110123783A1
(en)
|
2009-11-23 |
2011-05-26 |
David Sherrer |
Multilayer build processses and devices thereof
|
|
US8917150B2
(en)
*
|
2010-01-22 |
2014-12-23 |
Nuvotronics, Llc |
Waveguide balun having waveguide structures disposed over a ground plane and having probes located in channels
|
|
KR101796098B1
(en)
*
|
2010-01-22 |
2017-11-10 |
누보트로닉스, 인크. |
Thermal management
|
|
US8866300B1
(en)
|
2011-06-05 |
2014-10-21 |
Nuvotronics, Llc |
Devices and methods for solder flow control in three-dimensional microstructures
|
|
US8814601B1
(en)
|
2011-06-06 |
2014-08-26 |
Nuvotronics, Llc |
Batch fabricated microconnectors
|
|
WO2013010108A1
(en)
|
2011-07-13 |
2013-01-17 |
Nuvotronics, Llc |
Methods of fabricating electronic and mechanical structures
|
|
JP5935675B2
(en)
*
|
2012-12-03 |
2016-06-15 |
日立金属株式会社 |
Transmission line and antenna device
|
|
US9325044B2
(en)
|
2013-01-26 |
2016-04-26 |
Nuvotronics, Inc. |
Multi-layer digital elliptic filter and method
|
|
US9306255B1
(en)
|
2013-03-15 |
2016-04-05 |
Nuvotronics, Inc. |
Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other
|
|
US9306254B1
(en)
|
2013-03-15 |
2016-04-05 |
Nuvotronics, Inc. |
Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration
|
|
EP2876747B1
(en)
*
|
2013-11-21 |
2018-04-25 |
Spinner GmbH |
RF connector assembly
|
|
WO2015109208A2
(en)
|
2014-01-17 |
2015-07-23 |
Nuvotronics, Llc |
Wafer scale test interface unit: low loss and high isolation devices and methods for high speed and high density mixed signal interconnects and contactors
|
|
US10847469B2
(en)
|
2016-04-26 |
2020-11-24 |
Cubic Corporation |
CTE compensation for wafer-level and chip-scale packages and assemblies
|
|
US10511073B2
(en)
|
2014-12-03 |
2019-12-17 |
Cubic Corporation |
Systems and methods for manufacturing stacked circuits and transmission lines
|
|
US10319654B1
(en)
|
2017-12-01 |
2019-06-11 |
Cubic Corporation |
Integrated chip scale packages
|