EP2764536A1 - Substrate turning device - Google Patents

Substrate turning device

Info

Publication number
EP2764536A1
EP2764536A1 EP11779222.6A EP11779222A EP2764536A1 EP 2764536 A1 EP2764536 A1 EP 2764536A1 EP 11779222 A EP11779222 A EP 11779222A EP 2764536 A1 EP2764536 A1 EP 2764536A1
Authority
EP
European Patent Office
Prior art keywords
substrate
substrates
turning
carrier
turning device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11779222.6A
Other languages
German (de)
French (fr)
Inventor
Joachim Mai
Daniel Oelsner
Thilo Richter
Thomas Helbig
Lutz Eismann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meyer Burger Germany GmbH
Original Assignee
Roth and Rau AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Roth and Rau AG filed Critical Roth and Rau AG
Publication of EP2764536A1 publication Critical patent/EP2764536A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718Changing orientation of the substrate, e.g. from a horizontal position to a vertical position

Definitions

  • the present invention relates to a substrate turning device for a substrate processing system for processing plate-shaped substrates, wherein the substrate processing system is a continuous system with at least two process chambers and at least one separation chamber between the process chambers and at least one, in at least one transport direction for the substrates through the conveyor system movable substrate carrier with a plurality Having in a horizontal plane side by side and / or successively arranged frame-shaped, inside open support cells for supporting in each case a substrate to substrate edge regions.
  • the invention further relates to a substrate processing system with such a substrate turning device.
  • the substrates Since it is often necessary for plate-shaped substrates, such as wafers for the production of solar cells, to coat both the substrate front side and the substrate back side, the substrates must be turned between the individual substrate processing processes. In order to realize this, it is known in the art to provide substrate inverters as stand-alone tools between two process machines.
  • the substrate inverters operate under normal atmosphere and at room temperature with the principles known in automation, such as vacuum cups or Bernoulli grippers. If, as is typically the case, several substrate processing steps are carried out one after the other, in which on the one hand the substrate front side and on the other hand the substrate rear side is treated, it is thus necessary in the case of the systems known in the prior art to provide several separation points in the chain of the substrate processing systems. A consequence of this is a large footprint and high production costs of the plants by additionally provided inlet and Ausschleushuntn. In addition, a high energy requirement is associated with the change between normal pressure and vacuum or between ambient temperature and process temperature.
  • the known arrangement is only suitable for rotation of individual substrates which are held firmly in the respective substrate carrier.
  • the known device is not suitable for the turning of substrates which lie loosely on a substrate carrier with a plurality of side by side and successively arranged in a horizontal plane, frame-shaped support cells.
  • central clusters are known in which parallel processing chambers are arranged around a center in which a central substrate handling device is seated.
  • the central substrate handling device in each case only one substrate or a box with substrates is picked up and transported into another process chamber.
  • substrates which lie side by side and one after the other on a substrate carrier moving through a continuous system, such handling devices are not suitable.
  • the substrate processing system should be able to be provided with the lowest possible footprint and low production costs.
  • a substrate inverting device of the abovementioned type having at least one turning station which has a vertically movable or extendable substrate lifting system for lifting and lowering the substrates from and into the carrier cells and a substrate turning mechanism.
  • the holding elements or axes of rotation of the holding elements are connected by means provided transversely to the holding elements or the axes of rotation in the form of a frame and the frame about its horizontal center axis by at least 180 ° is rotatable.
  • the process chambers and the separation chamber are not at atmospheric pressure, that is at overpressure, under vacuum or under vacuum, operated chambers.
  • the substrate inverting device according to the invention thus permits turning of substrates during their passage through the substrate processing system even under vacuum conditions. With the substrate inverting device according to the invention, it is not necessary to provide separate inlet and / or discharge chambers in order to be able to turn the substrates between individual processing steps.
  • the turning station provided in the substrate inverting device according to the invention can be provided immediately following substrate processing.
  • the substrates from the carrier cells of the substrate carrier can be raised by the substrate subsystem from the carrier cells into a turning position defined by the substrate turning mechanism. Since the substrate turning mechanism has relatively movable holding members, the raised substrates can be temporarily held in the turning position and rotated together with the frame about its horizontal, for example transversely to the transport direction of the substrates in the substrate processing system aligned center axis by at least 180 °. Since the substrate subsystem is vertically movable, it can be lowered during the turning of the substrates to a position below the substrate turning mechanism in which it is not troublesome to the substrate turning operation. After the turning of the substrates has taken place, the substrate subsystem is again moved vertically upwards in the direction of the turning position or extended.
  • the holder of the substrates can be solved by the relatively movable holding elements readily again. Thereafter, the substrates can be lowered resting on the substrate subsystem back into their position in the carrier cells of the substrate carrier. During lifting, turning and lowering of the substrates, the substrate carrier remains in a turning position at the turning station. After the substrate reversal process has taken place, the substrate carrier with the substrates resting on it can be moved on to the next substrate processing step within the substrate processing system and the frame with the holding elements can be rotated back into its original position.
  • the substrate inverting device according to the invention can be positioned between two machining processes without the substrates having to be introduced or removed in the meantime, significant advantages arise for the entire substrate machining system. If, for example, the substrate processing installation is a coating installation, the use of only one coating direction results in an optimum coating process since the substrates can now be turned between individual coating processes without having to remove the substrates from the installation using the substrate turning device according to the invention. Since the turning station is located in a separating or secondary chamber directly between the process chambers, a cooling and reheating of the substrate support and the substrates can be omitted. This results in a reduced energy requirement for heating the successive thermal processes within the substrate processing system. Associated with this is a reduced carbon monoxide output.
  • the turning station is provided in a separation or secondary chamber directly between the process chambers and thus, if it does not have its own pumping system, operates in the same pressure chamber as the process chambers, also results in a lower energy requirements by eliminating venting and subsequent Evacuate the successive processes.
  • a substrate processing system in which the substrate inverting device according to the invention is provided can be provided with a substantially smaller footprint than other substrate processing systems in which conventional turning mechanisms are used.
  • lower production costs for the entire substrate processing system result from the omission of provided for turning the substrates input and Ausschleusmodulen, since the turning station is arranged in a separation or auxiliary chamber between the process chambers.
  • the holding elements are arranged on both sides of a carrier cell above the substrate carrier, scissor-like relative to each other movable holding arms.
  • the support arms are in the position of the substrate turning mechanism, that is, in a plane above the substrates carried by the substrate support into which the substrates are raised by the substrate subsystem.
  • the holding arms can be moved toward a substrate edge region of a substrate and moved away again from this substrate edge region.
  • the support arms clamp or hold the holding arms the respective substrate edge region.
  • the clamping or mounting of the substrate edge area is released again.
  • the holding arms can be provided with such a width that the clamping of a plurality of juxtaposed substrates or substrates of an entire substrate carrier row or column is possible.
  • each side of the at least one support cell of at least one of the support arms has a provided at its free end substrate holding portion having a recess which is deeper than a maximum thickness of the substrates.
  • the substrates are not clamped directly to the surfaces of the support arms, but lie in a substrate receiving gap defined by the recess between the support arms, but are still held securely by the two holding arms on both sides of the substrate. Since the depth of the recess is deeper than a maximum thickness of the substrates, a secure recording of all substrates is ensured in each case.
  • the recess can be in both the mutually movable support arms or be provided only in one of the support arms.
  • a respective first support arm is radially projecting radially mounted on an inner axis of a tubular mounting member for the support arms, wherein an outer tube is provided around the inner axis, on which a second support arm is radially projecting cantilevered.
  • the outer tube has in this embodiment a recessed for a movement of the first holding arm peripheral region.
  • the inner axis and the outer tube are independently rotatable.
  • both support arms can be mounted on one side of the carrier cell to a tubular arrangement and yet be moved in a scissor-like manner relative to each other.
  • the tubular mounting elements can be easily connected by connecting elements frontally to form a frame-shaped suspension for the support arms, wherein the frame can be connected to the connecting elements with a rotation axis, so that the frame can be rotated with the support arms by at least 180 °.
  • the rotation of the frame is independent of the rotatability of the support arms.
  • a defined depositing of the substrates into their respective substrate receiving regions of the associated carrier cells in the substrate carrier can be achieved in that in a specific embodiment of the present invention between the holding arms located in a substrate holding position on both sides of the substrate, different width substrate receiving gaps are formed, which at the beginning a substrate turnup process substrate receiving gap opposite the substrate subsystem is wider than a substrate receiving region of the carrier cell and wider than the other substrate receiving gap. Since the substrate receiving gap in which the substrate is initially deposited after it has been lifted out of the carrier cell is wider than the substrate receiving region of the carrier cell, the substrate can also be suitably inserted into the substrate turning mechanism even if the substrate is not initially exactly centered of the respective carrier cell and / or has been laterally displaced during its lifting by the substrate subsystem.
  • the substrate automatically moves into the space formed by the further holding arms.
  • the other substrate receiving gap which is narrower than the substrate receiving gap, in which the substrate was originally inserted.
  • the width of the other substrate receiving gap is adapted to the width of the substrate receiving region of the carrier cell.
  • the substrate can be picked up from the narrower substrate receiving gap by the substrate subsystem and lowered into its original position into the substrate receiving area of the carrier cell.
  • This embodiment of the invention has the particular advantage that tolerances of the substrates and / or tolerances in the insert geometry of the substrate carrier can be compensated for by the specifically designed substrate reversing mechanism.
  • the holding elements are parallel to each other in a horizontal plane opposite and movable in this plane relative to each other holding rails.
  • the support rails each have two superimposed retaining strips, between which an example U-, V- or C-shaped substrate receptacle for receiving a Substratend Studes at least one substrate is provided.
  • the height of the substrate holder is preferably greater than a maximum thickness of the substrates.
  • the support rails can be made so long that a whole series of substrates can be clamped simultaneously. After completion of the turning process, the support rails can be moved away from each other with a suitable mechanism in a simple manner in the horizontal again to release the respective substrate or the respective substrates and lower by the substrate subsystem back into the carrier cells. It has proved to be advantageous if the retaining rails are each formed from two superimposed retaining strips, which have on their opposite inner surfaces projections of ceramic. These protrusions can be formed, for example, in the form of a socket. Since the retaining strips are preferably formed of metal, it is ensured by the projections made of ceramic, that the substrates do not come directly into contact with the metal of the support rails, whereby contamination of the substrates by metal particles can be avoided.
  • a substrate insertion opening and / or a substrate removal opening of the separation chamber is continuously open, and the separation chamber can be evacuated by a pumping system of at least one adjacent process chamber.
  • the separation chamber can be evacuated by a pumping system of at least one adjacent process chamber.
  • the substrate subsystem has vertically aligned and vertically movable or extendable rods spaced apart from one another in the transport direction of the substrates, wherein each of the substrates has three rods for a three-point support of the substrates on the rods assigned.
  • each of the substrates can be safely raised and lowered on the three-point support.
  • the contact between substrate and rod is very small, so that contamination or other impairment of the substrates by contact with the rods go to zero.
  • design effort for the turnover station can be minimized.
  • the rods for raising and lowering the substrates are each formed at their end facing the substrates of a non-metallic material or with a non-metallic Material sheathed.
  • metal contamination on the substrate surfaces can be avoided, on the other hand, for example, by vibration damping properties of the non-metallic material, a defined design lifting and lowering can be realized.
  • the substrate carrier is preferably guided on parallel transport rollers provided at a distance from one another which are guided perpendicular to the transport direction of the substrates into the separation chamber.
  • the substrate carrier is temporarily fixable at the turning station in a turning position by a positioning device.
  • a positioning device for example, at least one vertically aligned and vertically movable or extendable fixing element can be provided below the substrate carrier for fixing, wherein at least one bushing for engaging the fixing element is provided on the substrate carrier.
  • a fixing for example, a conical-like fixing can be used, which can engage in one or more sockets, which is or are provided on the side edge of the substrate carrier.
  • the substrate carrier may be guided between transport rollers and a stop rail respectively provided on the chamber side walls of the separation chamber above the substrate carrier, wherein the stop rail forms a counter support for the substrate carrier with respect to the fixing element pressing against the substrate carrier from below.
  • the object is further achieved by a substrate processing system for processing plate-shaped substrates, wherein the substrate processing system is a continuous system with at least two process chambers and at least one separation chamber between the process chambers and at least one, in at least one transport direction for the substrates through the conveyor system movable substrate carrier with multiple in a horizontal plane and / or sequentially arranged migen, inside open carrier cells for supporting a respective substrate on the substrate edge regions and wherein the substrate processing system has an embodiment of the substrate turning device according to the invention described above.
  • the process chambers and the separation chamber are evacuatable chambers.
  • a plurality of successively arranged in the transport direction of the substrates turning stations are provided in the separation chamber, with which the substrates of several substrate carrier rows or columns are reversible, the turning stations have a distance from each other, which corresponds to at least one substrate carrier row or column ,
  • three turning stations are provided in the separating chamber, with which substrates of three substrate carrier rows can be turned at the same time, the substrate carrier rows being at a distance from each other corresponding to two substrate carrier rows located therebetween.
  • the substrate turning mechanisms of the turning stations are mounted on a common, transverse struts having support frame.
  • the support frame gives the entire arrangement a significantly increased stability.
  • the substrate carrier, the turning station (s) and the carrier frame for the turning station (s) are formed of a carbon fiber composite material.
  • a carbon fiber composite material By using such a material substrate carrier, turning stations (s) and support frame for the turning station (s) can be highly stable and yet formed with relatively low weight.
  • carbon fiber composites are characterized by a high temperature resistance and do not expand when influenced by temperature, which results in permanently high positioning accuracies of the substrates during the turning process in the turning station.
  • the drive motors for moving or extending the rods and rotating the frame of the substrate turning mechanism are provided outside the separation chamber. This facilitates the connection and maintenance of the drive motors and reduces the particle load inside the separation chamber. In other variants of the invention, however, it may be advantageous to provide the drive motors inside the separation chamber.
  • a temperature control device separate from the adjacent process chambers such as a heater or a cooling device, is provided in the separation chamber.
  • FIG. 1 shows a perspective top view of an open-topped separation chamber with a substrate inverting device according to an embodiment of the present invention
  • Figure 2 to Figure 6 show steps of a process sequence for turning with substrate inverting means of substrates according to an embodiment of the present invention
  • Figure 7 shows schematically a plan view of a part of a substrate turning mechanism according to an embodiment of the present invention
  • Figure 8 to Figure 10 schematically show steps of a process sequence for turning substrates with a substrate inverting device according to another embodiment of the present invention
  • Figure 1 1 shows schematically a part of a side view of a substrate carrier used in connection with the substrate inverting device according to the invention during its passage through a separation chamber
  • Figures 12 to 16 schematically show steps of a process sequence for turning substrates with another embodiment of a substrate inverting device according to the present invention.
  • FIG. 1 shows a perspective view of a separation chamber 1 of a substrate processing installation, which is disclosed here above.
  • process chambers of the substrate processing system are respectively arranged directly after the separation chamber 1, the process chambers not being shown in FIG. 1 for the sake of clarity.
  • the substrate processing system is a so-called continuous system, through which a substrate carrier 2 is moved in a horizontal plane of the continuous system.
  • the substrate carrier 2 has a plurality of carrier cells 3 for receiving substrates 4.
  • the substrate carrier 2 has a plurality of side-by-side and successively arranged frame-shaped, inner open carrier cells 3, on each of which a substrate 4 is placed on its substrate edge regions 5.
  • the carrier cells 3 of the substrate carrier 2 are arranged in rows and columns.
  • a substrate carrier 2 with nine substrate carrier rows 6 and five substrate carrier columns 7, as shown in the example of FIG. 1, can be used.
  • the number of substrate carrier rows 6 and columns 7 of the substrate carrier 2 can be varied as desired.
  • the substrate carrier 2 it is also possible for the substrate carrier 2 to have only a single substrate carrier row 6 or only a single substrate carrier column 7.
  • the support cells 3 are designed to receive square substrates 4, it is also possible for support cells 3 to be used to receive rectangular substrates 4 with different side lengths.
  • the device according to the invention is intended for those substrate processing systems in which plate-shaped substrates 4, such as, for example, wafers for solar cell production, are processed. Under a processing of the sub- strate 4 is to be understood here in particular as a coating of substrates 4.
  • the process chambers of the substrate processing equipment can also be used for other substrate processing processes, such as diffusion processes, firing processes, etching processes and / or cleaning processes, in which it is necessary to treat a substrate front side 29 of a substrate 4 other than its substrate backside 30 and therefore the substrates 4 in the meantime.
  • the substrate carrier 2 is introduced from an upstream process chamber through a Substratein technological Anlagen réelle 8 in the separation chamber 1 and introduced via a Substratausnaturalö réelle 9 at the end of the separation chamber 1 again in the next process chamber.
  • the substrate insertion opening 8 and the substrate removal opening 9 of the separation chamber 1 are continuously open and the separation chamber 1 can be evacuated by a pumping system, not shown here, of at least one adjacent process chamber.
  • a pumping system not shown here, of at least one adjacent process chamber.
  • the same pressure conditions as in the adjacent process chamber 1 a In principle, however, it is also possible according to the invention to provide a separate vacuum pump in the separation chamber 1.
  • the substrate inverting device according to the invention is used for turning substrates at pressure conditions other than atmospheric pressure in the process chambers and the separation chamber 1, such as in a vacuum, and has been designed especially for this case, for which no suitable substrate inverting device was previously known.
  • the carrier cells 3 of the substrate carrier are formed in the embodiment shown in the double-nest shape, so that each of the substrates 4 rests securely on the respective carrier cell 3 even after a displacement of a substrate 4.
  • the separation chamber 1 has three turning stations 10, which are arranged one after the other at a distance from one another in the transport direction A of the substrates 4 through the continuous installation.
  • this distance corresponds to two rows of substrate carriers 6, but in other embodiments may also be smaller or larger. The distance, however, must be so great that unimpeded rotation of the substrates 4 is possible.
  • only a single turning station 10 or a different number of turning stations 10 may be provided in the separation chamber 1.
  • a substrate subsystem for raising and lowering the substrates 4 is provided in a plane below the plane of the substrate carrier 2.
  • the substrate subsystem has a plurality of vertically aligned and vertically movable or extendable rods 11 for lifting and lowering the substrates 4 from or into the carrier cells 3 of the substrate carrier 2.
  • the rods 1 1 are formed of steel, wherein at the respective free rod ends of the rods 1 1, which respectively face the substrates 4, the rods 1 1 a tip 27 made of a non-metallic material or a sheath a non-metallic material.
  • the rods 1 1 are formed from another suitable, temperature-resistant material.
  • a cam arrangement can be used for lifting and lowering of the rods 1 1, for example.
  • the substrate subsystem is in each case designed in such a way that in each case all the rods 1 1 associated with a turning station 10 are vertically moved together or extended or retracted.
  • each of the turning stations 10 in the transport direction A of the substrates 4.
  • the rods 1 1 are spaced apart from one another and offset relative to one another such that each of the support cells 3 and thus each substrate 4 are assigned three rods 1 1.
  • more than three rods 1 1 may be assigned to a substrate 4. Since the substrates 4 rest horizontally on the support cells 3 and the rods 1 1 are vertically aligned, each is a substrate 4 when lifting or extending the rods 1 1 on the tips 27 of three rods 1 1 on.
  • the substrate 4 is securely held by the rods 3 and can be brought by the rods 3 further upwards in a plane located above the substrate support 2 level with a substrate turning mechanism.
  • the substrate turning mechanism has holding members movable relative to each other for clamping the substrates 4 to two opposite substrate edge portions.
  • the holding elements or, in other embodiments of the invention, axes of rotation of the holding elements are connected by transverse to the holding elements provided connecting elements 12 in the form of a frame 13 with each other.
  • the connecting elements 12 are in turn centrally connected to a rotation axis 39, so that the frame 13 about its horizontal, here transverse to the transport direction A of the substrates 4 aligned, central axis 38 is rotatable by at least 180 °.
  • the drive motors for moving or extending the bars 11 and rotating the frame 13 of the substrate turning mechanism are located outside the separation chamber 1. In other embodiments of the invention, these drive mechanisms may also be provided within the separation chamber 1.
  • the holding elements are mutually parallel in the transport direction A of the substrates 4 and in the transport direction A of the substrates 4 relatively movable support rails 14, 15.
  • the support rails 14, 15 have in the example shown approximately U
  • another suitable clamping profile such as a "V” or "C” shape, can be used here.
  • the profile is formed by two superimposed retaining strips 16 formed, wherein the distance between the superimposed retaining strips 16 is greater than a maximum thickness of the substrates 4.
  • At the respectively opposite inner surfaces of the retaining strips 16 may be provided, for example, nose-shaped projections made of ceramic.
  • the substrate turning mechanisms of the turning stations 10 are mounted in the embodiment shown in Fig. 1 on a common, transverse struts 17 having support frame 18.
  • the substrate carrier 2, the turning stations 10 and the support frame 18 for the turning stations 10 are formed in the embodiment shown made of steel.
  • NEN of the substrate carrier 2 the turning stations 10 and the support frame 18 for the turning stations 10 also be formed of a carbon fiber composite material.
  • FIGS. 2 to 7 or 12 to 16 schematically illustrated holding arms for holding the substrates 4 during their turning by the substrate turning mechanism be used.
  • FIGS. 2 to 6 schematically show steps of a process sequence for turning substrates 4 according to a possible embodiment of the substrate turning device according to the invention.
  • a substrate inverting device is used which, in order to clamp or hold a substrate 4, has holding elements in the form of support arms 3, each on both sides of a carrier cell 3, above the substrate carrier 2, holding arms 19, 20 which can be moved like scissors. 21, 22 used.
  • one of the holding arms 19, 21 is mounted on an inner axis 23 of a tubular mounting element in such a way that it protrudes radially from the inner axis 23.
  • an outer tube 24 is provided, from which the respective second holding arm 20, 22 projecting radially.
  • the inner axis 23 and the Au DTrohr 24 are each independently rotatable.
  • the outer tube 24, as shown in more detail in Fig. 7, a recessed peripheral portion 25, which allows the holding arms 19, 21 which are fixed to the inner axes 23, relative to the support arms 20, 22, the are attached to the Au JOen 24, are movable.
  • the holding arms 19 and 20 or 21 and 22 are each preferably connected by a spring mechanism, by which the respective Weil retaining arms are automatically brought, for example, in a horizontal orientation for holding the substrates 4.
  • At least one of the support arms 19, 20; 21, 22 a provided at its free end substrate clamping area with a recess 26.
  • the recess 26 has a depth t which is deeper than a maximum thickness d of the substrates 4.
  • FIG. 2 to 6 respectively recesses 26 in all support arms 19, 20; 21, 22 are provided, it is basically sufficient if the recesses 26 are provided only in one of the holding arms 19 or 20 or 21 or 22, but preferably in the bottom in Fig. 2 arranged holding arms 19 and 21.
  • the recesses 26 define the region in which the substrate edge regions 5 of the substrates 4 to be used are held during turning. If a recess 26, as shown in FIG. 2, is also provided in the holding arms 20, 22, these are preferably mirror-symmetrical as those of the lower holding arms 19, 21.
  • the substrate 4 shows a step of a sequence of steps for turning over a substrate 4, in which the substrate 4 is lifted vertically upward by the bars 1 1 provided below the carrier cell 3.
  • the substrate 4 is at the height of the axis of rotation of the inner axis 23 and the outer tube 24.
  • the rods 1 1 can in other embodiments of the invention, another suitable substrate subsystem for raising and lowering of the substrates 4, the substrates preferably only three Points of a substrate support during lifting and lowering rest, can be used.
  • the substrate 4 is raised slightly above the turning position of FIG.
  • the lower support arms 19, 21 are moved relative to the respective other holding arm 20, 22 in the direction of the substrate 4 in accordance with the directions indicated by the arrows B, C, until they are aligned horizontally.
  • the rods 1 1 corresponding to the marked by the arrow D Be movement direction down again moved and the substrate 4 placed on the defined by the recesses 26 of the support arms 19, 21 support area.
  • the substrate 4 is suitably inserted into a gap which is defined by the recesses 26 of the holding arms 19, 21.
  • the upper support arms 20, 22 are pivoted relative to the support arms 19, 21 inwardly to their horizontal orientation.
  • FIG. 4 A clamped or held arrangement of the substrate 4 in defined by the receptacles 26 substrate receiving gaps between the support arms 19, 20; 21, 22 is shown in Fig. 4.
  • the substrate 4 is securely between the holding arms 19, 22; 21, 22 held, but is not clamped.
  • the entire assembly can be rotated about a horizontal axis of rotation 38 by at least 180 °.
  • a substrate front side 29 of the substrate 4 is moved downward and a substrate rear side 30 of the substrate 4 is moved upward, that is to say the substrate 4 is turned.
  • Fig. 4 shows in principle a "zero position" of the holding elements of the present invention, in which the holding elements preferably automatically - for example, by a provided on the holding elements spring construction - are moved like a scissor.
  • Fig. 5 shows schematically a next step of the step sequence for turning the substrate 4.
  • the upper holding arms 20, 22 are relatively moved away from the respective other holding arms 19, 21 in accordance with the movement directions indicated by the arrows H, I.
  • the rods 1 1 are again moved in accordance with the direction of movement shown by the arrow J upwards, in the direction of the substrate 4 and the substrate 4 is raised to a position above the turning position.
  • the frame 13 is either rotated 180 ° or more according to the rotational directions E, F shown in FIG. 4, or rotated 180 ° counter to this direction of rotation to its original position of FIG.
  • the further or reverse rotation can also be done with the substrate receiving gap closed, but without a substrate 4 received therein.
  • Fig. 7 shows schematically the substrate turning means used in Figs. 2 to 6 for turning the substrate 4 in greater detail in a plan view.
  • the arrangement shown in Fig. 7 corresponds approximately to the step shown in Fig. 3.
  • the substrate 4 rests on the lower holding arms 19, 21.
  • the upper support arms 20, 22 are shown in the illustration of Fig. 7 for the sake of better understanding on a substrate 4 opposite side of the axis of rotation 31 of the inner axis 23 and the outer tube 24.
  • the tube-shaped arrangements provided on both sides of the substrate 4, comprising the inner axis 23 and the outer tube 24, are connected by connecting elements 12, which are provided here parallel to the transport direction A of the substrates 4 by the continuous flow system.
  • a frame 13 is formed, which is connected to the frontally provided connecting elements 12 with the axis of rotation 31 for the frame 13.
  • the rotation axis 31 protrudes through a chamber side wall 32 of the separation chamber 1 to the outside and is connected outside of the separation chamber 1 with corresponding drives to ensure rotation of the frame 13.
  • FIGS. 8 to 10 schematically show the turning of a substrate 4 with a substrate inverting device which, as shown in FIG. 1, uses support rails 14, 15 for holding the substrate 4 during the substrate turning operation.
  • the substrate 4 is lifted by means of the vertically oriented and vertically movable or extendable rods 11 into a turning position.
  • the substrate 4 is brought into the turning position with high positioning accuracy.
  • the support rails 14, 15 are still at a wide distance W from each other.
  • the support rails 14, 15 are moved towards each other according to the arrows L, M, so that they are arranged in their end position shown in Fig. 9 only at a distance w from each other, which is slightly larger than the width b of the substrate 4 is.
  • the frame 13, on which the support rails 14, 15 are provided is rotated about its horizontal axis by 180 °.
  • the substrate 4 is turned so that the former upper substrate front 29 is at the bottom and the former lower substrate rear 30 is at the top.
  • the rods 1 1 again moved to pick up the substrate 4 vertically upwards
  • the support rails 14, 15 along the arrows N O moved away from each other and the substrate 4 by a vertical movement of the rods 1 1 back to its original position on the Carrier cell 3 launched.
  • the frame 13 with the support rails 14, 15 further rotated by another 180 ° or rotated 180 ° counter to the direction of rotation of the substrate turning operation back to its initial position of Fig. 8.
  • Fig. 1 1 shows schematically a part of the substrate carrier 2, while it is in the separation chamber 1, in a sectional side view. As can be seen from FIG. 11, the substrate carrier 2 rests on transport rollers 34, which laterally project through the chamber side walls 32 into the interior of the separation chamber 1.
  • the substrate carrier 2 If the substrate carrier 2 reaches a position intended for turning the substrates 4 resting on it, the substrate carrier 2 is temporarily moved to a turning position. held, in which a substrate carrier row 6 is located exactly in the region of a turning station 10. This position is defined by the fact that in this position the substrate subsystem moves under a substrate 4, lifts it out of the respective carrier cell 3 and brings it upwards into a turning position. Since a high positioning accuracy is required for this purpose, the substrate carrier 2 is preferably temporarily fixed in this position by a positioning device.
  • the at least one fixing element 36 is provided below the substrate support 2, which is vertically aligned and vertically movable in the direction of the substrate support 2 and back, wherein the at least one fixing element 36 in at least one provided on the substrate support 2 socket
  • a plurality of bushes 37 are provided on the substrate carrier 2, so that the substrate carrier 2 can be fixed in several turning positions for turning different substrate carrier rows 6.
  • a stop rail 35 arranged at least in the region of the positioning device is provided above the substrate carrier 2 along the respective chamber side walls 32 so that the substrate carrier 2 is guided here between the transport rollers 4 and the stop rail 35 during its transport through the separation chamber 1 and the Stop rail 35 forms a counter-holding against the pressure exerted by the fixing member 36 against the substrate carrier 2 during the fixing process.
  • FIGS. 12 to 16 schematically show steps of a process sequence for turning substrates 4 with a substrate inverting device according to another embodiment of the present invention.
  • those steps which are not explicitly shown again in FIGS. 12 to 16 correspond to the lifting and lowering of the substrates 4 by a vertically movable or extendable substrate lifting system, for example the steps shown in FIGS. 2 to 6.
  • FIG. 12 schematically shows a substrate 4 brought by a substrate subsystem into a turning position above the substrate carrier 2 with a substrate front side 29 and a substrate rear side 30.
  • the substrate 4 lies in the illustration of FIG. 12 on both sides between two scissor-like relative to each other movable support arms 40, 41; 42, 43.
  • the substrate-receiving gap 44 formed between the recesses of the lower support arms 41, 43 is wider than the substrate-receiving gap 45 between the upper support arms 40, 42.
  • the substrate-receiving gap 44 is between the lower ones Supporting arms 41, 43 on both sides of the substrate 4 by a distance a wider than the substrate receiving portion 46 of the associated support cell 3 of the substrate carrier. 2
  • the substrate 4 In the position of FIG. 12, in which the substrate 4 has just been replaced by the holding arms 40, 41; 42, 43, the substrate 4 is in the formed by the lower support arms 41, 43 substrate receiving gap 44, wherein on both sides of the substrate 4 is still space to the edges of the recesses in the holding arms 41, 43 is provided.
  • the substrate 4 can also be suitably inserted into the substrate receiving gap 44 between the holding arms 41, 43, if the substrate 4 originally did not exactly centered on the respective carrier cell 3 of the substrate carrier 2 and / or during the lifting of the substrate 4 of the substrate subsystem was shifted laterally.
  • Fig. 13 shows schematically the substrate turning mechanism of Fig. 12 during another step of the process sequence for turning the substrate 4.
  • the holding arms 40, 41; 42, 43 according to the schematically shown arrows P, Q rotated about a horizontal center axis.
  • the substrate 4 tilts from the wide substrate receiving gap 44 up into the narrower substrate receiving gap 45.
  • Fig. 14 shows schematically the substrate turning mechanism of Figs. 12 and 13 in a subsequent position in which the substrate 4 has already been turned so far that its substrate back 30 is at the top and its substrate front 29 is at the bottom.
  • the substrate 4 is further rotated by the substrate turning mechanism in the direction of arrows R, S, ie beyond 180 °.
  • the substrate 4 slides down into the narrower substrate receiving gap 45.
  • the substrate 4 lies completely in the narrower substrate receiving gap 45 in this position.
  • the substrate turning mechanism with the substrate 4 is again rotated back in a horizontal orientation according to the arrows V, W.
  • the substrate 4 is turned in relation to its original position from FIG. 12, so that its substrate front side 29 is at the bottom and its substrate rear side 30 is at the top.
  • the substrate 4 is further in the narrower substrate receiving gap 45 and can be lowered from this position exactly in the substrate receiving area 46 of the carrier cell 3 by the Substratathubsystem again.
  • the substrate turning mechanism with the holding arms 40, 41; 42, 43 moved back to its original position, which is shown in Fig. 12, back.
  • the embodiment of the substrate inverting device according to the invention shown in FIGS. 12 to 16 has the advantage that, despite the turning, the substrate 4 can be defined and centered back into the carrier cell 3. In this case, in this embodiment, any tolerances of the substrates 4 and the insert geometry of the substrate carrier 2 by the special geometry of the recesses of the holding arms 40, 41; 42, 43 accounted for.
  • clamping of the substrates is shown only in holding elements opposite the transporting direction A of the substrates 4 through the separating chamber 1, in other embodiments of the invention, the substrates 4 may also be aligned with each other through transverse to the conveying direction A. opposite holding elements for the turning of the substrates 4 are clamped or held. It is only the above-described elements of the turning device offset by 90 s in the separation chamber 1 to be arranged.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention relates to a substrate turning device for a substrate processing system for processing plate-shaped substrates, wherein the substrate processing system is a pass-through system having at least two process chambers and at least one separating chamber between the process chambers and has at least one substrate carrier that can be moved through the pass-through system in at least one transport direction for the substrates, said substrate carrier having several frame-shaped, internally open carrier cells arranged one next to the other and/or one after the other in a horizontal plane for supporting one substrate each at substrate edge areas. The aim of the invention is to provide a substrate turning device of the stated type by means of which the substrates can be turned while the substrates pass through the substrate processing system on a substrate carrier, wherein the energy requirement for the turning of the substrates is as low as possible and the substrates can be optimally processed. Furthermore, it should be possible to provide the substrate processing system with the smallest possible footprint and low production costs. The aim is achieved by a substrate turning device of the stated type, wherein at least one turning station is provided in the separating chamber, at which turning station a vertically movable or extendable substrate lifting system for lifting the substrates out of and lowering the substrates into the carrier cells is provided below the carrier cells, and a substrate turning mechanism having retaining elements that can be moved relative to each other for retaining the substrates at two opposite substrate edge areas is provided above the substrate cells, wherein the retaining elements or rotational axes of the retaining elements are connected in the form of a frame by connecting elements provided perpendicular to the retaining elements or the rotational axes and the frame can be rotated by at least 180° about the horizontal center axis of the frame.

Description

Substratwendeeinrichtung  Substrate turning device
Die vorliegende Erfindung betrifft eine Substratwendeeinrichtung für eine Substratbearbeitungsanlage zur Bearbeitung von plattenförmigen Substraten, wobei die Substratbearbeitungsanlage eine Durchlaufanlage mit wenigstens zwei Prozesskammern und wenigstens einer Trennkammer zwischen den Prozesskammern ist und wenigstens einen, in wenigstens einer Transportrichtung für die Substrate durch die Durchlaufanlage bewegbaren Substratträger mit mehreren, in einer horizontalen Ebene nebeneinander und/oder nacheinander angeordneten rahmenförmigen, innen offenen Trägerzellen zur Auflage jeweils eines Substrates an Substratrandbereichen aufweist. Die Erfindung betrifft ferner eine Substratbearbeitungsanlage mit einer solchen Substratwendeeinrichtung. The present invention relates to a substrate turning device for a substrate processing system for processing plate-shaped substrates, wherein the substrate processing system is a continuous system with at least two process chambers and at least one separation chamber between the process chambers and at least one, in at least one transport direction for the substrates through the conveyor system movable substrate carrier with a plurality Having in a horizontal plane side by side and / or successively arranged frame-shaped, inside open support cells for supporting in each case a substrate to substrate edge regions. The invention further relates to a substrate processing system with such a substrate turning device.
Da es bei plattenförmigen Substraten, wie beispielsweise Wafern zur Herstellung von Solarzellen, häufig notwendig ist, sowohl die Substratvorder- als auch die Substratrückseite zu beschichten, müssen die Substrate zwischen den einzelnen Substratbearbeitungsprozessen gewendet werden. Um dies zu realisieren, ist es im Stand der Technik bekannt, Substratwendeeinrichtungen als einzeln bestehende Tools zwischen zwei Prozessmaschinen vorzusehen. Die Substratwendeeinrichtungen arbeiten unter Normalatmosphäre und bei Raumtemperatur mit den in der Automation bekannten Prinzipien, wie beispielsweise Vakuumsaugern oder Bernoulligreifern. Sind, wie es typischerweise der Fall ist, mehrere Substratbearbeitungsschritte nacheinander auszuführen, bei welchen einerseits die Substratvorderseite und andererseits die Substratrückseite behandelt wird, ist es somit bei den im Stand der Technik bekannten Anlagen notwendig, mehrere Trennstellen in der Kette der Substratbearbeitungsanlagen vorzusehen. Eine Folge hiervon sind ein großer Footprint und hohe Herstellungskosten der Anlagen durch zusätzlich vorzusehende Ein- und Ausschleuskammern. Zudem ist mit dem Wechsel zwischen Normaldruck und Vakuum beziehungsweise zwischen Umgebungstemperatur und Prozesstemperatur ein hoher Energiebedarf verbunden. Since it is often necessary for plate-shaped substrates, such as wafers for the production of solar cells, to coat both the substrate front side and the substrate back side, the substrates must be turned between the individual substrate processing processes. In order to realize this, it is known in the art to provide substrate inverters as stand-alone tools between two process machines. The substrate inverters operate under normal atmosphere and at room temperature with the principles known in automation, such as vacuum cups or Bernoulli grippers. If, as is typically the case, several substrate processing steps are carried out one after the other, in which on the one hand the substrate front side and on the other hand the substrate rear side is treated, it is thus necessary in the case of the systems known in the prior art to provide several separation points in the chain of the substrate processing systems. A consequence of this is a large footprint and high production costs of the plants by additionally provided inlet and Ausschleuskammern. In addition, a high energy requirement is associated with the change between normal pressure and vacuum or between ambient temperature and process temperature.
Darüber hinaus existieren im Stand der Technik Ansätze, Substratwendeeinrichtungen innerhalb einer Vakuumbeschichtungsanlage vorzusehen. So beschreibt die Druckschrift DE 39 08 894 C1 eine Substratwendeeinrichtung für eine Vakuumbeschichtungsanlage, bei welcher mehrere Substratträger schwenkbar am Umfang eines um eine Achse drehbar angeordneten Drehkorbes gelagert sind. An dem Drehkorb sind parallel zu den Substratträgern schwenkbare Wendearme vorgesehen, die starr mit den Schwenkachsen der Substratträger verbunden sind. An jedem der Wendearme sind Mitnehmer vorgesehen. Zudem weist die Wendeanlage einen Leitkanal für die Mitnehmer auf. In addition, there are approaches in the art to provide substrate inverters within a vacuum deposition system. This is how the document describes DE 39 08 894 C1 discloses a substrate turning device for a vacuum coating system in which a plurality of substrate carriers are mounted pivotably on the circumference of a rotating basket arranged rotatably about an axis. On the rotary basket pivotable turning arms are provided parallel to the substrate carriers, which are rigidly connected to the pivot axes of the substrate carrier. At each of the turning arms drivers are provided. In addition, the turning plant on a guide channel for the driver.
Die bekannte Anordnung eignet sich jeweils nur zu Drehung einzelner Substrate, die fest in dem jeweiligen Substratträger gehalten sind. Für das Wenden von Substraten, die lose auf einem Substratträger mit mehreren, in einer horizontalen Ebene nebeneinander und nacheinander angeordneten, rahmenförmigen Trägerzellen aufliegen, ist die bekannte Vorrichtung nicht geeignet. The known arrangement is only suitable for rotation of individual substrates which are held firmly in the respective substrate carrier. For the turning of substrates which lie loosely on a substrate carrier with a plurality of side by side and successively arranged in a horizontal plane, frame-shaped support cells, the known device is not suitable.
Darüber hinaus sind im Stand der Technik Zentral-Cluster bekannt, bei denen parallel prozessierende Kammern um einen Mittelpunkt herum angeordnet sind, in dem eine zentrale Substrathandlingvorrichtung sitzt. In der zentralen Substrathandlingvorrichtung wird jeweils nur ein Substrat oder eine Box mit Substraten aufgenommen und in eine andere Prozesskammer transportiert. Für ein Wenden von Substraten, die nebeneinander und nacheinander auf einem sich durch eine Durchlaufanlage bewegenden Substratträger aufliegen, sind derartige Handlingvorrichtungen nicht geeignet. In addition, in the prior art, central clusters are known in which parallel processing chambers are arranged around a center in which a central substrate handling device is seated. In the central substrate handling device, in each case only one substrate or a box with substrates is picked up and transported into another process chamber. For handling of substrates which lie side by side and one after the other on a substrate carrier moving through a continuous system, such handling devices are not suitable.
Es ist daher die Aufgabe der vorliegenden Erfindung, eine Substratwendeeinrichtung für eine Substratbearbeitungsanlage zur Bearbeitung von plattenförmigen Substraten zur Verfügung zu stellen, bei welcher das Wenden der Substrate während ihres Durchlaufs auf einem Substratträger durch die Substratbearbeitungsanlage möglich ist, wobei der Energiebedarf beim Wenden der Substrate möglichst gering ist und die Substrate optimal bearbeitet werden können. Darüber hinaus soll die Substratbearbeitungsanlage mit einem möglichst geringen Footprint und geringen Herstellungskosten zur Verfügung gestellt werden können. It is therefore the object of the present invention to provide a substrate inverting device for a substrate processing plant for processing plate-shaped substrates, in which the turning of the substrates during their passage on a substrate carrier through the substrate processing plant is possible, the energy required when turning the substrates as possible is low and the substrates can be optimally processed. In addition, the substrate processing system should be able to be provided with the lowest possible footprint and low production costs.
Die Aufgabe wird durch eine Substratwendeeinrichtung der oben genannten Gattung gelöst, wobei die Substratwendeeinrichtung wenigstens eine Wendestation aufweist, welche ein vertikal bewegbares oder ausfahrbares Substrathubsystem zum Heben und Absenken der Substrate aus und in die Trägerzellen und einen Substratwendemecha- nismus mit relativ zueinander bewegbaren Halteelementen zum Halten der Substrate an zwei gegenüber liegenden Substratrandbereichen aufweist, wobei die Halteelemente oder Drehachsen der Halteelemente durch quer zu den Halteelementen oder den Drehachsen vorgesehene Verbindungselemente in Form eines Rahmens verbunden sind und der Rahmen um seine horizontale Mittelachse um wenigstens 180° drehbar ist. The object is achieved by a substrate inverting device of the abovementioned type, the substrate inverting device having at least one turning station which has a vertically movable or extendable substrate lifting system for lifting and lowering the substrates from and into the carrier cells and a substrate turning mechanism. The holding elements or axes of rotation of the holding elements are connected by means provided transversely to the holding elements or the axes of rotation in the form of a frame and the frame about its horizontal center axis by at least 180 ° is rotatable.
Dabei sind gemäß einer bevorzugten Ausführungsform der Erfindung die Prozesskammern und die Trennkammer nicht bei Atmosphärendruck, das heißt bei Überdruck, bei Unterdruck oder unter Vakuum, betriebene Kammern. In this case, according to a preferred embodiment of the invention, the process chambers and the separation chamber are not at atmospheric pressure, that is at overpressure, under vacuum or under vacuum, operated chambers.
Die erfindungsgemäße Substratwendeeinrichtung erlaubt somit ein Wenden von Substraten während ihres Durchlaufs durch die Substratbearbeitungsanlage auch unter Vakuumbedingungen. Mit der erfindungsgemäßen Substratwendeeinrichtung ist es nicht erforderlich, separate Ein- und/oder Ausschleuskammern vorzusehen, um die Substrate zwischen einzelnen Bearbeitungsschritten wenden zu können. Die in der erfindungsgemäßen Substratwendeeinrichtung vorgesehene Wendestation kann unmittelbar im An- schluss an eine Substratbearbeitung vorgesehen werden. The substrate inverting device according to the invention thus permits turning of substrates during their passage through the substrate processing system even under vacuum conditions. With the substrate inverting device according to the invention, it is not necessary to provide separate inlet and / or discharge chambers in order to be able to turn the substrates between individual processing steps. The turning station provided in the substrate inverting device according to the invention can be provided immediately following substrate processing.
Dabei können die Substrate aus den Trägerzellen des Substratträgers durch das Substrathubsystem aus den Trägerzellen in eine durch den Substratwendemechanismus definierte Wendeposition angehoben werden. Da der Substratwendemechanismus über relativ zueinander bewegbare Halteelemente verfügt, können die angehobenen Substrate in der Wendeposition temporär gehalten werden und gemeinsam mit dem Rahmen um dessen horizontale, beispielsweise quer zur Transportrichtung der Substrate in der Substratbearbeitungsanlage ausgerichtete Mittelachse um wenigstens 180° gedreht werden. Da das Substrathubsystem vertikal bewegbar ist, kann es während des Wendens der Substrate in eine Position unterhalb des Substratwendemechanismus abgesenkt werden, in welcher es für den Substratwendevorgang nicht störend ist. Nachdem das Wenden der Substrate erfolgt ist, wird das Substrathubsystem wieder vertikal nach oben in Richtung der Wendeposition bewegt bzw. ausgefahren. Daraufhin kann die Halterung der Substrate durch die relativ zueinander bewegbaren Halteelemente ohne Weiteres wieder gelöst werden. Danach können die Substrate auf dem Substrathubsystem aufliegend wieder in ihre Position in den Trägerzellen des Substratträgers abgesenkt werden. Während des Hebens, Wendens und Absenkens der Substrate verharrt der Substratträger in einer Wendestellung an der Wendestation. Nach dem erfolgten Substratwendevorgang kann der Substratträger mit den darauf aufliegenden Substraten weiter zum nächsten Substratbearbeitungsschritt innerhalb der Substratbearbeitungsanlage gefahren werden und der Rahmen mit den Halteelementen wieder in seine Ursprungsposition gedreht werden. In this case, the substrates from the carrier cells of the substrate carrier can be raised by the substrate subsystem from the carrier cells into a turning position defined by the substrate turning mechanism. Since the substrate turning mechanism has relatively movable holding members, the raised substrates can be temporarily held in the turning position and rotated together with the frame about its horizontal, for example transversely to the transport direction of the substrates in the substrate processing system aligned center axis by at least 180 °. Since the substrate subsystem is vertically movable, it can be lowered during the turning of the substrates to a position below the substrate turning mechanism in which it is not troublesome to the substrate turning operation. After the turning of the substrates has taken place, the substrate subsystem is again moved vertically upwards in the direction of the turning position or extended. Then, the holder of the substrates can be solved by the relatively movable holding elements readily again. Thereafter, the substrates can be lowered resting on the substrate subsystem back into their position in the carrier cells of the substrate carrier. During lifting, turning and lowering of the substrates, the substrate carrier remains in a turning position at the turning station. After the substrate reversal process has taken place, the substrate carrier with the substrates resting on it can be moved on to the next substrate processing step within the substrate processing system and the frame with the holding elements can be rotated back into its original position.
Da die erfindungsgemäße Substratwendeeinrichtung zwischen zwei Bearbeitungsprozessen positioniert werden kann, ohne dass die Substrate zwischenzeitlich ein- oder ausgeschleust werden müssen, ergeben sich für die gesamte Substratbearbeitungsanlage bedeutende Vorteile. Ist die Substratbearbeitungsanlage beispielsweise eine Be- schichtungsanlage, ergibt sich durch die Verwendung nur einer Beschichtungsrichtung ein optimaler Beschichtungsprozess, da mithilfe der erfindungsgemäßen Substratwendeeinrichtung die Substrate nun zwischen Einzelbeschichtungsprozessen gewendet werden können, ohne die Substrate aus der Anlage herausnehmen zu müssen. Da sich die Wendestation in einer Trenn- bzw. Nebenkammer direkt zwischen den Prozesskammern befindet, kann ein Abkühlen und Wiederaufheizen des Substratträgers und der Substrate entfallen. Hieraus resultiert ein reduzierter Energiebedarf für das Heizen der aufeinander folgenden thermischen Prozesse innerhalb der Substratbearbeitungsanlage. Damit verbunden ist ein verringerter Kohlenmonoxidausstoß. Dadurch, dass die Wendestation in einer Trenn- bzw. Nebenkammer direkt zwischen den Prozesskammern vorgesehen ist und damit, wenn sie nicht über ein eigenes Pumpsystem verfügt, im gleichen Druckraum wie die Prozesskammern arbeitet, resultiert ferner ein geringerer Energiebedarf durch den Wegfall von Belüften und anschließendem Evakuieren der aufeinander folgenden Prozesse. Since the substrate inverting device according to the invention can be positioned between two machining processes without the substrates having to be introduced or removed in the meantime, significant advantages arise for the entire substrate machining system. If, for example, the substrate processing installation is a coating installation, the use of only one coating direction results in an optimum coating process since the substrates can now be turned between individual coating processes without having to remove the substrates from the installation using the substrate turning device according to the invention. Since the turning station is located in a separating or secondary chamber directly between the process chambers, a cooling and reheating of the substrate support and the substrates can be omitted. This results in a reduced energy requirement for heating the successive thermal processes within the substrate processing system. Associated with this is a reduced carbon monoxide output. The fact that the turning station is provided in a separation or secondary chamber directly between the process chambers and thus, if it does not have its own pumping system, operates in the same pressure chamber as the process chambers, also results in a lower energy requirements by eliminating venting and subsequent Evacuate the successive processes.
Insgesamt kann eine Substratbearbeitungsanlage, in welcher die erfindungsgemäße Substratwendeeinrichtung vorgesehen ist, mit einem wesentlich kleineren Footprint als andere Substratbearbeitungsanlagen zur Verfügung gestellt werden, in welchen herkömmliche Wendemechanismen verwendet werden. Zudem ergeben sich geringere Herstellungskosten für die gesamte Substratbearbeitungsanlage durch den Entfall von für das Wenden der Substrate vorgesehenen Ein- und Ausschleusmodulen, da die Wendestation in einer Trenn- bzw. Nebenkammer zwischen den Prozesskammern angeordnet ist. In einer bevorzugten Ausführungsform der vorliegenden Erfindung sind die Halteelemente jeweils beidseitig einer Trägerzelle über dem Substratträger angeordnete, scherenartig relativ zueinander bewegbare Haltearme. Die Haltearme befinden sich in der Position des Substratwendemechanismus, das heißt in einer Ebene oberhalb der durch den Substratträger transportierten Substrate, in welche die Substrate durch das Substrathubsystem angehoben werden. Dabei sind jeweils zwei scherenartig relativ zueinander bewegbare Haltearme auf beiden Seiten eines aus der Trägerzelle nach oben angehobenen Substrates vorgesehen. Durch die scherenartige Relativbewegung können die Haltearme auf einen Substratrandbereich eines Substrates zu- und von diesem Substratrandbereich wieder wegbewegt werden. In einer Endstellung der Aufeinanderzubewegung der Haltearme klemmen bzw. halten die Haltearme den jeweiligen Substratrandbereich. Bei der Voneinanderwegbewegung der Haltearme wird die Klemmung bzw. Halterung des Substratrandbereiches wieder gelöst. Dabei können die Haltearme mit einer solchen Breite vorgesehen werden, dass das Klemmen mehrerer, nebeneinander angeordneter Substrate bzw. von Substraten einer gesamten Substratträgerreihe oder -spalte möglich ist. Das Verwenden scherenartig relativ zueinander bewegbare Haltearme zum Klemmen bzw. Halten der Substrate ermöglicht ein Klemmen bzw. Halten unterschiedlicher Substrate. Somit können Substrate mit unterschiedlicher Dicke geklemmt werden. Auch ist es für das Klemmen unabhängig, ob und wie die Substrate gewölbt sind. Durch die scherenartige Relativbewegung der Haltearme kommt in jedem Fall ein Klemmen zustande. Es ergibt sich erfindungsgemäß auch dann ein zuverlässiges Klemmen, wenn die Substrate geringfügig innerhalb der Trägerzellen oder bei ihrem Anheben aus den Trägerzellen verschoben worden sind. Overall, a substrate processing system in which the substrate inverting device according to the invention is provided can be provided with a substantially smaller footprint than other substrate processing systems in which conventional turning mechanisms are used. In addition, lower production costs for the entire substrate processing system result from the omission of provided for turning the substrates input and Ausschleusmodulen, since the turning station is arranged in a separation or auxiliary chamber between the process chambers. In a preferred embodiment of the present invention, the holding elements are arranged on both sides of a carrier cell above the substrate carrier, scissor-like relative to each other movable holding arms. The support arms are in the position of the substrate turning mechanism, that is, in a plane above the substrates carried by the substrate support into which the substrates are raised by the substrate subsystem. In each case two scissor-like relative to each other movable support arms are provided on both sides of a raised from the support cell substrate. Due to the scissor-like relative movement, the holding arms can be moved toward a substrate edge region of a substrate and moved away again from this substrate edge region. In an end position of the Aufeinanderzubewegung the support arms clamp or hold the holding arms the respective substrate edge region. In the Voneinanderwegbewegung the support arms, the clamping or mounting of the substrate edge area is released again. In this case, the holding arms can be provided with such a width that the clamping of a plurality of juxtaposed substrates or substrates of an entire substrate carrier row or column is possible. The use of scissor-like relative to each other movable support arms for clamping or holding the substrates allows clamping or holding different substrates. Thus, substrates with different thicknesses can be clamped. Also, it is independent for clamping whether and how the substrates are arched. Due to the scissor-like relative movement of the holding arms, a clamping is achieved in each case. It also results according to the invention, a reliable terminals when the substrates have been slightly shifted within the carrier cells or during their lifting from the carrier cells.
Hierbei ist es besonders von Vorteil, wenn auf jeder Seite der wenigstens einen Trägerzelle wenigstens einer der Haltearme einen an seinem freien Ende vorgesehenen Substrathaltebereich mit einer Aussparung aufweist, die tiefer als eine maximale Dicke der Substrate ist. Durch die Aussparung werden die Substrate nicht direkt mit den Oberflächen der Haltearme geklemmt, sondern liegen in einem durch die Aussparung definierten Substrataufnahmespalt zwischen den Haltearmen, werden jedoch dennoch sicher durch die jeweils zwei Haltearme an beiden Seiten des Substrates gehalten. Da die Tiefe der Aussparung tiefer als eine maximale Dicke der Substrate ist, ist in jedem Fall eine sichere Aufnahme aller Substrate gewährleistet. Die Aussparung kann jeweils in beiden der aufeinander zu bewegbaren Haltearme oder nur in einem der Haltearme vorgesehen sein. It is particularly advantageous if on each side of the at least one support cell of at least one of the support arms has a provided at its free end substrate holding portion having a recess which is deeper than a maximum thickness of the substrates. Through the recess, the substrates are not clamped directly to the surfaces of the support arms, but lie in a substrate receiving gap defined by the recess between the support arms, but are still held securely by the two holding arms on both sides of the substrate. Since the depth of the recess is deeper than a maximum thickness of the substrates, a secure recording of all substrates is ensured in each case. The recess can be in both the mutually movable support arms or be provided only in one of the support arms.
In einer möglichen konstruktiven Ausgestaltung dieser Ausführungsvariante ist jeweils ein erster Haltearm strahlenförmig auskragend an einer Innenachse eines rohrförmigen Montageelementes für die Haltearme montiert, wobei um die Innenachse ein Außenrohr vorgesehen ist, an dem ein zweiter Haltearm strahlenförmig auskragend montiert ist. Das Außenrohr weist in dieser Ausführungsform einen für eine Bewegung des ersten Haltearmes ausgesparten Umfangsbereich auf. Zudem sind die Innenachse und das Außenrohr unabhängig voneinander drehbar. Bei dieser Ausführungsvariante können beide Haltearme auf einer Seite der Trägerzelle an einer rohrförmigen Anordnung montiert werden und dennoch relativ zueinander scherenförmig bewegt werden. Dabei können die rohrförmigen Montageelemente einfach durch Verbindungselemente stirnseitig unter Ausbildung einer rahmenförmigen Aufhängung für die Haltearme verbunden werden, wobei der Rahmen an den Verbindungselementen mit einer Drehachse verbunden werden kann, sodass der Rahmen mit den Haltearmen um wenigstens 180° gedreht werden kann. Dabei ist die Drehung des Rahmens unabhängig von der Drehbarkeit der Haltearme. In a possible constructive embodiment of this embodiment, a respective first support arm is radially projecting radially mounted on an inner axis of a tubular mounting member for the support arms, wherein an outer tube is provided around the inner axis, on which a second support arm is radially projecting cantilevered. The outer tube has in this embodiment a recessed for a movement of the first holding arm peripheral region. In addition, the inner axis and the outer tube are independently rotatable. In this embodiment, both support arms can be mounted on one side of the carrier cell to a tubular arrangement and yet be moved in a scissor-like manner relative to each other. The tubular mounting elements can be easily connected by connecting elements frontally to form a frame-shaped suspension for the support arms, wherein the frame can be connected to the connecting elements with a rotation axis, so that the frame can be rotated with the support arms by at least 180 °. The rotation of the frame is independent of the rotatability of the support arms.
Eine definierte Ablage der Substrate in ihre jeweiligen Substrataufnahmebereiche der zugehörigen Trägerzellen in dem Substratträger kann dadurch erreicht werden, dass in einer spezifischen Ausführungsvariante der vorliegenden Erfindung zwischen den in einer Substrathalteposition beidseitig des Substrates gegenüber liegenden Haltearmen unterschiedliche breite Substrataufnahmespalte ausgebildet sind, wobei der bei dem Beginn eines Substratwendevorgangs dem Substrathubsystem gegenüber liegende Substrataufnahmespalt breiter als ein Substrataufnahmebereich der Trägerzelle und breiter als der andere Substrataufnahmespalt ist. Indem derjenige Substrataufnahmespalt, in welchen das Substrat zu Beginn des Substratwendevorgangs nach seinem Anheben aus der Trägerzelle zunächst abgelegt wird, breiter als der Substrataufnahmebereich der Trägerzelle ist, kann das Substrat auch dann geeignet in den Substratwendemechanismus eingebracht werden, wenn das Substrat ursprünglich nicht exakt mittig auf der jeweiligen Trägerzelle aufgelegen hat und/oder während seines Anhebens durch das Substrathubsystem lateral verschoben wurde. Während des Wendens des Substrates bewegt sich das Substrat automatisch in den durch die weiteren Haltearme ausgebilde- ten anderen Substrataufnahmespalt, welcher schmaler als der Substrataufnahmespalt ist, in welchen das Substrat ursprünglich eingelegt wurde. Die Breite des anderen Substrataufnahmespaltes ist dabei an die Breite des Substrataufnahmebereiches der Trägerzelle angepasst. So kann durch eine geeignete Drehung des Substratwendemechanismus um mehr als 180°, vorzugsweise um bis zu 270°, das Substrat nach dem Wenden sicher in dem anderen schmaleren Substrataufnahmespalt aufgenommen werden. Nach dem Wenden des Substrates befindet sich dieser andere schmalere Substrataufnahmespalt in einer Position, in welcher er dem Substrathubsystem gegenüber, also unten, angeordnet ist. So kann das Substrat aus dem schmaleren Substrataufnahmespalt durch das Substrathubsystem aufgenommen und in seine Ursprungsposition in den Substrataufnahmebereich der Trägerzelle abgesenkt werden. Diese Ausführungsform der Erfindung besitzt den besonderen Vorteil, dass Toleranzen der Substrate und/oder Toleranzen in der Einlagegeometrie der Substratträgers durch den spezifisch gestalteten Substratwendemechanismus ausgeglichen werden können. A defined depositing of the substrates into their respective substrate receiving regions of the associated carrier cells in the substrate carrier can be achieved in that in a specific embodiment of the present invention between the holding arms located in a substrate holding position on both sides of the substrate, different width substrate receiving gaps are formed, which at the beginning a substrate turnup process substrate receiving gap opposite the substrate subsystem is wider than a substrate receiving region of the carrier cell and wider than the other substrate receiving gap. Since the substrate receiving gap in which the substrate is initially deposited after it has been lifted out of the carrier cell is wider than the substrate receiving region of the carrier cell, the substrate can also be suitably inserted into the substrate turning mechanism even if the substrate is not initially exactly centered of the respective carrier cell and / or has been laterally displaced during its lifting by the substrate subsystem. During the turning of the substrate, the substrate automatically moves into the space formed by the further holding arms. the other substrate receiving gap, which is narrower than the substrate receiving gap, in which the substrate was originally inserted. The width of the other substrate receiving gap is adapted to the width of the substrate receiving region of the carrier cell. Thus, by suitable rotation of the substrate reversing mechanism by more than 180 °, preferably by up to 270 °, the substrate can be securely received in the other narrower substrate receiving nip after turning. After turning the substrate, this other narrower substrate receiving gap is in a position in which it is the Substratathubsystem opposite, that is arranged below. Thus, the substrate can be picked up from the narrower substrate receiving gap by the substrate subsystem and lowered into its original position into the substrate receiving area of the carrier cell. This embodiment of the invention has the particular advantage that tolerances of the substrates and / or tolerances in the insert geometry of the substrate carrier can be compensated for by the specifically designed substrate reversing mechanism.
Gemäß einer alternativen Ausbildung der vorliegenden Erfindung sind die Halteelemente parallel zueinander in einer horizontalen Ebene gegenüber liegende und in dieser Ebene relativ zueinander bewegbare Halteschienen. Die Halteschienen weisen jeweils zwei übereinander liegende Halteleisten auf, zwischen welchen eine beispielsweise U-, V- oder C-förmige Substrataufnahme zur Aufnahme eines Substratendbereiches wenigstens eines Substrates vorgesehen ist. Die Höhe der Substrataufnahme ist dabei vorzugsweise größer als eine maximale Dicke der Substrate. Damit können die Halteschienen bei ihrer horizontalen Aufeinanderzubewegung gegenüber liegende Randbereiche eines Substrates in den Substrataufnahmen der Halteschienen aufnehmen, sodass das jeweilige Substrat temporär durch die Halteschienen, insbesondere während des Wendens des Substrates, gehalten werden kann. Die Halteschienen können so lang ausgebildet werden, dass eine ganze Reihe von Substraten gleichzeitig geklemmt werden kann. Nach der Beendigung des Wendevorganges können die Halteschienen mit einem geeigneten Mechanismus auf einfache Weise in der Horizontale wieder voneinander wegbewegt werden, um das jeweilige Substrat oder die jeweiligen Substrate wieder freizugeben und durch das Substrathubsystem wieder in die Trägerzellen absenken zu lassen. Es hat sich als günstig erwiesen, wenn die Halteschienen jeweils aus zwei übereinander liegenden Halteleisten ausgebildet sind, die an ihren gegenüber liegenden Innenflächen Auskragungen aus Keramik aufweisen. Diese Auskragungen können beispielsweise na- senförmig ausgebildet sein. Da die Halteleisten vorzugsweise aus Metall ausgebildet sind, wird durch die Auskragungen aus Keramik gewährleistet, dass die Substrate nicht direkt mit dem Metall der Halteschienen in Kontakt kommen, wodurch eine Verunreinigung der Substrate durch Metallpartikel vermieden werden kann. According to an alternative embodiment of the present invention, the holding elements are parallel to each other in a horizontal plane opposite and movable in this plane relative to each other holding rails. The support rails each have two superimposed retaining strips, between which an example U-, V- or C-shaped substrate receptacle for receiving a Substratendbereiches at least one substrate is provided. The height of the substrate holder is preferably greater than a maximum thickness of the substrates. Thus, the support rails can accommodate in their horizontal Aufeinanderzubewegung opposite edge regions of a substrate in the substrate receptacles of the support rails, so that the respective substrate can be temporarily held by the support rails, in particular during the turning of the substrate. The support rails can be made so long that a whole series of substrates can be clamped simultaneously. After completion of the turning process, the support rails can be moved away from each other with a suitable mechanism in a simple manner in the horizontal again to release the respective substrate or the respective substrates and lower by the substrate subsystem back into the carrier cells. It has proved to be advantageous if the retaining rails are each formed from two superimposed retaining strips, which have on their opposite inner surfaces projections of ceramic. These protrusions can be formed, for example, in the form of a socket. Since the retaining strips are preferably formed of metal, it is ensured by the projections made of ceramic, that the substrates do not come directly into contact with the metal of the support rails, whereby contamination of the substrates by metal particles can be avoided.
In einer besonders vorteilhaften Ausführung der erfindungsgemäßen Substratwendeeinrichtung ist eine Substrateinführöffnung und/oder eine Substratausführöffnung der Trennkammer kontinuierlich offen, und die Trennkammer ist durch ein Pumpsystem wenigstens einer benachbarten Prozesskammer evakuierbar. Somit ist es bei dieser Ausführungsform nicht notwendig, in der Trennkammer ein separates Pumpsystem vorzusehen. Vielmehr stellt sich in der Trennkammer die gleiche Atmosphäre wie in der benachbarten Prozesskammer durch die Verwendung ein und desselben Pumpsystems ein. Es ist somit bei dieser Ausführungsform möglich, die Substrate unter den gleichen Druckbedingungen wie in der Prozesskammer zu wenden. In a particularly advantageous embodiment of the substrate inverting device according to the invention, a substrate insertion opening and / or a substrate removal opening of the separation chamber is continuously open, and the separation chamber can be evacuated by a pumping system of at least one adjacent process chamber. Thus, in this embodiment it is not necessary to provide a separate pumping system in the separation chamber. Rather, in the separation chamber, the same atmosphere as in the adjacent process chamber through the use of one and the same pumping system. It is thus possible in this embodiment to apply the substrates under the same pressure conditions as in the process chamber.
In einem weiteren geeigneten Ausführungsbeispiel der vorliegenden Erfindung weist das Substrathubsystem in Transportrichtung der Substrate beabstandete und quer zur Transportrichtung der Substrate versetzt zueinander angeordnete, vertikal ausgerichtete und vertikal bewegbare oder ausfahrbare Stäbe auf, wobei jedem der Substrate drei Stäbe für eine Dreipunktauflage der Substrate auf den Stäben zugeordnet sind. Durch die Verwendung von drei Stäben zum Heben und Absenken der Substrate pro Substrat kann jedes der Substrate sicher auf der Dreipunktauflage angehoben und abgesenkt werden. Da jedes der Substrate nur auf drei Punkten aufliegt, ist zudem der Kontakt zwischen Substrat und Stab sehr gering, sodass Verunreinigungen oder andere Beeinträchtigungen der Substrate durch den Kontakt mit den Stäben gegen null gehen. Zudem können durch das Vorsehen von nur drei Stäben pro Substrat die Konstruktionsaufwendungen für die Wendestation auf ein Minimum reduziert werden. In a further suitable exemplary embodiment of the present invention, the substrate subsystem has vertically aligned and vertically movable or extendable rods spaced apart from one another in the transport direction of the substrates, wherein each of the substrates has three rods for a three-point support of the substrates on the rods assigned. By using three rods to lift and lower the substrates per substrate, each of the substrates can be safely raised and lowered on the three-point support. In addition, since each of the substrates rests only on three points, the contact between substrate and rod is very small, so that contamination or other impairment of the substrates by contact with the rods go to zero. In addition, by providing only three rods per substrate, design effort for the turnover station can be minimized.
In einer besonders geeigneten Variante der vorliegenden Erfindung sind die Stäbe zum Heben und Absenken der Substrate an ihrem den Substraten zugewandten Ende jeweils aus einem nichtmetallischen Werkstoff ausgebildet oder mit einem nichtmetallischen Werkstoff ummantelt. Hierdurch können einerseits Metallverunreinigungen auf den Substratoberflächen vermieden werden, andererseits kann beispielsweise durch schwin- gungsdämpfende Eigenschaften des nichtmetallischen Werkstoffes ein definiert gestalteter Hub- und Senkvorgang realisiert werden. In a particularly suitable variant of the present invention, the rods for raising and lowering the substrates are each formed at their end facing the substrates of a non-metallic material or with a non-metallic Material sheathed. In this way, on the one hand metal contamination on the substrate surfaces can be avoided, on the other hand, for example, by vibration damping properties of the non-metallic material, a defined design lifting and lowering can be realized.
Vorzugsweise ist der Substratträger auf parallelen, in einem Abstand zueinander vorgesehenen Transportrollen geführt, die senkrecht zur Transportrichtung der Substrate in die Trennkammer geführt sind. The substrate carrier is preferably guided on parallel transport rollers provided at a distance from one another which are guided perpendicular to the transport direction of the substrates into the separation chamber.
Bei der erfindungsgemäßen Substratwendeeinrichtung ist es besonders von Vorteil, wenn der Substratträger an der Wendestation in einer Wendestellung durch eine Positioniervorrichtung temporär fixierbar ist. Beispielsweise kann zur Fixierung wenigstens ein vertikal ausgerichtetes und vertikal bewegbares oder ausfahrbares Fixierelement unterhalb des Substratträgers vorgesehen werden, wobei am Substratträger wenigstens eine Buchse zum Eingreifen des Fixierelementes vorgesehen ist. Als Fixierelement kann beispielsweise ein kegelartiges Fixierelement verwendet werden, welches in eine oder mehrere Buchsen, die am Seitenrand des Substratträgers vorgesehen ist oder sind, eingreifen kann. Durch die Fixierung wird der Substratträger genau in der Wendestellung gehalten. Damit ist ein sicheres Heben und Absenken der Substrate, ein exaktes Klemmen und damit sicheres Wenden der Substrate sowie eine genaue Wiederablage der Substrate in den Substratträger möglich. In the case of the substrate turning device according to the invention, it is particularly advantageous if the substrate carrier is temporarily fixable at the turning station in a turning position by a positioning device. For example, at least one vertically aligned and vertically movable or extendable fixing element can be provided below the substrate carrier for fixing, wherein at least one bushing for engaging the fixing element is provided on the substrate carrier. As a fixing, for example, a conical-like fixing can be used, which can engage in one or more sockets, which is or are provided on the side edge of the substrate carrier. By fixing the substrate carrier is kept exactly in the turning position. For a safe lifting and lowering of the substrates, a precise clamping and thus safe turning of the substrates and a precise re-deposition of the substrates in the substrate carrier is possible.
Um die Fixierung zu erleichtern, kann wenigstens im Bereich der Positioniervorrichtung der Substratträger zwischen Transportrollen und einer jeweils oberhalb des Substratträgers an Kammerseitenwänden der Trennkammer vorgesehenen Anschlagschiene geführt sein, wobei die Anschlagschiene einen Gegenhalt für den Substratträger gegenüber dem von unten gegen den Substratträger drückenden Fixierelement ausbildet. In order to facilitate the fixation, at least in the region of the positioning device, the substrate carrier may be guided between transport rollers and a stop rail respectively provided on the chamber side walls of the separation chamber above the substrate carrier, wherein the stop rail forms a counter support for the substrate carrier with respect to the fixing element pressing against the substrate carrier from below.
Die Aufgabe wird ferner durch eine Substratbearbeitungsanlage zur Bearbeitung von plattenförmigen Substraten gelöst, wobei die Substratbearbeitungsanlage eine Durchlaufanlage mit wenigstens zwei Prozesskammern und wenigstens einer Trennkammer zwischen den Prozesskammern ist und wenigstens einen, in wenigstens einer Transportrichtung für die Substrate durch die Durchlaufanlage bewegbaren Substratträger mit mehreren in einer horizontalen Ebene und/oder nacheinander angeordneten rahmenför- migen, innen offenen Trägerzellen zur Auflage jeweils eines Substrates an Substratrandbereichen aufweist und wobei die Substratbearbeitungsanlage eine Ausführungsform der oben beschriebenen erfindungsgemäßen Substratwendeeinrichtung aufweist. The object is further achieved by a substrate processing system for processing plate-shaped substrates, wherein the substrate processing system is a continuous system with at least two process chambers and at least one separation chamber between the process chambers and at least one, in at least one transport direction for the substrates through the conveyor system movable substrate carrier with multiple in a horizontal plane and / or sequentially arranged migen, inside open carrier cells for supporting a respective substrate on the substrate edge regions and wherein the substrate processing system has an embodiment of the substrate turning device according to the invention described above.
In einer weiteren Variante der erfindungsgemäßen Substratbearbeitungsanlage sind die Prozesskammern und die Trennkammer evakuierbare Kammern. In a further variant of the substrate processing system according to the invention, the process chambers and the separation chamber are evacuatable chambers.
In einer bevorzugten Ausführungsform der vorliegenden Erfindung sind in der Trennkammer mehrere in Transportrichtung der Substrate nacheinander angeordnete Wendestationen vorgesehen, mit welchen gleichzeitig die Substrate mehrerer Substratträgerreihen oder -spalten wendbar sind, wobei die Wendestationen einen Abstand voneinander haben, der wenigstens einer Substratträgerreihe oder -spalte entspricht. In einer besonders vorteilhaften Variante dieser Ausführungsform sind in der Trennkammer drei Wendestationen vorgesehen, mit welchen gleichzeitig Substrate von drei Substratträgerreihen gewendet werden können, wobei die Substratträgerreihen einen Abstand voneinander haben, der zwei dazwischen liegenden Substratträgerreihen entspricht. Durch das Vorsehen mehrerer Wendestationen in ein und derselben Trennkammer können die Substrate, die auf einem Substratträger mit mehreren Substratträgerreihen angeordnet sind, besonders effizient umgewendet werden. In a preferred embodiment of the present invention, a plurality of successively arranged in the transport direction of the substrates turning stations are provided in the separation chamber, with which the substrates of several substrate carrier rows or columns are reversible, the turning stations have a distance from each other, which corresponds to at least one substrate carrier row or column , In a particularly advantageous variant of this embodiment, three turning stations are provided in the separating chamber, with which substrates of three substrate carrier rows can be turned at the same time, the substrate carrier rows being at a distance from each other corresponding to two substrate carrier rows located therebetween. By providing a plurality of turning stations in one and the same separating chamber, the substrates which are arranged on a substrate carrier with a plurality of substrate carrier rows can be turned over particularly efficiently.
Hierbei hat es sich als besonders günstig erwiesen, wenn die Substratwendemechanismen der Wendestationen an einem gemeinsamen, Querstreben aufweisenden Trägerrahmen montiert sind. Der Trägerrahmen verleiht der gesamten Anordnung eine deutlich erhöhte Stabilität. It has proven to be particularly advantageous if the substrate turning mechanisms of the turning stations are mounted on a common, transverse struts having support frame. The support frame gives the entire arrangement a significantly increased stability.
Vorzugsweise sind der Substratträger, die Wendestation(en) und der Trägerrahmen für die Wendestation(en) aus einem Kohlefaserverbundwerkstoff ausgebildet. Durch den Einsatz eines solchen Werkstoffes können Substratträger, Wendestationen(en) und Trägerrahmen für die Wendestation(en) hochstabil und dennoch mit verhältnismäßig geringem Gewicht ausgebildet werden. Darüber hinaus zeichnen sich Kohlefaserverbundwerkstoffe durch eine hohe Temperaturbeständigkeit aus und dehnen sich bei Temperaturbeeinflussung so gut wie nicht aus, wodurch sich dauerhaft hohe Positioniergenauigkeiten der Substrate während des Wendevorganges in der Wendestation ergeben. Vorzugsweise sind die Antriebsmotoren für das Bewegen bzw. Ausfahren der Stäbe und das Drehen des Rahmens des Substratwendemechanismus au ßerhalb der Trennkammer vorgesehen. Dies erleichtert das Anschließen und die Wartung der Antriebsmotoren und verringert die Partikelbelastung im Inneren der Trennkammer. In anderen Varianten der Erfindung kann es jedoch von Vorteil sein, die Antriebsmotoren im Inneren der Trennkammer vorzusehen. Preferably, the substrate carrier, the turning station (s) and the carrier frame for the turning station (s) are formed of a carbon fiber composite material. By using such a material substrate carrier, turning stations (s) and support frame for the turning station (s) can be highly stable and yet formed with relatively low weight. In addition, carbon fiber composites are characterized by a high temperature resistance and do not expand when influenced by temperature, which results in permanently high positioning accuracies of the substrates during the turning process in the turning station. Preferably, the drive motors for moving or extending the rods and rotating the frame of the substrate turning mechanism are provided outside the separation chamber. This facilitates the connection and maintenance of the drive motors and reduces the particle load inside the separation chamber. In other variants of the invention, however, it may be advantageous to provide the drive motors inside the separation chamber.
In einer günstigen Weiterbildung der vorliegenden Erfindung ist in der Trennkammer eine von den benachbarten Prozesskammern separate Temperiervorrichtung, wie eine Heizung oder eine Kühlvorrichtung, vorgesehen. Hierdurch können Temperaturinhomogenitäten, die sich durch den Transport der Substrate und den Aufenthalt der Substrate in der Trennkammer ergeben, ausgeglichen werden. In a favorable development of the present invention, a temperature control device separate from the adjacent process chambers, such as a heater or a cooling device, is provided in the separation chamber. As a result, temperature inhomogeneities, which result from the transport of the substrates and the residence of the substrates in the separation chamber, can be compensated.
Bevorzugte Ausführungsformen der vorliegenden Erfindung, deren Aufbau, Funktion und Vorteile werden im Folgenden an Hand der Figuren der Zeichnung näher erläutert, wobei Preferred embodiments of the present invention, their structure, function and advantages are explained in more detail below with reference to the figures of the drawing, wherein
Figur 1 eine perspektivische Draufsicht auf eine oben offene Trennkammer mit einer Substratwendeeinrichtung gemäß einer Ausführungsform der vorliegenden Erfindung zeigt; FIG. 1 shows a perspective top view of an open-topped separation chamber with a substrate inverting device according to an embodiment of the present invention;
Figur 2 bis Figur 6 Schritte einer Prozessabfolge zum Wenden mit einer Substratwendeeinrichtung von Substraten gemäß einer Ausführungsform der vorliegenden Erfindung zeigen; Figure 2 to Figure 6 show steps of a process sequence for turning with substrate inverting means of substrates according to an embodiment of the present invention;
Figur 7 schematisch eine Draufsicht auf einen Teil eines Substratwendemechanismus gemäß einer Ausführungsform der vorliegenden Erfindung zeigt; Figure 7 shows schematically a plan view of a part of a substrate turning mechanism according to an embodiment of the present invention;
Figur 8 bis Figur 10 schematisch Schritte einer Prozessabfolge zum Wenden von Substraten mit einer Substratwendeeinrichtung gemäß einer weiteren Ausführungsform der vorliegenden Erfindung zeigen; Figur 1 1 schematisch einen Teil einer Seitenansicht eines im Zusammenhang mit der erfindungsgemäßen Substratwendeeinrichtung verwendeten Substratträgers während seines Durchlaufs durch eine Trennkammer zeigt; und Figure 8 to Figure 10 schematically show steps of a process sequence for turning substrates with a substrate inverting device according to another embodiment of the present invention; Figure 1 1 shows schematically a part of a side view of a substrate carrier used in connection with the substrate inverting device according to the invention during its passage through a separation chamber; and
Figur 12 bis Figur 16 schematisch Schritte einer Prozessabfolge zum Wenden von Substraten mit einer weiteren Ausführungsform einer Substratwendeeinrichtung gemäß der vorliegenden Erfindung zeigen. Figures 12 to 16 schematically show steps of a process sequence for turning substrates with another embodiment of a substrate inverting device according to the present invention.
Fig. 1 zeigt eine perspektivische Ansicht einer hier oben offen dargestellten Trennkammer 1 einer Substratbearbeitungsanlage. Vor und/oder nach der Trennkammer 1 sind jeweils Prozesskammern der Substratbearbeitungsanlage direkt im Anschluss an die Trennkammer 1 angeordnet, wobei in Figur 1 der Übersichtlichkeit halber die Prozesskammern nicht dargestellt sind. 1 shows a perspective view of a separation chamber 1 of a substrate processing installation, which is disclosed here above. Before and / or after the separation chamber 1, process chambers of the substrate processing system are respectively arranged directly after the separation chamber 1, the process chambers not being shown in FIG. 1 for the sake of clarity.
Die Substratbearbeitungsanlage ist eine sogenannte Durchlaufanlage, durch welche ein Substratträger 2 in einer horizontalen Ebene der Durchlaufanlage hindurch bewegt wird. Der Substratträger 2 weist mehrere Trägerzellen 3 zur Aufnahme von Substraten 4 auf. In dem in Fig. 1 dargestellten Ausführungsbeispiel weist der Substratträger 2 mehrere nebeneinander und nacheinander angeordnete rahmenförmige, innen offene Trägerzellen 3 auf, auf welche jeweils ein Substrat 4 an dessen Substratrandbereichen 5 aufgelegt wird. Dabei sind die Trägerzellen 3 des Substratträgers 2 reihen- und spaltenförmig angeordnet. Beispielsweise kann ein Substratträger 2 mit neun Substratträgerreihen 6 und fünf Substratträgerspalten 7, wie in dem Beispiel von Figur 1 gezeigt, verwendet werden. Selbstverständlich können die Anzahl der Substratträgerreihen 6 und -spalten 7 des Substratträgers 2 wahlfrei variiert werden. So ist es grundsätzlich auch möglich, dass der Substratträger 2 nur eine einzige Substratträgerreihe 6 oder nur eine einzige Substratträgerspalte 7 aufweist.  The substrate processing system is a so-called continuous system, through which a substrate carrier 2 is moved in a horizontal plane of the continuous system. The substrate carrier 2 has a plurality of carrier cells 3 for receiving substrates 4. In the exemplary embodiment illustrated in FIG. 1, the substrate carrier 2 has a plurality of side-by-side and successively arranged frame-shaped, inner open carrier cells 3, on each of which a substrate 4 is placed on its substrate edge regions 5. The carrier cells 3 of the substrate carrier 2 are arranged in rows and columns. For example, a substrate carrier 2 with nine substrate carrier rows 6 and five substrate carrier columns 7, as shown in the example of FIG. 1, can be used. Of course, the number of substrate carrier rows 6 and columns 7 of the substrate carrier 2 can be varied as desired. Thus, in principle it is also possible for the substrate carrier 2 to have only a single substrate carrier row 6 or only a single substrate carrier column 7.
Obwohl in dem Beispiel von Fig. 1 die Trägerzellen 3 zur Aufnahme von quadratischen Substraten 4 ausgebildet sind, ist es auch möglich, dass Trägerzellen 3 zur Aufnahme von rechteckigen Substraten 4 mit unterschiedlichen Seitenlängen verwendet werden. In jedem Fall ist die erfindungsgemäße Vorrichtung jedoch für solche Substratbearbeitungsanlagen vorgesehen, in welchen plattenförmige Substrate 4, wie beispielsweise Wafer zur Solarzellenherstellung, bearbeitet werden. Unter einer Bearbeitung der Sub- strate 4 ist hierbei insbesondere ein Beschichten von Substraten 4 zu verstehen. Die Prozesskammern der Substratbearbeitungsanlage können jedoch auch zu anderen Substratbearbeitungsprozessen, wie beispielsweise Diffusionsprozessen, Feuerungsprozessen, Ätzprozessen und/oder Reinigungsprozess, eingesetzt werden, in welchen es erforderlich ist, gegebenenfalls eine Substratvorderseite 29 eines Substrates 4 anders als dessen Substratrückseite 30 zu behandeln und daher die Substrate 4 zwischenzeitlich zu wenden. Although in the example of FIG. 1 the support cells 3 are designed to receive square substrates 4, it is also possible for support cells 3 to be used to receive rectangular substrates 4 with different side lengths. In any case, however, the device according to the invention is intended for those substrate processing systems in which plate-shaped substrates 4, such as, for example, wafers for solar cell production, are processed. Under a processing of the sub- strate 4 is to be understood here in particular as a coating of substrates 4. However, the process chambers of the substrate processing equipment can also be used for other substrate processing processes, such as diffusion processes, firing processes, etching processes and / or cleaning processes, in which it is necessary to treat a substrate front side 29 of a substrate 4 other than its substrate backside 30 and therefore the substrates 4 in the meantime.
Der Substratträger 2 wird aus einer vorgeschalteten Prozesskammer durch eine Substrateinführöffnung 8 in die Trennkammer 1 eingebracht und über eine Substratausführöffnung 9 am Ende der Trennkammer 1 wieder in die nächste Prozesskammer eingeführt. In der in Fig. 1 dargestellten Ausführungsvariante der Trennkammer 1 sind die Substrateinführöffnung 8 und die Substratausführöffnung 9 der Trennkammer 1 kontinuierlich offen und die Trennkammer 1 ist durch ein hier nicht dargestelltes Pumpsystem wenigstens einer benachbarten Prozesskammer evakuierbar. Damit stellen sich innerhalb der Trennkammer 1 die gleichen Druckverhältnisse wie in der benachbarten Prozesskammer 1 ein. Grundsätzlich ist es erfindungsgemäß jedoch auch möglich, in der Trennkammer 1 eine eigene Vakuumpumpe vorzusehen. The substrate carrier 2 is introduced from an upstream process chamber through a Substrateinführöffnung 8 in the separation chamber 1 and introduced via a Substratausführöffnung 9 at the end of the separation chamber 1 again in the next process chamber. In the embodiment variant of the separation chamber 1 shown in FIG. 1, the substrate insertion opening 8 and the substrate removal opening 9 of the separation chamber 1 are continuously open and the separation chamber 1 can be evacuated by a pumping system, not shown here, of at least one adjacent process chamber. Thus set within the separation chamber 1, the same pressure conditions as in the adjacent process chamber 1 a. In principle, however, it is also possible according to the invention to provide a separate vacuum pump in the separation chamber 1.
Vorzugsweise wird die erfindungsgemäße Substratwendeeinrichtung zum Wenden von Substraten bei sich von Atmosphärendruck unterscheidenden Druckverhältnissen in den Prozesskammern und der Trennkammer 1 , wie beispielsweise im Vakuum, eingesetzt und wurde insbesondere für diesen Fall, für welchen bisher keine geeignete Substratwendeeinrichtung bekannt war, konzipiert. Preferably, the substrate inverting device according to the invention is used for turning substrates at pressure conditions other than atmospheric pressure in the process chambers and the separation chamber 1, such as in a vacuum, and has been designed especially for this case, for which no suitable substrate inverting device was previously known.
Die Trägerzellen 3 des Substratträgers sind in dem dargestellten Ausführungsbeispiel doppelnestförmig ausgebildet, sodass jedes der Substrate 4 auch nach einem Verschieben eines Substrates 4 sicher auf der jeweiligen Trägerzelle 3 aufliegt. The carrier cells 3 of the substrate carrier are formed in the embodiment shown in the double-nest shape, so that each of the substrates 4 rests securely on the respective carrier cell 3 even after a displacement of a substrate 4.
Die Trennkammer 1 weist in dem in Fig. 1 dargestellten Ausführungsbeispiel drei Wendestationen 10 auf, die in Transportrichtung A der Substrate 4 durch die Durchlaufanlage nacheinander in einem Abstand voneinander angeordnet sind. In dem gezeigten Beispiel entspricht dieser Abstand zwei Substratträgerreihen 6, kann jedoch in anderen Ausführungsformen auch geringer oder größer sein. Der Abstand muss jedoch so groß sein, dass ein ungehindertes Drehen der Substrate 4 möglich ist. In anderen, nicht gezeigten Ausführungsformen der vorliegenden Erfindung kann in der Trennkammer 1 auch nur eine einzige Wendestation 10 oder eine andere Anzahl von Wendestationen 10 vorgesehen sein. In the exemplary embodiment illustrated in FIG. 1, the separation chamber 1 has three turning stations 10, which are arranged one after the other at a distance from one another in the transport direction A of the substrates 4 through the continuous installation. In the example shown, this distance corresponds to two rows of substrate carriers 6, but in other embodiments may also be smaller or larger. The distance, however, must be so great that unimpeded rotation of the substrates 4 is possible. In other, not shown embodiments of the present invention, only a single turning station 10 or a different number of turning stations 10 may be provided in the separation chamber 1.
An jeder der Wendestationen 10 ist in einer Ebene unterhalb der Ebene des Substratträgers 2 ein Substrathubsystem zum Heben und Absenken der Substrate 4 vorgesehen. Das Substrathubsystem weist in dem gezeigten Ausführungsbeispiel mehrere vertikal ausgerichtete und vertikal bewegbare oder ausfahrbare Stäbe 1 1 zum Heben und Absenken der Substrate 4 aus bzw. in die Trägerzellen 3 des Substratträgers 2 auf. In dem Beispiel von Fig. 1 sind die Stäbe 1 1 aus Stahl ausgebildet, wobei an den jeweiligen freien Stabenden der Stäbe 1 1 , die jeweils den Substraten 4 zugewandt sind, die Stäbe 1 1 eine Spitze 27 aus einem nichtmetallischen Werkstoff oder eine Ummantelung aus einem nichtmetallischen Werkstoff aufweisen. Es ist jedoch auch möglich, dass die Stäbe 1 1 aus einem anderen geeigneten, temperaturbeständigen Material ausgebildet sind. At each of the turning stations 10, a substrate subsystem for raising and lowering the substrates 4 is provided in a plane below the plane of the substrate carrier 2. In the exemplary embodiment shown, the substrate subsystem has a plurality of vertically aligned and vertically movable or extendable rods 11 for lifting and lowering the substrates 4 from or into the carrier cells 3 of the substrate carrier 2. In the example of Fig. 1, the rods 1 1 are formed of steel, wherein at the respective free rod ends of the rods 1 1, which respectively face the substrates 4, the rods 1 1 a tip 27 made of a non-metallic material or a sheath a non-metallic material. However, it is also possible that the rods 1 1 are formed from another suitable, temperature-resistant material.
Zum Heben und Senken der Stäbe 1 1 kann beispielsweise eine Nockenanordnung verwendet werden. Dabei ist das Substrathubsystem jeweils so ausgebildet, dass jeweils alle zu einer Wendestation 10 zugehörigen Stäbe 1 1 gemeinsam vertikal bewegt oder aus- bzw. eingefahren werden. For lifting and lowering of the rods 1 1, for example, a cam arrangement can be used. In this case, the substrate subsystem is in each case designed in such a way that in each case all the rods 1 1 associated with a turning station 10 are vertically moved together or extended or retracted.
In dem Beispiel von Fig. 1 sind in jeder der Wendestationen 10 in Transportrichtung A der Substrate 4 nacheinander drei Reihen von Stäben 1 1 vorgesehen. Dabei sind die Stäbe 1 1 derart voneinander beabstandet und versetzt zueinander angeordnet, dass jeder der Trägerzellen 3 und damit jedem Substrat 4 drei Stäbe 1 1 zugeordnet sind. In anderen, nicht gezeigten Ausführungsformen der vorliegenden Erfindung können auch mehr als drei Stäbe 1 1 einem Substrat 4 zugeordnet sein. Da die Substrate 4 horizontal auf den Trägerzellen 3 aufliegen und die Stäbe 1 1 vertikal ausgerichtet sind, liegt jeweils ein Substrat 4 beim Anheben bzw. Ausfahren der Stäbe 1 1 auf den Spitzen 27 von jeweils drei Stäben 1 1 auf. Durch die Dreipunktauflage wird das Substrat 4 sicher durch die Stäbe 3 gehalten und kann durch die Stäbe 3 weiter nach oben in eine oberhalb des Substratträgers 2 befindliche Ebene mit einem Substratwendemechanismus gebracht werden. Der Substratwendemechanismus weist relativ zueinander bewegbare Halteelemente zum Klemmen bzw. Halten der Substrate 4 an zwei gegenüber liegenden Substratrandbereichen auf. Die Halteelemente oder, in anderen Ausführungsbeispielen der Erfindung, Drehachsen der Halteelemente sind durch quer zu den Halteelementen vorgesehene Verbindungselemente 12 in Form eines Rahmens 13 miteinander verbunden. Die Verbindungselemente 12 sind wiederum mittig mit einer Drehachse 39 verbunden, sodass der Rahmen 13 um seine horizontale, hier quer zur Transportrichtung A der Substrate 4 ausgerichtete, Mittelachse 38 um wenigstens 180° drehbar ist. In the example of FIG. 1, three rows of bars 1 1 are provided in succession in each of the turning stations 10 in the transport direction A of the substrates 4. In this case, the rods 1 1 are spaced apart from one another and offset relative to one another such that each of the support cells 3 and thus each substrate 4 are assigned three rods 1 1. In other, not shown embodiments of the present invention, more than three rods 1 1 may be assigned to a substrate 4. Since the substrates 4 rest horizontally on the support cells 3 and the rods 1 1 are vertically aligned, each is a substrate 4 when lifting or extending the rods 1 1 on the tips 27 of three rods 1 1 on. By the three-point support, the substrate 4 is securely held by the rods 3 and can be brought by the rods 3 further upwards in a plane located above the substrate support 2 level with a substrate turning mechanism. The substrate turning mechanism has holding members movable relative to each other for clamping the substrates 4 to two opposite substrate edge portions. The holding elements or, in other embodiments of the invention, axes of rotation of the holding elements are connected by transverse to the holding elements provided connecting elements 12 in the form of a frame 13 with each other. The connecting elements 12 are in turn centrally connected to a rotation axis 39, so that the frame 13 about its horizontal, here transverse to the transport direction A of the substrates 4 aligned, central axis 38 is rotatable by at least 180 °.
In dem Ausführungsbeispiel von Fig. 1 befinden sich die Antriebsmotoren für das Bewegen bzw. Ausfahren der Stäbe 1 1 und das Drehen des Rahmens 13 des Substratwendemechanismus außerhalb der Trennkammer 1 . In anderen Ausführungsformen der Erfindung können diese Antriebsmechanismen auch innerhalb der Trennkammer 1 vorgesehen sein. In the embodiment of FIG. 1, the drive motors for moving or extending the bars 11 and rotating the frame 13 of the substrate turning mechanism are located outside the separation chamber 1. In other embodiments of the invention, these drive mechanisms may also be provided within the separation chamber 1.
In dem in Fig. 1 dargestellten Ausführungsbeispiel sind die Halteelemente einander in der Transportrichtung A der Substrate 4 parallel gegenüber liegende und in Transportrichtung A der Substrate 4 relativ zueinander bewegbare Halteschienen 14, 15. Die Halteschienen 14, 15 weisen in dem gezeigten Beispiel ein etwa U-förmiges Profil auf, wobei die Öffnungen des„U" einander gegenüber liegen. Grundsätzlich ist jedoch auch ein anderes geeignetes Klemmprofil, wie beispielsweise eine„V"- oder„C"-Form, hier einsetzbar. Das Profil wird durch zwei übereinander liegende Halteleisten 16 ausgebildet, wobei der Abstand zwischen den übereinanderliegenden Halteleisten 16 größer als eine maximale Dicke der Substrate 4 ist. In the embodiment shown in Fig. 1, the holding elements are mutually parallel in the transport direction A of the substrates 4 and in the transport direction A of the substrates 4 relatively movable support rails 14, 15. The support rails 14, 15 have in the example shown approximately U In principle, however, also another suitable clamping profile, such as a "V" or "C" shape, can be used here.The profile is formed by two superimposed retaining strips 16 formed, wherein the distance between the superimposed retaining strips 16 is greater than a maximum thickness of the substrates 4.
An den jeweils gegenüber liegenden Innenflächen der Halteleisten 16 können beispielsweise nasenförmige Auskragungen aus Keramik vorgesehen sein. At the respectively opposite inner surfaces of the retaining strips 16 may be provided, for example, nose-shaped projections made of ceramic.
Die Substratwendemechanismen der Wendestationen 10 sind in dem in Fig. 1 dargestellten Ausführungsbeispiel an einem gemeinsamen, Querstreben 17 aufweisenden Trägerrahmen 18 montiert. Der Substratträger 2, die Wendestationen 10 und der Trägerrahmen 18 für die Wendestationen 10 sind in dem gezeigten Ausführungsbeispiel aus Stahl ausgebildet. In einer besonders geeigneten Ausführungsform der Erfindung kön- nen der Substratträger 2, die Wendestationen 10 und der Trägerrahmen 18 für die Wendestationen 10 auch aus einem Kohlefaserverbundwerkstoff ausgebildet sein. The substrate turning mechanisms of the turning stations 10 are mounted in the embodiment shown in Fig. 1 on a common, transverse struts 17 having support frame 18. The substrate carrier 2, the turning stations 10 and the support frame 18 for the turning stations 10 are formed in the embodiment shown made of steel. In a particularly suitable embodiment of the invention NEN of the substrate carrier 2, the turning stations 10 and the support frame 18 for the turning stations 10 also be formed of a carbon fiber composite material.
In dem Beispiel von Fig. 1 ist in der Trennkammer 1 keine separate Heizung vorgesehen. Die Beheizung der Trennkammer 1 erfolgt vielmehr durch die in Verbindung mit der Trennkammer 1 stehenden Prozesskammern. In einer anderen, nicht gezeigten Variante der vorliegenden Erfindung ist es jedoch auch möglich, dass in der Trennkammer 1 eine von den benachbarten Prozesskammern separate Heizung vorgesehen ist. Wie oben ausgeführt, ist es auch möglich, dass die Trennkammer 1 ein separates Pumpsystem zur Einstellung definierter Druckverhältnisse in der Trennkammer 1 aufweist. In the example of FIG. 1, no separate heating is provided in the separation chamber 1. The heating of the separation chamber 1 is effected rather by the standing in conjunction with the separation chamber 1 process chambers. In another variant, not shown, of the present invention, however, it is also possible for a heater separate from the adjacent process chambers to be provided in the separation chamber 1. As stated above, it is also possible that the separation chamber 1 has a separate pumping system for setting defined pressure conditions in the separation chamber 1.
Anstelle der in Fig. 1 verwendeten Halteschienen 14, 15 können in anderen Varianten der vorliegenden Erfindung auch andere Halteelemente, wie beispielsweise die in den Fig. 2 bis 7 oder 12 bis 16 schematisch dargestellten Haltearme zum Halten der Substrate 4 während ihres Wendens durch den Substratwendemechanismus verwendet werden. Instead of the retaining rails 14, 15 used in Fig. 1, in other variants of the present invention, other holding elements, such as in FIGS. 2 to 7 or 12 to 16 schematically illustrated holding arms for holding the substrates 4 during their turning by the substrate turning mechanism be used.
Die Fig. 2 bis 6 zeigen schematisch Schritte einer Prozessabfolge zum Wenden von Substraten 4 gemäß einer möglichen Ausführungsform der erfindungsgemäßen Substratwendeeinrichtung. In den Fig. 2 bis 6 kommt dabei eine Substratwendeeinrichtung zum Einsatz, die zum Klemmen bzw. Halten eines Substrates 4 Halteelemente in Form von jeweils beidseitig einer Trägerzelle 3 oberhalb des Substratträgers 2 angeordneten, scherenartig relativ zueinander bewegbaren Haltearmen 19, 20; 21 , 22 verwendet. FIGS. 2 to 6 schematically show steps of a process sequence for turning substrates 4 according to a possible embodiment of the substrate turning device according to the invention. In FIGS. 2 to 6, a substrate inverting device is used which, in order to clamp or hold a substrate 4, has holding elements in the form of support arms 3, each on both sides of a carrier cell 3, above the substrate carrier 2, holding arms 19, 20 which can be moved like scissors. 21, 22 used.
Wie in Fig. 7 im Detail gezeigt, ist dabei jeweils einer der Haltearme 19, 21 an einer Innenachse 23 eines rohrförmigen Montageelementes derart montiert, dass er strahlenförmig von der Innenachse 23 absteht. Um die Innenachse 23 ist ein Außenrohr 24 vorgesehen, von welchem der jeweils zweite Haltearm 20, 22 strahlenförmig auskragt. Die Innenachse 23 und das Au ßenrohr 24 sind jeweils unabhängig voneinander drehbar. Dabei weist das Außenrohr 24, wie es in Fig. 7 näher gezeigt ist, einen ausgesparten Umfangsbereich 25 auf, der es ermöglicht, dass die Haltearme 19, 21 , die an den Innenachsen 23 befestigt sind, relativ zu den Haltearmen 20, 22, die an den Au ßenrohren 24 befestigt sind, bewegbar sind. Dabei sind die Haltearme 19 und 20 bzw. 21 und 22 jeweils vorzugsweise durch einen Federmechanismus verbunden, durch welchen die je- weiligen Haltearme automatisch beispielsweise in eine horizontale Ausrichtung zum Halten der Substrate 4 gebracht werden. As shown in detail in FIG. 7, in each case one of the holding arms 19, 21 is mounted on an inner axis 23 of a tubular mounting element in such a way that it protrudes radially from the inner axis 23. To the inner axis 23, an outer tube 24 is provided, from which the respective second holding arm 20, 22 projecting radially. The inner axis 23 and the Au ßenrohr 24 are each independently rotatable. In this case, the outer tube 24, as shown in more detail in Fig. 7, a recessed peripheral portion 25, which allows the holding arms 19, 21 which are fixed to the inner axes 23, relative to the support arms 20, 22, the are attached to the Au ßenrohren 24, are movable. The holding arms 19 and 20 or 21 and 22 are each preferably connected by a spring mechanism, by which the respective Weil retaining arms are automatically brought, for example, in a horizontal orientation for holding the substrates 4.
Auf jeder Seite der wenigstens einen Trägerzelle 3 und damit auf jeder Seite wenigstens eines Substrates 4 weist wenigstens einer der Haltearme 19, 20; 21 , 22 einen an seinem freien Ende vorgesehenen Substratklemmbereich mit einer Aussparung 26 auf. Die Aussparung 26 besitzt eine Tiefe t, die tiefer als eine maximale Dicke d der Substrate 4 ist. On each side of the at least one support cell 3 and thus on each side of at least one substrate 4, at least one of the support arms 19, 20; 21, 22 a provided at its free end substrate clamping area with a recess 26. The recess 26 has a depth t which is deeper than a maximum thickness d of the substrates 4.
Obwohl in den Figuren 2 bis 6 jeweils Aussparungen 26 in allen Haltearmen 19, 20; 21 , 22 vorgesehen sind, ist es grundsätzlich ausreichend, wenn die Aussparungen 26 nur in einem der Haltearme 19 oder 20 bzw. 21 oder 22, vorzugsweise jedoch in den in Fig. 2 unten angeordneten Haltearmen 19 und 21 , vorgesehen sind. Die Aussparungen 26 definieren den Bereich, in welchem die Substratrandbereiche 5 der zu wendenden Substrate 4 während des Wendens gehalten werden. Ist in den Haltearmen 20, 22 ebenfalls eine Aussparung 26, wie in Fig. 2 gezeigt, vorgesehen, sind diese vorzugsweise spiegelsymmetrisch wie die der unteren Haltearme 19, 21 ausgebildet. Although in Figures 2 to 6 respectively recesses 26 in all support arms 19, 20; 21, 22 are provided, it is basically sufficient if the recesses 26 are provided only in one of the holding arms 19 or 20 or 21 or 22, but preferably in the bottom in Fig. 2 arranged holding arms 19 and 21. The recesses 26 define the region in which the substrate edge regions 5 of the substrates 4 to be used are held during turning. If a recess 26, as shown in FIG. 2, is also provided in the holding arms 20, 22, these are preferably mirror-symmetrical as those of the lower holding arms 19, 21.
Fig. 2 zeigt einen Schritt einer Schrittabfolge zum Wenden eines Substrates 4, bei welchem das Substrat 4 durch die unter der Trägerzelle 3 vorgesehenen Stäbe 1 1 vertikal nach oben angehoben wird. Hierfür werden wenigstens drei Stäbe 1 1 , vorzugsweise genau drei Stäbe 1 1 , zum Anheben jedes der Substrate 4 in die in Fig. 2 dargestellte Wendeposition benötigt. In der Wendeposition liegt das Substrat 4 auf Höhe der Drehachse der Innenachse 23 und des Außenrohres 24. Anstelle der Stäbe 1 1 kann in anderen Ausführungsvarianten der Erfindung auch ein anderes geeignetes Substrathubsystem zum Heben und Absenken der Substrate 4, wobei die Substrate vorzugsweise nur auf drei Punkten einer Substratauflage beim Heben und Absenken aufliegen, verwendet werden. 2 shows a step of a sequence of steps for turning over a substrate 4, in which the substrate 4 is lifted vertically upward by the bars 1 1 provided below the carrier cell 3. For this purpose, at least three rods 1 1, preferably exactly three rods 1 1, required for lifting each of the substrates 4 in the turning position shown in Fig. 2. In the reversing position, the substrate 4 is at the height of the axis of rotation of the inner axis 23 and the outer tube 24. Instead of the rods 1 1 can in other embodiments of the invention, another suitable substrate subsystem for raising and lowering of the substrates 4, the substrates preferably only three Points of a substrate support during lifting and lowering rest, can be used.
In dem in Fig. 3 dargestellten Schritt wird das Substrat 4 noch etwas über die Wendeposition von Fig. 2 nach oben durch die Stäbe 1 1 angehoben. In dieser Position des Substrates 4 werden die unteren Haltearme 19, 21 entsprechend der durch die Pfeile B, C gekennzeichneten Drehrichtungen relativ zu dem jeweils anderen Haltearm 20, 22 in Richtung des Substrates 4 nach innen bewegt, bis sie horizontal ausgerichtet sind. Daraufhin werden die Stäbe 1 1 entsprechend der durch den Pfeil D gekennzeichneten Be- wegungsrichtung wieder nach unten bewegt und das Substrat 4 auf den durch die Aussparungen 26 der Haltearme 19, 21 definierten Auflagebereich aufgelegt. Das Substrat 4 wird hierbei geeignet in einen Zwischenraum eingeführt, der durch die Aussparungen 26 der Haltearme 19, 21 definiert ist. Daraufhin werden die oberen Haltearme 20, 22 relativ zu den Haltearmen 19, 21 nach innen bis in ihre horizontale Ausrichtung geschwenkt. In the step shown in FIG. 3, the substrate 4 is raised slightly above the turning position of FIG. In this position of the substrate 4, the lower support arms 19, 21 are moved relative to the respective other holding arm 20, 22 in the direction of the substrate 4 in accordance with the directions indicated by the arrows B, C, until they are aligned horizontally. Thereafter, the rods 1 1 corresponding to the marked by the arrow D Be movement direction down again moved and the substrate 4 placed on the defined by the recesses 26 of the support arms 19, 21 support area. The substrate 4 is suitably inserted into a gap which is defined by the recesses 26 of the holding arms 19, 21. Thereafter, the upper support arms 20, 22 are pivoted relative to the support arms 19, 21 inwardly to their horizontal orientation.
Eine geklemmte bzw. gehaltene Anordnung des Substrates 4 in durch die Aufnahmen 26 definierten Substrataufnahmespalten zwischen den Haltearmen 19, 20; 21 , 22 ist in Fig. 4 dargestellt. Dabei wird das Substrat 4 sicher zwischen den Haltearmen 19, 22; 21 , 22 gehalten, ist jedoch nicht fest geklemmt. Entsprechend kann, wie es in Fig. 4 durch die Pfeile E, F dargestellt ist, die gesamte Anordnung um eine horizontale Drehachse 38 um wenigstens 180° gedreht werden. Durch diese Drehung wird eine Substratvorderseite 29 des Substrates 4 nach unten und eine Substratrückseite 30 des Substrates 4 nach oben bewegt, also das Substrat 4 gewendet. A clamped or held arrangement of the substrate 4 in defined by the receptacles 26 substrate receiving gaps between the support arms 19, 20; 21, 22 is shown in Fig. 4. In this case, the substrate 4 is securely between the holding arms 19, 22; 21, 22 held, but is not clamped. Accordingly, as shown in Fig. 4 by the arrows E, F, the entire assembly can be rotated about a horizontal axis of rotation 38 by at least 180 °. As a result of this rotation, a substrate front side 29 of the substrate 4 is moved downward and a substrate rear side 30 of the substrate 4 is moved upward, that is to say the substrate 4 is turned.
Fig. 4 zeigt vom Grundsatz her eine„Nulllage" der Halteelemente der vorliegenden Erfindung, in welche die Halteelemente vorzugsweise automatisch - beispielsweise durch eine an den Halteelementen vorgesehene Federkonstruktion - scherenartig bewegt werden. Fig. 4 shows in principle a "zero position" of the holding elements of the present invention, in which the holding elements preferably automatically - for example, by a provided on the holding elements spring construction - are moved like a scissor.
Fig. 5 zeigt schematisch einen nächsten Schritt der Schrittabfolge zum Wenden des Substrates 4. Dabei werden zunächst die oberen Haltearme 20, 22 relativ von den jeweils anderen Haltearmen 19, 21 entsprechend der durch die Pfeile H, I gekennzeichneten Bewegungsrichtungen wegbewegt. Daraufhin werden die Stäbe 1 1 wieder gemäß der durch den Pfeil J dargestellten Bewegungsrichtung nach oben, in Richtung auf das Substrat 4 gefahren und das Substrat 4 in eine Position oberhalb der Wendeposition angehoben. Fig. 5 shows schematically a next step of the step sequence for turning the substrate 4. At first, the upper holding arms 20, 22 are relatively moved away from the respective other holding arms 19, 21 in accordance with the movement directions indicated by the arrows H, I. Thereafter, the rods 1 1 are again moved in accordance with the direction of movement shown by the arrow J upwards, in the direction of the substrate 4 and the substrate 4 is raised to a position above the turning position.
Nachfolgend werden, wie in Fig. 6 schematisch dargestellt, auch die unteren beiden Haltearme 19, 21 in ihre Ursprungsposition zurückbewegt. Danach kann das gewendete Substrat 4 gemäß der durch den Pfeil K gezeigten Bewegungsrichtung der Stäbe 1 1 mit diesen wieder nach unten gefahren und mit seinen Substratrandbereichen auf der jeweils zugehörigen Trägerzelle 3 abgelegt werden. Ferner wird nach erfolgtem Substratwendevorgang der Rahmen 13 entweder um weitere 180° entsprechend der in Fig. 4 gezeigten Drehrichtungen E, F gedreht oder um 180° entgegen dieser Drehrichtung in seine Ausgangsposition von Fig. 2 zurückgedreht. Das Weiter- oder Zurückdrehen kann auch bei geschlossenem Substrataufnahmespalt, aber ohne ein darin aufgenommenes Substrat 4, erfolgen. Subsequently, as shown schematically in Fig. 6, and the lower two holding arms 19, 21 moved back to its original position. Thereafter, the turned substrate 4 according to the direction of movement of the rods 1 1 shown by the arrow K driven with these back down and stored with its substrate edge regions on the respective associated carrier cell 3. Further, after the substrate turning operation, the frame 13 is either rotated 180 ° or more according to the rotational directions E, F shown in FIG. 4, or rotated 180 ° counter to this direction of rotation to its original position of FIG. The further or reverse rotation can also be done with the substrate receiving gap closed, but without a substrate 4 received therein.
Fig. 7 zeigt schematisch die in den Fig. 2 bis 6 zum Wenden des Substrates 4 verwendete Substratwendeeinrichtung im größeren Detail in einer Draufsicht. Dabei entspricht die in Fig. 7 dargestellte Anordnung etwa dem Schritt, der in Fig. 3 dargestellt ist. In diesem Schritt liegt das Substrat 4 auf den unteren Haltearmen 19, 21 auf. Die oberen Haltearme 20, 22 sind in der Darstellung von Fig. 7 dem besseren Verständnis halber auf einer dem Substrat 4 gegenüber liegenden Seite der Drehachse 31 der Innenachse 23 und des Außenrohrs 24 dargestellt. Fig. 7 shows schematically the substrate turning means used in Figs. 2 to 6 for turning the substrate 4 in greater detail in a plan view. The arrangement shown in Fig. 7 corresponds approximately to the step shown in Fig. 3. In this step, the substrate 4 rests on the lower holding arms 19, 21. The upper support arms 20, 22 are shown in the illustration of Fig. 7 for the sake of better understanding on a substrate 4 opposite side of the axis of rotation 31 of the inner axis 23 and the outer tube 24.
Ferner ist aus Fig. 7 ersichtlich, dass die beidseitig des Substrates 4 vorgesehenen rohr- förmigen Anordnungen, bestehend aus Innenachse 23 und Außenrohr 24, durch Verbindungselemente 12, die hier parallel zur Transportrichtung A der Substrate 4 durch die Durchlaufanlage vorgesehen sind, verbunden sind. Durch die Verbindung entsteht ein Rahmen 13, der an den stirnseitig vorgesehenen Verbindungselementen 12 mit der Drehachse 31 für den Rahmen 13 verbunden ist. Die Drehachse 31 ragt durch eine Kammerseitenwand 32 der Trennkammer 1 nach außen und ist außerhalb der Trennkammer 1 mit entsprechenden Antrieben verbunden, um eine Drehung des Rahmens 13 zu gewährleisten. Furthermore, it can be seen from FIG. 7 that the tube-shaped arrangements provided on both sides of the substrate 4, comprising the inner axis 23 and the outer tube 24, are connected by connecting elements 12, which are provided here parallel to the transport direction A of the substrates 4 by the continuous flow system. Through the connection, a frame 13 is formed, which is connected to the frontally provided connecting elements 12 with the axis of rotation 31 for the frame 13. The rotation axis 31 protrudes through a chamber side wall 32 of the separation chamber 1 to the outside and is connected outside of the separation chamber 1 with corresponding drives to ensure rotation of the frame 13.
Wie es außerdem aus Fig. 7 hervorgeht, wird das Substrat 4 in den Aussparungen 26 der Haltearme 19, 20; 21 , 22 gehalten, wobei die Aussparungen 26 von einem etwa C- förmigen Halterand 33 umgeben sind. As is also apparent from Fig. 7, the substrate 4 in the recesses 26 of the support arms 19, 20; 21, 22, wherein the recesses 26 are surrounded by an approximately C-shaped retaining edge 33.
Zudem sind schematisch unterhalb des Substrates 4 drei Auflagepunkte dargestellt, an welchen das Substrat 4 auf den Endpunkten von drei Stäben 1 1 eines Substrathubsystems aufliegt. Die Fig. 8 bis 10 zeigen schematisch das Wenden eines Substrates 4 mit einer Substratwendeeinrichtung, die, wie in Fig. 1 gezeigt, Halteschienen 14, 15 zum Halten des Substrates 4 während des Substratwendevorganges nutzt. In addition, three support points are shown schematically below the substrate 4, on which the substrate 4 rests on the end points of three rods 1 1 of a Substrate Subsystem. FIGS. 8 to 10 schematically show the turning of a substrate 4 with a substrate inverting device which, as shown in FIG. 1, uses support rails 14, 15 for holding the substrate 4 during the substrate turning operation.
Wie in Fig. 8 schematisch dargestellt, wird das Substrat 4 mittels der vertikal ausgerichteten und vertikal bewegbaren oder ausfahrbaren Stäbe 1 1 in eine Wendeposition angehoben. Bei dieser Ausführungsform der Erfindung ist es notwendig, dass das Substrat 4 mit hoher Positioniergenauigkeit in die Wendeposition gebracht wird. In dem Schritt, der in Fig. 8 gezeigt ist, sind die Halteschienen 14, 15 noch in einem breiten Abstand W voneinander. As schematically illustrated in FIG. 8, the substrate 4 is lifted by means of the vertically oriented and vertically movable or extendable rods 11 into a turning position. In this embodiment of the invention, it is necessary that the substrate 4 is brought into the turning position with high positioning accuracy. In the step shown in Fig. 8, the support rails 14, 15 are still at a wide distance W from each other.
Wie in Fig. 9 dargestellt, werden daraufhin die Halteschienen 14, 15 gemäß der Pfeile L, M aufeinander zubewegt, sodass sie in ihrer in Fig. 9 gezeigten Endposition nur noch in einem Abstand w voneinander angeordnet sind, welcher geringfügig größer als die Breite b des Substrates 4 ist. In dieser Position wird der Rahmen 13, an dem die Halteschienen 14, 15 vorgesehen sind, um seine horizontale Achse um 180° gedreht. As shown in Fig. 9, then the support rails 14, 15 are moved towards each other according to the arrows L, M, so that they are arranged in their end position shown in Fig. 9 only at a distance w from each other, which is slightly larger than the width b of the substrate 4 is. In this position, the frame 13, on which the support rails 14, 15 are provided, is rotated about its horizontal axis by 180 °.
Im Ergebnis ist, wie in Fig. 10 dargestellt, das Substrat 4 gewendet, sodass sich die ehemals oben befindliche Substratvorderseite 29 unten und die ehemals unten befindliche Substratrückseite 30 oben befindet. In dieser Position werden die Stäbe 1 1 wieder zum Abholen der Substrates 4 vertikal nach oben gefahren, die Halteschienen 14, 15 entlang der Pfeile N, O voneinander wegbewegt und das Substrat 4 durch eine vertikale Abbewegung der Stäbe 1 1 wieder in seine Ursprungsposition auf der Trägerzelle 3 aufgelegt. Ferner wird der Rahmen 13 mit den Halteschienen 14, 15 um weitere 180 ° weitergedreht oder um 180 ° entgegen der Drehrichtung des Substratwendevorgangs zurück in seine Ausgangsposition von Fig. 8 gedreht. As a result, as shown in Fig. 10, the substrate 4 is turned so that the former upper substrate front 29 is at the bottom and the former lower substrate rear 30 is at the top. In this position, the rods 1 1 again moved to pick up the substrate 4 vertically upwards, the support rails 14, 15 along the arrows N, O moved away from each other and the substrate 4 by a vertical movement of the rods 1 1 back to its original position on the Carrier cell 3 launched. Further, the frame 13 with the support rails 14, 15 further rotated by another 180 ° or rotated 180 ° counter to the direction of rotation of the substrate turning operation back to its initial position of Fig. 8.
Fig. 1 1 zeigt schematisch einen Teil des Substratträgers 2, während er sich in der Trennkammer 1 befindet, in einer geschnittenen Seitenansicht. Wie es aus Fig. 1 1 ersichtlich ist, liegt der Substratträger 2 auf Transportrollen 34 auf, die durch die Kammerseitenwände 32 in das Innere der Trennkammer 1 seitlich hineinragen. Fig. 1 1 shows schematically a part of the substrate carrier 2, while it is in the separation chamber 1, in a sectional side view. As can be seen from FIG. 11, the substrate carrier 2 rests on transport rollers 34, which laterally project through the chamber side walls 32 into the interior of the separation chamber 1.
Gelangt der Substratträger 2 in eine für das Wenden der auf ihm aufliegenden Substrate 4 vorgesehene Position, wird der Substratträger 2 temporär an einer Wendestellung an- gehalten, in der sich eine Substratträgerreihe 6 genau im Bereich einer Wendestation 10 befindet. Diese Position ist dadurch definiert, dass in dieser Position das Substrathubsystem unter ein Substrat 4 fährt, dieses aus der jeweiligen Trägerzelle 3 anhebt und nach oben in eine Wendeposition bringt. Da hierfür eine hohe Positioniergenauigkeit erforderlich ist, wird der Substratträger 2 vorzugsweise in dieser Position durch eine Positioniervorrichtung temporär fixiert. If the substrate carrier 2 reaches a position intended for turning the substrates 4 resting on it, the substrate carrier 2 is temporarily moved to a turning position. held, in which a substrate carrier row 6 is located exactly in the region of a turning station 10. This position is defined by the fact that in this position the substrate subsystem moves under a substrate 4, lifts it out of the respective carrier cell 3 and brings it upwards into a turning position. Since a high positioning accuracy is required for this purpose, the substrate carrier 2 is preferably temporarily fixed in this position by a positioning device.
Hierfür ist in der in Fig. 1 1 dargestellten Ausführungsform wenigstens ein FixierelementFor this purpose, in the embodiment shown in Fig. 1 1 at least one fixing element
36 unterhalb des Substratträgers 2 vorgesehen, welches vertikal ausgerichtet und vertikal in Richtung des Substratträgers 2 und zurück bewegbar ist, wobei das wenigstens eine Fixierelement 36 in wenigstens eine an dem Substratträger 2 vorgesehene Buchse36 is provided below the substrate support 2, which is vertically aligned and vertically movable in the direction of the substrate support 2 and back, wherein the at least one fixing element 36 in at least one provided on the substrate support 2 socket
37 eingreifen und den Substratträger 2 in der entsprechenden Position temporär fixieren kann. Vorzugsweise sind an dem Substratträger 2 mehrere Buchsen 37 vorgesehen, so dass der Substratträger 2 in mehreren Wendestellungen zum Wenden unterschiedlicher Substratträgerreihen 6 fixiert werden kann. Engage 37 and temporarily fix the substrate carrier 2 in the appropriate position. Preferably, a plurality of bushes 37 are provided on the substrate carrier 2, so that the substrate carrier 2 can be fixed in several turning positions for turning different substrate carrier rows 6.
In dem gezeigten Beispiel ist oberhalb des Substratträgers 2 entlang der jeweiligen Kammerseitenwände 32 jeweils eine wenigstens im Bereich der Positioniervorrichtung angeordnete Anschlagschiene 35 vorgesehen, sodass der Substratträger 2 hier zwischen den Transportrollen 4 und der Anschlagschiene 35 bei seinem Transport durch die Trennkammer 1 geführt wird und die Anschlagschiene 35 einen Gegenhalt gegenüber dem beim Fixiervorgang durch das Fixierelement 36 gegen den Substratträger 2 ausgeübten Druck ausbildet. In the example shown, a stop rail 35 arranged at least in the region of the positioning device is provided above the substrate carrier 2 along the respective chamber side walls 32 so that the substrate carrier 2 is guided here between the transport rollers 4 and the stop rail 35 during its transport through the separation chamber 1 and the Stop rail 35 forms a counter-holding against the pressure exerted by the fixing member 36 against the substrate carrier 2 during the fixing process.
Die Fig. 12 bis 16 zeigen schematisch Schritte einer Prozessabfolge zum Wenden von Substraten 4 mit einer Substratwendeeinrichtung gemäß einer weiteren Ausführungsform der vorliegenden Erfindung. Dabei entsprechen diejenigen Schritte, die in den Figuren 12 bis 16 nicht explizit nochmals gezeigt sind, wie das Heben und Absenken der Substrate 4 durch ein vertikal bewegbares oder ausfahrbares Substrathubsystem, beispielsweise den in den Fig. 2 bis 6 gezeigten Schritten. FIGS. 12 to 16 schematically show steps of a process sequence for turning substrates 4 with a substrate inverting device according to another embodiment of the present invention. In this case, those steps which are not explicitly shown again in FIGS. 12 to 16 correspond to the lifting and lowering of the substrates 4 by a vertically movable or extendable substrate lifting system, for example the steps shown in FIGS. 2 to 6.
Fig. 12 zeigt schematisch ein durch ein Substrathubsystem in eine Wendeposition oberhalb des Substratträgers 2 gebrachtes Substrat 4 mit einer Substratvorderseite 29 und einer Substratrückseite 30. Dabei liegt das Substrat 4 in der Darstellung von Fig. 12 beidseitig zwischen zwei scherenartig relativ zueinander bewegbaren Haltearmen 40, 41 ; 42, 43. Wie aus Fig. 12 hervorgeht, ist der Substrataufnahmespalt 44, der zwischen den Aussparungen der unteren Haltearme 41 , 43 ausgebildet wird, breiter als der Substrataufnahmespalt 45 zwischen den oberen Haltearmen 40, 42. Dabei ist der Substrataufnahmespalt 44 zwischen den unteren Haltearmen 41 , 43 beidseitig des Substrates 4 um einen Abstand a breiter als der Substrataufnahmebereich 46 der zugehörigen Trägerzelle 3 des Substratträgers 2. FIG. 12 schematically shows a substrate 4 brought by a substrate subsystem into a turning position above the substrate carrier 2 with a substrate front side 29 and a substrate rear side 30. The substrate 4 lies in the illustration of FIG. 12 on both sides between two scissor-like relative to each other movable support arms 40, 41; 42, 43. As shown in Fig. 12, the substrate-receiving gap 44 formed between the recesses of the lower support arms 41, 43 is wider than the substrate-receiving gap 45 between the upper support arms 40, 42. Here, the substrate-receiving gap 44 is between the lower ones Supporting arms 41, 43 on both sides of the substrate 4 by a distance a wider than the substrate receiving portion 46 of the associated support cell 3 of the substrate carrier. 2
In der Stellung von Fig. 12, in welcher das Substrat 4 kurz zuvor durch die Haltearme 40, 41 ; 42, 43 aufgenommen wurde, liegt das Substrat 4 in dem durch die unteren Haltearme 41 , 43 ausgebildeten Substrataufnahmespalt 44, wobei beidseitig des Substrates 4 noch Platz bis an die Kanten der Aussparungen in den Haltearmen 41 , 43 vorgesehen ist. Somit kann das Substrat 4 auch dann geeignet in den Substrataufnahmespalt 44 zwischen den Haltearmen 41 , 43 eingelegt werden, wenn das Substrat 4 ursprünglich nicht exakt mittig auf der jeweiligen Trägerzelle 3 des Substratträgers 2 aufgelegen hat und/oder während des Hebens des Substrates 4 des Substrathubsystem lateral verschoben wurde. In the position of FIG. 12, in which the substrate 4 has just been replaced by the holding arms 40, 41; 42, 43, the substrate 4 is in the formed by the lower support arms 41, 43 substrate receiving gap 44, wherein on both sides of the substrate 4 is still space to the edges of the recesses in the holding arms 41, 43 is provided. Thus, the substrate 4 can also be suitably inserted into the substrate receiving gap 44 between the holding arms 41, 43, if the substrate 4 originally did not exactly centered on the respective carrier cell 3 of the substrate carrier 2 and / or during the lifting of the substrate 4 of the substrate subsystem was shifted laterally.
Fig. 13 zeigt schematisch den Substratwendemechanismus aus Fig. 12 während eines weiteren Schrittes der Prozessabfolge zum Wenden des Substrates 4. In dieser Position werden die Haltearme 40, 41 ; 42, 43 gemäß der schematisch gezeigten Pfeile P, Q um eine horizontale Mittelachse gedreht. Während des Drehvorganges kippt das Substrat 4 aus dem breiten Substrataufnahmespalt 44 oben in den schmaleren Substrataufnahmespalt 45. Fig. 13 shows schematically the substrate turning mechanism of Fig. 12 during another step of the process sequence for turning the substrate 4. In this position, the holding arms 40, 41; 42, 43 according to the schematically shown arrows P, Q rotated about a horizontal center axis. During the turning operation, the substrate 4 tilts from the wide substrate receiving gap 44 up into the narrower substrate receiving gap 45.
Fig. 14 zeigt schematisch den Substratwendemechanismus der Fig. 12 und 13 in einer nachfolgenden Position, in welcher das Substrat 4 bereits so weit gewendet wurde, dass seine Substratrückseite 30 oben und seine Substratvorderseite 29 unten liegt. Ausgehend von dieser Position wird das Substrat 4 durch den Substratwendemechanismus noch weiter in Richtung der Pfeile R, S, d. h. über 180° hinaus, gedreht. Dabei rutscht das Substrat 4 nach unten in den schmaleren Substrataufnahmespalt 45. Die in Fig. 14 dargestellte Drehung wird, wie in Fig. 15 durch die Pfeile T, U gezeigt, maximal bis in einen Drehwinkel von 270° relativ zu der Ursprungsposition, die in Fig. 12 gezeigt ist, gebracht. In der Darstellung von Fig. 15 liegt das Substrat 4 in dieser Position vollständig in dem schmaleren Substrataufnahmespalt 45. Fig. 14 shows schematically the substrate turning mechanism of Figs. 12 and 13 in a subsequent position in which the substrate 4 has already been turned so far that its substrate back 30 is at the top and its substrate front 29 is at the bottom. Starting from this position, the substrate 4 is further rotated by the substrate turning mechanism in the direction of arrows R, S, ie beyond 180 °. In this case, the substrate 4 slides down into the narrower substrate receiving gap 45. The rotation shown in Fig. 14, as shown in Fig. 15 by the arrows T, U, up to a rotational angle of 270 ° relative to the original position, the in Fig. 12 is shown brought. In the illustration of FIG. 15, the substrate 4 lies completely in the narrower substrate receiving gap 45 in this position.
Daraufhin wird der Substratwendemechanismus mit dem Substrat 4, wie es schematisch in Fig. 16 dargestellt ist, wieder in eine horizontale Ausrichtung gemäß der Pfeile V, W zurückgedreht. In dieser Position ist das Substrat 4 im Vergleich zu seiner Ursprungsposition aus Fig. 12 gewendet, sodass sich seine Substratvorderseite 29 unten und seine Substratrückseite 30 oben befindet. In dieser Position liegt das Substrat 4 weiter in dem schmaleren Substrataufnahmespalt 45 und kann aus dieser Position exakt in den Substrataufnahmebereich 46 der Trägerzelle 3 durch das Substrathubsystem wieder abgesenkt werden. Thereafter, the substrate turning mechanism with the substrate 4, as shown schematically in Fig. 16, is again rotated back in a horizontal orientation according to the arrows V, W. In this position, the substrate 4 is turned in relation to its original position from FIG. 12, so that its substrate front side 29 is at the bottom and its substrate rear side 30 is at the top. In this position, the substrate 4 is further in the narrower substrate receiving gap 45 and can be lowered from this position exactly in the substrate receiving area 46 of the carrier cell 3 by the Substratathubsystem again.
Nach dem in Fig. 16 gezeigten Schritt wird der Substratwendemechanismus mit den Haltearmen 40, 41 ; 42, 43 wieder in seine Ursprungsposition, die in Fig. 12 dargestellt ist, zurückbewegt. Die in den Fig. 12 bis 16 dargestellte Ausführungsform der erfindungsgemäßen Substratwendeeinrichtung hat den Vorteil, dass das Substrat 4 trotz des Wendens definiert und zentriert in die Trägerzelle 3 zurücktransportiert werden kann. Dabei wird in dieser Ausführungsform eventuellen Toleranzen der Substrate 4 und der Einlagegeometrie des Substratträgers 2 durch die spezielle Geometrie der Aussparungen der Haltearme 40, 41 ; 42, 43 Rechnung getragen. After the step shown in Fig. 16, the substrate turning mechanism with the holding arms 40, 41; 42, 43 moved back to its original position, which is shown in Fig. 12, back. The embodiment of the substrate inverting device according to the invention shown in FIGS. 12 to 16 has the advantage that, despite the turning, the substrate 4 can be defined and centered back into the carrier cell 3. In this case, in this embodiment, any tolerances of the substrates 4 and the insert geometry of the substrate carrier 2 by the special geometry of the recesses of the holding arms 40, 41; 42, 43 accounted for.
Obwohl in den gezeigten und oben beschriebenen Ausführungsformen ein Klemmen bzw. Halten der Substrate nur bei in Transportrichtung A der Substrate 4 durch die Trennkammer 1 gegenüberliegenden Halteelementen gezeigt ist, können in anderen Ausführungsformen der Erfindung die Substrate 4 auch durch quer zur Transportrichtung A ausgerichtete und einander gegenüberliegende Halteelemente für das Wenden der Substrate 4 geklemmt bzw. gehalten werden. Es sind lediglich die oben beschriebenen Elemente der Wendeeinrichtung jeweils um 90s versetzt in der Trennkammer 1 anzuordnen. Although, in the embodiments shown and described above, clamping of the substrates is shown only in holding elements opposite the transporting direction A of the substrates 4 through the separating chamber 1, in other embodiments of the invention, the substrates 4 may also be aligned with each other through transverse to the conveying direction A. opposite holding elements for the turning of the substrates 4 are clamped or held. It is only the above-described elements of the turning device offset by 90 s in the separation chamber 1 to be arranged.

Claims

Patentansprüche claims
1 . Substratwendeeinrichtung für eine Substratbearbeitungsanlage zur Bearbeitung von plattenförmigen Substraten (4), wobei die Substratbearbeitungsanlage eine Durchlaufanlage mit wenigstens zwei Prozesskammern und wenigstens einer Trennkammer (1 ) zwischen den Prozesskammern ist und wenigstens einen, in wenigstens einer Transportrichtung (A) für die Substrate (4) durch die Durchlaufanlage bewegbaren Substratträger (2) mit mehreren, in einer horizontalen Ebene nebeneinander und/oder nacheinander angeordneten rahmenförmigen, innen offenen Trägerzellen (3) zur Auflage jeweils eines Substrates (4) an Substratrandbereichen aufweist, wobei die Substratwendeeinrichtung wenigstens eine Wendestation (10) aufweist, welche ein vertikal bewegbares oder ausfahrbares Substrathubsystem zum Heben und Absenken der Substrate (4) aus und in die Trägerzellen (3) und einen Substratwendemechanismus mit relativ zueinander bewegbaren Halteelementen zum Halten der Substrate (4) an zwei gegenüber liegenden Substratrandbereichen (5) aufweist, wobei die Halteelemente oder Drehachsen der Halteelemente durch quer zu den Halteelementen oder den Drehachsen vorgesehene Verbindungselemente (12) in Form eines Rahmens (13) verbunden sind und der Rahmen (13) um seine horizontale Mittelachse (38) um wenigstens 180 ° drehbar ist. 1 . Substrate turning device for a substrate processing system for processing plate-shaped substrates (4), wherein the substrate processing system is a continuous system with at least two process chambers and at least one separation chamber (1) between the process chambers and at least one, in at least one transport direction (A) for the substrates (4). substrate carrier (2) which is movable by the continuous installation and has a plurality of frame-shaped, inwardly open support cells (3) arranged in a horizontal plane for supporting respectively one substrate (4) on substrate edge regions, the substrate turning device comprising at least one turning station (10) comprising a vertically movable or extendable substrate subsystem for raising and lowering the substrates (4) from and into the carrier cells (3) and a substrate reversing mechanism having relatively movable support members for holding the substrates (4) at two opposite ones Having substrate edge regions (5), wherein the holding elements or axes of rotation of the holding elements by transverse to the holding elements or the axes of rotation provided connecting elements (12) are connected in the form of a frame (13) and the frame (13) about its horizontal center axis (38) at least 180 ° is rotatable.
2. Substratwendeeinrichtung nach Anspruch 1 , dadurch gekennzeichnet, dass die Halteelemente jeweils zwei beidseitig wenigstens einer Trägerzelle (3) über dem Substratträger (2) angeordnete, scherenartig relativ zueinander bewegbare Haltearme (19, 20; 21 , 22) sind. 2. substrate turning device according to claim 1, characterized in that the holding elements are each two on both sides of at least one support cell (3) over the substrate carrier (2) arranged scissor-like relative to each other movable support arms (19, 20, 21, 22).
3. Substratwendeeinrichtung nach Anspruch 2, dadurch gekennzeichnet, dass auf jeder Seite der Trägerzellen (3) wenigstens einer der Haltearme (19, 20; 21 , 22) einen an seinem freien Ende vorgesehenen Substratklemmbereich mit einer Aussparung (26) aufweist, die tiefer als eine maximale Dicke (d) der Substrate (4) ist. 3. substrate turning device according to claim 2, characterized in that on each side of the support cells (3) at least one of the support arms (19, 20, 21, 22) has a provided at its free end substrate clamping area with a recess (26) deeper than a maximum thickness (d) of the substrates (4).
4. Substratwendeeinrichtung nach Anspruch 2 oder 3, dadurch gekennzeichnet, dass jeweils ein erster Haltearm (19, 21 ) strahlenförmig auskragend an einer Innenachse (23) eines rohrförmigen Montageelementes für die Haltearme (19, 20; 21 , 22) montiert ist, wobei um die Innenachse (23) ein Au ßenrohr (24) vorgesehen ist, an dem ein zweiter Haltearm (20, 22) strahlenförmig auskragend montiert ist und das einen für eine Bewegung des ersten Haltearmes (19, 21 ) ausgesparten Umfangsbereich (25) aufweist, wobei die Innenachse (23) und das Außenrohr (24) unabhängig voneinander drehbar sind. 4. substrate turning device according to claim 2 or 3, characterized in that in each case a first holding arm (19, 21) projecting radially on an inner axis (23) of a tubular mounting element for the retaining arms (19, 20; 21, 22) is mounted, wherein a Au ßenrohr (24) is provided around the inner axis (23) on which a second holding arm (20, 22) is radially projecting and mounted one for a movement of the first Haltearmes (19, 21 ) recessed peripheral portion (25), wherein the inner axis (23) and the outer tube (24) are independently rotatable.
Substratwendeeinrichtung nach einem der Ansprüche 2 bis 4, dadurch gekennzeichnet, dass zwischen den in einer Substrathalteposition beidseitig des Substrates (4) gegenüber liegenden Haltearmen (40, 41 , 42, 43) jeweils unterschiedlich breite Substrataufnahmespalte (44, 45) ausgebildet sind, wobei der bei zu Beginn eines Substratwendevorganges dem Substrathubsystem gegenüber liegende Substrataufnahmespalt (44) breiter als ein Substrataufnahmebereich der Trägerzelle (3) und breiter als der andere Substrataufnahmespalt (45) ist. Substrate turning device according to one of claims 2 to 4, characterized in that between the in a substrate holding position on both sides of the substrate (4) opposite holding arms (40, 41, 42, 43) respectively different width Substrataufnahmespalte (44, 45) are formed, wherein the at the beginning of a substrate turning operation, the substrate receiving gap (44) opposite the substrate subsystem is wider than a substrate receiving area of the carrier cell (3) and wider than the other substrate receiving gap (45).
Substratwendeeinrichtung nach Anspruch 1 , dadurch gekennzeichnet, dass die Halteelemente parallel zueinander in einer horizontalen Ebene gegenüber liegende und in dieser Ebene relativ zueinander bewegbare Halteschienen (14, 15) sind. Substrate turning device according to claim 1, characterized in that the holding elements parallel to each other in a horizontal plane opposite and in this plane relative to each other movable support rails (14, 15).
Substratwendeeinrichtung nach Anspruch 6, dadurch gekennzeichnet, dass die Halteschienen (14, 15) jeweils aus zwei übereinanderliegenden Halteleisten ausgebildet sind, die an ihren gegenüber liegenden Innenflächen Auskragungen aus Keramik aufweisen. Substrate turning device according to claim 6, characterized in that the retaining rails (14, 15) are each formed of two superimposed retaining strips, which have on their opposite inner surfaces projections of ceramic.
Substratwendeeinrichtung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Substrathubsystem in Transportrichtung (A) der Substrate (4) beabstandete und quer zur Transportrichtung (A) der Substrate (4) versetzt zueinander angeordnete vertikal ausgerichtete und vertikal bewegbare oder ausfahrbare Stäbe (1 1 ) aufweist, wobei jedem der Substrate (4) drei Stäbe (1 1 ) für eine Dreipunktanlage der Substrate (4) auf den Stäben (1 1 ) zugeordnet sind. Substrate turning device according to one of the preceding claims, characterized in that the substrate subsystem in the transport direction (A) of the substrates (4) spaced and transversely to the transport direction (A) of the substrates (4) staggered vertically aligned and vertically movable or extendable rods (1 1 ), wherein each of the substrates (4) are associated with three rods (1 1) for a three-point contact of the substrates (4) on the rods (1 1).
Substratwendeeinrichtung nach Anspruch 8, dadurch gekennzeichnet, dass die Stäbe (1 1 ) zumindest an ihrem an den Substraten (4) zugewandten Ende jeweils aus einem nichtmetallischen Werkstoff ausgebildet oder mit einem nichtmetallischen Werkstoff ummantelt sind. Substrate turning device according to claim 8, characterized in that the rods (1 1) are each formed at least at their on the substrates (4) facing the end of a non-metallic material or coated with a non-metallic material.
10. Substratwendeeinrichtung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass der Substratträger (2) an der wenigstens einen Wendestation (10) in einer Wendestellung durch eine Positioniervorrichtung temporär fixierbar ist. 10. Substrate turning device according to one of the preceding claims, characterized in that the substrate carrier (2) at the at least one turning station (10) is temporarily fixable in a turning position by a positioning device.
1 1 . Substratwendeeinrichtung nach Anspruch 10, dadurch gekennzeichnet, dass die Positioniervorrichtung wenigstens ein vertikal ausgerichtetes und vertikal bewegbares oder ausfahrbares Fixierelement (36) und wenigstens eine Buchse (37) zum Eingreifen des Fixierelementes (36) aufweist. 1 1. Substrate turning device according to claim 10, characterized in that the positioning device has at least one vertically aligned and vertically movable or extendable fixing element (36) and at least one bush (37) for engaging the fixing element (36).
12. Substratwendeeinrichtung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass der Substratträger (2), die wenigstens eine Wendestation (10) und ein Trägerrahmen (18) für die wenigstens eine Wendestation (10) an dem die Substratwendemechanismen der wenigstens einen Wendestation (10) montiert sind, aus einem Kohlefaserverbundwerkstoff ausgebildet sind. 12. substrate turning device according to one of the preceding claims, characterized in that the substrate carrier (2), the at least one turning station (10) and a support frame (18) for the at least one turning station (10) on which the substrate turning mechanisms of the at least one turning station (10 ), are formed of a carbon fiber composite material.
13. Substratbearbeitungsanlage zur Bearbeitung von plattenförmigen Substraten (4), wobei die Substratbearbeitungsanlage eine Durchlaufanlage mit wenigstens zwei Prozesskammern und wenigstens einer Trennkammer (1 ) zwischen den Prozesskammern ist und wenigstens einen, in wenigstens einer Transportrichtung (A) für die Substrate (4) durch die Durchlaufanlage bewegbaren Substratträger (2) mit mehreren in einer horizontalen Ebene und/oder nacheinander angeordneten rah- menförmigen, innen offenen Trägerzellen (3) zur Auflage jeweils eines Substrates (4) an Substratrandbereichen aufweist, dadurch gekennzeichnet, dass die Substratbearbeitungsanlage eine Substratwendeeinrichtung nach wenigstens einem der Ansprüche 1 bis 12 aufweist. 13. Substrate processing plant for processing plate-shaped substrates (4), wherein the substrate processing plant is a continuous system with at least two process chambers and at least one separation chamber (1) between the process chambers and at least one, in at least one transport direction (A) for the substrates (4) the continuous system movable substrate carrier (2) having a plurality of in a horizontal plane and / or consecutively arranged frame-shaped, internally open support cells (3) for supporting a respective substrate (4) on substrate edge regions, characterized in that the substrate processing system is a substrate turning device according to at least one of claims 1 to 12.
14. Substratbearbeitungsanlage nach Anspruch 13, dadurch gekennzeichnet, dass die Prozesskammern und die Trennkammer (1 ) evakuierbare Kammern sind. 14. substrate processing system according to claim 13, characterized in that the process chambers and the separation chamber (1) are evacuated chambers.
15. Substratbearbeitungsanlage nach Anspruch 13 oder 14, dadurch gekennzeichnet, dass eine Substrateinführöffnung (8) und/oder eine Substratausführöffnung (9) der Trennkammer (1 ) kontinuierlich offen ist und die Trennkammer (1 ) durch ein Pumpsystem wenigstens einer benachbarten Prozesskammer evakuierbar ist. 15. Substrate processing system according to claim 13 or 14, characterized in that a Substrateinführöffnung (8) and / or a Substratausführöffnung (9) of the separation chamber (1) is continuously open and the separation chamber (1) can be evacuated by a pumping system of at least one adjacent process chamber.
16. Substratbearbeitungsanlage nach einem der Ansprüche 13 bis 15, dadurch gekennzeichnet, dass in der Trennkammer (1 ) mehrere in Transportrichtung (A) der Substrate (4) nacheinander angeordnete Wendestationen (10) und ein Substratträger (2) mit reihen- und spaltenförmig angeordneten Trägerzellen (3), die Substratträgerreihen (6) und Substratträgerspalten (7) ausbilden, vorgesehen sind, mit welchen gleichzeitig die Substrate (4) mehrerer Substratträgerreihen (6) wendbar sind, wobei die Wendestationen (10) einen Abstand voneinander haben, der wenigstens einer Substratträgerreihe (6) entspricht. 16. substrate processing system according to one of claims 13 to 15, characterized in that in the separation chamber (1) in the transport direction (A) of the substrates (4) successively arranged turning stations (10) and a substrate carrier (2) arranged in rows and columns Carrier cells (3), the substrate carrier rows (6) and substrate carrier columns (7) form are provided, with which simultaneously the substrates (4) of several substrate carrier rows (6) are reversible, wherein the turning stations (10) have a distance from each other, the at least one Substrate carrier row (6) corresponds.
17. Substratbearbeitungsanlage nach einem der Ansprüche 13 bis 16, dadurch gekennzeichnet, dass Antriebsmotoren des Substratwendemechanismus au ßerhalb der Trennkammer (1 ) vorgesehen sind. 17. Substrate processing installation according to one of claims 13 to 16, characterized in that drive motors of the substrate turning mechanism are provided outside the separation chamber (1).
18. Substratbearbeitungsanlage nach einem der Ansprüche 13 bis 17, dadurch gekennzeichnet, dass in der Trennkammer (1 ) eine von den benachbarten Prozesskammern separate Temperiervorrichtung (9) vorgesehen ist. 18. substrate processing system according to one of claims 13 to 17, characterized in that in the separation chamber (1) is provided a separate from the adjacent process chambers tempering device (9).
EP11779222.6A 2011-10-06 2011-10-06 Substrate turning device Withdrawn EP2764536A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IB2011/054403 WO2013050805A1 (en) 2011-10-06 2011-10-06 Substrate turning device

Publications (1)

Publication Number Publication Date
EP2764536A1 true EP2764536A1 (en) 2014-08-13

Family

ID=44907921

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11779222.6A Withdrawn EP2764536A1 (en) 2011-10-06 2011-10-06 Substrate turning device

Country Status (2)

Country Link
EP (1) EP2764536A1 (en)
WO (1) WO2013050805A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3376530B1 (en) * 2017-03-16 2019-08-14 ATOTECH Deutschland GmbH Automated substrate holder loading device
CN108962813B (en) * 2018-09-06 2023-07-18 重庆科技学院 Adjustable chip clamp
CN113764330A (en) * 2020-06-03 2021-12-07 中芯北方集成电路制造(北京)有限公司 Wafer clamping device
CN115256221A (en) * 2022-09-28 2022-11-01 江苏积力环保科技有限公司 Turning device for machining electromechanical equipment

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3908894C1 (en) 1989-03-17 1990-01-11 Siemens Ag, 1000 Berlin Und 8000 Muenchen, De Substrate turning device for a vacuum coating installation (facility)
JP3005373B2 (en) * 1992-10-23 2000-01-31 東京エレクトロン株式会社 Processing equipment
US5492223A (en) * 1994-02-04 1996-02-20 Motorola, Inc. Interlocking and invertible semiconductor device tray and test contactor mating thereto
US5885353A (en) * 1996-06-21 1999-03-23 Micron Technology, Inc. Thermal conditioning apparatus
US6016611A (en) * 1998-07-13 2000-01-25 Applied Komatsu Technology, Inc. Gas flow control in a substrate processing system
JP3888608B2 (en) * 2001-04-25 2007-03-07 東京エレクトロン株式会社 Substrate double-sided processing equipment
DE10156441A1 (en) * 2001-05-18 2002-11-21 Mattson Thermal Products Gmbh Device to receive semiconductor wafers for thermal treatment comprises a support with recesses for holding the wafers
TW200401704A (en) * 2002-07-29 2004-02-01 Du Pont Carbon fiber composite transfer member with reflective surfaces
DE102005039100A1 (en) * 2005-08-09 2007-02-15 Gebr. Schmid Gmbh & Co. Device for holding or holding a plurality of substrates and electroplating device
JP4338205B2 (en) * 2006-03-29 2009-10-07 Tdk株式会社 Pod clamp unit, load port with pod clamp unit, mini environment system with pod and load port
EP2009685A4 (en) * 2006-04-19 2013-05-22 Ulvac Inc Vertical substrate conveyance device and film deposition equipment
US20080111206A1 (en) * 2006-11-10 2008-05-15 Evergreen Solar, Inc. Substrate with Two Sided Doping and Method of Producing the Same
KR101009643B1 (en) * 2008-07-16 2011-01-19 삼성모바일디스플레이주식회사 Substrate etching apparatus

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
None *
See also references of WO2013050805A1 *

Also Published As

Publication number Publication date
WO2013050805A1 (en) 2013-04-11

Similar Documents

Publication Publication Date Title
DE3943482C2 (en) Workpiece carrier for a disc-shaped workpiece, as well as vacuum process chamber
DE69830310T2 (en) MULTIFUNCTIONAL PROCESS ROOM FOR CVD PROCESSES
EP2139049A1 (en) Device for structuring a solar module
EP0350752A2 (en) Holding device for a disc and its use
DE102015217132B4 (en) Holding system, treatment device and loading method for disc-shaped objects
CH697146A5 (en) Gripping device for handling wafers.
WO2013050805A1 (en) Substrate turning device
EP0894337A2 (en) Installation for wet-treating substrates
EP3567129A1 (en) Holding device for holding a plurality of substrates for the treatment of the same, treatment plant and method of treatment
DE3635716C2 (en)
EP3422396B1 (en) Device for transport of a substrate, treatment device with a holder plate adapted to a substrate holder of such a device and a method for processing a substrate using such a device for transporting a substrate and treatment plant
WO2017097680A1 (en) Method and device for the thermal treatment of substrates and holding unit for substrates
EP0544995A1 (en) Apparatus for transporting substrates
WO2010122152A1 (en) Transport device having a deflectable sealing frame
EP1177570A1 (en) Device for handling substrates inside and outside a clean room
DE102007048758A1 (en) Transport device for conveying elongate substrates through vacuum coating system, has retainer bar operatively connected to array of substrate holding inserts so that spacing between each insert and substrate can be changed
WO2012153232A2 (en) Substrate‑transporting module, loading and unloading system, and method for transporting substrates in a substrate‑processing installation
EP0278308A2 (en) Arrangement for loading racks in chemical-bath treatment installations, particularly for electroplating plate-like work pieces
DE102010016325A1 (en) Substrate turn device for e.g. continuous flow system for processing plate-shaped substrates, has holding members or axes connected by connector and provided transverse to members or axes, where connector is rotatable around axis
DE102012111078A1 (en) Substrate carrier useful for directing substrates by substrate processing device, comprises plate-shaped base body with front and back sides, number of substrate holders for plate-shaped substrate, and multi-part plate-shaped cover mask
DE102011083139B4 (en) Substrate treatment process and substrate treatment plant
DE102014116342B4 (en) Substrate holding device and method for processing a substrate
EP0224501B1 (en) Device for piling uniform objects, particularly plate-like objects
DE102008026314B4 (en) Vacuum system with at least two vacuum chambers and a lock chamber between the vacuum chambers
DE102008046328A1 (en) Support for solar cells and process for processing solar cells

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20140505

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

RIN1 Information on inventor provided before grant (corrected)

Inventor name: OELSNER, DANIEL

Inventor name: HELBIG, THOMAS

Inventor name: MAI, JOACHIM

Inventor name: EISMANN, LUTZ

Inventor name: RICHTER, THILO

DAX Request for extension of the european patent (deleted)
RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: MEYER BURGER (GERMANY) AG

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

INTG Intention to grant announced

Effective date: 20191009

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20200220