EP1162509A2 - Système, méthode et appareil pour l'exposition d'une plaque pour circuit imprimé utilisant un laser à modes bloqués et opérant en mode continu - Google Patents

Système, méthode et appareil pour l'exposition d'une plaque pour circuit imprimé utilisant un laser à modes bloqués et opérant en mode continu Download PDF

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Publication number
EP1162509A2
EP1162509A2 EP01202093A EP01202093A EP1162509A2 EP 1162509 A2 EP1162509 A2 EP 1162509A2 EP 01202093 A EP01202093 A EP 01202093A EP 01202093 A EP01202093 A EP 01202093A EP 1162509 A2 EP1162509 A2 EP 1162509A2
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EP
European Patent Office
Prior art keywords
laser beam
photosensitive layer
modulated
substrate
scan direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP01202093A
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German (de)
English (en)
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EP1162509A3 (fr
Inventor
Marc Vernackt
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Ucamco Nv
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Barco Graphics NV
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Publication date
Application filed by Barco Graphics NV filed Critical Barco Graphics NV
Publication of EP1162509A2 publication Critical patent/EP1162509A2/fr
Publication of EP1162509A3 publication Critical patent/EP1162509A3/fr
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • G03F7/2032—Simultaneous exposure of the front side and the backside
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks

Definitions

  • the present invention relates to laser direct image printing and more specifically to a method and apparatus including a mode locked laser utilizing scophony methods to increase image quality and therefore line sharpness and accuracy.
  • printed circuit boards may be composed of several PCB panels, each panel having two sides, one or more of which is provided with a layer forming an electrical circuit.
  • the board When there is only one panel having only two layers, the board is commonly called a double-sided board or PCB panel, and when there are more than two layers, the board is commonly called a multi-layer board.
  • a common way of manufacturing a multi-layer board is by fixing several panels together, each panel having a single printed circuit on one side, or a circuit on each side.
  • “Outer” panels are those that face the outside of a multi-layer PCB, and “inner panels” are the interior panels.
  • the inner panels have a circuit on both sides, while the outer panels have a circuit only on one, the outer side.
  • Each inner panel resembles a thin double-sided PCB in that the panel is comprised of an insulating substrate, which is clad on both sides with metallic foil, typically copper foil.
  • a printed circuit is formed on any circuit side of an inner panel by that side's metal cladding having a light-sensitive layer laid on top of the metal.
  • the light-sensitive layer is exposed to light (typically ultra-violet (UV) radiation) at selected locations, then processed by a photographic process that removes the layer at selected locations.
  • a metal etching process is then applied to remove those parts of the layer of metal not necessary for forming the actual circuit.
  • the double-sided inner panels are fused (pressed) together by placing an insulating binding material, typically a partially cured epoxy-resin material called prepreg, between the panels.
  • an insulating binding material typically a partially cured epoxy-resin material called prepreg
  • laminated outer foils are placed on the outside of the double-sided inner panels, again with prepreg in between.
  • All the layers are now laminated by applying heat and pressure that causes the prepreg to flow and bond to the surfaces of the inner panels and the outer foils.
  • Holes are now drilled on the laminated multi-layer board, including holes for mounting electrical components inserted into the board ("mounting holes"), and holes for making contacts from one layer to one or more other layers (feed-throughs, also called vias or conductive vias). The holes typically are plated through.
  • Each outer side of the multi-layer panel now is sensitized, then exposed and processed to form the two outer printed circuits in exactly the same manner as forming circuits on the inner panels.
  • PCB panel or simply “panel” means either a complete PCB board, an inner PCB panel, or a post-lamination multi-layer panel.
  • a common method for producing printed circuit boards is to first produce artwork, which is an accurately scaled configuration used to produce a master pattern of a printed circuit, and is generally prepared at an enlarged scale using various width tapes and special shapes to represent conductors.
  • the items of artwork once reduced, for example, by a camera onto film to the correct final size, are referred to as phototools and are used as masks for exposing the sensitized layers.
  • phototools Because the photographic reduction is never 100 percent accurate, more accurate phototools are produced nowadays using photoplotters rather than photographic reduction. However produced, physical phototools are susceptible to damage.
  • any amendments need to be made to any circuit, new phototools need to be produced.
  • phototools sometimes in the form of photographic negatives, are difficult to store. They also may not be stable; their characteristics might change with temperature and humidity changes and can suffer degraded quality over time.
  • LDI laser direct imaging
  • Registration is the process of positioning the PCB pattern on the panel at a particular physical location.
  • the panel is physically positioned relative to the laser beam.
  • the geometrical accuracy can be increased by the use of a laser direct imaging (LDI) device.
  • LPI laser direct imaging
  • both geometrical accuracy and the quality of imaging are important.
  • the repeatability, line edge quality and control of the line width of the tracks after etching i.e ., the widths of the conducting interconnects
  • circuit components such as coils, high frequency (HF) circuits, and oscillator circuits are nowadays being implemented within the PCB layout itself. It is necessary to predict the characteristics of those components, and for this, a known and controlled fabricating process is needed to substantially eliminate later circuit trimming.
  • LDI technology addresses some of these problems and increase the overall imaging quality.
  • New technology for making PCB panels like sequential build up (SBU) and direct ablation of the copper can be used with direct imaging technology. Accuracy is also important for such new technologies that include adding each new layer directly to the previous stack of layers as an additive process. In such a case, the relationship between the imaging process and the registration process becomes very critical.
  • Fig. 1 illustrates one method of producing the PCB 200 illustrated in Fig. 2A-2E.
  • a substrate 202 with a copper layer 203 is provided.
  • a layer of photoresist 204 is applied on top of the copper layer 203, in block 104.
  • a mask layer 206 is placed on top of the photoresist 204 in block 106.
  • the mask layer has at least one opening 208 substantially corresponding to the location, shape and size of the desired copper trace 220.
  • the photoresist 204 that is not covered by the mask layer 206 is exposed with a high intensity light 210 such as an UV lamp.
  • the mask layer 206 and the unexposed photoresist 204 is etched away.
  • the exposed portion of the copper layer 203 is etched away in block 112.
  • the exposed photoresist 218 is then removed in block 114.
  • block 116 only the desired copper trace 220 remains.
  • step 106 is not used, and the mask layer 206 is not required.
  • Step 108 is then replaced with a direct imaging step that exposes some areas of the photoresist and not others in accordance with imaging data that corresponds to the pattern desired.
  • the exposed region of the photoresist 218 is typically wider at the bottom 224 than at the top 222, i.e., the sides of the exposed photoresist 218 are not perpendicular to the substrate 202.
  • the top 222 is substantially the same width as the opening in the mask 208.
  • the resulting copper trace 220 is similarly wider than the opening in the mask 208 (FIG 2A).
  • the triangular areas 214 and 216 represent an inaccuracy of the process 100. These areas 214, 216, while illustrated as having a triangular cross-section, are typically irregularly shaped, as known to those skilled in the art.
  • Fig. 3 illustrates a PCB substrate 302 with an irregular trace 304 resulting from such inaccuracy, together with the opening in the mask 306 that corresponds to the desired trace.
  • the areas 214, 216 are typically larger when non-collimated light source is used than when a collimated beam is used. If a perfectly collimated exposing light source is used, no error should, in theory, occur, assuming no other processes produce inaccuracies.
  • a laser direct imaging (LDI) device approaches a near perfectly collimated light source but, as will be explained below, still does not eliminate the error-producing areas 214, 216.
  • any exposed resist area are called sidewalls herein.
  • Sidewall quality degradation contributes to line edge quality degradation.
  • Other causes of sidewall quality degradation in addition to non-perfect collimation are present when phototools (and other masks) are used.
  • One reason is that the light must travel through a certain transparent layer 205, causing the light to be at least slightly diffracted by the diffraction coefficient of the transparent layer 205. Since LDI devices do not use such phototools or a transparent layer, this diffraction error is eliminated and thus inherently increases the quality.
  • PCB panels that include a light-sensitive layer on one or both sides.
  • Directly imaging PCB panels in particular improves geometrical position, provides collimated exposure, and eliminates diffraction-related errors. Note that the same advantages also are provided when directly imaging printing plates that include a UV, visible light, or thermally-sensitive layer.
  • the scanning apparatus for exposing such sheets for direct imaging e.g ., directly exposing printing plates or directly exposing PCB panels
  • the scanning apparatuses are typically quite bulky because of the horizontal table.
  • direct imaging systems expose one side at a time, and there are problems accurately aligning the two sides for double-sided exposure.
  • U.S. Patent Application S/N 09/435,983 to Vernackt, et al. describes a LDI device that images two sides of a panel that is held vertically, and including relatively positioning the imaging beams of one side to the other.
  • photoresist typically PCB panels to be direct imaged are coated with a photoresist material (photoresist).
  • the photoresist can be any one of several materials well known in the art, for example Riston® Photoresist (E. I. du Pont de Nemours and Company, Research Triangle Park, NC) or Laminar® Photoresist (Morton Electronic Materials, Tustin, CA).
  • Riston® Photoresist E. I. du Pont de Nemours and Company, Research Triangle Park, NC
  • Laminar® Photoresist Morton Electronic Materials, Tustin, CA.
  • E I x t
  • Direct imaging typically uses a laser as the source of exposing energy.
  • a laser may be suitable as a laser light source for exposing photoresist in a direct imaging process.
  • a commonly used laser is a continuous wave (CW) ultraviolet (UV) laser having a relatively low power of 1 to 4 watts.
  • CW continuous wave
  • UV ultraviolet
  • Such lasers are typically UV gas-ion lasers, and are available from, for example, Coherent, Inc., Santa Clara, CA, and Spectra-Physics Lasers, Inc. Mountain View, CA. Also solid state UV CW lasers are currently being developed. These also have relatively low laser power.
  • LDI has simplified the process of PCB exposure by eliminating the mask layer 206 and providing for increased accuracy in the manufacturing process.
  • the lasers typically used still produce undesirable inaccuracies.
  • LDI devices typically use some modulation device to modulate the light pattern along a scan line. Such devices have a finite rise (and fall) time, so that the light beams cannot be turned on or off instantaneously. This too leads to loss of perpendicularity of sidewalls of exposed photoresist, with resulting resolution degradation and inaccuracies.
  • a system, method and article of manufacture is disclosed that provides an improved, higher efficiency, more accurate laser direct imaging on a photosensitive medium on a substrate using a mode-locked laser having a low average power and a short pulse width.
  • the mode-locked laser is scanned across the surface of the photosensitive medium.
  • the resulting in-scan edges having improved perpendicularity relative to the underlying substrate.
  • Another embodiment describes a method for laser direct imaging a pixel on a photosensitive medium with a laser beam.
  • the method comprises providing a substrate having a first surface and an opposing second surface, and a photosensitive layer on the first surface. Then, emitting a mode locked laser beam, then receiving the laser beam by an acousto-optical modulator. Then receiving a modulating signal in the acousto-optical modulator and modulating the laser beam in the acousto-optical modulator. Next, emitting a modulated laser beam from the acousto-optical modulator to a first scanner unit.
  • the scanner unit then receives the modulated laser beam and then directs the modulated laser beam across said first photosensitive layer in an in-scan direction to cause a first pixel of the first photosensitive layer to substantially photo-polymerize.
  • the first pixel is defined by a surface area contacted by the modulated, pulsed laser beam and substantially penetrating through the first photosensitive layer to the first intermediate layer.
  • the first pixel has a first side and a first' in the in-scan direction and a first beginning and a first end in the cross scan direction, the first side and the first' side being substantially perpendicular to the substrate.
  • Yet another alternative embodiment is a laser direct imaging apparatus for imaging a pixel on a photosensitive medium with a laser beam.
  • the apparatus comprises a substrate, the substrate including a first surface and an opposing second surface and a first photosensitive layer on the first surface.
  • the apparatus also comprises a mode locked laser operable to emit a pulsed laser beam and an acousto-optical modulator.
  • the acousto-optical modulator includes a crystal oriented to receive the pulsed laser beam and a transducer.
  • the transducer is in contact with the crystal and the transducer receives a modulating signal from an external source and then emits the modulating signal into the crystal to modulate the pulsed laser beam.
  • the apparatus also includes a first scanner unit oriented to receive the modulated, pulsed laser beam.
  • the first scanner unit directs the modulated, pulsed laser beam across the first photosensitive layer in an in-scan direction to cause a first pixel of the first photosensitive layer to substantially photo-polymerize.
  • the first pixel is defined by a surface area contacted by the modulated, pulsed laser beam and substantially penetrating through the first photosensitive layer to the substrate.
  • the first pixel has a first and first' sides in the in-scan direction and a first beginning and a first end in the cross scan direction. The first side and first' side are substantially perpendicular to the substrate.
  • the mode-locked laser is a ultraviolet (UV) laser, having a wave length of between 200 nm and 532 nm.
  • UV ultraviolet
  • the mode-locked laser is modulated in a scophony mode.
  • the resulting cross scan beginning and end of the scanned line has improved perpendicularity relative to the underlying substrate.
  • the improved perpendicularity resulting in improved accuracy over the prior art.
  • the disclosed ultraviolet, mode-locked, scophony mode modulated laser is included in a dual side laser direct imaging system, method and apparatus wherein the substrate has a photosensitive medium on a first surface and on a second, opposing surface and the photosensitive medium on both sides of the substrate are substantially simultaneously imaged or scanned.
  • the substrate is held in a frame which can be moved in a cross scan direction.
  • the frame allows the substrate to be moved in a cross scan direction so that the ultraviolet, mode-locked, modulated laser can be caused to scan across the entire surface of the photosensitive medium.
  • the disclosed, improved, ultraviolet, mode-locked, scophony-mode-modulated laser imaging system, method and apparatus provides improved efficiency of up to a factor of three. This allows usage of a low, average power laser while still providing improved accuracy.
  • Fig. 1 illustrates a flow chart of a prior art photo-lithographic process.
  • Figs. 2A-2E illustrate a substrate undergoing a prior art photo-lithographic process.
  • Fig. 3 illustrates a trace created by a prior art photo-lithographic process.
  • Figs. 4A-4D illustrate a substrate undergoing a photo-lithographic process in accordance with one embodiment of the present invention.
  • Fig. 5 illustrates a trace created by a photo-lithographic process in accordance with one embodiment of the present invention.
  • Fig. 6 illustrates the relative directions on a photosensitive panel to be submitted to a photo-lithographic process.
  • Fig. 7 illustrates a flow chart of a photo-lithographic process in accordance with one embodiment of the present invention.
  • Figs. 8A-8D illustrate a substrate undergoing a photo-lithographic process in accordance with one embodiment of the present invention.
  • Fig. 9 illustrates one embodiment of a mode locked laser system in accordance with the present invention.
  • Fig. 10 illustrates a laser scan diagram
  • Fig. 11 illustrates another laser scan diagram.
  • Figs. 12A-12B illustrate an AOM in accordance with one embodiment of the present invention.
  • Fig. 13A illustrates an AOM in accordance with one embodiment of the present invention.
  • Fig. 13B illustrates an AOM in accordance with one embodiment of the present invention.
  • Fig. 14 illustrates a laser direct imaging (LDI) device in accordance with one embodiment of the present invention.
  • Fig. 15 illustrates a dual side laser direct imaging (LDI) device in accordance with one embodiment of the present invention.
  • the exposed photoresist 218 is wider at the bottom 224 than at the top 222, i.e., the sides of the exposed photoresist 218 are not perpendicular to the substrate 202.
  • the top 222 is substantially the same width as the opening in the mask 208.
  • the resulting copper trace 220 is similarly wider than the opening in the mask 208.
  • the triangular-shaped areas 214, 216 represent an inaccuracy of the process 100. These triangular areas 214, 216, while illustrated in triangular form, those skilled in the art know can also be irregularly shaped. The formation of the triangular, inaccurate areas 214, 216, shown in Fig. 2, in the sides of the photoresist are caused by a combination of two factors.
  • the first cause is the chemical migration of the exposed photoresist into the unexposed photoresist areas.
  • Chemical migration is simply the process of a high concentration of a chemical migrating into a lower concentration area.
  • the photosensitive resist consists of different chemical components such as photo initiators, inhibitors, polymeric binder, thermal inhibitors and other chemicals. Exposing the photoresist with a known quantity of energy such as heat or light of the proper wavelength causes the photoresist to polymerize, this is also known as photo-polymerization. Photo-polymerization is a process by which the photoresist photosensitive monomers are "chained” together into polymers. This process results in polymer chains that form a strong fabric-like structure in the exposed area. The strong fabric-like structure is capable of resisting the attack of the development or etching chemistry and later chemical steps.
  • Photoresist materials are most sensitive or reactive to specific, ideal wavelengths of energy.
  • a photoresist that is sensitive to ultraviolet (UV) light is used. If a given photoresist is most sensitive to a particular, ideal UV wavelength, then the UV light source must be centered on the same ideal wavelength to achieve the highest speed of exposure. UV of a wavelength not centered on the ideal wavelength can typically initiate the exposure process, but typically at a reduced rate, therefore requiring additional time to achieve the same results as an equivalent UV source centered at the ideal wavelength for that photoresist.
  • the speed of photo-polymerization through the whole thickness of the photoresist depends on the amount of UV energy available.
  • the process starts from the top surface and proceeds towards the bottom of the photoresist as illustrated in Figs. 2A-2C.
  • the exposure process is believed to be a photo-polymerization process that creates a high concentration of polymer chains in the center, directly exposed areas 212, 213.
  • the concentration of polymer chains chemically migrates into areas of the photoresist 204 to either side of the directly exposed areas 212, 213 having less concentrations of the polymer chains.
  • This chemical migration causes the triangular, inaccurate areas 214, 216 shown in Fig. 2E.
  • the detailed working of the photoresist process is beyond the scope of this text and is a well known process for those skilled in the art of chemical processes.
  • a second cause of the formation of the roughly triangular cross-section, inaccuracy-producing areas 214, 216 in the sides of the photoresist 204 is when the exposing light enters the photoresist 204 at some angle other than perpendicular to the substrate 202. This is also known to occur even when collimated light sources are utilized. As shown in Fig. 2D, the exposing light rays 215 enter the photoresist 204 at an angle different from perpendicular to the substrate 202 and thereby undercut the mask layer 206 and expose the photoresist 204 to either side of the opening 208 in the mask 206. This under cutting of the mask layer 206 occurs especially when the UV lamp light source is used in combination with a phototool mask. This error is also called "under-radiation effect". LDI technology improves this process and thus provides for increased line edge quality during imaging and later resist/copper development.
  • Figs. 4A-4D illustrate one embodiment of the present invention of producing a PCB 400 using a phototool.
  • a substrate 402 with a conductive layer 403 is provided.
  • the conductive layer 403 can be copper, aluminum or other conductive material.
  • a layer of photoresist 404 is applied on top of the conductive layer 403.
  • a mask layer 406 is placed on top of the photoresist 404.
  • the mask layer 406 has at least one opening 408 substantially corresponding to the location, shape and size of the desired copper trace 420.
  • the mask layer 406 can also be in the form of a reticle or other means of masking light in a photo-lithographic process, and such reticles and means are known to one skilled in the art.
  • the photoresist 404 that is not covered by the mask layer 406 is exposed with a UV, mode locked laser light 410.
  • the mask layer 406 and the unexposed photoresist 404 is etched away.
  • the portion of the copper layer 403, which is no longer covered by photoresist 404, is etched away.
  • the exposed photoresist 418 is then removed. Only the desired copper trace 420 remains.
  • the exposed photoresist 418 the bottom 424 is substantially the same width as the top 422, i.e., the sides of the exposed photoresist 418 are substantially perpendicular to the substrate 402.
  • the top 422 is substantially the same width as the opening in the mask 408.
  • the desired copper trace 420 is similarly substantially the same width as the opening in the mask 408.
  • Fig. 5 illustrates a PCB substrate 502 with the trace 504, which is substantially the same as the opening in the mask (not shown).
  • I high intensity
  • a mode locked laser is a special type of laser.
  • the mode locked laser is mode locking at 80 MHz with a pulse width of 10 ps. This means that the pulse has a width of 10 ps and a pulse is generated every 12.5 nanoseconds.
  • the resulting peak power is very high.
  • the laser has a high (peak) power (or intensity) to average power (or intensity) ratio, and a high average power.
  • Using such a laser results in substantially perpendicular sidewalls in the in-scan direction as illustrated in Figs. 4A-4D, which in turn leads to higher accuracy in the direction perpendicular to the in-scan direction.
  • Equation 1 a CW laser having a 355 nm wavelength and 50 mW average power would require 4.875 seconds to expose an area of 3.75 cm 2 of photoresist "A" having a resist sensitivity of 65 mJ/cm 2 .
  • This unexpected result further reduces the required laser average power or allows for further reduced exposure time or combinations thereof, as compared to a conventional CW laser.
  • a lower power, mode-locked laser can also be more economically manufactured than a higher powered mode-locked laser. Therefore, using a mode locked laser having a lower average power such as 50 mW to 4 watts results in a combination of inherent efficiency improvements and edge accuracy and perpendicularity is improvements as compared to a similarly powered CW laser.
  • Other mode locked lasers having higher average power, such as up to 20 watts may also be utilized.
  • a mode locked laser of a conventional CW laser of the same power and wavelength is that a mode locked laser can more rapidly expose a given photoresist even if the mode locked laser is not emitting light at the ideal wavelength for the photoresist.
  • a LDI device which scans a surface line by line.
  • a laser is scanned in the in-scan direction, and produces a set of scan lines separated by a small distance in the direction substantially perpendicular to the scan-line direction (called the transverse, cross scan, or slow scan direction).
  • Fig. 6 illustrates a single segment 608 of a laser scan line being written on a substrate 602 coated with photoresist.
  • a scan line segment such as segment 608 we mean part of a scan line starting from one point at which the beam modulation changes to another point at which the beam modulation changes.
  • Segment 608 might, for example, represent a single pixel, in which case those in the art will appreciate that segment 608 is shown having an exaggerated length.
  • the start 612 of the scan line segment 608 might be where the beam is turned on from an off state, or in the case of "gray scale” modulation, a point at which the beam changes from one level to another.
  • the end 614 of the scan line segment 608 might be where the beam is switched off or changes from one level to another.
  • the in-scan direction 604 is illustrated by an arrow pointing down.
  • the in-scan direction 604 is the direction in which the laser scan moves very fast over the substrate or media or surface to be scanned and is determined by the polygon speed in the optical system.
  • the in-scan direction could be upwards.
  • the laser could scan in both upwards and downwards directions and therefore the in-scan direction would be both upwards and downwards.
  • the cross scan direction is illustrated by an arrow 606 pointing both left and right. In alternative embodiments, the cross scan direction could be only to the left or only to the right.
  • the beginning 612 of the scan line segment 608 is where the laser scan begins the scan line segment 608.
  • the end 614 of the scan line segment 608 is where the laser scan ends the scan line segment.
  • the quality, accuracy and perpendicularity of the in-scan edges 610, or side walls, in the in-scan direction 604 are substantially improved by use of the mode locked laser.
  • the quality, accuracy and perpendicularity of the beginning 612 and the end 614 is determined by several factors, including the speed of modulating (e.g., turning -on and turning off) the laser light during scanning.
  • Fig. 7 illustrates a laser direct imaging (LDI) process using the mode-locked laser to produce the PCB 800 illustrated in Fig. 8A-8D.
  • a substrate 802 with a copper layer 803 is provided.
  • a layer of photoresist 804 is applied on top of the copper layer 803, in block 704.
  • the photoresist layer 804 can be applied in any of a plurality of methods or combinations known in the art.
  • the photoresist 804 is selectively exposed with a mode-locked laser. Note that since this is a LDI, no mask or reticle is used but rather the laser scans or writes the desired image directly on the photosensitive surface.
  • the photoresist 804 is being developed, removing portions of resist according the imaging pattern. As known to those skilled in the art, there are both positive and negative working photoresist. Then, the non protected portion of the copper layer 803 is etched away in block 712. The remaining photoresist 818 is then removed in block 714. In block 716, only the desired copper trace 820 remains.
  • the exposed photoresist 818 the bottom 824 is substantially the same width as the top 822, i.e., the sides of the exposed photoresist 818 are substantially straight and perpendicular to the substrate 802.
  • LDI exposures using a pulsed laser in accordance with one aspect of the present invention make those sidewalls perpendicular to the substrate 802 when those sidewalls are in the laser in-scan direction.
  • using scophony mode for the LDI exposures in accordance with another aspect of the present invention make those sidewalls perpendicular to the substrate 802 in other directions, so that the preferred embodiment provides for having substantially perpendicular sidewalls in all directions.
  • the top 822 is substantially the same width as the width covered by the one or more scan-lines from the laser.
  • the desired copper trace 820 is similarly substantially the same width as the one or more scan-lines from the laser.
  • the LDI method reduces the tendency of the exposing light entering the photoresist at some angle other than perpendicular to the substrate 802.
  • the mode lock laser used in the LDI method further reduces the tendency of the exposing light entering the photoresist at some angle other than perpendicular to the substrate 802.
  • the low duty cycle i.e., the high peak power and short time duration pulse of the laser light from the mode lock laser used in the LDI also reduces the time available for photo-polymerization and chemical migration to occur.
  • the mode lock laser thereby improves the perpendicularity, accuracy and quality of the side walls of the photoresist.
  • substantially perpendicular edges of the photoresist provide sharp, controlled line widths in copper after the chemical etching process. A certain thickness of the photoresist is required during the chemical etching to provide sufficient protection against the chemicals.
  • substantially perpendicular edges and “substantially perpendicular to the substrate” is meant having side walls that are substantially perpendicular to the substrate's surface after processing the PCB such that the resolution is improved in the direction perpendicular to the side wall, as illustrated in Fig. 8, the improvement being over having less perpendicular side walls such as illustrated in prior art Figs. 2A-2E.
  • improved perpendicularity is meant having side walls that are more perpendicular to the substrate's surface after processing the PCB such that the resolution is improved in the direction perpendicular to the side wall over the prior art.
  • FIG. 9 A simplified diagram of a laser pattern generator in accordance with one embodiment of the present invention is illustrated in Fig. 9.
  • This laser pattern generator in terms of most of its components, is conventional and is also similar to a variety of commercially available laser pattern generators as used for photolithography.
  • this laser pattern generator includes, instead of a conventional CW laser, a pulsed laser 940, which emits a series of laser pulses indicated as laser beam 942 which is pulsed at a relatively high frequency, i.e., 100 MHz with a range of typically 1 to 400 MHz.
  • a laser can be constructed from a mode-locked Nd:YLF laser driving an external cavity that is resonant for second harmonic radiation. This approach to laser construction has been described, for instance, in S.C.
  • the mode locked laser can have a wavelength of between 200 nm and 532 nm, a pulse width of between 1 ps and 20 ps, a pulse frequency of between 50 MHz and 400 MHz, an average power of between 50 mW and 20 watts and an average duty cycle of between 125 to 1 and 20,000 to 1, where the duty cycle is defined as the ratio of time between pulses to pulse width.
  • the pulsed laser beam 942 is coupled to the optical input port of an acousto-optic modulator (AOM) 946, which, as shown, also has an electrical port receiving a data signal in the form of pixel data.
  • AOM acousto-optic modulator
  • This data signal represents the pattern to be written.
  • the laser beam 942 may be split into a number of sub-beams and the modulator 946 may actually be one channel of a multi-channel modulator, with each channel individually modulating each of the sub-beams, as is well known in this field. Alternatively, several modulators may be used, with each modulating a single beam.
  • the modulated beam output from AOM 946 is incident upon the reflective facets of a conventional rotating polygon 948 of the type well known in this field.
  • the polygon 948 is the actual scanning device and is part of the scanning optics.
  • acousto-optical deflection may be used to generate the scanning motion of the beam.
  • An acousto-optical scanner hence is substitutable for a polygon-type scanner and was found to be faster at short scans.
  • Fig. 9 shows the rotating polygon scanning device 948, an acousto-optical or other deflection device can be substituted.
  • Many other types of scanner technology exists and are not in the scope of this text, but known to those skilled in the art.
  • the scanning laser beam reflected from the facets of rotating polygon 948, passes through the scan lens 952 which typically includes refractive (and sometimes reflective) optics which focus the beam on the upper surface of work piece or media or substrate 954, which in turn is held on frame 958.
  • the work-piece is for example a panel such as a substrate 954 having a layer of metal to be patterned and over which is also formed a photoresist layer to be exposed by the scanning beam.
  • Commercially available photoresist for PCB's are exposed by an approximately 355 nm wavelength laser beam.
  • An example of such photoresist is Riston® Photoresist (E. I. du Pont de Nemours and Company, Research Triangle Park, NC).
  • the modulator 946 is optimized for the 355 nm wavelength region in terms of transducer geometry and acoustic coupling.
  • the refractive elements of the scan lens 952 using conventional fused silica and if necessary, quartz lens elements, are optimized for the particular incident wavelength. Such modifications are well within the skill of one of ordinary skill in the art.
  • a typical optical output power level of laser 940 is 1 Watt.
  • a system of the type depicted in Fig. 9 operating with a shorter wavelength (e.g. 266 nm or less) pulsed laser also is within the scope of this invention.
  • the apparatus of Fig. 9 takes one of at least two embodiments.
  • the pixels i.e ., the data applied to the electrical port of modulator 946, are synchronous to the pulse rate of the laser.
  • the pulse rate of the laser is a fixed frequency dependent on the actual laser cavity design and materials.
  • the laser pulses in one embodiment are 5 ps long and have a period of 1 nanosecond (ns).
  • the pulse rate is 50 to 100 MHz. This is only exemplary and other wavelengths are possible for the laser as are other pulse lengths and periods (pulse frequencies) that provide the high peak to average ratio.
  • Fig. 10 shows an example of a pattern scanned by such a synchronous mode laser scanner.
  • the edge position of the feature being written (shown by the circles 1002 which are intended to be exposed beam spots or pixels) represents the feature edge position determined by a fixed writing grid 1004 and the modulator state, i.e., on, off, grayscale, at the edge pixels. Grayscale (variations in image intensity between on and off) can also be used.
  • the individual spots, i.e., exposed pixels are formed in a sequence by laser pulses on the fixed writing grid formed by the laser beam being modulated by the modulator according to the pixel data.
  • the in-scan axis 1025 is the vertical axis and the cross scan axis 1030 is the axis of movement is the horizontal axis.
  • the pixels 1002 being on or off represent an edge of the feature, shown by line 1010.
  • Fig. 11 shows writing in an asynchronous mode embodiment.
  • the individual pixel spots 1102 are not aligned to the writing grid 1104, but are turned on or off by the modulator 946 typically more gradually than the laser pulse rate, in order to achieve the writing pattern shown in Fig. 10.
  • the modulator intensity profile determines the feature edge position, shown by line 1110.
  • This embodiment also can be used in conjunction with grayscale, but again grayscale is not necessary.
  • the laser pulse rate is e.g. 200 MHz.
  • One common specification for both embodiments is that the pulse rate of the laser must be at least the same or higher than the pulse rate of the pixel data.
  • each scan line or scan line segment are also typically inaccurate, similar to the side walls.
  • the inaccuracies in the beginning and end of each scan line or scan line segment are caused by different causes than the inaccuracies of the side walls.
  • the beginning and end of each scan line segment is inaccurate as a result of a relatively slow turn on sequence of the laser at the beginning of each scan line segment and a relatively slow turn off sequence at the end of each scan line segment. This slow turn on and turn off sequence results in a sloped turn-on or turn-off power of the laser at the start and end of each scan line segment.
  • One method to solve improve the turn-on and turn-off of the laser, i.e., higher speed switching of the laser, and thereby improve the accuracy, perpendicularity and quality of the beginning and end of each scan line segment is to scan in "scophony" mode.
  • Scophony mode scanning substantially eliminates the rise time effect on the media of the AOM.
  • one result of using scophony mode is that the laser modulation turn on/turn off profile substantially resembles a step function in time, rather that a function in time that has some finite slope.
  • scophony mode laser switching is described in U.S. patent 4,213, 158 to DeBenedictis. Another is described in U.S. patent 5,923,359 to Montgomery.
  • the finite rise (and fall) times of the modulator also may lead to inaccuracies of features within a scan line, for example, at pixel boundaries. This is particularly important when the scanner is operated in asynchronous mode.
  • an AOM is used as an active light switch to modulate the laser beam on or off according to the pixel data.
  • An AOM provides a certain slope where the light energy increases from zero deflection to maximum deflection over a certain time. If the laser pulse arrives, for example, in the middle of that slope, the laser energy directed towards the photosensitive media is limited. Limiting the laser energy reduces the benefits of the mode-locked laser described above. Also in a scanning device, the actual instantaneous location or spot where the laser is focused on the media, is caused to move or scan across the media very quickly. This quick scan across the surface results in the laser energy being distributed over a larger area than it would be if the spot focused on a single location for an extended time.
  • Scophony mode substantially instantly applies the full available laser power to the photosensitive surface. This instant on substantially improves accuracy, perpendicularity and quality of the end and beginning of the scan line segment.
  • Figs. 12A-12B illustrate the principle of operating an AOM.
  • 1201 is an AOM crystal.
  • 1202 is a RF transducer attached to the AOM crystal 1201.
  • 1203 is the active window of the AOM crystal 1201 where laser light/RF sound interaction occurs.
  • 1204 is an absorbing surface to reduce RF back reflections inside the AOM crystal 1201.
  • 1205 is the zero order diffracted beam exiting the AOM and 1206 is the first order diffracted beam exiting the AOM.
  • 1207 is the acoustic wave inside the crystal travelling in the acoustic wave direction 1208.
  • the first order beam 1206 is used for imaging.
  • the first order beam 1206 beam is turned on (i.e., the main beam deflected to generate the first order beam) or not according to the pixel data applied to the RF transducer.
  • the pixel data is transformed into wavefronts within the AOM that move at an acoustic speed 1207 within the AOM. This results in an image on the imaging surface, e.g., on the surface of a PCB panel, that moves at a velocity related to the magnification of the optical system of the laser beam between the AOM and the surface of the panel being imaged, and to the acoustic speed within the AOM.
  • the image of the acoustic wave is oriented to move parallel and in an opposite direction to the scanning laser beam.
  • the velocity of the scanning laser beam is made equal to the velocity of the image of acoustic wave on the imaging surface.
  • the imaging data is effectively "frozen” onto the surface of the panel being imaged even though the laser beam is being moved in the in-scan direction.
  • the rise and fall time effects are significantly reduced. It is as if the switch has a block wave characteristic.
  • the pixel data appears to be effectively standing still on the media.
  • a mode-locked laser is combined with scophony mode to create improved edge quality in both in-scan direction (sides) and cross scan direction (beginning and end) of each scan line segment ⁇ which may be a single pixel ⁇ during one exposing event.
  • AOM devices are used to switch the laser light on/off going towards a laser sensitive medium as described above.
  • AOM devices can be configured as a monobeam or multibeam. These multiple configurations provide the ability to write pixels, and thereby create an image, on media.
  • An example of such multibeam devices are shown in Figs 13A-B. Multibeam technology improves the throughput of a LDI device.
  • a mono crystal/transducer version is illustrated in Fig. 13A and includes the undeflected original (and also the zero order exit) laser beam 1305.
  • the original laser beam 1305 is deflected by a mixed RF signal applied to the transducer to generate a plurality of deflected beams 1308 that are each used for imaging.
  • Each of the components of the mixed RF signals modulates the particular deflected beam.
  • a stacked transducer with one crystal configuration is possible as shown in Fig. 13B.
  • Several original beams are used, coming from different laser sources or from a beam splitter (not shown). One such beam is shown as 1310.
  • Each beam is deflected or not, and one deflected beam 1310 is shown, and is generated if transducer 1304a is activated with a RF signal.
  • other beams e.g ., original beams 1311 and 1312
  • the RF signal is modulated according to the pixel data, and comes from an RF driver/amplifier (not shown).
  • An LDI in accordance with one embodiment of the present invention situation uses one laser source, two optical heads and a head to head laser switch. This creates an optical multiplexing system.
  • the head-to-head switching can be performed on one active laser beam, this is a mono beam version, or on a group of multiple number of beams, this is a multi beam configuration.
  • An AOM can also be utilized to perform the head to head switching.
  • a light source 1410 is used for generating a light beam 1420.
  • Light source 1410 of exposing apparatus 1400 includes a mode locked UV laser, as described above, generating a main beam 1420 which is directed to optical scanning unit 1430.
  • Optical switch 1425 acting as a deflector and switch directs the beam 1420 to optical scanning unit 1430.
  • scanning unit 1430 directs the beam 1420 to the photosensitive layer 1442 of panel 1440, thereby exposing the photosensitive layer 1442 during a pass or scan of the beam 1420.
  • the panel 1440 can be caused to pass by the beam 1420 or a combination of passing the beam 1420 and the panel 1440, relative to each other.
  • Optical switch 1425 in one embodiment is a beam deflector, in particular, an AOM as described above in Figs. 12A through 13B.
  • FIG. 15 A dual side LDI in accordance with one embodiment of the present invention is illustrated in Fig. 15.
  • only one light source 1510 is used for generating both light beams 1520 and 1525.
  • the two beams 1520 and 1525 are each generated from a different light source. That is, two light sources are used, one for each of optical systems 1530 and 1535.
  • light source 1510 of optical system 1505 of exposing apparatus 1500 includes a mode locked UV laser, as described above.
  • the mode locked UV laser generates a main beam 1514 which, alternately, is directed to optical scanning unit 1530 and optical scanning unit 1535, with the alternating switching carried out by means of an optical switch 1515.
  • the optical switch 1515 acts as a deflector and split mirrors 1517 and 1518 direct to optical scanning units 1530 and 1535, respectively.
  • scanning units 1530 and 1535 respectively, direct or scan the two beams 1520 and 1525 toward the photosensitive layers 1542, 1544 on opposing surfaces of panel 1540, thereby exposing both of the photosensitive layers 1542, 1544 during a single pass of the two beams 1520 and 1525.
  • the panel is secured in place by a frame 1550.
  • the frame 1550 can also be movable in the cross scan direction.
  • the panel 1540 can be caused to pass by the two beams 1520, 1525 in the cross scan direction or a combination of passing the two beams 1520, 1525 and the panel 1540, relative to each other.
  • the optical systems 1530 and 1535 can be movable in the cross scan direction so as to scan the entire surface of the panel 1540.
  • Further alternative embodiments include both the optical systems 1530 and 1535 and the panel 1540 are movable in the cross scan direction so as to scan the entire surface of the panel 1540.
  • Split mirrors 1517 and 1518 in one embodiment are two faces of a reflecting prism.
  • Optical switch 1515 in one embodiment is a beam deflector, in particular, an AOM deflector.
  • the split mirrors 1517 and 1518 and optical switch 1515 can be combined into a more efficient AOM such as those described above in Figs. 12A through 13B.
  • either of the embodiments illustrated in Figs. 14 and 15 can also be performed with the panel to be scanned in either a horizontal or vertical orientation.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
EP01202093A 2000-06-08 2001-06-01 Système, méthode et appareil pour l'exposition d'une plaque pour circuit imprimé utilisant un laser à modes bloqués et opérant en mode continu Pending EP1162509A3 (fr)

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US590782 2000-06-08

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002067057A1 (fr) * 2001-02-22 2002-08-29 Norseld Pty Ltd Amplification d"images pour systemes laser
US7058109B2 (en) 2001-02-22 2006-06-06 Norseld Pty Ltd Image amplification for laser systems
WO2005109083A3 (fr) * 2004-05-06 2005-12-15 Esko Graphics As Dispositif et procede d'exposition d'image optique
TWI655512B (zh) * 2011-08-19 2019-04-01 以色列商奧寶科技有限公司 光束形成光學系統及直接成像系統

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