EP0975462A1 - Thermal insulating coating employing microencapsulated phase change material and method - Google Patents
Thermal insulating coating employing microencapsulated phase change material and methodInfo
- Publication number
- EP0975462A1 EP0975462A1 EP98906339A EP98906339A EP0975462A1 EP 0975462 A1 EP0975462 A1 EP 0975462A1 EP 98906339 A EP98906339 A EP 98906339A EP 98906339 A EP98906339 A EP 98906339A EP 0975462 A1 EP0975462 A1 EP 0975462A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- article according
- group
- phase change
- microcapsules
- polymeric binder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
Definitions
- This invention relates generally to the field of insulative coatings and more specifically to insulative coatings that are applied to substrates in order to protect an underlying structure from thermal transients and thermal impulses.
- thermal energy delivered during short periods of time is one type of stress that, if not effectively managed will cause a shortening of component life.
- Several techniques are commonly employed to cool electronic components such as attaching the component to a heat sink which can then reject heat by means of thermal radiation and convection.
- Another method which is often used in combination with heat sinks is to circulate air around the component by mounting a fan or blower proximate the component to be cooled.
- Another method of cooling components is to surround them with potting compounds or conformal coatings which also protect them from the deleterious effects of
- the potting compound is usually a semifiexible epoxy with a thixotropic agent and a curing agent added.
- the particular epoxy used usually depends on a number of parameters, including the thermal coefficient of expansion of the component.
- the thermal coefficient of expansion of the epoxy should be close to that of the electronic component so as 2 to prevent possible breakage thereof.
- Other considerations are that the epoxy should be waterproof and that it not react electrically or physically with the component. It would therefore be of commercial value to formulate a coating that could be applied to the exterior of an electronic component or its package that
- Another object of present invention is to provide a thermally capacitive coating that will extend component life. Also an object of the present invention is to provide a thermally capacitive coating that will enhance component reliability.
- a still further object of the present invention is to provide a thermally capacitive coating that is less costly than the currently available thermal
- a coating is placed in energy absorbing contacting relation with the substrate.
- the coating includes a base material and plurality of microcapsules dispersed within the 4 base material.
- the microcapsules contain a thermal energy absorbing material, for example, a phase change material such as paraffinic hydrocarbons or plastic crystals.
- Figure 1 is a cross section of a microcapsule containing a phase change
- Figure 2 is a cross section of a substrate such as an aircraft skin, road surface, bridge, electronic component, foam, glass, plastic, etc. coated with a base material loaded with microencapsulated phase change materials according to the
- Figure 3 is a graph that illustrates an uncoated control sample of aircraft skin.
- Figure 4 is a graph that illustrates the heating of a sample of aircraft skin coated with a 10 mil thick coating of binder material only.
- Figure 5 is a graph that illustrates the heating of a sample of aircraft skin coated with a 10 mil thick coating of binder in combination with microencapsulated phase change material dispersed therein.
- the coating generally indicated at 10 comprises a flexible polymer binder 20, with a plurality of microcapsules 30 (figure 1) integral and dispersed within the polymer binder 20.
- the microcapsules 30 contain a temperature stabilizing means 40 as will be more
- the polymer binder may take the form of an organic plastic, examples of which include but are not limited to polyurethane, nitrile rubbers, cholorprene rubbers, polyvinyl alcohol, silicone, ethylene/vinyl acetate copolymer, acrylic and the like.
- microcapsules can range in diameter from about 0.50 microns to about 1000 microns and are formed according to conventional methods well known to
- microcapsules contain a temperature stabilizing means or phase change material 40 such as eicosane. Additionally, plastic crystals such as 2,2-dimethyl-
- DMP 1,3- propanediol
- HMP 2-hydroxymenthyl-2-methyl-1 ,3-propanediol
- the composition of the phase change material 40 may be modified to obtain optimum thermal properties for a given temperature range.
- the melting point of a homologous series of paraffinic hydrocarbons is directed related to the number of carbon atoms as shown in the following table: COMPOUND NAME # CARBON ATOMS MELTING POINT DEG.C n-Octacosane 28 61.4 n-Heptacosane 27 59.0 n-Hexacosane 26 56.4 n-Pentacosane 25 53.7 n-Tetracosane 24 50.9 n-Tricosane 23 47.6 n-Docosane 22 44.4 n-Heneicosane 21 40.5 n-Eicosane 20 36.8 n-Nonadecane 19 32.1 n-Octadecane 18 28.2 n-Heptadecane 17 22.0 n-Hexadecane 16 18.
- each of the above materials can be separately encapsulated and is most efficient near the melting point indicated. It will be seen from the foregoing that the effective temperature of the coating can be tailored to a specific environment by selecting the phase change materials required for the corresponding temperature 7 and adding microcapsules containing the material to the coating.
- the desired microencapsulated phase change materials are added to the polymer binder (liquid, solution or dispersion), compounded, cured, sprayed, cross-linked or famed to form a flexible (or inflexible) layer on a substrate such as an aircraft skin, concrete, roadway surfaces (such as asphalt), foam, bridge structures or building materials according to conventional methods.
- added to the polymer binder range from about 30% by weight to about 80% by weight.
- Embedding the microcapsules directly within the polymer binder 20 adds durability as the phase change material is protected by a dual wall, the first being the wall of the microcapsule and the second being the surrounding polymer matrix
- the substrate can be any type of structure that is subjected to repeated thermal gradients, regardless of whether said gradients are impulse or relatively gradual.
- impulse type thermal gradients would be found in pulsed electronic components such as Pulse Power Thyristors - on the order of milliseconds or microseconds or vertical take-off and landing jets where thermal transients may have a duration on the order of 15 seconds.
- the thermal gradients may be gradual and shift over a period of hours.
- a bridge absorbs thermal energy during the daylight hours and releases or radiates the energy at night.
- precipitation falls especially in colder climates, it often freezes making roadways dangerous.
- a road 8 surface incorporating the coating according to the present invention would remain above the freezing temperature for a longer period of time, thus reducing or even possibly eliminating the need for sanding/salting on some occasions.
- the phase change material would be selected so as to melt during the daylight hours, thus absorbing the solar energy and would freeze after having relinquished the energy so stored after sunset. The net result being that the formation of ice on the roadway would be delayed.
- the coating may be applied to aircraft wings to avoid or delay the need for deicing.
- second line is the surface temperature and the third curve is the temperature immediately under the coating as measured by a miniature thermocouple. In 15 seconds, the temperature of the uncoated sample had reached 270 degrees C. 9
- Figure 4 illustrates the heating of a 10 mil coated sample under the same conditions.
- the coating was a urethane binder material without any microencapsulated phase change materials.
- the temperature immediately below the surface shown by the third line from the top
- Figure 5 is the curve for a 0.010 inch coating containing microencapsulated phase change materials at an eight per cent Critical Pigment Volume Concentration (PVC) loading fraction.
- the PVC is the
- Figure 5 shows how the temperature immediately below the surface reached only 80 degrees C after 15 seconds of heating. In fact, as the figure illustrates, the subsurface temperature reached only 100 degrees C after 20 seconds of heating. This enhanced thermal protection means that a very thin coating of microencapsulated phase change materials can reduce the sample surface temperature over 70 percent, from 270 degrees C to 80
Landscapes
- Paints Or Removers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
Claims
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US1998/002674 WO1999041067A1 (en) | 1995-07-05 | 1998-02-13 | Thermal insulating coating employing microencapsulated phase change material and method |
Publications (1)
Publication Number | Publication Date |
---|---|
EP0975462A1 true EP0975462A1 (en) | 2000-02-02 |
Family
ID=22266376
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP98906339A Withdrawn EP0975462A1 (en) | 1998-02-13 | 1998-02-13 | Thermal insulating coating employing microencapsulated phase change material and method |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0975462A1 (en) |
JP (1) | JP2001519968A (en) |
KR (1) | KR20010006245A (en) |
CN (1) | CN1252025A (en) |
AU (1) | AU6158598A (en) |
CA (1) | CA2286011A1 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070173154A1 (en) * | 2006-01-26 | 2007-07-26 | Outlast Technologies, Inc. | Coated articles formed of microcapsules with reactive functional groups |
CN100447208C (en) * | 2006-09-28 | 2008-12-31 | 成都新柯力化工科技有限公司 | Energy-saving building coating and preparation method |
CN103289425B (en) * | 2013-07-01 | 2015-06-17 | 句容宁武科技开发有限公司 | Preparation method of of pavement thermoregulation paving material based on phase-change heat accumulation microcapsules |
CN103745772B (en) * | 2013-12-29 | 2016-05-18 | 湖南华菱线缆股份有限公司 | Phase transformation temp auto-controlled shielded cable |
NZ742798A (en) * | 2015-10-23 | 2019-06-28 | Schmetzer Ind Holdings Pty Ltd | Insulation material arrangement and method for forming an insulation material |
CN105835495A (en) * | 2016-04-01 | 2016-08-10 | 湖南星鑫航天新材料股份有限公司 | Phase-change energy-storage flexible lightweight composite heat shroud and manufacturing method thereof |
CN111395100A (en) * | 2020-03-17 | 2020-07-10 | 同济大学 | Asphalt road structure adjusts temperature |
KR102376230B1 (en) * | 2020-04-28 | 2022-03-22 | 주식회사 우조하이텍 | Polyurethane foam insulation and manufacturing method thereof |
CN114133888B (en) * | 2021-12-13 | 2023-04-07 | 九牧厨卫股份有限公司 | Heat-conducting composite material and plate |
-
1998
- 1998-02-13 KR KR19997009327A patent/KR20010006245A/en not_active Application Discontinuation
- 1998-02-13 CN CN98804081A patent/CN1252025A/en active Pending
- 1998-02-13 CA CA002286011A patent/CA2286011A1/en not_active Abandoned
- 1998-02-13 EP EP98906339A patent/EP0975462A1/en not_active Withdrawn
- 1998-02-13 AU AU61585/98A patent/AU6158598A/en not_active Abandoned
- 1998-02-13 JP JP54143999A patent/JP2001519968A/en not_active Ceased
Non-Patent Citations (1)
Title |
---|
See references of WO9941067A1 * |
Also Published As
Publication number | Publication date |
---|---|
JP2001519968A (en) | 2001-10-23 |
AU6158598A (en) | 1999-08-30 |
KR20010006245A (en) | 2001-01-26 |
CA2286011A1 (en) | 1999-08-19 |
CN1252025A (en) | 2000-05-03 |
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Legal Events
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