DE112012002279T5 - Method and apparatus for power distribution with multiple inputs to adjacent outputs - Google Patents

Abstract

Methods, systems and devices efficiently and reliably deliver power from multiple input power sources to adjacent outputs. Aspects of the disclosure provide a power distribution unit (PDU) that has a number of power outputs that have first and second adjacent power outputs. The PDU has a printed circuit board that has a first conductive layer that is electrically connected to a first power input terminal and the first current output and a second conductive layer that is at least partially above the first conductive layer and in an opposite or facing Relationship to it. The second conductive layer is electrically isolated from the first conductive layer and is electrically connected to a second current input terminal and the second current output, the first and second current outputs thereby being connected to different current inputs.

Description

TERRITORY

The present disclosure is directed to apparatus, systems, and methods used in power distribution, power management, and power monitoring applications. More particularly, the present disclosure is directed to devices, systems, and methods that have the ability to provide power from different power inputs to adjacent outputs.

BACKGROUND

Power Distribution Units (PDUs) have long been used to power electronic devices. A conventional power distribution unit (PDU) is an array of multiple "outlets" (also referred to as "jacks" or "outlets") which receive electrical power from one source and supply the electrical power to one via the outlets or distribute several separate electronic units whose respective power cables or connecting cables are plugged into the respective sockets of the PDU. In some applications, a PDU receives power from two different power inputs, commonly referred to as dual feed PDUs or dual input PDUs. Such dual inputs may provide a PDU with additional power capability and / or may provide redundant power sources for devices receiving power from PDU outlets. PDUs may be used in any of various applications and environments, such as, for example, in or on racks or supports for electronic devices (such as RETMA racks) to provide, among other applications, network devices (eg, servers, routers, etc.). Gateways, network switches). One or more PDUs located in a cabinet may be referred to simply as a cabinet power distribution unit (CDU) or cabinet power distribution unit.

Power distributed to small businesses or residential customers is generally a "single-phase" current or a "split-phase" current. In a single-phase system, a single AC voltage is distributed through a two-conductor connection. In a split-phase system, two AC voltages are distributed through at least three conductors: a neutral conductor and another conductor for each of the two phases. The two voltage waveforms are separated in time by a "phase difference" of 180 degrees - that is, the sinusoidal shape of the voltage in one conductor advances or retreats the sinusoidal shape of the voltage in the other conductor by the amount of the phase difference. The effective voltage between the first phase conductor and the second phase conductor is therefore considerably larger than the effective voltage between each of the phase conductors and the neutral conductor. As a result, a three-wire split-phase system can provide, for example, 120 volts in a circuit from a phase conductor to a neutral and 240 volts in a circuit from a phase conductor to a phase conductor.

Three-phase systems can be used in larger commercial and industrial applications. In three-phase systems, each voltage cycle in each phase conductor is phase shifted by 120 degrees or 1/3 of a cycle from the voltage cycle in each of the other two phase conductors. Three-phase systems are used in large commercial and industrial applications because a three-phase device is smaller in size, less weighs, and more efficient than a single-phase or two-phase device. Although three-phase circuits are somewhat more complex than single-phase or two-phase circuits, they weigh less than single-phase circuits for the same loads supported by the circuits. Three-phase circuits can also provide a wide range of voltages and can be used for single-phase or two-phase loads.

A three-phase current is generated by circuits in one of two configurations: (i) a "delta" or "triangle" configuration; or (ii) a "Ypsilon" or "star" configuration. If one end of each of the line branches of a three-phase circuit is connected centrally at a common point and the other ends are connected to three phase conductors (one conductor for each phase), then the configuration is called a star connection or "Y" circuit. Instead, if the line branches of the three-phase circuits are connected in series to form a closed circuit, with one phase conductor connected to each connection point of two adjacent line branches, then the configuration is called a "triangle" or "Δ" circuit.

One reason that the three-phase circuits are more complex than typical single-phase circuits is the need to maintain symmetrical loads between each of the three phases, at least to some degree. An indicator of imbalance is the level of current flowing through each phase conductor. When the level of current flowing through a Phase conductor flows, differs considerably from that flowing through another phase conductor, then the load is considered asymmetrical. In a star-connected system, an imbalance may also be indicated by current flowing through the neutral. An imbalance between the loads can lead to damage to the three-phase system, can cause excessive wear of components in the system, such as the alternator, can result in increased power consumption, and can be difficult and expensive to correct.

For example, high-capacity data centers used in computer and communications network applications generally use three-phase power to provide the operating power to the devices residing in hundreds or thousands of equipment racks in the data center. Generally, three-phase power is supplied to the device racks via a four- or five-wire input providing one conductor for each voltage phase, ground, and neutral for three-phase star circuits. A vertically or horizontally aligned power distribution unit is connected to or connected to the input and distributes different phase current to a plurality of phase outputs. A three-phase PDU typically provides three or more output branches, one branch for each current phase provided by the three-phase power strip. The PDU may be attachable to or adjacent a given device rack to supply three or more branches of single-phase power (each of which branches is derived from the three-phase power input) to the rack or other device in the vicinity.

SUMMARY

In various embodiments, a power distribution unit (PDU) is provided, comprising: (a) a PDU housing; (b) a power input disposed at least partially within the housing and having at least a first input terminal electrically connectable to a first power source and a second input terminal electrically connectable to a second power source; (c) a plurality of power outlets at least partially disposed within the housing and having at least a first power output and a second power output located adjacent to the first power output; and (d) a printed circuit board disposed in the housing and having (i) a first conductive layer electrically connected to the first input terminal and the first current output, and (ii) a second conductive layer at least partially is above the first conductive layer and in facing relation thereto, electrically insulated from the first conductive layer, electrically connected to the second input terminal and electrically connected to the second current output, the first and second current outputs thereby being different Power inputs are connected.

In some embodiments, the printed circuit board further includes a first conductive coated through-bore extending through the first and second conductive layers, the first conductive-coated through-hole electrically connected to the first conductive layer, electrically isolated from the second conductive layer and electrically connected to the first current output. The printed circuit board of such embodiments may further comprise a second conductive plated through bore extending through the first and second conductive layers, the second conductive plated through hole being electrically connected to the second conductive layer, being electrically isolated from the first conductive layer, and is electrically connected to the second current output.

The power input may further include a third power input terminal that is electrically connectable to a third power source, in which case the power outputs have a third power output adjacent the second power output, and the printed circuit board further comprises a third conductive layer which is at least partially above the first and second conductive layers, is electrically isolated from the first and second conductive layers, is electrically connected to the third input terminal, and is electrically connected to the third current output. With such a configuration, the first, second and third current outputs are thereby connected to different current inputs. The printed circuit board may (1) be electrically insulated from the second and third conductive layers and electrically connected to the first conductive via hole extending through the first, second and third conductive layers and electrically connected to the first conductive layer Current output is connected; (2) a second conductive coated through-bore extending through the first, second and third conductive layers and electrically connected to the second conductive layer, electrically isolated from the first and third conductive layers, and electrically connected to the second current output; and (3) comprise a third conductive coated through-bore extending through the first, second and third conductive layers, and is electrically connected to the third conductive layer, is electrically isolated from the first and second conductive layers and is electrically connected to the third current output.

In some embodiments, the current outputs include at least first and second groups of linearly-arranged current outputs, with adjacent current outputs within each of the groups being connected to different current inputs. The PDU also includes a plurality of power control relays disposed in the housing, wherein each of the plurality of power control relays is connected in independent current controlling communication between the power input and one of the power outputs in some embodiments. The PDU may also include a power related information reporting system (eg, at least one of the power, voltage, and power) that communicates with one or more of the power input in the housing in current information related communication and the power outputs, and in communication related to the power related information, may be connectable to a separate communications network remote from the power distribution device.

The power input to the PDU may include a first power input connected to a first power source and a second power input connected to a second power source, or may have a three-phase power input in which the first and second power sources are different phases of the three-phase power input correspond.

Another aspect of the disclosure provides a printed circuit board apparatus for providing adjacent power outputs with a stream of different power inputs, comprising: (a) a first conductive layer having a first input terminal configured to be connected to a first power input and having a first output terminal configured to be connected to a first current output; and (b) a second conductive layer at least partially over the first conductive layer, and preferably in opposing relationship thereto, and electrically isolated from the first conductive layer. The second conductive layer has a second input terminal configured to be connected to a second current input and a second output terminal configured to be connected to a second current output.

The printed circuit board may include a first conductive coated through-bore extending through the first and second conductive layers and electrically connected to the first conductive layer and electrically isolated from the second conductive layer, and a second conductive-coated through-hole extending through the first and second conductive layers extend and are electrically connected to the second conductive layer and are electrically isolated from the first conductive layer.

The printed circuit board may also include a third conductive layer at least partially over the first and second conductive layers, and preferably in an opposed relationship thereto. The third layer is electrically isolated from the first and second conductive layers and has a third input terminal configured to be connected to a third current input and a third output terminal configured to be connected to a third current output , In such embodiments, a first conductive coated throughbore may extend through the first, second, and third conductive layers, may be electrically connected to the first conductive layer, may be electrically isolated from the second and third conductive layers, and may be electrically connected to the first current output terminal be; a second conductive coated via may extend through the first, second, and third conductive layers, may be electrically connected to the second conductive layer, may be electrically isolated from the first and third conductive layers, and may be electrically connected to the second current output terminal; and a third conductive coated throughbore may extend through the first, second, and third conductive layers, may be electrically connected to the third conductive layer, may be electrically isolated from the first and second conductive layers, and may be electrically connected to the third current output terminal.

Another aspect of the disclosure provides a method for supplying power to adjacent power outputs of different power inputs in a power distribution unit, the method comprising the steps of: (a) connecting a first conductive layer of a printed circuit board to a first power input; (b) connecting a second conductive layer of the printed circuit board to a second power input, the second conductive layer being at least partially over the first conductive layer and being electrically isolated from the first conductive layer; (c) Connect a mains power connection of a first current output to the first conductive layer; and (d) connecting a mains current terminal of a second current output adjacent the first current output to the second conductive layer.

The method may also include connecting a third conductive layer of the printed circuit board to a third power input, the third conductive layer being at least partially over the first and second conductive layers and being electrically isolated from the first and second conductive layers; and connecting a power supply terminal of a third power output adjacent one of the first and second power outputs to the third conductive layer.

The connecting the mains current terminal of the first current output to the first conductive layer may comprise connecting a first conductive coated through-hole to the mains current terminal of the first current output, the first conductive-coated through-hole extending through the first and second conductive layers electrically to the first conductive layer is connected and is electrically isolated from the second conductive layer. The connecting the mains current terminal of the second current output to the second conductive layer may comprise connecting a second conductive plated through-hole to the mains current terminal of the second current output, the second conductive-coated through-hole extending through the first and second conductive layers electrically to the second conductive layer is connected and is electrically isolated from the first conductive layer. The method may also include connecting a third plated through hole to the power outlet of a third power outlet, the third plated through hole extending through a third conductive layer and the first and second conductive layers and electrically connected to the third conductive layer and electrically is isolated from the first and second conductive layers.

It should be understood that the above is a brief description of various aspects of various embodiments. It is therefore also to be understood that the scope of the invention should be determined by the claims as they were issued, and not by whether a given item includes any or all of such features or advantages, or any or all of here noted problems.

In addition, there are other advantages and varying novel features and aspects of alternative embodiments. The above and other features and advantages will be more apparent from the following detailed description, which proceeds with reference to the accompanying figures.

BRIEF DESCRIPTION OF THE DRAWINGS

Several embodiments incorporating the preferred embodiments and the best mode of the present invention are set forth in the following description and the accompanying drawings, in which:

1 FIG. 3 is a front perspective view of a power distribution unit of an exemplary embodiment; FIG.

2 Figure 5 is an illustration of a group of outputs and associated printed circuit boards in accordance with an exemplary embodiment;

3 FIG. 4 is an illustration of an output receptacle of an exemplary embodiment; FIG.

4 FIG. 5 is an illustration of a printed circuit board that powers outputs of different inputs in accordance with an exemplary embodiment; FIG.

5 FIG. 5 is an illustration of a printed circuit board that powers outputs from different inputs in accordance with another exemplary embodiment; FIG.

6 Figure 3 is a perspective view of a partial cross-sectional illustration of a printed circuit board that provides outputs from different inputs in accordance with an exemplary embodiment;

7 Figure 11 illustrates a conductive material of a conductive layer of a printed circuit board that supplies outputs from one of a plurality of power inputs in accordance with an exemplary embodiment;

8th illustrates a conductive material of another conductive layer of a printed circuit board that supplies outputs from one of a plurality of power inputs in accordance with an exemplary embodiment;

9 Figure 12 illustrates a conductive material of yet another conductive layer of a printed circuit board that supplies outputs from one of a plurality of power inputs in accordance with an exemplary embodiment;

10 Fig. 3 is an illustration of a group of outputs and a printed circuit board associated therewith that provides outputs from different inputs in accordance with another exemplary embodiment; and

11 FIG. 5 is a flow chart illustrating a method for supplying power from multiple inputs to adjacent outputs in a PDU.

DETAILED DESCRIPTION

Embodiments of multi-phase power distribution, power monitoring and power management devices, systems and methods or multiple input power distribution, power monitoring and power management devices, systems and methods are described herein. Embodiments of such devices and systems include a Power Distribution Unit (PDU) with side-by-side outlets powered by power from different power inputs through a power distribution board. The present disclosure recognizes that properly balancing loads in different phases of a multi-phase PDU is an important task, which is complicated by the fact that different phases of current are traditionally supplied to different groupings of outputs. Such different sets of sockets are generally along the length of a PDU housing, and as a result, when adjacent components mounted in a device rack must be plugged into different phases, their respective power cables must be routed in non-ideal directions become. Furthermore, in some cases, cable routing becomes a challenge due to excessively long cable lengths and the need to route cables to different outlet groups. The present disclosure provides groupings of sockets in which adjacent sockets are connected to different phases of current. Traditionally, to power adjacent power outlets with power from different phases, separate physical wires or conductors would need to be connected to the side-by-side power outlets. In cases where there are a relatively large number of sockets, such an arrangement would require dozens of connection points, each of which would have to be manually connected during assembly. This would require a very labor intensive process to assemble the device, which would entail a corresponding increase in the likelihood of manufacturing errors, such as missed or incorrect connections, shorted connections, and / or resistive connections, resulting in increased power consumption and increased power consumption reduced reliability, not to mention the extra cost associated with such a configuration.

Embodiments of the present disclosure supply power to outlets through a power distribution board connected to each power input phase. The circuit board allows the provision of a connection of different current input phases with adjacent sockets. The printed circuit board has a number of layers of conductive material, with different layers connected to different inputs or phases and to the mains power connector of different sockets. Such a printed circuit board provides a PDU that is considerably simpler to manufacture and considerably more reliable than individual wired connections to any outlet from different power inputs or phases.

With reference to 1 becomes an exemplary power distribution unit (PDU) 100 described. The PDU 100 has a housing 105 configured to be mounted vertically in an electronic equipment rack. As will be appreciated, such a vertically mountable PDU 100 mounted in a device rack at a rear portion of the device rack so that it does not consume any vertical space in the device rack ("zero U" (0 height units)) that would otherwise be used for the computing equipment. The arrangement of the PCU 100 On the back of the device rack, power cables or connection cables that extend from the back of the computer equipment or devices can be easily inserted into the PDU 100 can be inserted. Although a vertically mountable PDU 100 in 1 As illustrated, the concepts and features described herein may also be incorporated into other power distribution devices having other form factors, such as horizontally mountable power distribution units, and power distribution devices for use in other applications. Accordingly, the particular devices and applications discussed herein are for illustrative purposes only.

A power input 110 penetrates the PDU housing 105 and may receive a current input from multiple power phases, such as a three-phase power input. In other embodiments, power distribution units may have separate power inputs, each receiving power from another power source or current phase. The PDU 100 In this embodiment, there are three groups or banks of sockets 115 . 120 . 125 on. Each group of sockets 115 . 120 . 125 has a number of individual sockets, such as the sockets 115-a . 115-b and 115-c the socket group 115 , the sockets 120-a . 120-b and 120-c the socket group 120 and the sockets 125-a . 125-b and 125-c the socket group 125 , Single sockets 115-a . 115-b and 115-c are adjacent to each other and, in this embodiment, have a different phase of the three-phase current from the current input 110 connected. Similarly, the sockets are 120-a . 120-b . 120-c and 125-a . 125-b . 125-c adjacent to each other and each having a different phase of the three-phase current from the current input 110 connected. As a result, adjacent sockets are within a group of sockets 115 . 120 . 125 connected to different phases of the input current, thereby providing the ability that components within a device rack, which are directly above or below each other, can be plugged into sockets, which have different phases of current, without the power cable or connecting cable for the Device must be guided to various groups or banks of sockets. Such a configuration provides a more convenient load balancing in a three phase system. In addition, cable routing is simplified by providing different current inputs or phases within each socket group along the length of a PDU.

The PDU 100 This embodiment also has a display 130 which may provide an optical indication of information relating to the current passing through each of the phases or current inputs to the PDU 100 is supplied. The ad 130 is preferably a digital display and may be numeric, alphabetic, pictorial, just to name a few, or, without limitation, may be a combination of the foregoing. In the embodiment of 1 indicates the ad 130 three separate displays, one for each input power phase, providing a real-time optical indication of the current for each phase, which can help in balancing the loads in each of the input power phases. In some embodiments, each power phase is provided as a separate power leg having an associated circuit protection device, such as a circuit breaker or fuse. The display may also aid in determining the current level for each current phase or branch for a maximum current level at which the particular circuit or circuit or branch may be operated without blowing a fuse or tripping a circuit breaker becomes. The ad 130 may also display other power related information, such as, for example, the voltage in respective phases, the apparent power (measured in volt-ampere) supplied to each phase or each branch, active or real, the power (measured in watts), which is supplied to each phase or branch, and / or a power factor associated with each phase or branch. The ad 130 For example, it may include one or more seven-segment LED displays, one or more LCD displays, or one or more touch-screen displays that provide such power related information regarding each phase, each branch, and / or each power input , Such an ad 130 but is not a necessity, and therefore it is absent in various embodiments.

The PDU 100 may be usable in a computer network and may be over the computer network with a communication module 135 communicate. The communication module 135 In various embodiments, it communicates with a network power manager that may be located in a workstation or in another remote device that is used in managing a data center or in another enterprise management system. The communication module 135 may have a Network Interface Card (NIC), which has application firmware and hardware and which serves as an interface to the PDU 100 to network with the computer network. The communication module 135 may also be connected to one or more environmental sensors and / or one or more other PDUs. Similar to the ad 130 The communication module is not necessary and is not available in various embodiments.

The PDU 100 can sockets 115 . 120 . 125 which are switchable to control the application of current from the input current to a corresponding current output. The PDU 100 may also provide a current or power state measurement and / or a load measurement with respect to the corresponding sockets. In some embodiments, load measurement information for the various inputs and / or outlets over a network communication module 135 , as described above, reports.

Now, reference is made 2 taken in a group of sockets 200 is illustrated. The group of sockets 200 In this embodiment, it is arranged in a modular fashion and may be referred to as a smart power module. In the embodiment of 2 For example, various circuits associated with the sockets are contained on a number of interconnected printed circuit boards. In this embodiment, power is supplied from the power inputs to the sockets 115-a . 115-b . 115-c through a lower printed circuit board 205 fed. The first (lower) circuit board 205 is constructed so that they are adjacent sockets 115-a . 115-b and 115-c supplied with power from different power inputs or power phases. The structure of the lower circuit board 205 will be described in more detail below. A second (middle) circuit board 210 and a third (upper) circuit board 215 are with the lower circuit board 205 connected. In this embodiment, the upper circuit board 215 a variety of power control relays 220 which work to apply power to an associated output 115-a . 115-b . 115-c to control. In the embodiment of 2 has the middle circuit board 210 Current measurement components that provide current or power related information with each current output 115-a . 115-b . 115-c are associated, measure and report, and the current transformers 225 for each output in this embodiment. The electrical connections of each of the printed circuit boards may be designed so that the printed circuit boards can be assembled with associated inputs / sockets and terminals that are aligned to provide an efficient modular assembly of socket modules that incorporate some or all of the features have been described herein by the addition of one or more associated printed circuit board (s).

In various embodiments, the middle and upper circuit boards 210 . 215 not be present, depending on the particular application of the PDU. In other embodiments, one or more of the middle and upper circuit boards may be used 210 . 215 which depends on the particular application of the PDU. In other embodiments, various different components of a receptacle module may be used 200 be assembled on the separate circuit boards, which are then assembled into a socket module. In such a way, component or component boards may be assembled to have features that are ordered by a particular customer or user of a PDU in which the socket module will be used. In addition, a user or customer may desire that some, but not all, of the sockets in a PDU have one or more functions, such as switching and power reporting, and thus, different socket modules or sub-groups of sockets in a socket module with the additional ones Component boards are assembled to provide such capability. Such a configuration provides flexible and efficient manufacturing options while maintaining high reliability.

In one embodiment, the socket module 200 eight sockets 300 each of which is of the IEC C13 type, as shown in FIG 3 is illustrated. In this embodiment, each outlet is 300 an "off-hook" or "snap-in" type socket that is a power connector 315 , a neutral connection part 305 and a ground connection part 310 having. The sockets 300 be with the outlet connectors 305 . 310 . 315 , which have corresponding openings in the lower circuit board 205 be connected, built into the module housing or assembled therein. As a result, the module can 200 be assembled in a relatively efficient and reliable manner. It will be understood that this embodiment and other embodiments described herein as having IEC-C13 type sockets are merely examples, and that any of various other types of sockets may alternatively be used. For example, the "sockets" may be other NEMA types (eg, NEMA 5-15R, NEMA 6-20R, NEMA 6-30R, or NEMA 6-50R), or they may each be of different IEC types (e.g. B. IEC C19). It will also be clear that not all "sockets" in a special socket module 200 or in other socket modules must be identical. It will also be understood that the "sockets" are not limited to three-pin sockets and that alternatively one or more of the "sockets" for two or more than three pins may be configured in the mating connector. It will also be understood that the "sockets" are not limited to having receiving or inwardly pointing pin receptacles. Furthermore, it will be clear that, although the socket module 200 the present embodiment includes eight sockets, this is only a single example and that a socket module may have a different number of sockets.

The lower circuit board 205 as mentioned above supplies power to each of the power outlets, such as the outlets 300 , Now, reference is made 4 taken in a lower circuit board 400 will be described in more detail in accordance with an embodiment. In this embodiment, the plate 400 Current inputs for each current phase in a three-phase current input, wherein the three phases are referred to as phase X, phase Y and phase Z. A first entrance 402 is connectable to the phase X input, a second input 405 is connectable to the phase Y input and a third input 410 is connectable to the phase Z input. A fourth entrance 415 is connectable to a neutral conductor. The circuit board 400 also has entrances 420 on, which are connectable to a ground connection. The circuit board 400 has a number of sets of connection elements 425 . 430 . 435 which are spaced and sized to fit the connecting parts 305 . 310 and 315 a power outlet 300 be able to record. For example, the connection element set points 425 a network connection 425-a which is arranged to the power connector 315 the socket 300 take a neutral connection 425-b which is arranged to the neutral terminal part 305 the socket 300 and a ground terminal 425-c on, which is arranged around the Erdanschlussteil 310 the socket 300 take. In this embodiment, each power connection element 425-a . 430-a and 435-a connected to another phase of the power input, wherein the power connection element 425-a connected to a phase X, the connecting element 430-a is connected to a phase Y and the connecting element 435-a is connected to a phase Z. As a result, adjacent power outputs are connected to a different power input. By using a printed circuit board 400 In order to achieve such connections, the manufacturing complexity of providing such a PDU is significantly reduced as compared to a PDU in which individual wires would have to be connected to each adjacent power output.

The use of a printed circuit board 400 Also provides improved reliability than individual wire connections due to more reliable connections between the socket 300 and the printed circuit board 400 , As will be appreciated, if connections between power supplying components are improperly connected, such as through loose discrete wire connectors and / or improper crimping of wires to these connectors, the connection may and will have additional resistance referred to as an ohmic connection. Ohmic connections can provide significant reliability and security problems due to the heating of such connections and a significantly higher probability of failure due to heating. The use of a printed circuit board 400 As has been described, the probability of such problematic connections is considerably reduced.

As has been described, the plate has 400 Connections or connections for nine sockets 300 on. In this way, three sockets are connected to each phase in an alternating manner, namely a first socket is connected to the phase X, a second socket is connected to the Y phase, a third socket is connected to the Z phase and so on to the ninth outlet. In other embodiments, other numbers of outputs may be present, such as the printed circuit board 500 as they are in 5 is illustrated. Such a printed circuit board 500 contains similar connections or connections as the printed circuit board 400 and just has a reduced number of outputs.

In some embodiments, each power input phase has an associated circuit protection device, such as a circuit breaker or fuse. In some embodiments, all outlets and circuit protection devices associated with a particular power phase are color coded on the housing of the PDU. As a result, all the sockets and circuit protectors associated with phase X may have a first color, all sockets and circuit protectors associated with phase Y may have a second color and may have all the sockets and circuit protection devices associated with phase Z. have a third color. In such a way, a particular socket and / or circuit protection device can be easily identified with the corresponding current phase. Similarly, in embodiments having a display, the display may have corresponding color coding to identify the particular stream phase for which power related information is displayed. In other embodiments, other numbers of phases or current inputs may be supplied to the PDU, involving corresponding changes in the printed circuit boards and / or color coding, which will be readily apparent to one skilled in the art.

Now, reference is made 6 taken in a representation of a circuit board 600 an embodiment is discussed. The circuit board 600 (not to scale) is partially illustrated in cross section and illustrates the number of layers in the printed circuit board 600 available. Such a structure may be, for example, in the printed circuit boards 205 . 400 and 500 used become. The printed circuit board 600 is made of a number of alternating layers of conductors and insulators. The circuit board 600 is fabricated to have a number of overlapping conductive and insulating layers, the different conductive layers being disposed in facing relation to others of the conductive layers, and thereby a printed circuit board 600 which has a compact sandwich-type configuration with alternating conductive and insulating layers. A top layer 605 In this embodiment, both a conductive and an insulating material, which provides circuit connections and electrical insulation, and a protective cover for the printed circuit board 600 on. A first insulating layer 610 is located below the topmost layer 605 and sees electrical insulation between the uppermost layer and the first inner conductive layer 615 in front. The first inner conductive layer 615 In this embodiment, there are three electrically insulated conductive sections, one of which is connected to the phase input corresponding to phase X, and the other two are earth terminals. A second insulating layer 620 is below the first conductive layer 615 arranged and provides an electrical insulation between the first conductive layer and the second conductive layer 625 ready. The second inner conductive layer 625 In this embodiment, there are three electrically insulated conductive sections, one connected to the phase input corresponding to phase Y and the other two ground connections. A third insulating layer 630 is located below the second conductive layer 625 and sees an electrical insulation between the second conductive layer 625 and the third conductive layer 635 in front. The third inner conductive layer 635 In this embodiment, there are three electrically isolated conductive sections, one connected to the phase input corresponding to phase Z and the other two ground connections. A fourth insulating layer 640 is located below the third conductive layer 635 and sees electrical insulation between the third conductive layer 635 and the fourth conductive layer 645 in front. The fourth inner conductive layer 645 is connected to the neutral input in this embodiment. A fifth insulating layer 650 is located below the fourth conductive layer 645 and sees an electrical insulation between the fourth conductive layer 645 and a lower layer 655 in front. The lower layer 655 In this embodiment, both a conductive and an insulating material, which provides circuit connections and an electrical insulation, and a protective cover for the printed circuit board 600 on. The printed circuit board 600 also has a variety of conductive coated through holes leading to a mains connection 425-a which is arranged to the power connector 315 the socket 300 a neutral connection 425-b which is arranged to the neutral terminal part 305 the socket 300 and a ground terminal 425-c fits, which is arranged around the earth connection part 310 the socket 300 take. As will be readily apparent, the circuit board 600 conductive coated through holes that match other sockets.

The conductive layers 605 . 615 . 625 . 635 . 645 and 655 have voids in the conductive material, such as copper, around the through-holes that are not to be electrically connected to the particular conductive layer. 7 to 9 illustrate different conductive layers 615 ( 7 ) 625 ( 8th ) and 635 ( 9 ). If you have the conductive layer 615 from 7 As an example, the conductive layer of this embodiment has a copper conductor characterized by the bright areas and voids in the conductor material passing through the dark areas of 7 Marked are. The cavities are placed so that the conductive layer 615 does not come into contact with the plated through holes corresponding to the outputs that are not to be connected to the particular phase input of the conductive layer. As a result, in the example of 7 the conductive material at the entrance 410 for the multiphase phase Z input and at the mains connection 425-a of the exit 425 available. The layer 615 has cavities each around the power connections 430-a and 435-a the outputs 430 and 435 on. In this way, the conductive coated through hole that connects to the power connector 425-a is electrically connected to the phase Z input 410 connected while the network connections 430-a and 435-a the outputs 430 and 435 electrically from the phase Z input 410 are isolated. The conductive layer 615 has a mesh side and a ground side that are electrically isolated. The earth side of the layer 615 has a conductive material present at the ground terminals for each of the outputs, and has cavities associated with the through holes corresponding to the neutral terminals of each output. 8th illustrates the conductive layer 625 and the connections to the phase Y input in a similar manner. 9 illustrates the conductive layer 635 and connections to the Phase X input in a similar manner.

Although the embodiments of 4 to 9 illustrate multiple current phase connections in a "star" -type configuration, in which outputs between one For example, similar designs may be used to provide outputs that are connected to multiple power phases in a "triangle" type configuration. In such embodiments, the conductive layers for different current phase inputs are simply extended to overlap with both of the non-earth current inputs of a corresponding current output. The conductive layers corresponding to the different current phases are provided with corresponding electrical insulation (such as through the cavities described above) and connections to conductive coated through holes for the power output connections. As a result, the conductive plated through holes for a given current output can be selectively connected to the two appropriate input current phases to provide a current output that is connected from phase to phase and not from phase to neutral.

Accordingly, there is described printed circuit boards that can be used to provide power to adjacent power outputs from different power inputs without the need for complex wiring harnesses and a large number of individual wire connections. Sockets, such as the socket 300 from 3 , may include terminations that are inserted into corresponding through-holes in the exemplary printed circuit boards and electrically connected to the appropriate electrical connections. Of course, the concepts of the printed circuit boards described herein can also be applied to printed circuit boards that also have other components. 10 illustrates an example of a printed circuit board 966 including the plurality of conductive layers as described above around adjacent sockets 950 to supply power from different power inputs. In this embodiment, the mains power is connected to the sockets 950 through a network connection 954 delivered by a relay 958 and an associated current transformer 962 is directed. The relays 958 and current transformers 962 are connected to control and monitoring circuits as described above. In this embodiment, the printed circuit board is 966 at an angle of 90 degrees relative to the level of the sockets 950 appropriate. In this way, the extra surface area of the circuit board 966 needed is provided in a plane that is generally perpendicular to the plane of the sockets 950 runs and is not in a parallel plane, as in the embodiment of 2 is illustrated. By configuring the circuit board 966 perpendicular to the plane of the sockets 950 For example, this additional surface area can be easily accommodated by making the PDU housing slightly deeper, with the width of the housing being substantially the same as that of the embodiment of FIG 1 remains. The use of a single printed circuit board 966 allows reduced manufacturing costs and provides manufacturing efficiencies due to reduced assembly steps compared to embodiments with more than one printed circuit board.

As noted in several of the embodiments described above, power from multiple inputs may be distributed through a printed circuit board fabricated with interlaced or overlapping conductive and insulating layers in a sandwiched relationship to form the printed circuit board having characteristics discussed in the above embodiments. Now, reference is made 11 In the drawing, a flowchart illustration of an example method is shown 1100 for providing power to adjacent power outputs of different power inputs in a power distribution unit that can use such a sandwiched printed circuit board. In this embodiment, as in the block 1105 noted, a first conductive layer of a printed circuit board is connected to a first power input. In the block 1110 For example, a second conductive layer of the printed circuit board is connected to a second power input. The second conductive layer, in various embodiments, is located at least partially above the first conductive layer in an opposed relationship thereto and is electrically isolated from the first conductive layer. An AC outlet of a first outlet is connected to the first conductive layer according to block 1115 connected. An AC outlet of a second outlet located adjacent to the first outlet is connected to the second conductive layer, as in block 1120 is noted. A third conductive layer of the printed circuit board is connected to a third power input at block 1125 connected. In a similar manner as above, the third conductive layer is at least partially above the first and second conductive layers and is electrically isolated from the first and second conductive layers. At the block 1130 For example, a mains power connector of a third outlet located adjacent to one of the first and second outlets is connected to the third conductive layer. In accordance with some embodiments, connecting the power outlet of the first outlet to the first conductive layer includes electrically connecting a first conductive plated through-hole to the power outlet of the first power outlet, the first conductive-coated via extending through the first and second conductive layers the first conductive layer is connected and is electrically isolated from the second conductive layer. Similarly, connecting a power outlet of the second and third outlets to the second and third conductive layers may each comprise connecting second and third conductive plated through-holes to the power outlet of the second and third outlets. The second and third conductive coated through-holes extend through each of the conductive layers and are each electrically connected to the second and third conductive layers. Each conductive coated through-hole is electrically isolated from the other conductive layers, in a manner similar to that described above. Of course, it will be readily recognized that the steps of the procedure 1100 are merely exemplary in nature and that various variations in the order of steps, additional branches, or fewer steps may be present in various embodiments. For example, if power from dual power inputs is to be connected to alternate side-by-side AC outlets in a PDU, then the sandwiched printed circuit board may have conductive layers for each of the dual power inputs, with power supplies from adjacent power outlets be connected to the appropriate conductive layers.

• • effiziente Herstellung und Montage bzw. Zusammenbauen von Stromverteilungseinheiten, die Gruppen von linear angeordneten Steckdosen mit nebeneinander liegenden Stromausgängen aufweisen, die mit unterschiedlichen Stromquellen verbunden sind;
• • kostengünstigere PDUs, die die oben beschriebenen Merkmale aufweisen, durch eine Reduzierung von Materialien, die für die Herstellung und das Zusammenbauen solcher PDUs benötigt werden;
• • kostengünstigere PDUs, die die oben beschriebenen Merkmale aufweisen, durch eine Reduzierung von Zusammenbauschritten, die für das Zusammenbauen solcher PDUs benötigt werden;
• • PDUs mit einer höheren Zuverlässigkeit infolge einer reduzierten Wahrscheinlichkeit von Herstellungsfehlern und/oder ohmschen Verbindungen zwischen nebeneinander liegenden Steckdosen, die unterschiedliche Stromquelleneingänge haben;
• • effizienter Belastungsausgleich zwischen Phasen von Mehrphasen-PDUs;
• • bei PDUs mit zwei Eingängen können Geräte mit internen redundanten Stromversorgungen, die eine Verbindung mit redundanten Stromquellen benötigen, mit nebeneinander liegenden Steckdosen in einer PDU verbunden werden, wodurch die Kabelführung vereinfacht wird;
• • PDUs mit mehreren Gruppen von Steckdosen mit Optionen für das Verbinden bzw. Anschließen von nebeneinander liegenden Komponenten bzw. Bauteilen in einem Geräte-Rack mit nebeneinander liegenden Ausgängen der PDU und nicht mit Steckdosen in unterschiedlichen Steckdosengruppen, wodurch die Kabelführung vereinfacht wird; und
• • PDUs, die eines oder mehrere der oben angeführten Merkmale in einem kompakten Formfaktor haben, der null Einheiten an Geräte-Rack-Raum verbraucht.

As can be readily appreciated from the embodiments described above, the present disclosure provides for efficient and reliable output of power from multiple power inputs to adjacent power outputs. As a result, it can be seen that the above and other embodiments or aspects thereof may variously provide one or more of the following solutions, advantages, or benefits:

• • efficient manufacture and assembly of power distribution units comprising groups of linearly arranged power outlets with adjacent power outlets connected to different power sources;
• • lower cost PDUs having the features described above by reducing materials needed to manufacture and assemble such PDUs;
• • lower cost PDUs having the features described above by reducing assembly steps needed to assemble such PDUs;
• PDUs with higher reliability due to a reduced likelihood of manufacturing errors and / or ohmic connections between adjacent sockets having different power source inputs;
• • efficient load balancing between phases of multiphase PDUs;
• • For PDUs with two inputs, devices with internal redundant power supplies that require connection to redundant power sources can be connected to adjacent sockets in a PDU, simplifying cable management;
• PDUs with multiple groups of sockets with options for connecting or connecting adjacent components in a device rack with PDU side-by-side outlets, rather than outlets in different outlets groups, simplifying cable management; and
• • PDUs that have one or more of the above features in a compact form factor that consumes zero units of device rack space.

The foregoing disclosure of the disclosure is provided to enable one skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Throughout the disclosure, the term "example" or "exemplary" indicates an example or a case and does not imply or require any preference for the example given. As a result, the disclosure is not intended to be limited to the examples and designs described herein, but is to be accorded the broadest scope consistent with the principles and novel features disclosed herein.

Claims (21)

A power distribution apparatus comprising: a power distribution unit housing; a power input disposed at least partially within the housing and having at least a first input terminal electrically connectable to a first power source and a second input terminal electrically connectable to a second power source; a plurality of power outlets at least partially disposed within the housing and having at least a first power output and a second power output located adjacent to the first power output; a printed circuit board disposed in the housing and having (i) a first conductive layer electrically connected to the first input terminal and the first current output, and (ii) a second conductive layer at least partially over the first conductive one Layer and in an opposing relationship thereto, is electrically isolated from the first conductive layer, is electrically connected to the second input terminal and is electrically connected to the second current output, wherein the first and second current outputs are thereby connected to different current inputs. The device of claim 1, wherein the printed circuit board further comprises a first conductive coated through-bore extending through the first and second conductive layers, electrically connected to the first conductive layer, electrically isolated from the second conductive layer, and electrically connected to the first conductive layer first current output is connected. The device of claim 2, wherein the printed circuit board further comprises a second conductive plated through bore extending through the first and second conductive layers, electrically connected to the second conductive layer, electrically insulated from the first conductive layer, and electrically connected to the first conductive layer second current output is connected. The apparatus of claim 1, wherein the power input further comprises a third power input terminal electrically connectable to a third power source. wherein the plurality of power outputs further comprises a third power output located adjacent to the second power output, and the printed circuit board further comprising a third conductive layer at least partially over the first and second conductive layers, electrically isolated from the first and second conductive layers, electrically connected to the third input terminal, and electrically connected to the third current output is connected, wherein the first, second and third current outputs are thereby connected to different power inputs. The device of claim 4, wherein the printed circuit board further comprises: a first conductive coated through-bore extending through the first, second and third conductive layers, electrically connected to the first conductive layer, electrically isolated from the second and third conductive layers, and electrically connected to the first current output; a second conductive coated through-bore extending through the first, second and third conductive layers, electrically connected to the second conductive layer, electrically isolated from the first and third conductive layers, and electrically connected to the second current output; a third conductive coated through-bore extending through the first, second and third conductive layers, electrically connected to the third conductive layer, electrically isolated from the first and second conductive layers, and electrically connected to the third current output. The apparatus of claim 1, wherein the plurality of power outputs comprise at least first and second groups of linearly-arranged power outputs, wherein adjacent power outputs in each of the groups are connected to different power inputs. The device of claim 1, further comprising: a plurality of power control relays disposed in the housing, each of the plurality of power control relays being connected in independent current controlling communication between the power input and one of the power outputs. The device of claim 1, further comprising: a power related information reporting system disposed in the housing in communication with one or more of the power input and the power outputs, and communicating the power related information with a separate communication Communication network is located, which is located far from the power distribution device. The apparatus of claim 1, wherein the power input comprises a first power input connected to a first power source and a second power input connected to a second power source. The apparatus of claim 1, wherein the power input has a three-phase power input, and wherein the first and second power sources correspond to different phases of the three-phase power input. A circuit board device for providing power to adjacent power outlets from different power inputs, comprising: a first conductive layer having a first input port configured to be connected to a first power input and a first output port configured therefor to be connected to a first current output; and a second conductive layer at least partially above the first conductive layer and electrically isolated from the first conductive layer and having a second input terminal configured to be connected to a second current input and a second output terminal configured to be connected to a second current output. The device of claim 11, further comprising a first conductive coated through-bore extending through the first and second conductive layers, electrically connected to the first conductive layer, and electrically isolated from the second conductive layer. The device of claim 12, further comprising a second conductive plated through bore extending through the first and second conductive layers, electrically connected to the second conductive layer, and electrically isolated from the first conductive layer. The device of claim 12, wherein a first insulating layer is overlapped with the first and second conductive layers, and wherein the first conductive layer, the first insulating layer and the second conductive layer are in a sandwiched configuration. The device of claim 11, further comprising a third conductive layer at least partially overlying the first and second conductive layers, electrically isolated from the first and second conductive layers, a third input terminal configured therewith having a third current input and having a third output terminal configured to be connected to a third current output. The apparatus of claim 15, wherein the printed circuit board further comprises: a first conductive coated through-bore extending through the first, second and third conductive layers, electrically connected to the first conductive layer, electrically isolated from the second and third conductive layers, and electrically connected to the first current output terminal; a second conductive coated through-bore extending through the first, second and third conductive layers, electrically connected to the second conductive layer, electrically isolated from the first and third conductive layers, and electrically connected to the second current output terminal; a third conductive coated through-bore extending through the first, second and third conductive layers, electrically connected to the third conductive layer, electrically isolated from the first and second conductive layers, and electrically connected to the third current output terminal. A method of supplying power to adjacent power outputs of different power inputs in a power distribution unit, comprising the steps of: Bonding a first conductive layer of a printed circuit board to a first power input; Bonding a second conductive layer of the printed circuit board to a second power input, the second conductive layer being at least partially over the first conductive layer and being electrically isolated from the first conductive layer; Connecting a mains current terminal of a first current output to the first conductive layer; and Connecting a mains current terminal of a second current output, which is adjacent to the first current output, with the second conductive layer. The method of claim 17, further comprising the steps of: Bonding a third conductive layer of the printed circuit board to a third power input, the third conductive layer being at least partially over the first and second conductive layers and being electrically isolated from the first and second conductive layers; and Connecting a mains current terminal of a third current output adjacent one of the first and second current outputs to the third conductive layer. The method of claim 18, wherein connecting a power outlet of the first power outlet to the first conductive layer includes connecting a first conductive plated through-hole to the power outlet of the first power outlet, the first conductive-coated through-hole extending through the first and second conductive layers is connected to the first conductive layer and is electrically isolated from the second conductive layer. The method of claim 19, wherein connecting a power supply terminal of the second power output to the second conductive layer includes connecting a second plated through hole to the power outlet of the second power outlet, the second plated through hole extending through the first and second conductive layers is connected to the second conductive layer and is electrically isolated from the first conductive layer. The method of claim 19, further comprising connecting a third plated through hole to the power outlet of a third power outlet, the third plated through hole extending through a third conductive layer and the first and second conductive layers electrically connected to the third conductive layer is connected and is electrically isolated from the first and second conductive layers.

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