DE102016109111B8 - System und Verfahren für einen MEMS-Wandler - Google Patents

System und Verfahren für einen MEMS-Wandler Download PDF

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Publication number
DE102016109111B8
DE102016109111B8 DE102016109111.1A DE102016109111A DE102016109111B8 DE 102016109111 B8 DE102016109111 B8 DE 102016109111B8 DE 102016109111 A DE102016109111 A DE 102016109111A DE 102016109111 B8 DE102016109111 B8 DE 102016109111B8
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DE
Germany
Prior art keywords
mems transducer
mems
transducer
Prior art date
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Application number
DE102016109111.1A
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English (en)
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DE102016109111A1 (de
DE102016109111B4 (de
Inventor
Stefan Barzen
Alfons Dehe
Wolfgang Klein
Martin Wurzer
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Infineon Technologies AG
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Infineon Technologies AG
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Publication of DE102016109111B4 publication Critical patent/DE102016109111B4/de
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B81B3/007—For controlling stiffness, e.g. ribs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • B81B3/0021—Transducers for transforming electrical into mechanical energy or vice versa
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • B81B3/0027—Structures for transforming mechanical energy, e.g. potential energy of a spring into translation, sound into translation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00182—Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00642—Manufacture or treatment of devices or systems in or on a substrate for improving the physical properties of a device
    • B81C1/0065—Mechanical properties
    • B81C1/00658—Treatments for improving the stiffness of a vibrating element
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0221—Variable capacitors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0307—Anchors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0315—Cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0353—Holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/04—Electrodes
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/08—Mouthpieces; Microphones; Attachments therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
DE102016109111.1A 2015-05-20 2016-05-18 System und Verfahren für einen MEMS-Wandler Active DE102016109111B8 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/717,556 US9540226B2 (en) 2015-05-20 2015-05-20 System and method for a MEMS transducer
US14/717,556 2015-05-20

Publications (3)

Publication Number Publication Date
DE102016109111A1 DE102016109111A1 (de) 2017-11-23
DE102016109111B4 DE102016109111B4 (de) 2023-03-23
DE102016109111B8 true DE102016109111B8 (de) 2023-06-01

Family

ID=57325112

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102016109111.1A Active DE102016109111B8 (de) 2015-05-20 2016-05-18 System und Verfahren für einen MEMS-Wandler

Country Status (4)

Country Link
US (1) US9540226B2 (de)
KR (2) KR20160137399A (de)
CN (1) CN106170119B (de)
DE (1) DE102016109111B8 (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9843862B2 (en) * 2015-08-05 2017-12-12 Infineon Technologies Ag System and method for a pumping speaker
US10065852B2 (en) * 2016-09-26 2018-09-04 Taiwan Semiconductor Manufacturing Company Ltd. MEMS device and manufacturing method thereof
GB2557367A (en) * 2016-11-29 2018-06-20 Cirrus Logic Int Semiconductor Ltd Mems device
DE102016125082B3 (de) * 2016-12-21 2018-05-09 Infineon Technologies Ag Halbleitervorrichtung, mikrofon und verfahren zum herstellen einer halbleitervorrichtung
GB2567251B (en) * 2017-10-05 2021-10-27 Cirrus Logic Int Semiconductor Ltd MEMS devices and processes
US11206493B2 (en) * 2018-03-30 2021-12-21 Taiwan Semiconductor Manufacturing Co., Ltd. Sensor device and manufacturing method thereof
JP7410935B2 (ja) 2018-05-24 2024-01-10 ザ リサーチ ファウンデーション フォー ザ ステイト ユニバーシティー オブ ニューヨーク 容量性センサ
CN109218870B (zh) * 2018-08-06 2020-05-12 歌尔股份有限公司 一种麦克风
WO2020133334A1 (zh) * 2018-12-29 2020-07-02 共达电声股份有限公司 Mems声音传感器、mems麦克风及电子设备
DE102019205735B3 (de) * 2019-04-18 2020-08-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mikromechanischer Schallwandler
EP3766589A1 (de) * 2019-07-15 2021-01-20 Infineon Technologies AG Mems-schallwandlerelement
US11470426B2 (en) * 2019-08-09 2022-10-11 Infineon Technologies Ag MEMS devices
CN110545511B (zh) * 2019-08-16 2021-05-07 瑞声声学科技(深圳)有限公司 压电式mems麦克风
US10981780B2 (en) 2019-08-19 2021-04-20 Infineon Technologies Ag Membrane support for dual backplate transducers
US10993043B2 (en) * 2019-09-09 2021-04-27 Shin Sung C&T Co., Ltd. MEMS acoustic sensor
US11611835B2 (en) 2020-06-09 2023-03-21 Infineon Technologies Ag Combined corrugated piezoelectric microphone and corrugated piezoelectric vibration sensor
US11693021B2 (en) * 2020-06-09 2023-07-04 Infineon Technologies Ag Combined corrugated piezoelectric microphone and corrugated piezoelectric vibration sensor
US11691871B2 (en) 2021-06-18 2023-07-04 Infineon Technologies Ag Microelectromechanical system (MEMS) vibration sensor having a segmented backplate
US20230059140A1 (en) * 2021-08-20 2023-02-23 Aac Acoustic Technologies (Shenzhen) Co., Ltd. Microphone back panel and microphone
CN114650486B (zh) * 2022-03-28 2024-02-27 歌尔微电子股份有限公司 传感器及电子设备

Citations (6)

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JPS62213400A (ja) 1986-03-13 1987-09-19 Sony Corp コンデンサ形マイクロホン
US20090060230A1 (en) 2003-06-25 2009-03-05 Perlos Technology Oy Electromechanical transducer and a production method
WO2009130628A1 (en) 2008-04-23 2009-10-29 Nxp B.V. Capacitive pressure sensor
DE102014204712A1 (de) 2013-03-14 2014-09-18 Infineon Technologies Ag MEMS-Akustikwandler, MEMS-Mikrofon, MEMS-Mikrolautsprecher, Lautsprecher-Array und Verfahren zur Herstellung eines Akustikwandlers
DE102014217153A1 (de) 2014-08-28 2015-12-03 Robert Bosch Gmbh MEMS-Bauelement mit einer druckempfindlichen Membran
US20160037263A1 (en) 2014-08-04 2016-02-04 Knowles Electronics, Llc Electrostatic microphone with reduced acoustic noise

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DE102006055147B4 (de) * 2006-11-03 2011-01-27 Infineon Technologies Ag Schallwandlerstruktur und Verfahren zur Herstellung einer Schallwandlerstruktur
US8362853B2 (en) 2009-06-19 2013-01-29 Qualcomm Incorporated Tunable MEMS resonators
US20120027235A1 (en) 2010-07-27 2012-02-02 Chun-Kai Chan Mems capacitive microphone
US8237521B1 (en) 2010-12-09 2012-08-07 The United States Of America As Represented By The Secretary Of The Army Triaxial MEMS acceleration switch
US9148712B2 (en) * 2010-12-10 2015-09-29 Infineon Technologies Ag Micromechanical digital loudspeaker
WO2012122696A1 (en) * 2011-03-11 2012-09-20 Goertek Inc. Cmos compatible silicon differential condenser microphone and method for manufacturing the same
US8461655B2 (en) 2011-03-31 2013-06-11 Infineon Technologies Ag Micromechanical sound transducer having a membrane support with tapered surface
US8975107B2 (en) 2011-06-16 2015-03-10 Infineon Techologies Ag Method of manufacturing a semiconductor device comprising a membrane over a substrate by forming a plurality of features using local oxidation regions
US9148726B2 (en) * 2011-09-12 2015-09-29 Infineon Technologies Ag Micro electrical mechanical system with bending deflection of backplate structure
US9382109B2 (en) * 2011-11-14 2016-07-05 Epcos Ag MEMS microphone with reduced parasitic capacitance
WO2013097135A1 (en) * 2011-12-29 2013-07-04 Goertek Inc. A silicon based mems microphone, a system and a package with the same
US9078069B2 (en) 2012-01-11 2015-07-07 Invensense, Inc. MEMS microphone with springs and interior support
US8723277B2 (en) * 2012-02-29 2014-05-13 Infineon Technologies Ag Tunable MEMS device and method of making a tunable MEMS device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62213400A (ja) 1986-03-13 1987-09-19 Sony Corp コンデンサ形マイクロホン
US20090060230A1 (en) 2003-06-25 2009-03-05 Perlos Technology Oy Electromechanical transducer and a production method
WO2009130628A1 (en) 2008-04-23 2009-10-29 Nxp B.V. Capacitive pressure sensor
DE102014204712A1 (de) 2013-03-14 2014-09-18 Infineon Technologies Ag MEMS-Akustikwandler, MEMS-Mikrofon, MEMS-Mikrolautsprecher, Lautsprecher-Array und Verfahren zur Herstellung eines Akustikwandlers
US20160037263A1 (en) 2014-08-04 2016-02-04 Knowles Electronics, Llc Electrostatic microphone with reduced acoustic noise
DE102014217153A1 (de) 2014-08-28 2015-12-03 Robert Bosch Gmbh MEMS-Bauelement mit einer druckempfindlichen Membran

Also Published As

Publication number Publication date
DE102016109111A1 (de) 2017-11-23
CN106170119A (zh) 2016-11-30
CN106170119B (zh) 2019-11-01
DE102016109111B4 (de) 2023-03-23
KR102381099B1 (ko) 2022-03-31
US9540226B2 (en) 2017-01-10
KR20160137399A (ko) 2016-11-30
US20160340173A1 (en) 2016-11-24
KR20180036662A (ko) 2018-04-09

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