CN220454357U - Integrated heat pipe radiator - Google Patents

Integrated heat pipe radiator Download PDF

Info

Publication number
CN220454357U
CN220454357U CN202321850422.9U CN202321850422U CN220454357U CN 220454357 U CN220454357 U CN 220454357U CN 202321850422 U CN202321850422 U CN 202321850422U CN 220454357 U CN220454357 U CN 220454357U
Authority
CN
China
Prior art keywords
heat
heat pipe
plate
pipes
special
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202321850422.9U
Other languages
Chinese (zh)
Inventor
邓元
周华军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chuyue Huizhou Heat Transfer Technology Co ltd
Original Assignee
Chuyue Huizhou Heat Transfer Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chuyue Huizhou Heat Transfer Technology Co ltd filed Critical Chuyue Huizhou Heat Transfer Technology Co ltd
Priority to CN202321850422.9U priority Critical patent/CN220454357U/en
Application granted granted Critical
Publication of CN220454357U publication Critical patent/CN220454357U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The utility model discloses an integrated heat pipe radiator, which comprises a heat conduction bottom plate, wherein a plurality of heat pipe assemblies are connected to the heat conduction bottom plate in a heat conduction way, each heat pipe assembly comprises at least two heat pipes which are oppositely arranged, special-shaped fins for uniformly radiating are arranged on the heat pipes, the special-shaped fins are arranged on two sides of the heat pipes in an expanding way so as to form wide openings on two sides of the oppositely arranged heat pipes, the radiator also comprises a fan, and an air outlet of the fan is arranged on one side of the wide opening. The heat dissipation efficiency of the heat conduction bottom plate can be effectively improved by arranging the plurality of heat pipe assemblies on the heat conduction bottom plate and simultaneously matching with the special-shaped fins for heat dissipation; by arranging the fan at the wide opening of the special-shaped fin, the air speed can be increased when air flows through the heat pipe arranged oppositely after entering the wide opening, and the heat dissipation strength is further improved.

Description

Integrated heat pipe radiator
Technical Field
The utility model relates to the field of small heat radiators, in particular to a heat radiator integrated with a heat pipe.
Background
The radiator is a cooling device widely applied to a computing device processor, mainly absorbs heat of the processor through the heat conducting plate and radiates the heat through air or other mediums, at present, the structure of the heat conducting plate matched with the heat radiating fins is widely applied because of simple structure, but a mode of only using the heat radiating fins to be matched with air for passive heat radiation easily causes heat to be accumulated at the radiator, so that the heat radiating efficiency is gradually reduced, in order to solve the problem of heat accumulation, the heat pipe is added into the radiator, generally the heat pipe is connected with the heat conducting plate, and the end of the heat pipe far away from the heat conducting plate is provided with other heat radiation enhancing devices such as a fan, and the like.
Disclosure of Invention
In view of the above problems, an object of the present utility model is to provide an integrated heat pipe radiator, which can achieve better heat dissipation effect.
In order to achieve the above purpose, the utility model provides an integrated heat pipe radiator, which comprises a heat conducting bottom plate, wherein a plurality of heat pipe assemblies are connected to the heat conducting bottom plate in a heat conduction way, each heat pipe assembly comprises at least two heat pipes which are oppositely arranged, special-shaped fins for uniformly radiating are arranged on the heat pipes, and the special-shaped fins are arranged on two sides of the heat pipes in an expanding way so as to form wide openings on two sides of the heat pipes which are oppositely arranged.
Further, the radiator further comprises a fan, and an air outlet of the fan is positioned at one side of the wide opening.
Further, the side edge of the heat conduction bottom plate, which is far away from the wide opening, is provided with a metal plate for passive heat dissipation.
Further, a plurality of radiating fins for passive heat radiation are arranged on the metal plate.
Further, a heat conducting plate is vertically arranged on the metal plate, and a plurality of radiating fins for passive heat radiation are arranged on two sides of the heat conducting plate.
Further, the heat pipe is of a solid metal structure.
Further, the heat pipes are of hollow metal structures, a plurality of the heat pipes are connected in a conducting mode, and cooling liquid is arranged in the heat pipes.
Further, the end of the heat pipe assembly is provided with a noise reduction plate, and one surface of the noise reduction plate, which faces the heat pipe assembly, is provided with a plurality of noise elimination holes for absorbing noise.
The beneficial effects of the utility model are as follows:
1. the heat dissipation efficiency of the heat conduction bottom plate can be effectively improved by arranging the plurality of heat pipe assemblies on the heat conduction bottom plate and simultaneously matching with the special-shaped fins for heat dissipation;
2. by arranging the fan at the wide opening of the special-shaped fin, the air speed can be increased when the air flow flows through the heat pipe arranged oppositely after entering the wide opening, and the heat dissipation strength is further improved;
3. by arranging the noise reduction plate at the end part of the heat pipe assembly, the noise generated when the wind speed is increased can be effectively absorbed while the air flow direction is limited.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the principles of the utility model.
Fig. 1 is a side view of a heat sink in embodiment 1;
FIG. 2 is a top view of the heat sink of embodiment 1;
FIG. 3 is a top view of the heat sink in embodiment 2;
fig. 4 is a schematic structural view of the noise reduction plate in embodiment 1.
Reference numerals:
1. a thermally conductive base plate; 2. a heat pipe assembly; 3. a heat pipe; 4. a special-shaped fin; 5. opening; 6. a fan; 7. a metal plate; 8. a heat radiation fin; 9. a heat conductive plate; 10. a noise reduction plate; 11. and (5) a sound elimination hole.
Detailed Description
The utility model is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the substances, and not restrictive of the utility model. It should be further noted that, for convenience of description, only the portions related to the present utility model are shown in the drawings.
It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other. The utility model will be described in detail below with reference to the drawings in connection with embodiments.
Example 1
Referring to fig. 1, an integrated heat pipe 3 heatsink includes a thermally conductive base plate 1 for being disposed in close proximity to an element to be heat-dissipated, such as a processor of a computing device. In order to quickly dissipate heat of the heat-conducting bottom plate 1 after heat conduction, a plurality of heat pipe assemblies 2 are arranged on the heat-conducting bottom plate 1, each heat pipe assembly 2 comprises two heat pipes 3 which are oppositely arranged, in the embodiment, the heat pipes 3 are made of copper or aluminum materials, and the structure is solid or hollow. The heat pipe assembly 2 further comprises a special-shaped fin 4 arranged on each heat pipe 3, when the heat pipes 3 are solid, better support can be provided for the special-shaped fins 4, when the heat pipes 3 are hollow, the heat pipes 3 in the plurality of heat pipe assemblies 2 are communicated, and cooling liquid for heat dissipation is arranged in the heat pipes 3. The special-shaped fins 4 are plate-shaped metal sheets with thickness, and are attached and connected with the heat pipes 3. The special-shaped fins 4 are arranged on two sides of the heat pipe 3 far away from the mounting surface of the heat pipe 3, and two opposite special-shaped fins 4 form a flared opening 5 with a cross section at two sides of the heat pipe 3 so as to realize that the air flow flowing through the flared opening 5 accelerates the air flow velocity at the heat pipe 3 due to the narrowing of the flow passage, thereby realizing the improvement of the cooling efficiency. Therefore, the heat sink in this embodiment further includes a fan 6 provided on the housing of the heat conductive base plate 1, and the fan 6 is powered from the current apparatus to perform an operation. The air outlet of the fan 6 faces the wide opening 5 so as to realize that cold air is told to be blown into the wide opening 5, and the cooling efficiency is improved when flowing through the metal pipe.
Referring to fig. 2, the heat pipe assemblies 2 are used to cooperate with the fan 6 to realize active rapid cooling, and to further improve cooling efficiency, metal plates 7 are disposed on two sides of the heat conducting bottom plate 1 parallel to the air flow direction in the wide opening 5, and the metal plates 7 are made of copper or aluminum. The metal plate 7 is provided with a plurality of heat radiating fins 8 for increasing the heat conduction area. In one or more embodiments, the metal plate 7 is vertically provided with the heat conducting plate 9, two sides of the heat conducting plate 9 are respectively provided with a plurality of heat radiating fins 8 for passive heat radiation, and the heat conducting plate 9 is added to guide and arrange the heat radiating fins 8 at a position with wider space according to different installation environments, so that the heat radiating effect can be ensured. Because the radiating fins 8 are used for passive heat radiation, an air flow channel is not required to be designed, and the structure can be randomly arranged according to the installation environment, so that the radiator has higher flexibility.
Referring to fig. 1 and 4, in the present embodiment, a fan 6 is disposed at a heat pipe assembly 2 to achieve active heat dissipation with higher efficiency, but different degrees of noise are generated when the flow rate of air in an air duct changes, and under the condition that the heat dissipation effect is not affected, a noise reduction plate 10 is disposed at the end of the heat pipe assembly 2, and a noise reduction hole 11 for absorbing noise is disposed at a side of the noise reduction plate 10 facing the heat pipe assembly 2, where the noise reduction hole 11 in the present embodiment adopts a hexagonal honeycomb structure. Meanwhile, since the noise reduction plate 10 is disposed at the end of the heat pipe assembly 2, the cooling air flow can be restricted from overflowing toward the end of the heat pipe assembly 2, and thus the noise reduction plate 10 can further improve the utilization efficiency of the cooling air flow while achieving noise elimination.
Example 2
Referring to fig. 3, on the basis of embodiment 1, each heat pipe assembly 2 includes at least four heat pipes 3 that are oppositely disposed, a special-shaped fin 4 is respectively attached to the plurality of heat pipes 3 on both sides, the special-shaped fin 4 is located on both sides of each heat pipe 3 and is far away from the installation surface of the heat pipe 3, and the two opposite special-shaped fins 4 form a plurality of horn-shaped wide openings 5 on both sides of the plurality of heat pipes 3, so that the air flow flowing through the wide openings 5 accelerates the air flow rate due to the narrowing of the flow channels at the heat pipes 3, and the plurality of wide openings 5 realize multiple accelerated flows of the air flow, thereby improving the cooling efficiency and meeting the heat dissipation requirement of a larger area.
It will be appreciated by persons skilled in the art that the above embodiments are provided for clarity of illustration only and are not intended to limit the scope of the utility model. Other variations or modifications of the above-described utility model will be apparent to those of skill in the art, and are still within the scope of the utility model.

Claims (8)

1. The utility model provides an integrated heat pipe radiator, its characterized in that includes the heat conduction bottom plate, the heat conduction is connected with a plurality of heat pipe assemblies on the heat conduction bottom plate, every the heat pipe assembly includes two at least heat pipes of relative setting, be provided with the special-shaped fin that is used for even radiating on the heat pipe, special-shaped fin is the expansion setting in the both sides of heat pipe to realize forming the wide mouth in the heat pipe both sides of relative setting.
2. The heat sink of claim 1, further comprising a fan having an air outlet located on a side of the wide mouth.
3. The heat sink of claim 1, wherein the thermally conductive base plate is provided with a metal plate for passive heat dissipation at a side remote from the wide opening.
4. A radiator according to claim 3, wherein the metal plate is provided with a plurality of heat radiating fins for passive heat radiation.
5. A radiator according to claim 3, wherein the metal plate is vertically provided with a heat conducting plate, and a plurality of heat radiating fins for passive heat radiation are provided on both sides of the heat conducting plate.
6. The heat sink of claim 1 wherein the heat pipe is a solid metal structure.
7. The heat sink of claim 1, wherein the heat pipes are hollow metal structures, a plurality of the heat pipes are connected in conduction, and a cooling liquid is disposed in the heat pipes.
8. The heat sink of claim 1, wherein the end of the heat pipe assembly is provided with a noise reduction plate, and a face of the noise reduction plate facing the heat pipe assembly is provided with a plurality of noise reduction holes for absorbing noise.
CN202321850422.9U 2023-07-14 2023-07-14 Integrated heat pipe radiator Active CN220454357U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202321850422.9U CN220454357U (en) 2023-07-14 2023-07-14 Integrated heat pipe radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202321850422.9U CN220454357U (en) 2023-07-14 2023-07-14 Integrated heat pipe radiator

Publications (1)

Publication Number Publication Date
CN220454357U true CN220454357U (en) 2024-02-06

Family

ID=89730904

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202321850422.9U Active CN220454357U (en) 2023-07-14 2023-07-14 Integrated heat pipe radiator

Country Status (1)

Country Link
CN (1) CN220454357U (en)

Similar Documents

Publication Publication Date Title
CN1204797C (en) Heatsink for electronic component, and apparatus and method for manufacturing the same
US20100025013A1 (en) Heat dissipation device
KR100981155B1 (en) Heat sink
US20090321060A1 (en) Cooling Fin
CN220454357U (en) Integrated heat pipe radiator
CN101287347A (en) Heat pipe radiating device
CN110749123A (en) Radiator and refrigeration equipment
CN111366018B (en) Semiconductor refrigeration heat dissipation assembly and semiconductor refrigeration equipment
CN112739156A (en) Heat dissipation module, radiator and power equipment
CN116642224A (en) Automatically controlled heat radiation structure, air condensing units and air conditioner
CN208487601U (en) A kind of radiator for high-power LED light source
US7654308B2 (en) Heat exchanger
CN214791873U (en) Radiator and air conditioner
CN220965472U (en) High-efficient radiating aluminium alloy
CN111336716A (en) Lower box of refrigeration vehicle
CN214225852U (en) Radiator with wind-guiding passageway
CN212082115U (en) Radiator and air conditioner
CN212344334U (en) Heat sink for power device
CN212781932U (en) Computer host radiator
CN211233442U (en) Radiator and refrigeration equipment
CN219981405U (en) Radiator and electrical equipment
CN217561988U (en) Chip coupling cooling device and computer
CN210319659U (en) Fin heat dissipation module and projecting lamp
CN220210863U (en) Servo controller with good heat dissipation effect
CN217217245U (en) Heat sink device

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant