CN218896652U - LED display module and LED display screen - Google Patents
LED display module and LED display screen Download PDFInfo
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- CN218896652U CN218896652U CN202222694184.9U CN202222694184U CN218896652U CN 218896652 U CN218896652 U CN 218896652U CN 202222694184 U CN202222694184 U CN 202222694184U CN 218896652 U CN218896652 U CN 218896652U
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Abstract
The utility model belongs to the technical field of LED display, and particularly relates to an LED display module and an LED display screen. The LED display module comprises a substrate, an LED chip, a sealing layer and a packaging film, wherein the LED chip is arranged on the substrate, and the sealing layer is used for packaging the LED chip on the substrate. The packaging film comprises a main body part and a side part, wherein the main body part covers the surface of the sealing adhesive layer, the side part extends along the thickness direction of the substrate and is coated with the sealing adhesive layer from the side of the substrate, so that after the modules are spliced, the side part is clamped between the two modules, thereby improving the consistency of the gap between the modules and the ink color on the surfaces of the modules, and the side part shields and partially absorbs the light rays emitted from the side of the sealing adhesive layer, so that the visual brightness of the spliced seam can be reduced.
Description
Technical Field
The utility model belongs to the technical field of LED display, and particularly relates to an LED display module and an LED display screen.
Background
In the field of LED display, along with the continuous improvement of the visual experience demands of people, the image quality of the display screen is improved by reducing the pixel point distance of the display screen and improving the integration level, and the like, which is one of the main directions of development and attack of the LED display industry.
However, since the LED display screen is usually formed by splicing a plurality of LED display modules, limited by a splicing device, a process, etc., when each display module is spliced, a gap or extrusion formed between the modules or the box body may form a bright and dark line visually, for example, when the splice of two adjacent modules is too tight, the gap between the modules is smaller, the bright line may appear at the splice position, and when the splice of two adjacent modules is too loose, the dark line may appear at the splice position. And the smaller the pixel point distance of the display screen is, the more easily the problem of bright and dark lines is caused, thereby influencing the effective improvement of the image quality of the display screen.
In the related art, the size of the splice gap is usually corrected manually or mechanically to eliminate the bright and dark lines, in the actual operation process, the positions of the splice bright and dark lines, namely the splice gap, are required to be observed firstly, the size of the splice bright and dark lines is measured, and then correction coefficients are input to the splice bright and dark lines according to the size, so that the correction coefficients are required to be adjusted repeatedly in the correction process, and the bright and dark lines can be eliminated. The method for correcting the gap can solve the problem of splicing the bright and dark lines, but repeatedly corrects the gap, has complicated correction operation and low correction efficiency, and has higher accuracy requirement on correction coefficients, high requirement on machines and staff for executing correction operation, high cost and large investment, and is not beneficial to the cost management and control of product production.
Disclosure of Invention
The embodiment of the utility model aims to provide an LED display module and an LED display screen, which are used for solving the technical problems of complicated operation, low correction efficiency and high investment cost of eliminating bright and dark lines by manually or mechanically correcting a splicing gap in the related technology.
The technical scheme adopted by the utility model is as follows: the utility model provides a LED display module assembly, its characterized in that includes:
a substrate;
the LED chip is arranged on the substrate and used for emitting light;
the sealing adhesive layer is arranged on the surface of the substrate and used for packaging the LED chip on the substrate;
the packaging film comprises a main body part and side edge parts arranged on the periphery of the main body part;
the main body part covers the surface of the sealing adhesive layer, which is away from the substrate, and the side edge part extends along the thickness direction of the substrate and covers the sealing adhesive layer from the side edge of the substrate.
In some embodiments, the body portion is bonded to the sealant layer.
In some embodiments, the length of the side portion in the thickness direction of the substrate is equal to the thickness of the sealing adhesive layer, and the side portion is adhered to the sealing adhesive layer.
In some embodiments, the length of the side portion in the thickness direction of the substrate is greater than the thickness of the sealant layer and less than the total thickness of the sealant layer and the substrate, the side portion is bonded to the sealant layer, and/or the side portion is bonded to the substrate.
In some embodiments, the packaging film further includes a lap joint portion disposed at one end of the side edge portion facing away from the main body portion, the length of the side edge portion along the thickness direction of the substrate is equal to the total thickness of the sealing layer and the substrate, and the lap joint portion overlaps the bottom surface of the substrate facing away from the main body portion.
In some embodiments, the landing is bonded to the bottom surface of the substrate.
In some embodiments, the encapsulant film is a laminate of any one or more of a polyethylene terephthalate film, a polypropylene film, a polyvinyl chloride film, a super-resolution polyester film, a thermoplastic polyurethane elastomer rubber film, and a polarizer film.
In some embodiments, the encapsulation film is a black light transmissive film.
The one or more technical schemes in the LED display module provided by the utility model have at least one of the following technical effects: according to the LED display module, the packaging film is arranged, on one hand, the main body part of the packaging film covers the surface, deviating from the substrate, of the sealing layer, namely the light-emitting surface of the sealing layer, the main body part shields the sealing layer and the LED chip packaged in the sealing layer, the color of the main body part is apparent color in vision, and therefore, the consistency of the ink color of the LED display module can be improved by arranging the main body part to be consistent. On the other hand, the packaging film also comprises a side edge part arranged on the periphery of the main body part, the side edge part extends along the thickness direction of the substrate and coats the packaging adhesive layer from the side edge of the substrate, so that the side edge part can shield and absorb part of light rays emitted from the side edge of the packaging adhesive layer, thereby reducing the visual brightness of a spliced seam during splicing and avoiding the occurrence of excessively bright lines; in addition, the side cladding seal glue layer of side portion follow base plate, when a plurality of modules splice, the side portion presss from both sides between locating adjacent two modules, helps improving the gap between the module and the ink color uniformity on module surface, simultaneously, can also be equal through setting up the width size of each side portion, makes the width in gap between each module can keep unanimously basically when the concatenation module, like this, just can effectually avoid the problem that leads to appearing obvious bright dark line because of too big or undersize in the gap between the module. So, through setting up packaging film cladding seal glue layer, can enough improve the ink color uniformity of this application LED display module assembly, can effectually improve the bright dark line problem after the module concatenation again, need not to adjust the gap between the module repeatedly during the concatenation many times, can be simple efficient elimination bright dark line, the practicality is strong.
The utility model adopts another technical scheme that: an LED display screen is provided, which comprises a plurality of mutually spliced LED display modules.
In some embodiments, the width of the side edge portion of the encapsulation film of each LED display module is equal.
According to the LED display screen, the problem of bright and dark lines of the screen is solved by using the LED display module, the visual effect is better, and gaps among the modules are not required to be corrected manually or by means of machinery, so that the splicing operation of the LED display screen can be simplified, the splicing difficulty is reduced, the splicing and assembling efficiency is improved, the production cost of the LED display screen can be reduced, and the cost management and control are facilitated.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of an LED display module according to an embodiment of the present utility model;
FIG. 2 is a cross-sectional view of the LED display module shown in FIG. 1;
fig. 3 is a cross-sectional view of an LED display module according to another embodiment of the present utility model;
fig. 4 is a cross-sectional view of an LED display module according to still another embodiment of the present utility model.
Wherein, each reference sign in the figure:
10. a substrate;
20. an LED chip;
30. a sealing adhesive layer;
40. packaging films; 41. a main body portion; 42. a side edge portion; 43. and a lap joint part.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the present utility model is further described in detail below with reference to fig. 1 to 4 and the embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It is to be understood that the terms "length," "width," "upper," "lower," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship based on that shown in the drawings, merely to facilitate describing the present utility model and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present utility model.
Furthermore, in the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
Reference in the specification to "one embodiment," "some embodiments," or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the utility model. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," and the like in the specification are not necessarily all referring to the same embodiment, but mean "one or more but not all embodiments" unless expressly specified otherwise. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
As is well known, light emitting diodes (Light Emitting Diode, LEDs) are an important component of many electronic products, such as general lighting, smart phones, display screens, and the like, and the use of LEDs as light emitting chips can achieve high-efficiency lighting with an electro-optical conversion efficiency of more than 50%, and the small size of the LED chips can reduce the overall volume of the product, making the product more compact and also contributing to improving the flexibility of product design. In recent years, LEDs have been developed as one of the most widely used illumination and display light sources, and, with the rapid development of semiconductor micro-nano manufacturing technology, the combination of the semiconductor micro-nano manufacturing technology and LEDs enables the size of the LEDs to be reduced to a micrometer level, that is, sub-millimeter light emitting diodes (Mini Light Emitting Diode, mini-LEDs) to be manufactured, and compared with conventional LEDs, mini-LEDs also have many other characteristics, for example, when Mini-LEDs are used for manufacturing displays, they not only enable the screen of the display to have higher brightness, higher resolution and higher color saturation, but also can increase the response speed of the display, reduce the energy consumption of the display, and prolong the service life of the display.
However, as the technology for producing Mini-LEDs for display screens is mature, the market demand for higher definition image quality is increasing, which also makes the pixel pitch of the display screens smaller and smaller. In the actual production process, the LED display screen is formed by assembling a plurality of LED display modules, and after the LED display screen is assembled, the problem of bright and dark lines of the display screen is more likely to occur in smaller pixel point intervals, so that the effective improvement of the image quality of the display screen is affected, and the LED display screen becomes one of the technical bottlenecks for restricting the technical development of Mini-LED display screens.
Based on this, this application provides an LED display module assembly, and this display module assembly can effectively improve the bright dark line problem behind the LED display module assembly concatenation to improve the image quality that uses the display screen of this application's LED display module assembly, improve the display effect of display screen, this LED display module assembly not only is applicable to high density LED display screen, like the display screen of using Mini-LED chip etc. its LED display screen that also is applicable to other little pixel dot spacing. The following describes the LED display module of the present application in detail with reference to the drawings and specific embodiments.
As shown in fig. 1 to 4, an embodiment of the present utility model provides an LED display module, which includes a substrate 10, an LED chip 20 and a sealing layer 30, wherein the LED chip 20 is disposed on the substrate 10 and is used for emitting light, and the sealing layer 30 is disposed on the substrate 10 and is used for packaging the LED chip 20 on the substrate 10. In addition, the LED display module of the present embodiment further includes an encapsulation film 40, specifically, the encapsulation film 40 includes a main body portion 41 and a side portion 42 disposed at a periphery of the main body portion 41, where the main body portion 41 covers a surface of the encapsulation layer 30 facing away from the substrate 10, that is, covers a light emitting surface of the encapsulation layer 30, and the side portion 42 extends along a thickness direction (a direction indicated by an arrow F1 in fig. 2 to 4) of the substrate 10, and covers the encapsulation layer 30 from a side of the substrate 10, that is, the side portion 42 covers a side of the encapsulation layer 30.
According to the LED display module provided by the embodiment of the utility model, the packaging film 40 is arranged, on one hand, the main body part 41 of the packaging film 40 covers the surface of the packaging film 30, which is far away from the substrate 10, namely the light-emitting surface of the packaging film 30, the main body part 41 shields the packaging film 30 and the LED chip 20 packaged in the packaging film 30, the color of the main body part 41 is apparent, and thus, the consistency of the ink color of the LED display module can be improved by arranging the main body part 41 to be consistent in color. On the other hand, the packaging film 40 further includes a side edge portion 42 disposed at the periphery of the main body portion 41, where the side edge portion 42 extends along the thickness direction of the substrate 10 and covers the sealing layer 30 from the side edge of the substrate 10, so that the side edge portion 42 can shield and absorb a part of light emitted from the side edge of the sealing layer 30, thereby reducing the visual brightness of the splice seam during splicing and avoiding the occurrence of excessively bright lines; in addition, when the side edge part 42 is wrapped by the sealing glue layer 30 from the side edge of the substrate 10, and a plurality of modules are spliced, the side edge part 42 is clamped between two adjacent modules, so that the consistency of ink colors between gaps among the modules and the surfaces of the modules is improved, meanwhile, the width of the gaps among the modules can be basically kept consistent when the modules are spliced by setting the width dimension of the side edge part 42, and the problem that obvious bright and dark lines are caused by overlarge or overlarge gaps among the modules can be effectively avoided.
So, the LED display module of this embodiment through setting up encapsulation membrane 40 cladding seal glue layer 30, can enough improve the ink color uniformity of this application LED display module, can effectually improve the bright dark line problem after the module concatenation again, need not to adjust the inter-module gap repeatedly during the concatenation many times, can be simple efficient eliminate bright dark line, and the practicality is strong.
In a specific embodiment, as shown in fig. 1 and 2, the substrate 10 is a multi-layer circuit board substrate, a cup-shaped flat substrate, or may be a multi-layer circuit board substrate with driving, and the type of the specific substrate 10 may be selected according to actual needs. The LED chip 20 may be a Mini-LED chip 20, or may be other common LED chips 20, in addition, the LED chip 20 may be a tin electrode chip or a gold electrode chip, and the LED chip 20 may be mounted by any one or more of a vertical chip, a front-mounted chip or a flip chip. Here, the selection of the substrate 10, the selection of the LED chip 20, the selection of the electrodes of the LED chip 20, and the selection of the mounting manner of the LED chip 20 are only exemplary and should not be construed as being limited only.
In a specific embodiment, as shown in fig. 1, the substrate 10 may be a regular polygonal plate, a triangular plate or a circular plate, or may be an irregularly shaped plate, and the packaging film 40 is a cover-shaped structure and is covered on the substrate 10, and it is only necessary to ensure that the main body portion 41 covers the light-emitting surface of the sealing glue layer 30, and the side edge portion 42 covers the side edge of the sealing glue layer 30.
In a specific embodiment, as shown in fig. 2 to 4, the sealing layer 30 may be formed by using one of epoxy resin or silicone resin, and encapsulating the LED chip 20 on the substrate 10 by using a conventional encapsulation process, such as a molding process. Specifically, the substrate 10 has a top surface and a bottom surface that are oppositely disposed along a thickness direction, the LED chip 20 is encapsulated on the top surface of the substrate 10 through the sealing adhesive layer 30, the sealing adhesive layer 30 covers the top surface of the substrate 10, the light of the LED chip 20 passes through the sealing adhesive layer 30 and is emitted from the surface of the sealing adhesive layer 30 facing away from the substrate 10, and the surface of the emitted light is the light emitting surface of the sealing adhesive layer 30. The main body 41 of the packaging film 40 covers the light-emitting surface of the sealing glue layer 30, the ink color of the main body 41 is the ink color of the light-emitting surface at the visual angle, the LED chip 20 is packaged in the sealing glue layer 30, and the influence of the LED chip 20 on the consistency of the ink color of the main body 41 is small; the sealing glue layer 30 has a certain thickness, and the sealing glue layer 30 covers the top surface of the substrate 10, so that the light emitted by the LED chip 20 can be emitted from the side edge of the sealing glue layer 30, the side edge portion 42 of the sealing film 40 just covers the sealing glue layer 30 from the side edge of the substrate 10, and the side edge portion 42 can shield and partially absorb the light emitted from the side edge of the sealing glue layer 30.
In some embodiments, as shown in fig. 2 to 4, the encapsulation film 40 is a black transparent film, the chromaticity of the encapsulation film 40 is uniform, which is favorable for improving the consistency of the ink color of the display module, and can also meet the light transmission requirement of the display module, and when the encapsulation layer 30 is covered with the black transparent film and the LED chip 20 does not emit light, the encapsulation film 40 is black, i.e. the display surface of the display module is black, which is also favorable for improving the contrast of the display module, and obtaining the LED display screen with higher contrast.
In some embodiments, as shown in fig. 2 to 4, the encapsulation film 40 may be any one of a polyethylene terephthalate (Polyethylene terephthalate, PET) film, a Polypropylene (PP) film, a polyvinyl chloride (Polyvinyl chloride, PVC) film, an ultra-refractive polyester film, that is, an SRF film, a thermoplastic polyurethane elastomer rubber (Thermoplastic polyyrethane, TPU) film, and a polarizing plate film, or may be a laminate structure of the above films.
In some embodiments, as shown in fig. 2 to 4, the main body 41 of the encapsulating film 40 is adhered to the encapsulating layer 30, for example, by using the adhesion of the encapsulating layer 30 itself, or by using other adhesives without affecting the chromaticity and light transmittance of the encapsulating layer 30 and the main body 41.
In some embodiments, as shown in fig. 2, the length D1 of the side edge portion 42 of the encapsulation film 40 in the thickness direction of the substrate 10 is equal to the thickness D2 of the encapsulation layer 30, and the side edge portion 42 just shields the side edge of the encapsulation layer 30. In a specific embodiment, the side portion 42 may be adhered to the sealant layer 30, for example, by using the adhesive of the sealant layer 30 itself, or by using other adhesives without affecting the chromaticity, light transmittance, etc. of the sealant layer 30 and the main body portion 41.
In other embodiments, as shown in fig. 3, a length D1 of the side portion 42 of the encapsulation film 40 along the thickness direction of the substrate 10 may be greater than the thickness D2 of the encapsulation layer 30 and less than the total thickness of the encapsulation layer 30 and the substrate 10, that is, along the thickness direction of the substrate 10, the side portion 42 extends beyond the encapsulation layer 30, and partially overlaps the side of the substrate 10.
In this embodiment, the side edge 42 may be directly adhered to the sealant layer 30 by using the viscosity of the sealant layer 30 itself; alternatively, the side edge 42 may be bonded to the substrate 10 with an adhesive at a portion exceeding the sealant layer 30; alternatively, the portion where the side edge portion 42 is bonded to the side edge of the sealing layer 30 may be bonded to the sealing layer 30, and the portion where the side edge portion 42 exceeds the sealing layer 30 may be bonded to the substrate 10 with an adhesive. The use of the adhesive does not affect chromaticity, light transmittance, and the like of the sealant layer 30 and the main body 41.
In other embodiments, as shown in fig. 4, the packaging film 40 further includes a lap joint portion 43, where the lap joint portion 43 is disposed at an end of the side edge portion 42 facing away from the main body portion 41, specifically, a length D1 of the side edge portion 42 along the thickness direction of the substrate 10 is equal to the total thickness of the sealing adhesive layer 30 and the substrate 10, the lap joint portion 43 overlaps the bottom surface of the substrate 10 facing away from the main body portion 41, that is, the side edge portion 42 covers the sealing adhesive layer 30 and the entire side edge of the substrate 10, and the main body portion 41 and the lap joint portion 43 cover the top surface and the bottom surface of the substrate 10, respectively.
In the embodiment, as shown in fig. 4, the lap portion 43 is adhered to the bottom surface of the substrate 10, and is stably connected to the substrate 10.
In the embodiment, as shown in fig. 2 to 4, the encapsulation film 40 is an integral piece, and the main body portion 41 and the side edge portion 42, and the lap portion 43 are integrally formed.
The following is a simple description of a molding process of the LED display module according to the present application, with reference to a specific embodiment:
firstly, a substrate 10 is provided, for example, the substrate 10 may be a multi-layer circuit board, then solder paste is printed on the substrate 10 by printing or the like, and the LED chip 20 is fixed on the substrate 10 by a single-point die bonding process or the like, and is electrically connected with the substrate 10 by reflow soldering.
Then, the molding process is used to form the sealing layer 30 on the substrate 10 to encapsulate the LED chip 20, for example, a molding process is used to form the sealing layer 30 from a two-component epoxy resin without doped diffusion powder, to encapsulate the LED chip 20, and the edge redundant portion of the sealing layer 30 is removed along the side edge of the substrate 10 after the molding of the sealing layer 30.
Finally, the packaging film 40 is disposed on the substrate 10, such that the main body 41 of the packaging film 40 covers the light-emitting surface of the sealing glue layer 30, and the side edge 42 covers the side edge of the sealing glue layer 30 from the side edge of the substrate 10, as shown in fig. 3 and 4, so as to obtain the LED display module without bright and dark lines.
According to the LED display module, the packaging film is arranged to cover the sealing layer, so that the consistency of ink colors of the LED display module is effectively improved, meanwhile, the problem of bright and dark lines after the LED display module is spliced is greatly improved, the bright and dark lines can be simply and efficiently eliminated, and when the LED display module is spliced into an LED display screen, gaps among the LED display modules do not need to be repeatedly adjusted, so that the LED display module has high practicability.
Another embodiment of the present utility model further provides an LED display (not shown), where the LED display includes a plurality of LED display modules in the foregoing embodiments, and the plurality of LED display modules are spliced and connected with each other.
In a specific embodiment, the width of the side edge portion of the packaging film of each LED display module is equal, where it is noted that "the width of the side edge portion" refers to: the width dimension of the side portions in the direction perpendicular to the thickness direction of the substrate (the direction indicated by the arrow F1 in fig. 2 to 4), i.e., the width dimension of the side portions in the direction indicated by the arrow F2 in fig. 2 to 4, is indicated by W in the drawing.
Therefore, the widths W of the side edge parts of the packaging films of the LED display modules are equal, and when the LED display modules are spliced, the widths of gaps among the modules can be kept consistent, so that the problem that obvious bright and dark lines appear due to overlarge or undersize gaps among the modules can be effectively avoided, and the bright and dark lines are effectively eliminated.
According to the LED display screen, the problem of bright and dark lines of the screen is solved by using the LED display module, the visual effect is better, and gaps among the modules are not required to be corrected manually or by means of machinery, so that the splicing operation of the LED display screen can be simplified, the splicing difficulty is reduced, the splicing and assembling efficiency is improved, the production cost of the LED display screen can be reduced, and the cost management and control are facilitated.
In addition, the LED display screen of this embodiment also has other beneficial effects of the LED display module provided in the foregoing embodiments, and will not be described herein.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.
Claims (10)
1. An LED display module, comprising:
a substrate;
the LED chip is arranged on the substrate and used for emitting light;
the sealing layer is arranged on the surface of the substrate and used for packaging the LED chip on the substrate;
the packaging film comprises a main body part and side edge parts arranged on the periphery of the main body part;
the main body part covers the surface of the sealing adhesive layer, which is away from the substrate, and the side edge part extends along the thickness direction of the substrate and covers the sealing adhesive layer from the side edge of the substrate.
2. The LED display module of claim 1, wherein the body portion is bonded to the encapsulant layer.
3. The LED display module of claim 1, wherein the length of the side edge portion in the thickness direction of the substrate is equal to the thickness of the sealing layer, and the side edge portion is adhered to the sealing layer.
4. The LED display module according to claim 1, wherein a length of the side portion in the thickness direction of the substrate is greater than a thickness of the sealing layer and less than a total thickness of the sealing layer and the substrate, the side portion is bonded to the sealing layer, and/or the side portion is bonded to the substrate.
5. The LED display module according to claim 1, wherein the encapsulation film further comprises a lap joint portion disposed at an end of the side edge portion facing away from the main body portion, a length of the side edge portion in a thickness direction of the substrate is equal to a total thickness of the encapsulation layer and the substrate, and the lap joint portion overlaps a bottom surface of the substrate facing away from the main body portion.
6. The LED display module of claim 5, wherein the tab is bonded to the bottom surface of the substrate.
7. The LED display module according to any one of claims 1 to 6, wherein the encapsulation film is a laminated structure of any one or more of a polyethylene terephthalate film, a polypropylene film, a polyvinyl chloride film, a super-refractive polyester film, a thermoplastic polyurethane elastomer rubber film, and a polarizing plate film.
8. The LED display module according to any one of claims 1 to 6, wherein the encapsulation film is a black light-transmitting film.
9. An LED display screen comprising a plurality of LED display modules according to any one of claims 1 to 8 spliced to one another.
10. The LED display screen of claim 9, wherein the width of the side edge portion of the encapsulation film of each LED display module is equal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222694184.9U CN218896652U (en) | 2022-10-12 | 2022-10-12 | LED display module and LED display screen |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222694184.9U CN218896652U (en) | 2022-10-12 | 2022-10-12 | LED display module and LED display screen |
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| CN218896652U true CN218896652U (en) | 2023-04-21 |
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| CN202222694184.9U Active CN218896652U (en) | 2022-10-12 | 2022-10-12 | LED display module and LED display screen |
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