CN212461695U - LED display panel and display device - Google Patents
LED display panel and display device Download PDFInfo
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- CN212461695U CN212461695U CN202021107566.1U CN202021107566U CN212461695U CN 212461695 U CN212461695 U CN 212461695U CN 202021107566 U CN202021107566 U CN 202021107566U CN 212461695 U CN212461695 U CN 212461695U
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Abstract
The utility model discloses a LED display panel and display device, LED display panel includes LED array substrate and color conversion cover, LED array substrate includes the circuit board, a plurality of LED send out light chip and transparent packaging body, LED sends out light chip and sets up in the reflection cup on the circuit board, transparent packaging body is filled in the reflection cup and is covered LED and send out light chip, be formed with between transparent packaging body and the color conversion cover and be used for radiating cavity, color conversion cover includes a plurality of color conversion structures that correspond with a plurality of LED send out light chip, color conversion structure is used for converting the first chromatic light that LED sent out light chip into the second chromatic light. There is the cavity that is used for the heat dissipation between transparent packaging body's surface and the color conversion cover, and this cavity is used for radiating away the heat that LED luminescence chip produced in the course of the work, plays the thermal buffering effect, avoids the heat to accumulate in the color conversion structure, leads to the quantum dot in the color conversion structure because of the impaired problem of high temperature, has improved display panel's life.
Description
Technical Field
The utility model relates to a show technical field, especially relate to a LED display panel and display device.
Background
Under the severe trend of pursuing colorization and high-resolution and high-contrast thereof, various large companies and research institutions in the world propose various solutions to solve the colorization problem of Micro-LED display. At present, two Micro-LED colorization realization methods are respectively an RGB three-color LED mode and a quantum dot color conversion mode.
The RGB three-color LED mode is mainly based on the basic principle of three primary colors (red, green and blue) color mixing, and the brightness value of the red LED, the green LED and the blue LED can be controlled by applying different currents, so that the combination of the three primary colors is realized, and the full-color display effect is achieved. The method needs to transfer a large amount of three-color LEDs to the driving circuit board, and at present, the method has the problems of low transfer efficiency and easy damage to the product quality during transfer due to unstable process of the red LEDs.
Therefore, quantum dot color conversion approaches are of great interest to those skilled in the art. Quantum dot color conversion technology, namely, a method of using UV LED (ultraviolet LED) or blue LED + color conversion medium to realize full color. Meanwhile, due to the characteristics of the quantum dots, the color purity of R, G, B excited by the quantum dots is very high, so that the LED display with high color gamut can be obtained.
The color conversion medium, i.e., quantum dots, is currently commonly applied by spraying the quantum dots directly onto the LED surface. The existing quantum dot color conversion display panel is easy to damage quantum dots due to overhigh temperature in the working process, so that the service life of the display panel is shortened.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a LED display panel and display device can avoid the heat to accumulate in color conversion structure, leads to the quantum dot in the color conversion structure because of the impaired problem of high temperature, has improved display panel's life.
In a first aspect, an embodiment of the present invention provides an LED display panel, including an LED array substrate, and a color conversion cover covering the LED array substrate;
the LED array substrate comprises a circuit board, a plurality of LED light-emitting chips and a transparent packaging body;
a plurality of reflecting cups arranged in an array are formed on the circuit board;
the LED light-emitting chip is arranged in the reflecting cup;
the transparent packaging body is filled in the reflecting cup and covers the LED light-emitting chip;
a cavity for heat dissipation is formed between the surface of the transparent packaging body and the color conversion cover;
the color conversion cover comprises a plurality of color conversion structures which are arranged in an array and correspond to the LED luminous chips, and the color conversion structures are used for converting first color light emitted by the LED luminous chips into second color light.
Optionally, the side wall of the reflecting cup is coated with a light shielding material for shielding light.
Optionally, the LED display panel further includes a pressing plate formed on the circuit board, the pressing plate is provided with a through hole corresponding to each of the LED light emitting chips, and the inner wall of the through hole and the surface of the circuit board enclose the reflection cup.
Optionally, the color conversion cover includes a transparent substrate, a color conversion layer and a transparent encapsulation layer;
the color conversion layer is formed on the transparent substrate and comprises a plurality of color conversion structures which correspond to the LED light-emitting chips and are arranged in an array manner;
the transparent packaging layer covers the color conversion layer.
Optionally, a light shielding structure is disposed between two adjacent color conversion structures.
Optionally, the transparent substrate includes a plurality of cup-shaped structures recessed toward the transparent encapsulation body, the color conversion structures are filled in the cup-shaped structures, and the cup-shaped structures are embedded in the reflective cup.
Optionally, an included angle between the outer side wall of the cup-shaped structure and a direction perpendicular to the transparent substrate is greater than 0 ° and smaller than 90 °.
Optionally, the inner side wall of the cup-shaped structure is coated with a shading material for shading.
Optionally, the LED light emitting chip is a blue light chip or an ultraviolet light chip and is configured to emit blue light or ultraviolet light, and the color conversion layer includes a red conversion structure, a green conversion structure and a blue conversion structure, and is respectively configured to convert the first color light emitted by the LED light emitting chip into red light, green light and blue light.
In a second aspect, the embodiment of the present invention further provides a display device, including the utility model discloses the first aspect provides a LED display panel.
The embodiment of the utility model provides a LED display panel, including LED array substrate, and cover the color conversion cover on LED array substrate, LED array substrate includes the circuit board, a plurality of LED send out optical chip and transparent packaging body, be formed with a plurality of reflection cups that are the array and arrange on the circuit board, LED sends out optical chip and sets up in reflection cup, transparent packaging body is filled in reflection cup and is covered LED and send out optical chip, be formed with between transparent packaging body's surface and the color conversion cover and be used for radiating cavity, the color conversion cover includes a plurality of color conversion structures that are the array and arrange that correspond with a plurality of LED send out optical chip, color conversion structure is used for converting the first chromatic light that LED sent into the second chromatic light. There is the cavity that is used for the heat dissipation between transparent packaging body's surface and the color conversion cover, and this cavity is used for radiating away the heat that LED luminescence chip produced in the course of the work, plays the thermal buffering effect, avoids the heat to accumulate in the color conversion structure, leads to the quantum dot in the color conversion structure because of the impaired problem of high temperature, has improved display panel's life.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings and examples.
Fig. 1 is a partial structural cross-sectional view of an LED display panel according to an embodiment of the present invention;
fig. 2 is a top view of an LED array substrate according to an embodiment of the present invention;
fig. 3 is a partially enlarged view of a region a of the LED array substrate of fig. 2;
fig. 4 is a top view of a circuit board according to an embodiment of the present invention;
fig. 5 is a top view of a laminated board according to an embodiment of the present invention;
fig. 6 is a top view of the circuit board and the pressing plate after being pressed together according to the embodiment of the present invention;
fig. 7 is a partial sectional view of another LED display panel according to an embodiment of the present invention;
FIG. 8 is an enlarged view of a portion of area B of FIG. 7;
fig. 9 is a flowchart of a method for manufacturing an LED display panel according to an embodiment of the present invention;
fig. 10 is a partial cross-sectional view of an LED array substrate according to an embodiment of the present invention;
fig. 11 is a schematic structural diagram of a color conversion cover according to an embodiment of the present invention;
fig. 12 is a schematic structural diagram of a transparent substrate according to an embodiment of the present invention;
FIG. 13 is a schematic illustration of filling a color conversion structure in a cup-shaped structure;
FIG. 14 is a schematic diagram of forming a transparent encapsulation layer over a color conversion layer;
fig. 15 is a schematic view illustrating a bonding of an LED array substrate and a color conversion cover according to an embodiment of the present invention;
fig. 16 is a schematic view illustrating another embodiment of the present invention, wherein the LED array substrate is attached to a color conversion cover.
Detailed Description
In order to make the technical problems, technical solutions and technical effects achieved by the present invention more clear, the embodiments of the present invention will be described in further detail with reference to the accompanying drawings, and obviously, the described embodiments are only some embodiments, not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature. Furthermore, the terms "first" and "second" are used merely for descriptive purposes and are not intended to have any special meaning.
Fig. 1 is a partial structural cross-sectional view of an LED display panel provided in an embodiment of the present invention, as shown in fig. 1, the LED display panel includes an LED array substrate 10, and a color conversion cover 20 covering the LED array substrate 10.
The LED array substrate 10 includes a circuit board 110, a plurality of LED light emitting chips 120, and a transparent package 130. A plurality of reflecting cups 111 arranged in an array are formed on the circuit board 110, the LED light emitting chips 120 are disposed on the circuit board 110 in the reflecting cups 111, the transparent packaging body 130 is filled in the reflecting cups 111 and covers the LED light emitting chips 120, and the LED light emitting chips 120 emit light toward one side of the transparent packaging body 130.
Specifically, the color conversion cover 20 covers the light emitting side of the LED array substrate, the transparent package 130 partially fills the reflective cup 111, and a cavity for dissipating heat is formed between the surface of the transparent package 130 and the color conversion cover 20.
The color conversion cover 20 includes a plurality of color conversion structures 221 arranged in an array corresponding to the plurality of LED light emitting chips 120, and the color conversion structures 221 are configured to convert the first color light emitted by the LED light emitting chips 120 into a second color light.
Because a cavity for heat dissipation exists between the surface of the transparent packaging body 130 and the color conversion cover 20, that is, a cavity for heat dissipation exists between the transparent packaging body 130 and the color conversion structure 221, the cavity is used for radiating heat generated by the LED light emitting chip 120 in the working process, so as to play a role of thermal buffering, avoid heat accumulation in the color conversion structure 221, and thus prevent quantum dots in the color conversion structure 221 from being damaged due to high temperature, thereby prolonging the service life of the display panel.
Specifically, in the embodiment of the present invention, the circuit board 110 may be formed by an etching process, and has a metal circuit and a driving component (e.g., a field effect transistor, a capacitor, etc.) for driving the LED light emitting chip 120 to emit light. The circuit board 110 may include a single-layer circuit or a multi-layer circuit, and the embodiments of the present invention are not limited thereto.
The LED light emitting chip 120 may be a light emitting chip emitting high energy, for example, emitting ultraviolet light or blue light. The first color light is ultraviolet light or blue light emitted by the LED light emitting chip 120, and the second color light is red light, green light, or blue light converted from the quantum dots in the color conversion structure 221. If the first color light emitted by the LED light emitting chip 120 is blue light, the color conversion structure 221 for converting the first color light into blue light in the color conversion cover 20 may be a highly transparent material, such as glass, polyimide, or the like.
The LED light emitting chip 120 may be a front-mounted chip, a flip chip or a vertical chip, and the embodiment of the present invention does not limit the specific structure of the LED light emitting chip. The two electrodes of the face-up chip are positioned on the light-emitting surface of the LED light-emitting chip, the two electrodes of the flip chip are positioned on the backlight surface opposite to the light-emitting surface of the LED light-emitting chip, and the two electrodes of the vertical chip are respectively positioned on the light-emitting surface and the backlight surface of the LED light-emitting chip.
The material of the transparent package 130 may be a transparent packaging material such as resin, polyimide, etc., and the embodiment of the present invention is not limited herein. In this embodiment, the surface of the transparent encapsulation 130 may be a flat surface, as shown in fig. 1. In other embodiments of the present invention, the transparent package 130 may also be a spherical surface with a certain radian, and the spherical surface can increase the light emitting angle of the LED light emitting chip 120.
In the embodiment of the present invention, the reflective cup 111 may be formed by the substrate itself of the circuit board 110, or may be formed by adding an additional structure on the circuit board 110, and the embodiment of the present invention is not limited herein.
The embodiment of the utility model provides a LED display panel, including LED array substrate, and cover the color conversion cover on LED array substrate, LED array substrate includes the circuit board, a plurality of LED send out optical chip and transparent packaging body, be formed with a plurality of reflection cups that are the array and arrange on the circuit board, LED sends out optical chip and sets up in reflection cup, transparent packaging body is filled in reflection cup and is covered LED and send out optical chip, be formed with between transparent packaging body's surface and the color conversion cover and be used for radiating cavity, the color conversion cover includes a plurality of color conversion structures that are the array and arrange that correspond with a plurality of LED send out optical chip, color conversion structure is used for converting the first chromatic light that LED sent into the second chromatic light. There is the cavity that is used for the heat dissipation between transparent packaging body's surface and the color conversion cover, and this cavity is used for radiating away the heat that LED luminescence chip produced in the course of the work, plays the thermal buffering effect, avoids the heat to accumulate in the color conversion structure, leads to the quantum dot in the color conversion structure because of the impaired problem of high temperature, has improved display panel's life.
The utility model discloses an in some embodiments, the lateral wall coating of reflection cup 111 has the shading material that is used for the shading, and the shading material is used for blockking that the light that LED luminescence chip 120 sent in reflection cup 111 propagates to adjacent reflection cup 111 from the side direction, prevents that adjacent LED luminescence chip 120 from taking place the crosstalk phenomenon, and then has improved display effect. Wherein, the light shielding material can be black ink or other black paint.
Specifically, in some embodiments of the present invention, the reflection cup can be formed by additionally adding a laminated board with a through hole on the surface of the circuit board, so as to form a plurality of reflection cups arranged in an array on the circuit board. Fig. 2 is a plan view of a LED array substrate provided by an embodiment of the present invention, fig. 3 is a partial enlarged view of an area a of the LED array substrate in fig. 2, fig. 4 is a plan view of a circuit board provided by an embodiment of the present invention, fig. 5 is a plan view of a laminated board provided by an embodiment of the present invention, and fig. 6 is a plan view of the embodiment of the present invention after the circuit board and the laminated board are pressed together, which is exemplary, as shown in fig. 1 to fig. 6, a laminated board 140 is formed on the circuit board 110, and the laminated board 140 and the circuit board 110 can be combined together by a laminating or bonding method. The pressing plate 140 has a through hole 141 corresponding to each LED light emitting chip 120, the inner wall of the through hole 141 and the surface of the circuit board 110 form a reflection cup 111, and the LED light emitting chips 120 are fixed in the corresponding through holes 141.
For example, in this embodiment, the pressing plate 140 may be made of a light shielding material (e.g., black plastic), or the surface of the pressing plate 140 and the inner wall of the through hole 141 are coated with the light shielding material, which may be black ink or other black paint, to prevent the adjacent LED light emitting chips 120 from crosstalk and improve the display effect.
In some embodiments of the present invention, the scattering material is uniformly distributed in the transparent package 130, and the first color light from the LED light emitting chip 120 is scattered away from each angle through multiple scattering of the scattering material in the transparent package 130, and is uniformly emitted from the transparent package 130. The scattering material can be powder particles, for example, metal powder particles, and the metal powder particles can play a role in scattering on one hand and also play a role in heat dissipation on the other hand, so that the phenomenon that the temperature is too high due to heat accumulation is avoided. Specifically, the scattering material may be added into the liquid encapsulation glue, and after fully and uniformly stirring, the encapsulation glue is injected into the reflective cup 111, and after solidification, the transparent encapsulation body 130 is formed.
Specifically, as shown in fig. 1-6, in an embodiment of the present invention, the LED light emitting chip 120 is a flip chip, two pads 112, which can be an anode pad and a cathode pad, are disposed on the circuit board 110 corresponding to each LED light emitting chip 120, and two electrodes of the flip chip are respectively fixed on the two corresponding pads 112 through a conductive material (e.g., solder paste or conductive adhesive), that is, the anode of the flip chip is fixed on the corresponding anode pad, and the cathode of the flip chip is fixed on the corresponding cathode pad.
Specifically, in the embodiment of the present invention, the color conversion cover 20 includes a transparent substrate 210, a color conversion layer 220 and a transparent encapsulation layer 230. The color conversion layer 220 is formed on the transparent substrate 210, and the color conversion layer 220 includes a plurality of color conversion structures 221 arranged in an array corresponding to the plurality of LED light emitting chips 120. A transparent encapsulation layer 230 overlies the color conversion layer 220.
Specifically, the transparent substrate 210 may be a glass substrate, an organic transparent substrate (e.g., a polyimide substrate), or the like, and the embodiment of the invention is not limited herein. The color conversion layer 220 includes a red conversion structure, a green conversion structure, and a blue conversion structure, and is respectively configured to convert the first color light emitted by the corresponding LED light emitting chip into red light, green light, and blue light. If the first color light emitted by the LED light emitting chip 120 is blue light, the blue conversion structure may be a highly transparent material, such as glass, polyimide, or the like. The transparent encapsulation layer 230 may be made of a transparent encapsulation colloid material with waterproof and oxygen-proof properties, such as PET (Polyethylene terephthalate), polyimide or epoxy resin, and the present invention is not limited herein.
Specifically, in an embodiment of the present invention, as shown in fig. 1, the transparent substrate 210 and the transparent encapsulating layer 230 are PET plates, and the color converting structure 221 is injected between the two PET plates and pressed together, similar to a sandwich structure.
Further, in some embodiments of the present invention, as shown in fig. 1, a light shielding structure 222 is disposed between two adjacent color conversion structures 221, the light shielding structure 222 is used to block the light emitted by the color conversion structure 221 from propagating from the side direction to the adjacent color conversion structure 221, so as to prevent the light crosstalk phenomenon from occurring in the adjacent color conversion structure 221, and further improve the display effect. The light shielding structure 222 may be made of a light shielding material, or the surface of the light shielding structure 222 may be coated with a light shielding material, such as black ink or other black paint. In addition, the light shielding structure 222 can also play a supporting role between the two PET plates, so as to prevent the color conversion structure 221 from being damaged due to excessive extrusion of the color conversion structure 221 when the two PET plates are pressed.
In some embodiments of the present invention, as shown in fig. 1, the LED display panel may further include a cover plate 30, the cover plate 30 covers the color conversion cover 20, and wraps up the side wall of the color conversion cover 20, on one hand, the cover plate 30 plays a role of sealing protection, and prevents impurities such as external water vapor from entering the inside of the LED display panel, and prevents the color conversion cover 20 from being damaged from the outside, and on the other hand, the cover plate 30 also plays a role of fixing the color conversion cover 20. The cover plate 30 may be a molecular film material having high transparency.
In another embodiment of the present invention, in order to improve the alignment precision between the color conversion cover and the LED array substrate, the color conversion cover may be provided in the form of a plurality of cup-shaped structures, and the cup-shaped structures are embedded into the reflective cups of the LED array substrate. Fig. 7 is a partial sectional view of another LED display panel according to an embodiment of the present invention, and fig. 8 is a partial enlarged view of a region B in fig. 7, in this embodiment, the LED array substrate has the same structure as the array substrate in the foregoing embodiment, which is not repeated herein, but a color conversion cover is used, and the specific structure of the color conversion cover in this embodiment will be described in detail below.
Specifically, in the embodiment of the present invention, as shown in fig. 7 and 8, the color conversion cover 20 includes a transparent substrate 210, a color conversion layer 220, and a transparent encapsulation layer 230. The color conversion layer 220 is formed on the transparent substrate 210, and the color conversion layer 220 includes a plurality of color conversion structures 221 arranged in an array corresponding to the plurality of LED light emitting chips 120. A transparent encapsulation layer 230 overlies the color conversion layer 220.
Specifically, the transparent substrate 210 includes a plurality of cup-shaped structures 211 recessed toward the transparent package 130, and the cup-shaped structures 211 are embedded in the reflective cup 111, specifically, the transparent substrate 210 and the transparent package 130 have a certain gap to form a cavity for dissipating heat. Color conversion structure 221 is filled in cup-shaped structure 211, and specifically, color conversion structure 221 completely fills cup-shaped structure 211, that is, color conversion structure 221 is flush with the surface of the portion of transparent substrate 210 that is not recessed. By arranging the transparent substrate 210 in a form including a plurality of cup-shaped structures 211 recessed toward the transparent encapsulation 130, each cup-shaped structure 211 is embedded in the corresponding reflective cup 111 when the LED array substrate 10 and the color conversion cover 20 are assembled and attached, so that the alignment efficiency and the alignment accuracy of the LED array substrate 10 and the color conversion cover 20 are improved.
Specifically, in the present embodiment, as shown in fig. 7 and 8, the outer sidewall 2111 of the cup-shaped structure 211 makes an angle greater than 0 ° and smaller than 90 ° with respect to a direction perpendicular to the transparent substrate 210 (i.e., a vertical direction in the drawing). By setting the included angle between the outer sidewall 2111 of the cup-shaped structure 211 and the direction perpendicular to the transparent substrate 210 to a certain inclination angle, when the LED array substrate 10 and the color conversion cover 20 are assembled and attached, the cup-shaped structure 211 is more easily embedded into the corresponding reflective cup 111, thereby further improving the alignment efficiency. Specifically, in one embodiment, the outer sidewall 2111 of the cup-shaped structure 211 makes an angle greater than 45 ° with respect to a direction perpendicular to the transparent substrate 210.
Illustratively, in the present embodiment, the inner sidewall 2112 of the cup-shaped structure 211 is coated with a light shielding material for shielding light, such as black ink or other black paint, so as to block the light emitted by the color conversion structure 221 from propagating laterally to the adjacent color conversion structure 221, thereby preventing the crosstalk phenomenon from occurring between the adjacent color conversion structures 221 and further improving the display effect.
For example, in the present embodiment, the transparent encapsulation layer 230 may be a barrier material with waterproof and oxygen-proof properties, so as to prevent external water and oxygen from invading into the color conversion structure 221 to damage the quantum dots.
The embodiment of the utility model provides a still provide a preparation method of LED display panel, fig. 9 is the utility model provides a preparation method's of LED display panel flowchart, it is concrete, as shown in fig. 9, this method includes following step:
s301, preparing the LED array substrate.
Specifically, in the embodiment of the present invention, this step may include the following processes:
1. a wiring board is provided. As shown in fig. 4, two pads 112, which may be an anode pad and a cathode pad, are disposed on the wiring board 110 corresponding to each LED light emitting chip 120.
2. A laminated board is formed on the circuit board. As shown in fig. 5, the pressing plate 140 has a through hole 141 corresponding to each LED light emitting chip 120, and the inner wall of the through hole 141 and the surface of the circuit board 110 form a reflective cup 111. The laminate board 140 and the circuit board 110 may be bonded together by lamination or adhesion, and the through hole 141 exposes two pads 112 corresponding to one LED light emitting chip 120. Specifically, the laminated plate 140 may be made of a light shielding material (e.g., black plastic), or the surface of the laminated plate 140 and the inner wall of the through hole 141 are coated with the light shielding material, which may be black ink or other black paint, to prevent the adjacent LED light emitting chips 120 from crosstalk, thereby improving the display effect.
3. And transferring the LED light-emitting chip to a circuit board. As shown in fig. 1 to fig. 3, the LED light emitting chip 120 is transferred to the circuit board 110 in the corresponding reflective cup 111, wherein two electrodes of the LED light emitting chip 120 are respectively fixed on two corresponding bonding pads through a conductive material, that is, the anode of the LED light emitting chip 120 is fixed on the corresponding anode bonding pad, and the cathode of the LED light emitting chip is fixed on the corresponding cathode bonding pad.
4. Transparent packaging glue mixed with scattering materials is injected into the reflecting cup, so that a transparent packaging body is formed in the reflecting cup. Fig. 10 is a partial cross-sectional view of an LED array substrate according to an embodiment of the present invention, specifically, a scattering material is mixed in a transparent encapsulation adhesive and stirred uniformly. Then, the transparent encapsulation glue mixed with the scattering material is injected into the reflection cup 111, and after the transparent encapsulation glue is solidified, the transparent encapsulation body 130 is formed in the reflection cup 111. In the glue injection process, the glue amount of the glue injection can be controlled, as shown in fig. 10, so that a cavity for heat dissipation is formed between the surface of the transparent package 130 and the top of the reflective cup 111 (i.e., the surface of the laminated plate 140), and the cavity is used for radiating heat generated by the LED light emitting chip 120 in the working process, so as to play a role of thermal buffering, prevent the heat from accumulating in the color conversion structure 221, and prevent quantum dots in the color conversion structure 221 from being damaged due to high temperature, thereby prolonging the service life of the display panel.
S302, preparing a color conversion cover.
Specifically, the color conversion mask can be prepared in the following two ways.
In a first mode
1. A transparent substrate is provided. Specifically, the transparent substrate 210 may be a glass substrate or an organic transparent substrate, and the embodiment of the present invention is not limited herein. In this embodiment, the transparent substrate 210 is a PET substrate.
2. And forming a light shielding structure on the transparent substrate. Specifically, fig. 11 is a schematic structural view of a color conversion cover according to an embodiment of the present invention, as shown in fig. 11, the light shielding structure 222 may be made of a light shielding material, or the surface of the light shielding structure 222 is coated with a light shielding material, such as black ink or other black paint.
3. And filling color conversion structures between the adjacent light shielding structures to form a color conversion layer. Specifically, the color conversion structure 221 is filled between adjacent light shielding structures to form the color conversion layer 220. The color conversion structure 221 is disposed corresponding to the LED light emitting chip 120.
The color conversion layer 220 includes a red conversion structure, a green conversion structure, and a blue conversion structure, and is respectively configured to convert the first color light emitted by the corresponding LED light emitting chip into red light, green light, and blue light. If the first color light emitted by the LED light emitting chip 120 is blue light, the blue conversion structure may be a highly transparent material, such as glass, polyimide, or the like.
The light shielding structure 222 is used to block the light emitted from the color conversion structure 221 from laterally propagating to the adjacent color conversion structure 221, so as to prevent the light crosstalk phenomenon from occurring in the adjacent color conversion structure 221, thereby improving the display effect.
4. A transparent encapsulation layer is formed over the color conversion layer. Specifically, the transparent encapsulating layer 230 is disposed on the color conversion layer 220 and laminated by lamination or adhesion. The transparent encapsulating layer 230 may be made of a transparent encapsulating colloid material having waterproof and oxygen-proof properties, and in this embodiment, the transparent encapsulating layer 230 is a PET plate. In this embodiment, the light shielding structure 222 can support the two PET plates, so as to prevent the color conversion structure 221 from being damaged due to the excessive extrusion of the color conversion structure 221 when the two PET plates are pressed together.
Mode two
1. A transparent substrate is provided, which includes a plurality of cup-shaped structures recessed to one side. Specifically, fig. 12 is a schematic structural diagram of a transparent substrate according to an embodiment of the present invention, as shown in fig. 8 and 12, the transparent substrate 210 includes a plurality of cup-shaped structures 211 recessed to one side, and an included angle between an outer sidewall 2111 of each cup-shaped structure 211 and a direction perpendicular to the transparent substrate 210 (i.e., a vertical direction in the drawing) is greater than 0 ° and smaller than 90 °. In one embodiment, the outer sidewall 2111 of the cup-shaped structure 211 makes an angle of more than 45 ° with the direction perpendicular to the transparent substrate 210.
Illustratively, the inner sidewalls 2112 of the cup-shaped structure 211 are coated with a light-blocking material, such as a black ink or other black paint, for blocking light.
2. And filling the cup-shaped structure with a color conversion structure to form a color conversion layer. Fig. 13 is a schematic diagram of filling a color conversion structure in a cup-shaped structure, and specifically, as shown in fig. 13, a color conversion structure 221 is filled in a cup-shaped structure 211 to form a color conversion layer 220. Specifically, the color conversion structure 221 completely fills the cup-shaped structure 211, i.e., the color conversion structure 221 is flush with the surface of the portion of the transparent substrate 210 that is not recessed. The color conversion structure 221 is disposed corresponding to the LED light emitting chip 120.
The color conversion layer 220 includes a red conversion structure, a green conversion structure, and a blue conversion structure, and is respectively configured to convert the first color light emitted by the corresponding LED light emitting chip into red light, green light, and blue light. If the first color light emitted by the LED light emitting chip 120 is blue light, the blue conversion structure may be a highly transparent material, such as glass, polyimide, or the like.
The light shielding material coated on the inner sidewall 2112 of the cup-shaped structure 211 is used for blocking the light emitted by the color conversion structure 221 from laterally propagating to the adjacent color conversion structure 221, so that the phenomenon of light crosstalk between the adjacent color conversion structures 221 is prevented, and the display effect is further improved.
3. A transparent encapsulation layer is formed over the color conversion layer. Fig. 14 is a schematic view of forming a transparent encapsulating layer on the color conversion layer, specifically, as shown in fig. 14, the transparent encapsulating layer 230 is disposed on the color conversion layer 220 and laminated by lamination or adhesion. The transparent encapsulation layer 230 may be transparent and have a water-proof and oxygen-proof barrier material, so as to prevent external water and oxygen from invading into the color conversion structure 221 to cause quantum dot damage.
And S303, attaching the LED array substrate to the color conversion cover to form the LED display panel.
Fig. 15 is a schematic view of the LED array substrate and the color conversion cover in accordance with an embodiment of the present invention, and the LED display panel after being attached is as shown in fig. 1, specifically, as shown in fig. 1 and 15, the LED array substrate 10 is aligned with the color conversion cover 20 formed in the first manner, each color conversion structure 221 is aligned with the corresponding reflective cup 111, the LED array substrate 10 is attached to the color conversion cover 20, and the LED array substrate is fixed by using an adhesive.
In this embodiment, after the LED array substrate 10 and the color conversion cover 20 are attached to each other, the cover plate 30 is attached to the color conversion cover 20, and the cover plate 30 covers the color conversion cover 20 and covers the side wall of the color conversion cover 20, as shown in fig. 1. On the one hand, apron 30 plays sealed protection's effect, avoids impurity such as external steam to get into inside the LED display panel to and avoid color conversion cover 20 to receive the harm that comes from the outside, and on the other hand, apron 30 also plays the effect of fixed color conversion cover 20. The cover plate 30 may be a molecular film material having high transparency.
Fig. 16 is a schematic view of another embodiment of the present invention, showing a color conversion cover attached to an LED array substrate, where the attached LED display panel is as shown in fig. 7, specifically, as shown in fig. 7 and 16, the LED array substrate 10 is aligned with the color conversion cover 20 formed in the second manner, each cup-shaped structure 211 corresponds to one reflective cup 111, the cup-shaped structure 211 is embedded in the reflective cup 111, and specifically, the transparent substrate 210 and the transparent package 130 have a certain gap to form a cavity for heat dissipation. By arranging the transparent substrate 210 in a form including a plurality of cup-shaped structures 211 recessed toward the transparent encapsulation 130, each cup-shaped structure 211 is embedded in the corresponding reflective cup 111 when the LED array substrate 10 and the color conversion cover 20 are assembled and attached, so that the alignment efficiency and the alignment accuracy of the LED array substrate 10 and the color conversion cover 20 are improved. In addition, by setting the included angle between the outer sidewall 2111 of the cup-shaped structure 211 and the direction perpendicular to the transparent substrate 210 to a certain inclination angle, when the LED array substrate 10 and the color conversion cover 20 are assembled and attached, the cup-shaped structure 211 is more easily embedded into the corresponding reflective cup 111, thereby further improving the alignment efficiency.
The embodiment of the utility model provides a still provide a display device, this display device includes if the utility model discloses the LED display panel that above-mentioned arbitrary embodiment improves has the same function and effect.
In the description herein, it is to be understood that the terms "upper," "lower," "left," "right," and the like are used in a descriptive sense and with reference to the illustrated orientation or positional relationship for purposes of descriptive convenience and simplicity of operation, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the present invention.
In the description herein, references to the description of "an embodiment," "an example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be appropriately combined to form other embodiments as will be appreciated by those skilled in the art.
The technical principle of the present invention is described above with reference to specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without any inventive effort, which would fall within the scope of the present invention.
Claims (10)
1. An LED display panel is characterized by comprising an LED array substrate and a color conversion cover covering the LED array substrate;
the LED array substrate comprises a circuit board, a plurality of LED light-emitting chips and a transparent packaging body;
a plurality of reflecting cups arranged in an array are formed on the circuit board;
the LED light-emitting chip is arranged in the reflecting cup;
the transparent packaging body is filled in the reflecting cup and covers the LED light-emitting chip;
a cavity for heat dissipation is formed between the surface of the transparent packaging body and the color conversion cover;
the color conversion cover comprises a plurality of color conversion structures which are arranged in an array and correspond to the LED luminous chips, and the color conversion structures are used for converting first color light emitted by the LED luminous chips into second color light.
2. The LED display panel of claim 1, wherein the sidewalls of the reflective cup are coated with a light blocking material for blocking light.
3. The LED display panel of claim 1, further comprising a laminate formed on the circuit board, wherein the laminate has a through hole corresponding to each of the LED chips, and the inner wall of the through hole and the surface of the circuit board define the reflective cup.
4. The LED display panel of any of claims 1-3, wherein the color conversion cap comprises a transparent substrate, a color conversion layer, and a transparent encapsulation layer;
the color conversion layer is formed on the transparent substrate and comprises a plurality of color conversion structures which correspond to the LED light-emitting chips and are arranged in an array manner;
the transparent packaging layer covers the color conversion layer.
5. The LED display panel of claim 4, wherein a light shielding structure is disposed between two adjacent color conversion structures.
6. The LED display panel of claim 4, wherein the transparent substrate comprises a plurality of cup-shaped structures recessed toward the transparent encapsulant, the color conversion structures being filled in the cup-shaped structures, the cup-shaped structures being embedded in the reflective cup.
7. The LED display panel of claim 6, wherein the outer sidewalls of the cup-shaped structures are angled more than 0 ° and less than 90 ° from a direction perpendicular to the transparent substrate.
8. The LED display panel of claim 6, wherein the inner sidewalls of the cup-shaped structure are coated with a light blocking material for blocking light.
9. The LED display panel of claim 4, wherein the LED light emitting chips are blue light chips or ultraviolet light chips for emitting blue light or ultraviolet light, and the color conversion layer comprises a red conversion structure, a green conversion structure and a blue conversion structure for converting the first color light emitted by the LED light emitting chips into red light, green light and blue light, respectively.
10. A display device comprising the LED display panel according to any one of claims 1 to 9.
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| CN202021107566.1U CN212461695U (en) | 2020-06-15 | 2020-06-15 | LED display panel and display device |
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| CN202021107566.1U CN212461695U (en) | 2020-06-15 | 2020-06-15 | LED display panel and display device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114187849A (en) * | 2021-12-09 | 2022-03-15 | 惠州华星光电显示有限公司 | LED display panel and display device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114187849A (en) * | 2021-12-09 | 2022-03-15 | 惠州华星光电显示有限公司 | LED display panel and display device |
| CN114187849B (en) * | 2021-12-09 | 2024-03-15 | 惠州华星光电显示有限公司 | LED display panel and display device |
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