CN216389361U - LED chip packaging structure and LED display device - Google Patents
LED chip packaging structure and LED display device Download PDFInfo
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- CN216389361U CN216389361U CN202122753610.7U CN202122753610U CN216389361U CN 216389361 U CN216389361 U CN 216389361U CN 202122753610 U CN202122753610 U CN 202122753610U CN 216389361 U CN216389361 U CN 216389361U
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Abstract
The utility model relates to the field of LED packaging, in particular to an LED chip packaging structure and an LED display device, wherein the packaging structure comprises a substrate, the substrate comprises two opposite surfaces, a first circuit and a second circuit are respectively arranged on the two opposite surfaces, and the first circuit and the second circuit are connected through a through hole on the substrate; the chip array is arranged on the substrate and comprises one or more blue light chips, a green light chip and a red light chip, and the red light chip comprises a light-emitting chip and a color conversion layer covered on the light-emitting chip; the packaging layer covers the chip array, light emitted by the light-emitting chip is converted through the color conversion layer to obtain red light, and the obtained red light brightness can meet the use requirement under the condition of the same design size as that of the blue light chip and the green light chip, so that a mixed light LED chip packaging body with a smaller size can be obtained; the display device has the advantages of good light emitting effect and low packaging cost, and can better meet application requirements.
Description
Technical Field
The utility model relates to the technical field of display, in particular to an LED chip packaging structure and an LED display device.
Background
A light emitting diode (abbreviated as LED) is a solid semiconductor light emitting device. The existing full-flip LED display device generally adopts a flip blue LED, a flip green LED and a flip red LED to obtain an excellent display effect, but the flip red LED is an AlInGaP quaternary light emitting system, the technology is not mature enough, the yield is low, and the cost of the flip red LED is very high.
SUMMERY OF THE UTILITY MODEL
In order to solve the above problems, the present invention provides an LED chip package structure and an LED display device, which have a simple structure, a reasonable design, and a good luminance.
The technical scheme adopted by the utility model is as follows:
an LED chip package structure comprising:
the circuit board comprises a substrate and a first circuit, wherein the substrate comprises two opposite surfaces, a first circuit and a second circuit are respectively arranged on the two opposite surfaces, and the first circuit is connected with the second circuit through a through hole on the substrate;
the chip array is arranged on the substrate and comprises one or more blue light chips, green light chips and red light chips, the red light chips comprise light emitting chips and color conversion layers covering the light emitting chips, and the color conversion layers are used for converting light emitted by the light emitting chips into red light;
and the packaging layer is covered on the chip array so as to package the chip array.
In some embodiments, the thickness of the color conversion layer on each side of the light emitting chip is the same as the thickness of the color conversion layer on the top surface of the light emitting chip.
In some embodiments, the distance between the light emitting chip and the blue light chip is greater than the distance between the blue light chip and the green light chip;
the distance between the light-emitting chip and the green chip is larger than the distance between the blue chip and the green chip.
In some embodiments, the light-emitting chip is an ultraviolet light-emitting chip, and the light-emitting wavelength of the ultraviolet light-emitting chip is 100-450 nm; or the light-emitting wavelength of the blue light chip is 450-470 nm.
In some embodiments, the color conversion layer is a fluorescent layer covering the surface of the light emitting chip, the fluorescent layer includes a yellow fluorescent glue layer and a red filter film layer, and the red filter film layer is farther from the light emitting chip than the yellow fluorescent glue layer, or the fluorescent layer includes a red fluorescent glue layer.
In some embodiments, the color conversion layer is a quantum dot layer covering the surface of the light emitting chip, and red quantum dots are disposed in the quantum dot layer.
In some embodiments, the red chip further comprises: and the heat insulation layer is arranged between the light emitting chip and the color conversion layer.
In some embodiments, the encapsulation layer is provided in a convex lens or planar shape.
In some embodiments, the blue chip is a blue flip chip; the green chip is a green flip chip; the light emitting chip is a flip light emitting chip.
The utility model also provides an LED display device, which uses any one of the LED chip packaging structures to form one or more pixel points, or uses any one of the LED chip packaging structures to form a backlight unit.
The utility model has the following beneficial effects:
1. the utility model provides an LED chip packaging structure, which comprises a substrate, a first circuit and a second circuit, wherein the substrate comprises two opposite surfaces, the two opposite surfaces are respectively provided with the first circuit and the second circuit, and the first circuit is connected with the second circuit through a through hole on the substrate; the chip array is arranged on the substrate and comprises one or more blue light chips, a green light chip and a red light chip, the red light chip comprises a light-emitting chip and a color conversion layer covering the light-emitting chip, and the color conversion layer is used for converting light emitted by the light-emitting chip into red light; the utility model converts light emitted by the light emitting chip through the color conversion layer to obtain red light, and obtains a low-cost red light chip which can be applied to the field of LED display, such as LED display screens and LCD (liquid crystal display) backlight sources;
2. the LED display device provided by the utility model has the advantages of low cost and good light-emitting effect, and can better meet the use requirement.
Drawings
Fig. 1 is a schematic structural diagram of an LED chip package structure according to an embodiment of the present invention;
FIG. 2 is a schematic top view of the present invention taken in front view as shown in FIG. 1;
fig. 3 is a schematic structural diagram of an LED chip package structure according to another embodiment of the utility model;
fig. 4 is a schematic top view of fig. 3 as a front view.
Description of reference numerals: 1. the LED chip comprises a substrate, 2 chip arrays, 21 blue chips, 22 green chips, 23 red chips, 231 light emitting chips, 232 color conversion layers and 3 packaging layers.
Detailed Description
The utility model will be further described with reference to the accompanying drawings.
As shown in fig. 1 and fig. 2, the LED chip package structure of the present embodiment includes a substrate 1, the substrate 1 includes two opposite surfaces, the two opposite surfaces are respectively provided with a first circuit and a second circuit, and the first circuit and the second circuit are connected through a through hole on the substrate; a plurality of chip arrays 2 are arranged on the substrate 1 at intervals, each chip array 2 includes a blue light chip 21, a green light chip 22 and a red light chip 23, each red light chip 23 includes a light emitting chip 231 and a color conversion layer 232 covering the light emitting chip 231, more specifically, each blue light chip 21 is a blue light LED chip, each green light chip 22 is a green light LED chip, in this embodiment, light emitted by the light emitting chip 231 is converted by the color conversion layer 232, red light is obtained, and a low-cost red light chip is obtained.
In one embodiment of the present application, the blue chip may be a blue-light-mounted chip or a blue-light flip chip; the green chip can be a green flip chip or a green flip chip; the light emitting chip may be a face-up light emitting chip or a flip light emitting chip.
In an embodiment of the present application, the light emitting chip 231 may be a blue chip, the light emitting wavelength of which is 450-470nm, and the color conversion layer 232 is a fluorescent layer that covers the surface of the light emitting chip 231 and can be excited by blue light, specifically, the fluorescent layer includes a yellow fluorescent glue layer and a red light filtering film layer, the red light filtering film layer is farther away from the light emitting chip 231 than the yellow fluorescent glue layer, in this embodiment, the blue chip excites the color conversion layer 232 to emit red light satisfying the brightness, specifically, the yellow fluorescent powder in the yellow fluorescent glue layer converts the blue light into white light, and then the red light filtering film layer converts the white light into red light.
In an embodiment of the present application, the light emitting chip 231 may be a blue chip, the light emitting wavelength of which is 450-470nm, and the color conversion layer 232 is a fluorescent layer covering the surface of the light emitting chip 231 and capable of being excited by blue light, and specifically, the fluorescent layer includes a red fluorescent glue layer. In this embodiment, the color conversion layer 232 is excited by the blue light chip to emit red light satisfying brightness, specifically, the red phosphor in the red phosphor layer converts the blue light into red light, and the structure design is simple and reasonable, and the light emitting effect is good. In this embodiment, the red phosphor layer includes K2SiF6Mn (KSF) red phosphor.
The fluorescent layer in one embodiment of the application can be arranged in a dispensing manner, and certainly, the fluorescent layer in the embodiment can also be arranged in a spraying manner, so that compared with the dispensing arrangement, the spraying manner needs a smaller space, and the arrangement of the whole packaging structure is convenient.
In an embodiment of the present application, when the light emitting chip 231 is a blue light chip, the color conversion layer 232 may be a quantum dot layer or other structure capable of converting blue light into red light, which is not limited herein.
In one embodiment of the present application, red quantum dots are disposed in the quantum dot layer, and the composition of the red quantum dots is InP, CdTe, perovskite, or the like.
In an embodiment of the present application, the light emitting chip 231 may be an ultraviolet light emitting chip, and the light emitting wavelength thereof is 100-450nm, which is different from the light emitting wavelength of a blue light chip, so as to adapt to the color conversion layer 232 with a shorter excitation wavelength. The color conversion layer 232 may be a quantum dot layer covering the surface of the light emitting chip 231, specifically, red quantum dots are disposed in the quantum dot layer, in this embodiment, the color conversion layer 232 is excited by the ultraviolet light emitting chip to emit red light satisfying brightness, and the color conversion layer has a simple and reasonable structural design and a good light emitting effect.
In an embodiment of the present application, when the light emitting chip 231 is an ultraviolet light emitting chip, the color conversion layer 232 may be a fluorescent layer capable of being excited by the ultraviolet light emitting chip to emit red light or other structures capable of converting ultraviolet light into red light, which is not limited herein.
In the above embodiment, the red light chip obtained by performing light conversion using the blue light chip or the ultraviolet light emitting chip has lower cost than a red light chip directly using quaternary AlInGaP.
In an embodiment of the present application, the red light chip may further include a thermal insulation layer disposed between the light emitting chip and the color conversion layer to avoid an influence of heat generated by the chip on the color conversion layer, for example, when the color conversion layer is a quantum dot layer, the thermal insulation layer may prevent the quantum dot from being quenched by heat generated after the chip emits light.
In this embodiment, the insulation layer may be a thermal insulation coating, a thermal insulation powder, or a thermal insulation glue.
In an embodiment of the present application, the LED chip package structure includes a substrate 1, a chip array 2 disposed on the substrate 1, and a package layer 3, where the package layer 3 covers the chip array 2 and is connected to the substrate 1 to package the chip array 2, and specifically, the package layer 3 may be set to a convex lens shape to condense light emitted from the chip array 2, thereby achieving a better optical effect. The encapsulation layer 3 may be a transparent thermosetting material or a translucent thermosetting material, and the thermosetting material may be cured after covering the chip array 2, so that the encapsulation layer 3 fills the chip array 2 and covers the chip array 2, thereby fixing the chip array 2. In other embodiments of the present application, the package layer 3 may be a cover body in a convex lens shape, and the cover body is directly covered on the chip array, so that the structure is simple and the manufacturing process is simplified. In this embodiment, the color conversion layer 232 can be protected by the encapsulation layer 3, and the chip array 2 can be completely encapsulated or covered to obtain a better optical effect.
In other embodiments of the present application, the encapsulation layer 3 may be set to a planar shape, so as to make the volume of the package structure smaller.
In an embodiment of the present application, the thickness of the color conversion layer 232 on each side surface of the light emitting chip 231 is the same as the thickness of the color conversion layer 232 on the top surface of the light emitting chip 231, and with such an arrangement, light emitted from each angle of the light emitting chip 231 can all pass through the color conversion layer 231 with the same thickness, so that the obtained red light chip 23 has good color temperature consistency, which is beneficial to making the final LED chip package structure have good light emitting effect.
In one embodiment of the present application, the distance between the light emitting chip 23 and the blue light chip 21 is greater than the distance between the blue light chip 21 and the green light chip 22, and the distance between the light emitting chip 23 and the green light chip 22 is greater than the distance between the blue light chip 21 and the green light chip 22.
Fig. 3 and 4 are schematic structural views of an LED chip package structure according to another embodiment of the present invention, and fig. 3 packages a plurality of blue chips 21, green chips 22, and red chips 23. For details that are not disclosed in this embodiment, please refer to the above-mentioned embodiment of the LED chip package structure.
In an embodiment of the present application, an LED display device is provided, where the LED display device may use any one of the LED chip package structures described above to form one or more pixels, or use any one of the LED chip package structures described above to form a backlight unit.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. An LED chip package structure, comprising:
the circuit board comprises a substrate and a first circuit, wherein the substrate comprises two opposite surfaces, a first circuit and a second circuit are respectively arranged on the two opposite surfaces, and the first circuit is connected with the second circuit through a through hole on the substrate;
the chip array is arranged on the substrate and comprises one or more blue light chips, green light chips and red light chips, the red light chips comprise light emitting chips and color conversion layers covering the light emitting chips, and the color conversion layers are used for converting light emitted by the light emitting chips into red light;
and the packaging layer is covered on the chip array so as to package the chip array.
2. The LED chip package structure of claim 1, wherein the thickness of the color conversion layer on each side surface of the light emitting chip is the same as the thickness of the color conversion layer on the top surface of the light emitting chip.
3. The LED chip package structure according to claim 1,
the distance between the light-emitting chip and the blue light chip is greater than the distance between the blue light chip and the green light chip;
the distance between the light-emitting chip and the green chip is larger than the distance between the blue chip and the green chip.
4. The LED chip package structure of claim 1, wherein the light emitting chip is an ultraviolet light emitting chip having a light emitting wavelength of 100-450 nm; or the light-emitting chip is a blue light chip, and the light-emitting wavelength of the blue light chip is 450-470 nm.
5. The LED chip package structure according to claim 1,
the color conversion layer is a fluorescent layer covering the surface of the light emitting chip, the fluorescent layer comprises a yellow fluorescent glue layer and a red light filtering film layer, and the red light filtering film layer is farther away from the light emitting chip than the yellow fluorescent glue layer, or the fluorescent layer comprises a red fluorescent glue layer.
6. The LED chip package structure of claim 1, wherein the color conversion layer is a quantum dot layer covering the surface of the light emitting chip, and red quantum dots are disposed in the quantum dot layer.
7. The LED chip package structure of claim 1, wherein the red chip further comprises:
and the heat insulation layer is arranged between the light emitting chip and the color conversion layer.
8. The LED chip package structure of claim 1, wherein the encapsulation layer is provided in a convex lens or planar shape.
9. The LED chip package structure according to claim 1, wherein the blue chip is a blue flip chip;
the green chip is a green flip chip;
the light emitting chip is a flip light emitting chip.
10. An LED display device, wherein the LED chip package structure of any one of claims 1 to 9 is applied to form one or more pixels, or the LED chip package structure of any one of claims 1 to 9 is applied to form a backlight unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122753610.7U CN216389361U (en) | 2021-11-10 | 2021-11-10 | LED chip packaging structure and LED display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122753610.7U CN216389361U (en) | 2021-11-10 | 2021-11-10 | LED chip packaging structure and LED display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216389361U true CN216389361U (en) | 2022-04-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122753610.7U Active CN216389361U (en) | 2021-11-10 | 2021-11-10 | LED chip packaging structure and LED display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216389361U (en) |
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2021
- 2021-11-10 CN CN202122753610.7U patent/CN216389361U/en active Active
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