CN216648335U

CN216648335U - Inserting sheet cleaning and guiding sheet making-down integrated machine

Info

Publication number: CN216648335U
Application number: CN202122250699.5U
Authority: CN
Inventors: 连锦坤; 申朝锋; 胡滇建; 平飞林
Original assignee: Longji Leye Photovoltaic Technology Xixian New Area Co ltd
Current assignee: Longji Leye Photovoltaic Technology Xixian New Area Co ltd
Priority date: 2021-09-16
Filing date: 2021-09-16
Publication date: 2022-05-31
Anticipated expiration: 2031-09-16

Abstract

The application discloses inserted sheet washs guide card making herbs into wool all-in-one includes: the inserting unit, the cleaning unit, the guide unit and the texturing unit are arranged in sequence; the inserting piece unit is used for inserting the silicon wafer to be cleaned and subjected to texturing into the flower basket; the cleaning unit is used for cleaning the silicon wafer; the guide vane unit is used for replacing the flower basket for the cleaned silicon wafer; and the texture surface making unit is used for making texture surfaces of the cleaned silicon wafers with the flower baskets replaced. The scheme can reduce the production cost and the use cost of the equipment.

Description

Inserted sheet washs and leads piece system fine hair all-in-one

Technical Field

The utility model relates to the technical field of photovoltaics, in particular to an insert cleaning and guide texturing all-in-one machine.

Background

With the increasing shortage of fossil energy and the enhancement of environmental awareness, photovoltaic power generation technology is becoming more and more widely applied as an environment-friendly technology capable of directly converting sunlight into electric energy.

The current manufacturing process flow of the solar cell is generally the procedures of silicon material → crystal pulling → slicing → degumming → cleaning → sorting, packaging → wool making → electrode preparation and the like. In the cleaning and texturing processes, partial functions of the groove bodies are overlapped, and the cleaning and texturing are divided into two independent systems, so that the production cost and the use cost are increased.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned defects or shortcomings in the prior art, it is desirable to provide an integrated insert cleaning, guide and texturing machine for reducing the production cost and the use cost of equipment.

The utility model provides an insert cleaning and guide texturing integrated machine, which comprises: the inserting unit, the cleaning unit, the guide unit and the texturing unit are arranged in sequence;

the inserting piece unit is used for inserting the silicon wafer to be cleaned and subjected to texturing into the flower basket;

the cleaning unit comprises a plurality of first groove bodies which are sequentially arranged and is used for cleaning the silicon wafer;

the guide unit is used for replacing a basket for the cleaned silicon wafers and comprises a first base, a first silicon wafer conveying module is arranged on the first base, a first basket lifting mechanism is arranged at one end of the first silicon wafer conveying module along the silicon wafer conveying direction of the first silicon wafer conveying module and used for driving the basket placed on the first silicon wafer conveying module to move in the vertical direction, a second basket lifting mechanism is arranged at the other end of the first silicon wafer conveying module and used for driving the basket placed on the second silicon wafer conveying module to move in the vertical direction; a sheet pushing mechanism is arranged on one side, away from the first silicon wafer conveying module, of the first basket lifting mechanism and connected to the first base, and is provided with a sheet pushing piece which can extend to the position above the first basket lifting mechanism along the horizontal direction and is used for pushing silicon wafers in a basket placed on the first basket lifting mechanism to the first silicon wafer conveying module;

and the texture surface making unit comprises a plurality of second groove bodies which are sequentially arranged and is used for making texture surfaces on the silicon wafers which are cleaned and replaced by the flower basket.

As an implementation manner, the first basket lifting mechanism and the second basket lifting mechanism each include a basket support, and the height of the basket support on the first base is adjustable along the vertical direction.

As an implementation mode, the guide vane unit further comprises a subfissure detection module, and the subfissure detection module is used for performing subfissure detection on the cleaned silicon wafer.

As an implementation manner, a first mounting frame is fixedly connected to the first base, and the first mounting frame is provided with a first mounting part located above the first silicon wafer conveying module and a second mounting part located below the first silicon wafer conveying module;

the subfissure detection module comprises an infrared light emitter and an infrared camera, wherein one of the infrared light emitter and the infrared camera is fixedly connected with the first installation part, and the other one of the infrared light emitter and the infrared camera is fixedly connected with the second installation part.

As an implementation manner, a second mounting frame is fixedly connected to the first base, the second mounting frame is provided with a third mounting part located above the first silicon wafer conveying module, the third mounting part is fixedly connected with an air knife, and an air outlet of the air knife faces the first silicon wafer conveying module;

in the silicon wafer conveying direction, the air knife is positioned between the first basket lifting mechanism and the subfissure detection module.

As an implementation manner, a partition is arranged at the joint of the guide sheet unit and the texturing unit, and the partition is used for partitioning the guide sheet unit and the texturing unit on two opposite sides of the partition;

the partition is provided with a channel, and a butt joint groove is arranged in the channel in a matching and penetrating manner; the butt joint groove is provided with a first part and a second part which are communicated with each other, the first part and the guide piece unit are positioned on the same side of the partition, and the second part and the texturing unit are positioned on the other side of the partition; the first part and the second part are both provided with notches, and at least one notch is movably connected with a notch cover; and a butt joint conveying mechanism is arranged in the butt joint groove.

As an implementation manner, each notch is respectively arranged at the top of the first part and the second part, and the notch is movably connected with the slot cover.

In a practical manner, the docking transfer mechanism comprises a belt conveyor which extends from the first section to the second section in its own conveying direction.

As an achievable mode, the plurality of sequentially arranged first tank bodies are a prewashing tank, a first alkali washing tank, a second alkali washing tank, a third alkali washing tank, a fourth alkali washing tank, a first rinsing tank, a second rinsing tank, a third rinsing tank, a fourth rinsing tank, a fifth rinsing tank and a sixth rinsing tank in sequence; and the sixth rinsing tank and the third rinsing tank are connected in a downward overflow mode in sequence.

The second bath bodies arranged in sequence are a first pickling tank, a seventh rinsing tank, a fifth alkaline washing tank, a sixth alkaline washing tank, a second acid washing tank, a first prefabricated wool groove, a second prefabricated wool groove, an eighth rinsing tank, a first wool making tank, a second wool making tank, a ninth rinsing tank, a third pickling tank, a fourth pickling tank, a tenth rinsing tank, an eleventh rinsing tank and a drying tank in sequence.

As an achievable mode, the cleaning unit further comprises a first manipulator, and the first manipulator is used for grabbing a flower basket for holding the silicon wafers to be cleaned and subjected to texturing, and sequentially passes through the pre-washing tank to the sixth rinsing tank so as to clean the silicon wafers to be cleaned and subjected to texturing; and/or the presence of a gas in the gas,

the texturing unit further comprises a second mechanical arm, the second mechanical arm is used for grabbing a basket of flowers containing the silicon wafers to be textured, and the baskets of flowers are sequentially arranged in the first pickling tank to the drying tank so as to be textured by the silicon wafers.

As a realizable mode, the inserting piece unit comprises a second machine base, a second silicon wafer conveying module is arranged on the second machine base, the silicon wafer conveying direction of the second silicon wafer conveying module is followed, one end of the second silicon wafer conveying module is provided with a water tank, the other end of the second silicon wafer conveying module is provided with a third basket lifting mechanism, the water tank is fixedly connected with the second machine base, and the third basket lifting mechanism is arranged on the second machine base and is adjustable in height along the vertical direction.

As an achievable mode, the automatic cleaning device further comprises a first basket returning track and a second basket returning track, the first basket returning track is at least arranged on one side of the texturing unit, the second basket returning track is at least arranged on one side of the cleaning unit, a first AGV transfer trolley is arranged on the first basket returning track, a second AGV transfer trolley is arranged on the second basket returning track, the first AGV transfer trolley is used for conveying the empty baskets from the blanking stations of the guide piece unit to the feeding stations of the insertion piece unit along the first basket returning track, and the second AGV transfer trolley is used for conveying the empty baskets from the blanking stations of the texturing unit to the feeding stations of the guide piece unit along the second basket returning track.

The above-mentioned scheme that this application provided, owing to link together the inserted sheet unit, the cleaning unit, lead piece unit and texturing unit order, the silicon chip is after the cleaning unit washs, the silicon chip is clean, it directly sends to the texturing unit through leading the piece unit after changing the basket of flowers and carries out the texturing, can not wash once more before the texturing, consequently, avoided arranging different factories or workshops because of cleaning unit and texturing unit branch, the silicon chip need sort the packing after the cleaning unit washs, then transport to the texturing unit, and unpack, owing to in-process in transportation and unpacking, the silicon chip can be polluted, consequently, need wash once more the silicon chip before carrying out the texturing, also promptly, this application scheme can save the abluent cell body and relevant part once more before the texturing, consequently, equipment manufacturing cost and use cost have been reduced. In addition, when the insert cleaning and guide piece texturing all-in-one machine is used, only one set of sewage disposal system is needed, and compared with the case that the cleaning unit and the texturing unit are respectively arranged in different factories or workshops, two sets of sewage disposal systems need to be built, the factory construction cost and the sewage disposal (use) cost are reduced. In addition, the flower basket is replaced through the guide vane unit, and impurities introduced into a subsequent wool making process by the flower basket used in the cleaning unit are avoided.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:

FIG. 1 is a top view of an integrated insert cleaning and guide texturing machine provided by an embodiment of the present invention;

FIG. 2 is a schematic view of a guide vane unit according to an embodiment of the present invention;

FIG. 3 is a schematic view of a blade unit according to an embodiment of the present invention;

FIG. 4 is a schematic view of a septum provided in accordance with an embodiment of the present invention;

FIG. 5 is a schematic view of an open state of one of the covers of the docking bay according to an embodiment of the present invention;

fig. 6 is a schematic view of an assembled compartment and docking bay according to an embodiment of the present invention.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and are not limiting of the utility model. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.

As shown in fig. 1 to 6, an insert cleaning and guide texturing machine provided in an embodiment of the present invention includes: the device comprises an inserting sheet unit 1, a cleaning unit 2, a guide sheet unit 6 and a texturing unit 3 which are arranged in sequence;

the inserting piece unit 1 is used for inserting a silicon wafer 8 to be cleaned and subjected to texturing into the flower basket 9; as will be understood by those skilled in the art, the inserting unit 1 has a water tank 107 and a scooping mechanism or a feeding mechanism 108, the silicon rod is sliced into the silicon wafer 8, the silicon wafer 8 enters the water tank 107 of the inserting unit 1 to primarily remove dust attached to the surface of the silicon wafer 8 during slicing, and the scooping mechanism or the feeding mechanism 108 scoops the silicon wafer 8 out of the water tank 107 to be inserted into the basket 9 for subsequent processes, such as cleaning, subfissure detection, wool making, etc. The inserting sheet unit 1 can be an existing device, and the structure of the inserting sheet unit is not limited uniquely.

The cleaning unit 2 comprises a plurality of first groove bodies which are arranged in sequence and is used for cleaning the silicon wafer 8; the silicon chip 8 is inserted into the flower basket 9 and is conveyed to the cleaning unit 2, and the number of the first groove bodies and the types of cleaning liquid arranged in the first groove bodies can be adjusted according to the process requirements. The silicon wafers 8 can be sequentially placed into the first tank bodies along with the flower basket 9 in a manual or automatic manner to clean the silicon wafers 8.

The guide vane unit 6 is used for replacing the flower basket 9 for the cleaned silicon wafer 8; the guide unit 6 only needs to replace the baskets 9 with silicon wafers 8, for example, but not limited thereto, the guide unit includes a first base 611, the first base 611 may be, but not limited to, a welded frame structure, the first base 611 is provided with a first silicon wafer conveying module 601, the first silicon wafer conveying module 601 may be a belt conveyor, along the silicon wafer conveying direction of the first silicon wafer conveying module 601, one end of the first silicon wafer conveying module 601 is provided with a first basket lifting mechanism, the first basket lifting mechanism is used to drive the baskets 9 placed thereon to move in the vertical direction, and the other end is provided with a second basket lifting mechanism, the second basket lifting mechanism is used to drive the baskets 9 placed thereon to move in the vertical direction; one side of the first basket of flowers hoist mechanism that deviates from the first silicon chip transport module 601 is provided with a push-out mechanism 610, the push-out mechanism 610 is connected to the first chassis 611, the push-out mechanism 610 has a push-out piece 6101 which can stretch to the top of the first basket of flowers hoist mechanism along the horizontal direction, the push-out piece 6101 is used for pushing the silicon chip 8 in the basket of flowers 9 placed on the first basket of flowers hoist mechanism to the first silicon chip transport module 601. The pushing component 6101 is, for example and without limitation, a plate-shaped component, and can be driven by a pneumatic cylinder, an electric push rod, or the like to extend above the first basket lifting mechanism in the horizontal direction, so as to push the silicon wafers 8 in the basket 9 to the first silicon wafer conveying module 601.

And the texturing unit 3 comprises a plurality of second groove bodies which are sequentially arranged and is used for texturing the silicon wafer 8 which is cleaned and is used for replacing the flower basket 9. After the cleaning, the silicon wafer 8 is conveyed to the texturing unit 3 to be textured. Generally, the texturing unit 3 includes a plurality of second tank bodies, and the second tank bodies include a cleaning tank (rinsing) and a texturing tank, and the number of the cleaning tank and the texturing tank, the type of cleaning solution disposed in the cleaning tank, and the type of texturing solution in the texturing tank can be adjusted according to the process requirements. Generally, the silicon wafer 8 is sequentially placed into each second tank of the texturing unit 3 along with the flower basket 9 in an automated manner to perform a texturing process on the silicon wafer 8.

According to the scheme provided by the application, as the inserting sheet unit 1, the cleaning unit 2, the guiding sheet unit 6 and the texturing unit 3 are sequentially connected together, after the silicon wafer 8 is cleaned by the cleaning unit 2, the silicon wafer 8 is clean, after the flower basket 9 is replaced by the guide sheet unit 6, the flower basket is directly sent to the wool making unit 3 for wool making, and the flower basket can be cleaned again before the wool making, therefore, the silicon wafers 8 are prevented from being sorted and packaged after being cleaned by the cleaning unit 2 and then being transported to the texturing unit 3 and unpacked because the cleaning unit 2 and the texturing unit 3 are respectively arranged in different factories or workshops, because the silicon wafer 8 may be contaminated during transportation and unpacking, the silicon wafer 8 needs to be cleaned again before texturing, that is, the tank body and related parts thereof which are cleaned again before texturing can be omitted in the scheme of the application, so that the production cost and the use cost of the equipment are reduced. In addition, when the insert cleaning and guide piece texturing all-in-one machine is used, only one set of sewage disposal system is needed, compared with the case that the cleaning unit 2 and the texturing unit 3 are respectively arranged in different factories or workshops, and two sets of sewage disposal systems need to be built, the factory construction cost and the sewage disposal (use) cost are reduced. In addition, the flower basket 9 is replaced through the guide vane unit, so that impurities are prevented from being introduced into the subsequent texturing process by the flower basket 9 used in the cleaning unit.

In an implementation manner, each of the first and second basket lifting mechanisms includes a basket support 608, the basket support 608 may be a flat plate, and the height of the basket support 608 on the first chassis 611 is adjustable along a vertical direction. For example, a pneumatic cylinder 609, a hydraulic cylinder, an electric push rod, a screw transmission mechanism, or the like is installed below the basket support 608 to drive the height adjustment of the basket support 608 in the vertical direction on the first chassis 611.

When the silicon wafer 8 is replaced by the basket of flowers 9, the first basket of flowers lifting mechanism drives the basket of flowers 9 to ascend or descend by the storage height of a silicon wafer 8, the sheet pushing piece 6101 of the sheet pushing mechanism 610 horizontally extends into the basket of flowers 9 to push the silicon wafer 8 to the first silicon wafer conveying module 601, according to the rule, the silicon wafer 8 in the basket of flowers 9 is pushed to the first silicon wafer conveying module 601, the first silicon wafer conveying module 601 conveys the silicon wafer 8 to the basket of flowers 9 placed on the second basket of flowers lifting mechanism, the second basket of flowers lifting mechanism drives the basket of flowers 9 to ascend or descend by the storage height of a silicon wafer 8, the first silicon wafer conveying module 601 inserts the silicon wafer 8 into the basket of flowers 9 on the second basket of flowers lifting mechanism to complete the replacement of the basket of flowers 9 of the silicon wafer 8.

As an achievable way, in order to improve the yield of the product and reduce the breakage rate in the manufacturing process, in the early stage of the texturing process, that is, before the texturing of the silicon wafer 8, the subfissure detection module is further disposed in the guide unit 6, and the subfissure detection module is configured to perform subfissure detection on the cleaned silicon wafer 8.

As an implementation manner, a first mounting rack 605 is fixedly connected to the first machine seat 611, and the first mounting rack 605 has a first mounting part located above the first silicon wafer conveying module 601 and a second mounting part located below the first silicon wafer conveying module 601;

the subfissure detection module comprises an infrared light emitter 603 and an infrared camera 604, one of the infrared light emitter 603 and the infrared camera 604 is fixedly connected to the first installation part, and the other is fixedly connected to the second installation part. In this example, the infrared camera 604 is fixedly connected to the first mounting portion, and the infrared light emitter 605 is fixedly connected to the second mounting portion.

The infrared light emitter 603 emits infrared light to irradiate the silicon wafer 8 to be subjected to subfissure detection, the infrared camera 604 shoots the silicon wafer 8 to be subjected to subfissure detection, and whether the silicon wafer 8 has the defects of subfissure and the like is judged according to a shot picture.

As an achievable way, in order to improve the accuracy of subfissure detection, it is necessary to ensure that the silicon wafer 8 is relatively dry during detection, and at the very least, a large amount of water cannot remain on the silicon wafer 8; then, a second mounting rack 607 is fixedly connected to the first base 611, the second mounting rack 607 has a third mounting portion located above the first silicon wafer conveying module 601, the third mounting portion is fixedly connected to an air knife 606, and an air outlet of the air knife 606 faces the first silicon wafer conveying module 601;

in the silicon wafer conveying direction, the air knife 606 is located between the first basket lifting mechanism and the subfissure detection module; that is, the silicon wafer 8 passes through the air knife 606, is dried by the air knife 606, and is then sent to the position of the subfissure detection module for subfissure detection. The air knife 606 is used to blow the silicon wafer 8. In order to improve the drying efficiency, the air knife 606 may blow hot air toward the silicon wafer 8.

In an achievable mode, the parts in the cleaning unit 2, such as the first grooves and the guide sheet unit 6, are made of steel, and the parts in the wool making unit 3, such as the second grooves, are made of PP materials; when the texturing process is performed in the texturing unit 3, volatile acid such as hydrochloric acid is used, the volatile acid is volatilized into the air and enters the cleaning unit 2 and the sheet guide unit 6, damage is caused to the cleaning unit 2 and the sheet guide unit 6, in order to prevent or reduce the damage, a partition 5 is arranged at the joint of the sheet guide unit 6 and the texturing unit 3, and the partition 5 is used for partitioning the sheet guide unit 6 and the texturing unit 3 at two sides of the partition 5; the partition 5 is, for example, but not limited to, a partition wall that divides a workshop in which the integrated insert cleaning and guide card-making machine is installed into two independent working spaces and prevents acid gas from flowing in the different working spaces.

On the basis of preventing acid gas from flowing in different working spaces, and ensuring that the silicon wafer 8 can be conveyed from the wafer guide unit 6 to the texturing unit 3 for the texturing process, the partition 5 is provided with a channel 51, a butt-joint groove 602 is arranged in the channel 51 in a matched and penetrated mode, the butt-joint groove 602 is arranged in the channel in the matched and penetrated mode, so that acid mist can be prevented from diffusing through the gap due to the gap between the butt-joint groove 602 and the channel 51, the butt-joint groove 602 is provided with a first part 6021 and a second part 6022 which are connected with each other, the first part 6021 is positioned on the same side of the partition 5 as the wafer guide unit 6, and the second part 6022 is positioned on the other side of the partition 5 as the texturing unit 3; the first part 6021 and the second part 6022 are both provided with notches 6023, and at least one notch 6023 is movably connected with a groove cover 6024; a docking conveying mechanism is arranged in the docking groove 602. In operation, the cleaned silicon wafer 8 is transferred from the first part 6021 to the second part 6022 by the docking transfer mechanism.

In a practical way, each of the slots 6023 is respectively arranged on the top of the first part 6021 and the second part 6022, the slot 6023 is arranged on the top of the first part 6021 and the second part 6022 for conveniently taking and placing the flower basket 9, and the slot cover 6024 is movably connected at each of the slots 6023 to improve the acid gas isolation effect.

When it is desired to transfer a silicon wafer 8, the lid 6024 of the notch 6023 of the first part 6021 of the docking bay 602 is opened, and the basket 9 holding the silicon wafer 8 is placed from the notch 6023 of the first part 6021 onto a docking transfer mechanism, such as, but not limited to, a belt conveyor, within the docking bay 602 and covered with the lid 6024; the basket 9 containing the silicon wafers 8 is transferred to the second part 6022 by the docking transfer mechanism, and after the basket is transferred to the position, the cover 6024 of the second part 6022 of the docking bay 602 is opened, and the basket 9 containing the silicon wafers 8 is taken out of the second part 6022 of the docking bay 602 and covered with the cover 6024. With this structure, during the process of putting the flower basket 9 containing the silicon wafers 8 into the docking tank 602 or taking the flower basket 9 out of the docking tank 602, a tank cover 6024 covers the top notch 6023 of the docking tank 602, i.e., the flow of most of the acid gas between the cleaning unit 2 and the texturing unit 3 through the docking tank 602 can be prevented or at least blocked; in addition, during the process that the basket 9 for holding the silicon wafers 8 is transported in the docking well 602, both the well covers 6024 on the top well part 6023 of the docking well 602 are covered, and therefore, the acid gas cannot flow (diffuse) between the guide piece unit 6 and the texturing unit 3 through the docking well 602 at this time.

As an implementable manner, the butt-joint conveying mechanism comprises a belt conveyor, which is known to those skilled in the art to generally comprise a drive roller, a driven roller and a belt connected to the drive roller and the driven roller. The belt conveyor extends in its own conveying direction from the first part 6021 to the second part 6022. When it is desired to transfer a silicon wafer 8, the tank cover 6024 of the notch 6023 of the first part 6021 of the docking tank 602 is opened, the basket 9 containing the silicon wafer 8 is put into the belt conveyor in the docking tank 602 from the notch 6023 of the first part 6021 and covered with the tank cover 6024, the basket 9 containing the silicon wafer 8 is transferred to the second part 6022 by the belt conveyor, and after the transfer to a place, the tank cover 6024 of the second part 6022 of the docking tank 602 is opened, the basket 9 containing the silicon wafer 8 is taken out of the second part 6022 of the docking tank 602 and covered with the tank cover 6024.

As a realizable mode, the plurality of sequentially arranged first tank bodies are a prewash tank 201, a first alkaline washing tank 202, a second alkaline washing tank 203, a third alkaline washing tank 204, a fourth alkaline washing tank 205, a first rinse tank 206, a second rinse tank 207, a third rinse tank 208, a fourth rinse tank 209, a fifth rinse tank 210 and a sixth rinse tank 211 in sequence; and is connected in sequence from the sixth rinse tank 211 to the third rinse tank 208 in an overflow manner. The term "overflow-down connection" as used herein means that the liquid in the sixth rinse tank 211 may overflow to the fifth rinse tank 210, the liquid in the fifth rinse tank 210 may overflow to the fourth rinse tank 209, and the liquid in the fourth rinse tank 209 may overflow to the third rinse tank 208.

Generally, the working medium of the prewash tank 201 may be pure water; working media of the first alkaline washing tank 202, the second alkaline washing tank 203, the third alkaline washing tank 204 and the fourth alkaline washing tank 205 can be sodium hydroxide solutions, wherein the first alkaline washing tank 202 can comprise two tank bodies 2021 which are connected in parallel according to the requirement of capacity; working media of the first rinsing tank 206 and the second rinsing tank 207 can be pure water and hydrogen peroxide; the working medium in each of the third rinse tank 208, the fourth rinse tank 209, the fifth rinse tank 210, and the sixth rinse tank 211 may be pure water.

In order to improve the cleaning effect, ultrasonic generators are arranged in at least the prewash tank 201, the first alkaline washing tank 202, the second alkaline washing tank 203, the third alkaline washing tank 204, the fourth alkaline washing tank 205, the third rinsing tank 208, the fourth rinsing tank 209, the fifth rinsing tank 210 and the sixth rinsing tank 211 to perform ultrasonic cleaning.

In a practical manner, the plurality of second tank bodies arranged in sequence are a first pickling tank 301, a seventh rinsing tank 302, a fifth alkaline washing tank 303, a sixth alkaline washing tank 304, a second acid washing tank 305, a first pre-texturing tank 306, a second pre-texturing tank 307, an eighth rinsing tank 308, a first texturing tank 309, a second texturing tank 310, a ninth rinsing tank 311, a third pickling tank 312, a fourth pickling tank 313, a tenth rinsing tank 314, an eleventh rinsing tank 315 and a drying tank 316.

Generally, the working medium of the first pickling tank 301 may be hydrochloric acid; the working medium of the seventh rinse tank 302 may be deionized water; working media of the fifth alkali washing tank 303 and the sixth alkali washing tank 304 can be sodium hydroxide solution and hydrogen peroxide or SDR; the working medium of the second acid washing tank 305 can be hydrochloric acid and ozone; the working medium of the first prefabricated woolen groove 306 and the second prefabricated woolen groove 307 can be KOH + APD (absolute ethyl alcohol or isopropanol); the working medium of the eighth rinsing tank 308 can be deionized water; the working medium of the first texturing groove 309 and the second texturing groove 310 can be KOH + APD (absolute ethyl alcohol or isopropanol); the working medium of the ninth rinsing tank 311 can be deionized water; the working medium of the third pickling tank 312 can be hydrochloric acid and ozone; the working medium of the fourth pickling tank 313 can be hydrochloric acid and hydrofluoric acid; the working medium of the tenth rinse tank 314 may be deionized water; the working medium of the eleventh rinsing tank 315 may be hot water; the drying slots 316 can be provided in a plurality according to actual needs, in this example, five drying slots 316 are provided, and the working medium in each drying slot 316 can be hot air or hot nitrogen.

As a practical way, the cleaning unit 2 further includes a first manipulator, the number of the first manipulators can be determined according to actual needs, the first manipulator can be arranged at a fixed position, and can be provided with a walking mechanism to move among different troughs; the first manipulator is used for grabbing a flower basket for containing the silicon wafers to be cleaned and subjected to texturing, and the flower basket sequentially passes through the pre-washing tank 201 to the sixth rinsing tank 211 so as to clean the silicon wafers to be cleaned and subjected to texturing; and/or the presence of a gas in the gas,

the texturing unit 3 further comprises second mechanical arms, the number of the second mechanical arms can be determined according to actual needs, the second mechanical arms can be arranged at fixed positions and can be provided with traveling mechanisms to move among different grooves; the second manipulator is used for grabbing the baskets containing the silicon wafers to be subjected to texturing, and sequentially passes through the first pickling tank 301 to the drying tank 316 so as to be subjected to texturing on the silicon wafers to be subjected to texturing.

In an implementation manner, the blade unit 1 includes a second base 106, the second base 106 is, for example and without limitation, a welded frame structure, the second base 106 is provided with a second silicon wafer conveying module 101, and the second silicon wafer conveying module 101 is, for example and without limitation, a belt conveyor. Along the silicon wafer conveying direction of the second silicon wafer conveying module 101, one end of the second silicon wafer conveying module 101 is provided with a water tank 107, the other end of the second silicon wafer conveying module 101 is provided with a third basket lifting mechanism 105, the water tank 107 is fixedly connected with the second machine base 106, and the third basket lifting mechanism 105 is arranged on the second machine base 106 and is adjustable in height along the vertical direction.

When inserting the wafer, can be through setting up the confession piece mechanism 108 in basin 107, provide silicon chip 8 on the band conveyer as second silicon chip transport module 101, just under the visual angle to fig. 3, carry the module 101 through the second silicon chip and carry silicon chip 8 from a left side to the right side, and insert in the basket of flowers 9, every inserts a slice silicon chip 8 back in the basket of flowers 9, third basket of flowers hoist mechanism 105 drive basket of flowers 9 is on vertical direction, upwards or move certain distance downwards, so that insert next slice silicon chip 8 into basket of flowers 9. The distance is determined according to the distance between two adjacent slots for placing the silicon wafers 8 in the flower basket 9. The third basket lifting mechanism 105 is, for example, but not limited to, a mechanical jaw, as long as it can carry the basket 9 to move in the vertical direction. The third basket lifting mechanism 105 is vertically adjustable on the second base 106, and may be implemented by a screw transmission mechanism, a pneumatic cylinder, a hydraulic cylinder, or an electric push rod.

As an implementation manner, in order to realize the automation of the empty basket returning, the insert cleaning and guide piece texturing machine further includes a first basket returning track 4 and a second basket returning track 7, the first basket returning track 4 is at least arranged on one side of the texturing unit 3, the second basket returning track 7 is at least arranged on one side of the cleaning unit 2, the first basket returning track 4 is provided with a first AGV transfer trolley, the second basket returning track 7 is provided with a second AGV transfer trolley, the first AGV transfer trolley is used for conveying the empty basket 9 from the blanking station of the guide piece unit 6 to the feeding station of the insert unit 1 along the first basket returning track 4, and the second AGV transfer trolley is used for conveying the empty basket 9 from the blanking station of the texturing unit 3 to the feeding station of the guide piece unit 6 along the second basket returning track 7. The blanking station of the texturing unit 3 can be, but is not limited to, the position where the silicon wafer 8 is taken out from the flower basket 9 after texturing is finished; the loading station of the tab unit 1 can be understood, without limitation, as a location for placing an empty flower basket 7. The blanking station of the guide unit 6 can be understood as a position for taking out the silicon wafer 8 from the basket 9, and the loading station of the guide unit 6 can be understood as a position for reinserting the silicon wafer 8 into the basket 9.

It will be understood that any orientation or positional relationship indicated above with respect to the terms "central," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc., is based on the orientation or positional relationship shown in the drawings and is for convenience in describing and simplifying the utility model, and does not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and is therefore not to be considered limiting of the utility model. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by those skilled in the art that the scope of the utility model herein disclosed is not limited to the particular combination of features described above, but also encompasses other arrangements formed by any combination of features described above or equivalents thereof without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.

Claims

1. The utility model provides an inserted sheet washs and leads piece system fine hair all-in-one which characterized in that includes: the inserting unit, the cleaning unit, the guide unit and the texturing unit are arranged in sequence;

2. The insert cleaning and guide texturing machine according to claim 1, wherein the first basket lifting mechanism and the second basket lifting mechanism each comprise a basket support member, and the basket support member is vertically height-adjustable on the first base.

3. The integrated machine for cleaning and texturing inserting sheets according to claim 1,

the guide vane unit further comprises a hidden crack detection module, and the hidden crack detection module is used for detecting hidden cracks of the cleaned silicon wafer.

4. An integrated insert cleaning and guide texturing machine according to claim 3,

the first base is fixedly connected with a first mounting frame, and the first mounting frame is provided with a first mounting part positioned above the first silicon wafer conveying module and a second mounting part positioned below the first silicon wafer conveying module;

5. The integrated insert cleaning and guide texturing machine according to claim 4, wherein a second mounting frame is fixedly connected to the first base, the second mounting frame is provided with a third mounting portion located above the first silicon wafer conveying module, the third mounting portion is fixedly connected with an air knife, and an air outlet of the air knife faces the first silicon wafer conveying module;

6. An integrated machine for cleaning and making piles according to any one of claims 1 to 5, wherein a partition is provided at the junction of the guide unit and the making piles unit, and the partition is used for partitioning the guide unit and the making piles unit on two sides of the partition;

7. An integrated insert cleaning and guide texturing machine according to claim 6, wherein the notches are respectively arranged at the tops of the first portion and the second portion, and the notch is movably connected with the slot cover.

8. An integrated insert cleaning and guide flocking machine as recited in claim 6, wherein the docking conveyor comprises a belt conveyor extending from the first portion to the second portion in its own conveying direction.

9. The integrated insert cleaning, guide piece and flocking machine according to claim 6, wherein the first groove bodies arranged in sequence are a prewashing groove, a first alkaline washing groove, a second alkaline washing groove, a third alkaline washing groove, a fourth alkaline washing groove, a first rinsing groove, a second rinsing groove, a third rinsing groove, a fourth rinsing groove, a fifth rinsing groove and a sixth rinsing groove in sequence; and the sixth rinsing tank and the third rinsing tank are connected in a downward overflow mode in sequence.

10. The integrated insert piece cleaning, guiding and texturing machine according to claim 9, wherein the plurality of sequentially arranged second bath bodies are sequentially a first pickling tank, a seventh rinsing tank, a fifth alkaline washing tank, a sixth alkaline washing tank, a second pickling tank, a first pre-texturing tank, a second pre-texturing tank, an eighth rinsing tank, a first texturing tank, a second texturing tank, a ninth rinsing tank, a third pickling tank, a fourth pickling tank, a tenth rinsing tank, an eleventh rinsing tank and a drying tank.

11. The integrated insert cleaning and guide texturing machine of claim 10, wherein the cleaning unit further comprises a first manipulator, the first manipulator is used for grabbing a flower basket for holding the silicon wafers to be cleaned and textured, and the flower basket sequentially passes through the pre-washing tank to the sixth rinsing tank so as to clean the silicon wafers to be cleaned and textured; and/or the presence of a gas in the gas,

12. An insert cleaning and guide texturing all-in-one machine as claimed in any one of claims 1 to 5, wherein the insert unit comprises a second machine base, a second silicon wafer conveying module is arranged on the second machine base, a water tank is arranged at one end of the second silicon wafer conveying module along the silicon wafer conveying direction of the second silicon wafer conveying module, a third basket lifting mechanism is arranged at the other end of the second silicon wafer conveying module, the water tank is fixedly connected with the second machine base, and the third basket lifting mechanism is vertically adjustable in height on the second machine base.

13. The integrated insert cleaning and guide piece flocking machine according to any one of claims 1-5, further comprising a first return basket rail and a second return basket rail, wherein the first return basket rail is at least arranged on one side of the flocking unit, the second return basket rail is at least arranged on one side of the cleaning unit, a first AGV transfer trolley is arranged on the first return basket rail, a second AGV transfer trolley is arranged on the second return basket rail, the first AGV transfer trolley is used for conveying an empty basket from the blanking station of the guide piece unit to the feeding station of the insert unit along the first return basket rail, and the second AGV transfer trolley is used for conveying an empty basket from the blanking station of the flocking unit to the feeding station of the guide piece unit along the second return basket rail.