CN214672662U

CN214672662U - N-in-one LED packaging device and LED display module

Info

Publication number: CN214672662U
Application number: CN202120626933.7U
Authority: CN
Inventors: 李星; 刘生良
Original assignee: Dongguan HCP Technology Co Ltd
Current assignee: Dongguan HCP Technology Co Ltd
Priority date: 2021-03-26
Filing date: 2021-03-26
Publication date: 2021-11-09
Anticipated expiration: 2031-03-26

Abstract

The utility model relates to a LED shows technical field, especially relates to a LED encapsulation device and LED display module assembly of N unification. The LED light-emitting device comprises a substrate, light-transmitting glue and N-in-one LED light-emitting units arranged on the substrate in a matrix manner, wherein white shells are arranged on two sides of the N-in-one LED light-emitting units, surround the N-in-one LED light-emitting units to form an accommodating cavity, N is more than or equal to 2, and the light-transmitting glue is filled in the accommodating cavity; consequently, with N unification LED luminescence unit fixed mounting in the front of base plate, surround N unification LED luminescence unit through the white shell and form the holding chamber, the printing opacity is glued and is filled at the holding intracavity, thereby, the utility model provides a well spacing N unification encapsulation device's in the LED encapsulation device waterproof, corrosion-resistant protection effect is better, has promoted subsides dress and the welding effect of LED encapsulation device simultaneously.

Description

N-in-one LED packaging device and LED display module

Technical Field

The utility model relates to a LED shows technical field, especially relates to a LED encapsulation device and LED display module assembly of N unification.

Background

At present, LED display screens are developing towards small and even micro-spacing directions, and hundreds of thousands to millions of LEDs are often integrated on one LED display screen. However, as the pixel pitch of the LED display screen is reduced, the number of packaged devices per unit area is increased, so that the packaging difficulty is increased exponentially. The current leading technologies are to fabricate the display module (or named module) of the display screen by N-in-one (i.e. a plurality of pixels are integrated into a chip device) or COB packaging technology. The traditional lamp bead is also provided with a waterproof structure technology, but is generally used for traditional display or illumination, and does not relate to a small-space N-in-one patch packaging device. However, the N-in-one package device is generally used for indoor display screens, and is less related to outdoor display screens, and the outdoor display screens have technical requirements of water resistance, corrosion resistance and the like in a room, so that improvement of the outdoor display screens is particularly necessary.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a LED encapsulation device of N unification to solve the equidistant N unification encapsulation device and be applicable to indoor outdoor display screen, and have good waterproof, corrosion-resistant scheduling technical problem.

The utility model provides a LED encapsulation device of N unification, including a base plate, printing opacity glue with set up the N unification LED luminescence unit that is the matrix arrangement on the base plate, the both sides of N unification LED luminescence unit are provided with the white shell, the white shell surrounds N unification LED luminescence unit encloses into a holding chamber, N more than or equal to 2, the printing opacity glue fill in the holding intracavity.

Furthermore, the N-in-one LED light-emitting unit is a two-in-one LED light-emitting unit, and each LED light-emitting unit comprises a red light chip, a green light chip and a blue light chip.

Furthermore, Z-shaped steps are arranged on the edges of the upper end faces of the two sides of the white shell, and black layers are arranged on the steps.

Furthermore, a pin electrode end is arranged on the back surface of the substrate, and the N-in-one LED light-emitting unit is electrically connected with the pin electrode end.

Further, the pin electrode terminal is provided with a bonding layer through screen printing.

Furthermore, the bonding layer is made of a solder paste easy-soldering material.

Further, the substrate is a BT board.

Further, the white shell is made of acrylic, PPA, PCT and EMC epoxy resin.

Furthermore, the material of the light-transmitting glue is epoxy resin.

The utility model also provides a LED display module assembly, LED display module assembly includes as above-mentioned arbitrary one the LED encapsulation device of N unification.

The utility model discloses an among the LED encapsulation device of N unification, owing to with N unification LED luminescence unit fixed mounting in the front of base plate, surround N unification LED luminescence unit through the shell and form the holding chamber, the printing opacity is glued and is filled at the holding intracavity, thereby, the utility model provides an it is better to be applicable to indoor outdoor booth apart from N unification encapsulation device among the LED encapsulation device, and waterproof, corrosion-resistant protection effect, has promoted the subsides dress and the welding effect of N unification encapsulation device simultaneously.

Drawings

Fig. 1 is a schematic structural diagram of an LED package device according to an embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantageous effects of the present invention more clearly understood, the present invention is further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

In order to explain the technical solution of the present invention, the following description is made by using specific examples.

Referring to fig. 1, an embodiment of the present invention provides a pair of N-in-one LED package device, including a substrate 1, transparent adhesive 2 and N-in-one LED light emitting units 3 arranged on the substrate in a matrix arrangement, the two sides of the N-in-one LED light emitting units 3 are provided with white shells 4, the white shells 4 surround the N-in-one LED light emitting units 3 to form a holding cavity 5, N is greater than or equal to 2, the transparent adhesive 2 is filled in the holding cavity 5, therefore, the N-in-one LED light emitting units are fixedly mounted in the front of the substrate, the N-in-one LED light emitting units are surrounded by the white shells to form a holding cavity, and the transparent adhesive is filled in the holding cavity.

The embodiment of the utility model provides an in one, N unification LED luminescence unit 3 is two unification LED luminescence units, every LED luminescence unit 3 all includes ruddiness chip, green glow chip and blue light chip.

In the first embodiment of the present invention, Z-shaped steps 6 are disposed on the edges of the upper end surfaces of the two sides of the white shell 4, and a black layer 7 is disposed on the steps 6; the exposed height of the side white shell can be reduced, and the contrast ratio when the side white shell is viewed from the side is further improved.

In the first embodiment of the present invention, the back surface of the substrate 1 is provided with the pin electrode terminal 8, the N-in-one LED light emitting unit 6 and the pin electrode terminal 8 are electrically connected.

In the first embodiment of the present invention, the pin electrode terminal 8 is provided with a bonding layer 9 formed by screen printing; the bonding layer 9 is made of solder paste which is easy to weld.

In the first embodiment of the present invention, the substrate 1 is a BT board.

In the first embodiment of the present invention, the material of the white shell 4 is acrylic, PPA, PCT, EMC epoxy resin.

The embodiment of the present invention provides a first embodiment, the material of the transparent adhesive 2 is epoxy resin, and the transparent adhesive can be epoxy resin doped with black pigment.

The embodiment of the utility model provides an in still provide a LED display module assembly, LED display module assembly includes like in the above-mentioned embodiment one the LED encapsulation device of N unification.

In the embodiment of the utility model, the utility model provides an in the LED encapsulation device be applicable to indoor outdoor booth apart from N unification encapsulation device, and waterproof, corrosion-resistant protection effect is better, has promoted subsides dress and the welding effect of N unification encapsulation device simultaneously.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. An LED encapsulation device of N unification which characterized in that: the LED light-emitting device comprises a substrate, a light-transmitting adhesive and N-in-one LED light-emitting units arranged on the substrate in a matrix manner, wherein white shells are arranged on two sides of the N-in-one LED light-emitting units, the white shells surround the N-in-one LED light-emitting units to form an accommodating cavity, N is more than or equal to 2, and the light-transmitting adhesive is filled in the accommodating cavity.

2. The LED packaged device according to claim 1, wherein the N-in-one LED lighting unit is a two-in-one LED lighting unit, each of the LED lighting units comprising a red chip, a green chip, and a blue chip.

3. The LED packaging device as claimed in claim 1, wherein the edges of the upper end faces of the two sides of the white shell are provided with Z-shaped steps, and the steps are provided with black layers.

4. The N-up LED package device according to claim 1, wherein a pin electrode terminal is disposed on a back surface of the substrate, and the N-up LED light emitting unit is electrically connected to the pin electrode terminal.

5. The LED package device of claim 4, wherein the pin electrode terminals are provided with a bonding layer by screen printing.

6. The N-in-one LED package device of claim 5, wherein the bonding layer is solder paste.

7. The N-up LED package device of claim 1, wherein the substrate is a BT board.

8. The N-in-one LED package device as claimed in claim 1, wherein the material of the white shell is acrylic, PPA, PCT or EMC epoxy.

9. The N-in-one LED package device of claim 1, wherein the light-transmitting adhesive is epoxy resin.

10. An LED display module, characterized in that the LED display module comprises the N-in-one LED packaging device as claimed in any one of claims 1 to 9.