CN207398144U - A kind of LED component, display module and display screen - Google Patents
A kind of LED component, display module and display screen Download PDFInfo
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- CN207398144U CN207398144U CN201721223433.9U CN201721223433U CN207398144U CN 207398144 U CN207398144 U CN 207398144U CN 201721223433 U CN201721223433 U CN 201721223433U CN 207398144 U CN207398144 U CN 207398144U
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Abstract
The utility model discloses a kind of LED component, including LED chip, the packing colloid being covered in the LED chip, it is characterised in that：The LED chip is bipolar electrode LED chip of two electrodes in the same side, two electrode lower surfaces of the LED chip are exposed outside the packing colloid, the lower surface of the packing colloid is no more than the lower surface of two electrodes of the LED chip, and the LED chip includes blue-light LED chip, green LED chip and red LED chip.The invention also discloses a kind of display module and display screens.The LED component avoids gold thread fracture from causing component failure, reliability is high, cost-effective, simplifies packaging technology and program without using stent and gold thread；The display module uses the LED component, and the LED component of failure can be individually replaced when the LED component fails, easy to repair；Due to absorption and scattering process of no stent to light, the efficiency of light energy utilization improves.
Description
Technical field
The utility model is related to a kind of LED encapsulation technologies field more particularly to LED component, display module and display screens
Encapsulation technology.
Background technology
LED display develops towards high-resolution, this requires unit area pixel more and more, and the prior art
SMD and COB technologies are restricted by its structure and state of the art, for realizing that the close display of superelevation becomes very unrealistic.
Existing SMD LED displays, the reduction of spacing are mainly restricted by its SMD device size, existing SMD devices
Part structure is mainly PLCC and CHIP two types, all includes the chip needed for its encapsulation and places pad, routing pad, draws
Foot, substrate or stent etc., when device size reduces again, it has been difficult to accomplish to be restricted by structure, and the point spacing of its display screen
It also can only be in more than P0.7.
Existing COB display screens, the advantage of structure in itself can meet a spacing and be made smaller, it can be achieved that below P0.9
Display resolution.But there are still problems in the actual production process to influence display degree：1）Since picture element density is higher, and
Each pixel is made of one group of RGB chip, therefore chip assembling quantity is more, and efficiency is low；2）In any of the above pixel
The assembling of any one RGB chip when go wrong, be it is unqualified need to reprocess or scrap, it is therefore of high cost；3）COB modules seal
Its single pixel cannot be divided after dress, display consistency is poor, therefore the sorting span to chip supplied materials and its stringent, core
Piece effective rate of utilization is low, and cost increases；4）Module once completes glue package, just cannot reprocess, if exception occurs in encapsulation, just only
Energy monoblock is scrapped；5）For COB modules when its spacing accomplishes below P0.9, optical crosstalk problem is extremely serious.
In view of above problems of the prior art, this motion to solve the above problems, propose it is a kind of without substrate,
Encapsulation is simple, the LED component of micromation, display module and display screen.
The content of the invention
The purpose of this utility model is that provide it is a kind of without substrate, display consistency is good, LED component envelope of micromation
Assembling structure, display module and display screen.
In order to solve the above technical problems, the technical solution of the utility model is：
A kind of LED component, including at least three LED chips, the packing colloid being covered in the LED chip, feature
It is：The LED chip is bipolar electrode LED chip of two electrodes in the same side, and two electrode lower surfaces of the LED chip are naked
It is exposed at outside the packing colloid, the lower surface of the packing colloid is no more than the lower surface of two electrodes of the LED chip, described
LED chip includes blue-light LED chip, green LED chip and red LED chip, and the length of the LED component is 0.3mm≤a
≤ 1.0mm, width are 0.3mm≤b≤1.0mm.
Preferably, the upper surface of the packing colloid covering LED chip and four sides.
Preferably, the packing colloid also covers remaining lower surface outside two electrode of LED chip.
Preferably, the packing colloid surface of the LED component is black and/or is frosted rough surface.
Preferably, at least one side of the LED component sets light shield layer.
Preferably, at least three LED chip is yi word pattern placement arranged in parallel, at least three LED chip
Positive electrode or negative electricity are extremely arranged in the same side；Or at least three LED chip is the placement arranged in parallel of non-yi word pattern, it is described
The positive electrode or negative electrode of at least three LED chips are close.
A kind of display module including pcb board, places LED component on the pcb, and the LED component is above-mentioned
LED component described in one.
Preferably, line layer and at least one pad are provided on the pcb board, one pad includes public pad
And electrode pad, between the distance between the public pad and electrode pad and the electrode pad and electrode pad
Distance is between 0.05mm-0.2mm.
A kind of display screen is spliced by multiple LED display modules described in any one of the above embodiments.
Preferably, it is provided with light penetrating panel on the display screen.
Compared with prior art, the utility model has the following advantages that：
1. a kind of LED component provided by the utility model, display module and display screen, the LED component uses flip LED
The LED chip that chip or formal dress fall without using stent and gold thread, avoids gold thread fracture from causing component failure etc. possible,
Reliability is high, cost-effective, simplifies packaging technology and program.
2. a kind of LED component provided by the utility model, display module and display screen, described in the display module uses
LED component can be individually replaced the LED component of failure when the LED component fails, easy to repair, and the LED component need not
Supporting structure, chip directly radiate, and heat dissipation performance is splendid, extend service life, since no stent to the absorption of light and dissipates
The effect of penetrating, the efficiency of light energy utilization improve.
3. a kind of LED component provided by the utility model, display module and display screen, the LED component can be arranged to
Five faces shine, one side shines etc., and light-emitting surface quantity, shapes and sizes can be designed according to demand, and flexibility ratio is high.
Description of the drawings
Fig. 1 is the elevational schematic view that a kind of yi word pattern of one LED component of the utility model embodiment arranges；
Fig. 2 is the schematic side view that a kind of yi word pattern of one LED component of the utility model embodiment arranges；
Fig. 3 is that the packing colloid that a kind of yi word pattern of one LED component of the utility model embodiment arranges is no more than under electrode
The schematic side view on surface；
Fig. 4 is a kind of schematic side view of the arrowhead-shaped arrangement of one LED component of the utility model embodiment；
Fig. 5 is a kind of two display module of the utility model embodiment and the corresponding pad structure of LED component yi word pattern arrangement
Schematic top plan view.
Specific embodiment
For the technology contents of the utility model, construction feature, the objects and the effects are described in detail, below in conjunction with implementation
Mode simultaneously coordinates attached drawing to be explained in detail.
Embodiment one
A kind of LED component provided by the utility model, as shown in Figure 1, Figure 2, Figure 3 and Figure 4, including LED chip 1, covering
Packing colloid 2 in the LED chip, the LED chip 1 is bipolar electrode LED chip of two electrodes in the same side, described
Two electrode lower surfaces of LED chip are exposed outside the packing colloid, and the lower surface of the packing colloid is no more than the LED core
The lower surface of two electrodes of piece, the LED chip 1 include blue-light LED chip, green LED chip and red LED chip；It is described
At least three chips are yi word pattern placement arranged in parallel, and the positive electrode or negative electricity of at least three chip are extremely arranged in same
Side；Or at least three chip be the placement arranged in parallel of non-yi word pattern, the positive electrode or negative electrode of at least three chip
It is close.
The LED chip 1 is flip LED chips or the packed LED chip of horizontal structure, in the present embodiment, the LED
Chip 1 is flip LED chips, and two electrodes 11 positioned at same side, 1 overlying of LED chip are provided in the LED chip
Be stamped packing colloid 2, specifically, the packing colloid 2 cover the LED chip 1 upper surface and four sides, i.e., except set
Have outside the lower surface of electrode, other surfaces of LED chip are covered by the packing colloid 2.Further, such as Fig. 1 to Fig. 4
Shown, the packing colloid 2 also covers remaining lower surface outside two electrode of LED chip, the lower surface of the packing colloid 2
No more than two electrode surfaces of the LED chip, the lower surface of two electrodes of the LED chip is exposed in the packing colloid
Outside, as shown in Fig. 2, the lower surface of the packing colloid is concordant with two electrode lower surfaces of the LED chip.As shown in figure 3, institute
The lower surface for stating packing colloid is no more than two electrode lower surfaces of the LED chip.
In other embodiments, the LED chip 1 is the packed LED chip of horizontal structure, is set in the LED chip
There are two electrodes positioned at the same side, covered with packing colloid in the LED chip 1, specifically, the packed LED chip is done down
It fills LED chip to use, the LED chip 1 in addition to the surface for being provided with electrode, by the packing colloid 2 covered by other surfaces
Lid, further, the LED chip 1 is provided with the surface of electrode in addition to two electrodes, and other surfaces are by the packing colloid
2 coverings, the lower surface of the packing colloid 2 are not less than the lower surface of two electrode of LED chip, two electricity of the LED chip
The lower surface of pole 11 is exposed outside the packing colloid.In the present embodiment, using flip LED chips, the LED after encapsulation
Device is five surface light-emitting devices, light emitting angle increase, and further, optical crosstalk in order to prevent improves the concentration degree of light, at other
In embodiment, can light shield layer be set at least one side of the LED component, specifically, can be set four sides
Light shield layer, the further light shield layer is black ink, and the modes such as spraying may be employed and realize.It is described after light shield layer is set
LED component is top emission device, and light is concentrated, available for display screen, indicator light etc.；Or the packing colloid of the LED component
Surface is black and/or is frosted rough surface, can increase the contrast and matte effect of the LED component.
The LED chip 1 includes blue-light LED chip, green LED chip and red LED chip.In the present embodiment, wrap
A blue-light LED chip is included, a green LED chip, a red LED chip, the LED chip 1 can be in that yi word pattern is arranged
Row, in it is arrowhead-shaped arrangement or in it is Chinese character pin-shaped arrangement etc., three chips be yi word pattern placement arranged in parallel, three cores
The positive electrode or negative electricity of piece are extremely arranged in the same side；Three chips are placed for the arrangement of arrowhead-shaped or isosceles triangle, and described three
The positive electrode or negative electrode of a chip are close or adjacent, and the arrangement mode can be not limited to this reality depending on actual conditions
Apply the situation in example.
The packing colloid is polymer encapsulation colloid, it is preferred that the packing colloid is epoxy resin or silicones.
After overall package, the length of the LED component is a, width b, and the length of the LED component is
0.3mm≤a≤1.0mm, width are 0.3mm≤b≤1.0mm.
Embodiment two
The present embodiment two provides a kind of display module, the display module include the LED component provided in embodiment one with
And pcb board, LED component on the pcb is placed, as shown in figure 5, being provided with line layer and at least one on the pcb board
Pad 3, one pad include public pad and electrode pad, the distance between the public pad and electrode pad, with
And the distance between the electrode pad and electrode pad are between 0.05mm-0.2mm.The LED component is placed in correspondence
Pad 3 on, the electrode of the LED chip in the LED component is corresponding with the pad 3 on the pcb board respectively, described
LED component is electrically connected with the pad, and the LED chip in the LED component forms common anode or cathode connects altogether, described in realization
LED component is scaling powder, tin cream, silver paste or anisotropy conductiving glue etc. with the material used in the pad conductive communication, also may be used
It is welded and realized by eutectic.The display module uses the LED component, and mistake can be individually replaced when the LED component fails
The LED component of effect, it is easy to repair.
Further, after the LED component is placed on the pcb board, in the LED component and the pcb board again
Secondary to encapsulate transparent or dark encapsulation glue, dark color encapsulation glue is preferably black.It is described encapsulation glue covering pcb board surface and
The LED component, further, the encapsulation glue can cover the entire LED component, and the encapsulation glue can pass through silk
The techniques such as wire mark brush or spraying or compression molding are realized.When the packaging plastic water uses transparent glue, LED component can be improved
Brightness；When using dark encapsulation glue, it can effectively prevent optical crosstalk between pixel, improve the contrast of the display module.
By the way that encapsulation encapsulates glue again in LED component and the pcb board, it can effectively prevent the entrance of steam, improve the LED
The air-tightness of device and raising display screen surface flatness.
Embodiment three
A kind of display screen that the present embodiment three provides, including a kind of display module that embodiment two is provided, the display
Screen is spliced as the display module described in embodiment two, after the completion of display screen splicing, may be used also on the display screen
To be provided with light penetrating panel, the light penetrating panel can be glass plate etc., and visually, the appearance of the display screen is more flat
Whole, beautiful, display effect is more preferable；In addition, the light penetrating panel can prevent dust, steam to enter display screen to a certain extent
It is interior, enhance the waterproof effect of display screen.
A kind of LED component provided by the utility model, display module and display screen, have the following advantages：
1. a kind of LED component provided by the utility model, display module and display screen, the LED component uses flip LED
The LED chip that chip or formal dress fall without using stent and gold thread, avoids gold thread fracture from causing component failure etc. possible,
Reliability is high, cost-effective, simplifies packaging technology and program.
2. a kind of LED component provided by the utility model, display module and display screen, described in the display module uses
LED component can be individually replaced the LED component of failure when the LED component fails, easy to repair, and the LED component need not
Supporting structure, chip directly radiate, and heat dissipation performance is splendid, extend service life, since no stent to the absorption of light and dissipates
The effect of penetrating, the efficiency of light energy utilization improve.
3. a kind of LED component provided by the utility model, display module and display screen, the LED component can be arranged to
Five faces shine, one side shines etc., and light-emitting surface quantity, shapes and sizes can be designed according to demand, and flexibility ratio is high.
The utility model is described in detail above, in text using specific case to the principle of the utility model and
Implementation is set forth, and the explanation of above example is only intended to help to understand that the method for the utility model and its core are thought
Think.It should be pointed out that for those skilled in the art, on the premise of the utility model is not departed from, may be used also
With to the utility model, some improvement and modification can also be carried out, these improvement and modification also fall into the protection of the utility model claims
Scope.
Claims (10)
1. a kind of LED component, including at least three LED chips, the packing colloid being covered in the LED chip, feature exists
In：The LED chip is bipolar electrode LED chip of two electrodes in the same side, and two electrode lower surfaces of the LED chip are exposed
Outside the packing colloid, the lower surface of the packing colloid is no more than the lower surface of two electrodes of the LED chip, described
LED chip includes blue-light LED chip, green LED chip and red LED chip, the length of the LED component for 0.3mm≤a≤
1.0mm, width are 0.3mm≤b≤1.0mm.
2. a kind of LED component according to claim 1, it is characterised in that：The packing colloid covers the LED chip
Upper surface and four sides.
3. a kind of LED component according to claim 2, it is characterised in that：The packing colloid also covers the LED chip
Remaining lower surface outside two electrodes.
4. a kind of LED component according to claim 1, it is characterised in that：The packing colloid surface of the LED component is black
Color and/or for frosted rough surface.
5. a kind of LED component according to claim 1, it is characterised in that：At least one side of the LED component is set
Light shield layer.
6. a kind of LED component according to claim 1, it is characterised in that：At least three LED chip is put down for yi word pattern
Row arrangement is placed, and the positive electrode or negative electricity of at least three LED chip are extremely arranged in the same side；Or described at least three
LED chip is the placement arranged in parallel of non-yi word pattern, and the positive electrode or negative electrode of at least three LED chip are close.
7. a kind of display module, including pcb board, the LED component being placed on the pcb board, it is characterised in that：The LED devices
LED component of the part any one of claim 1-6.
8. a kind of display module according to claim 7, it is characterised in that：Line layer and extremely is provided on the pcb board
A few pad, one pad include public pad and electrode pad, between the public pad and electrode pad away from
From and the distance between the electrode pad and electrode pad between 0.05mm-0.2mm.
9. a kind of display screen, it is characterised in that：It is spliced including the display module any one of claim 7-8.
10. a kind of display screen according to claim 9, it is characterised in that：Light penetrating panel is provided on the display screen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721223433.9U CN207398144U (en) | 2018-02-27 | 2018-02-27 | A kind of LED component, display module and display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721223433.9U CN207398144U (en) | 2018-02-27 | 2018-02-27 | A kind of LED component, display module and display screen |
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| Publication Number | Publication Date |
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| CN207398144U true CN207398144U (en) | 2018-05-22 |
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| CN201721223433.9U Active CN207398144U (en) | 2018-02-27 | 2018-02-27 | A kind of LED component, display module and display screen |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114038342A (en) * | 2021-03-09 | 2022-02-11 | 重庆康佳光电技术研究院有限公司 | LED display screen repairing method |
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2018
- 2018-02-27 CN CN201721223433.9U patent/CN207398144U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114038342A (en) * | 2021-03-09 | 2022-02-11 | 重庆康佳光电技术研究院有限公司 | LED display screen repairing method |
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