CN214586772U

CN214586772U - Server

Info

Publication number: CN214586772U
Application number: CN202122374255.2U
Authority: CN
Inventors: 刘明
Original assignee: Sunlune Technology Beijing Co Ltd
Current assignee: Shenglong Singapore Pte Ltd
Priority date: 2021-09-29
Filing date: 2021-09-29
Publication date: 2021-11-02
Anticipated expiration: 2031-09-29

Abstract

An embodiment of the present application provides a server, including: a chassis; the radiator is arranged in the case and provided with a radiating cavity; and the force calculation plate is at least partially arranged in the heat dissipation cavity and is in contact with the heat sink. In the scheme, the radiator is in contact with the force calculation plate and used for radiating the force calculation plate, so that the force calculation plate is prevented from being broken or even damaged due to overhigh temperature. And the radiator is provided with a heat dissipation cavity, and at least one part of the force calculation plate is positioned in the heat dissipation cavity. Compare in the radiator do not have the heat dissipation chamber and establish the scheme in calculation board one side, this scheme has both been favorable to increasing the heat radiating area of radiator, also is favorable to increasing the area of contact of calculation board and radiator to improve the radiating efficiency of radiator, satisfy the heat dissipation demand of high performance server. On the other hand, the internal space of the radiator is reasonably utilized, the occupied space of the radiator and the force calculation board is reduced, the size of the case is favorably reduced, and the high-density arrangement of server components is facilitated.

Description

Server

Technical Field

The present disclosure relates to computer technology, and more particularly, to a server.

Background

The computing power server based on the high-performance chip has an increasing heat productivity, and an efficient heat dissipation scheme is provided for the server, so that the problem which needs to be solved in the field is solved urgently.

SUMMERY OF THE UTILITY MODEL

The application provides a server is equipped with the radiator that can provide high-efficient radiating efficiency to satisfy the heat dissipation demand of server.

An embodiment of the present application provides a server, including: a chassis; the radiator is arranged in the case and provided with a radiating cavity; and the force calculation plate is at least partially arranged in the heat dissipation cavity and is in contact with the heat radiator.

Compared with the related art, the server provided by the embodiment of the application comprises the chassis, the radiator and the computing board. The computing board is the main heat generating component of the server. The radiator is contacted with the force calculation plate and used for radiating the force calculation plate and preventing the force calculation plate from being broken or even damaged due to overhigh temperature. And the radiator is provided with a heat dissipation cavity, and at least one part of the force calculation plate is positioned in the heat dissipation cavity. Compare in the radiator do not have the heat dissipation chamber and establish the scheme in calculation board one side, this scheme has both been favorable to increasing the heat radiating area of radiator, also is favorable to increasing the area of contact of calculation board and radiator to improve the radiating efficiency of radiator, satisfy the heat dissipation demand of high performance server. On the other hand, the internal space of the radiator is reasonably utilized, the occupied space of the radiator and the force calculation board is reduced, the size of the case is favorably reduced, and the high-density arrangement of server components is facilitated.

In an exemplary embodiment, the heat sink includes: a heat dissipation substrate in contact with the computation force plate; the heat dissipation side plates are connected with two ends of the heat dissipation substrate and enclose the heat dissipation cavity with the heat dissipation substrate; and the heat dissipation fins are arranged on the surface of the heat dissipation base plate, which deviates from the force calculation plate.

In an exemplary embodiment, at least one side surface of the heat dissipating fin is provided as a wavy surface or a serrated surface.

In an exemplary embodiment, the computing board is fixedly connected to the heat sink, and the server further includes: the supporting frame is fixedly connected with the radiator and the case and used for supporting the radiator and the force calculating plate and enabling the force calculating plate and the radiator to be arranged in a suspended mode relative to the case; the supporting frame comprises a supporting part and a fixing part, the supporting part is fixedly connected with the radiating side plate, and the fixing part is fixedly connected with the case.

In an exemplary embodiment, a heat dissipation air duct is arranged in the case, the case is further provided with an air inlet and an air outlet which are communicated with the heat dissipation air duct, and the computation force plate and the radiator are located in the heat dissipation air duct; the server also comprises a heat dissipation fan matched with the heat dissipation air channel, and the heat dissipation fan is used for generating airflow flowing through the heat dissipation air channel.

In an exemplary embodiment, a wind scooper is arranged in the case, the wind scooper is covered on the radiator, and the radiator and the force calculation plate are located between the wind scooper and a bottom plate of the case; the space between the wind scooper and the bottom plate of the case forms the heat dissipation air duct.

In an exemplary embodiment, the heat dissipation fan includes a first fan set and a second fan set, the first fan set is disposed at the air inlet, and the second fan set is disposed at the air outlet; the first fan group comprises a plurality of first fans which are arranged side by side, and the second fan group comprises a plurality of second fans which are arranged side by side; and two ends of the wind scooper are fixed on the first fan set and the second fan set.

In an exemplary embodiment, the server further comprises: the main control board is arranged in the case, is electrically connected with the force calculation board and the cooling fan, and is used for adjusting the rotating speed of the cooling fan according to the temperature of the force calculation board; and/or the power module is arranged in the case and is electrically connected with the main control board, the force calculation board and the cooling fan.

In an exemplary embodiment, the force computation plate includes: the force calculation plate body is arranged in the heat dissipation cavity and comprises a plurality of force calculation chips which are arranged in a dispersed manner and are in contact with the heat radiator; and the wiring part is connected with the edge of the force calculation plate body and is positioned outside the heat dissipation cavity.

In an exemplary embodiment, a surface of the heat sink facing the force computing plate body is provided with a heat conducting boss, and the heat conducting boss is in contact with the force computing chip; and/or the computing board body further comprises an inductance element; and a hollow part is arranged at the position of the radiator corresponding to the inductance element.

In an exemplary embodiment, the chassis includes: the top end of the bottom shell is arranged in an open manner; the cover plate is covered at the open end of the bottom shell; the first panel is connected with the bottom shell and is provided with an indicator light and an operating part; and the second panel is connected with the bottom shell and is provided with a slot and/or a network interface.

Additional features and advantages of the application will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the application. Other advantages of the present application may be realized and attained by the instrumentalities and combinations particularly pointed out in the specification and the drawings.

Drawings

The accompanying drawings are included to provide an understanding of the present disclosure and are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the examples serve to explain the principles of the disclosure and not to limit the disclosure.

Fig. 1 is an exploded schematic diagram of a server according to an embodiment of the present application;

FIG. 2 is an enlarged view of portion A of FIG. 1;

FIG. 3 is a front view of the heat sink of FIG. 1;

FIG. 4 is a top view of the force calculation plate of FIG. 1;

FIG. 5 is a front view of the second panel of FIG. 1;

FIG. 6 is a bottom view of the cover plate of FIG. 1;

fig. 7 is a front view of the cover plate of fig. 1.

Wherein the reference numerals in fig. 1 to 7 are as follows:

1, a chassis, a first panel 11, a 111 air inlet, a second panel 12, a 121 air outlet, a bottom shell 13, a vent hole 131, a bottom plate 132, a cover plate 14 and a first clamping tongue 141;

2, a radiator, 21 a radiating base plate, 211 a heat conducting boss, 22 a radiating side plate, 23 a radiating fin and 24 a radiating cavity;

3 force calculation board, 31 force calculation board body, 311 force calculation chip, 32 wiring part, 321 power line and 322 flat cable;

4 support frame, 41 support part, 42 fixing part;

5 radiator fan, 51 first fan group, 511 first fan, 52 second fan group, 521 second fan;

6, a wind scooper;

7, a main control board;

and 8, a power supply module.

Detailed Description

The principles and features of the present invention are described below in conjunction with the following drawings, the examples given are only intended to illustrate the present invention and are not intended to limit the scope of the present invention.

As shown in fig. 1, one embodiment of the present application provides a server, including: a case 1, a radiator 2 and a force calculation plate 3.

Wherein, the radiator 2 is arranged in the case 1. The heat sink 2 is provided with a heat dissipation chamber 24 as shown in fig. 2 and 3. The force computing plate 3 is at least partially disposed within the heat dissipation chamber 24, as shown in FIG. 2, and is in contact with the heat sink 2.

The server provided by the embodiment of the application comprises a case 1, a radiator 2 and a computing board 3. The computing board 3 is the main heat generating component of the server. The radiator 2 is in contact with the force calculation plate 3 and used for radiating the force calculation plate 3 and preventing the force calculation plate 3 from being broken or damaged due to overhigh temperature. The heat sink 2 is provided with a heat dissipation chamber 24, and at least a part of the computation force plate 3 is located in the heat dissipation chamber 24. Compare in radiator 2 do not have heat dissipation chamber 24 and establish the scheme in calculation power board 3 one side, this scheme has both been favorable to increasing the heat radiating area of radiator 2, also is favorable to increasing the area of contact of calculation power board 3 with radiator 2 to improve the radiating efficiency of radiator 2, satisfy the heat dissipation demand of high performance server. On the other hand, the internal space of the radiator 2 is reasonably utilized, the occupied space of the radiator 2 and the force calculation board 3 is reduced, the size of the case 1 is reduced, and high-density arrangement of server components is facilitated.

In an exemplary embodiment, as shown in fig. 2 and 3, the heat sink 2 includes: a heat radiation base plate 21, a heat radiation side plate 22 and a heat radiation fin 23. Wherein, the heat dissipation substrate 21 is in contact with the force calculation plate 3. The heat dissipation side plates 22 are connected to two ends of the heat dissipation substrate 21, and enclose a heat dissipation cavity 24 with the heat dissipation substrate 21. The heat dissipation fins 23 are provided on the surface of the heat dissipation base plate 21 away from the computation force plate 3.

The heat sink 2 includes a heat radiation base plate 21, a heat radiation side plate 22, and heat radiation fins 23. The heat dissipation substrate 21 is in contact with the force calculation plate 3, and conducts heat of the force calculation plate 3 away. The heat dissipation side plates 22 are connected with two ends of the heat dissipation substrate 21 and enclose a heat dissipation cavity 24 with the heat dissipation substrate 21, so that the heat dissipation cavity 24 is a cavity with a U-shaped cross section, and the heat dissipation base plate is simple in structure and convenient to machine and mold. The heat dissipation side plate 22 can be a narrow and long flange, and is simple in structure and convenient to machine and form. The heat dissipation fins 23 are arranged on the surface of the heat dissipation substrate 21 away from the computation force plate 3, and are used for increasing the heat dissipation area of the heat sink 2 and improving the heat dissipation efficiency of the heat sink 2.

Further, as shown in fig. 3, the number of the heat dissipation side plates 22 is two, and the two heat dissipation side plates 22 are symmetrically disposed on both sides of the heat dissipation substrate 21. The computation force plate 3 is disposed opposite to the heat dissipation substrate 21.

As shown in fig. 2 and 3, the number of the heat dissipation fins 23 is plural, and the plurality of heat dissipation fins 23 are arranged in parallel, which is beneficial to further increase the heat dissipation area of the heat sink 2 and further improve the heat dissipation efficiency.

In an exemplary embodiment, as shown in fig. 2 and 3, at least one side surface of the heat radiating fin 23 is provided as a wavy surface or a serrated surface.

At least one side surface of the heat dissipation fin 23 is set to be a wavy surface or a sawtooth surface, which is beneficial to increasing the surface area of the heat dissipation fin 23, thereby further increasing the heat dissipation area of the heat sink 2 and further improving the heat dissipation efficiency of the heat sink 2.

In an exemplary embodiment, the force computing plate 3 is fixedly connected to the heat sink 2. The server further comprises: a support frame 4, as shown in fig. 1. The supporting frame 4 is fixedly connected with the radiator 2 and the case 1, and is used for supporting the radiator 2 and the force calculation plate 3 and suspending the force calculation plate 3 and the radiator 2 relative to the case 1.

The supporting frame 4 is arranged to support the radiator 2 and the force calculation plate 3, so that the radiator 2 and the force calculation plate 3 are not in contact with the inner wall surface of the case 1 (namely, the force calculation plate 3 is arranged in a suspended manner relative to the case 1), and thus, the air near the radiator 2 and the force calculation plate 3 can flow conveniently, and the heat can be dissipated to the periphery quickly; and the upper side and the lower side of the radiator 2 and the force calculation plate 3 can be ventilated to form front-back double-sided heat dissipation, which is beneficial to further improving the heat dissipation efficiency. On the other hand, the force calculation plate 3 is fixedly connected with the radiator 2 (for example, fixedly connected through fasteners such as screws), and the support frame 4 is also fixedly connected with the radiator 2 and the case 1, so that the indirect fixation of the force calculation plate 3 and the radiator 2 with the case 1 is realized, and the stability and reliability of the force calculation plate 3 and the radiator 2 in the case 1 are ensured.

In an exemplary embodiment, as shown in fig. 2, the supporting frame 4 includes a supporting portion 41 and a fixing portion 42. The supporting portion 41 is fixedly connected to the heat-radiating side plate 22, and the fixing portion 42 is fixedly connected to the housing 1.

The support frame 4 includes a support portion 41 and a fixing portion 42, both the support portion 41 and the fixing portion 42 can be plate-shaped structures, so that the support frame 4 is integrally L-shaped plate-shaped structure, the structure of the support frame 4 is simplified, and the cost of the support frame 4 is reduced. The support part 41 is fixedly connected with the radiating side plate 22, so that the support frame 4 is fixedly connected with the radiator 2. The fixing portion 42 is fixedly connected with the case 1, so that the support frame 4 is fixedly connected with the case 1.

Further, the number of the support frames 4 is two, and the two support frames 4 are symmetrically arranged on two sides of the heat sink 2 and are connected with the two heat dissipation side plates 22 in a one-to-one correspondence manner.

In an exemplary embodiment, a heat dissipation duct (not shown) is disposed in the chassis 1. The cabinet 1 is further provided with an air inlet 111 (shown in fig. 1) and an air outlet 121 (shown in fig. 5) which are communicated with the heat dissipation air duct. The computing board 3 and the radiator 2 are positioned in the radiating air duct. The server further includes a heat dissipation fan 5 coupled to the heat dissipation air duct, as shown in fig. 1, the heat dissipation fan 5 is configured to generate an air flow flowing through the heat dissipation air duct.

A heat dissipation air duct and a heat dissipation fan 5 are arranged in the chassis 1, and an air inlet 111 and an air outlet 121 are correspondingly arranged on the chassis 1, so that when the heat dissipation fan 5 operates, air flow can enter the heat dissipation air duct in the chassis 1 through the air inlet 111 and flow out of the chassis 1 through the air outlet 121. Because the radiator 2 and the force calculation plate 3 are positioned in the heat dissipation air duct, the air flow can take away the heat generated by the force calculation plate 3 and the heat of the radiator 2, thereby further improving the heat dissipation efficiency of the server. Therefore, the high-efficiency passive heat dissipation of the heat radiator 2 and the high-efficiency active heat dissipation of the heat dissipation fan 5 are comprehensively applied to the calculation board 3, the heat dissipation efficiency can be obviously improved, and the heat dissipation requirement of a high-performance server is met.

In an exemplary embodiment, a wind scooper 6 is disposed within the enclosure 1, as shown in fig. 1. The wind scooper 6 is covered on the radiator 2. The radiator 2 and the force calculation plate 3 are located between the wind scooper 6 and the bottom plate 132 of the case 1. The space between the wind scooper 6 and the bottom plate 132 of the cabinet 1 forms a heat dissipation air duct.

The wind scooper 6 is arranged in the case 1, and the wind scooper 6 can well guide airflow, so that the airflow is concentrated near the radiator 2 and the force calculation plate 3, and heat can be rapidly dissipated to the external environment.

In an exemplary embodiment, as shown in fig. 1, the heat dissipation fan 5 includes a first fan group 51 and a second fan group 52. The first fan set 51 is disposed at the air inlet hole 111, and the second fan set 52 is disposed at the air outlet hole 121. The first fan group 51 includes a plurality of first fans 511 arranged side by side, and the second fan group 52 includes a plurality of second fans 521 arranged side by side. Both ends of the wind scooper 6 are fixed to the first fan group 51 and the second fan group 52.

The heat radiation fan 5 includes a first fan group 51 and a second fan group 52. The first fan set 51 is disposed at the air inlet holes 111 for sucking the external air into the heat-dissipating air duct through the air inlet holes 111. The second fan set 52 is disposed at the air outlet 121, and is used for sucking the air flow in the heat dissipation air duct out of the heat dissipation air duct and discharging the air flow out of the case 1 through the air outlet 121. Compared with the fan arranged only at the air inlet 111 or only at the air outlet 121, the two fan sets can obviously improve the air flow quantity and the air flow speed flowing through the heat dissipation air duct, and further obviously improve the heat dissipation efficiency.

In addition, compared with the case that only a single fan is arranged at the air inlet 111 and the air outlet 121, in the present embodiment, the first fan set 51 includes a plurality of first fans 511 arranged side by side, and the second fan set 52 includes a plurality of second fans 521 arranged side by side, in other words, each fan set includes a plurality of fans, which can further improve the air flow rate and the air flow velocity flowing through the heat dissipation air duct, and further improve the heat dissipation efficiency.

Two ends of the wind scooper 6 are fixed on the first fan set 51 and the second fan set 52, so that the first fan set 51 and the second fan set 52 can be well matched with the heat dissipation air duct.

Illustratively, the number of the first fans 511 is equal to the number of the second fans 521.

In an exemplary embodiment, as shown in fig. 1, the server further includes: and the main control board 7 is arranged in the case 1, is electrically connected with the force calculation board 3 and the cooling fan 5, and is used for adjusting the rotating speed of the cooling fan 5 according to the temperature of the force calculation board 3.

Further, as shown in fig. 1, the server further includes: and the power supply module 8 is arranged in the case 1 and is electrically connected with the main control board 7, the force calculating board 3 and the cooling fan 5.

The server also comprises a main control board 7 and a power supply module 8. The main control board 7 is electrically connected with the force calculation board 3 and the cooling fan 5, the rotating speed of the cooling fan 5 can be reasonably controlled according to the temperature of the force calculation board 3, unnecessary power consumption is reduced while the normal work of a product is ensured, and the operation noise of a server is reduced. The power module 8 is electrically connected with the main control board 7, the force calculating board 3 and the cooling fan 5, and supplies power to the main control board 7, the force calculating board 3 and the cooling fan 5.

In an exemplary embodiment, as shown in fig. 4, the force calculation board 3 includes: a force calculation plate body 31 and a wire connection portion 32. Wherein, the force calculating board body 31 is arranged in the heat dissipation cavity 24, and the force calculating board body 31 comprises a plurality of force calculating chips 311. The plurality of force chips 311 are disposed discretely and in contact with the heat sink 2. The wire connecting portion 32 is connected to the edge of the force calculation plate body 31 and located outside the heat dissipation chamber 24.

The force calculation plate 3 includes a force calculation plate body 31 and a wire connection portion 32. The computing board body 31 is positioned in the heat dissipation cavity 24, so that efficient heat dissipation through the heat sink 2 is facilitated. Calculate power board body 31 includes a plurality of power chips 311 that calculate, and a plurality of power chips 311 that calculate disperse and set up, and is rationally distributed, can prevent to calculate 3 heat of power board and concentrate, is favorable to improving the radiating efficiency. Moreover, the force calculating chip 311 is in contact with the heat sink 2, so that the generated heat can be dissipated rapidly through the heat sink 2. The wiring portion 32 is connected with the edge of the force calculation board body 31 and is located outside the heat dissipation cavity 24, so that connection with the main control board 7 and the power module 8 is facilitated. The wire connecting portion 32 may include, but is not limited to, a power line 321 for connecting the power module 8 and a flat cable 322 for connecting the main control board 7.

In an exemplary embodiment, as shown in fig. 3, the surface of the heat sink 2 facing the force calculation plate body 31 is provided with a heat conduction boss 211. The thermally conductive boss 211 is in contact with the force computing chip 311.

The heat conduction boss 211 is arranged on the surface of the heat sink 2 facing the force calculation plate body 31, and the force calculation chip 311 is contacted by the heat conduction boss 211, so that the heat of the force calculation chip 311 can be quickly transferred to the heat sink 2, and the structure of the heat sink 2 is simplified.

In an exemplary embodiment, the force computing plate body 31 further includes an inductive element (not shown). The heat sink 2 is provided with a hollow portion (not shown) corresponding to the position of the inductance element.

The computation board body 31 further includes an inductance element, and the height of the inductance element is relatively high, so that a hollow portion is arranged at a corresponding position of the heat sink 2, heat at the position can be taken away through the hollow portion conveniently by using air flow, heat accumulation generated by the inductance element can be prevented, and interference between the inductance element and the heat sink 2 can also be prevented.

In an exemplary embodiment, as shown in fig. 1, the chassis 1 includes: a bottom case 13, a cover plate 14, a first panel 11, and a second panel 12.

Wherein, the top end of the bottom shell 13 is arranged in an open manner. The cover plate 14 covers the open end of the bottom case 13. The first panel 11 is connected to the bottom case 13 and is provided with an indicator lamp and an operating member (e.g., a button). The second panel 12 is connected to the bottom case 13 and has a slot, a network interface, and the like.

The chassis 1 includes a bottom case 13, a cover 14, a first panel 11, and a second panel 12. The top end of the bottom shell 13 is open, so that the internal force calculation plate 3, the radiator 2, the support frame 4, the cooling fan 5, the wind scooper 6, the main control board 7, the power module 8 and other structures can be conveniently installed. A cover 14 covers the open end of the bottom case 13 to enclose the above components in the cabinet 1. The first panel 11 is connected to the bottom case 13, and is provided with an indicator light, an operating member, and the like, and is a front panel of the chassis 1. The second panel 12 is connected to the bottom case 13, and has a slot, a network interface, and the like, and is a rear panel of the chassis 1.

Further, a first latch 141 (as shown in fig. 6 and 7) is disposed at the front end of the cover plate 14, a second latch (not shown) is disposed at the top end of the first panel 11, and a top surface of the first latch 141 and a bottom surface of the second latch are in abutting fit, so as to position the first panel 11 and prevent the first panel 11 from tilting upward. The left end, the right end and the rear end of the cover plate 14 are fixedly connected with the bottom case 13 through fasteners such as screws. The second panel 12 is fixedly connected with the bottom case 13. The first panel 11 is provided with air inlet openings 111. the air inlet openings 111 may be grill openings, as shown in fig. 1. The second panel 12 is provided with an air outlet 121, and the air outlet 121 may be a grid hole or a strip hole (as shown in fig. 5). The front end and the rear end of the bottom case 13 are respectively provided with a vent hole 131, as shown in fig. 1, the vent hole 131 may be a circular hole, a hexagonal hole, a rhombic hole, or the like.

One embodiment is described below with reference to the drawings.

The specific embodiment provides a server, specifically a 1U computing power server, with the operation power consumption of 250W.

As shown in fig. 1, the server includes: the device comprises a case 1, a radiator 2, a force calculation plate 3, a support frame 4, a radiating fan 5, an air guide cover 6, a main control plate 7, a power module 8 and the like.

The casing 1 is substantially rectangular in shape, and has a width of 482.2mm, a height of 44.5mm and a depth of 450.0 mm. The cabinet 1 includes: a bottom case 13, a cover 14, a first panel 11, and a second panel 12, as shown in fig. 1. The first panel 11 is a front panel having an operating status light and keys. The second panel 12 is a rear panel provided with a TF (Trans-flash Card) Card slot and a network interface. The top end of the bottom case 13 is open, and the front side wall and the rear side wall of the bottom case 13 are respectively provided with a vent hole 131. The first panel 11 is fixedly connected with the front side wall of the bottom case 13 through screws. The second panel 12 is fixedly connected to the rear side wall of the bottom case 13 by screws. The first panel 11 is provided with an air inlet hole 111 correspondingly communicated with the front side wall of the bottom case 13, as shown in fig. 1. The second panel 12 is provided with an air outlet 121 correspondingly communicated with the rear side wall of the bottom case 13, as shown in fig. 5. The front portion of the cover plate 14 is provided with a first latch 141, as shown in fig. 6 and 7. The first panel 11 is provided with a second latch tongue matched with the first panel. The first latch 141 of the cover plate 14 is latched under the second latch and is in abutting fit with the second latch, and the left and right ends and the rear end of the cover plate 14 are fixedly connected with the bottom case 13 through screws.

As shown in fig. 1, the heat dissipation fan 5, the force calculation plate 3, the heat dissipation fan 5, the wind scooper 6, the main control plate 7, and the power module 8 are fixed in the chassis 1.

As shown in fig. 1, the heat dissipation fan 5 includes a first fan group 51 at the air inlet hole 111 and a second fan group 52 at the air outlet hole 121. The first fan group 51 includes five first fans 511 arranged side by side in the left-right direction. The second fan group 52 includes five second fans 521 arranged side by side in the left-right direction. The maximum rotation speed of each fan can reach 16000 revolutions. The fan bracket of the first fan set 51 is fixedly connected with the bottom plate 132 of the bottom case 13 by screws. The fan bracket of the second fan set 52 is fixedly connected with the bottom plate 132 of the bottom case 13 through screws. The front end of the wind scooper 6 is fixedly connected with the fan bracket of the first fan set 51 through a screw, and the rear end of the wind scooper 6 is fixedly connected with the fan bracket of the first fan set 51 through a screw. A heat dissipation air duct is formed between the air guiding cover 6 and the bottom plate 132. The heat dissipation air duct adopts a forward and backward discharging mode and is consistent with the power module 8.

As shown in fig. 4, the force calculation plate 3 includes a force calculation plate body 31 and a wire connection portion 32. The computing board body 31 is located in the heat dissipation cavity 24 and is fixedly connected with the heat sink 2 through screws. The wire connection portion 32 is connected to the rear portion of the right edge of the force calculation plate body 31 and is located outside the heat dissipation chamber 24. The wire connection portion 32 includes a power line 321 for connecting the power module 8 and a flat cable 322 for connecting the main control board 7. The force computing plate body 31 includes eight high-performance force computing chips 311 arranged at intervals along the circumferential direction thereof. Eight chips are uniformly distributed, so that heat concentration is avoided. The force calculation plate body 31 further includes an inductance element. The integrated radiator 2 reduces the performance difference of chips at the air outlet 121 and the air inlet 111 caused by different temperatures, and improves the stability of the system.

As shown in fig. 2 and 3, the heat sink 2 includes a heat radiation base plate 21, two heat radiation side plates 22, and a plurality of heat radiation fins 23. The two radiating side plates 22 are respectively connected with the left end and the right end of the radiating base plate 21, and enclose a radiating cavity 24 with the radiating base plate 21. The force calculation plate body 31 is located in the heat dissipation chamber 24. The wiring portion 32 is located outside the heat dissipation chamber 24. The wind scooper 6 is also provided with a notch corresponding to the wiring part 32.

A plurality of heat dissipation fins 23 are provided in parallel at intervals on the upper plate surface of the heat dissipation substrate 21. The lower plate surface of the heat dissipation substrate 21 is provided with a heat conduction boss 211, and the heat conduction boss 211 is in contact with a bare die (or bare die) of the computation chip 311. The heat dissipation substrate 21 is further provided with a hollow portion, the hollow portion is arranged corresponding to the inductance element of the computation force plate 3, and the hollow design avoids heat accumulation of the inductance element. The radiator 2 is integrally formed by aluminum extrusion without considering the connection problem among all parts.

The height of the heat radiating fins 23 is 9.9mm to 12.1mm, such as 11 mm. The spacing of the fins 23 is 1.125mm to 1.375mm, such as 1.25 mm. By optimizing the height and the distance of the radiating fins 23, the radiating fins 23 can be fully utilized, the contact area of air is enlarged, and the air flow is accelerated by the radiating fan 5, so that the heat on the radiating fins 23 is taken away. The two sides of the heat dissipation fins 23 are provided with the wavy lines (namely, the surfaces of the two sides are provided with wavy surfaces), so that the heat dissipation area is increased, the working temperature of each electronic element of the force calculation plate 3 is reduced, and the service life of the product is prolonged.

The number of the support frames 4 is two, and the two support frames 4 are arranged on the left side and the right side of the radiator 2. As shown in fig. 2, the support frame 4 includes a plate-shaped support portion 41 and a plate-shaped fixing portion 42. The support frame 4 is substantially L-shaped. The support portion 41 is fixedly connected to the heat-radiating side plate 22 by screws, and the fixing portion 42 is fixedly connected to the bottom plate 132 by screws. After the assembly is completed, a gap is formed between the lower surface of the force calculation plate 3 and the bottom plate 132, and a gap is also formed between the lower end of the heat dissipation side plate 22 and the bottom plate 132. Therefore, the force calculation plate 3 and the heat sink 2 are suspended from the chassis 1.

The main control board 7 provides an external network interface, a TF card interface, an operation status lamp and keys. As shown in fig. 1, the main control board 7 is located on the right side of the force calculation board 3 and is fixedly connected with the bottom board 132 through screws. And, the main control board 7 is electrically connected with the computation board 3 through the flat cable 322, and is electrically connected with the cooling fan 5 through the connecting wire, automatically adjusts the rotating speed of the cooling fan 5 through a PMW (Pulse Width Modulation) signal according to the temperature of the computation board 3, reduces unnecessary power consumption while ensuring the normal operation of the product, and reduces the noise of the server operation.

As shown in fig. 1, the power module 8 is located at the front side of the main control board 7 and is fixedly connected to the bottom board 132 by screws or clips. And the power module 8 is electrically connected with the main control board 7, the force calculating board 3 and the cooling fan 5 to supply power for the main control board, the force calculating board and the cooling fan.

Through the optimization design, when the ambient temperature is 40 ℃, the temperature of the server plate is controlled below 65 ℃, the normal operation of the force calculation plate 3 of the server is ensured, the design of heat dissipation of 250W in the structure of the 1U server is realized, meanwhile, unnecessary noise and energy consumption are avoided by automatically adjusting the rotating speed of the fan, and the high-density deployment of the force calculation server is facilitated.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship indicated based on the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Although embodiments of the present invention have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art without departing from the scope of the present invention.

Claims

1. A server, comprising:

a chassis;

the radiator is arranged in the case and provided with a radiating cavity; and

and the computing board is at least partially arranged in the heat dissipation cavity and is in contact with the heat radiator.

2. The server of claim 1, wherein the heat sink comprises:

a heat dissipation substrate in contact with the computation force plate;

the heat dissipation side plates are connected with two ends of the heat dissipation substrate and enclose the heat dissipation cavity with the heat dissipation substrate; and

and the heat dissipation fins are arranged on the surface of the heat dissipation base plate, which deviates from the force calculation plate.

3. The server according to claim 2,

at least one side surface of the radiating fin is set to be a wavy surface or a sawtooth surface.

4. The server of claim 2, wherein the computing board is fixedly connected to the heat sink, the server further comprising:

the supporting frame is fixedly connected with the radiator and the case and used for supporting the radiator and the force calculating plate and enabling the force calculating plate and the radiator to be arranged in a suspended mode relative to the case;

the supporting frame comprises a supporting part and a fixing part, the supporting part is fixedly connected with the radiating side plate, and the fixing part is fixedly connected with the case.

5. The server according to any one of claims 1 to 4,

a heat dissipation air channel is arranged in the case, an air inlet and an air outlet which are communicated with the heat dissipation air channel are also arranged in the case, and the force calculation plate and the radiator are positioned in the heat dissipation air channel;

the server also comprises a heat dissipation fan matched with the heat dissipation air channel, and the heat dissipation fan is used for generating airflow flowing through the heat dissipation air channel.

6. The server according to claim 5,

the chassis is internally provided with an air guide cover, the air guide cover covers the radiator, and the radiator and the force calculation plate are positioned between the air guide cover and the bottom plate of the chassis;

the space between the wind scooper and the bottom plate of the case forms the heat dissipation air duct.

7. The server according to claim 6,

the heat radiation fan comprises a first fan group and a second fan group, the first fan group is arranged at the air inlet, and the second fan group is arranged at the air outlet;

the first fan group comprises a plurality of first fans which are arranged side by side, and the second fan group comprises a plurality of second fans which are arranged side by side;

and two ends of the wind scooper are fixed on the first fan set and the second fan set.

8. The server of claim 5, further comprising:

the main control board is arranged in the case, is electrically connected with the force calculation board and the cooling fan, and is used for adjusting the rotating speed of the cooling fan according to the temperature of the force calculation board; and/or

And the power module is arranged in the case and is electrically connected with the main control board, the force calculation board and the cooling fan.

9. The server according to any one of claims 1 to 4, wherein the computing board comprises:

the force calculation plate body is arranged in the heat dissipation cavity and comprises a plurality of force calculation chips which are arranged in a dispersed manner and are in contact with the heat radiator; and

and the wiring part is connected with the edge of the force calculation plate body and is positioned outside the heat dissipation cavity.

10. The server according to claim 9,

the surface of the radiator facing the force calculation plate body is provided with a heat conduction boss, and the heat conduction boss is in contact with the force calculation chip; and/or

The force calculation board body also comprises an inductance element; and a hollow part is arranged at the position of the radiator corresponding to the inductance element.