CN211534504U - Area array transducer arrangement - Google Patents
Area array transducer arrangement Download PDFInfo
- Publication number
- CN211534504U CN211534504U CN201922441456.2U CN201922441456U CN211534504U CN 211534504 U CN211534504 U CN 211534504U CN 201922441456 U CN201922441456 U CN 201922441456U CN 211534504 U CN211534504 U CN 211534504U
- Authority
- CN
- China
- Prior art keywords
- backing
- pitch
- conducting wire
- array transducer
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Transducers For Ultrasonic Waves (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
Abstract
The utility model provides a planar array transducer device, include: the piezoelectric crystal is used for transmitting and receiving ultrasonic signals; the piezoelectric crystal comprises a preset array interval of (D)1，D2) Array element of (1), said D1For the spacing of two array elements in a first direction, D2The distance between the two array elements in the second direction; the first back lining is arranged on the end face far away from the radiation face of the piezoelectric wafer and is connected with the piezoelectric wafer in an adhesion mode; the primary backing further includes first conductive lines arranged in a first direction D1A change in pitch; the second backing is arranged on the end face, far away from the piezoelectric wafer, of the first backing and is connected with the first backing; the secondary backing further comprisesA second conductive line arranged in a second direction D2A change in pitch. The space between the leads of the array element electrodes is changed in the two-dimensional direction, the mounting and processing difficulty of the leads of the electrodes is reduced, and the mounting of a circuit board such as a chip is realized.
Description
Technical Field
The utility model belongs to the technical field of ultrasonic diagnostic equipment technique and specifically relates to a planar array transducer device.
Background
The ultrasonic imaging is to obtain an ultrasonic image of the human tissue property and structure of the object to be detected by receiving and processing the echo carrying the characteristic information of the tissue or structure property of the object to be detected and performing beam processing and the like after the ultrasonic wave is transmitted to the object to be detected.
Ultrasound, CT and MRI are diagnostic techniques commonly used in the clinic today. Compared with the latter two, ultrasound is not only free from the limitation of working environment, but also harmless to human body, so that it is widely applied in clinical application.
The surface array transducer with dense array elements generally has thousands to tens of thousands of array elements, the process difficulty of the existing surface array transducer is large, the technology is complex, especially the difficulty of the dense surface array transducer is multiplied, for example, the wires of array element electrodes, because the array elements (piezoelectric ceramics) are as many as thousands to tens of thousands, the conventional process also needs to lead out a corresponding number of electrode wires. Because the spacing of array elements in the area array is very small, the wire spacing of the electrodes of the array elements is also very small, and the wires of the electrodes are connected to the chip.
The electrodes of the existing area array transducer are connected with the chip, generally through two methods: in the first mode, the wire spacing of electrodes in one-dimensional direction of a wire in a flexible circuit board outside a backing is changed, and then a special chip is designed to be electrically connected with the wire of the transducer electrode with the changed spacing, and the chip is arranged on the side surface of the backing; the second mode, through designing more special chip, directly with the chip laminating at the back of array element, realize the chip and be connected with the electricity of array element. The two schemes put high requirements on chip design, and have high cost and complex process.
Disclosure of Invention
An object of the utility model is to overcome the not enough of existence among the prior art, provide an area array transducer device to solve the problem that the wire of array element electrode is connected with the chip electricity in the transducer, make the transducer can conveniently be connected with realization electricity such as chip, reduced technology complexity, the cost is reduced and the yield has been improved. The utility model adopts the technical proposal that:
a first aspect of the present invention provides a planar array transducer apparatus, including:
the piezoelectric crystal is used for transmitting and receiving ultrasonic signals;
the piezoelectric crystal comprises a preset array interval of (D)1，D2) Array element of (1), said D1For the spacing of two array elements in a first direction, D2The distance between the two array elements in the second direction;
the first back lining is arranged on the end face far away from the radiation face of the piezoelectric wafer and is connected with the piezoelectric wafer in an adhesion mode; the primary backing further includes first conductive lines arranged in a first direction D1A change in pitch;
the second backing is arranged on the end face, far away from the piezoelectric wafer, of the first backing and is connected with the first backing; the secondary backing further comprises secondary wires, the secondary wires being arranged in a second direction D2A change in pitch. The distance between the leads of the array element electrodes is changed in the two-dimensional direction through the leads in the backing, so that the installation and processing difficulty of the leads of the electrodes is reduced.
In some embodiments, the first conductive line is in a first direction D1The pitch change is one of equal pitch enlargement, equal pitch reduction, unequal pitch enlargement, and unequal pitch reduction.
In some embodiments, the second conductive line is in a second direction D2The pitch change is one of equal pitch enlargement, equal pitch reduction, unequal pitch enlargement, and unequal pitch reduction. The first wire array interval (D) of the wires at the end of the original first wire close to the piezoelectric crystal is changed by changing the interval of the wires in the first backing and the second backing1，D2) Changing to a second wire array pitch (D ') of the second wire near the chip end'1，D’2). Furthermore, the space between the leads of the electrodes is changed in the two-dimensional direction, so that the leads of the electrodes with narrow array element space can be connected with a plurality of chips, and the improvement is realizedThe performance of the transducer is improved.
In some embodiments, the primary backing comprises a primary backing upper portion, a primary backing lower portion; the first conducting wire comprises a first conducting wire upper part and a first conducting wire lower part; the included angle between the upper part of the first conducting wire and the lower part of the first conducting wire is larger than 90 degrees and not higher than 150 degrees. Such angle setting, wire length is shorter, when doing benefit to processing, has solved prior art, for example the wire distance is long when contained angle 90, is unfavorable for various signal transmission's problem.
In some embodiments, the first lead lower portion is substantially parallel to the Z-axis of the piezoelectric crystal.
In some embodiments, the first backing lower portion is parallel to the piezoelectric crystal in a first direction.
In some embodiments, the secondary backing comprises a secondary backing upper portion, a secondary backing lower portion; the second conducting wire comprises a second conducting wire upper part and a second conducting wire lower part; and the included angle between the upper part of the second conducting wire and the lower part of the second conducting wire is larger than 90 degrees and not higher than 150 degrees. Such angle setting, wire length is shorter, when doing benefit to processing, has solved prior art, for example the wire distance is long when contained angle 90, is unfavorable for various signal transmission's problem.
In some embodiments, the second wire lower portion is substantially parallel to the Z-axis of the piezoelectric crystal. The lower part of the second lead is parallel to the Z-axis direction of the end face of the piezoelectric crystal, so that the chip can be conveniently arranged below the second backing, the processing and the installation are facilitated, and meanwhile, the signal interference and the space size inside the probe are reduced.
In some embodiments, the second backing lower portion is parallel to the piezoelectric crystal in a second direction.
In some embodiments, the first and second leads are connected by a ball grid array packaging process; the first conducting wire and the second conducting wire are connected through the conducting paste and the solder balls. Different from the change of the lead of the flexible circuit board outside the backing in the one-dimensional direction, how to realize the change in the two-dimensional direction in the backing is not found at present, the mode of changing the spacing in the two-dimensional direction in the backing in the market and the technical field in the field is not found at present, and the difficulty of various processes exists in how to realize the change of the spacing in the two-dimensional direction in the backing, for example, how to reliably connect the first lead and the second lead, and the problem can be effectively solved by realizing the connection of the first lead and the second lead through conductive paste and solder balls.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the description below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a partial area array transducer according to an embodiment of the present invention.
Fig. 2 is a schematic perspective view of a partial planar array transducer according to an embodiment of the present invention.
Fig. 3 is a schematic diagram of two-dimensional directions of a mid-plane array transducer according to an embodiment of the present invention.
Fig. 4 is a schematic structural diagram of the first backing and the second backing according to the first embodiment of the present invention.
Fig. 5 is a schematic diagram of a septum structure according to an embodiment of the present invention.
Fig. 6 is a schematic diagram illustrating a change in the pitch of the first conductive line in the X direction according to a first embodiment of the present invention.
Fig. 7 is a schematic view illustrating a connection between a first conductive line and a second conductive line according to a first embodiment of the present invention.
Fig. 8 is a schematic diagram of a septum structure according to an embodiment of the present invention.
Fig. 9 is a schematic view of a partition installation structure according to an embodiment of the present invention.
Fig. 10 is a schematic perspective view of a planar array transducer according to an embodiment of the present invention.
Fig. 11 is a schematic view of a lead unequal-pitch transformation structure according to an embodiment of the present invention.
Fig. 12 is a schematic view of a three-dimensional structure of the embodiment of the present invention with unequal-spacing lead wires.
Fig. 13 is a schematic diagram illustrating a change in the pitch of the second conductive line in the Y direction in the embodiment of the present invention.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.
As shown in fig. 1 and 2, an embodiment of the present invention provides an area array transducer apparatus 100, including:
the piezoelectric crystal 150 is used for transmitting and receiving ultrasonic waves, the radiation surface of the piezoelectric crystal 150 generates the ultrasonic waves to scan the tissue to be detected, the negative electrode layer 160 is arranged above the radiation surface of the piezoelectric crystal 150, and the negative electrode layer can be set to be a metal negative electrode layer. A matching layer is arranged above the negative electrode layer 160, namely the end face of the negative electrode layer 160 far away from the piezoelectric crystal 150, the matching layer can be one layer or multiple layers, the matching layer is connected with the piezoelectric crystal 150 in an adhesion mode, and the matching layer is used for realizing the matching of the acoustic characteristic impedance between the piezoelectric crystal 150 and the sound transmission medium. For example: when the matching layers are two layers, the first matching layer 170 and the second matching layer 180 are sequentially disposed on the radiation surface of the piezoelectric crystal 150 and are connected to each other by bonding. And a lens 190 disposed above the matching layer, i.e., the end surface of the matching layer away from the piezoelectric crystal 150, for focusing the ultrasonic beam. The positive electrode layer 130 is adhered below the piezoelectric crystal 150, i.e., on the end face of the piezoelectric crystal 150 away from the radiation surface. A primary backing 120 is bonded to the underside of the electrode layer 130, i.e., the end facing away from the piezoelectric crystal 150, and the primary backing 120 is primarily used to absorb unwanted acoustic reflections off the opposite side of the radiating face of the piezoelectric crystal 150. The planar array transducer device 100 has positive electrode layer wires disposed therein, and the positive electrode layer wires include a first wire 131 and a second wire 132. The first backing 120 has an electrode first lead 131 provided therein for electrical connection with the positive electrode layer 130 and/or the piezoelectric crystal 150. The second backing 110 is adhered below the first backing 120, i.e. the end of the first backing 120 far away from the piezoelectric crystal 150, and the second backing 110 is mainly used for supporting the main structure of the area array transducer device 100, such as supporting the first backing 120, the piezoelectric crystal 150 and the like. The second backing 110 has disposed therein a second lead 132 of an electrode for electrical connection with the first lead 131. The piezoelectric crystal 150 is cut by the cutting groove 140, the piezoelectric crystal 150 is cut into dense array elements, and the arrangement mode and the spacing of the array elements are limited by the cutting groove 140. The chip 200 (not shown) is electrically connected to the lower side of the second backing 110, i.e., the end of the second backing 110 away from the piezoelectric crystal 150.
As shown in fig. 3, the piezoelectric crystal 150 with dense array elements, because when the spacing between the array elements of the piezoelectric crystal 150 is small, the array elements electrically connect the chip 200 with the piezoelectric crystal 150 for high efficiency and reliability, the present invention provides various embodiments by adjusting the spacing between the positive electrode layer wires of the piezoelectric crystal 150, for example, amplifying the spacing between the first wire 131 and the second wire 132, in the embodiment of fig. 3, it is specified that the X direction is the first direction of the area array transducer, the Y direction is the second direction of the area array transducer, and the spacing between the first wire 131 in the X direction, that is, the spacing in the first direction, is amplified; enlarging the pitch of the second conductive lines 132 in the Y direction, i.e., the pitch in the second direction; through the distance after the two times of amplification, the distance between the second wires 132 can be enlarged, the difficulty of the chip 200 is reduced, the size of the chip 200 does not need to be designed to be small, and the chip 200 can be electrically connected with the second wires 132. The chip 200 may also be an FPC or a PCB. The array pitch of the array elements of the piezoelectric crystal 150 is (D)1，D2) Said D is1For the spacing of two array elements in a first direction, D2The first conductor 131 in the primary backing 120 for the spacing of the two array elements in the second direction, realizes that the first conductor 131 is in the first direction D1A change in pitch; second conductive lines 132 in the second backing 110, the second conductive lines 132 being implemented in a second direction D2A change in pitch. Unlike the prior art in which the pitch in one dimension of the conductors is changed in the flexible wiring board outside the backing, this embodiment achieves the change in the pitch of the conductors in two dimensions in the backing. The first array spacing (D) of the wires at the end of the original first wire 131 near the piezoelectric crystal is changed by changing the spacing between the wires in the first and second backings1，D2) Changing to a second wire array pitch (D ') of the second wire near the chip end'1，D’2). Furthermore, the space between the leads of the electrodes is changed in the two-dimensional direction, so that the leads of the electrodes with narrow array element space can be connected with a plurality of chips, and the performance of the transducer is improved.
As shown in fig. 3, the first backing 120 is provided with first wires 131, two ends of the first wires 131 are approximately flush with two ends of the first backing 120, the second backing 110 is provided with the first wires 131, and two ends of the second wires 132 are approximately flush with two ends of the second backing 110. In the primary backing 120, by enlarging the pitch of the first wires 131 in the X direction, that is, the pitch in the first direction; in the second backing 110, the pitch of the second wires 132 in the Y direction, that is, the pitch in the second direction is enlarged. In this embodiment, as shown in fig. 4, the primary backing 120 is composed of an upper portion and a lower portion, the upper portion 121 of the primary backing has a trapezoidal cross section in the X direction, i.e., the first direction, and the lower portion 122 of the primary backing has a rectangular cross section. The top end 121a of the trapezoid of the first backing upper part 121 is sized to match the size of the piezoelectric crystal 150, and the bottom end of the trapezoid of the first backing upper part 121b is sized to match the size of the first backing lower part 122. The bottom end of the rectangle of the lower portion 122 of the primary backing is sized to match the top end of the secondary backing 110. The secondary backing 110 is composed of an upper portion and a lower portion, the upper portion 111 of the secondary backing has a trapezoidal cross section in the Y direction, i.e., the second direction, and the lower portion 112 of the secondary backing has a rectangular cross section. The top trapezoidal end 111a (not shown) of the second upper backing section 111 matches the size of the first lower backing section 122, and the bottom trapezoidal end 111b (not shown) of the second upper backing section 111 matches the size of the rectangle of the second lower backing section 112. The pitch of the wires is changed by the trapezoidal magnification/reduction in the first backing 120, the second backing 110. For example, as shown in fig. 6, the pitch of the first conductive lines 131 in the X direction is enlarged by the trapezoidal enlargement of the first backing 120 in the X direction, i.e., the first direction.
In an embodiment of the present invention, as shown in fig. 4, the first conductive wire 131 includes a first conductive wire upper portion 131a (not shown) and a first conductive wire lower portion 131b (not shown), the first conductive wire upper portion 131a is disposed in the first backing upper portion 121, the first conductive wire lower portion 131b is disposed in the first backing lower portion 122, and the first conductive wire upper portion 131a and the first conductive wire lower portion 131b are integrally formed. The angle between the first wire upper portion 131a and the first wire lower portion 131b is greater than 90 ° and not higher than 150 °. At this moment, the included angle between the first wire upper portion 131a and the first wire lower portion 131b is larger than 90 degrees and not higher than 150 degrees, the length of the wire is short, and the wire is beneficial to processing, and meanwhile, the angle setting solves the problems that in the prior art, for example, the wire distance is long when the included angle is 90 degrees, and various signal transmission is not facilitated. The Z-axis direction perpendicular to the end face of the area array crystal 150 is defined as the Z-axis direction, i.e., the third direction. The first lower wire part 131b is parallel to the axial direction of the end face of the area array crystal 150, so that the second backing 110 is conveniently arranged on the end face of the first backing 120 far away from the piezoelectric crystal 150, and the included angle between the straight line of the first lower wire part 131b and the straight line of the Z axis of the end face of the piezoelectric crystal 150 is not higher than +/-2 degrees.
In an embodiment of the present invention, as shown in fig. 4, the second conductive wire 132 includes a second conductive wire upper portion 132a (not shown) and a second conductive wire lower portion 132b (not shown), the second conductive wire upper portion 132a is disposed in the second backing upper portion 111, the second conductive wire lower portion 132b is disposed in the second backing lower portion 112, and the second conductive wire upper portion 132a and the second conductive wire lower portion 132b are integrally formed. The angle between the second upper wire portion 132a and the second lower wire portion 132b is greater than 90 ° and not higher than 150 °. At this moment, the included angle between the second wire upper portion 132a and the second wire lower portion 132b is larger than 90 degrees and not higher than 150 degrees, and due to the arrangement of such an angle, the length of the wire is short, so that the processing is facilitated, and meanwhile, the problems that in the prior art, for example, the wire distance is long when the included angle is 90 degrees, and various signal transmissions are not facilitated are solved. The Z-axis direction perpendicular to the end face of the area array crystal 150 is defined as the Z-axis direction, i.e., the third direction. The angle between the line of the lower portion 132b of the second wire and the line of the Z-axis of the end face of the piezoelectric crystal 150 is not higher than ± 2 °, which facilitates the chip 200 to be mounted below the second backing 110, i.e. the end face of the second backing 110 far away from the piezoelectric crystal 150. In the prior art, the lower part of the lead is vertical to the axial direction of the end face of the piezoelectric crystal 150, so that the chip can only be installed on the side face of the back lining, which is not beneficial to installation and probe size reduction. In the embodiment, the second lower wire portion 132b is substantially parallel to the axial direction of the end face of the piezoelectric crystal 150, and the included angle between the straight line of the second lower wire portion 132b and the straight line of the Z axis of the end face of the piezoelectric crystal 150 is not higher than ± 2 °, so that the chip 200 is conveniently mounted below the second backing 110, which is beneficial to processing and mounting, and reduces signal interference and the space size inside the probe.
The first conductive traces 131 in the first backing 120 are electrically connected to the second conductive traces 132 in the second backing 110, as shown in fig. 7, the first conductive traces 131 are electrically connected to the second conductive traces 132 through the BGA process, in this embodiment, a low-temperature cured conductive adhesive, for example, a conductive adhesive with a curing temperature not higher than 80 ℃ is used to replace the BGA process solder paste, to form a first conductive paste 133 and a second conductive paste 135, and the first conductive paste 133 and the second conductive paste 135 are connected through solder balls 134. This achieves the electrical connection of the first wire 131 and the second wire 132.
An embodiment of the present invention provides a planar array transducer apparatus 100 process, comprising:
step 1) etching the copper foil with the hollowed-out pattern shown in fig. 5 by adopting a chemical etching process, wherein the copper foil comprises a plurality of electrode leads, and the thickness of the copper foil is set as T1. The array of wires near the electrodes of the array element of the planar array transducer is shown at a in fig. 6, where the X direction is defined as the 1 st direction of the planar array transducer (as shown in fig. 3). And the position B is a lead array formed by changing the leads of the electrodes into the same pitch. Of course, the wires of the electrodes may be made smaller at equal intervals, varied at unequal intervals (as shown in fig. 11 and 12), and the like, and the smaller the equal intervals of the wires may be realized by an inverted trapezoidal structure, for example.
And 2) machining the partition board, wherein the partition board is divided into an upper part and a lower part or a left part and a right part which are combined together (as shown in figure 8). As shown in fig. 5, the separator thickness is set to T2. The sum of T1 and T2 is equal to the wire array spacing of the planar array transducer in the Y direction near the array element electrodes, which is defined as the 2 nd direction of the planar array transducer (as shown in fig. 2). Of course, the partition plate may be integrally formed.
And 3) loading the copper foils and the partition plates of the array of the planar array transducer in the 2 nd direction into a first backing mould at intervals, as shown in figure 9. And pouring the prepared liquid primary backing material added with the curing agent into a mould. After curing, the mold and spacer are removed and the excess copper foil is trimmed away to form a primary backing 120 with embedded first wires 131, as shown in fig. 6. The change of the wire spacing of the wires of the planar array transducer electrodes in the 1 st direction is realized.
Step 4) the second backing 110 is similarly manufactured by making the first backing 120, as shown in fig. 13. The array pitch of the second backing 110 copper foil, marked C, is identical to the 2 nd directional array of the area array transducer. At mark D, the second conductive line 132 is a conductive line array with shifted pitches in the 2 nd direction, as shown in fig. 13.
The first direction in the embodiments of the present invention can be interchanged with the second direction, for example, the distance between the first conductive wires 131 in the second direction is changed in the first backing 120, and the distance between the second conductive wires 132 in the first direction is changed in the second backing 110, the present invention is to realize the change of the distance between the conductive wires in the two-dimensional direction through the first backing and the second backing.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to the examples, those skilled in the art should understand that the technical solutions of the present invention can be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the scope of the claims of the present invention.
Claims (10)
1. A planar array transducer assembly, comprising:
the piezoelectric crystal is used for transmitting and receiving ultrasonic signals;
the piezoelectric crystal comprises a preset array interval D1、D2Array element of (1), said D1For the spacing of two array elements in a first direction, D2The distance between the two array elements in the second direction;
the first back lining is arranged on the end face far away from the radiation face of the piezoelectric wafer and is connected with the piezoelectric wafer in an adhesion mode; the primary backing further includes first conductive lines arranged in a first direction D1A change in pitch;
the second backing is arranged on the end face, far away from the piezoelectric wafer, of the first backing and is connected with the first backing; the secondary backing further comprises secondary wires, the secondary wires being arranged in a second direction D2A change in pitch.
2. The planar array transducer assembly of claim 1 wherein the first conductor is in a first direction D1The pitch change is one of equal pitch enlargement, equal pitch reduction, unequal pitch enlargement, and unequal pitch reduction.
3. The planar array transducer assembly of claim 1 wherein the second conductive line is in a second direction D2The pitch change is one of equal pitch enlargement, equal pitch reduction, unequal pitch enlargement, and unequal pitch reduction.
4. The planar array transducer assembly of claims 1-3 wherein the first backing includes a first backing upper portion, a first backing lower portion; the first conducting wire comprises a first conducting wire upper part and a first conducting wire lower part; the included angle between the upper part of the first conducting wire and the lower part of the first conducting wire is larger than 90 degrees and not higher than 150 degrees.
5. The area array transducer assembly of claim 4 wherein the lower portion of the first wire is substantially parallel to the Z axis of the piezoelectric crystal.
6. The area array transducer arrangement of claim 4 wherein the first lower backing portion is parallel to the piezoelectric crystal in the first direction.
7. The planar array transducer assembly of claims 1-3 wherein the secondary backing includes a secondary backing upper portion, a secondary backing lower portion; the second conducting wire comprises a second conducting wire upper part and a second conducting wire lower part; and the included angle between the upper part of the second conducting wire and the lower part of the second conducting wire is larger than 90 degrees and not higher than 150 degrees.
8. The area array transducer assembly of claim 7 wherein the lower portion of the second wire is substantially parallel to the Z-axis of the piezoelectric crystal.
9. The area array transducer arrangement of claim 7 wherein the second lower backing portion is parallel to the piezoelectric crystal in the second direction.
10. The area array transducer assembly of any one of claims 1-3 wherein the first conductive lines and the second conductive lines are connected by a ball grid array packaging process; the first conducting wire and the second conducting wire are connected through the conducting paste and the solder balls.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922441456.2U CN211534504U (en) | 2019-12-30 | 2019-12-30 | Area array transducer arrangement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922441456.2U CN211534504U (en) | 2019-12-30 | 2019-12-30 | Area array transducer arrangement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211534504U true CN211534504U (en) | 2020-09-22 |
Family
ID=72511677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922441456.2U Active CN211534504U (en) | 2019-12-30 | 2019-12-30 | Area array transducer arrangement |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211534504U (en) |
-
2019
- 2019-12-30 CN CN201922441456.2U patent/CN211534504U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7103960B2 (en) | Method for providing a backing member for an acoustic transducer array | |
| US7795784B2 (en) | Redistribution interconnect for microbeamforming(s) and a medical ultrasound system | |
| US9907538B2 (en) | High frequency ultrasound probe | |
| JP3279375B2 (en) | Support for acoustic transducer array | |
| US8410666B2 (en) | Ultrasonic probe and method of manufacturing the same | |
| JP4408974B2 (en) | Ultrasonic transducer and manufacturing method thereof | |
| US6859984B2 (en) | Method for providing a matrix array ultrasonic transducer with an integrated interconnection means | |
| KR20100104535A (en) | Probe for ultrasonic diagnostic apparatus and manufacturing method thereof | |
| CN113042347A (en) | Array ultrasonic transducer | |
| JP3319532B2 (en) | Two-dimensional array type ultrasonic probe and manufacturing method thereof, two-dimensional array type ultrasonic convex probe | |
| CN211534504U (en) | Area array transducer arrangement | |
| CN110960261A (en) | Area array transducer arrangement | |
| JP7049323B2 (en) | Flexible circuit with redundant connection points for ultrasonic arrays | |
| CN214766703U (en) | Array ultrasonic transducer | |
| CN112757554B (en) | Ultrasonic transducer and manufacturing process thereof | |
| CN108926362A (en) | A kind of ultra-high density arrays energy converter | |
| CN111558514B (en) | Ultrasonic transducer | |
| CN111050666B (en) | Ultrasonic probe and method for manufacturing same | |
| JPS63276400A (en) | Ultrasonic probe and its manufacture | |
| JP3851743B2 (en) | Electronic scanning ultrasonic probe | |
| JP4709718B2 (en) | Ultrasonic probe and manufacturing method thereof | |
| WO2020077639A1 (en) | Backing block of ultrasonic area-array probe, ultrasonic area-array probe, and ultrasonic diagnosis and imaging device | |
| JP4709718B6 (en) | Ultrasonic probe and manufacturing method thereof | |
| KR20180056979A (en) | Ultrasound transducer having convex-concave surface by using non-stackable flexible printed circuit board and manufacturing method therefor | |
| JPH05130694A (en) | Method for connecting multicore cable |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |