CN211177506U

CN211177506U - Wind deflector adopting Peltier effect

Info

Publication number: CN211177506U
Application number: CN201921869006.7U
Authority: CN
Inventors: 鲁亚萍; 邵旭平
Original assignee: Mengyue Comfort Technology Shanghai Co ltd
Current assignee: Mengyue Comfort Technology Shanghai Co ltd
Priority date: 2019-11-01
Filing date: 2019-11-01
Publication date: 2020-08-04
Anticipated expiration: 2029-11-01

Abstract

The utility model discloses an adopt wind-guiding ware of peltier effect, including the upper cover, radiating fin, lower cover and semiconductor wafer, the semiconductor wafer sets up in the middle of radiating fin, radiating fin sets up in the casing that comprises upper cover and lower cover, constitute the air intake of wind-guiding ware by the last inlet end of upper cover and the lower inlet end of lower cover, upwards extend at the up end of the low reaches end of upper cover and set up the air outlet, the low reaches end at the lower cover sets up the gas vent, air intake and the coaxial setting of gas vent are in radiating fin's both ends side, air outlet vertically sets up between the upper reaches of radiating fin's low reaches and gas vent. The air guide device is simple in structure, flexible to operate and convenient to use, installation efficiency can be improved, production cost is reduced, and the exhaust port can be used for connecting an exhaust device and a multi-pipe exhaust device.

Description

Wind deflector adopting Peltier effect

Technical Field

The utility model relates to a control by temperature change wind-guiding technical field especially relates to an adopt wind-guiding ware of peltier effect.

Background

In 1834, the french scientist peltier found thermoelectric cooling and heating phenomena, namely the metallic thermoelectric reverse effect. A pair of thermocouples is formed by two different metals, and when direct current is input into the thermocouples, heat absorption and heat release phenomena are generated at the junctions of the thermocouples due to different directions of the direct current, which are called as the Peltier effect. The thermoelectric material is a semiconductor material, and after being electrified, one end of the thermoelectric material absorbs heat, and the other end releases heat, so that the thermoelectric material can play a role in refrigerating and heating by utilizing the characteristic. In recent years, thermoelectric refrigeration devices integrated by thermoelectric materials have been widely used in industries such as automobile air conditioning seats, environment-friendly refrigerators, and the like.

The thermoelectric semiconductor heating and refrigerating devices in the current market are not different from each other in air inlet and air outlet, for example, patent CN201820355044X, thermoelectric semiconductor module 3, and if the air outlet is in a closed space, the heat dissipation will be not smooth, which results in the performance reduction of the devices. The air outlet of the traditional thermoelectric semiconductor heating and cooling device is connected to the outside of the seat by using a plurality of connecting pieces or a through pipe, the method is single, and the installation is not flexible.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the present invention provides a wind deflector using peltier effect, which can solve the above problems.

The purpose of the utility model is realized by adopting the following technical scheme:

the utility model provides an adopt wind-guiding ware of Peltier effect, includes upper cover, radiating fin, lower cover and semiconductor wafer, the semiconductor wafer sets up in the middle of the radiating fin, the radiating fin sets up in the casing that comprises upper cover and lower cover, constitutes the air intake of wind-guiding ware by the last inlet end of upper cover and the lower inlet end of lower cover, upwards extend to set up the air outlet at the upper end of the low reaches end of upper cover, set up the gas vent in the low reaches end of lower cover, air intake and gas vent coaxial setting are in the both ends side of radiating fin, the perpendicular setting of air outlet is in between the low reaches of radiating fin and the upper reaches of gas vent.

Preferably, an exhaust device is sleeved in the exhaust port.

Preferably, the heat dissipation fin comprises an upper fin group and a lower fin group which are arranged at intervals up and down, and the semiconductor fin is arranged in a spacing layer between the upper fin group and the lower fin group.

Preferably, a buckle is arranged at the downstream end of the upper cover, and a clamping groove corresponding to the buckle is formed at the upstream end of the exhaust port of the lower cover.

Preferably, the air guide device further comprises a heat insulation sleeve wrapping the outer peripheral wall of the radiating fin, and a flow guide notch is formed in the lower end of the upper wall of the heat insulation sleeve and is located below the air outlet.

Preferably, an upper cover opening is formed on the upper cover, and a lower cover opening is formed on the lower cover, corresponding to the heat dissipation fins.

Preferably, the semiconductor wafer comprises an upper heating layer and a lower cooling layer, and a connecting lead is arranged from one end of the semiconductor wafer.

Preferably, the air deflector further comprises an arc-shaped air deflector, an air deflector seat extends upwards from the tail end of the horizontal part of the butt joint part of the lower cover and the upper cover in an arc shape to form an air outlet, and the air deflector is mounted on the air deflector seat.

Preferably, the air deflector further comprises two mounting lugs connected to both side end walls of the upper and/or lower cover.

Preferably, the air inlet, the air outlet and the air outlet are kidney-round tube holes.

Preferably, the exhaust device is a three-hole exhaust pipe sleeve body.

Preferably, the exhaust port is of a butt-joint structure and comprises an upper exhaust part and a lower exhaust part, three rows of through holes are formed in the butt-joint structure to serve as exhaust channels, and arc-shaped guide plates are integrally arranged at the gas inflow part of the upper exhaust part.

Preferably, the mounting lugs are integrally formed on both side end walls of the upper cover.

Compared with the prior art, the beneficial effects of the utility model reside in that: 1. the air guide device is simple in structure, flexible to operate and convenient to use; 2. the air guide device greatly improves the installation efficiency and reduces the production cost in the aspect of seat installation; 3. the exhaust port of the air guide device has two purposes; 4. the exhaust port can simultaneously realize the function of connecting one exhaust device and the multi-pipe exhaust device.

Drawings

Fig. 1 is a schematic structural view of a wind deflector using peltier effect according to the present invention;

FIG. 2 is a schematic view of another perspective of a wind deflector employing the Peltier effect;

FIG. 3 is a schematic view of a baffle mounted to a lower cover;

FIG. 4 is an exploded view of a wind deflector employing the Peltier effect;

FIG. 5 is an exploded view of another embodiment of a vent in the lower cover.

In the figure: 1. an upper cover; 11. an upper cover opening; 12. buckling; 2. a heat dissipating fin; 21. an upper fin group; 22. a lower fin group; 3. a lower cover; 31. a lower cover opening; 32. a card slot; 33. a flow guide seat; 4. a semiconductor wafer; 41. an upper heat generating layer; 42. a lower refrigeration layer; 43. connecting a lead; 51. an upper air inlet end; 52. a lower air inlet end; 5. an air inlet; 6. an air outlet; 7. an exhaust port; 71. an upper exhaust part; 72. a lower exhaust part; 8. an exhaust device; 9. a thermal insulation sleeve; 91. a diversion gap; 10. mounting a lug; 100. a baffle.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1 to 4, an air deflector using peltier effect includes an upper cover 1, a heat dissipating fin 2, a lower cover 3 and a semiconductor fin 4, the semiconductor fin 4 is disposed in the middle of the heat dissipating fin 2, the heat dissipating fin 2 is disposed in a casing formed by the upper cover 1 and the lower cover 3, an air inlet 5 of the air deflector is formed by an upper air inlet end 51 of the upper cover 1 and a lower air inlet end 52 of the lower cover 3, an air outlet 6 extends upward from an upper end of a downstream end of the upper cover 1, an air outlet 7 is disposed at a downstream end of the lower cover 3, the air inlet 5 and the air outlet 7 are coaxially disposed at two end sides of the heat dissipating fin 2, and the air outlet 6 is vertically disposed between a downstream of the heat dissipating fin 2 and an upstream of the air outlet 7.

The air inlet 5, the air outlet 6 and the air outlet 7 are kidney-shaped pipe holes.

Referring to fig. 4, an exhaust device 8 is sleeved in the exhaust port 7. The exhaust device 8 is a three-hole exhaust pipe sleeve body. The exhaust port 7 can simultaneously realize the dual-purpose function of connecting one exhaust device or a multi-pipe exhaust device; when used for connecting a single exhaust, the exhaust port 7 is connected in only one connection mode, and when used for connecting a multi-pipe exhaust, the exhaust port 7 can be selected from a three-hole exhaust pipe sleeve body or an exhaust device connected in series.

The heat dissipation fin 2 comprises an upper fin group 21 and a lower fin group 22 which are arranged at intervals up and down, and the semiconductor fin 4 is arranged in a spacing layer between the upper fin group 21 and the lower fin group 22.

A buckle 12 is arranged at the downstream end of the upper cover 1, and a clamping groove 32 corresponding to the buckle 12 is arranged at the upstream end of the exhaust port 7 of the lower cover 3.

The air guide device further comprises a heat insulation sleeve 9 wrapping the outer peripheral wall of the radiating fin 2, a flow guide notch 91 is formed in the downstream end of the upper wall of the heat insulation sleeve 9, and the flow guide notch 91 is located below the air outlet 6. The diversion notches 91 are used for guiding the airflow of the upper fin group 21 to the air outlet 6 more smoothly.

Corresponding to the heat dissipation fins 2, an upper cover opening 11 is formed in the upper cover 1, and a lower cover opening 31 is formed in the lower cover 3.

The semiconductor chip 4 includes an upper heat generating layer 41 and a lower cooling layer 42, and a connection lead 43 is provided from one end of the semiconductor chip 4.

The air deflector further comprises an arc-shaped guide plate 100, a guide seat 33 which extends upwards from the tail end of the horizontal part of the butt joint part of the lower cover 3 and the upper cover 1 in an arc shape to form an air outlet 6, and the guide plate 100 is installed on the guide seat 33. The guide plate 100 is made of a heat insulation material, and has both a guide function and a heat insulation function.

The wind deflector further comprises two mounting lugs 10, said mounting lugs 10 being connected to the two side end walls of said upper and

lower covers

1, 3.

In another embodiment, the exhaust port 7 is a butt-joint structure, and includes an upper exhaust portion 71 and a lower exhaust portion 72, and the butt-joint structure 7 is provided with three rows of through holes as exhaust channels, and an arc-shaped baffle 100 is integrally disposed at a gas inflow portion of the upper exhaust portion 71. Therefore, the condition that the exhaust device 8 is arranged independently is eliminated, the structure is simpler, and the cost is lower.

The air deflector may be used in a wide variety of applications, but is not limited to, ventilation systems or heating systems for car seats or refrigeration units.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims

1. The utility model provides an adopt wind-guiding ware of Peltier effect, includes upper cover (1), radiating fin (2), lower cover (3) and semiconductor wafer (4), its characterized in that: the semiconductor chip (4) is arranged in the middle of the radiating fin (2), the radiating fin (2) is arranged in a shell formed by an upper cover (1) and a lower cover (3), an air inlet (5) of an air deflector is formed by an upper air inlet end (51) of the upper cover (1) and a lower air inlet end (52) of the lower cover (3), an air outlet (6) extends upwards from the upper end of the downstream end of the upper cover (1), an air outlet (7) is arranged at the downstream end of the lower cover (3), the air inlet (5) and the air outlet (7) are coaxially arranged at two end sides of the radiating fin (2), and the air outlet (6) is vertically arranged between the downstream of the radiating fin (2) and the upstream of the air outlet (7).

2. The wind deflector of claim 1, wherein: and an exhaust device (8) is sleeved in the exhaust port (7).

3. The wind deflector of claim 1, wherein: the radiating fins (2) comprise upper fin groups (21) and lower fin groups (22) which are arranged at intervals up and down, and the semiconductor fins (4) are arranged in a spacing layer between the upper fin groups (21) and the lower fin groups (22).

4. The wind deflector of claim 1, wherein: a buckle (12) is arranged at the downstream end of the upper cover (1), and a clamping groove (32) is formed at the upstream end of the exhaust port (7) of the lower cover (3) and corresponds to the buckle (12).

5. The wind deflector of claim 1, wherein: the air guide device further comprises a heat insulation sleeve (9) wrapping the outer peripheral wall of the radiating fin (2), a flow guide notch (91) is formed in the downstream end of the upper wall of the heat insulation sleeve (9), and the flow guide notch (91) is located below the air outlet (6).

6. The wind deflector of claim 1, wherein: an upper cover opening (11) is arranged on the upper cover (1) corresponding to the radiating fins (2), and a lower cover opening (31) is arranged on the lower cover (3).

7. The wind deflector of claim 1, wherein: the semiconductor wafer (4) comprises an upper heating layer (41) and a lower cooling layer (42), and a connecting lead (43) is arranged at one end of the semiconductor wafer (4).

8. The wind deflector of claim 1, wherein: the air deflector further comprises an arc-shaped guide plate (100), a guide seat (33) of an air outlet (6) is formed by extending upwards from the tail end of the horizontal part of the butt joint part of the lower cover (3) and the upper cover (1) in an arc shape, and the guide plate (100) is installed on the guide seat (33).

9. The wind deflector of claim 5, wherein: the device further comprises two mounting lugs (10), said mounting lugs (10) being connected to the two side end walls of said upper and/or lower cover (1, 3).

10. The wind deflector of claim 1, wherein: the exhaust port (7) is of a butt-joint structure and comprises an upper exhaust part (71) and a lower exhaust part (72), three rows of through holes are formed in the butt-joint structure to serve as exhaust channels, and arc-shaped guide plates (100) are integrally arranged at the gas inflow part of the upper exhaust part (71).