CN210765128U - Water-based temperature control viscose glue fixing structure - Google Patents
Water-based temperature control viscose glue fixing structure Download PDFInfo
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- CN210765128U CN210765128U CN201920932782.0U CN201920932782U CN210765128U CN 210765128 U CN210765128 U CN 210765128U CN 201920932782 U CN201920932782 U CN 201920932782U CN 210765128 U CN210765128 U CN 210765128U
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Abstract
The utility model relates to a water-based temperature-controlled bonding and separating adhesive fixing structure, which comprises a release layer, a bonding and separating adhesive layer and a substrate, wherein the release layer completely covers the bonding and separating adhesive layer which is attached on the substrate; the adhesive layer is a hydrogenated rosin methyl ester adhesive layer with the thickness of 10-60 um. This structure adopts waterborne control by temperature change to glue from, and green is pollution-free to the environment, and substrate reuse has high adhesion under the uniform temperature, can subtract the viscidity fast under the low temperature, and easily the product is peeled off fast, and does not have the cull, and usable alkali lye soaks under the uniform temperature and will glue from the glue film and remove from the substrate surface fast. The structure can be applied to the fixing processing of optical glass lenses such as flexible substrates and optical filters, and semiconductor materials such as monocrystalline silicon wafers under UV irradiation and at different temperatures.
Description
Technical Field
The utility model belongs to the technical field of polymer adhesive development technique and specifically relates to a waterborne temperature control bonding is from gluing fixed knot and is constructed.
Background
In the process of processing optical lens glass or semiconductors such as optical filters and the like, such as monocrystalline silicon wafers, when the lens glass or the semiconductor silicon wafers are cut and ground, the lens glass or the semiconductor silicon wafers are usually fixed by adopting an adhesive for assistance, so that damage caused by movement of components in a cutting process is avoided. After the processing is finished, the processed product is easily stripped from the fixed adhesive film, and the wafer material is not influenced. At present, two kinds of thermal viscosity reducing adhesive and UV viscosity reducing adhesive are mainly available on the market, wherein the viscosity of the thermal viscosity reducing adhesive is controlled by temperature, and the viscosity of the UV viscosity reducing adhesive is controlled by illumination.
However, when a metal circuit is processed, the flexible material needs to be fixed on a substrate, and the yellow light process and the metal ion sputtering process need to be carried out under different temperatures and illumination conditions. The same problem exists in the processing of optical lenses or semiconductor materials.
SUMMERY OF THE UTILITY MODEL
In order to solve the problems, the utility model provides a water-based temperature-control separation glue fixing structure, which adopts a water-based separation glue layer, and can realize the separation of the separation glue layer and a base material by soaking the fixing structure in an alkaline solution; within a certain temperature range, the adhesive has high cohesiveness, can quickly strip the protected workpiece under temperature reduction, has no residual adhesive during stripping, and can be used for fixing and processing optical glass lenses such as flexible substrates and optical filters, and semiconductor materials such as monocrystalline silicon wafers under UV irradiation and at different temperatures.
In the water-based temperature control bonding and separating glue fixing structure, the release layer is used for protecting the bonding and separating glue layer from being polluted, and the release layer is torn off to expose the bonding and separating glue layer when in use and is used for fixedly bonding workpieces to be processed, such as optical glass lenses such as flexible substrates and optical filters, and semiconductor materials such as monocrystalline silicon wafers after being heated. The base material provides a supporting structure for the whole product, and in the process of preparing the water-based temperature control adhesive fixing structure, the base material is used as a carrier for coating and curing the adhesive layer, and in the use process, the base material provides a fixing medium for a workpiece to be processed, so that the processing operation is convenient. After the fixing structure is used, the workpiece can quickly and automatically fall off from the surface of the temperature-control sticky separation film layer by adopting a cooling technology (for example, the temperature is reduced to below 10 ℃), and no adhesive residue exists; the temperature-controlled adhesive layer on the base material can be automatically peeled off without adhesive residue after being soaked in aqueous alkali at 40-80 ℃ for 1-10 min. The substrate can be reused.
In order to solve the technical problem, the utility model discloses take following scheme:
a water-based temperature-control bonding and separating adhesive fixing structure comprises a release layer, a bonding and separating adhesive layer and a base material, wherein the release layer completely covers the bonding and separating adhesive layer which is attached to the base material; the adhesive layer is a hydrogenated rosin methyl ester adhesive layer with the thickness of 10-60 um. The hydrogenated rosin methyl ester adhesive layer is a layer formed by drying a mixture of an adhesive and hydrogenated rosin methyl ester.
Further, the release layer is a release film or release paper.
Further, the release layer is a PET release film.
Furthermore, the adhesive separation glue layer is a thin layer composed of a mixture of an adhesive and hydrogenated rosin methyl ester, and the adhesive is a high polymer.
Furthermore, the thickness of the adhesive layer is 20-30 um.
Further, the base material is any one of a release material, a glass plate, a plastic substrate, a flexible film material or metal.
Based on the same inventive concept, the utility model also provides another water-based temperature control separation glue fixing structure, which comprises two separation layers, two separation glue layers and a base material, wherein the two separation glue layers are respectively attached to the upper surface and the lower surface of the base material, and the two separation layers completely cover the separation glue layers respectively positioned on the upper surface and the lower surface of the base material; the adhesive layer is a hydrogenated rosin methyl ester adhesive layer with the thickness of 10-60 um. The hydrogenated rosin methyl ester adhesive layer is a layer formed by drying a mixture of an adhesive and hydrogenated rosin methyl ester.
Further, the release layer is a release film or release paper.
Further, the adhesive-separating layer is formed by mixing an adhesive and hydrogenated rosin methyl ester, wherein the adhesive is a high molecular polymer; the thickness of the adhesive layer on the upper surface and the thickness of the adhesive layer on the lower surface of the base material are equal.
Further, the base material is any one of a release material, a glass plate, a plastic substrate, a flexible film material or metal.
Through adopting aforementioned technical scheme, the utility model discloses compare with prior art, adopt waterborne to glue from glue film green, pollution-free to the environment, substrate reuse, this fixed knot structure has high adhesion under the uniform temperature, can subtract the viscidity fast under the low temperature, and does not have the cull, and usable alkali lye soaks to fade glues. The fixing structure can be applied to fixing and processing of optical glass lenses such as flexible substrates and optical filters, and semiconductor materials such as monocrystalline silicon wafers under UV irradiation and at different temperatures.
Drawings
Fig. 1 is a schematic structural view of an aqueous temperature-controlled adhesive fixing structure provided in embodiment 1 of the present invention;
fig. 2 is a schematic structural view of an aqueous temperature-controlled adhesive fixing structure provided in embodiment 2 of the present invention.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings and detailed description, but those skilled in the art will understand that the following described embodiments are some, not all, of the embodiments of the present invention, and are only used for illustrating the present invention, and should not be construed as limiting the scope of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention. The examples, in which specific conditions are not specified, were conducted under conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1:
referring to fig. 1, the aqueous temperature-controlled adhesive fixing structure is composed of a release layer 1, an adhesive layer 2 and a substrate 3, wherein the release layer 1 is a PET release film, the release layer 1 completely covers the adhesive layer 2, the adhesive layer 2 is a mixture of an adhesive and hydrogenated rosin methyl ester, the thickness of the adhesive is 25um, and the adhesive is a high molecular polymer. The adhesive layer 2 is attached to the surface of the substrate 3, and the substrate 3 is a glass plate with the thickness of 1 mm.
The water-based temperature-control adhesive fixing structure has 180-degree stripping force of more than 600gf/25mm at 40-100 ℃, and has lasting adhesion to workpieces for 7 days. After being baked for 1h at the temperature of 150-. After being irradiated by ultraviolet for 72h, the test stripping force is unchanged compared with that before irradiation, and the fixed workpiece can be rapidly peeled off from the surface of the adhesive film by adopting (1) a cooling method and (2) the adhesive film on the surface of the base material is removed by adopting an alkali solution soaking method.
Example 2:
referring to fig. 2, the water-based temperature-controlled adhesive fixing structure is composed of a first release layer 1, a first adhesive layer 2, a substrate 3, a second adhesive layer 4 and a second release layer 5, wherein the first release layer 1 and the second release layer 5 are PET release films, the first release layer 1 and the second release layer 5 respectively and completely cover the first adhesive layer 2 and the second adhesive layer 4, the first adhesive layer 2 and the second adhesive layer 4 are formed by a mixture of an adhesive and hydrogenated rosin methyl ester, the thickness of the adhesive is 20um, and the adhesive is a polymer, such as acrylic resin, polyurethane resin and the like. The base material 3 is positioned between the first adhesive layer 2 and the second adhesive layer 4, the edge of the base material 3 exceeds the outer edges of the first adhesive layer 2 and the second adhesive layer 4, and the exceeding part is convenient for moving and fixing the product. The substrate 3 is an acrylic plate and has a thickness of 1 cm.
Compared with the embodiment 1, the product has a double-sided structure, two workpieces can be simultaneously fixed on two sides of the base material 3, and the workpiece processing efficiency is improved.
Example 3
A water-based temperature control bonding and separating adhesive fixing structure comprises a release layer 1, a bonding and separating adhesive layer 2 and a substrate 3, wherein the release layer 1 is release paper, the release layer 1 completely covers the bonding and separating adhesive layer 2, the bonding and separating adhesive layer 2 is formed by a mixture of an adhesive and hydrogenated rosin methyl ester, the thickness of the bonding and separating adhesive is 30 micrometers, and the adhesive is a high-molecular polymer such as acrylic resin, polyurethane resin and the like. The adhesive layer 2 is attached to the surface of the base material 3, and the base material 3 is acrylic and 1cm thick.
The present embodiment is only exemplary, the present invention is not limited to this structure, and it should be understood by those skilled in the art that the thickness of the bond line 2 may also be other values, such as 22, 24, 26, 28um, to meet the fixing requirements of workpieces with different thicknesses.
Example 4
A water-based temperature control bonding and separating adhesive fixing structure comprises a release layer 1, a bonding and separating adhesive layer 2 and a substrate 3, wherein the release layer 1 is a PET release film, the release layer 1 completely covers the bonding and separating adhesive layer 2, the bonding and separating adhesive layer 2 is formed by a mixture of an adhesive and hydrogenated rosin methyl ester, the thickness of the bonding and separating adhesive is 50 micrometers, and the adhesive is a high-molecular polymer, such as acrylic resin, polyurethane resin and the like. The adhesive layer 2 is attached to the surface of the base material 3, and the base material 3 is a flexible film with the thickness of 0.5 cm.
Example 5
The utility model provides a waterborne control by temperature change glues from gluing fixed knot and constructs, by first from type layer 1, first glue from the glue film 2, substrate 3, the second glues from the glue film 4, the second is from type layer 5 and constitutes, wherein first from type layer 1 and second from type layer 5 for from type paper, first from type layer 1 and second from type layer 5 cover first glue from glue film 2 and second glue from glue film 4 respectively completely, first glue from glue film 2 and second glue from glue film 4 and constitute for the mixture of adhesive and hydrogenated rosin methyl ester, thickness is 10um, the adhesive is polymer, like acrylic resin, polyurethane resin etc.. The substrate 3 is positioned between the first debonding glue layer 2 and the second debonding glue layer 4. The substrate 3 is a release material plate with the thickness of 0.8 cm.
Example 6
The utility model provides a waterborne control by temperature change glues from gluing fixed knot and constructs, by first from type layer 1, first glue from the glue film 2, substrate 3, the second glues from the glue film 4, the second is from type layer 5 and constitutes, wherein first from type layer 1 and second from type layer 5 for PET release film, first from type layer 1 and second from type layer 5 cover first glue from glue film 2 and second glue from glue film 4 respectively completely, first glue from glue film 2 and second glue from glue film 4 and constitute for the mixture of adhesive and hydrogenated rosin methyl ester, thickness is 60um, the adhesive is polymer, like acrylic resin, polyurethane resin etc.. . The base material 3 is positioned between the first adhesive layer 2 and the second adhesive layer 4, the edge of the base material 3 exceeds the outer edges of the first adhesive layer 2 and the second adhesive layer 4, and the exceeding part is convenient for moving and fixing the product. The substrate 3 is a copper plate with a thickness of 0.4 cm.
Example 7
The utility model provides a waterborne control by temperature change glues from gluing fixed knot and constructs, by first from type layer 1, first glue from the glue film 2, substrate 3, the second glues from the glue film 4, the second is from type layer 5 and constitutes, wherein first from type layer 1 and second from type layer 5 for from type paper, first from type layer 1 and second from type layer 5 cover first glue from glue film 2 and second glue from glue film 4 respectively completely, first glue from glue film 2 and second glue from glue film 4 and constitute for the mixture of adhesive and hydrogenated rosin methyl ester, thickness is 40um, the adhesive is polymer, like acrylic resin, polyurethane resin etc.. The substrate 3 is positioned between the first debonding glue layer 2 and the second debonding glue layer 4. The substrate 3 is a release material plate with the thickness of 0.8 cm.
Although embodiments of the present invention have been shown and described, it is to be understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that changes, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art without departing from the principles and spirit of the present invention.
Claims (9)
1. The utility model provides a waterborne control by temperature change viscose fixed knot constructs which characterized in that: the release layer completely covers the adhesive layer, and the adhesive layer is attached to the base material; the adhesive layer is a hydrogenated rosin methyl ester adhesive layer with the thickness of 10-60 um.
2. The aqueous temperature-controlled adhesive fixing structure according to claim 1, wherein: the release layer is a release film or release paper.
3. The aqueous temperature-controlled adhesive fixing structure according to claim 2, characterized in that: the release layer is a PET release film.
4. The aqueous temperature-controlled adhesive fixing structure according to claim 1, wherein: the thickness of the adhesive layer is 20-30 um.
5. The aqueous temperature-controlled adhesive fixing structure according to claim 1, wherein: the base material is any one of a release material, a glass plate, a plastic substrate, a flexible film material or metal.
6. The utility model provides a waterborne control by temperature change viscose fixed knot constructs which characterized in that: the adhesive-release-type film comprises two release layers, two adhesive-release-type adhesive layers and a base material, wherein the two adhesive-release-type adhesive layers are respectively attached to the upper surface and the lower surface of the base material, and the two release layers completely cover the adhesive-release-type adhesive layers respectively positioned on the upper surface and the lower surface of the base material; the adhesive layer is a hydrogenated rosin methyl ester adhesive layer with the thickness of 10-60 um.
7. The aqueous temperature controlled adhesive fixation structure of claim 6, wherein: the release layer is a release film or release paper.
8. The aqueous temperature controlled adhesive fixation structure of claim 6, wherein: the thickness of the adhesive layer on the upper surface and the thickness of the adhesive layer on the lower surface of the base material are equal.
9. The aqueous temperature controlled adhesive fixation structure of claim 6, wherein: the base material is any one of a release material, a glass plate, a plastic substrate, a flexible film material or metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920932782.0U CN210765128U (en) | 2019-06-20 | 2019-06-20 | Water-based temperature control viscose glue fixing structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920932782.0U CN210765128U (en) | 2019-06-20 | 2019-06-20 | Water-based temperature control viscose glue fixing structure |
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| CN210765128U true CN210765128U (en) | 2020-06-16 |
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| CN201920932782.0U Active CN210765128U (en) | 2019-06-20 | 2019-06-20 | Water-based temperature control viscose glue fixing structure |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114605081A (en) * | 2022-04-27 | 2022-06-10 | 江西沃格光电股份有限公司 | Preparation method of ultrathin glass with low fragment rate |
| CN114605081B (en) * | 2022-04-27 | 2024-05-14 | 江西沃格光电股份有限公司 | Preparation method of low-fragment-rate ultrathin glass |
-
2019
- 2019-06-20 CN CN201920932782.0U patent/CN210765128U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114605081A (en) * | 2022-04-27 | 2022-06-10 | 江西沃格光电股份有限公司 | Preparation method of ultrathin glass with low fragment rate |
| CN114605081B (en) * | 2022-04-27 | 2024-05-14 | 江西沃格光电股份有限公司 | Preparation method of low-fragment-rate ultrathin glass |
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