CN210596244U - Magnetron sputtering coating system for preparing dysprosium/terbium coating - Google Patents
Magnetron sputtering coating system for preparing dysprosium/terbium coating Download PDFInfo
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- CN210596244U CN210596244U CN201920675757.9U CN201920675757U CN210596244U CN 210596244 U CN210596244 U CN 210596244U CN 201920675757 U CN201920675757 U CN 201920675757U CN 210596244 U CN210596244 U CN 210596244U
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Abstract
The utility model discloses a magnetron sputtering coating system for preparing dysprosium/terbium coating, a magnetron sputtering source used by the system has the characteristic of a tubular structure, a magnet is arranged on the outer side of the tube wall of the tubular magnetron sputtering source, a heavy rare earth target material is embedded in the tube wall, and a workpiece frame is arranged on an end cover and can rotate along the axis of the tubular magnetron sputtering source; a film coating space is formed in the tubular sputtering source, the magnetron sputtering discharge and the hollow cathode discharge are coupled together, the plasma density is high, the film deposition rate is far higher than that of the conventional magnetron sputtering, meanwhile, due to the characteristic of a tubular structure, the main part of the sputtered material of the target material is deposited on the workpiece, and the other part of the sputtered material returns to the surface of the target material again, so that the utilization rate of the target material is high, meanwhile, the workpiece on the workpiece frame is rotated along the axis of the tubular source, the sputtered material is uniformly received, and a dysprosium/terbium coating with uniform thickness distribution is formed.
Description
Technical Field
The utility model relates to a magnetron sputtering technical field especially relates to a magnetron sputtering coating system for preparing dysprosium terbium cladding material.
Background
The sintered Nd-Fe-B magnet unit has excellent comprehensive magnetic performance, and is widely applied to many fields such as energy transportation, medical equipment, electronic communication, instruments and meters and the like at present. In recent years, with the rapid development of new energy automobiles and the wind power generation industry, new requirements are put forward on the performance of a high-end sintered neodymium-iron-boron magnet unit, particularly the heat resistance of the magnet unit. Specifically, the magnet unit is required to have a high maximum energy product BHmax while having an intrinsic coercive force Hcj as high as possible. Thereby ensuring that the magnet unit can be used for a long time under the condition of high temperature and can keep stable magnetic performance.
The conventional method directly adds heavy rare earth elements Dy, Tb to improve the coercive force during the magnet unit manufacturing process, but needs to consume a large amount of expensive heavy rare earth elements Dy and Tb. Meanwhile, the antiferromagnetic coupling of the heavy rare earth element and iron may lower the saturation magnetization and the residual magnetization of the magnet unit product. In order to solve the problem, the Grain Boundary Diffusion Processing technology developed in recent years prepares a layer of heavy rare earth elements on the surface of a magnet unit blank, and after a proper heat treatment step, the heavy rare earth elements penetrate through the Grain Boundary of a sintered blank, diffuse into the blank and preferentially distribute near the main phase Grain Boundary, so that the non-uniform anisotropy of the heavy rare earth elements is fully exerted. The technology is very effective for the magnet unit with smaller size, particularly the thickness in the magnetizing direction is less than 10mm, and the coercive force of the magnet unit can be obviously improved under the condition of not reducing the remanence.
The core of the grain boundary diffusion treatment technology is to form an adhesion layer of heavy rare earth elements on the surface of a magnet unit blank quickly, efficiently and economically by coating, sputtering plating or evaporation plating and other methods. Patent document CN106205924A discloses a method for preparing a heavy rare earth element adhesion layer on the surface of a magnet unit by a slurry coating method, and the method mainly has the problems of large material waste, weak coating bonding force, poor thickness uniformity and inconvenience for the subsequent thermal diffusion process. Patent documents CN101652821 and CN101163814 disclose a process method and an evaporation equipment for evaporation plating Dy and Tb, respectively, but the directionality of evaporation, the process controllability and the existence of a large amount of evaporation waste limit the use of such methods. In comparison, Dy and Tb coatings obtained by vacuum sputtering coating have the advantages of good binding force with a magnet unit substrate, uniform film thickness distribution and the like, so that the subsequent diffusion and permeation process is facilitated, the effect of improving the coercive force of Dy and Tb can be fully exerted, and the waste of materials is avoided.
However, for the current commonly used systems for magnetron sputtering Dy and Tb plating in the industry, the conventional planar magnetron sputtering source and the pass-through design are still adopted to complete the plating. Such methods and systems suffer from the following disadvantages: 1 the deposition rate is very low. A single source deposition rate of less than 10 microns/hour; 2, the utilization rate of the target is very low, and although the sputtering utilization rate of a large number of tiled magnet unit blanks can reach more than 80%, the sputtering position of the target is fixed, and the overall sputtering rate is less than 40%, so that the final target utilization rate is still only about 30%; 3, the equipment is expensive, complex and poor in flexibility; 4 for satisfying batch production's requirement, this type of system adopts multisource, multi-chamber's structure more, and equipment cost is high, the reliability is relatively poor, and the throughput is relatively poor on the contrary to the order of small batch volume.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problems existing in the background technology, the utility model provides a magnetron sputtering coating system for preparing dysprosium/terbium coating.
The utility model provides a magnetron sputtering coating system for preparing dysprosium terbium cladding material, include: at least one magnetron sputtering unit, the magnetron sputtering unit comprising: the device comprises a tubular sputtering source, a rotary workpiece frame, a first end cover and a second end cover;
the tubular sputtering source is internally provided with a coating space extending along the axial direction, a first end cover and a second end cover are respectively and hermetically arranged at two ends of the coating space and are in insulation connection with the tubular sputtering source, the first end cover and/or the second end cover are/is provided with an extraction opening, the first end cover and/or the second end cover are/is provided with a gas inlet, the side wall of the tubular sputtering source is provided with a magnet unit, and the inner wall of the tubular sputtering source is provided with a target material layer arranged annularly;
the rotating workpiece frame is positioned in the coating space and can be rotatably arranged on the first end cover and/or the second end cover.
Preferably, a water cooling cavity is arranged in the side wall of the tubular sputtering source.
Preferably, the water cooling chamber is annularly arranged around the coating space.
Preferably, the water cooling device comprises a plurality of magnet units, wherein the magnet units are arranged in the water cooling cavity and distributed annularly around the water cooling cavity;
preferably, each magnet unit includes a first magnet having a ring structure and a second magnet located at a middle portion of the first magnet; more preferably, the first magnet extends axially parallel to the water cooling chamber and the second magnet extends axially parallel to the water cooling chamber.
Preferably, the target material layer is formed by splicing a plurality of target material strips distributed along the circumference.
Preferably, the gas inlet and the pumping port are located on the first end cap and the second end cap, respectively.
Preferably, a plurality of magnetron sputtering units are included, and the air suction ports of each magnetron sputtering unit are communicated in sequence.
Preferably, the gas inlets of each magnetron sputtering unit are communicated in sequence.
Preferably, the coating space has a columnar structure, and the rotating workpiece holder is arranged coaxially with the coating space.
The utility model discloses in, the magnetron sputtering coating system for preparing dysprosium terbium cladding material that provides, the magnetron sputtering source that the system used have the tubulose structural feature, form the coating film cavity through the both ends end cover, and the plasma discharge process takes place in this space, and magnet unit and inside the inlaying of tubulose magnetron sputtering source pipe wall outside are arranged and are had heavy tombarthite target, and the work rest is installed on the end cover and can be followed tubulose magnetron sputtering source axis and rotate. According to the magnetron sputtering coating system for preparing the dysprosium/terbium coating, which is optimally designed, a coating space is formed inside the tubular sputtering source, and magnetron sputtering discharge is coupled with hollow cathode discharge, so that the plasma density is high, and the deposition rate is high. In addition, due to the characteristic of a tubular structure, the main part of the sputtered material of the target material is deposited on the workpiece, and the other part of the sputtered material returns to the surface of the target material again, so that the utilization rate of the target material is high, meanwhile, the workpiece on the rotating workpiece frame rotates along the axis of the tubular source, the sputtered material is uniformly received, and a dysprosium/terbium coating with uniform thickness distribution is formed, and the tubular source sputtering device is particularly suitable for sputtering the rare earth material target with high price.
Drawings
FIG. 1 is a schematic structural view of a magnetron sputtering coating system for preparing a dysprosium/terbium coating.
FIG. 2 is a schematic structural diagram of the arrangement of the target material layers of the magnetron sputtering coating system for preparing dysprosium/terbium coating according to the present invention.
Fig. 3 is a schematic structural diagram of a magnet unit arrangement mode of a magnetron sputtering coating system for preparing dysprosium/terbium coating according to the present invention.
Detailed Description
As shown in fig. 1 to 3, fig. 1 is a schematic structural view of a magnetron sputtering coating system for preparing a dysprosium/terbium plating layer provided by the present invention, fig. 2 is a schematic structural view of a target layer arrangement of a magnetron sputtering coating system for preparing a dysprosium/terbium plating layer provided by the present invention, and fig. 3 is a schematic structural view of a magnet unit arrangement manner of a magnetron sputtering coating system for preparing a dysprosium/terbium plating layer provided by the present invention.
Referring to fig. 1, the utility model provides a magnetron sputtering coating system for preparing dysprosium terbium coating, includes: at least one magnetron sputtering unit, the magnetron sputtering unit comprising: a tubular sputtering source 1, a rotating workpiece frame 2, a first end cover 3 and a second end cover 4;
a coating space extending along the axial direction is arranged in the tubular sputtering source 1, the first end cover 3 and the second end cover 4 are respectively and hermetically arranged at two ends of the coating space and are in insulation connection with the tubular sputtering source 1, an air suction opening 81 is arranged on the first end cover 3 and/or the second end cover 4, a gas inlet 82 is arranged on the first end cover 3 and/or the second end cover 4, a magnet unit is arranged on the side wall of the tubular sputtering source 1, and a target material layer 6 arranged in an annular mode is arranged on the inner wall of the tubular sputtering source 1;
the rotating workpiece holder 2 is positioned inside the coating space, and the rotating workpiece holder 2 is rotatably mounted on the first end cap 3 and/or the second end cap 4.
In this embodiment, in the proposed magnetron sputtering coating system for preparing a dysprosium/terbium coating, a coating space extending along an axial direction is provided inside a tubular sputtering source of a magnetron sputtering unit, a first end cover and a second end cover are respectively and hermetically mounted at two ends of the coating space, an air suction port is provided on one end cover, a magnet unit is provided on a side wall of the tubular sputtering source, a target layer arranged in an annular shape is provided on an inner wall of the tubular sputtering source, and a rotating workpiece holder is rotatably mounted inside the coating space. According to the magnetron sputtering coating system for preparing the dysprosium/terbium coating, which is optimally designed, a coating space is formed inside the tubular sputtering source, the target material layer is arranged on the inner wall of the coating space, the workpiece is rotatably arranged in the coating space by rotating the workpiece holder, and sputtering of the target material is limited in the closed space.
In the specific working process of the magnetron sputtering coating system for preparing the dysprosium/terbium coating, after gas in the coating space is pumped out through the pumping hole, process gas is filled into the coating space through the gas inlet 82, then the tubular sputtering source, the magnet unit, the target material layer and the power supply cathode are connected together to form a sputtering cathode, the workpiece frame is rotated to be connected with the power supply anode to form a sputtering anode, after the power is turned on, plasma discharge is generated between the sputtering cathode and the sputtering anode, so that the workpiece substrate is completely positioned in a plasma discharge area, meanwhile, the workpiece substrate rotates along with the rotation of the workpiece frame, the sputtering position of the target material layer is changed along with the rotation of the workpiece substrate, the sputtering area of the target material layer is greatly increased, the sputtering coating efficiency is improved, and the utilization rate of the target material is improved.
In a specific embodiment, a water cooling cavity 11 is arranged in the side wall of the tubular sputtering source 1, and the water cooling cavity 11 is annularly arranged around the coating space; make the thermal contact good between sputter source and target layer and the water-cooling chamber, guarantee operating temperature through the water-cooling chamber, protect target layer and sputter source.
Referring to fig. 2, in a specific arrangement of the target, when the rare earth target is selected for sputtering, it is difficult to manufacture the heavy rare earth target such as round tube-shaped dysprosium/terbium target with a large diameter and a long length in the industrial field, so that the target layer 6 can be formed by splicing a plurality of target strips 61 distributed along the circumference, thereby facilitating the arrangement of the target layers arranged annularly.
In a specific design mode of the magnet, the magnet comprises a plurality of magnet units, and the magnet units are arranged in the water-cooling cavity 11 and distributed annularly around the water-cooling cavity 11; the magnet unit is arranged in the water-cooling cavity, so that the water-cooling protection of the magnet unit is ensured on one hand, and the magnetic field intensity on the surface of the target material is ensured on the other hand, thereby ensuring the high efficiency of the magnetron sputtering.
In the specific working process of the embodiment, after being electrified, an electromagnetic field for restricting the movement of electrons is generated on the surface of the target layer, and then a magnetron sputtering discharge phenomenon is generated, meanwhile, due to the characteristic of a hollow tubular structure of a sputtering source, a hollow cathode discharge effect is generated in a coating space, so that the hollow cathode discharge and the magnetron sputtering discharge are coupled in the sputtering process, the plasma discharge strength is greatly enhanced, the ionization rate of working gas molecules is high, the sputtering rate is greatly improved, the deposition rate of only a few micrometers to dozens of micrometers per hour of the traditional magnetron sputtering is improved to 100 micrometers per hour, and the film obtained by the target sputtering is deposited on the surface of a workpiece at a high speed.
Referring to fig. 3, in a further embodiment of the magnet units, each magnet unit includes a first magnet 51 having an annular structure and a second magnet 52 located at a middle portion of the first magnet 51, specifically, the first magnet 51 extends axially parallel to the water cooling chamber, and the second magnet 52 extends axially parallel to the water cooling chamber; the magnetic field is uniform in the direction parallel to the axial direction of the water cooling cavity, so that the magnetic field is matched with the rotation of the rotating frame in a rotating mode, and the sputtering uniformity of the coating is realized in the direction parallel to the axial direction and the circumferential direction.
In a further embodiment, the annular structure comprises a plurality of magnetic blocks extending axially parallel to the water cooling cavity; in the actual selection of the magnet unit structure, the magnet unit can be designed into a rectangular annular or elliptical annular structure and the like, the extending direction of the magnet unit is parallel to the circumferential arrangement of the water cooling cavity, and the design effectively makes up the problem that the axial magnetic field distribution is uneven due to the fact that two adjacent magnet units are circumferentially and annularly arranged, so that the obtained coating is uneven in thickness distribution, the magnetic field is even in circumferential distribution, and the obtained coating is good in uniformity.
In order to meet the requirements of coating and installation modes of different workpieces, the system comprises a plurality of magnetron sputtering units which are connected in parallel, rotary workpiece racks with different structures can be selected according to requirements in each coating space, the air suction ports 81 of each magnetron sputtering unit are communicated in sequence, and the gas inlets 82 of each magnetron sputtering unit are communicated in sequence; in the specific installation, a workpiece can be hung on a rotating workpiece frame, or a metal wire mesh roller is used as the rotating workpiece frame, the workpiece is fixedly or not fixedly placed in the metal wire mesh roller, or the workpiece is fixed on the rotating workpiece frame through a fastener; the tubular sputtering sources working at the same time can be respectively powered by independent power supplies, and each tubular sputtering source can be operated independently or simultaneously, so that the system has strong capacity of adjusting the productivity.
In other specific design modes, the film coating space has a cylindrical structure, and the rotating workpiece frame 2 is coaxially arranged with the film coating space; the magnetic field in the coating space is ensured to be uniformly distributed, and the coating of the workpiece is uniform in the rotating process.
The embodiment also provides a magnetron sputtering coating method of the magnetron sputtering coating system for preparing the dysprosium/terbium coating, which comprises the following steps:
s1, mounting the workpiece substrate on a rotary workpiece frame, and enabling the surface of the workpiece substrate to be coated to face the target layer;
s2, pumping out the gas in the film coating space through a pumping hole;
s3, introducing process gas into the film coating space to a preset pressure value;
in a specific working mode, after gas in the film coating space is pumped out through the pumping hole 81, process gas is filled into the film coating space through the gas inlet 82, after the process gas is filled, negative pressure is applied to the rotating workpiece frame and the workpiece in advance, and plasma cleaning is carried out on the rotating workpiece frame;
specifically, the air pressure in the film coating space is pumped to P1, wherein P1 is not more than 3X10-3Pa, then filling the process gas into the film coating space until P2 is reached, wherein P2 is more than or equal to 0.5Pa and less than or equal to 3Pa, the specific negative pressure can be selected from-300V to-800V, and the cleaning time is 5-10 min.
S4, applying negative pressure to the tubular sputtering source 1, the magnet unit 5 and the target material layer 6, applying positive pressure to the rotating workpiece frame and the workpiece substrate to perform sputtering coating, and simultaneously driving the rotating workpiece frame 2 to rotate;
in the process of coating, the coating thickness is controlled by controlling the coating time.
And S5, cooling after the film coating is finished, and finally taking out the film-coated product.
In S5, the process gas is pumped out through the pumping hole 81 and the protective gas is filled into the film plating space through the gas inlet 82; in the selection of the process gas, an inert gas such as argon is used as the process gas. In the process, argon has two functions, the coating process is used as protective gas, Ar is ionized into Ar ions, the Ar ions can bombard the surface of the target material and splash out the material, and the Ar ions are used as process gas after the coating is finished and are used for preventing the surface of the workpiece from being oxidized and accelerating cooling.
In order to guarantee the cooling effect of the protective gas during cooling, in the specific design mode of the air suction port and the air inlet, the air inlet 82 and the air suction port 81 are respectively arranged on the first end cover 3 and the second end cover 4, so that the air inlet and the air suction port simultaneously enter and exit air during cooling, and the cooling effect is greatly improved through the flowing of the protective gas from the air inlet to the air suction port.
In a further specific implementation manner of the magnetron sputtering method provided in this embodiment, the method further includes: s5, performing high-temperature thermal diffusion on the coated product under the vacuum condition or under the protection of process gas, and then performing tempering treatment; preferably, the working temperature of the high-temperature thermal diffusion is 800-1000 ℃, and the working time is 6-15 h; preferably, the working temperature of the tempering treatment is 400-600 ℃, and the working time is 1-10 h.
The method according to the present invention is explained in more detail below with reference to specific embodiments in order to better understand the advantageous effects of the present invention.
Example one
(1) Five pieces of each of the commercial N52, N42SH, and N50H magnet unit blanks were used as workpieces for terbium-plated treatment. The dimensions of the magnet unit are 56mm × 30mm × 4mm, 34mm × 33mm × 4mm, respectively, wherein the 4mm direction is the magnetization direction of the magnet unit.
(2) The magnetic sheets are dried after being degreased, pickled and cleaned by ultrasonic alcohol;
(3) and (5) mounting the cleaned magnetic sheet on a workpiece frame, and fixing by adopting a wire mesh mode. The section of the tubular magnetron sputtering source used for coating is regular hexadecagon, the distance of opposite sides is 260mm, and the length is 420 mm. The sputtering coating adopts terbium metal, and the purity is 99.9 wt.%. The vertical distance between the magnetic sheet and the surface of the target material is about 20 mm;
(4) starting a vacuum pump pumping system to pump the air pressure in the tubular magnetron sputtering source to be less than 5X10-3Pa, introducing working gas argon into the vacuum chamber, and controlling the air pressure in the tubular magnetron sputtering source to be 0.3 Pa;
(5) starting a sputtering power supply, controlling the sputtering power to be 15kW, and after sputtering for 5 minutes, closing the magnetron sputtering power supply;
(6) introducing inert gas (N2 or Ar) into the tubular magnetron sputtering source, cooling for 5 minutes, and then opening the tubular magnetron sputtering source;
(7) taking out the workpiece, repeating the steps (1) to (5), and plating the other surface of the workpiece;
(8) performing thermal diffusion treatment on the magnet unit subjected to film coating, wherein the high-temperature thermal diffusion is 900 ℃ degrees multiplied by 15 hours, and the tempering treatment is 500 ℃ degrees multiplied by 6 hours;
(9) the magnetic properties of the samples were measured and the results are shown in Table 1.
TABLE 1 coercive force variation after terbium plating of magnet units
Example two
(1) Five pieces of each of the commercial N52, N42SH, and N50H magnet unit blanks were used as workpieces for terbium-plated treatment. The dimensions of the magnet unit are 56mm × 30mm × 4mm, 34mm × 33mm × 4mm, respectively, wherein the 4mm direction is the magnetization direction of the magnet unit.
(2) The magnetic sheets are dried after being degreased, pickled and cleaned by ultrasonic alcohol;
(3) and (5) mounting the cleaned magnetic sheet on a workpiece frame, and fixing by adopting a wire mesh mode. The section of the tubular magnetron sputtering source used for coating is regular hexadecagon, the distance of opposite sides is 260mm, and the length is 420 mm. Dysprosium metal is adopted for sputtering coating, and the purity is 99.9 wt.%. The vertical distance between the magnetic sheet and the surface of the target material is about 20 mm;
(4) starting a vacuum pump pumping system to pump the air pressure in the tubular magnetron sputtering source to be less than 5X10-3Pa, introducing working gas argon into the vacuum chamber, and controlling the air pressure in the tubular magnetron sputtering source to be 0.3 Pa;
(5) starting a sputtering power supply, controlling the sputtering power to be 15kW, and after sputtering for 5 minutes, closing the magnetron sputtering power supply;
(6) introducing inert gas (N2 or Ar) into the tubular magnetron sputtering source, cooling for 5 minutes, and then opening the tubular magnetron sputtering source;
(7) taking out the workpiece, repeating the steps (1) to (5), and plating the other surface of the workpiece;
(8) performing thermal diffusion treatment on the magnet unit subjected to film coating, wherein the high-temperature thermal diffusion is 900 ℃ degrees multiplied by 15 hours, and the tempering treatment is 500 ℃ degrees multiplied by 6 hours;
(9) the magnetic properties of the samples were measured and the results are shown in Table 2.
TABLE 2 coercive force variation after dysprosium plating of magnet units
According to the two embodiments, it can be seen that the deposition time is 5 minutes, the thickness of the finally obtained coating is about 5 micrometers, the deposition speed is about 1 micrometer/minute, and the deposition speed of the conventional magnetron sputtering is about several micrometers to tens of micrometers/hour, so that the technical scheme of the application greatly improves the speed of the magnetron sputtering.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (10)
1. A magnetron sputtering coating system for preparing dysprosium/terbium coating is characterized by comprising: at least one magnetron sputtering unit, the magnetron sputtering unit comprising: the device comprises a tubular sputtering source (1), a rotary workpiece rack (2), a first end cover (3) and a second end cover (4);
a coating space extending along the axial direction is arranged in the tubular sputtering source (1), the first end cover (3) and the second end cover (4) are respectively and hermetically mounted at two ends of the coating space and are in insulation connection with the tubular sputtering source (1), the first end cover (3) and/or the second end cover (4) are/is provided with a pumping hole (81), the first end cover (3) and/or the second end cover (4) are/is provided with a gas inlet (82), the side wall of the tubular sputtering source (1) is provided with a magnet unit, and the inner wall of the tubular sputtering source (1) is provided with a target material layer (6) arranged annularly;
the rotating workpiece frame (2) is positioned in the coating space, and the rotating workpiece frame (2) can be rotatably arranged on the first end cover (3) and/or the second end cover (4).
2. The magnetron sputtering coating system for preparing dysprosium/terbium coatings according to claim 1, wherein a water-cooling cavity (11) is provided in the side wall of the tubular sputtering source (1); preferably, the water cooling chamber (11) is annularly arranged around the coating space.
3. A magnetron sputter coating system for the preparation of a dysprosium/terbium coating according to claim 2 comprising a plurality of magnet units disposed within said water-cooled chamber (11) and distributed annularly around said water-cooled chamber (11).
4. A magnetron sputter coating system for the preparation of a dysprosium/terbium coating according to claim 3, characterized in that each magnet unit comprises a first magnet (51) having an annular structure and a second magnet (52) located in the middle of the first magnet (51).
5. The magnetron sputtering coating system for the preparation of a dysprosium/terbium coating according to claim 4, wherein the first magnet (51) extends axially parallel to the water-cooled chamber and the second magnet (52) extends axially parallel to the water-cooled chamber.
6. Magnetron sputtering coating system for the preparation of a dysprosium/terbium coating according to claim 1 or 2, characterized in that the target layer (6) is spliced from a plurality of circumferentially distributed target strips (61).
7. A magnetron sputter coating system for the preparation of a dysprosium/terbium coating according to claim 1, characterized in that the gas inlet (82) and the gas extraction port (81) are located on the first end cap (3) and the second end cap (4), respectively.
8. The magnetron sputtering coating system for preparing dysprosium/terbium coating according to claim 1, comprising a plurality of magnetron sputtering units, wherein the pumping ports (81) of each magnetron sputtering unit are in communication in sequence.
9. A magnetron sputtering coating system for the preparation of a dysprosium/terbium coating according to claim 1 or 2, characterized in that the gas inlets (82) of each magnetron sputtering unit are in communication in sequence.
10. Magnetron sputtering coating system for the preparation of a dysprosium/terbium coating according to claim 1 wherein the coating space has a cylindrical structure and the rotating workpiece holder (2) is arranged coaxially with the coating space.
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| CN110055503A (en) * | 2019-05-13 | 2019-07-26 | 合肥赉晟科技有限公司 | It is a kind of to be used to prepare dysprosium/terbium coating magnetron sputtering coating system and method |
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| CN110055503A (en) * | 2019-05-13 | 2019-07-26 | 合肥赉晟科技有限公司 | It is a kind of to be used to prepare dysprosium/terbium coating magnetron sputtering coating system and method |
| CN110055503B (en) * | 2019-05-13 | 2024-03-19 | 宁波赉晟新材料科技有限责任公司 | Magnetron sputtering coating system and method for preparing dysprosium/terbium coating |
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