CN209643229U - A kind of radiator structure of communication equipment - Google Patents
A kind of radiator structure of communication equipment Download PDFInfo
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- CN209643229U CN209643229U CN201822052701.6U CN201822052701U CN209643229U CN 209643229 U CN209643229 U CN 209643229U CN 201822052701 U CN201822052701 U CN 201822052701U CN 209643229 U CN209643229 U CN 209643229U
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- optical module
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- radiator
- radiating area
- main pcb
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Abstract
The utility model relates to a kind of radiator structures of communication equipment.Main PCB plate is mounted in cabinet, partition is arranged on main PCB plate will be divided into lower radiating area and upper radiating area in cabinet, it include two fpga chips, I, ZYNQ chip, five power supply chips and two groups of QSFP optical module cages with radiator on main PCB plate in upper radiating area, two groups of QSFP optical module cages stretch out outside the cage hole of rear panel, are inserted into 1 QSFP optical module heating device respectively in cage hole；On the main PCB plate in lower radiating area, including a fpga chip II and power supply chip；Two sub- pcb boards are filled above main PCB plate, and six groups of SFP optical module cages with radiator are respectively set on two sub- pcb boards；12 groups of SFP optical module cages stretch out outside the cage hole of front panel, are inserted into 1 SFP optical module heating device respectively in cage hole.It ensure that communication equipment normal work in use.
Description
Technical field
The utility model relates to radiator structure technical fields, relate more specifically to a kind of radiator structure of communication equipment.
Background technique
Currently, when especially case system internal power consumption is larger, system radiating air duct is in machine for general communication machine box
The left and right sides of case increases fan component, and side fan component takes cold wind inside machine 3 casees to, into each board region PCB, respectively
The heat that pcb board card generates is discharged by the fan component of the other side, for a lower height of equipment, such as 1U equipment, if
System power dissipation is larger, it may be necessary to increase fan in cabinet left and right side plates, the noise that will lead to system in this way is larger, cost
Increase, blindly increase more fans also may not be able to very good solution problems of excessive heat, fan increases, system it is reliable
Property can reduce, and space layout is restricted.
In the prior art, by way of increasing fan component at left and right sides of cabinet, by the heat of internal system generation
It takes away, when pcb board power consumption is higher, how reasonably to carry out casing structure layout and be distributed fan component, effectively by chip
The heat of upper generation is taken away and is particularly important, therefore, it is necessary to carry out the topology layout of cabinet inside by heat dissipation design means,
Maximize the utilization rate of cooling system.
Summary of the invention
The purpose of this utility model is how reasonably to carry out the layout of casing structure, reduce the temperature of internal system
Degree becomes the utility model problem to be solved, and in view of the problems of the existing technology, the utility model provides a kind of logical
Believe that the radiator structure of equipment, this radiator structure carry out the heat radiation structure design of cabinet by simulation analysis means, reasonably carry out
The layout of cabinet inside structure space guarantees that the Flow Field Distribution of internal system is uniform, i.e., according to equipment internal power consumption distribution situation,
It is radiated using subregion, heat dissipation wind channel is to enter the wind on the right side of cabinet, and cold wind generates heat after passing through pcb board, passes through the two of left side
Group fan component takes away heat.
To achieve the above object, used technical solution is the utility model: a kind of radiator structure of communication equipment, packet
Cabinet is included, cabinet is made of left plate, right side plate, front panel, rear panel, bottom plate and upper cover plate, it is characterised in that: further include master
Pcb board, sub- pcb board, the component I of fan, the component II of fan, QSFP optical module heating device, SFP optical module heating device；
The bottom plate and upper cover plate be it is rectangular-shaped, left plate, right side plate, front panel and rear panel are oblong-shaped；
SFP optical module cage hole there are two being set on the front panel；
The rear panel is equipped with QSFP optical module cage hole；
Horizontal interval is equipped with two groups of air outlets on the left plate, that is, four air outlet I and two air outlets II；
Horizontal interval is equipped with two groups of air inlets on the right side plate, that is, air inlet I and air inlet II, air inlet I and air inlet
Mouth II is made of several air inlet holes；
The main PCB plate is mounted on the bottom plate in cabinet, and partition is arranged on main PCB plate by the space cloth of cabinet inside
Office carries out subregion, is divided into the lower radiating area between front panel to partition and the upper radiating area between rear panel to partition, In
On main PCB plate in upper radiating area, heating device includes two fpga chips, I, ZYNQ chip, five power supply chips and two
QSFP optical module cage of the group with radiator, every group of QSFP optical module cage with radiator is by four horizontally arranged cage hole structures
At two groups of QSFP optical module cages with radiator stretch out outside the QSFP optical module cage hole of rear panel, in two groups of band radiators
QSFP optical module cage cage hole in, be inserted into 1 QSFP optical module heating device, totally 8 QSFP optical module heaters respectively
Part；
Copper radiator is set on the fpga chip I, aluminium radiator II is set on the ZYNQ chip, on power supply chip not
Radiator is set；
On the main PCB plate in lower radiating area, main heating device includes a fpga chip II and power supply core
Aluminium radiator I is arranged on the fpga chip II, is not provided with radiator on power supply chip for piece；
Two sub- pcb boards, two sub- PCB are installed at the left and right position above the main PCB plate at case front panel
Plate is parallel to main PCB plate, and six groups of SFP optical module cages with radiator are respectively set in the obverse and reverse sides on the sub- pcb board,
Every group of SFP optical module cage with radiator is made of four horizontally arranged cage holes；
12 groups of SFP optical module cages with radiator stretch out outside two SFP optical module cage holes of front panel, 12
In cage hole of the group with the SFP optical module cage of radiator, it is inserted into 1 SFP optical module heating device respectively, totally 48 SFP optical modes
Block heating device；
According on main PCB plate in main PCB plate in upper radiating area and lower radiating area heating device distribution and power consumption estimation,
The power consumption of lower radiating area is less than the power consumption of upper radiating area, and four are installed on four air outlets I that upper radiating area corresponds to left plate
The component I of fan corresponds to the component II that two fans are installed on two air outlets II of left plate in lower radiating area, four fans
The component II of component I and two fan respectively sucks cold wind from the air inlet I and air inlet II of cabinet right side plate, by main PCB
The heat that heating device surface generates on plate and sub- pcb board, passes through four II rows of air outlet I and two air outlet of left plate
Out；
After test, cabinet inside peak flow rate (PFR) is 9.64m/s, and heat-generating components inside maximum temperature is 78.10C, plane Z=
The flow velocity of ZYNQ chip vicinity is 1.98m/s when 11mm, and corresponding flow field temperature is 32.70C；Z is by bottom plate to testing
Level.
The utility model beneficial effect is:
(1), heat spreader structures are arranged on each heat source to be transmitted to the heat that heating device generates on radiator in time.
(2), using air draught heat dissipation design, cold wind can be made to flow uniformly through each heat source region, makes the flow field of cabinet inside
It is evenly distributed.
(3), cabinet inside is divided into radiating area and lower radiating area, is radiated using subregion, utilizes the work of two groups of fan components
It is discharged with by heat, the utilization efficiency of fan can be improved.
(4), according to the distribution of the power consumption inside equipment, the utility model carries out cooling system using hot simulation analysis method
Structure design, can before real equipment produces pre- measurement equipment problems of excessive heat, provide section for the production of real equipment
Heat dissipation foundation, can satisfy radiating requirements, overcome the prior art need a large amount of fan cooling cause system noise compared with
Big problem occurs, and reduces costs；Importantly, the chip in equipment is enable to work within the scope of suitable temperature,
It does not damage, ensure that communication equipment normal work in use.
Detailed description of the invention
Fig. 1 is the radiator structure schematic layout pattern of the utility model communication equipment；
Fig. 2 is the A-A broken section structural schematic diagram of Fig. 1 structure；
Fig. 3 is the left plate structural schematic diagram of Fig. 1；
Fig. 4 is the right side plate structural schematic diagram of Fig. 1；
Fig. 5 is the front-panel structure schematic diagram of Fig. 1；
Fig. 6 is the rear panel structure schematic diagram of Fig. 1；
Fig. 7 is the inside flow velocity cloud charts of the utility model first embodiment；
Fig. 8 is the interior temperature distribution cloud atlas of the utility model first embodiment；
Fig. 9 is the inside flow velocity cloud charts of the utility model second embodiment；
Figure 10 is the interior temperature distribution cloud atlas of the utility model second embodiment.
Specific embodiment
In order to more clearly from illustrate the technical solution in the utility model, the utility model is led to reference to the accompanying drawing
Radiator structure in letter equipment is further illustrated.
Such as Fig. 1 to Fig. 6, embodiment 1, a kind of radiator structure of communication equipment, including cabinet, cabinet is by left plate 1, right side
Plate 2, front panel 3, rear panel 4, bottom plate 5 and upper cover plate composition, further include component I 8, the wind of main PCB plate 6, sub- pcb board 7, fan
Component II 9, QSFP optical module heating device 10, the SFP optical module heating device 11 of fan；
Bottom plate 5 and upper cover plate be it is rectangular-shaped, left plate 1, right side plate 2, front panel 3 and rear panel 4 are oblong-shaped；
SFP optical module cage hole there are two being set on plate 3 in front；
QSFP optical module cage hole is equipped on plate 4 below；
Horizontal interval is equipped with two groups of air outlets on left plate 1, that is, four air outlets, I 1-1 and two II 1-2 of air outlet；
Horizontal interval is equipped with two groups of air inlets on right side plate 2, that is, II 2-2 of I 2-1 of air inlet and air inlet, air inlet I
2-1 and II 2-2 of air inlet are made of several air inlet holes,
Left plate 1 and right side plate 2 use sheet metal component, are formed by bending, welding procedure, front panel 3 and rear panel 4 are adopted
It is formed with aluminium alloy extrusions, the length of left plate 1 and right side plate 2 is 380mm, height 42mm.
Main PCB plate 6 is mounted on the bottom plate 5 in cabinet, and partition 12 is arranged on main PCB plate 6 by the space of cabinet inside
Layout carries out subregion, is divided into from front panel 3 to the lower radiating area 13 partition 12 and from rear panel 4 to upper partition 12
Radiating area 14, on the main PCB plate 6 in upper radiating area 14, main heating device includes two I 6-1 of fpga chip, one
The QSFP optical module cage 6-4 of ZYNQ chip 6-3, five power supply chip 6-5 and two groups with radiator, every group with radiator
QSFP optical module cage 6-4 is made of four horizontally arranged cage holes, and two groups of QSFP optical module cage 6-4 with radiator stretch out
Outside the QSFP optical module cage hole of rear panel 4, in the cage hole of two groups of QSFP optical module cage 6-4 with radiator, insert respectively
Enter 1 QSFP optical module heating device 10, totally 8 QSFP optical module heating devices 10；
Copper radiator 6-1-1 is set on I 6-1 of fpga chip, II 6-3-1 of aluminium radiator is set on ZYNQ chip 6-3,
Radiator is not provided on power supply chip 6-5；
On the main PCB plate 6 in lower radiating area 13, main heating device includes one fpga chip II 6-2 and one
I 6-2-1 of aluminium radiator is set on power supply chip 6-5, II 6-2 of fpga chip, is not provided with radiator on power supply chip 6-5；
Two sub- pcb boards 7, two sons are installed at the left and right position above the main PCB plate 6 at case front panel 3
Pcb board 7 is parallel to main PCB plate 6, the obverse and reverse sides on sub- pcb board 7, and six groups of SFP optical modules with radiator are respectively set
Cage 7-1, every group of SFP optical module cage 7-1 with radiator are made of four horizontally arranged cage holes；
12 groups of SFP optical module cage 7-1 with radiator stretch out outside two SFP optical module cage holes of front panel 3, In
In the cage hole of 12 groups of SFP optical module cage 7-1 with radiator, it is inserted into 1 SFP optical module heating device 11 respectively, totally 48
A SFP optical module heating device 11；
According to the heating device distribution and power consumption on main PCB plate 6 in main PCB plate 6 in upper radiating area 14 and lower radiating area 13
Estimation, the power consumption of lower radiating area 13 is less than the power consumption of upper radiating area 14, in four outlet air of the corresponding left plate 1 of upper radiating area 14
The component I 8 that four fans are installed on I 1-1 of mouth installs two on corresponding 1 two II 1-2 of air outlet of left plate of lower radiating area 13
The component II 9 of the component II 9 of fan, the component I 8 of four fans and two fans respectively by cold wind from cabinet right side plate 2 into
I 2-1 of air port and II 2-2 of air inlet sucking, the heat that heating device surface on main PCB plate 6 and sub- pcb board 7 is generated pass through a left side
Four air outlets, I 1-1 and two II 1-2 of air outlet discharge of side plate 1；
As shown in Figure 7, Figure 8, it can be seen that internal from cloud charts, cabinet inside peak flow rate (PFR) is 9.64m/s, internal
Heating device maximum temperature is 78.10The flow velocity of the vicinity ZYNQ chip 6-3 is 1.98m/s when C, plane Z=11mm, corresponding
Flow field temperature is 32.70C；Z is by bottom plate 5 to the level tested.
Embodiment 2, three fans of installation on the bottom plate 5 of corresponding 1 two II 1-2 of air outlet of left plate of lower radiating area 13
Component II 9, other layouts are identical as the layout of embodiment 1, can be seen that internal highest stream from Fig. 8, Figure 10 cloud charts result
Speed is 9.67m/s, and heat-generating components inside maximum temperature is 76.60The flow velocity of the vicinity ZYNQ chip 6-3 when C, plane Z=11mm
For 2.2m/s, corresponding flow field temperature is 32.10C.Comparative example 1, it can be seen that lower radiating area 13 increases by one in embodiment 2
The contribution that a fan does system radiating is little.
It is in summary only specific embodiment of the present utility model, designer can exist according to the enlightenment of examples detailed above
It optimizes or improves without departing under technical solution.
Claims (2)
1. a kind of radiator structure of communication equipment, including cabinet, cabinet by left plate (1), right side plate (2), front panel (3), after
Panel (4), bottom plate (5) and upper cover plate composition, it is characterised in that: further include the component of main PCB plate (6), sub- pcb board (7), fan
I (8), the component II (9) of fan, QSFP optical module heating device (10), SFP optical module heating device (11)；
The bottom plate (5) and upper cover plate be it is rectangular-shaped, left plate (1), right side plate (2), front panel (3) and rear panel (4) are equal
For oblong-shaped；
SFP optical module cage hole there are two being set on the front panel (3)；
The rear panel (4) is equipped with QSFP optical module cage hole；
Horizontal interval is equipped with two groups of air outlets on the left plate (1), that is, four air outlets I (1-1) and two air outlets II
(1-2)；
Horizontal interval is equipped with two groups of air inlets on the right side plate (2), that is, air inlet I (2-1) and air inlet II (2-2), air inlet
I (2-1) of mouth and air inlet II (2-2) are made of several air inlet holes；
The main PCB plate (6) is mounted on the bottom plate in cabinet (5), and partition (12) are arranged on main PCB plate (6) will be in cabinet
The space layout in portion carries out subregion, is divided into from front panel (3) to the lower radiating area (13) partition (12) and from rear panel (4)
To the upper radiating area (14) between partition (12), on the main PCB plate (6) in upper radiating area (14), heating device includes two
Fpga chip I (6-1), a ZYNQ chip (6-3), five power supply chips (6-5) and two groups of QSFP optical modules with radiator
Cage (6-4), every group of QSFP optical module cage (6-4) with radiator are made of four horizontally arranged cage holes, and two groups of bands dissipate
The QSFP optical module cage (6-4) of hot device stretches out outside the QSFP optical module cage hole of rear panel (4), at two groups with radiator
In the cage hole of QSFP optical module cage (6-4), it is inserted into 1 QSFP optical module heating device (10) respectively, totally 8 QSFP optical modules
Heating device (10)；
Copper radiator (6-1-1) is set on the fpga chip I (6-1), aluminium radiator II is set on the ZYNQ chip (6-3)
(6-3-1) is not provided with radiator on power supply chip (6-5)；
On the main PCB plate (6) in lower radiating area (13), main heating device includes a fpga chip II (6-2) and one
Aluminium radiator I (6-2-1) is arranged on the fpga chip II (6-2) in a power supply chip (6-5), does not set on power supply chip (6-5)
Set radiator；
Two sub- pcb boards (7) of installation at the left and right position above the main PCB plate (6) at case front panel (3), two
Sub- pcb board (7) is parallel to main PCB plate (6), and the obverse and reverse sides on the sub- pcb board (7) are respectively set six groups with radiator
SFP optical module cage (7-1), every group of SFP optical module cage (7-1) with radiator are made of four horizontally arranged cage holes；
12 groups of SFP optical module cages (7-1) with radiator stretch out outside two SFP optical module cage holes of front panel (3), In
In the cage hole of 12 groups of SFP optical module cages (7-1) with radiator, it is inserted into 1 SFP optical module heating device (11) respectively,
Totally 48 SFP optical module heating devices (11)；
According on the interior main PCB plate (6) of upper radiating area (14) and the interior main PCB plate (6) of lower radiating area (13) heating device distribution and
The estimation of power consumption, the power consumption of lower radiating area (13) are less than the power consumption of upper radiating area (14), in upper radiating area (14) corresponding left plate
(1) component I (8) that four fans are installed on four air outlets I (1-1), in lower radiating area (13) corresponding left plate (1) two
The component II (9) of two fans, the component II of the component I (8) of four fans and two fans are installed on air outlet II (1-2)
(9) cold wind is sucked from the air inlet I (2-1) and air inlet II (2-2) of cabinet right side plate (2) respectively, by main PCB plate (6) and
The heat that heating device surface generates on sub- pcb board (7), passes through four air outlets I (1-1) of left plate (1) and two outlet air
Mouth II (1-2) discharge；
After test, cabinet inside peak flow rate (PFR) is 9.64m/s, and heat-generating components inside maximum temperature is 78.10When C, plane Z=11mm
The flow velocity of the vicinity ZYNQ chip (6-3) is 1.98m/s, and corresponding flow field temperature is 32.70C；Z is by bottom plate (5) to testing
Level.
2. a kind of radiator structure of communication equipment according to claim 1, it is characterised in that: the left plate (1) and the right side
Side plate (2) uses sheet metal component, is formed by bending, welding procedure, front panel (3) and rear panel (4) are all made of aluminium alloy extrusions
It forms, left side plate length 380mm, height 42mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822052701.6U CN209643229U (en) | 2018-12-07 | 2018-12-07 | A kind of radiator structure of communication equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822052701.6U CN209643229U (en) | 2018-12-07 | 2018-12-07 | A kind of radiator structure of communication equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209643229U true CN209643229U (en) | 2019-11-15 |
Family
ID=68473639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822052701.6U Active CN209643229U (en) | 2018-12-07 | 2018-12-07 | A kind of radiator structure of communication equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209643229U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112034948A (en) * | 2020-09-03 | 2020-12-04 | 银河水滴科技（北京）有限公司 | Gait array server and system thereof |
-
2018
- 2018-12-07 CN CN201822052701.6U patent/CN209643229U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112034948A (en) * | 2020-09-03 | 2020-12-04 | 银河水滴科技（北京）有限公司 | Gait array server and system thereof |
| CN112034948B (en) * | 2020-09-03 | 2022-06-10 | 银河水滴科技（北京）有限公司 | Gait array server and system thereof |
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