CN109417862A - Circuit board calculates equipment and cooling cabinet - Google Patents
Circuit board calculates equipment and cooling cabinet Download PDFInfo
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- CN109417862A CN109417862A CN201880001930.5A CN201880001930A CN109417862A CN 109417862 A CN109417862 A CN 109417862A CN 201880001930 A CN201880001930 A CN 201880001930A CN 109417862 A CN109417862 A CN 109417862A
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- substrate
- radiator
- chip
- circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
It include substrate, multiple chips and multiple first radiators this application provides a kind of circuit board, calculating equipment and cooling cabinet, circuit board；Multiple chips are arranged on the same face of substrate, and along the direction of the air intake of substrate to outlet air end, and arrangement density of multiple chips on substrate gradually decreases；Multiple first radiators connect one to one with multiple chips, and the first radiator is located at the ipsilateral of substrate with chip；Air intake to each first radiator that the direction of outlet air end arranges along substrate is gradually increased in the frontal projected area of substrate.Circuit board, calculating equipment and cooling cabinet provided by the present application, reduce the chip positioned at air duct downstream is influenced by the heat for being located at air duct upstream chip, while cooling down to circuit board, the temperature difference positioned at circuit board air intake and outlet air end chip is also reduced, the calculated performance of supercomputer server apparatus is promoted.
Description
Technical field
This application involves circuit board technology fields, such as are related to a kind of circuit board, calculate equipment and cooling cabinet.
Background technique
Major part supercomputer server apparatus is to promote its calculated performance at present, and multiple chips are provided on its circuit board,
Multiple chips, which generate a large amount of heat, will affect the operational capability of chip, it is therefore desirable to cool down to chip.
Existing major part supercomputer server apparatus all uses wind-cooling heat dissipating, circuit board is mounted in air duct, circuit board
On be uniformly arranged multiple radiators, the heat transfer that chip generates to radiator, and the cold wind introduced by air duct one end will dissipate
The heat of hot device is taken away, and realization cools down to chip.
But current radiator is all evenly arranged on circuit boards, and cold wind is introduced from the side of circuit board, is located under air duct
The chip of trip is influenced by the heat for being located at upstream chip, leads to the presence of temperature between circuit board air intake and outlet air end chip
Difference is spent, so that the calculated performance of supercomputer server apparatus be made to decline.
Above-mentioned background technique content be only used for help understand the application, and do not represent recognize or approve mentioned by it is any
Content belongs to a part of the common knowledge relative to the application.
Summary of the invention
The embodiment of the present disclosure provides a kind of circuit board, comprising: substrate, multiple chips and multiple first radiators；It is described
Multiple chips are arranged on the same face of the substrate, and along the direction of the air intake of the substrate to outlet air end, the multiple
The arrangement density of chip on the substrate gradually decreases；The multiple first radiator and the multiple chip, which correspond, to be connected
It connects, and first radiator is located at the ipsilateral of the substrate with the chip；Air intake along the substrate is to outlet air end
The frontal projected area of each first radiator of direction arrangement on the substrate is gradually increased.
Further, the multiple chip is arranged in array on the substrate.
Further, the multiple chip is divided into multiple row chipset, and along the side of the air intake of the substrate to outlet end
To the column pitch between adjacent two column chipset is gradually increased.
Further, the orthographic projection of the relatively described substrate of first radiator covers the relatively described substrate of the chip
Orthographic projection.
Further, the center of orthographic projection of first radiator relative to the substrate is opposite with the chip described
The center of the orthographic projection of substrate is overlapped.
Further, along each first radiator that the direction of the air intake of the substrate to outlet air end arranges, appoint
The interval of two first radiators of meaning is equal.
Further, the circuit board further includes multiple second radiators；Second radiator and first heat dissipation
Device is opposite to be installed, and first radiator and the second radiator are located at the two sides of the substrate.
Further, the shapes and sizes of corresponding first radiator of the same chip and the second radiator are identical.
Further, the bottom of first radiator is provided with the first installation base, the bottom of second radiator
It is provided with the second installation base；First radiator is bonded on the chip by first installation base, is passed through
Second installation base welds second radiator on the substrate.
The embodiment of the present disclosure additionally provides a kind of calculating equipment, including at least one described circuit board.
The embodiment of the present disclosure additionally provides a kind of cooling cabinet, comprising: shell, blowing fan and at least one described circuit
Plate；The shell is provided with air inlet and air outlet, and the blowing fan is mounted on the air inlet, is provided in the shell
At least one set of mounting groove, the circuit board are plugged in the mounting groove, and the air intake of the circuit board is towards the air inlet
Mouthful, the outlet air end of the circuit board is towards the air outlet.
Further, the air outlet is provided with exhaust fan.
Further, the cooling cabinet further includes temperature sensor and control panel；The control panel respectively with the temperature
It spends sensor, the exhaust fan and the blowing fan and carries out signal connection；The temperature sensor is mounted on circuit board
On the chip of outlet air end；The chip temperature that the control panel is acquired according to the temperature sensor controls the exhaust fan and described
The revolving speed of blowing fan.
The same of substrate is arranged in circuit board, calculating equipment and cooling cabinet, the multiple chips that embodiment of the disclosure provides
On on one side, and along the direction of the air intake of substrate to outlet air end, the arrangement density of multiple chips on the substrate is gradually decreased,
Multiple first radiators connect one to one with multiple chips, and along the arrangement of the direction of the air intake of substrate to outlet air end
Each first radiator is gradually increased in the frontal projected area of the substrate；The chip reduced positioned at air duct downstream is upper by being located at
The heat of travel core piece influences, and while cooling down to circuit board, also reduces the chip of circuit board air intake and outlet air end
Between temperature difference, promoted supercomputer server apparatus calculated performance.
Detailed description of the invention
One or more embodiments are illustrated by corresponding attached drawing, these exemplary illustrations and attached drawing
The restriction to embodiment is not constituted, the element with same reference numbers label is expressed as similar element, attached drawing in attached drawing
Composition does not limit, and wherein:
Fig. 1 is the structural schematic diagram for the circuit board that the embodiment of the present disclosure provides；
Fig. 2 is arrangement schematic diagram of the first radiator that provides of the embodiment of the present disclosure on substrate；
Fig. 3 is the scheme of installation of the embodiment of the present disclosure the first radiator, the second radiator that provide relative to substrate；
Fig. 4 is the structural schematic diagram for the first radiator that the embodiment of the present disclosure provides；
Fig. 5 is chip temperature schematic diagram uniformly distributed on prior art circuits plate；
Non- uniformly distributed chip temperature schematic diagram on the circuit board that Fig. 6 provides for the embodiment of the present disclosure.
Description of symbols:
10- substrate,
20- chip,
The first radiator of 30-,
The first installation base of 31-.
Specific embodiment
The characteristics of in order to more fully hereinafter understand the embodiment of the present disclosure and technology contents, with reference to the accompanying drawing to this public affairs
The realization for opening embodiment is described in detail, appended attached drawing purposes of discussion only for reference, is not used to limit the embodiment of the present disclosure.
In technical description below, for convenience of explanation for the sake of, disclosed embodiment is fully understood with providing by multiple details.
However, one or more embodiments still can be implemented in the case where without these details.It in other cases, is simplification
Attached drawing, well known construction and device can simplify displaying.
As recorded in background technique, the method that major part supercomputer server apparatus all uses stacked chips at present is promoted
Performance, and with the continuous promotion for calculating power, chip power-consumption is also significantly increased.Moreover, current most of supercomputer server is all adopted
With wind-cooling heat dissipating, the method by increasing radiator increases cooling heat source area, then takes away heat by the cooling wind that fan is sent
Amount.But radiator is on circuit boards all using being evenly arranged at present, heat sink size is also identical, and which results in wind
Road downstream chip is influenced by upstream chip heat, and then leads to the presence of temperature between circuit board air intake and outlet air end chip
Difference is spent, so that the calculated performance of supercomputer server apparatus be made to decline.
The embodiment of the present disclosure provides a kind of circuit board, calculates equipment and cooling cabinet, can reduce and enters the wind positioned at circuit board
There are temperature differences between end and outlet air end chip, promote the calculated performance of supercomputer server apparatus.
The specific of circuit board, calculating equipment and the cooling cabinet that the embodiment of the present disclosure provides is discussed in detail with reference to the accompanying drawing
Embodiment.
The embodiment of the present disclosure provides a kind of circuit board, and structure is as depicted in figs. 1 and 2, which includes: substrate
10, multiple chips 20 and multiple first radiators 30；Multiple chips 20 are arranged on the same face of substrate 10, and along substrate 10
Air intake to the direction of outlet air end, the arrangement density of chip 20 on the substrate 10 gradually decreases；Multiple first radiators 30 with it is more
A chip 20 connects one to one, and the first radiator 30 is located at the ipsilateral of substrate 10 with chip 20；Along the air intake of substrate 10
The frontal projected area of each first radiator 30 arranged to the direction of outlet air end on the substrate 10 is gradually increased.
Illustratively, substrate 10 is generally rectangular in shape, and multiple chip installation areas and connection are provided on substrate 10
The circuit of each chip installation area.When the air intake of substrate 10 refers to that substrate 10 is mounted in the air duct for calculating equipment, 10 court of substrate
To one end of air inlet of air duct；When the outlet air end of substrate 10 refers to that substrate 10 is placed in the air duct for calculating equipment, 10 court of substrate
To one end of duct outlet.
Multiple one-to-one correspondence of chip 20 are mounted on multiple chip installation areas, specifically, chip 20 can be by being bonded or welded
Etc. modes be fixedly connected with substrate 10.20 quantity of chip close to the region setting of the air intake of substrate 10 is greater than close to substrate
20 quantity of chip of the region setting of 10 outlet air end, that is to say, that the air intake along substrate 10 is to the direction of outlet air end, chip
20 distributed quantity on the substrate 10 gradually decreases, due to each chip 20 generate heat it is almost the same, substrate 10 close into
The quantity of the chip 20 of the region setting at wind end is more, higher in the heat of the air intake generation of substrate 10 accordingly, substrate 10
The quantity for the chip 20 being arranged close to the region of outlet air end is few, fewer in the heat of the outlet air end generation of substrate 10 accordingly,
Therefore the heat for needing cold wind to take away along the air intake of substrate 10 to the direction of outlet air end, substrate 10 gradually decreases.
It is understood that multiple chips 20 can be in array distribution on the front of substrate 10, i.e., multiple chips 20 are in base
It can be in several rows of ordered series of numbers distributions on plate 10.Chip 20 on substrate 10 can be divided into multiple row chipset, and each column chipset includes more
A chip 10, and the column interval between the air intake of substrate 10 to outlet air extreme direction, adjacent two spr chips group is gradually increased, because
This substrate 10 is greater than chip array density of the substrate 10 close to outlet air end, Jin Erji close to the arrangement density of the chip 20 of air intake
Heat of the plate 10 close to the region of air intake is greater than substrate 10 close to the heat in the region of outlet air end.
The quantity for the first radiator 30 arranged on substrate 10 is equal with 20 quantity of chip of 10 front arrangement of substrate, each
First radiator 30 is individually correspondingly arranged on a chip 20.Aluminium extruded radiator, so-called aluminium can be used in first radiator 30
For crowded radiator, that is, aluminium using radiator made of extrusion process, the first radiator 30 includes multiple radiating fins uniformly arranged
Piece, the identical heat dissipation cavity formed between any two radiating fin；The heat transfer that chip 20 generates is to the first radiator 30
On, the cold wind introduced from the air intake of substrate 10 flows through the heat dissipation cavity of the first radiator 30, by the heat band of the first radiator 30
It walks, and heat is transferred to the outlet air end of substrate 10 with the flowing of cold wind.
In the present embodiment, the frontal plane of projection of each first radiator 30 arranged along air intake to the outlet air extreme direction of substrate 10
Product is gradually increased；It is understood that since the first radiator 30 is oppositely arranged on the substrate 10 and in each first radiator 30
It is of same size in the case where, the length of each first radiator 30 arranged along air intake to the outlet air extreme direction of substrate 10 is gradually
Increase, the frontal projected area for each first radiator 30 that air intake to the outlet air extreme direction along substrate 10 can be made to arrange gradually increases
Greatly.The frontal projected area of each first radiator 30 arranged with the air intake along substrate 10 to outlet air extreme direction is gradually increased,
Also the contact area of each first radiator 30 and cold wind that arrange just air intake to the outlet air extreme direction along substrate 10 is bigger,
The heat exchanger effectiveness of the first radiator 30 with cold wind is improved, therefore is arranged along the air intake of substrate 10 to outlet air extreme direction each
The heat-sinking capability of first radiator 30 is gradually increased.
It is understood that the first radiator 30 provided in this embodiment, length and the first radiator 30 are in substrate 10
Environment temperature around installed position, the herein power consumption of chip 20 and positioned at substrate outlet air end and positioned at substrate air intake
The temperature difference of chip 20 is related, and the thermal resistance of the first radiator 30 needed for being determined according to the above parameter passes through the thermal resistance of the first radiator
The length of the first radiator is selected, that is, selects the heat exchange area of the first radiator 30 and cold wind.
In the present embodiment, 20 quantity of chip arranged along 10 air intake of substrate to outlet air extreme direction is gradually less, substrate 10
On the heat that need to spread it is gradually less accordingly along cold wind flow direction, furthermore the first radiator 30 dissipating in cold wind flow direction
Heat area is also gradually increased, and the heat-sinking capability of the first radiator 30 is gradually increased, therefore the temperature of the chip of 10 outlet air end of substrate
The heat of chip by 10 air intake of substrate is influenced to reduce, and then is made 20 temperature of chip for being located at 10 air intake of substrate and be located at
The temperature difference of basic outlet air end chip 20 reduces, and promotes the calculated performance of supercomputer server apparatus.
In the present embodiment, the positive throwing of orthographic projection covering 20 opposing substrate 10 of chip of 30 opposing substrate 10 of the first radiator
Shadow.
Specifically, the first radiator 30 is mounted on side of the chip 20 far from substrate 10, for the heat for generating chip 20
It quickly is transferred to the first radiator 30,30 opposing substrate of the first radiator, 10 orthographic projection can be by chip 20 relative to substrate 10
The surface area that orthographic projection covering, the i.e. heat dissipation area of the first radiator 30 are greater than chip 20, it is possible to increase the first radiator 30 and core
Heat transfer efficiency between piece 20.Compared to the area that the heat dissipation area of the first radiator 30 is less than chip 20, chip 20 is generated
Heat can quickly be transferred on the first radiator 30.
Further, the first radiator 30 relative to the orthographic projection of substrate 10 center and 20 opposing substrate 10 of chip just
The center of projection is overlapped.
Specifically, chip 20 and 30 centering of the first radiator are arranged, the center of the orthographic projection of 20 opposing substrate 10 of chip with
The center of first radiator, 30 orthographic projection is overlapped, and the heat that chip 20 generates is spread to surrounding space, diffuses to chip 20
The heat of surrounding space can be diffused to uniformly on the first radiator 30, and be discharged via the first radiator 30 with cold wind, accelerate the
Heat transmission between one radiator 30 and chip 20.
On the basis of the above embodiments, each first radiator arranged along the direction of the air intake of substrate 10 to outlet air end
In 30, the interval of arbitrary two the first radiators 30 is equal.
Specifically, being arranged with multiple first radiators 30, any two along the direction of air intake to the outlet air end of substrate 10
The interval of first radiator 30 is equal, i.e., the first radiator of any two 30 between left and right every equal.It is understood that this reality
Apply the first radiator of any two in example between left and right every can be 2-5mm, preferably 2mm.
The interval of the heat dissipation of any two first 30 is equal in the present embodiment, ensure that air intake along substrate 10 to outlet air end
Direction, the length of the first radiator 30 increases with the interval scaling up between adjacent chips, further decreases substrate
Temperature difference on 10 between the chip 20 of different location.
As shown in figure 3, circuit board further includes multiple second radiators, the second radiator and the opposite peace of the first radiator 30
Dress, and the first radiator 30 and the second radiator are located at the two sides of substrate 10.
Illustratively, substrate 10 includes front and back, and chip 20 may be provided on the front of substrate 10, the first radiator
30 can be bonded on chip 20.The back side of substrate 10 is provided with multiple second radiators, the second radiator is mounted on chip 20
At corresponding 10 back side of substrate, and each chip 20 is in one the second radiator of the corresponding installation in the back side of substrate, and then realizes the
Second radiator and the opposite installation of the first radiator 30.Substrate 10 is using the first radiator 30 and the second radiator simultaneously to chip 20
Cool down, improves the cooling efficiency to chip 20.It is understood that bonding or weldering equally can be used in the second radiator
The mode connect is fixed on the back side of substrate 10.
It is understood that for the back side that the heat that chip 20 generates is quickly diffused to substrate 10, substrate 10 is provided with
Multiple heat transfer holes, multiple heat transfer holes can be evenly arranged around chip 20, and the heat that chip 20 generates diffuses to base by hole of conducting heat
The back side of plate 10 diffuses in the heat transmission to the second radiator at 10 back side of substrate, and cold wind flows through the second radiator and by
Heat on second radiator is transplanted on outside the outlet air end of substrate 10.
Without restriction for the shapes and sizes of the second radiator in the present embodiment, the second radiator is relative to substrate
10 orthographic projection can be greater than orthographic projection of the chip 20 relative to substrate 10, orthographic projection of second radiator relative to substrate 10
Orthographic projection of the chip 20 relative to substrate 10 can be not more than, details are not described herein again.Preferably, same chip 20 corresponding
One radiator 30 is identical with the shapes and sizes of the second radiator, further reduced the temperature of chip 20 on substrate 10, and subtracts
The temperature difference of chip, improves the calculated performance of supercomputer server apparatus on small substrate 10.
As shown in figure 4, the bottom of the first radiator 30 is provided with the first installation base 31, the bottom setting of the second radiator
There is the second installation base；First radiator 30 is bonded on chip 20 by the first installation base 31, it is convex by the second installation
Platform welds the second radiator on the substrate 10.
Specifically, the first radiator 30 is identical with the form and dimension of the second radiator, the first radiator 30 and second dissipates
The radiating fin that hot device includes heat dissipation bottom sheet and is mounted in heat dissipation bottom sheet at equal intervals, heat dissipation bottom sheet have the arc of certain radian
Shape plate, radiating fin can be rectangular slab, and radiating fin is vertically mounted in heat dissipation bottom sheet, and is formed and dissipated between adjacent heat radiation fin
Hot chamber, heat dissipation cavity are arranged along cold wind flow direction, and cold wind passes through heat dissipation cavity for the first radiator 30 and the heat of the second radiator
It takes away；Heat dissipation bottom sheet is made of arc panel, it is possible to increase the space between heat dissipation bottom sheet and substrate.
The heat dissipation bottom sheet of first radiator 30 is provided with the first installation base 31,31 shape of the first installation base and chip 20
Shape it is identical, the material of the first installation base 31 can be identical as the material of the first radiator 30, and usually heat conductivity compares
Good metal material, such as aluminium.First installation base 31 may be designed to rectangular block, the side of the first installation base 31 arcuately plate
Center line arrangement；First installation base, 31 other side is bonded on side of the chip 20 far from substrate 10, and first after bonding
Installation base 31 is overlapped with chip 20.First radiator 30 is connect by the first installation base 31 with chip 20, it is possible to increase first
Heat transfer efficiency between radiator 30 and chip 20, while also enhancing the bonding strength between the first radiator 30 and chip 20,
First radiator 30 is bonded on chip 20.
The present embodiment is without restriction for the bonding way of the first installation base 31 and chip 20, preferably in the first peace
It is fixed between dress boss 31 and chip 20 using heat-conducting glue, heat-conducting glue not only acts as fixed function, and furthermore heat-conducting glue is as interface
Material has lesser thermal contact resistance, is conducive to the heat transmitting between the first installation base 31 and chip 20.
The bottom of second radiator is provided with the second installation base, likewise, the second installation base is designed to rectangular block, the
Two installation base sides arcuately plate center line arrangement；Second installation base can be fixed on by way of being bonded or welding
On substrate 10.
In the present embodiment, preferably the second installation base is fixed in a manner of scolding tin on the substrate 10, it can be in substrate 10
The position that the back side corresponds to chip 20 is provided with dew copper, and the size for revealing copper is identical as the size of the mounting surface of the second installation base, will
Second installation base is welded on dew copper position.
In addition, the first installation base 31 of the first radiator 30 setting and the second installation base of the second radiator setting,
Space between substrate 10 and radiator can be effectively increased, other elements installation requirements on substrate 10 can be met, extend substrate 10
Function.
The embodiment of the present disclosure additionally provides a kind of calculating equipment, including at least one circuit board, is provided on circuit board more
A chip 20 and the first radiator 30 and the second radiator；Nonuniform mutation operator has chip 20 on the substrate 10, i.e., along substrate 10
Air intake to the direction of outlet air end, the distributed quantity of chip 20 on the substrate 10 gradually decreases；And extremely along the air intake of substrate 10
Each first radiator 30 of direction arrangement and the length of the second radiator of outlet air end are gradually increased；Therefore the embodiment of the present disclosure mentions
The chip that the calculating equipment of confession reduces positioned at air duct downstream is influenced by the heat for being located at upstream chip, is carried out to circuit board
While cooling, the temperature difference between circuit board air intake and the chip of outlet air end is also reduced, promotes the meter for calculating equipment
Calculate performance.
The embodiment of the present disclosure additionally provides a kind of cooling cabinet comprising: shell, blowing fan and at least one circuit board；
Shell is provided with air inlet and air outlet, and blowing fan is mounted on air inlet, at least one set of mounting groove, circuit are provided in shell
Plate is plugged in mounting groove, and the air intake of circuit board is towards air inlet, and the outlet air end of circuit board is towards air outlet.
Specifically, cooling cabinet includes shell, shell can be the rectangular configuration surrounded using four rectangular panels, shell
Both ends be provided with air inlet and air outlet, blowing fan is installed in the air inlet of shell, blowing fan will be outside cooling cabinet
Cold wind introduce shell in, cold wind along air inlet to air outlet direction flow, formed air duct.At least one set is provided in shell
Mounting groove, and at least one set of circuit board as shown in Figures 1 to 5 is plugged in mounting groove, is realized circuit board and is detachably installed
In cooling cabinet；Wherein the air intake of circuit board makes at circuit board towards air inlet, the outlet air end of circuit board towards air outlet
In on the direction of cold wind flowing, the heat on circuit board drains into outside cooling cabinet by cold wind.The present embodiment is to circuit board and dissipates
Connection type between heat engine case is without restriction；For example, dovetail groove can be provided in air duct, circuit board is provided with and dovetail
The installation side that slot matches, circuit board are slid into from one end of dovetail groove by installation side and are mounted in dovetail groove, it can be achieved that by electric
Road plate is quick installed in shell.
In the embodiment of the present disclosure, the air outlet of cooling cabinet is provided with exhaust fan, and exhaust fan is used for will be in cooling cabinet
Hot wind draws cooling cabinet.In the present embodiment, it is respectively arranged with blowing fan and exhaust fan in the air inlet and air outlet of shell, it can
Accelerate the flowing velocity of cold wind in cooling cabinet and in time takes away the heat on circuit board, heat radiation cabinet interior circuit board
Heat dissipation effect.
On the basis of the above embodiments, cooling cabinet further includes temperature sensor and control panel, control panel respectively with temperature
It spends sensor, exhaust fan and blowing fan and carries out signal connection, temperature sensor is mounted on the chip of the outlet air end of circuit board
On 20；The revolving speed of chip temperature control exhaust fan and blowing fan that control panel is acquired according to temperature sensor.
Specifically, being equipped with control panel on the surface of a panel of cooling cabinet, on road, plate is close to cabinet air outlet position
Temperature sensor is installed on the chip 20 at place.The input terminal of control panel is connect with temperature sensor signal, the output of control panel
End is connect with exhaust fan and blowing fan signal respectively.Temperature sensor acquires 20 temperature of chip close to cabinet air outlet position,
And this temperature data is transferred to control panel, control panel controls exhaust fan and air-supply according to the temperature data that temperature sensor acquires
The revolving speed of fan advantageously reduces the function of supercomputer server apparatus so that 20 temperature of chip close to cabinet air outlet position is constant
Consumption and noise.
The cooling cabinet that the embodiment of the present disclosure provides, multiple circuit boards are equipped in air duct, are provided on circuit board more
A chip 20 and the first radiator 30 and the second radiator；Nonuniform mutation operator has chip 20 on the substrate 10, i.e., along substrate 10
Air intake to the direction of outlet air end, the distributed quantity of chip 20 on the substrate 10 gradually decreases.The non-homogeneous cloth in the two sides of substrate 10
It is equipped with the first radiator 30 and the second radiator, the length of the first radiator 30 and the second radiator by changing different location
Degree, i.e., the length of each first radiator 30 and the second radiator that arrange along the direction of the air intake of substrate 10 to outlet air end is gradually
Increase；Therefore the cooling cabinet that the embodiment of the present disclosure provides, under the premise of not changing arrangement space inside cooling cabinet, in base
Be provided with the first radiator 30 of different length on plate 10, change the thermal resistance of radiator, the heat radiator thermal resistance that chip is selected with
The inversely proportional relationship of the local ambient temperature of the position reduces the chip positioned at air duct downstream by the heat for being located at upstream chip
Amount influences, and while cooling down to circuit board, also reduces the temperature between circuit board air intake and the chip of outlet air end
Difference promotes the calculated performance of supercomputer server apparatus.
Attached drawing 5 and attached drawing 6 are please referred to, is compared and is shown by attached drawing 5 and attached drawing 6: the circuit that embodiment of the disclosure provides
Plate and cooling cabinet make 20 minimum temperature of chip positioned at circuit board outlet air end be reduced to 84.4 by 88.6, reduce 4.2 DEG C,
The temperature for reducing circuit board improves 20 service life of chip and performance, while being located at 20 He of chip of circuit board outlet air end
The temperature difference between the chip 20 of circuit board air intake is reduced to 5.6 DEG C by 19 DEG C before；It can continue to carry out chip excellent
Change, make positioned at circuit board outlet air end chip 20 and between the chip 20 of circuit board air intake the temperature difference control 3 DEG C with
It is interior, in the ideal situation, the temperature of the chip 20 positioned at circuit board outlet air end and the chip 20 positioned at circuit board air intake can be made
It reaches unanimity；And in the embodiments of the present disclosure, due to reducing the temperature of high temperature chip, the revolving speed of radiator fan can be appropriate
It reduces to reduce Overall Power Consumption.
Above-mentioned technical description can refer to attached drawing, these attached drawings form a part of the application, and by description attached
The embodiment according to described embodiment is shown in figure.Although the description of these embodiments is enough in detail so that this field
Technical staff can be realized these embodiments, but these embodiments are non-limiting；Other implementations thus can be used
Example, and variation can also be made in the case where not departing from the range of described embodiment.For example, described in flow chart
Operation order be non-limiting, therefore in flow charts illustrate and according to flow chart description two or more behaviour
The sequence of work can be changed according to several embodiments.As another example, in several embodiments, it explains in flow charts
It releases and is optional or deletable according to one or more operations that flow chart describes.In addition, certain steps or
Function can be added in the disclosed embodiments or more than two sequence of steps are replaced.All these variations are considered
Included in the disclosed embodiments and claim.
In addition, using term to provide the thorough understanding of described embodiment in above-mentioned technical description.However, and being not required to
Will excessively detailed details to realize described embodiment.Therefore, the foregoing description of embodiment be in order to illustrate and describe and
It presents.The embodiment and example disclosed according to these embodiments presented in foregoing description is provided separately, with
Addition context simultaneously helps to understand described embodiment.Description above, which is not used in, accomplishes exhaustive or by described reality
Apply the precise forms that example is restricted to the disclosure.According to the above instruction, it is several modification, selection be applicable in and variation be feasible.?
In some cases, processing step well known is not described in avoid described embodiment is unnecessarily influenced.
Industrial applicibility
Circuit board, calculating equipment and cooling cabinet disclosed in the present application are dissipated under the premise of arrangement space is constant by designing
The different heat dissipation areas of hot device, change the thermal resistance of radiator, the heat radiator thermal resistance that chip is selected and the position
Local ambient temperature is inversely proportional；Achieve the effect that whole plate samming by temperature, thermal resistance matching, improves chip service life and property
Can, to promote the calculated performance of supercomputer server apparatus.In addition, this chip and radiator layout type of the disclosure, it can
With reduce be located at the chip in air duct downstream by the heat of the chip positioned at upstream influenced, it is same cooling down to circuit board
When, also reduce the temperature difference between circuit board air intake and outlet air end chip；Also, due to reducing high temperature chip
Temperature, rotation speed of the fan can reduce suitably to reduce Overall Power Consumption.
Claims (13)
1. a kind of circuit board, which is characterized in that including substrate, multiple chips and multiple first radiators；
The multiple chip is arranged on the same face of the substrate, and along the direction of the air intake of the substrate to outlet air end,
The arrangement density of the multiple chip on the substrate gradually decreases；
The multiple first radiator connects one to one with the multiple chip, and first radiator and the chip position
In the ipsilateral of the substrate；
The positive throwing of each first radiator arranged along air intake to the direction of outlet air end of the substrate on the substrate
Shadow area is gradually increased.
2. circuit board according to claim 1, which is characterized in that the multiple chip is in array row on the substrate
Cloth.
3. circuit board according to claim 2, which is characterized in that the multiple chip is divided into multiple row chipset, and along institute
The air intake of substrate is stated to the direction of outlet end, the column pitch between adjacent two column chipset is gradually increased.
4. circuit board according to claim 1, which is characterized in that the orthographic projection of the relatively described substrate of the first radiator
Cover the orthographic projection of the relatively described substrate of the chip.
5. circuit board according to claim 4, which is characterized in that positive throwing of first radiator relative to the substrate
The center of the orthographic projection of the center of the shadow substrate opposite with the chip is overlapped.
6. circuit board according to claim 5, which is characterized in that arrange in air intake to the direction of outlet air end along the substrate
In each first radiator of column, the interval of arbitrary two first radiators is equal.
7. circuit board according to claim 1, which is characterized in that the circuit board further includes multiple second radiators；
Second radiator installation opposite with first radiator, and first radiator and the second radiator are located at institute
State the two sides of substrate.
8. circuit board according to claim 7, which is characterized in that corresponding first radiator of the same chip and
The shapes and sizes of second radiator are identical.
9. circuit board according to claim 8, which is characterized in that the bottom of first radiator is provided with the first installation
The bottom of boss, second radiator is provided with the second installation base；
First radiator is bonded on the chip by first installation base, passes through second installation base
On the substrate by second radiator welding.
10. a kind of calculating equipment, which is characterized in that including at least one such as the described in any item circuit boards of claim 1-9.
11. a kind of cooling cabinet, which is characterized in that including shell, blowing fan and at least one any one of such as claim 1 to 9
The circuit board；
The shell is provided with air inlet and air outlet, and the blowing fan is mounted on the air inlet, setting in the shell
Have at least one set of mounting groove, the circuit board is plugged in the mounting groove, and the air intake of the circuit board towards it is described into
Air port, the outlet air end of the circuit board is towards the air outlet.
12. cooling cabinet according to claim 11, which is characterized in that the air outlet is provided with exhaust fan.
13. cooling cabinet according to claim 12, which is characterized in that the cooling cabinet further include temperature sensor and
Control panel；
The control panel carries out signal connection with the temperature sensor, the exhaust fan and the blowing fan respectively；
The temperature sensor is mounted on the chip of the outlet air end of circuit board；
The control panel controls turn of the exhaust fan and the blowing fan according to the chip temperature that the temperature sensor acquires
Speed.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2018/109118 WO2020062253A1 (en) | 2018-09-30 | 2018-09-30 | Circuit board, computing device and cooling case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109417862A true CN109417862A (en) | 2019-03-01 |
Family
ID=65461991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880001930.5A Pending CN109417862A (en) | 2018-09-30 | 2018-09-30 | Circuit board calculates equipment and cooling cabinet |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109417862A (en) |
| WO (1) | WO2020062253A1 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110708932A (en) * | 2019-09-25 | 2020-01-17 | 北京比特大陆科技有限公司 | Radiator and PCB radiating assembly and server with same |
| CN112153870A (en) * | 2020-09-25 | 2020-12-29 | 科华恒盛股份有限公司 | Heat radiation structure and inverter |
| CN113126704A (en) * | 2020-01-15 | 2021-07-16 | 阿里巴巴集团控股有限公司 | Mainboard applied to computing equipment, computing equipment and data center machine room |
| CN113364027A (en) * | 2021-05-17 | 2021-09-07 | 华为技术有限公司 | Energy storage module, energy storage device and power generation system |
| WO2023001012A1 (en) * | 2021-07-20 | 2023-01-26 | 北京比特大陆科技有限公司 | Hashboard and data processing device |
| WO2024041017A1 (en) * | 2022-08-24 | 2024-02-29 | 北京嘉楠捷思信息技术有限公司 | Electronic device |
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| WO2024041017A1 (en) * | 2022-08-24 | 2024-02-29 | 北京嘉楠捷思信息技术有限公司 | Electronic device |
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| Publication number | Publication date |
|---|---|
| WO2020062253A1 (en) | 2020-04-02 |
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Address after: 100192 2nd Floor, Building 25, No. 1 Hospital, Baosheng South Road, Haidian District, Beijing Applicant after: BEIJING BITMAIN TECHNOLOGY CO., LTD. Address before: 100192 No. 25 Building of Aubei Science Park, No. 1 Baosheng South Road, Haidian District, Beijing Applicant before: BEIJING BITMAIN TECHNOLOGY CO., LTD. |