CN205033593U - Laser ray array 3D printing apparatus - Google Patents
Laser ray array 3D printing apparatus Download PDFInfo
- Publication number
- CN205033593U CN205033593U CN201520208875.0U CN201520208875U CN205033593U CN 205033593 U CN205033593 U CN 205033593U CN 201520208875 U CN201520208875 U CN 201520208875U CN 205033593 U CN205033593 U CN 205033593U
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Abstract
The utility model provides a laser ray array 3D printing apparatus, includes computer control, shaping layer board, storage case, laser irradiation ware and scraper blade, and wherein shaping layer board below is equipped with elevating system, and the shaping layer board sets up at the storage incasement with elevating system is whole, places a large amount of materials for use at the storage incasement, is equipped with a liftable scraper blade and laser irradiation ware above the shaping layer board, this laser irradiation ware a plurality of laser diode of array that reach the standard grade. The utility model discloses based on in the SLA technique, adopted a laser ray array irradiator, go on by line to a face formula scanning shaping the shaping work piece of big breadth, can carry out high efficiency, accurate shaping preparation to the large size product of big breadth, improve the time of expending in shaping speed, the reduction manufacturing process.
Description
[technical field]
The utility model designs a kind of 3D field shaping technique, particularly relates to and adopts laser diode linear array to arrange quick 3D forming technique.
[background technology]
3D printing technique, also can be described as and increases material manufacturing technology, by the printing of the automatic numerical control successively process implementation threedimensional model of buildup of material.For traditional process technology, 3D printing technique does not need to make mould separately, directly processes finished product.And the special construction obstacle that traditional machining cannot realize can be overcome, the simplification that can realize any complex components is produced, can automatically, directly, accurately just design philosophy, from cad model, be converted into the model or device with certain function.
At present, 3D printing technique can be divided into according to forming principle: fusion sediment technology FDM, selective laser sintering forming technique SLS, photocurable liquid resin constituency curing molding technology SLA.But FDM technology is by ablation heat thermoplastic plastic or eutectic system metal and extrudes shower nozzle, and it is three-dimensionally shaped to realize that solidification to be cooled obtains required workpiece.SLA is then shaping by laser scanning curing photosensitive resin, and selective laser sintering is by powder sintered shaping by laser scanning.These rapid prototyping & manufacturing technology existing all also exist and can only scan zonule, and by point to line, again by the process of line to face, manufacturing time length is its defect.SLS is commercialization the earliest, should be used as rapid shaping technique widely, and it is theoretical, the reduction etc. of the perfect and price of technique, has important impact to the popularization and application of rapid prototyping & manufacturing technology.
[summary of the invention]
The utility model proposes a kind of based in SLA technical foundation for above situation, the laser linear array column 3D forming method that flat scanning is shaping can be realized, the method can carry out the shaping making of 3D to large format, large scale product, and improves shaping speed, the time of minimizing spent by manufacturing process.
Laser linear array column 3D printing device involved by the utility model comprises computer control, shaping supporting plate, material storing box, laser irradiation device and scraper plate, wherein be provided with elevating mechanism below shaping supporting plate, shaping supporting plate and elevating mechanism are integrally provided in material storing box, a large amount of stand-by material is placed in material storing box, a liftable scraper plate and laser irradiation device is provided with, the multiple laser diode of linear array on this laser irradiation device above shaping supporting plate.
Multiple laser diode linear array arrangement on laser irradiation device, the spacing between every laser diode is 0.1mm.
The diameter of this laser diode chip lamp pearl is 1mm.
A forming method for laser linear array column 3D printing device, it is characterized in that, the method comprises the following steps:
Step one: use 3D modeling software analogue formation in a computer, utilizes software to be surface model by threedimensional model section, is sent on the computer control of laser linear array column 3D printing device;
Step 2: the power output adjustable range of single laser diode is 0.1w ~ 10w;
Step 3: corresponding laser diode selection material, ultraviolet laser diode selects photosensitive resin material; Infra-red laser diode selects dusty material;
Step 4: place enough materials in material storing box, and shaping supporting plate is adjusted on extreme higher position, and guarantee the material shaping supporting plate being covered with an applicable formable layer;
Step 5: open laser irradiation device and scanning irradiation is carried out to shaping supporting plate, computer control, in scanning process, controls opening/closing of corresponding laser diode according to the X-Y scheme that section generates;
Step 6: after completing one deck scanning, scraper plate is under the control of computer control, and the surface being close to shaped article hangs excess stock;
Step 7: shaping supporting plate declines the height of one deck under elevating mechanism drives, supplementary material;
Move in circles, until obtain finished article.
In the forming method of laser linear array column 3D printing device, if the liquid material of material, when each shaping supporting plate declines, completed the process of supplementary material by the shaping supporting plate of flowing submergence of liquid material, and if dusty material, then need to re-lay layer of material.
Comprise material in dusty material process of deployment and spread paving and material strikes off, roughly spread by material and be layered on shaping supporting plate, then scraper plate was scraped from face, kept material face even uniform.
The utility model is technical based on SLA, have employed a kind of laser rays array irradiator, the shaping workpiece of large format is carried out by line to face formula scanning moulding, can carry out efficiently the large-sized product of large format, shaping making accurately, improve molding rate, reduce the time spent in manufacturing process.
[accompanying drawing explanation]
Fig. 1 is the structural representation of the laser linear array column 3D printing device involved by the utility model;
Fig. 2 is the laser linear array column 3D printing device implementation step flow chart involved by the utility model;
Wherein: 10, shaping supporting plate; 20, elevating mechanism; 30, material storing box; 40, laser irradiation device; 41, laser diode; 50, scraper plate; 60, computer control;
[detailed description of the invention]
Below in conjunction with the utility model the drawings and specific embodiments, the utility model laser linear array column 3D printing device and forming method thereof are described in further detail.
The utility model can realize the unlimited expansion of processing breadth in theory, limit, utilized 1000 laser diode LDs, the spacing 0.1mm between diode, prepared the laser diode linear array that length is about 200mm by experiment condition.The restriction that the diameter 1mm of laser diode chip lamp pearl had both breached large format processing in turn ensure that formed precision.In addition, laser diode power, wavelength have multiple, according to used power and wavelength connecting shaping material, can meet different forming requirements.
Laser linear array column 3D printing device comprises computer control 60, shaping supporting plate 10, material storing box 30, laser irradiation device 40 and scraper plate 50, wherein be provided with elevating mechanism 20 below shaping supporting plate 10, shaping supporting plate 10 and elevating mechanism 20 are integrally provided in material storing box 30, a large amount of stand-by material is placed in material storing box 30, a liftable scraper plate 50 and laser irradiation device 40 is provided with, the multiple laser diode 41 of linear array on this laser irradiation device 40 above shaping supporting plate 10.
Multiple laser diode 41 linear array arrangement on laser irradiation device 40, the spacing between every laser diode 41 is 0.1mm.
The diameter of this laser diode 41 chip lamp pearl is 1mm.
A forming method for laser linear array column 3D printing device, it is characterized in that, the method comprises the following steps:
Step one: use 3D modeling software analogue formation in a computer, utilizes software to be surface model by threedimensional model section, is sent on the computer control of laser linear array column 3D printing device;
Step 2: the power output adjustable range of single laser diode is 0.1w ~ 10w;
Step 3: corresponding laser diode selection material, ultraviolet laser diode selects photosensitive resin material; Infra-red laser diode selects dusty material;
Step 4: place enough materials in material storing box, and shaping supporting plate is adjusted on extreme higher position, and guarantee the material shaping supporting plate being covered with an applicable formable layer;
Step 5: open laser irradiation device and scanning irradiation is carried out to shaping supporting plate, computer control, in scanning process, controls opening/closing of corresponding laser diode according to the X-Y scheme that section generates;
Step 6: after completing one deck scanning, scraper plate is under the control of computer control, and the surface being close to shaped article hangs excess stock;
Step 7: shaping supporting plate declines the height of one deck under elevating mechanism drives, supplementary material;
Move in circles, until obtain finished article.
In the forming method of laser linear array column 3D printing device, if the liquid material of material, when each shaping supporting plate declines, completed the process of supplementary material by the shaping supporting plate of flowing submergence of liquid material, and if dusty material, then need to re-lay layer of material.
Comprise material in dusty material process of deployment and spread paving and material strikes off, roughly spread by material and be layered on shaping supporting plate, then scraper plate was scraped from face, kept material face even uniform.
Described section precision refers to that the layer precision in conjunction with threedimensional model size and system of processing determines threedimensional model to be separated into how many, and precision is higher, more than discrete.
Described 3D modeling software can be: 3DMAX, Pro/E, solidworks, AUTOCAD etc.Described two-dimensional surface image refers to two cross-section data information threedimensional model being separated into each face and obtaining.
Described irradiation time laser intensity needed for the fusing point of material cured or material determines.
Described laser diode linear array refers to the laser diode dot matrix made by common LED dot matrix principle with the specific customization chip of specific wavelength, single luminescence chip about 0.05 ~ 0.5mm
2, can select different luminescence chip according to formed precision, single the adjustable output power range of laser diode, in 0.1w ~ 10w, can regulate the power output of single laser diode according to different shaping needs.
The utility model is technical based on SLA, have employed a kind of laser rays array irradiator, the shaping workpiece of large format is carried out by line to face formula scanning moulding, can carry out efficiently the large-sized product of large format, shaping making accurately, improve molding rate, reduce the time spent in manufacturing process.
Operation principle of the present utility model is: photosensitive resin or dusty material solidify or melt cooled and solidified again after being heated to uniform temperature under the irradiation of laser diode.First produce row's diode laser matrix line, under computer and drive circuit control, laser diode pipe array lines provides picture signal by computer program, and laser diode point front moves and irradiates two-dimensional pattern, and namely corresponding laser diode is bright.Like this, the photosensitive resin be irradiated to or powder will be cured or be cooled after coagulation by heat fused.Every one deck X-Y scheme is shaping complete after, by computer control elevating mechanism move down profiled member supporting plate, displacement is thick layer, repaves layer of material, realize successively scan irradiation.When the two dimensional image that threedimensional model is cut into slices successively scan irradiate shaping after, then obtain the entity of whole threedimensional model.
The above, it is only the utility model preferred embodiment, not any pro forma restriction is done to the utility model, although the utility model discloses as above with preferred embodiment, but and be not used to limit the utility model, any those skilled in the art, do not departing within the scope of technical solutions of the utility model, make a little change when the technology contents of above-mentioned announcement can be utilized or be modified to the Equivalent embodiments of equivalent variations, in every case be do not depart from technical solutions of the utility model content, any simple modification that above embodiment is done is referred to according to the utility model technology, equivalent variations and modification, all belong in the scope of technical solutions of the utility model.
Claims (3)
1. a laser linear array column 3D printing device, this 3D printing device comprises computer control, shaping supporting plate, material storing box, laser irradiation device and scraper plate, wherein be provided with elevating mechanism below shaping supporting plate, shaping supporting plate and elevating mechanism are integrally provided in material storing box, a large amount of stand-by material is placed in material storing box, a liftable scraper plate and laser irradiation device is provided with, the multiple laser diode of linear array on this laser irradiation device above shaping supporting plate.
2. laser linear array column 3D printing device according to claim 1, is characterized in that, multiple laser diode linear array arrangement on laser irradiation device, the spacing between every laser diode is 0.1mm.
3. laser linear array column 3D printing device according to claim 1, it is characterized in that, the diameter of this laser diode chip lamp pearl is 1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520208875.0U CN205033593U (en) | 2015-04-09 | 2015-04-09 | Laser ray array 3D printing apparatus |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520208875.0U CN205033593U (en) | 2015-04-09 | 2015-04-09 | Laser ray array 3D printing apparatus |
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| CN205033593U true CN205033593U (en) | 2016-02-17 |
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| CN201520208875.0U Expired - Fee Related CN205033593U (en) | 2015-04-09 | 2015-04-09 | Laser ray array 3D printing apparatus |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104742376A (en) * | 2015-04-09 | 2015-07-01 | 深圳长朗三维科技有限公司 | Laser linear array type 3D printing equipment and molding method thereof |
| CN105880593A (en) * | 2016-06-17 | 2016-08-24 | 哈尔滨福沃德多维智能装备有限公司 | Multi-laser line beam printing type scanning fast forming device and method for manufacturing parts |
| CN108748998A (en) * | 2018-06-29 | 2018-11-06 | 芜湖启迪打印机科技有限公司 | A kind of feeding unit for 3D printer |
| CN109952167A (en) * | 2016-09-29 | 2019-06-28 | Slm方案集团股份公司 | 3 D workpiece is manufactured by means of multiple radiating elements |
| CN111356962A (en) * | 2017-08-17 | 2020-06-30 | Eos有限公司电镀光纤系统 | Method and device for additive manufacturing of at least one component layer of a component, and storage medium |
| CN113427762A (en) * | 2021-07-28 | 2021-09-24 | 深圳市创想三帝科技有限公司 | Photocuring 3D printer |
-
2015
- 2015-04-09 CN CN201520208875.0U patent/CN205033593U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104742376A (en) * | 2015-04-09 | 2015-07-01 | 深圳长朗三维科技有限公司 | Laser linear array type 3D printing equipment and molding method thereof |
| CN105880593A (en) * | 2016-06-17 | 2016-08-24 | 哈尔滨福沃德多维智能装备有限公司 | Multi-laser line beam printing type scanning fast forming device and method for manufacturing parts |
| CN109952167A (en) * | 2016-09-29 | 2019-06-28 | Slm方案集团股份公司 | 3 D workpiece is manufactured by means of multiple radiating elements |
| CN111356962A (en) * | 2017-08-17 | 2020-06-30 | Eos有限公司电镀光纤系统 | Method and device for additive manufacturing of at least one component layer of a component, and storage medium |
| CN108748998A (en) * | 2018-06-29 | 2018-11-06 | 芜湖启迪打印机科技有限公司 | A kind of feeding unit for 3D printer |
| CN113427762A (en) * | 2021-07-28 | 2021-09-24 | 深圳市创想三帝科技有限公司 | Photocuring 3D printer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160217 Termination date: 20170409 |