CN104742376A - Laser linear array type 3D printing equipment and molding method thereof - Google Patents
Laser linear array type 3D printing equipment and molding method thereof Download PDFInfo
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- CN104742376A CN104742376A CN201510164760.0A CN201510164760A CN104742376A CN 104742376 A CN104742376 A CN 104742376A CN 201510164760 A CN201510164760 A CN 201510164760A CN 104742376 A CN104742376 A CN 104742376A
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Abstract
The invention discloses laser linear array type 3D printing equipment which comprises a computer controller, a molding supporting plate, a storage box, a laser irradiator and a scraper, wherein a lifting mechanism is arranged below the molding supporting plate; the molding supporting plate and the lifting mechanism are integrally arranged in the storage box; a large quantity of to-be-used materials are arranged in the storage box; the liftable scraper and the laser irradiator are arranged above the molding supporting plate; and multiple laser diodes are arranged on the laser irradiator in a linear array manner. According to the equipment disclosed by the invention, the laser linear array irradiator is adopted based on a SLA technology, a large-scale image is scanned and molded from a linear mode to a surface mode, a large-scale large-size product can be efficiently and accurately molded and manufactured, the molding rate is increased, and the time consumed in the manufacturing process is reduced.
Description
[technical field]
The present invention designs a kind of 3D field shaping technique, particularly relates to and adopts laser diode linear array to arrange quick 3D forming technique.
[background technology]
3D printing technique, also can be described as and increases material manufacturing technology, by the printing of the automatic numerical control successively process implementation threedimensional model of buildup of material.For traditional process technology, 3D printing technique does not need to make mould separately, directly processes finished product.And the special construction obstacle that traditional machining cannot realize can be overcome, the simplification that can realize any complex components is produced, can automatically, directly, accurately just design philosophy, from cad model, be converted into the model or device with certain function.
At present, 3D printing technique can be divided into according to forming principle: fusion sediment technology FDM, selective laser sintering forming technique SLS, photocurable liquid resin constituency curing molding technology SLA.But FDM technology is by ablation heat thermoplastic plastic or eutectic system metal and extrudes shower nozzle, and it is three-dimensionally shaped to realize that solidification to be cooled obtains required workpiece.SLA is then shaping by laser scanning curing photosensitive resin, and selective laser sintering is by powder sintered shaping by laser scanning.These rapid prototyping & manufacturing technology existing all also exist and can only scan zonule, and by point to line, again by the process of line to face, manufacturing time length is its defect.SLS is commercialization the earliest, should be used as rapid shaping technique widely, and it is theoretical, the reduction etc. of the perfect and price of technique, has important impact to the popularization and application of rapid prototyping & manufacturing technology.
[summary of the invention]
The present invention is directed to above situation proposes a kind of based in SLA technical foundation, the laser linear array column 3D forming method that flat scanning is shaping can be realized, the method can carry out the shaping making of 3D to large format, large scale product, and improves shaping speed, the time of minimizing spent by manufacturing process.
Laser linear array column 3D printing device involved in the present invention comprises computer control, shaping supporting plate, material storing box, laser irradiation device and scraper plate, wherein be provided with elevating mechanism below shaping supporting plate, shaping supporting plate and elevating mechanism are integrally provided in material storing box, a large amount of stand-by material is placed in material storing box, a liftable scraper plate and laser irradiation device is provided with, the multiple laser diode of linear array on this laser irradiation device above shaping supporting plate.
Multiple laser diode linear array arrangement on laser irradiation device, the spacing between every laser diode is 0.1mm.
The diameter of this laser diode chip lamp pearl is 1mm.
A forming method for laser linear array column 3D printing device, it is characterized in that, the method comprises the following steps:
Step one: use 3D modeling software analogue formation in a computer, utilizes software to be surface model by threedimensional model section, is sent on the computer control of laser linear array column 3D printing device;
Step 2: the power output adjustable range of single laser diode is 0.1w ~ 10w;
Step 3: corresponding laser diode selection material, ultraviolet laser diode selects photosensitive resin material; Infra-red laser diode selects dusty material;
Step 4: place enough materials in material storing box, and shaping supporting plate is adjusted on extreme higher position, and guarantee the material shaping supporting plate being covered with an applicable formable layer;
Step 5: open laser irradiation device and scanning irradiation is carried out to shaping supporting plate, computer control, in scanning process, controls opening/closing of corresponding laser diode according to the X-Y scheme that section generates;
Step 6: after completing one deck scanning, scraper plate is under the control of computer control, and the surface being close to shaped article hangs excess stock;
Step 7: shaping supporting plate declines the height of one deck under elevating mechanism drives, supplementary material;
Move in circles, until obtain finished article.
In the forming method of laser linear array column 3D printing device, if the liquid material of material, when each shaping supporting plate declines, completed the process of supplementary material by the shaping supporting plate of flowing submergence of liquid material, and if dusty material, then need to re-lay layer of material.
Comprise material in dusty material process of deployment and spread paving and material strikes off, roughly spread by material and be layered on shaping supporting plate, then scraper plate was scraped from face, kept material face even uniform.
The present invention is technical based on SLA, have employed a kind of laser rays array irradiator, the shaping workpiece of large format is carried out by line to face formula scanning moulding, can carry out efficiently the large-sized product of large format, shaping making accurately, improve molding rate, reduce the time spent in manufacturing process.
[accompanying drawing explanation]
Fig. 1 is the structural representation of laser linear array column 3D printing device involved in the present invention;
Fig. 2 is laser linear array column 3D printing device implementation step flow chart involved in the present invention;
Wherein: 10, shaping supporting plate; 20, elevating mechanism; 30, material storing box; 40, laser irradiation device; 41, laser diode; 50, scraper plate; 60, computer control;
[detailed description of the invention]
Below in conjunction with the drawings and specific embodiments of the present invention, laser linear array column 3D printing device of the present invention and forming method thereof are described in further detail.
The present invention can realize the unlimited expansion of processing breadth in theory, limit, utilized 1000 laser diode LDs, the spacing 0.1mm between diode, prepared the laser diode linear array that length is about 200mm by experiment condition.The restriction that the diameter 1mm of laser diode chip lamp pearl had both breached large format processing in turn ensure that formed precision.In addition, laser diode power, wavelength have multiple, according to used power and wavelength connecting shaping material, can meet different forming requirements.
Laser linear array column 3D printing device comprises computer control 60, shaping supporting plate 10, material storing box 30, laser irradiation device 40 and scraper plate 50, wherein be provided with elevating mechanism 20 below shaping supporting plate 10, shaping supporting plate 10 and elevating mechanism 20 are integrally provided in material storing box 30, a large amount of stand-by material is placed in material storing box 30, a liftable scraper plate 50 and laser irradiation device 40 is provided with, the multiple laser diode 41 of linear array on this laser irradiation device 40 above shaping supporting plate 10.
Multiple laser diode 41 linear array arrangement on laser irradiation device 40, the spacing between every laser diode 41 is 0.1mm.
The diameter of this laser diode 41 chip lamp pearl is 1mm.
A forming method for laser linear array column 3D printing device, it is characterized in that, the method comprises the following steps:
Step one: use 3D modeling software analogue formation in a computer, utilizes software to be surface model by threedimensional model section, is sent on the computer control of laser linear array column 3D printing device;
Step 2: the power output adjustable range of single laser diode is 0.1w ~ 10w;
Step 3: corresponding laser diode selection material, ultraviolet laser diode selects photosensitive resin material; Infra-red laser diode selects dusty material;
Step 4: place enough materials in material storing box, and shaping supporting plate is adjusted on extreme higher position, and guarantee the material shaping supporting plate being covered with an applicable formable layer;
Step 5: open laser irradiation device and scanning irradiation is carried out to shaping supporting plate, computer control, in scanning process, controls opening/closing of corresponding laser diode according to the X-Y scheme that section generates;
Step 6: after completing one deck scanning, scraper plate is under the control of computer control, and the surface being close to shaped article hangs excess stock;
Step 7: shaping supporting plate declines the height of one deck under elevating mechanism drives, supplementary material;
Move in circles, until obtain finished article.
In the forming method of laser linear array column 3D printing device, if the liquid material of material, when each shaping supporting plate declines, completed the process of supplementary material by the shaping supporting plate of flowing submergence of liquid material, and if dusty material, then need to re-lay layer of material.
Comprise material in dusty material process of deployment and spread paving and material strikes off, roughly spread by material and be layered on shaping supporting plate, then scraper plate was scraped from face, kept material face even uniform.
Described section precision refers to that the layer precision in conjunction with threedimensional model size and system of processing determines threedimensional model to be separated into how many, and precision is higher, more than discrete.
Described 3D modeling software can be: 3D MAX, Pro/E, solidworks, AUTO CAD etc.Described two-dimensional surface image refers to two cross-section data information threedimensional model being separated into each face and obtaining.
Described irradiation time laser intensity needed for the fusing point of material cured or material determines.
Described laser diode linear array refers to the laser diode dot matrix made by common LED dot matrix principle with the specific customization chip of specific wavelength, single luminescence chip about 0.05 ~ 0.5mm
2, can select different luminescence chip according to formed precision, single the adjustable output power range of laser diode, in 0.1w ~ 10w, can regulate the power output of single laser diode according to different shaping needs.
The present invention is technical based on SLA, have employed a kind of laser rays array irradiator, the shaping workpiece of large format is carried out by line to face formula scanning moulding, can carry out efficiently the large-sized product of large format, shaping making accurately, improve molding rate, reduce the time spent in manufacturing process.
Operation principle of the present invention is: photosensitive resin or dusty material solidify or melt cooled and solidified again after being heated to uniform temperature under the irradiation of laser diode.First produce row's diode laser matrix line, under computer and drive circuit control, laser diode pipe array lines provides picture signal by computer program, and laser diode point front moves and irradiates two-dimensional pattern, and namely corresponding laser diode is bright.Like this, the photosensitive resin be irradiated to or powder will be cured or be cooled after coagulation by heat fused.Every one deck X-Y scheme is shaping complete after, by computer control elevating mechanism move down profiled member supporting plate, displacement is thick layer, repaves layer of material, realize successively scan irradiation.When the two dimensional image that threedimensional model is cut into slices successively scan irradiate shaping after, then obtain the entity of whole threedimensional model.
The above, it is only present pre-ferred embodiments, not any pro forma restriction is done to the present invention, although the present invention discloses as above with preferred embodiment, but and be not used to limit the present invention, any those skilled in the art, do not departing within the scope of technical solution of the present invention, make a little change when the technology contents of above-mentioned announcement can be utilized or be modified to the Equivalent embodiments of equivalent variations, in every case be do not depart from technical solution of the present invention content, any simple modification that above embodiment is done is referred to according to the technology of the present invention, equivalent variations and modification, all belong in the scope of technical solution of the present invention.
Claims (6)
1. a laser linear array column 3D printing device comprises computer control, shaping supporting plate, material storing box, laser irradiation device and scraper plate, wherein be provided with elevating mechanism below shaping supporting plate, shaping supporting plate and elevating mechanism are integrally provided in material storing box, a large amount of stand-by material is placed in material storing box, a liftable scraper plate and laser irradiation device is provided with, the multiple laser diode of linear array on this laser irradiation device above shaping supporting plate.
2. laser linear array column 3D printing device according to claim 1, is characterized in that, multiple laser diode linear array arrangement on laser irradiation device, the spacing between every laser diode is 0.1mm.
3. laser linear array column 3D printing device according to claim 1, it is characterized in that, the diameter of this laser diode chip lamp pearl is 1mm.
4. a forming method for laser linear array column 3D printing device, is characterized in that, the method comprises the following steps:
Step one: use 3D modeling software analogue formation in a computer, utilizes software to be surface model by threedimensional model section, is sent on the computer control of laser linear array column 3D printing device;
Step 2: single output power of laser diode adjustable range is 0.1w ~ 10w;
Step 3: corresponding laser diode selection material, ultraviolet laser diode selects photosensitive resin material; Infra-red laser diode selects dusty material;
Step 4: place enough materials in material storing box, and shaping supporting plate is adjusted on extreme higher position, and guarantee the material shaping supporting plate being covered with an applicable formable layer;
Step 5: open laser irradiation device and scanning irradiation is carried out to shaping supporting plate, computer control, in scanning process, controls opening/closing of corresponding laser diode according to the X-Y scheme that section generates;
Step 6: after completing one deck scanning, scraper plate is under the control of computer control, and the surface being close to shaped article hangs excess stock;
Step 7: shaping supporting plate declines the height of one deck under elevating mechanism drives, supplementary material;
Move in circles, until obtain finished article.
5. the forming method of laser linear array column 3D printing device according to claim 4, it is characterized in that, material is liquid material, then when each shaping supporting plate declines, the process of supplementary material is completed by the shaping supporting plate of flowing submergence of liquid material, material is dusty material, then need to re-lay layer of material.
6. the forming method of laser linear array column 3D printing device according to claim 5, it is characterized in that dusty material process of deployment comprise material spread paving and material strike off, roughly spread by material and be layered on shaping supporting plate, then scraper plate was scraped from face, kept material face even uniform.
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Cited By (21)
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|---|---|---|---|---|
| CN105034614A (en) * | 2015-07-06 | 2015-11-11 | 周建钢 | Method and apparatus for mass printing customized patterns on batch products |
| CN105172141A (en) * | 2015-09-10 | 2015-12-23 | 杜晖 | Photosensitive resin 3D printer taking LED array as light source |
| CN105710369A (en) * | 2016-03-03 | 2016-06-29 | 西安铂力特激光成形技术有限公司 | Device for manufacturing three-dimensional body layer by layer, control method and scanning method |
| CN105881903A (en) * | 2016-04-22 | 2016-08-24 | 郑强 | Molding end line-type sweep molding control method and device for 3D printer |
| CN105946229A (en) * | 2016-05-04 | 2016-09-21 | 杭州研智科技有限公司 | 3d printer and control method thereof |
| CN108215173A (en) * | 2016-12-15 | 2018-06-29 | 上海普利生机电科技有限公司 | Light-cured type 3 D-printing equipment, the method and system that can automatically continuously print |
| JP2018520920A (en) * | 2015-07-13 | 2018-08-02 | ストラタシス リミテッド | Leveling device for 3D printer |
| CN108501377A (en) * | 2018-03-03 | 2018-09-07 | 河南理工大学 | A kind of the 3D printing scanning molding machine and control method of variable cross-section forming ends |
| CN110605390A (en) * | 2019-08-13 | 2019-12-24 | 浙江工业大学 | Wire forming method for metal additive manufacturing |
| US10562132B2 (en) | 2013-04-29 | 2020-02-18 | Nuburu, Inc. | Applications, methods and systems for materials processing with visible raman laser |
| US10634842B2 (en) | 2017-04-21 | 2020-04-28 | Nuburu, Inc. | Multi-clad optical fiber |
| CN111225757A (en) * | 2017-08-11 | 2020-06-02 | 西门子股份公司 | Method for additive manufacturing of a structure from a powder bed on a pre-existing component |
| US10804680B2 (en) | 2017-06-13 | 2020-10-13 | Nuburu, Inc. | Very dense wavelength beam combined laser system |
| CN111940733A (en) * | 2020-07-20 | 2020-11-17 | 北京科技大学 | Device and method for removing splashed oxide and compensating powder supply in selective laser melting process |
| US10940562B2 (en) | 2017-01-31 | 2021-03-09 | Nuburu, Inc. | Methods and systems for welding copper using blue laser |
| US10971896B2 (en) | 2013-04-29 | 2021-04-06 | Nuburu, Inc. | Applications, methods and systems for a laser deliver addressable array |
| US11052605B2 (en) | 2016-03-08 | 2021-07-06 | Concept Laser Gmbh | Apparatus for the additive manufacturing of a three-dimensional object |
| US11612957B2 (en) | 2016-04-29 | 2023-03-28 | Nuburu, Inc. | Methods and systems for welding copper and other metals using blue lasers |
| US11646549B2 (en) | 2014-08-27 | 2023-05-09 | Nuburu, Inc. | Multi kW class blue laser system |
| US11870203B2 (en) | 2018-11-23 | 2024-01-09 | Nuburu, Inc. | Multi-wavelength visible laser source |
| US11980970B2 (en) | 2016-04-29 | 2024-05-14 | Nuburu, Inc. | Visible laser additive manufacturing |
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Cited By (24)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US10562132B2 (en) | 2013-04-29 | 2020-02-18 | Nuburu, Inc. | Applications, methods and systems for materials processing with visible raman laser |
| US10971896B2 (en) | 2013-04-29 | 2021-04-06 | Nuburu, Inc. | Applications, methods and systems for a laser deliver addressable array |
| US11646549B2 (en) | 2014-08-27 | 2023-05-09 | Nuburu, Inc. | Multi kW class blue laser system |
| CN105034614A (en) * | 2015-07-06 | 2015-11-11 | 周建钢 | Method and apparatus for mass printing customized patterns on batch products |
| US10786947B2 (en) | 2015-07-13 | 2020-09-29 | Stratasys Ltd. | Leveling apparatus for a 3D printer |
| JP2018520920A (en) * | 2015-07-13 | 2018-08-02 | ストラタシス リミテッド | Leveling device for 3D printer |
| CN105172141A (en) * | 2015-09-10 | 2015-12-23 | 杜晖 | Photosensitive resin 3D printer taking LED array as light source |
| CN105710369A (en) * | 2016-03-03 | 2016-06-29 | 西安铂力特激光成形技术有限公司 | Device for manufacturing three-dimensional body layer by layer, control method and scanning method |
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| CN105881903A (en) * | 2016-04-22 | 2016-08-24 | 郑强 | Molding end line-type sweep molding control method and device for 3D printer |
| US11980970B2 (en) | 2016-04-29 | 2024-05-14 | Nuburu, Inc. | Visible laser additive manufacturing |
| US11612957B2 (en) | 2016-04-29 | 2023-03-28 | Nuburu, Inc. | Methods and systems for welding copper and other metals using blue lasers |
| CN105946229A (en) * | 2016-05-04 | 2016-09-21 | 杭州研智科技有限公司 | 3d printer and control method thereof |
| CN108215173A (en) * | 2016-12-15 | 2018-06-29 | 上海普利生机电科技有限公司 | Light-cured type 3 D-printing equipment, the method and system that can automatically continuously print |
| US10940562B2 (en) | 2017-01-31 | 2021-03-09 | Nuburu, Inc. | Methods and systems for welding copper using blue laser |
| US10634842B2 (en) | 2017-04-21 | 2020-04-28 | Nuburu, Inc. | Multi-clad optical fiber |
| US10804680B2 (en) | 2017-06-13 | 2020-10-13 | Nuburu, Inc. | Very dense wavelength beam combined laser system |
| CN111225757A (en) * | 2017-08-11 | 2020-06-02 | 西门子股份公司 | Method for additive manufacturing of a structure from a powder bed on a pre-existing component |
| US11331727B2 (en) | 2017-08-11 | 2022-05-17 | Siemens Energy Global GmbH & Co. KG | Method of additively manufacturing a structure on a pre-existing component out of the powder bed |
| CN108501377A (en) * | 2018-03-03 | 2018-09-07 | 河南理工大学 | A kind of the 3D printing scanning molding machine and control method of variable cross-section forming ends |
| US11870203B2 (en) | 2018-11-23 | 2024-01-09 | Nuburu, Inc. | Multi-wavelength visible laser source |
| CN110605390A (en) * | 2019-08-13 | 2019-12-24 | 浙江工业大学 | Wire forming method for metal additive manufacturing |
| CN111940733A (en) * | 2020-07-20 | 2020-11-17 | 北京科技大学 | Device and method for removing splashed oxide and compensating powder supply in selective laser melting process |
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