CN204721718U - A kind of pad structure reducing Reflow Soldering Component Displacement - Google Patents
A kind of pad structure reducing Reflow Soldering Component Displacement Download PDFInfo
- Publication number
- CN204721718U CN204721718U CN201520400756.5U CN201520400756U CN204721718U CN 204721718 U CN204721718 U CN 204721718U CN 201520400756 U CN201520400756 U CN 201520400756U CN 204721718 U CN204721718 U CN 204721718U
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- pad
- perforate
- pcb
- led
- reflow soldering
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Abstract
The utility model discloses a kind of pad structure reducing Reflow Soldering Component Displacement, comprise a pcb board material, pcb board material be uniformly provided with several print wire ring, the pcb board material being positioned at print wire ring is provided with the shape PCB pad corresponding with the LED pad at LED back, PCB pad is made up of the size pad that two areas are different, size pad offers first respectively, second perforate, in perforate, equal hollow out is without copper, first, the position of the second perforate on PCB pad is corresponding with the position of two hollow holes in left and right on LED pad respectively, and open pore size is also identical with the aperture of two hollow holes in left and right on LED pad respectively.The utility model can make the pad of LED better be combined with the pad of PCB, solve Reflow Soldering and cross the problem that often accurately cannot control mount components mounting position in the process of stove, decrease the generation of skew, enhance weld strength, decrease the generation of bad product, reduce the cost in manpower and man-hour, improve capacity efficiency.
Description
Technical field
The utility model belongs to photoelectricity manufacture field, is specifically related to a kind of pad structure reducing Reflow Soldering Component Displacement.
Background technology
The universal pad of current employing, cross in the process of stove in Reflow Soldering, due to factors such as the mobility of tin cream, adhesion and the scaling powders that adds, often cause the mounting position that accurately cannot control mount components, offset, and in subsequent production, bring following problem:
1. make the weld strength of mount components reduce, cause bad, cause finished product defective, manpower need be increased and carry out maintenance process;
2. through repeatedly regulating front road paster technique and rail temperature, and the setting of conveyer belt speed to be optimized, making board mobility poor, cause capacity efficiency low, increase manpower in man-hour; 3. the finished product mount components synteny produced is poor, causes completed optical luminescence skew, to such an extent as to the scrapping of material.
Utility model content
Cross in the processing procedure of stove to solve Reflow Soldering, often the mounting position of mount components cannot accurately be controlled thus the problem of generation skew, the utility model provides a kind of pad structure reducing Reflow Soldering Component Displacement, LED pad can be made better to be combined with PCB pad, to reduce the generation of skew.
For realizing above-mentioned technical purpose, reach above-mentioned technique effect, the utility model is achieved through the following technical solutions:
A kind of pad structure reducing Reflow Soldering Component Displacement, comprise a pcb board material, described pcb board material be uniformly provided with several print wire ring, the described pcb board material being positioned at described print wire ring is provided with the shape PCB pad corresponding with the LED pad at LED back, described PCB pad is made up of the different large bonding pad of two areas and little pad, described large bonding pad offers the first perforate, second perforate on described little pad, in described first perforate and described second perforate all hollow out without copper, described first perforate and the described second perforate position on described PCB pad is corresponding with the position of two hollow holes in left and right on described LED pad respectively, described first perforate is also identical with the aperture of two hollow holes in left and right on described LED pad respectively with the pore size of described second perforate.
Further, the size of described PCB pad is 90% of described LED pad size.
Further, described pcb board material is provided with equably several print wire ring and PCB pads.
Further, the outer ledge 1.59mm of large bonding pad described in the vertical centre linear distance of described first perforate.
Further, the outer ledge 1.46mm of little pad described in the vertical centre linear distance of described second perforate.
The utility model eats tin shape according to the LED pad at LED rear portion, and the encapsulation of design attachment pad, corresponding position on pcb board material, devises the hollow type PCB pad corresponding with LED bond pad shapes.When print solder paste, tin cream deposits to some extent at the hollow part of PCB pad, when crossing Reflow Soldering, the PCB pad that the tin cream in PCB pad openwork part can flow to its surrounding carries out the fixing of LED.This measure can make LED pad corresponding with the position of PCB pad, and it can be made better to combine, and greatly reduces the generation (principle that the similar nut of this principle combines with screw) of skew.
The beneficial effects of the utility model are as follows:
1, the utility model can make the pad of LED better be combined with the pad of PCB, greatly reduces the generation of skew, solves Reflow Soldering and crosses the problem that often accurately cannot control the mounting position of mount components in the process of stove.
2, the utility model makes the weld strength of the mount components such as LED strengthen, and reduces the generation of bad product, reduces manpower and the cost in man-hour, board mobility is increased, and capacity efficiency promotes.
3, the utility model can improve the consistency of finished product mount components synteny, reduces the scrappage of material, guarantees the quality of product.
Above-mentioned explanation is only the general introduction of technical solutions of the utility model, in order to better understand technological means of the present utility model, and can be implemented according to the content of specification, coordinates accompanying drawing to be described in detail as follows below with preferred embodiment of the present utility model.Embodiment of the present utility model is provided in detail by following examples and accompanying drawing thereof.
Accompanying drawing explanation
Accompanying drawing described herein is used to provide further understanding of the present utility model, and form a application's part, schematic description and description of the present utility model, for explaining the utility model, is not formed improper restriction of the present utility model.In the accompanying drawings:
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the front view of LED;
Fig. 3 is the vertical view of LED;
Fig. 4 is the rearview of LED;
Fig. 5 be PCB pad of the present utility model with LED pad weld schematic diagram;
Fig. 6 is the front view after PCB pad of the present utility model and LED pad solder.
Number in the figure illustrates: 1, pcb board material; 2, wire ring is printed; 3, PCB pad; 4, the first perforate; 5, the second perforate; 301, large bonding pad; 302, little pad; 601, LED pad; 602, hollow hole.
Embodiment
Below with reference to the accompanying drawings and in conjunction with the embodiments, describe the utility model in detail.
Shown in Fig. 1 and Fig. 5, a kind of pad structure reducing Reflow Soldering Component Displacement, comprise a pcb board material 1, described pcb board material 1 be uniformly provided with several print wire ring 2, the described pcb board material 1 being positioned at described print wire ring 2 is provided with the shape PCB pad 3 corresponding with the LED pad 601 at LED 6 back, described PCB pad 3 is made up of the different large bonding pad 301 of two areas and little pad 302, described large bonding pad 301 offers the first perforate 4, second perforate 5 on described little pad 302, in described first perforate 4 and described second perforate 5 all hollow out without copper, described first perforate 4 and described second perforate 5 position on described PCB pad 3 is corresponding with the position of two hollow holes 602 in left and right on described LED pad 601 respectively, described first perforate 4 is also identical with the aperture of two hollow holes 602 in left and right on described LED pad 601 respectively with the pore size of described second perforate 5.
Further, the size of described PCB pad 3 is 90% of described LED pad 601 size.
Further, described pcb board material 1 is provided with equably 9 print wire rings 2 and PCB pad 3.
Further, the outer ledge 1.59mm of large bonding pad 301 described in the vertical centre linear distance of described first perforate 4.
Further, the outer ledge 1.46mm of little pad 302 described in the vertical centre linear distance of described second perforate 5.
Shown in Fig. 2-4, respectively show the front view of described LED 6, vertical view and rearview, two, the left and right LED pad 601 at the back of described LED 6 offers a hollow hole 602 respectively.
The utility model eats tin shape according to the LED pad at LED rear portion, and the encapsulation of design attachment pad, corresponding position on pcb board material, devises the hollow type PCB pad corresponding with LED bond pad shapes.When print solder paste, tin cream deposits to some extent at the hollow part of PCB pad, when crossing Reflow Soldering, the PCB pad that the tin cream in PCB pad openwork part can flow to its surrounding carries out the fixing of LED.This measure can make LED pad corresponding with the position of PCB pad, and it can be made better to combine, and greatly reduces the generation (principle that the similar nut of this principle combines with screw) of skew.
The foregoing is only preferred embodiment of the present utility model, be not limited to the utility model, for a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, any amendment done, equivalent replacement, improvement etc., all should be included within protection range of the present utility model.
Claims (5)
1. one kind is reduced the pad structure of Reflow Soldering Component Displacement, it is characterized in that: comprise a pcb board material (1), described pcb board material (1) be uniformly provided with several print wire ring (2), the described pcb board material (1) being positioned at described print wire ring (2) is provided with a shape and LED(6) the corresponding PCB pad (3) of the LED pad (601) at back, described PCB pad (3) is made up of the different large bonding pad (301) of two areas and little pad (302), described large bonding pad (301) offers the first perforate (4), described little pad (302) offers the second perforate (5), in described first perforate (4) and described second perforate (5) all hollow out without copper, described first perforate (4) and described second perforate (5) position on described PCB pad (3) is corresponding with the position of two hollow holes (602) in left and right on described LED pad (601) respectively, described first perforate (4) is also identical with the aperture of two hollow holes (602) in left and right on described LED pad (601) respectively with the pore size of described second perforate (5).
2. the pad structure of minimizing Reflow Soldering Component Displacement according to claim 1, is characterized in that: the size of described PCB pad (3) is 90% of described LED pad (601) size.
3. the pad structure of minimizing Reflow Soldering Component Displacement according to claim 1, is characterized in that: described pcb board material (1) is provided with equably several print wire ring (2) and PCB pads (3).
4. the pad structure of minimizing Reflow Soldering Component Displacement according to claim 1, is characterized in that: the outer ledge 1.59mm of large bonding pad (301) described in the vertical centre linear distance of described first perforate (4).
5. the pad structure of minimizing Reflow Soldering Component Displacement according to claim 1, is characterized in that: the outer ledge 1.46mm of little pad (302) described in the vertical centre linear distance of described second perforate (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520400756.5U CN204721718U (en) | 2015-06-11 | 2015-06-11 | A kind of pad structure reducing Reflow Soldering Component Displacement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520400756.5U CN204721718U (en) | 2015-06-11 | 2015-06-11 | A kind of pad structure reducing Reflow Soldering Component Displacement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204721718U true CN204721718U (en) | 2015-10-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520400756.5U Expired - Fee Related CN204721718U (en) | 2015-06-11 | 2015-06-11 | A kind of pad structure reducing Reflow Soldering Component Displacement |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204721718U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105397221A (en) * | 2015-12-01 | 2016-03-16 | 长沙奥托自动化技术有限公司 | PCB packaging design and welding method of TQFP chip |
| CN110475427A (en) * | 2019-09-20 | 2019-11-19 | 昆山国显光电有限公司 | A kind of pad, terminal device and welding method |
-
2015
- 2015-06-11 CN CN201520400756.5U patent/CN204721718U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105397221A (en) * | 2015-12-01 | 2016-03-16 | 长沙奥托自动化技术有限公司 | PCB packaging design and welding method of TQFP chip |
| CN110475427A (en) * | 2019-09-20 | 2019-11-19 | 昆山国显光电有限公司 | A kind of pad, terminal device and welding method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151021 Termination date: 20170611 |