CN204119670U - A kind of PLCC encapsulates mobile phone camera - Google Patents
A kind of PLCC encapsulates mobile phone camera Download PDFInfo
- Publication number
- CN204119670U CN204119670U CN201420539210.3U CN201420539210U CN204119670U CN 204119670 U CN204119670 U CN 204119670U CN 201420539210 U CN201420539210 U CN 201420539210U CN 204119670 U CN204119670 U CN 204119670U
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- CN
- China
- Prior art keywords
- pcb board
- plcc
- tin cream
- lens assembly
- fpc plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of PLCC and encapsulate mobile phone camera, comprise cameral lens assembly, pcb board and FPC plate, cameral lens assembly is welded on pcb board, and pcb board is welded on FPC plate, in the welding position of pcb board and cameral lens assembly, be provided with one deck lead-free high-temperature tin cream; In the welding position of pcb board and FPC plate, be provided with one deck lead-free low-temperature tin cream.The beneficial effects of the utility model are, segmentation divides warm welding procedure, make PLCC product in different phase, the tin cream of different melting points temperature is adopted to complete surface mount process, when crossing stove, peak temperature actual value is between 170-180 DEG C, like this, the bump (fusing point: 217 DEG C) of PLCC internal components there will not be melting phenomenon, and what avoid that secondary back adopts the lead-free high-temperature tin cream of identical fusing point to bring is above-mentioned bad.
Description
technical field
The utility model relates to electron image camera field, is specially a kind of PLCC and encapsulates mobile phone camera.
Background technology
Electron image camera, when adopting PLCC encapsulation, product just will can complete surface mount through twice reflow soldering:
1, the first stage is the encapsulation of PLCC: before encapsulation, PCB substrate first must carry out surface mount, namely weld through SMT technique with some capacitance-resistance passive devices (resistance, electric capacity, drive IC etc.), afterwards, then with other device (as Sensor, DAM, IR etc.) to adopt COB process combination to bind shaping.Above process, is referred to as the encapsulation of PLCC;
2, second stage is the surface mount between PLCC and FPC plate;
Surface mount (SMT) process in above two stages, be all adopt lead-free high-temperature tin cream (tin: silver: copper=96.5:3:0.5, fusing point: 217 DEG C), when crossing reflow soldering, peak temperature actual value is between 250-260 DEG C;
During second stage reflow soldering, can there is following problem points in PLCC product aborning:
1, the bump of PLCC inside all there will be secondary fusion, and the tiny tin point that there will be in various degree splashes down at PLCC interior periphery (comprising Sensor photosensitive area and IR inner surface).Like this, camera is when back segment operation assembling test, and image can manifest stain (composition of stain is verified as tin cream composition through EDX analysis of components), and clean assembling station cannot wiping;
2, PLCC substrate is through secondary high-temperature, there will be distortion in various degree, causes sensitive chip evenness to change, and finally affects the homogeneity of camera definition, forms image fog bad time serious;
Be more than normal reflux welding manner, under normal circumstances, camera is in back segment assembling test process, the ratio very high (>=10%) that its image visualization stain is bad, in addition, because PCB evenness generation slight deformation can cause product image fog, so camera integral production yield is lower.
Utility model content
The utility model object is to overcome the deficiencies in the prior art, proposes a kind of novel PLCC and encapsulates mobile phone camera.
The technical solution of the utility model is: a kind of PLCC encapsulates mobile phone camera, comprise cameral lens assembly, pcb board and FPC plate, cameral lens assembly is welded on pcb board, and pcb board is welded on FPC plate, in the welding position of pcb board and cameral lens assembly, be provided with one deck lead-free high-temperature tin cream; In the welding position of pcb board and FPC plate, be provided with one deck lead-free low-temperature tin cream.
The beneficial effects of the utility model are, segmentation divides warm welding procedure, make PLCC product in different phase, the tin cream of different melting points temperature is adopted to complete surface mount process, when crossing stove, peak temperature actual value is between 170-180 DEG C, like this, the bump (fusing point: 217 DEG C) of PLCC internal components there will not be melting phenomenon, and what avoid that secondary back adopts the lead-free high-temperature tin cream of identical fusing point to bring is above-mentioned bad.
accompanying drawing explanation
Fig. 1 is the side structure schematic diagram of camera;
Fig. 2 is the STRUCTURE DECOMPOSITION figure of camera.
Embodiment
Below in conjunction with drawings and Examples, set forth the utility model further.As shown in the figure, PLCC encapsulates mobile phone camera, comprises cameral lens assembly 1, pcb board 2 and FPC plate 3, cameral lens assembly is welded on pcb board, pcb board is welded on FPC plate, in the welding position of pcb board and cameral lens assembly, is provided with one deck lead-free high-temperature tin cream 4; In the welding position of pcb board and FPC plate, be provided with one deck lead-free low-temperature tin cream 5.
CCD camera assembly comprises the parts such as camera lens 11, motor 12, IR13, chip 14, electric capacity 15, drive IC 16, and electric capacity, drive IC are welded on PCB plate by high temperature tin cream at pcb board edge.
Camera of the present utility model in process of production, adopts segmentation to divide warm welding procedure (i.e. different phase adopts the surface mount welding procedure of different melting points temperature):
First stage reflow soldering: belong to the stage before PLCC products C OB encapsulation, this stage adopts lead-free high-temperature tin cream (tin: silver: copper=96.5:3:0.5, fusing point: 217 DEG C) to complete whole surface mount process;
Second stage reflow soldering: PLCC has completed COB encapsulation, enters into and carries out the surface mount stage with FPC plate, and this stage adopts lead-free low-temperature tin cream (tin: bismuth: silver=42:57.6:0.4, fusing point: 138 DEG C).
Segmentation divides warm welding procedure, makes PLCC product in different phase, and adopt the tin cream of different melting points temperature to complete surface mount process, the welding procedure of melting temperature identical with tradition contrasts as follows:
More than show and describe general principle of the present utility model, principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; what describe in above-described embodiment and specification just illustrates principle of the present utility model; under the prerequisite not departing from the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (1)
1. PLCC encapsulates a mobile phone camera, it is characterized in that, comprises cameral lens assembly, pcb board and FPC plate, cameral lens assembly is welded on pcb board, pcb board is welded on FPC plate, in the welding position of pcb board and cameral lens assembly, is provided with one deck lead-free high-temperature tin cream; In the welding position of pcb board and FPC plate, be provided with one deck lead-free low-temperature tin cream.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420539210.3U CN204119670U (en) | 2014-09-18 | 2014-09-18 | A kind of PLCC encapsulates mobile phone camera |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420539210.3U CN204119670U (en) | 2014-09-18 | 2014-09-18 | A kind of PLCC encapsulates mobile phone camera |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204119670U true CN204119670U (en) | 2015-01-21 |
Family
ID=52336942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420539210.3U Expired - Fee Related CN204119670U (en) | 2014-09-18 | 2014-09-18 | A kind of PLCC encapsulates mobile phone camera |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204119670U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105101637A (en) * | 2015-07-13 | 2015-11-25 | 格科微电子（上海）有限公司 | Method for rapidly welding camera module |
| CN110913608A (en) * | 2019-11-27 | 2020-03-24 | 惠州Tcl移动通信有限公司 | Circuit board lamination welding method, device and storage medium |
-
2014
- 2014-09-18 CN CN201420539210.3U patent/CN204119670U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105101637A (en) * | 2015-07-13 | 2015-11-25 | 格科微电子（上海）有限公司 | Method for rapidly welding camera module |
| CN110913608A (en) * | 2019-11-27 | 2020-03-24 | 惠州Tcl移动通信有限公司 | Circuit board lamination welding method, device and storage medium |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150121 Termination date: 20170918 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |