CN203657579U - Temperature homogenizing plate - Google Patents
Temperature homogenizing plate Download PDFInfo
- Publication number
- CN203657579U CN203657579U CN201320859255.4U CN201320859255U CN203657579U CN 203657579 U CN203657579 U CN 203657579U CN 201320859255 U CN201320859255 U CN 201320859255U CN 203657579 U CN203657579 U CN 203657579U
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- Prior art keywords
- lid
- temperature
- capillary structure
- uniforming plate
- heat conduction
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- Expired - Lifetime
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- 239000000463 material Substances 0.000 claims abstract description 23
- 238000001704 evaporation Methods 0.000 claims description 17
- 230000008020 evaporation Effects 0.000 claims description 16
- 230000004308 accommodation Effects 0.000 claims description 12
- 238000009833 condensation Methods 0.000 claims description 12
- 230000005494 condensation Effects 0.000 claims description 11
- 239000012530 fluid Substances 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 238000009413 insulation Methods 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000137 annealing Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A temperature homogenizing plate comprises a first cover plate, a second cover plate and multiple support members; the first cover body is made of a non-heat conduction material; the second cover body is made of a heat conduction material; the first cover body and the second cover body are combined; a containing space is formed between the first cover body and the second cover body. The support members are arranged in the containing space and are connected with the first cover body and the second cover body.
Description
Technical field
The utility model relates to a kind of temperature-uniforming plate, espespecially a kind of temperature-uniforming plate with the lid of being made up of non-Heat Conduction Material.
Background technology
The operation principle of temperature-uniforming plate is the evaporation and condensation circulation start that is closed in working fluid in tabular cavity with it, makes the characteristic of the quick samming of its tool, thus the function of the conduction of tool Rapid Thermal and thermal diffusion.Generally speaking, temperature-uniforming plate be by metal shell, capillary structure and working fluid through annealing, vacuumize and the manufacturing process such as soldering and sealing made.The metal shell of existing temperature-uniforming plate is to be combined into by upper and lower two metal cap body, and electronic component is attached at the lower metal cap body as evaporation ends, and upper metal cap body is as condensation end.After the heat that lower metal cap body produces while absorbing electronic component running, via the evaporation and condensation circulation start that is closed in working fluid in tabular cavity, then dispelled the heat by upper metal cap body.But; for example, when temperature-uniforming plate (is applied to thinned electronic; notebook computer, panel computer etc.) time; the operation interface that upper metal cap body can approach user conventionally very much (for example; the keyboard of notebook computer); because upper metal cap body has conductive force, be easy to conduct to operation interface and cause the discomfort in use from the loose heat removing of upper metal cap body.
Utility model content
The utility model provides a kind of temperature-uniforming plate with the lid of being made up of non-Heat Conduction Material, to solve the above problems.
According to an embodiment, temperature-uniforming plate of the present utility model comprises:
One first lid, is made up of a non-Heat Conduction Material;
One second lid, is made up of a Heat Conduction Material, and this first lid is combined with this second lid, and between this first lid and this second lid, forms an accommodation space; And
Multiple support members, are arranged in this accommodation space and connect this first lid and this second lid.
Described temperature-uniforming plate, wherein, this non-Heat Conduction Material is composite.
Described temperature-uniforming plate, wherein, this Heat Conduction Material is copper or aluminium.
Described temperature-uniforming plate, wherein, the plurality of support member and this second lid are one-body molded.
Described temperature-uniforming plate, wherein, this second lid has an evaporation ends and a condensation end, and an electronic component is attached at this evaporation ends.
Described temperature-uniforming plate, wherein, separately comprises:
One capillary structure, is arranged in this accommodation space; And
One working fluid, is filled in this accommodation space.
Described temperature-uniforming plate, wherein, this capillary structure is plough groove type capillary structure, porous capillary structure, netted capillary structure, powder sintered capillary structure or combined capillary structure.
In sum, the utility model is to make the first lid with non-Heat Conduction Material, and makes the second lid with Heat Conduction Material.For example, when temperature-uniforming plate of the present utility model (is applied to thinned electronic, notebook computer, panel computer etc.) time, can make the first lid towards user's operation interface (for example, the keyboard of notebook computer), because the first lid is to be made up of non-Heat Conduction Material, therefore the first lid has effect of heat insulation.In addition, evaporation ends and condensation end are all positioned at the second lid, and the heat producing when electronic component running only can carry out one side heat transfer at the second lid.Thus, temperature-uniforming plate of the present utility model can effectively be avoided heat to conduct to operation interface and cause the discomfort in use.
Can rely on following utility model detailed description and appended accompanying drawing to be further understood about advantage of the present utility model and spirit.
Brief description of the drawings
Fig. 1 is according to the stereogram of the temperature-uniforming plate of the utility model one embodiment;
Fig. 2 is the exploded view of the temperature-uniforming plate in Fig. 1;
Fig. 3 is temperature-uniforming plate in Fig. 1 profile along A-A line.
Description of reference numerals: 1-temperature-uniforming plate; 3-electronic component; 10-the first lid; 12-the second lid; 14-support member; 16-capillary structure; 18-working fluid; 20-accommodation space; 120-evaporation ends; 122-condensation end; 160-sheet capillary structure; 162-column capillary structure; A-A-hatching.
Detailed description of the invention
Refer to Fig. 1 to Fig. 3, Fig. 1 is according to the stereogram of the temperature-uniforming plate 1 of the utility model one embodiment, and Fig. 2 is the exploded view of the temperature-uniforming plate 1 in Fig. 1, and Fig. 3 is temperature-uniforming plate 1 in Fig. 1 profile along A-A line.As shown in Figure 1 to Figure 3, temperature-uniforming plate 1 comprises one first lid 10, one second lid 12, multiple support member 14, a capillary structure 16 and a working fluid 18.The first lid 10 is made up of a non-Heat Conduction Material, and the second lid 12 is made up of a Heat Conduction Material.In this embodiment, non-Heat Conduction Material can be composite, and Heat Conduction Material can be copper or aluminium, but not as limit.
As shown in Figure 3, the first lid 10 and the second lid 12 combinations, and form an accommodation space 20 between the first lid 10 and the second lid 12.Support member 14 is arranged in accommodation space 20 and connects the first lid 10 and the second lid 12.Support member 14 is in order to support the first lid 10 and the second lid 12, to prevent that the first lid 10 and/or the second lid 12 from breaking because of pressurized avalanche.Preferably, support member 14 and the second lid 12 can be formed in one, but not as limit.Capillary structure 16 is arranged in accommodation space 20, and wherein capillary structure 16 can be plough groove type capillary structure, porous capillary structure, netted capillary structure, powder sintered capillary structure or combined capillary structure, depending on practical application.It should be noted that, above-mentioned combined capillary structure can be made up of at least two kinds of capillary structures in plough groove type capillary structure, porous capillary structure, netted capillary structure and powder sintered capillary structure.In addition, capillary structure 16 can comprise sheet capillary structure 160 and column capillary structure 162.In this embodiment, sheet capillary structure 160 is formed on the first lid 10 and the second lid 12 madial walls, and column capillary structure 162 can be sheathed on support member 14.Working fluid 18 is filled in accommodation space 20, and wherein working fluid 18 can be water, ethanol or other and have the liquid of low coefficient of viscosity.
In this embodiment, the second lid 12 has an evaporation ends 120 and a condensation end 122, and electronic component 3 is attached at evaporation ends 120.In the time that evaporation ends 120 absorbs the heat that electronic component 3 produces, the working fluid 18 in evaporation ends 120 can raise and evaporation gradually by Yin Wendu.Then, steam is flowed towards condensation end 122 by evaporation ends 120, then via condensing into liquid after condensation end 122 chilled air cools around, and then complete heat radiation circulation.In other words the heat producing when, electronic component 3 operates only can carry out one side heat transfer at the second lid 12.
For example, when temperature-uniforming plate 1 of the present utility model (is applied to thinned electronic, notebook computer, panel computer etc.) time, can make the first lid 10 towards user's operation interface (for example, the keyboard of notebook computer), because the first lid 10 is to be made up of non-Heat Conduction Material, therefore the first lid 10 has effect of heat insulation.In addition, evaporation ends 120 is all positioned at the second lid 12 with condensation end 122, and the heat that electronic component 3 produces while running only can carry out one side heat transfer at the second lid 12.Thus, temperature-uniforming plate 1 of the present utility model can effectively be avoided heat to conduct to operation interface and cause the discomfort in use.
In sum, the utility model is to make the first lid with non-Heat Conduction Material, and makes the second lid with Heat Conduction Material.For example, when temperature-uniforming plate of the present utility model (is applied to thinned electronic, notebook computer, panel computer etc.) time, can make the first lid towards user's operation interface (for example, the keyboard of notebook computer), because the first lid is to be made up of non-Heat Conduction Material, therefore the first lid has effect of heat insulation.In addition, evaporation ends and condensation end are all positioned at the second lid, and the heat producing when electronic component running only can carry out one side heat transfer at the second lid.Thus, temperature-uniforming plate of the present utility model can effectively be avoided heat to conduct to operation interface and cause the discomfort in use.
The foregoing is only preferred embodiment of the present utility model, all equalizations of doing according to the utility model claim change and modify, and all should belong to covering scope of the present utility model.
Claims (7)
1. a temperature-uniforming plate, is characterized in that, comprises:
One first lid, is made up of a non-Heat Conduction Material;
One second lid, is made up of a Heat Conduction Material, and this first lid is combined with this second lid, and between this first lid and this second lid, forms an accommodation space; And
Multiple support members, are arranged in this accommodation space and connect this first lid and this second lid.
2. temperature-uniforming plate as claimed in claim 1, is characterized in that, this non-Heat Conduction Material is composite.
3. temperature-uniforming plate as claimed in claim 1, is characterized in that, this Heat Conduction Material is copper or aluminium.
4. temperature-uniforming plate as claimed in claim 1, is characterized in that, the plurality of support member and this second lid are one-body molded.
5. temperature-uniforming plate as claimed in claim 1, is characterized in that, this second lid has an evaporation ends and a condensation end, and an electronic component is attached at this evaporation ends.
6. temperature-uniforming plate as claimed in claim 1, is characterized in that, separately comprises:
One capillary structure, is arranged in this accommodation space; And
One working fluid, is filled in this accommodation space.
7. temperature-uniforming plate as claimed in claim 6, is characterized in that, this capillary structure is plough groove type capillary structure, porous capillary structure, netted capillary structure, powder sintered capillary structure or combined capillary structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320859255.4U CN203657579U (en) | 2013-12-24 | 2013-12-24 | Temperature homogenizing plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320859255.4U CN203657579U (en) | 2013-12-24 | 2013-12-24 | Temperature homogenizing plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203657579U true CN203657579U (en) | 2014-06-18 |
Family
ID=50923958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320859255.4U Expired - Lifetime CN203657579U (en) | 2013-12-24 | 2013-12-24 | Temperature homogenizing plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203657579U (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105338784A (en) * | 2014-08-08 | 2016-02-17 | 联想(北京)有限公司 | Cooling device and electronic equipment |
| CN105466263A (en) * | 2014-09-03 | 2016-04-06 | 奇鋐科技股份有限公司 | Uniform temperature board structure |
| CN105698581A (en) * | 2015-12-14 | 2016-06-22 | 上海利正卫星应用技术有限公司 | Light, thin and pressing-resistant flat heat pipe with high installation adaptability |
| CN106643247A (en) * | 2017-01-23 | 2017-05-10 | 中车大连机车研究所有限公司 | Composite liquid absorption core type heat pipe radiator |
| CN106643246A (en) * | 2017-01-23 | 2017-05-10 | 中车大连机车研究所有限公司 | Composite wick type special-shaped heat pipe radiator |
| CN106949764A (en) * | 2017-05-04 | 2017-07-14 | 广州华钻电子科技有限公司 | A kind of loop soaking plate |
| CN109413930A (en) * | 2017-08-18 | 2019-03-01 | 鹏鼎控股(深圳)股份有限公司 | The electronic device of temperature-uniforming plate and the application temperature-uniforming plate |
| CN110248521A (en) * | 2016-11-18 | 2019-09-17 | 双鸿科技股份有限公司 | Has the heat dissipation element of thermal resistance mechanism |
| CN111121510A (en) * | 2019-12-27 | 2020-05-08 | 东莞赛诺高德蚀刻科技有限公司 | Temperature-uniforming plate and preparation method thereof |
| CN112033200A (en) * | 2019-03-14 | 2020-12-04 | 山东大学 | Loop heat pipe |
| CN113494864A (en) * | 2020-04-03 | 2021-10-12 | 得意精密电子(苏州)有限公司 | Temperature-equalizing plate and manufacturing method thereof |
-
2013
- 2013-12-24 CN CN201320859255.4U patent/CN203657579U/en not_active Expired - Lifetime
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105338784A (en) * | 2014-08-08 | 2016-02-17 | 联想(北京)有限公司 | Cooling device and electronic equipment |
| CN105466263A (en) * | 2014-09-03 | 2016-04-06 | 奇鋐科技股份有限公司 | Uniform temperature board structure |
| CN105466263B (en) * | 2014-09-03 | 2019-08-02 | 奇鋐科技股份有限公司 | Equalizing plate structure |
| CN105698581A (en) * | 2015-12-14 | 2016-06-22 | 上海利正卫星应用技术有限公司 | Light, thin and pressing-resistant flat heat pipe with high installation adaptability |
| CN110248521A (en) * | 2016-11-18 | 2019-09-17 | 双鸿科技股份有限公司 | Has the heat dissipation element of thermal resistance mechanism |
| CN106643247A (en) * | 2017-01-23 | 2017-05-10 | 中车大连机车研究所有限公司 | Composite liquid absorption core type heat pipe radiator |
| CN106643246A (en) * | 2017-01-23 | 2017-05-10 | 中车大连机车研究所有限公司 | Composite wick type special-shaped heat pipe radiator |
| CN106949764A (en) * | 2017-05-04 | 2017-07-14 | 广州华钻电子科技有限公司 | A kind of loop soaking plate |
| CN109413930A (en) * | 2017-08-18 | 2019-03-01 | 鹏鼎控股(深圳)股份有限公司 | The electronic device of temperature-uniforming plate and the application temperature-uniforming plate |
| CN112033200A (en) * | 2019-03-14 | 2020-12-04 | 山东大学 | Loop heat pipe |
| CN112033200B (en) * | 2019-03-14 | 2021-08-13 | 山东大学 | Loop heat pipe |
| CN111121510A (en) * | 2019-12-27 | 2020-05-08 | 东莞赛诺高德蚀刻科技有限公司 | Temperature-uniforming plate and preparation method thereof |
| CN113494864A (en) * | 2020-04-03 | 2021-10-12 | 得意精密电子(苏州)有限公司 | Temperature-equalizing plate and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140618 |